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TW201435160A - Polycrystalline germanium ingot manufacturing device and manufacturing method thereof - Google Patents

Polycrystalline germanium ingot manufacturing device and manufacturing method thereof Download PDF

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Publication number
TW201435160A
TW201435160A TW102120617A TW102120617A TW201435160A TW 201435160 A TW201435160 A TW 201435160A TW 102120617 A TW102120617 A TW 102120617A TW 102120617 A TW102120617 A TW 102120617A TW 201435160 A TW201435160 A TW 201435160A
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crucible
heat conductor
cooling
polycrystalline germanium
heat
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Shoichi Hiwasa
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Shoichi Hiwasa
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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F71/00Manufacture or treatment of devices covered by this subclass
    • H10F71/121The active layers comprising only Group IV materials
    • H10F71/1221The active layers comprising only Group IV materials comprising polycrystalline silicon
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B11/00Single-crystal growth by normal freezing or freezing under temperature gradient, e.g. Bridgman-Stockbarger method
    • C30B11/003Heating or cooling of the melt or the crystallised material
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B29/00Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
    • C30B29/02Elements
    • C30B29/06Silicon
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02BCLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
    • Y02B10/00Integration of renewable energy sources in buildings
    • Y02B10/10Photovoltaic [PV]
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy
    • Y02E10/546Polycrystalline silicon PV cells
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Silicon Compounds (AREA)

Abstract

本發明提供一種多晶矽矽錠製造裝置,包括:坩堝,可收納矽原料;加熱器,配置於該坩堝的周圍;導熱體,配置於該坩堝的下方;以及冷卻單元,對該導熱體進行冷卻;所述多晶矽矽錠製造裝置的特徵在於:上述導熱體形成下方開口的有底的筒狀體,上述導熱體的底部外表面與上述坩堝的底部外表面相對向而配置,藉由上述冷卻單元來使上述導熱體的開口端部附近被冷卻。The present invention provides a polycrystalline germanium ingot manufacturing apparatus, comprising: a crucible capable of accommodating a crucible raw material; a heater disposed around the crucible; a thermal conductor disposed under the crucible; and a cooling unit cooling the thermal conductor; In the polycrystalline germanium ingot manufacturing apparatus, the heat conductor is formed with a bottomed cylindrical body that is opened downward, and a bottom outer surface of the heat conductor is disposed to face the outer surface of the bottom of the crucible, and the cooling unit is provided by the cooling unit. The vicinity of the opening end of the heat conductor is cooled.

Description

多晶矽矽錠的製造裝置及其製造方法 Polycrystalline germanium ingot manufacturing device and manufacturing method thereof

本發明是有關於一種用以製造多晶矽矽錠的製造裝置及用以製造多晶矽矽錠的方法。 The present invention relates to a manufacturing apparatus for manufacturing a polycrystalline germanium ingot and a method for producing a polycrystalline germanium ingot.

多晶矽(multi-crystalline silicon)主要被用作太陽電池用的基板材料。用於太陽電池等的多晶矽通常是自多晶矽的矽錠切斷成任意的大小及形狀來製造。多晶矽的矽錠通常藉由如下方式來製造:將矽原料收納於坩堝內,對該坩堝進行加熱而獲得熔融矽,其後對坩堝自其底部進行冷卻而使矽凝固(參照專利文獻1及專利文獻2)。近年來,為了獲得大口徑的多晶矽晶圓,要求製造更大的多晶矽矽錠。為了製造大的多晶矽矽錠,需要控制自坩堝底部的散熱量而適當地控制矽的凝固速度。但是,矽的凝固速度的控制需要微妙且精密地控制散熱量,因此極為困難(專利文獻3)。例如在經熔融的矽的凝固過程中,藉由先前的散熱法,存在自坩堝底部的散熱量大的傾向,因此必須將熔融矽的溫度(熔 融液溫度)保持在充分高於矽的凝固溫度(1410℃)的溫度(例如1440~1460℃),以防凝固迅速地自凝固初期行進至凝固中期。在該條件下獲得的矽結晶的晶格缺陷多,當加工成太陽電池用的基板時,存在能量轉換效率下降等品質上的問題。而且,為了適當地控制矽的凝固速度,迄今為止已知有對坩堝在裝置內的位置進行控制而控制散熱量的方法(專利文獻3)、控制坩堝內的溫度分布的方法等。但是,在所述方法中,難以完全地控制自坩堝的散熱量。 Multi-crystalline silicon is mainly used as a substrate material for solar cells. A polycrystalline silicon used for a solar cell or the like is usually produced by cutting a polycrystalline germanium ingot into an arbitrary size and shape. A polycrystalline germanium ingot is usually produced by accommodating a tantalum raw material in a crucible, heating the crucible to obtain a molten crucible, and then cooling the crucible from the bottom thereof to solidify the crucible (refer to Patent Document 1 and Patent) Literature 2). In recent years, in order to obtain a large-diameter polycrystalline germanium wafer, it is required to manufacture a larger polycrystalline germanium ingot. In order to manufacture a large polycrystalline niobium ingot, it is necessary to control the amount of heat dissipated from the bottom of the crucible to appropriately control the solidification speed of the crucible. However, the control of the solidification rate of the crucible requires extremely delicate and precise control of the amount of heat dissipation, which is extremely difficult (Patent Document 3). For example, in the solidification process of the molten crucible, the heat dissipation from the bottom of the crucible tends to be large due to the previous heat dissipation method, so the temperature of the melting crucible must be melted. The melt temperature is maintained at a temperature sufficiently higher than the solidification temperature of the crucible (1410 ° C) (for example, 1440 to 1460 ° C) to prevent solidification from rapidly proceeding from the initial stage of solidification to the middle of solidification. The ruthenium crystal obtained under these conditions has many lattice defects, and when processed into a substrate for a solar cell, there is a problem in quality such as a decrease in energy conversion efficiency. Further, in order to appropriately control the solidification speed of the crucible, a method of controlling the position of the crucible in the apparatus to control the amount of heat radiation (Patent Document 3), a method of controlling the temperature distribution in the crucible, and the like have been known. However, in the method, it is difficult to completely control the amount of heat dissipation from the crucible.

[先前技術文獻] [Previous Technical Literature] [專利文獻] [Patent Literature]

[專利文獻1]日本專利特開昭60-103017號公報 [Patent Document 1] Japanese Patent Laid-Open Publication No. SHO 60-103017

[專利文獻2]日本專利特開昭63-166711號公報 [Patent Document 2] Japanese Patent Laid-Open Publication No. SHO 63-166711

[專利文獻3]日本專利特開2002-308616號公報 [Patent Document 3] Japanese Patent Laid-Open Publication No. 2002-308616

本發明的目的在於提供一種用以製造多晶矽矽錠的製造裝置,其能夠適當地控制自坩堝的散熱量。 An object of the present invention is to provide a manufacturing apparatus for manufacturing a polycrystalline germanium ingot which can appropriately control the amount of heat radiation from the crucible.

而且,本發明的目的在於提供一種用以適當地控制自坩堝的散熱量而製造良好的多晶矽矽錠的方法。 Further, it is an object of the present invention to provide a method for producing a good polycrystalline germanium ingot by appropriately controlling the amount of heat released from the crucible.

特別的是,本發明的目的在於藉由採用上述製造裝置及製造方法,可製造各種尺寸的多晶矽矽錠,且獲得具有優異的結晶品質的多晶矽矽錠,其在該多晶矽矽錠的所有高度方向上結晶缺陷 極少。 In particular, it is an object of the present invention to produce polycrystalline ruthenium ingots of various sizes by using the above-described manufacturing apparatus and manufacturing method, and to obtain a polycrystalline yttrium ingot having excellent crystal quality in all height directions of the polycrystalline yttrium ingot. Upper crystal defect Very few.

本發明是基於如下見解而完成:當製造多晶矽矽錠時,使用配置於坩堝下方的用以對坩堝進行冷卻的導熱體,將該導熱體設為特定的形狀,並且採取適當的導熱體冷卻方法,藉此可適當地控制坩堝的散熱量。 The present invention has been completed based on the following findings: when manufacturing a polycrystalline germanium ingot, a heat conductor disposed under the crucible for cooling the crucible is used, the thermal conductor is set to a specific shape, and an appropriate thermal body cooling method is employed. Thereby, the amount of heat dissipation of the crucible can be appropriately controlled.

具體而言,本發明可包括以下內容。 In particular, the invention may include the following.

一種多晶矽矽錠製造裝置,包括:坩堝,可收納矽原料;加熱器,配置於該坩堝的周圍;導熱體,配置於該坩堝的下方;以及冷卻單元,對該導熱體進行冷卻;所述多晶矽矽錠製造裝置的特徵在於:上述導熱體形成下方開口的有底的筒狀體,將上述導熱體的底部外表面與上述坩堝的底部外表面相對向而配置,一面使上述導熱體的開口端部附近的開口部面積跨整個凝固期間範圍而任意變化,一面藉由上述冷卻單元而冷卻。 A polycrystalline germanium ingot manufacturing apparatus comprising: a crucible capable of accommodating a crucible raw material; a heater disposed around the crucible; a thermal conductor disposed under the crucible; and a cooling unit cooling the thermal conductor; the polycrystalline crucible In the bismuth ingot manufacturing apparatus, the heat conductor is formed with a bottomed cylindrical body that is opened downward, and an outer surface of the bottom surface of the heat conductor is disposed to face the outer surface of the bottom surface of the crucible, and an open end of the heat conductor is disposed. The area of the opening near the portion is arbitrarily changed across the entire solidification period, and is cooled by the cooling unit.

其中上述導熱體根據JIS R1611的閃光(flash)法在25℃下進行測定而具有30W/m.K~150W/m.K的導熱率。 The above thermal conductor is measured at 25 ° C according to the flash method of JIS R1611 and has 30 W / m. K~150W/m. The thermal conductivity of K.

其中上述導熱體為黑鉛製。 The above thermal conductor is made of black lead.

所述多晶矽矽錠製造裝置更包括感應加熱線圈,所述感應加熱線圈是對上述導熱體進行加熱。 The polycrystalline germanium ingot manufacturing apparatus further includes an induction heating coil that heats the heat conductor.

所述的多晶矽矽錠製造裝置更包括隔熱材料,所述隔熱材料覆蓋上述坩堝、上述加熱器及上述導熱體中的至少一部分。 The polycrystalline germanium ingot manufacturing apparatus further includes a heat insulating material covering at least a part of the crucible, the heater, and the heat conductor.

所述的多晶矽矽錠製造裝置更包括:蓋子,覆蓋上述坩堝的 開口端部;以及噴嘴,用以對該坩堝內部噴入惰性氣體。 The polycrystalline germanium ingot manufacturing device further comprises: a cover covering the above-mentioned crucible An open end; and a nozzle for injecting an inert gas into the interior of the crucible.

一種多晶矽矽錠製造方法,包括如下步驟:(1)將矽原料收納於可進行溫度調節的坩堝內;(2)將上述坩堝內的矽原料加熱至矽的熔點以上的溫度而使上述矽原料熔融;以及(3)經由配置於該坩堝的下方的導熱體,對上述坩堝內的熔融矽進行冷卻,而獲得多晶矽矽錠;所述多晶矽矽錠製造方法的特徵在於:上述導熱體形成下方開口的有底的筒狀體,將上述導熱體的底部外表面與上述坩堝的底部外表面相對向而配置,藉由上述冷卻單元來對上述導熱體的開口端部附近進行冷卻。 A method for producing a polycrystalline ruthenium ingot, comprising the steps of: (1) accommodating a ruthenium raw material in a temperature-adjustable crucible; and (2) heating the niobium raw material in the crucible to a temperature higher than a melting point of niobium to make the niobium raw material And (3) cooling the molten crucible in the crucible via a heat conductor disposed under the crucible to obtain a polycrystalline ingot; the polycrystalline ingot manufacturing method is characterized in that the thermal conductor forms a lower opening The bottomed cylindrical body is disposed such that a bottom outer surface of the heat conductor is opposed to a bottom outer surface of the crucible, and the vicinity of an opening end portion of the heat conductor is cooled by the cooling unit.

其中在如下條件下進行上述冷卻,即,將上述導熱體的底部外表面的溫度(Tg)(℃)設為以下的線性近似方程式:Tg=a-bt The cooling is performed under the following conditions, that is, the temperature (Tg) (° C.) of the outer surface of the bottom surface of the heat conductor is set to the following linear approximation equation: Tg=a-bt

(式中,a為1,250~1,400,b為10~35,t為自冷卻開始算起的經過時間(小時))。 (In the formula, a is 1,250 to 1,400, and b is 10 to 35, and t is an elapsed time (hour) from the start of cooling).

其中藉由加熱器及上述導熱體來進行上述加熱,所述加熱器配置於上述坩堝的周圍,上述導熱體是藉由感應加熱線圈而加熱。 The heating is performed by a heater and the heat conductor, and the heater is disposed around the crucible, and the heat conductor is heated by an induction heating coil.

其中在惰性氣體環境下進行上述加熱步驟及冷卻步驟。 The heating step and the cooling step are carried out under an inert gas atmosphere.

根據本發明,可提供一種用以製造多晶矽矽錠的製造裝 置,其能夠適當地控制自坩堝的散熱量。特別是可藉由配置於坩堝的下方的特殊形狀的導熱體,而自坩堝適當地進行散熱。而且,根據本發明,可提供一種用以適當地控制自坩堝的散熱量而製造具有良好品質的結晶的多晶矽矽錠的方法。特別是使冷卻條件著眼於與坩堝接近的導熱體的溫度而不依賴於如先前的坩堝的上部溫度或坩堝自身的冷卻條件,來控制坩堝的冷卻,藉此可使坩堝在適當的溫度下冷卻而不會過冷卻。特別是藉由跨矽的整個凝固時間範圍,將熔融矽的過熱度(熔融矽的熔融液溫度-矽的凝固溫度)保持在40℃以下,較佳為保持在10℃以下,更佳為保持在2℃~5℃,可獲得結晶缺陷極少的高品質的多晶矽。 According to the present invention, a manufacturing apparatus for manufacturing a polycrystalline germanium ingot can be provided It can properly control the amount of heat dissipation from the self. In particular, heat can be appropriately dissipated by a special-shaped heat conductor disposed under the crucible. Moreover, according to the present invention, it is possible to provide a method for producing a crystallized polycrystalline germanium ingot having a good quality by appropriately controlling the amount of heat released from the crucible. In particular, the cooling conditions are focused on the temperature of the heat conductor close to the crucible without relying on the upper temperature of the previous crucible or the cooling condition of the crucible itself to control the cooling of the crucible, thereby allowing the crucible to be cooled at an appropriate temperature. Without overcooling. In particular, the superheat degree of the molten crucible (the melt temperature of the molten crucible - the solidification temperature of the crucible) is maintained below 40 ° C, preferably below 10 ° C, and more preferably by the entire solidification time range of the crucible. At 2 ° C to 5 ° C, high quality polycrystalline germanium with few crystal defects can be obtained.

1‧‧‧底部外表面 1‧‧‧Bottom outer surface

2‧‧‧底部內表面 2‧‧‧ bottom inner surface

3‧‧‧壁部 3‧‧‧ wall

4‧‧‧底部外尺寸 4‧‧‧ bottom outer dimensions

5‧‧‧底部內尺寸 5‧‧‧ bottom size

6‧‧‧底部的厚度 6‧‧‧ thickness at the bottom

7‧‧‧壁部的高度 7‧‧‧ Height of the wall

8‧‧‧壁部的厚度 8‧‧‧ Thickness of the wall

9‧‧‧開口端部 9‧‧‧Open end

101‧‧‧多晶矽製造裝置 101‧‧‧Polysilicon manufacturing equipment

102‧‧‧矽原料 102‧‧‧矽Materials

103‧‧‧坩堝 103‧‧‧坩埚

104‧‧‧加熱器 104‧‧‧heater

105‧‧‧上部室 105‧‧‧ upper room

106‧‧‧導熱體 106‧‧‧ Thermal Conductor

107‧‧‧冷卻單元 107‧‧‧Cooling unit

108‧‧‧下部室 108‧‧‧low room

109‧‧‧蓋子 109‧‧‧Cover

110‧‧‧支持板 110‧‧‧Support board

111‧‧‧噴嘴 111‧‧‧Nozzles

112‧‧‧上部隔熱材料 112‧‧‧Upper insulation

113‧‧‧感應加熱線圈 113‧‧‧Induction heating coil

114‧‧‧下部隔熱材料 114‧‧‧Bottom insulation

115‧‧‧汽缸 115‧‧‧ cylinder

116‧‧‧空隙 116‧‧‧ gap

117‧‧‧溫度感測器 117‧‧‧temperature sensor

Ts‧‧‧熔融矽的溫度 Temperature of Ts‧‧‧ melting enthalpy

Tx‧‧‧坩堝底部內側的溫度 Tx‧‧‧坩埚The temperature inside the bottom of the bottom

Tg‧‧‧導熱體的底部外表面的溫度 Temperature of the outer surface of the bottom of the Tg‧‧‧ thermal conductor

圖1(a)至圖1(c)是本發明的導熱體的概略圖。 1(a) to 1(c) are schematic views of a heat conductor of the present invention.

圖2(a)至圖2(f)是本發明的導熱體的縱剖面圖。 2(a) to 2(f) are longitudinal cross-sectional views of the heat conductor of the present invention.

圖3(a)是對坩堝進行加熱的步驟中的本發明的多晶矽矽錠製造裝置的剖面圖。 Fig. 3 (a) is a cross-sectional view showing the polycrystalline germanium ingot manufacturing apparatus of the present invention in the step of heating the crucible.

圖3(b)是對坩堝進行冷卻的步驟中的本發明的多晶矽矽錠製造裝置的剖面圖。 Fig. 3 (b) is a cross-sectional view showing the polycrystalline germanium ingot manufacturing apparatus of the present invention in the step of cooling the crucible.

圖4是實施例1中的熔融矽的溫度Ts(℃)、坩堝底部內側的溫度Tx(℃)、導熱體的底部外表面的溫度Tg(℃)自凝固開始至凝固結束為止的時間變化。 4 is a time change of the temperature Ts (° C.) of the molten crucible in the first embodiment, the temperature Tx (° C.) inside the crucible bottom, and the temperature Tg (° C.) of the outer surface of the bottom surface of the heat conductor from the start of solidification to the end of solidification.

圖5是實施例2中的熔融矽的溫度Ts(℃)、坩堝底部內側的 溫度Tx(℃)、導熱體的底部外表面的溫度Tg(℃)自凝固開始至凝固結束為止的時間變化。 Figure 5 is a temperature Ts (°C) of the molten crucible in Example 2, and inside the bottom of the crucible The temperature Tx (° C.) and the temperature Tg (° C.) of the outer surface of the bottom portion of the heat conductor change from the start of solidification to the end of solidification.

圖6是比較例1中的熔融矽的溫度Ts(℃)、水冷式銅製冷卻冷凍機(chiller)的底部外表面(與坩堝底部相接的黑鉛製支持板)的溫度Tg(℃)自凝固開始至凝固結束為止的時間變化。 6 is a temperature Ts (° C.) of the molten crucible in Comparative Example 1, and a temperature Tg (° C.) of the bottom outer surface of the water-cooled copper cooling chiller (black lead supporting plate that is in contact with the bottom of the crucible). The time from the start of solidification to the end of solidification.

圖7是實施例1、實施例2及比較例1中,凝固速度(mm/分)自凝固開始至凝固結束為止的時間變化。 Fig. 7 is a graph showing changes in time of solidification rate (mm/min) from the start of solidification to the end of solidification in Example 1, Example 2, and Comparative Example 1.

[A]多晶矽製造裝置 [A] Polycrystalline germanium manufacturing device

以下,對本發明的多晶矽矽錠製造裝置進行詳細說明。 Hereinafter, the polycrystalline germanium ingot manufacturing apparatus of the present invention will be described in detail.

(1)本發明的多晶矽矽錠製造裝置包括:坩堝,可收納矽原料;加熱器,配置於該坩堝的周圍;導熱體,配置於該坩堝的下方;以及冷卻單元,對該導熱體進行冷卻。而且,本發明的多晶矽矽錠製造裝置任意地包括感應加熱線圈、隔熱材料、蓋子、用以噴入惰性氣體的噴嘴等。以下,對各個構件進行說明。 (1) The polycrystalline germanium ingot manufacturing apparatus of the present invention comprises: a crucible capable of accommodating a crucible raw material; a heater disposed around the crucible; a thermal conductor disposed under the crucible; and a cooling unit cooling the thermal conductor . Further, the polycrystalline germanium ingot manufacturing apparatus of the present invention arbitrarily includes an induction heating coil, a heat insulating material, a lid, a nozzle for injecting an inert gas, and the like. Hereinafter, each member will be described.

.坩堝 . crucible

坩堝是用以收納矽原料,對矽原料進行加熱而獲得熔融矽,進而進行冷卻而製造多晶矽矽錠。坩堝的形狀較佳為上端開口的有底的筒狀體,更佳為底部平坦。該底部可為圓形或三角形以外的多邊形,但較佳為圓形或四邊形。坩堝的大小亦取決於所製作的多晶矽的大小,例如,當坩堝為有底且底部為正方形的筒形時, 底部的外尺寸例如適當的是300mm~1500mm見方,較佳為500mm~1200mm見方,更佳為670mm~1000mm見方,底部的厚度例如適當的是1mm~50mm,較佳為5mm~30mm,更佳為10mm~25mm。坩堝的高度例如適當的是100mm~1000mm,較佳為200mm~800mm,更佳為300mm~700mm。例如,當坩堝為有底的圓筒形時,底部例如適當的是半徑150mm~750mm的圓形,較佳為半徑250mm~600mm的圓形,更佳為半徑335mm~500mm的圓形,底部的厚度例如適當的是1mm~100mm,較佳為5mm~70mm,更佳為10mm~50mm。坩堝的高度例如適當的是100mm~1000mm,較佳為200mm~800mm,更佳為300mm~500mm。而且,坩堝的壁部的厚度例如適當的是1mm~50mm,較佳為5mm~30mm,更佳為10mm~25mm。坩堝的導熱率在根據JIS R1611的閃光(flash)法在25℃下進行測定時,例如適當的是1.2W/m.K~11.6W/m.K,較佳為1.7W/m.K~5.8W/m.K,更佳為2.3W/m.K~4.7W/m.K。 The crucible is used for accommodating a crucible raw material, heating the crucible raw material to obtain a molten crucible, and further cooling to produce a polycrystalline antimony ingot. The shape of the crucible is preferably a bottomed cylindrical body having an open upper end, and more preferably a flat bottom. The bottom portion may be a polygon other than a circle or a triangle, but is preferably a circle or a quadrangle. The size of the crucible also depends on the size of the polycrystalline silicon produced, for example, when the crucible is a bottomed cylinder with a square bottom. The outer dimension of the bottom is, for example, suitably 300 mm to 1500 mm square, preferably 500 mm to 1200 mm square, more preferably 670 mm to 1000 mm square, and the thickness of the bottom is suitably 1 mm to 50 mm, preferably 5 mm to 30 mm, more preferably 10mm~25mm. The height of the crucible is, for example, suitably from 100 mm to 1000 mm, preferably from 200 mm to 800 mm, more preferably from 300 mm to 700 mm. For example, when the crucible is a bottomed cylindrical shape, the bottom portion is suitably a circle having a radius of 150 mm to 750 mm, preferably a circle having a radius of 250 mm to 600 mm, more preferably a circle having a radius of 335 mm to 500 mm, and a bottom portion. The thickness is suitably, for example, 1 mm to 100 mm, preferably 5 mm to 70 mm, more preferably 10 mm to 50 mm. The height of the crucible is, for example, suitably from 100 mm to 1000 mm, preferably from 200 mm to 800 mm, more preferably from 300 mm to 500 mm. Further, the thickness of the wall portion of the crucible is, for example, suitably 1 mm to 50 mm, preferably 5 mm to 30 mm, more preferably 10 mm to 25 mm. The thermal conductivity of ruthenium is measured at 25 ° C according to the flash method of JIS R1611, and is suitably 1.2 W/m, for example. K~11.6W/m. K, preferably 1.7 W/m. K~5.8W/m. K, more preferably 2.3W/m. K~4.7W/m. K.

在坩堝的上部,可設置蓋子。 On the upper part of the crucible, a cover can be provided.

作為坩堝及蓋子,並無特別限定,可使用通常的多晶矽矽錠製造裝置中所使用的公知的坩堝及蓋子。例如坩堝較佳為不透明石英,作為蓋子,則較佳為黑鉛。坩堝的壁面較佳為利用氮化矽加以塗佈,所述氮化矽例如包含1質量%~10質量%的二氧化矽(silica),較佳為包含3質量%~7質量%的二氧化矽,更佳為包 含4質量%~6質量%的二氧化矽。 The crucible and the lid are not particularly limited, and a known crucible and a lid used in a conventional polycrystalline ingot manufacturing apparatus can be used. For example, ruthenium is preferably opaque quartz, and as a cover, black lead is preferred. The wall surface of the crucible is preferably coated with tantalum nitride, for example, containing 1% by mass to 10% by mass of silica, preferably containing 3% by mass to 7% by mass of dioxide. Oh, better for the package Containing 4% by mass to 6% by mass of cerium oxide.

.噴嘴 . nozzle

亦可設置噴嘴,自該噴嘴將惰性氣體噴入至坩堝內,所述噴嘴是用以在多晶矽矽錠的製造過程中,特別是對矽原料進行加熱及冷卻時,對坩堝內部噴入惰性氣體。作為惰性氣體,較佳為稀有氣體(rare gas),例如較佳為氦氣、氬氣等。除了惰性氣體以外,亦可添加如一氧化碳氣體之類的可降低或控制氧氣濃度的氣體。當在氬氣中添加一氧化碳氣體時,一氧化碳氣體的濃度例如適當的是600ppmm~1400ppmm,較佳為800ppmm~1200ppm,更佳為1000ppmm~1100ppm。 A nozzle may also be provided, from which an inert gas is injected into the crucible for injecting an inert gas into the crucible during the manufacturing process of the polycrystalline ingot, particularly when heating and cooling the crucible material. . As the inert gas, a rare gas is preferable, and for example, helium gas, argon gas or the like is preferable. In addition to the inert gas, a gas such as a carbon monoxide gas which lowers or controls the oxygen concentration may be added. When carbon monoxide gas is added to argon gas, the concentration of carbon monoxide gas is, for example, suitably from 600 ppmm to 1400 ppmm, preferably from 800 ppmm to 1200 ppm, more preferably from 1000 ppmm to 1100 ppm.

.矽原料 .矽 raw materials

作為收納於坩堝內的矽原料,適當的是多晶矽,所述多晶矽例如具有6-N以上的純度,較佳為具有7-N以上的純度,更佳為具有9-N以上(即99.9999999%的純度)的純度。 The tantalum raw material accommodated in the crucible is suitably polycrystalline germanium, and the polycrystalline germanium has a purity of, for example, 6-N or more, preferably has a purity of 7-N or more, more preferably 9-N or more (that is, 99.9999999%). Purity) purity.

.加熱器 . Heater

加熱器配置於上述坩堝的周圍,即,配置於上述坩堝的上方及/或至少一方向的側方,較佳為配置於上述坩堝的上方。作為加熱器,只要為可進行溫度調節的加熱器,則可使用公知的加熱器,例如,將各向同性黑鉛等的黑鉛或碳纖維(碳陶瓷基質(Carbon Ceramic Matrix,CCM)合成物等用於發熱體的電阻加熱式加熱器或感應加熱式加熱器等。 The heater is disposed around the crucible, that is, disposed above the crucible and/or at least in a direction, preferably disposed above the crucible. As the heater, a known heater can be used as long as it is a temperature-adjustable heater. For example, black lead or carbon fiber (carbon ceramic matrix (CCM) composition, etc., such as isotropic black lead or the like can be used. A resistance heating heater or an induction heating heater for a heating element.

.導熱體 . Thermal conductor

導熱體配置於坩堝的下方。在1個導熱體上,亦可配置1個或多個坩堝。而且,導熱體與坩堝既可密接亦可相離,此外,亦可在導熱體與坩堝之間包含支持板,所述支持板用以支持坩堝。導熱體是將該導熱體的底部外表面與上述坩堝的底部外表面相對向而配置。藉由如上所述進行配置,使得坩堝通過導熱體而有效率地冷卻,有時通過導熱體而有效率地加熱。圖1表示導熱體的外形的示例。圖1(a)是底部為矩形或正方形的筒狀體。圖1(b)是具有如下形狀的筒狀體,即,底部為矩形或正方形,且底部自側壁的壁部向外方突出固定的長度。圖1(c)是底部為圓形的筒狀體。圖1(b)的筒狀體的底部自側壁突出的長度例如為70mm~220mm,較佳為60mm~120mm,更佳為50mm~100mm,亦可為突出側壁的壁部的外尺寸的1%~30%,較佳為突出側壁的壁部的外尺寸的5%~20%。作為導熱體的形狀,較佳為一端開口且有底的底部為正方形的筒狀體。作為導熱體的縱剖面的形狀,較佳為凹型(參照圖1(a)或圖1(c))、π型(或Π型,參照圖1(b)),特佳為凹型。圖2(a)表示凹型的導熱體的縱剖面圖。導熱體形成有底的筒狀體,在與配置坩堝之側為相反之側開口,即,在下方開口,並且形成為導熱體的內側被挖空的形狀。導熱體的內側的部分,即該挖空部分的縱剖面的形狀亦可為三角形(參照圖2(b)、圖2(c))、四邊形(參照圖2(d))等多邊形,半圓形 (參照圖2(e))等曲線形。 The heat conductor is disposed below the crucible. One or more crucibles may be disposed on one thermal conductor. Moreover, the heat conductor and the crucible may be in close contact or separated from each other. Further, a support plate may be included between the heat conductor and the crucible, and the support plate is used to support the crucible. The heat conductor is disposed such that the outer surface of the bottom of the heat conductor faces the outer surface of the bottom of the crucible. By disposing as described above, the crucible is efficiently cooled by the heat conductor, and is sometimes heated efficiently by the heat conductor. Fig. 1 shows an example of the outer shape of a heat conductor. Fig. 1(a) is a cylindrical body having a rectangular or square bottom. Fig. 1(b) is a cylindrical body having a shape in which the bottom is rectangular or square, and the bottom protrudes from the wall portion of the side wall to a fixed length. Fig. 1(c) is a cylindrical body having a circular bottom. The length of the bottom of the cylindrical body of Fig. 1(b) protruding from the side wall is, for example, 70 mm to 220 mm, preferably 60 mm to 120 mm, more preferably 50 mm to 100 mm, or 1% of the outer dimension of the wall portion of the protruding side wall. ~30%, preferably 5% to 20% of the outer dimension of the wall portion of the protruding side wall. As the shape of the heat conductor, a cylindrical body having an open end and a bottomed bottom is preferably a square. The shape of the longitudinal cross section of the heat conductor is preferably concave (see Fig. 1 (a) or Fig. 1 (c)), π type (or Π type, see Fig. 1 (b)), and particularly preferably concave. Fig. 2(a) is a longitudinal sectional view showing a concave heat conductor. The heat conductor is formed with a bottomed cylindrical body that is open on the side opposite to the side on which the crucible is disposed, that is, is opened below, and is formed in a shape in which the inside of the heat conductor is hollowed out. The inner portion of the heat conductor, that is, the longitudinal cross-section of the hollow portion may have a triangular shape (see FIGS. 2(b), 2(c)) and a quadrangle (see FIG. 2(d)), and a semicircle. shape (Refer to Fig. 2(e)) and other curved shapes.

而且,如圖2(a)所示,開口端部(圖2(a)9)的縱剖面形狀可為壁部的厚度不變的矩形,亦可如圖2(f),較壁部的厚度細一個台階部或兩個台階部。例如,當壁部的高度(圖2(a)7)為500mm~1000mm且壁部的厚度為60mm~180mm時,適當的是開口端部(圖2(f)9)的高度為50mm~200mm(壁部的高度的5%~20%),開口端部的厚度為30mm~100mm(壁部的厚度的30~60%)左右。 Further, as shown in Fig. 2(a), the longitudinal end shape of the open end portion (Fig. 2(a) 9) may be a rectangle having a constant thickness of the wall portion, or may be a wall portion as shown in Fig. 2(f). The thickness is one step or two steps. For example, when the height of the wall portion (Fig. 2(a) 7) is 500 mm to 1000 mm and the thickness of the wall portion is 60 mm to 180 mm, it is appropriate that the height of the open end portion (Fig. 2 (f) 9) is 50 mm to 200 mm. (5% to 20% of the height of the wall), and the thickness of the opening end is about 30 mm to 100 mm (30 to 60% of the thickness of the wall).

導熱體若為如下固體,即,導熱率在室溫(25℃)下測定時(參照JIS R1611閃光法)為30W/m.K~150W/m.K,較佳為40W/m.K~120W/m.K,更佳為50W/m.K~100W/m.K,則可使用任意材料,但較佳為黑鉛製。作為可用作導熱體的特佳的黑鉛,可列舉東海碳素(Tokai Carbon)股份有限公司製的各向同性黑鉛G535、G330、G320、G347等。上述支持板亦較佳為具有與導熱體相同的導熱率的固體,更佳為與導熱體相同的黑鉛製。 The thermal conductor is a solid as follows, that is, when the thermal conductivity is measured at room temperature (25 ° C) (refer to JIS R1611 flash method) is 30 W / m. K~150W/m. K, preferably 40 W/m. K~120W/m. K, more preferably 50W/m. K~100W/m. K, any material can be used, but it is preferably black lead. As a particularly preferable black lead which can be used as a heat conductor, isotropic black lead G535, G330, G320, G347, etc. by Tokai Carbon Co., Ltd. are mentioned. The support plate is also preferably a solid having the same thermal conductivity as the heat conductor, more preferably the same black lead as the heat conductor.

為了維持凝固的控制精度,關於導熱體的尺寸,重要的是導熱體的熱容量為凝固開始時的坩堝的熱容量及原料矽的熱容量及原料矽的凝固潛熱的總和以下,例如為該總和的90%以下,較佳為該總和的1%~80%,更佳為該總和的10%~60%。例如,當導熱體為有底且底部(即,筒狀體的內側的底部(圖2(a)2))為正方形的筒形時,該底部的外尺寸(圖2(a)4)例如適當的是等 於坩堝的外尺寸(當配置多個坩堝時為各坩堝的外尺寸的總和)±400mm的尺寸,較佳為等於坩堝的底部的外尺寸±200mm的尺寸,更佳為等於坩堝的外尺寸±50mm的尺寸。具體而言,導熱體的底部的外尺寸例如適當的是100mm~4000mm見方,較佳為200mm~2000mm見方,更佳為300mm~1500mm見方。而且,底部的厚度(圖2(a)6)例如為5mm~200mm,較佳為20mm~100mm,更佳為30mm~60mm。而且,筒狀壁部的高度(圖2(a)7)例如適當的是250mm~2000mm,較佳為400mm~1500mm,更佳為500mm~1000mm。筒狀壁部的厚度(圖2(a)8)例如為20mm~300mm,較佳為40mm~250mm,更佳為60mm~180mm。 In order to maintain the control accuracy of the solidification, it is important that the heat capacity of the heat conductor is equal to or less than the total heat capacity of the heat of the crucible at the start of solidification and the heat capacity of the raw material crucible and the latent heat of solidification of the raw material crucible, for example, 90% of the total. Hereinafter, it is preferably from 1% to 80% of the total, and more preferably from 10% to 60% of the total. For example, when the heat conductor is bottomed and the bottom (ie, the bottom of the inner side of the cylindrical body (FIG. 2(a) 2)) is a square cylindrical shape, the outer dimension of the bottom (FIG. 2(a) 4) is, for example, Appropriate is waiting The outer dimensions of the crucible (the sum of the outer dimensions of the crucibles when a plurality of crucibles are arranged) ±400 mm, preferably equal to the outer dimension of the bottom of the crucible ±200 mm, more preferably equal to the outer dimension of the crucible 50mm size. Specifically, the outer dimension of the bottom portion of the heat conductor is, for example, suitably from 100 mm to 4000 mm square, preferably from 200 mm to 2000 mm square, more preferably from 300 mm to 1500 mm square. Further, the thickness of the bottom portion (Fig. 2(a) 6) is, for example, 5 mm to 200 mm, preferably 20 mm to 100 mm, more preferably 30 mm to 60 mm. Further, the height of the cylindrical wall portion (Fig. 2(a) 7) is, for example, suitably 250 mm to 2000 mm, preferably 400 mm to 1500 mm, more preferably 500 mm to 1000 mm. The thickness of the cylindrical wall portion (Fig. 2(a) 8) is, for example, 20 mm to 300 mm, preferably 40 mm to 250 mm, more preferably 60 mm to 180 mm.

例如,當導熱體為有底的圓筒形時,底部的半徑例如適當的是坩堝的半徑±200mm,較佳為坩堝的半徑±100mm,更佳為坩堝的半徑±50mm。具體而言,該底部的半徑例如適當的是100mm~1000mm,較佳為半徑150mm~800mm,更佳為半徑200mm~500mm。而且,底部的厚度例如為5mm~200mm,較佳為20mm~100mm,更佳為30mm~60mm。筒狀壁部的厚度例如為20mm~100mm,較佳為30mm~70mm,更佳為40mm~50mm,而且,筒狀壁部的高度例如為250mm~700mm,較佳為350mm~550mm,更佳為400mm~500mm。支持板的厚度例如適當的是5mm~100mm,較佳為10mm~60mm,更佳為20mm~50mm。 For example, when the heat conductor is a bottomed cylindrical shape, the radius of the bottom portion is suitably, for example, a radius of the crucible of ±200 mm, preferably a radius of the crucible of ±100 mm, more preferably a radius of the crucible of ±50 mm. Specifically, the radius of the bottom portion is, for example, suitably from 100 mm to 1000 mm, preferably from 150 mm to 800 mm, more preferably from 200 mm to 500 mm. Further, the thickness of the bottom portion is, for example, 5 mm to 200 mm, preferably 20 mm to 100 mm, more preferably 30 mm to 60 mm. The thickness of the cylindrical wall portion is, for example, 20 mm to 100 mm, preferably 30 mm to 70 mm, more preferably 40 mm to 50 mm, and the height of the cylindrical wall portion is, for example, 250 mm to 700 mm, preferably 350 mm to 550 mm, more preferably 400mm~500mm. The thickness of the support plate is, for example, suitably 5 mm to 100 mm, preferably 10 mm to 60 mm, more preferably 20 mm to 50 mm.

.冷卻單元 . Cooling unit

上述導熱體是藉由冷卻單元來對該導熱體的開口端部(圖2(a)9)的附近進行冷卻。如上所述僅對開口端部附近進行冷卻,藉此在靠近該開口端部的導熱體的底部,熱直接在導熱體內部傳遞,從而使該底部冷卻(導熱)。而且,在遠離該開口端部的導熱體的底部,熱在導熱體的開口部藉由輻射而傳遞至開口端部附近,從而使該底部冷卻(熱放射)。如上所述,本發明的導熱體藉由具有開口部、以及利用冷卻單元對導熱體的開口端部附近進行冷卻,可均勻地冷卻導熱體的底部。 The heat conductor is cooled by the cooling unit in the vicinity of the opening end (Fig. 2 (a) 9) of the heat conductor. As described above, only the vicinity of the open end portion is cooled, whereby heat is directly transmitted inside the heat conductor at the bottom of the heat conductor close to the open end portion, thereby cooling the bottom portion (heat conduction). Further, at the bottom of the heat conductor remote from the end of the opening, heat is transmitted to the vicinity of the opening end by radiation at the opening of the heat conductor, thereby cooling the bottom portion (heat radiation). As described above, the heat conductor of the present invention can uniformly cool the bottom of the heat conductor by having the opening and cooling the vicinity of the opening end of the heat conductor by the cooling unit.

作為冷卻單元,可列舉藉由冷媒而冷卻的感應加熱線圈等的冷卻部分,所述冷媒是用以對內側已經冷卻的下部室之壁及線圈部分進行冷卻。藉由將所述冷卻部分面向導熱體開口端部而配置於外側,可不與導熱體的開口端部接觸,而利用自導熱體的開口端部表面傳向該冷卻部分的輻射傳熱來進行冷卻。對於冷卻部分的冷卻而言,可利用水冷方式等液體媒體方式、惰性氣體或空冷方式等氣體媒體方式。輻射傳熱量(Q)和導熱體開口端部的表面溫度(T1)的四次方與冷卻部分的表面溫度(T2)的四次方之差成比例(Q=A×B×k×(T14-T24),式中,A為導熱體開口端部的表面積,B為形態係數,k為波茲曼係數(Boltzmann factor)),因此可一面利用溫度感測器對上述冷卻部分的表面溫度進行測定,並且對導熱體開口端部的經開口的表面積(A)進行任意調整,一面 控制散熱量。 The cooling unit includes a cooling portion such as an induction heating coil cooled by a refrigerant for cooling the wall and the coil portion of the lower chamber that has been cooled inside. By arranging the cooling portion toward the open end of the heat conductor, the radiant heat transfer from the open end surface of the heat conductor to the cooling portion can be performed without being in contact with the open end of the heat conductor. . For the cooling of the cooling portion, a gas medium method such as a liquid medium method such as a water cooling method, an inert gas or an air cooling method can be used. The radiant heat transfer amount (Q) and the fourth power of the surface temperature (T1) of the open end of the heat conductor are proportional to the fourth power difference of the surface temperature (T2) of the cooling portion (Q=A×B×k×(T1) 4 - T2 4 ), where A is the surface area of the open end of the heat conductor, B is the form factor, and k is the Boltzmann factor, so that the surface of the cooling portion can be used with a temperature sensor The temperature was measured, and the surface area (A) of the opening of the open end of the heat conductor was arbitrarily adjusted to control the amount of heat radiation.

藉由冷卻單元而冷卻的導熱體的開口端部附近部分並無特別限定,但當將導熱體筒狀壁的高度設為100%時,是指自開口端部算起1%~70%的高度的區域,較佳為自開口端部算起1%~50%的高度的區域,更佳為自開口端部算起1%~40%的高度的區域。開口端部附近亦可包含開口端部自身。具體而言,與設置於導熱體的開口端部周邊的冷卻單元的空隙,例如適當的是大於0mm且400mm以下,較佳為1mm~300mm,更佳為10mm~200mm。 The vicinity of the opening end portion of the heat conductor cooled by the cooling unit is not particularly limited. However, when the height of the heat conductor tubular wall is 100%, it means 1% to 70% from the opening end. The height region is preferably a region having a height of 1% to 50% from the open end portion, and more preferably a region having a height of 1% to 40% from the open end portion. The open end itself may also be included near the open end. Specifically, the gap with the cooling unit provided around the opening end portion of the heat conductor is, for example, suitably larger than 0 mm and 400 mm or less, preferably 1 mm to 300 mm, and more preferably 10 mm to 200 mm.

.隔熱材料 . Insulation materials

當藉由加熱器對坩堝中的矽原料進行加熱時,自熱效率方面來看,較佳為本發明的多晶矽製造裝置整體,特別是坩堝及導熱體整體已與外部進行隔熱。因此,加熱過程中,較佳為已對導熱體及冷卻單元進行隔熱。作為進行隔熱的方法,例如可列舉使導熱體用的載置台與覆蓋坩堝及導熱體的隔熱材料密接。另一方面,在冷卻過程中,例如,藉由該隔熱材料的升降用汽缸(cylinder)而使該導熱體開口端部附近的下部隔熱材料下降,在導熱體的開口端部附近形成空隙。通過該空隙,不與下部室之壁或感應加熱線圈等導熱體相接觸,而藉由對配置於外周部的冷卻部分的輻射傳熱來進行冷卻。輻射傳熱量可藉由根據導熱體開口端部表面的溫度及冷卻部分表面溫度,改變導熱體開口端部的開口部的面積,來進行任意控制。此處,隔熱材料可覆蓋上述坩堝、加熱器 背面及導熱體的至少一部分。作為隔熱材料,較佳為如下的隔熱材料,即,具有至少2000℃以上的耐熱性,較佳為具有2500℃以上的耐熱性。作為隔熱材料,理想的是碳纖維成形隔熱材料等。作為較佳的隔熱材料的示例,例如可列舉大阪氣體化學(Osaka Gas Chemicals)股份有限公司製的DONACARBO(DON-1000、DON-2000、DON-3000、DON-4000)。 When the crucible raw material in the crucible is heated by the heater, it is preferable that the entire polycrystalline silicon manufacturing apparatus of the present invention is thermally insulated from the outside, in particular, the entire crucible and the thermal conductor are thermally insulated from the outside. Therefore, in the heating process, it is preferable to insulate the heat conductor and the cooling unit. As a method of performing heat insulation, for example, a mounting table for a heat conductor is adhered to a heat insulating material covering the heat sink and the heat conductor. On the other hand, in the cooling process, for example, the lower heat insulating material in the vicinity of the opening end portion of the heat conductor is lowered by the cylinder for raising and lowering the heat insulating material, and a gap is formed in the vicinity of the opening end portion of the heat conductor. . The gap is not in contact with the heat transfer body such as the wall of the lower chamber or the induction heating coil, but is cooled by heat transfer to the cooling portion disposed on the outer peripheral portion. The amount of radiation heat transfer can be arbitrarily controlled by changing the area of the opening of the open end of the heat conductor according to the temperature of the surface of the open end of the heat conductor and the surface temperature of the cooling portion. Here, the insulating material can cover the above-mentioned crucible and heater The back side and at least a portion of the heat conductor. The heat insulating material is preferably a heat insulating material having a heat resistance of at least 2000 ° C or higher, and preferably having a heat resistance of 2500 ° C or higher. As the heat insulating material, a carbon fiber forming heat insulating material or the like is preferable. As an example of a preferable heat insulating material, DONACARBO (DON-1000, DON-2000, DON-3000, DON-4000) by Osaka Gas Chemicals Co., Ltd. is mentioned, for example.

.感應加熱線圈 . Induction heating coil

導熱體是藉由感應加熱線圈而加熱,亦可用作可自坩堝的下部進行加熱的加熱器。感應加熱線圈可與導熱體相離而配置,因此即使在導熱體由隔熱材料所覆蓋時,亦可自該隔熱材料的外側對導熱體進行加熱。而且,感應加熱線圈不僅可對導熱體的表面進行加熱,亦可對導熱體的內部進行加熱,因此具有可對導熱體的底部進行均勻加熱的優點。感應加熱線圈較佳為設置溫度感測器,從而可進行溫度調節。感應線圈例如控制在1Hz~500Hz的頻率,較佳為控制在10Hz~300Hz的頻率,更佳為控制在30Hz~100Hz的頻率。 The heat conductor is heated by the induction heating coil, and can also be used as a heater that can be heated by the lower portion of the crucible. Since the induction heating coil can be disposed apart from the heat conductor, the heat conductor can be heated from the outside of the heat insulating material even when the heat conductor is covered by the heat insulating material. Further, the induction heating coil can not only heat the surface of the heat conductor but also heat the inside of the heat conductor, so that it has the advantage of uniformly heating the bottom of the heat conductor. The induction heating coil is preferably provided with a temperature sensor for temperature adjustment. The induction coil is controlled, for example, at a frequency of 1 Hz to 500 Hz, preferably at a frequency of 10 Hz to 300 Hz, and more preferably at a frequency of 30 Hz to 100 Hz.

[B]多晶矽矽錠製造方法 [B] Polycrystalline germanium ingot manufacturing method

本發明的多晶矽製造方法是使用上述多晶矽矽錠製造裝置來進行,且包括以下步驟:(1)將矽原料收納於可進行溫度調節的坩堝內;(2)將上述坩堝內的矽原料加熱至矽的熔點以上的溫度而使 上述矽原料熔融;以及(3)經由配置於該坩堝的下方的導熱體,對上述坩堝內的熔融矽進行冷卻,而獲得多晶矽。 The polycrystalline silicon crucible manufacturing method of the present invention is carried out using the polycrystalline germanium ingot manufacturing apparatus, and includes the steps of: (1) storing the tantalum raw material in a temperature-adjustable crucible; and (2) heating the crucible raw material in the crucible to The temperature above the melting point of the crucible The crucible raw material is melted; and (3) the molten crucible in the crucible is cooled by a heat conductor disposed under the crucible to obtain polycrystalline germanium.

(1)收納矽原料的步驟 (1) Steps of accommodating 矽 raw materials

首先,將矽原料收納於坩堝內。矽原料及坩堝的具體情況如上所述。 First, the raw material is stored in a crucible. The details of the raw materials and bismuth are as described above.

(2)對坩堝進行加熱的步驟 (2) Steps of heating the crucible

其次,將上述坩堝內的矽原料加熱至矽的熔點以上的溫度而使上述矽原料熔融。加熱是藉由加熱器來進行,所述加熱器配置於坩堝的周圍,較佳為配置於坩堝的上方。加熱器的具體情況如上所述。 Next, the niobium raw material in the crucible is heated to a temperature equal to or higher than the melting point of niobium to melt the niobium raw material. Heating is performed by a heater disposed around the crucible, preferably above the crucible. The details of the heater are as described above.

由於矽的熔點為約1410℃,因此以如下方式來進行加熱,即,坩堝內的經熔融的矽原料的溫度達到充分高於該熔點的溫度,例如達到1450℃以上的溫度,較佳為達到1450℃~1600℃的溫度,更佳為達到1500℃~1550℃左右的溫度。 Since the melting point of cerium is about 1410 ° C, heating is performed in such a manner that the temperature of the molten cerium raw material in the crucible reaches a temperature sufficiently higher than the melting point, for example, a temperature of 1450 ° C or higher, preferably The temperature of 1450 ° C ~ 1600 ° C, more preferably reaches the temperature of about 1500 ° C ~ 1550 ° C.

而且,亦可藉由上述加熱器與導熱體的組合來進行加熱,所述導熱體是藉由感應加熱線圈而加熱。藉由利用加熱器及導熱體進行加熱,可自坩堝的上下進行加熱,因此有效率。感應加熱線圈的具體情況如上所述。 Further, heating may be performed by a combination of the heater and the heat conductor which is heated by the induction heating coil. By heating by the heater and the heat conductor, it is possible to heat the upper and lower sides of the crucible, which is efficient. The details of the induction heating coil are as described above.

(3)對坩堝進行冷卻的步驟 (3) Steps for cooling the crucible

經由配置於該坩堝的下方的導熱體,對上述坩堝內的熔融矽 進行冷卻。為了製造均質的多晶矽,特佳為一面使導熱體的底部外表面(與坩堝的底部外表面接近之側)的溫度保持均勻,一面進行冷卻。而且,當將導熱體的底部外表面的溫度設為Tg(℃)時,較佳為在Tg滿足以下通式(線性近似方程式)的條件下使溫度下降:Tg=a-bt。 Melting enthalpy in the above crucible via a heat conductor disposed under the crucible Cool down. In order to produce a homogeneous polycrystalline crucible, it is particularly preferable to cool while maintaining the temperature of the outer surface of the bottom portion of the heat conductor (the side close to the outer surface of the bottom surface of the crucible). Further, when the temperature of the outer surface of the bottom portion of the heat conductor is Tg (° C.), it is preferred to lower the temperature under the condition that Tg satisfies the following general formula (linear approximation equation): Tg=a-bt.

式中,a為1,250~1,400(℃),較佳為1,290~1,380(℃),更佳為1,300~1,360(℃),b為10~35,較佳為15~33,更佳為17~30,t為自冷卻開始算起的經過時間(小時)。換言之,較佳為使Tg以如下速度以大致一次函數方式下降,所述速度為10℃/小時~35℃/小時,較佳為15℃/小時~33℃/小時,更佳為17℃/小時~30℃/小時的速度。 In the formula, a is 1,250~1,400 (°C), preferably 1,290~1,380 (°C), more preferably 1,300~1,360 (°C), b is 10~35, preferably 15~33, more preferably 17~ 30, t is the elapsed time (hours) from the start of cooling. In other words, it is preferred to lower the Tg in a substantially linear manner at a rate of from 10 ° C / hour to 35 ° C / hour, preferably from 15 ° C / hour to 33 ° C / hour, more preferably 17 ° C / Hour ~ 30 ° C / hour speed.

而且,熔融矽與坩堝底部相接的部分的溫度Tx適當的是與Tg相比高40℃~200℃,較佳為高50℃~150℃,更佳為高60℃~120℃。此處,熔融矽的凝固速度例如適當的是0.1mm/分~1.5mm/分,較佳為0.2mm/分~1.0mm/分,更佳為0.3mm/分~0.5mm/分。熔融矽的過熱度(熔融矽的溫度-矽的凝固溫度)適當的是跨整個凝固時間範圍,例如保持在40℃以下,較佳為保持在10℃以下,更佳為保持在2℃~5℃。 Further, the temperature Tx of the portion where the molten crucible is in contact with the bottom of the crucible is suitably 40 ° C to 200 ° C higher than Tg, preferably 50 ° C to 150 ° C higher, more preferably 60 ° C to 120 ° C higher. Here, the solidification rate of the molten crucible is, for example, suitably 0.1 mm/min to 1.5 mm/min, preferably 0.2 mm/min to 1.0 mm/min, more preferably 0.3 mm/min to 0.5 mm/min. The degree of superheat of the molten crucible (the temperature of the melting crucible - the solidification temperature of the crucible) is suitably in the range of the entire solidification time, for example, kept below 40 ° C, preferably below 10 ° C, more preferably maintained at 2 ° C ~ 5 °C.

[C]藉由圖式來說明多晶矽製造裝置 [C] illustrates a polysilicon manufacturing device by a schematic diagram

以下,一面參照圖式,一面說明本發明的多晶矽製造裝置。 Hereinafter, the polycrystalline silicon manufacturing apparatus of the present invention will be described with reference to the drawings.

圖3(a)是對坩堝進行加熱的步驟中的本發明的多晶矽製造裝置的剖面圖。圖3(b)是對坩堝進行冷卻的步驟中的本發明的多晶矽製造裝置的剖面圖。 Fig. 3 (a) is a cross-sectional view showing the apparatus for producing a polycrystalline silicon of the present invention in the step of heating the crucible. Fig. 3 (b) is a cross-sectional view showing the apparatus for producing a polycrystalline silicon of the present invention in the step of cooling the crucible.

如圖3(a)及圖3(b)所示,本發明的多晶矽製造裝置(101)包括上部室(105)及下部室(108),所述上部室(105)包括可收納矽原料(102)的坩堝(103)、以及配置於該坩堝(103)的上方的加熱器(104),所述下部室(108)包括配置於該坩堝(103)的下方的導熱體(106)、以及對該導熱體(106)進行冷卻的冷卻單元(107)及冷卻部分(108、113)。用作冷卻部分的下部室(108)的壁內部及感應加熱線圈(113)的內部是利用水冷方式等液體媒體方式、惰性氣體或空冷方式等氣體媒體方式進行冷卻。在坩堝(103)的上部,亦可設置有蓋子(109),在坩堝的下部,亦可設置有用以支持坩堝(103)的支持板(110)。在坩堝(103)中亦可設置噴嘴(111),自該噴嘴(111)噴入惰性氣體等。坩堝(103)、加熱器(104)及上述導熱體(106)是由隔熱材料(112)及隔熱材料(114)所覆蓋。圖3(a)中,構成冷卻單元(107)的下部隔熱材料(114)與上部隔熱材料(112)相接,因此同樣地作為冷卻單元(107)的一部分的空隙(116)(參照圖3(b))被封閉。導熱體(106)藉由感應加熱線圈(113)而加熱,所述感應加熱線圈(113)配置於隔熱材料(112)的外側。因此,冷卻單元(107) 在圖3(a)中不發揮作用。另一方面,如圖3(b)所示,在對坩堝(103)進行冷卻的步驟中,藉由汽缸(115)而使下部隔熱材料(114)降落,從而設置空隙(116)。藉此,與空隙(116)相接的導熱體(106)的開口端部附近得到冷卻。再者,加熱器(104)、導熱體(106)的底部溫度、開口端部表面溫度、感應加熱線圈(113)的前面側溫度及下部室之壁的爐內側表面可分別藉由溫度感測器(117)進行測定。 As shown in FIGS. 3(a) and 3(b), the polysilicon manufacturing apparatus (101) of the present invention includes an upper chamber (105) and a lower chamber (108), and the upper chamber (105) includes a raw material ( a crucible (103) of 102), and a heater (104) disposed above the crucible (103), the lower chamber (108) including a heat conductor (106) disposed under the crucible (103), and A cooling unit (107) and a cooling portion (108, 113) for cooling the heat conductor (106). The inside of the lower chamber (108) serving as the cooling portion and the inside of the induction heating coil (113) are cooled by a liquid medium method such as a liquid cooling method such as a water cooling method or an inert gas or air cooling method. A cover (109) may be provided on the upper portion of the crucible (103), and a support plate (110) for supporting the crucible (103) may be provided in the lower portion of the crucible. A nozzle (111) may be provided in the crucible (103), and an inert gas or the like is injected from the nozzle (111). The crucible (103), the heater (104), and the heat conductor (106) are covered by a heat insulating material (112) and a heat insulating material (114). In Fig. 3(a), since the lower heat insulating material (114) constituting the cooling unit (107) is in contact with the upper heat insulating material (112), the space (116) which is a part of the cooling unit (107) is similarly referred to (refer to Figure 3 (b)) is closed. The heat conductor (106) is heated by an induction heating coil (113) disposed outside the heat insulating material (112). Therefore, the cooling unit (107) It does not work in Figure 3(a). On the other hand, as shown in FIG. 3(b), in the step of cooling the crucible (103), the lower heat insulating material (114) is dropped by the cylinder (115), thereby providing a void (116). Thereby, the vicinity of the opening end portion of the heat conductor (106) that is in contact with the gap (116) is cooled. Furthermore, the temperature of the bottom of the heater (104), the heat conductor (106), the surface temperature of the open end, the temperature of the front side of the induction heating coil (113), and the inner surface of the wall of the lower chamber can be respectively sensed by temperature. The device (117) performs the measurement.

[D]多晶矽的評價 [D] Evaluation of polycrystalline germanium

藉由上述方法而製造的多晶矽矽錠的特性可藉由測定作為太陽電池的能量轉換效率來進行評價。能量轉換效率通常是使用太陽燈(Solar Light)公司製的太陽模擬器(solar simulator)等,根據STC(標準試驗條件;Standard Test Cell conditions)來評價。再者,STC是將太陽輻射強度1.0kW/m2、氣團(airmass)AM=1.5的太陽模擬器作為光源,根據在太陽電池溫度25℃下所測定的太陽電池的最大輸出功率進行評價。作為試料,可使用自所獲得的多晶矽矽錠切出矽晶圓而製作的太陽電池。 The characteristics of the polycrystalline germanium ingot produced by the above method can be evaluated by measuring the energy conversion efficiency as a solar cell. The energy conversion efficiency is usually evaluated by using a solar simulator manufactured by Solar Light Co., Ltd., etc., according to STC (Standard Test Cell conditions). Further, the STC is a solar simulator having a solar radiation intensity of 1.0 kW/m 2 and an air mass of AM = 1.5 as a light source, and is evaluated based on the maximum output power of the solar cell measured at a solar cell temperature of 25 °C. As the sample, a solar cell produced by cutting out a tantalum wafer from the obtained polycrystalline germanium ingot can be used.

以下,藉由實施例及比較例來對本申請案發明進行更詳細說明,但實施例為本發明的一例,並未限定本發明的範圍。 Hereinafter, the invention of the present application will be described in more detail by way of examples and comparative examples, but the examples are examples of the invention and are not intended to limit the scope of the invention.

[實施例] [Examples]

實施例1及實施例2 Embodiment 1 and Embodiment 2

使用如圖3(a)及圖3(b)所示的多晶矽製造裝置製造多晶 矽。但是,在實施例及比較例中,未使用支持板(110)。 Polycrystalline is produced using a polysilicon manufacturing apparatus as shown in Figs. 3(a) and 3(b) Hey. However, in the examples and comparative examples, the support plate (110) was not used.

作為坩堝,是使用有底的筒形坩堝,具有1000mm見方的正方形的底部,高度為650mm。坩堝的導熱率為4.5W/m.K(測定溫度950℃)。坩堝的厚度為25mm。坩堝為不透明石英製,在坩堝內表面上施加有添加了5質量%的二氧化矽的氮化矽的塗層。作為導熱體,是使用縱剖面為凹型的東海碳素股份有限公司製的各向同性黑鉛製導熱體G535。導熱體是有底的筒形,具有1100mm見方的正方形的底部外尺寸,壁部的高度(圖2(a)7)為500mm(實施例1及實施例2)(參照圖1(a)、圖2(a))。導熱體的底部及壁部的厚度(圖2(a)6及8)為150mm(實施例1及2)。導熱體的導熱率為81W/m.K(在室溫下測定(參照JIS R1611閃光法))。設置於導熱體的開口端部周邊的冷卻單元的空隙是在大於0mm且200mm以下的範圍內進行調節。 As a crucible, a bottomed cylindrical crucible having a square bottom of 1000 mm square and a height of 650 mm is used. The thermal conductivity of tantalum is 4.5W/m. K (measurement temperature 950 ° C). The thickness of the crucible is 25 mm. The crucible was made of opaque quartz, and a coating of tantalum nitride to which 5 mass% of ceria was added was applied to the inner surface of the crucible. As the heat conductor, an isotropic black lead heat conductor G535 made of Tokai Carbon Co., Ltd. having a concave profile in a longitudinal section is used. The heat conductor is a bottomed cylindrical shape having a square outer outer dimension of 1100 mm square, and the height of the wall portion (Fig. 2(a) 7) is 500 mm (refer to Fig. 1 and embodiment 2) (refer to Fig. 1 (a), Figure 2 (a)). The thickness of the bottom and wall portions of the heat conductor (Figs. 2(a) 6 and 8) was 150 mm (Examples 1 and 2). The thermal conductivity of the thermal conductor is 81W/m. K (measured at room temperature (refer to JIS R1611 flash method)). The gap of the cooling unit provided around the open end of the heat conductor is adjusted within a range of more than 0 mm and 200 mm or less.

作為收納於上述坩堝內的矽原料,是使用純度99.9999999%以上的多晶矽(瓦克(Wacker)公司製)。 As the niobium raw material accommodated in the crucible, a polycrystalline crucible (manufactured by Wacker Co., Ltd.) having a purity of 99.9999999% or more is used.

作為加熱器,是使用東海碳素股份有限公司製的各向同性黑鉛G535,作為感應加熱線圈,是使用富士電機爐(Fuji Electric Furnace)公司製的低頻感應加熱裝置(輸出50kW)。而且,作為裝置內的隔熱材料,是使用大阪氣體化學股份有限公司製的DONACARBO(DON-1000)。 As the heater, an isotropic black lead G535 manufactured by Tokai Carbon Co., Ltd. was used, and as the induction heating coil, a low-frequency induction heating device (output: 50 kW) manufactured by Fuji Electric Furnace Co., Ltd. was used. Further, as a heat insulating material in the apparatus, DONACARBO (DON-1000) manufactured by Osaka Gas Chemical Co., Ltd. was used.

首先,藉由坩堝上方的加熱器及導熱體來對坩堝進行加熱, 以使熔融矽的溫度達到1550℃,所述導熱體是藉由感應加熱線圈(50Hz)而加熱。 First, the crucible is heated by the heater and the heat conductor above the crucible. The temperature of the molten crucible was brought to 1550 ° C, and the heat conductor was heated by an induction heating coil (50 Hz).

當矽原料全部變為熔融矽之後,停止導熱體的加熱,使導熱體用的下部隔熱材料降落而在導熱體的開口端部附近設置空隙,開始導熱體的冷卻。導熱體的底部外表面的溫度Tg(℃)的溫度分佈(temperature profile)可用以下的線性近似方程式表示:Tg=a-bt。 After all the raw materials of the crucible are melted, the heating of the thermal conductor is stopped, the lower heat insulating material for the thermal conductor is lowered, and a gap is provided near the open end of the thermal conductor to start cooling of the thermal conductor. The temperature profile of the temperature Tg (° C.) of the bottom outer surface of the heat conductor can be expressed by the following linear approximation equation: Tg=a-bt.

其中,式中a及b如以下表1所示,t為自冷卻開始算起的經過時間(小時)。再者,實施例1及實施例2中,加入至坩堝中的矽的高度為300mm,凝固過程中的熔融矽表面的溫度Ts維持在與熔點1410℃相比高2℃的狀態(過熱度=2℃,Ts=1412℃)。關於凝固速度Vs,實施例1的目標為0.3mm/分,實施例2的目標為0.5mm/分。圖4、圖5及圖7分別表示將實施例1及實施例2的Ts(℃)、Tx(℃)、Tg(℃)及凝固速度的變化加以圖表化的圖。再者,在凝固最終階段,為了使熔融矽固化,使坩堝上方的加熱器輸出位準維持固定。 Here, a and b in the formula are as shown in the following Table 1, and t is an elapsed time (hour) from the start of cooling. Further, in Example 1 and Example 2, the height of the crucible added to the crucible was 300 mm, and the temperature Ts of the surface of the molten crucible during solidification was maintained at a state 2 ° C higher than the melting point of 1410 ° C (superheat = 2 ° C, Ts = 1412 ° C). Regarding the solidification rate Vs, the target of Example 1 was 0.3 mm/min, and the target of Example 2 was 0.5 mm/min. 4, 5, and 7 are graphs showing changes in Ts (°C), Tx (°C), Tg (°C), and solidification speed in Examples 1 and 2, respectively. Further, in the final stage of solidification, in order to solidify the molten crucible, the heater output level above the crucible is maintained constant.

比較例1 Comparative example 1

取代本發明的導熱體,作為先前方法,正對著坩堝底部而配置水冷式銅製冷凍機(市售脫氧銅,1,000mm見方,箱式冷卻構造,冷卻板部厚度:12mm,冷卻水:淨水,水量50l/分),並使 用收納於上述坩堝內時高度達到250mm的矽原料,使矽矽錠凝固,除此以外,與實施例1同樣地製造多晶矽矽錠。圖6及圖7表示此時的熔融矽表面溫度Ts(℃)、水冷式銅製冷卻冷凍機的底部外表面(與坩堝底部相接之側)的溫度Tg(℃)及凝固速度的變化。 In place of the heat conductor of the present invention, as a conventional method, a water-cooled copper refrigerator (a commercially available deoxidized copper, a 1,000 mm square, a box type cooling structure, a cooling plate portion thickness: 12 mm, a cooling water: purified water) is disposed facing the bottom of the crucible. , the amount of water 50l / min), and A polycrystalline germanium ingot was produced in the same manner as in Example 1 except that the crucible ingot was solidified in a crucible having a height of 250 mm. Fig. 6 and Fig. 7 show changes in the temperature Tg (°C) of the molten tantalum surface temperature T° (°C) and the bottom outer surface (the side in contact with the bottom of the crucible) of the water-cooled copper cooling refrigerator, and the solidification rate.

評價 Evaluation

切下如上所述而製造的實施例及比較例的矽矽錠的下端20mm、上端10mm、側部20mm,自剩下的矽錠切出36條150mm□的塊料(block)。自36條塊料進而切出剖面尺寸150mm、厚度200μm的矽晶圓,製成太陽電池。該太陽電池的能量轉換效率是使用太陽燈公司製的太陽模擬器(16S-300-002),在上述STC條件下進行測定。將與實施例1、實施例2及比較例中所獲得的矽矽錠相對應的所有晶圓的每一個的能量轉換效率的分布集中示於表2。 The lower end of the bismuth ingot of the examples and the comparative examples produced as described above was cut into 20 mm, the upper end was 10 mm, and the side portion was 20 mm, and 36 pieces of 150 mm □ blocks were cut out from the remaining bismuth ingots. A solar cell having a cross-sectional dimension of 150 mm and a thickness of 200 μm was cut out from 36 blocks. The energy conversion efficiency of the solar cell was measured under the above-described STC conditions using a solar simulator (16S-300-002) manufactured by Sunlight Co., Ltd. The distribution of the energy conversion efficiencies of each of all the wafers corresponding to the bismuth ingots obtained in Example 1, Example 2, and Comparative Example is collectively shown in Table 2.

*實施例1、實施例2及比較例1的數值是所有晶圓中,顯示出符合條件的轉換效率的晶圓的塊數的比例(%) * The numerical values of Example 1, Example 2, and Comparative Example 1 are ratios (%) of the number of wafers showing the conversion efficiency that meets the conditions in all wafers.

如上述表2所示,在實施例1及實施例2中,具有可謂是比較高的17%以上的能量轉換效率的矽晶圓的塊數均獲得整體的70%以上,與此相對,在先前方法中,所述矽晶圓的塊數為整體的20%,收率為三分之一以下。 As shown in the above-mentioned Table 2, in the first embodiment and the second embodiment, the number of blocks of the germanium wafer having a relatively high energy conversion efficiency of 17% or more is 70% or more of the total, and in contrast, In the prior method, the number of blocks of the germanium wafer is 20% of the whole, and the yield is less than one third.

上述結果為,本發明的多晶矽矽錠製造裝置可將熔融矽溫度跨整個凝固範圍維持在稍高於熔點的溫度,且將凝固速度亦跨整個凝固範圍維持得較低且固定。由所獲得的多晶矽矽錠製造的多晶矽與比較例相比具有優越的能量轉換效率。 As a result of the above, the polycrystalline germanium ingot manufacturing apparatus of the present invention can maintain the melting enthalpy temperature at a temperature slightly higher than the melting point across the entire solidification range, and maintain the solidification speed lower and constant across the entire solidification range. The polycrystalline germanium produced from the obtained polycrystalline germanium ingot has superior energy conversion efficiency as compared with the comparative example.

101‧‧‧多晶矽製造裝置 101‧‧‧Polysilicon manufacturing equipment

102‧‧‧矽原料 102‧‧‧矽Materials

103‧‧‧坩堝 103‧‧‧坩埚

104‧‧‧加熱器 104‧‧‧heater

105‧‧‧上部室 105‧‧‧ upper room

106‧‧‧導熱體 106‧‧‧ Thermal Conductor

108‧‧‧下部室 108‧‧‧low room

109‧‧‧蓋子 109‧‧‧Cover

110‧‧‧支持板 110‧‧‧Support board

111‧‧‧噴嘴 111‧‧‧Nozzles

112‧‧‧上部隔熱材料 112‧‧‧Upper insulation

113‧‧‧感應加熱線圈 113‧‧‧Induction heating coil

114‧‧‧下部隔熱材料 114‧‧‧Bottom insulation

115‧‧‧汽缸 115‧‧‧ cylinder

117‧‧‧溫度感測器 117‧‧‧temperature sensor

Claims (10)

一種多晶矽矽錠製造裝置,包括:坩堝,可收納矽原料;加熱器,配置於該坩堝的周圍;導熱體,配置於該坩堝的下方;以及冷卻單元,對該導熱體進行冷卻;所述多晶矽矽錠製造裝置的特徵在於:上述導熱體形成下方開口的有底的筒狀體,將上述導熱體的底部外表面與上述坩堝的底部外表面相對向而配置,藉由上述冷卻單元來使上述導熱體的開口端部附近被冷卻。 A polycrystalline germanium ingot manufacturing apparatus comprising: a crucible capable of accommodating a crucible raw material; a heater disposed around the crucible; a thermal conductor disposed under the crucible; and a cooling unit cooling the thermal conductor; the polycrystalline crucible In the bismuth ingot manufacturing apparatus, the heat conductor is formed with a bottomed cylindrical body that is opened downward, and the bottom outer surface of the heat conductor is disposed to face the outer surface of the bottom of the crucible, and the cooling unit is configured to The vicinity of the open end of the heat conductor is cooled. 如申請專利範圍第1項所述的多晶矽矽錠製造裝置,其中上述導熱體根據JIS R1611的閃光法在25℃下進行測定而具有30W/m.K~150W/m.K的導熱率。 The polycrystalline germanium ingot manufacturing apparatus according to claim 1, wherein the heat conductor is measured at 25 ° C according to the flash method of JIS R1611 and has 30 W/m. K~150W/m. The thermal conductivity of K. 如申請專利範圍第1項或第2項所述的多晶矽矽錠製造裝置,其中上述導熱體為黑鉛製。 The polycrystalline germanium ingot manufacturing apparatus according to the first or second aspect of the invention, wherein the heat conductor is made of black lead. 如申請專利範圍第1項至第3項中任一項所述的多晶矽矽錠製造裝置,更包括感應加熱線圈,所述感應加熱線圈是對上述導熱體進行加熱。 The polycrystalline germanium ingot manufacturing apparatus according to any one of claims 1 to 3, further comprising an induction heating coil, wherein the induction heating coil heats the heat conductor. 如申請專利範圍第1項至第4項中任一項所述的多晶矽矽錠製造裝置,更包括隔熱材料,所述隔熱材料覆蓋上述坩堝、上述加熱器及上述導熱體的至少一部分。 The polycrystalline germanium ingot manufacturing apparatus according to any one of claims 1 to 4, further comprising a heat insulating material covering at least a part of the crucible, the heater, and the heat conductor. 如申請專利範圍第1項至第5項中任一項所述的多晶矽矽 錠製造裝置,其中更包括:蓋子,覆蓋上述坩堝的開口端部;以及噴嘴,用以對該坩堝內部噴入惰性氣體。 Polycrystalline germanium as described in any one of claims 1 to 5 The ingot manufacturing apparatus further includes: a cover covering the open end of the crucible; and a nozzle for injecting an inert gas into the crucible. 一種多晶矽矽錠製造方法,包括如下步驟:(1)將矽原料收納於可進行溫度調節的坩堝內;(2)將上述坩堝內的矽原料加熱至矽的熔點以上的溫度而使上述矽原料熔融;以及(3)經由配置於該坩堝的下方的導熱體,對上述坩堝內的熔融矽進行冷卻,而獲得多晶矽矽錠;所述多晶矽矽錠製造方法的特徵在於:上述導熱體形成下方開口的有底的筒狀體,將上述導熱體的底部外表面與上述坩堝的底部外表面相對向而配置,藉由上述冷卻單元來對上述導熱體的開口端部附近進行冷卻。 A method for producing a polycrystalline ruthenium ingot, comprising the steps of: (1) accommodating a ruthenium raw material in a temperature-adjustable crucible; and (2) heating the niobium raw material in the crucible to a temperature higher than a melting point of niobium to make the niobium raw material And (3) cooling the molten crucible in the crucible via a heat conductor disposed under the crucible to obtain a polycrystalline ingot; the polycrystalline ingot manufacturing method is characterized in that the thermal conductor forms a lower opening The bottomed cylindrical body is disposed such that a bottom outer surface of the heat conductor is opposed to a bottom outer surface of the crucible, and the vicinity of an opening end portion of the heat conductor is cooled by the cooling unit. 如申請專利範圍第7項所述的多晶矽矽錠製造方法,其中在如下條件下進行上述冷卻,即,將上述導熱體的底部外表面的溫度(Tg)(℃)設為以下的線性近似方程式:Tg=a-bt,其中a為1,250~1,400,b為10~35,t為自冷卻開始算起的經過時間(小時)。 The method for producing a polycrystalline germanium ingot according to claim 7, wherein the cooling is performed under the following conditions, that is, the temperature (Tg) (° C.) of the outer surface of the bottom surface of the heat conductor is set to the following linear approximation equation. :Tg=a-bt, where a is 1,250~1,400, b is 10~35, and t is the elapsed time (hours) from the start of cooling. 如申請專利範圍第7項或第8項所述的多晶矽矽錠製造方 法,其中藉由加熱器及上述導熱體來進行上述加熱,所述加熱器配置於上述坩堝的周圍,上述導熱體是藉由感應加熱線圈而加熱。 The manufacturer of polycrystalline germanium ingots as described in claim 7 or 8 In the method, the heating is performed by a heater and the heat conductor, and the heater is disposed around the crucible, and the heat conductor is heated by an induction heating coil. 如申請專利範圍第7項至第9項中任一項所述的多晶矽矽錠製造方法,其中在惰性氣體環境下進行上述加熱步驟及冷卻步驟。 The method for producing a polycrystalline germanium ingot according to any one of claims 7 to 9, wherein the heating step and the cooling step are carried out under an inert gas atmosphere.
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