TW201347567A - Microphone assembly - Google Patents
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Abstract
Description
本發明涉及一種麥克風模組，特別是涉及一種耳機的麥克風模組。The invention relates to a microphone module, in particular to a microphone module of an earphone.
隨著科學技術的快速發展及人們對生活的需求，麥克風已廣泛應用於電腦、移動電話、耳機等電子設備中。眾所周知，麥克風的共振腔對麥克風的性能起著決定性的作用，在其他條件相同的情況下，麥克風的共振腔越大，麥克風的最低共振頻率越小，麥克風的低頻回應效果也就越好，然而增加麥克風的共振腔的體積也相應地使麥克風的體積增大，這顯然與電子設備向短小輕薄的方向發展的趨勢相違背，因此如何合理利用該麥克風內部的空間就顯得至關重要。With the rapid development of science and technology and people's demand for life, microphones have been widely used in electronic devices such as computers, mobile phones, and earphones. As we all know, the resonant cavity of the microphone plays a decisive role in the performance of the microphone. Under other conditions, the larger the cavity of the microphone, the smaller the minimum resonant frequency of the microphone, and the better the low frequency response of the microphone. Increasing the volume of the cavity of the microphone also increases the volume of the microphone accordingly, which obviously contradicts the tendency of the electronic device to develop in a short, thin and light direction, so how to properly utilize the space inside the microphone is crucial.
有鑒於此，有必要提供一種可改善低頻回應效果的麥克風模組。In view of this, it is necessary to provide a microphone module that can improve the low frequency response effect.
一種麥克風模組，包括外殼、收容於該外殼內的電路板及收容於該外殼內並與該電路板電連接的麥克風，該麥克風具有第一亥姆霍茲共振腔，該第一亥姆霍茲共振腔的體積為V，該外殼開設有通音孔，該通音孔的深度為l，該通音孔的直徑為d，外殼與麥克風之間設有墊圈，墊圈的內側周面圍設形成空腔，空腔將通音孔與第一亥姆霍茲共振腔連通，空腔的直徑為D，該空腔的直徑D的取值範圍為D=d或。A microphone module includes a housing, a circuit board housed in the housing, and a microphone housed in the housing and electrically connected to the circuit board, the microphone having a first Helmholtz resonant cavity, the first Helmhol The volume of the resonant cavity is V, the outer casing is provided with a sound hole, the depth of the sound hole is l, the diameter of the sound hole is d, a gasket is arranged between the outer casing and the microphone, and the inner circumferential surface of the gasket is surrounded. Forming a cavity, the cavity communicating the sound hole with the first Helmholtz resonant cavity, the diameter of the cavity being D, and the diameter D of the cavity is in the range of D=d or .
該麥克風模組通過在外殼與麥克風之間設置具有空腔的墊圈，使空腔與第一亥姆霍茲共振腔連通，從而擴大了麥克風模組的亥姆霍茲共振腔的體積，進而改善低頻回應效果。The microphone module connects the cavity with the first Helmholtz resonant cavity by providing a gasket with a cavity between the outer casing and the microphone, thereby expanding the volume of the Helmholtz resonant cavity of the microphone module, thereby improving Low frequency response effect.
圖1與圖2所示為本發明第一實施例的麥克風模組，該麥克風模組包括一外殼10、設於該外殼10內的一電路板20及設於該電路板20上的一麥克風30。FIG. 1 and FIG. 2 show a microphone module according to a first embodiment of the present invention. The microphone module includes a housing 10, a circuit board 20 disposed in the housing 10, and a microphone disposed on the circuit board 20. 30.
請同時參照圖3與圖4，該外殼10包括一底蓋11、與該底蓋11結合的一頂蓋12、二分別固定至底蓋11相對兩側的側蓋13及一固定於底蓋11並覆蓋頂蓋12的殼體14。Referring to FIG. 3 and FIG. 4 simultaneously, the outer casing 10 includes a bottom cover 11 , a top cover 12 coupled to the bottom cover 11 , two side covers 13 respectively fixed to opposite sides of the bottom cover 11 , and a bottom cover 13 fixed to the bottom cover 11 and cover the housing 14 of the top cover 12.
該底蓋11呈半封閉狀，其包括一底板111及設於該底板111上的兩側板112。該底板111大致呈矩形，其與二側板112共同圍設出一收容空間113(如圖4)。該兩側板112由該底板111正對的兩側分別向上延伸形成，每一側板112的頂端形成一內高外低的臺階118。底蓋11還在每一側板112的內壁面上形成一豎直的扣鉤115及一支撐肋114。該扣鉤115與支撐肋114彼此垂直並均垂直於底板111。該支撐肋114支撐電路板20的底面，該扣鉤115抵壓電路板20的頂面，從而共同將電路板20固定在底蓋11上。每一側板112還在靠近其一端形成一低於其臺階118的卡槽117。一擋板116垂直形成於底板111上並連接二側板112的另外的二端部。該擋板116在其頂部開設有一矩形的開槽119。The bottom cover 11 is semi-closed and includes a bottom plate 111 and two side plates 112 disposed on the bottom plate 111. The bottom plate 111 is substantially rectangular, and a accommodating space 113 is disposed together with the two side plates 112 (see FIG. 4). The two side plates 112 are formed by upwardly extending the two sides of the bottom plate 111, and the top end of each of the side plates 112 forms a step 118 with a high inner and outer low. The bottom cover 11 also forms a vertical clasp 115 and a support rib 114 on the inner wall surface of each of the side plates 112. The clasp 115 and the support rib 114 are perpendicular to each other and are perpendicular to the bottom plate 111. The support ribs 114 support the bottom surface of the circuit board 20, and the hooks 115 abut against the top surface of the circuit board 20 to collectively fix the circuit board 20 to the bottom cover 11. Each side panel 112 also forms a card slot 117 below its step 118 near its end. A baffle 116 is vertically formed on the bottom plate 111 and connects the other two ends of the two side plates 112. The baffle 116 has a rectangular slot 119 formed in the top thereof.
該頂蓋12與該底蓋11類似，其也呈半封閉狀。頂蓋12包括一頂板121及設於該頂板121上的兩側板122。該頂板121與二側板122共同圍設出另一收容空間123。該頂板121大致呈矩形，其一側靠近二角落處分別設有二上下貫穿的扣孔124。該頂板121在其中部區域上還設有一通孔127，該通孔127貫穿該頂板121上下表面。該頂板121由該通孔127的外緣向該底蓋11方向凸伸一限位凸緣128。該限位凸緣128呈環狀。The top cover 12 is similar to the bottom cover 11, which is also semi-closed. The top cover 12 includes a top plate 121 and two side plates 122 disposed on the top plate 121. The top plate 121 and the two side plates 122 together define another receiving space 123. The top plate 121 is substantially rectangular, and two sides of the two sides are respectively provided with two upper and lower through holes 124. The top plate 121 further defines a through hole 127 in the middle portion thereof, and the through hole 127 extends through the upper and lower surfaces of the top plate 121. The top plate 121 protrudes from the outer edge of the through hole 127 toward the bottom cover 11 by a limiting flange 128. The limit flange 128 is annular.
該兩側板122由該頂板121正對的兩側分別向下延伸形成，該兩側板122的外側表面之間的距離略小於該底蓋11的兩側板112的內側表面之間的距離。每一側板122在靠近其一端的底部向下延伸一卡鉤125，該卡鉤125的鉤部朝外設置，以與該底蓋11的側板112上的卡槽117配合，從而將頂蓋12與底蓋11固定。The two side plates 122 are respectively formed by the opposite sides of the top plate 121 extending downward, and the distance between the outer side surfaces of the two side plates 122 is slightly smaller than the distance between the inner side surfaces of the side plates 112 of the bottom cover 11. Each side plate 122 extends downwardly from a bottom portion near one end thereof with a hook 125. The hook portion of the hook portion 125 is outwardly disposed to cooperate with the slot 117 of the side plate 112 of the bottom cover 11 to thereby cover the top cover 12 It is fixed to the bottom cover 11.
該殼體14包括一頂板141、由該頂板141向下延伸的兩側板142及結合於該頂板141上的一墊圈143。The housing 14 includes a top plate 141, two side plates 142 extending downward from the top plate 141, and a gasket 143 coupled to the top plate 141.
該頂板141大致呈矩形，其底面在靠近端部位置處分別向下凸伸二扣鉤144。這些扣鉤144分別與該頂蓋12的扣孔124配合從而將殼體14固定於頂蓋12上。該頂板141在其中部設有一通音孔147，該通音孔147貫穿該頂板141上下表面，並對準該頂蓋12的通孔127。該通音孔147呈圓形，其直徑遠小於該頂蓋12的通孔127的直徑。該頂板141於該通音孔147的週邊向該頂蓋12方向凸伸一定位凸緣148。該定位凸緣148呈圓環狀。The top plate 141 is substantially rectangular, and its bottom surface protrudes downwardly from the hook portion 144 at a position close to the end portion. The clasps 144 are respectively engaged with the button holes 124 of the top cover 12 to fix the housing 14 to the top cover 12. The top plate 141 is provided with a sound hole 147 at a middle portion thereof, and the sound hole 147 penetrates the upper and lower surfaces of the top plate 141 and is aligned with the through hole 127 of the top cover 12. The sound hole 147 has a circular shape and a diameter much smaller than the diameter of the through hole 127 of the top cover 12. A locating flange 148 protrudes from the top plate 141 in the direction of the top cover 12 at the periphery of the sound hole 147. The positioning flange 148 has an annular shape.
該墊圈143由彈性材料組成，如海綿、橡膠等。該墊圈143貼設於該頂板141上且位於該定位凸緣148內。該墊圈143也呈圓環狀，其內側周面圍設形成一空腔149。該墊圈143的外徑略小於該定位凸緣148的內徑，且該墊圈143的內徑即該空腔149的直徑遠大於該通音孔147的直徑。The gasket 143 is composed of an elastic material such as a sponge, a rubber or the like. The gasket 143 is attached to the top plate 141 and located within the positioning flange 148. The washer 143 is also annular, and a cavity 149 is formed around the inner peripheral surface thereof. The outer diameter of the washer 143 is slightly smaller than the inner diameter of the positioning flange 148, and the inner diameter of the washer 143, that is, the diameter of the cavity 149 is much larger than the diameter of the sound hole 147.
該兩側板142由該頂板141正對的兩側分別向下延伸形成，每一側板142的底端形成一外低內高的臺階146，該臺階146與該底蓋11的側板112上的臺階118配合，從而將殼體14定位在底蓋11上。The two side plates 142 are respectively formed by the opposite sides of the top plate 141 extending downwardly, and the bottom end of each of the side plates 142 forms an outer low inner height step 146, and the step 146 and the step on the side plate 112 of the bottom cover 11 The 118 cooperates to position the housing 14 on the bottom cover 11.
該麥克風30設於該電路板20的上表面。麥克風30底部向下凸伸出二引腳300，用於插設在電路板20的二穿孔21內，從而與電路板20電連接。本實施例中，該麥克風30為駐極體電容麥克風（Electret Condenser Microphone，ECM）。該麥克風30呈圓柱體狀，其外徑略小於該頂蓋12的通孔127的直徑，以收容在通孔127內。該麥克風30設有位於內部的一音腔31及位於頂部的一聲學孔37，該聲學孔37將該音腔31與外界連通，該聲學孔37與該音腔31於該麥克風30之內共同形成一第一亥姆霍茲（Helmholtz）共振腔38。該麥克風30上表面上貼設有一調音布39，該調音布39由不織布製成，其覆蓋於該聲學孔37上，以用於調節該麥克風30的Q值（品質因素）。The microphone 30 is provided on the upper surface of the circuit board 20. The bottom of the microphone 30 protrudes downwardly from the two pins 300 for insertion in the two through holes 21 of the circuit board 20 to be electrically connected to the circuit board 20. In this embodiment, the microphone 30 is an electret condenser microphone (ECM). The microphone 30 has a cylindrical shape with an outer diameter slightly smaller than the diameter of the through hole 127 of the top cover 12 to be received in the through hole 127. The microphone 30 is provided with a sound chamber 31 located inside and an acoustic hole 37 at the top. The acoustic hole 37 communicates the sound chamber 31 with the outside, and the acoustic hole 37 and the sound chamber 31 are common within the microphone 30. A first Helmholtz resonant cavity 38 is formed. A tuning cloth 39 is attached to the upper surface of the microphone 30. The tuning cloth 39 is made of a non-woven fabric and covers the acoustic hole 37 for adjusting the Q value (quality factor) of the microphone 30.
該二側蓋13分別設於殼體14的相對兩側。每一側蓋13包括一蓋板131及一從蓋板131內表面凸伸的凸塊132。二側蓋13固定於底蓋11、頂蓋12及殼體14上而使麥克風模組整體呈現出立方形。其中一側蓋13的蓋板131的內表面抵接底蓋11的底板111及擋板116的側面、頂蓋12的頂板121的側面以及殼體14的頂板141的側面，凸塊132收容於底蓋11的開槽119內而夾設於頂蓋12的頂板121與底蓋11的擋板116之間，並通過其內表面抵接於頂蓋12的限位凸緣128外側周面。另一側蓋13的蓋板131的內表面抵接底蓋11的底板111、頂蓋12的頂板121以及殼體14的頂板141的另外的相對側面，凸塊132抵接於頂蓋12的頂板121下表面並與限位凸緣128隔開距離。The two side covers 13 are respectively disposed on opposite sides of the housing 14 . Each side cover 13 includes a cover plate 131 and a protrusion 132 protruding from the inner surface of the cover plate 131. The two side covers 13 are fixed to the bottom cover 11, the top cover 12 and the housing 14 to make the microphone module as a whole. The inner surface of the cover 131 of the one side cover 13 abuts the bottom surface 111 of the bottom cover 11 and the side surface of the baffle 116, the side surface of the top plate 121 of the top cover 12, and the side surface of the top plate 141 of the housing 14. The bump 132 is received in The groove 119 of the bottom cover 11 is interposed between the top plate 121 of the top cover 12 and the baffle 116 of the bottom cover 11, and abuts against the outer circumferential surface of the limiting flange 128 of the top cover 12 through the inner surface thereof. The inner surface of the cover plate 131 of the other side cover 13 abuts against the bottom plate 111 of the bottom cover 11 , the top plate 121 of the top cover 12 , and the other opposite side surfaces of the top plate 141 of the housing 14 , and the bumps 132 abut against the top cover 12 . The lower surface of the top plate 121 is spaced apart from the limit flange 128.
上述麥克風模組中，該殼體14與該麥克風30之間設有內部形成有空腔149的墊圈143，從而充分利用該殼體14與該麥克風30之間的間隙，使該墊圈143內的空腔149與該殼體14的頂板141的通音孔147於該麥克風30之外共同形成第二亥姆霍茲共振腔50，有利於拓寬該麥克風模組的聲音頻帶及降低該麥克風模組的聲音的最低共振頻率，從而提升該麥克風模組的低頻回應效果。In the above microphone module, a gasket 143 having a cavity 149 formed therein is disposed between the casing 14 and the microphone 30, so as to fully utilize the gap between the casing 14 and the microphone 30, so that the gasket 143 is inside the gasket 143. The cavity 149 and the sound hole 147 of the top plate 141 of the casing 14 form a second Helmholtz resonant cavity 50 outside the microphone 30, which is beneficial to widening the sound frequency band of the microphone module and lowering the microphone module. The lowest resonant frequency of the sound, thereby enhancing the low frequency response of the microphone module.
請再參閱圖5，目前已知一個亥姆霍茲共振腔40的最低共振頻率符合下列公式：Referring again to Figure 5, it is known that the lowest resonant frequency of a Helmholtz resonator 40 conforms to the following formula:
其中f0為最低共振頻率，C為音速，S為管道41的截面積，l為管道41的長度，d為管道41的直徑，V為腔體42的體積。Where f 0 is the lowest resonance frequency, C is the speed of sound, S is the cross-sectional area of the duct 41, l is the length of the duct 41, d is the diameter of the duct 41, and V is the volume of the cavity 42.
顯然，f0越小(即共振腔的最低共振頻率越小)，亥姆霍茲共振腔40的低頻回應效果就更好。因此，本發明在第一亥姆霍茲共振腔38的基礎上再增加一個第二亥姆霍茲共振腔50，相當於增加公式中V的數值，從而使f0變小，進而獲得更低頻的回應。Obviously, the smaller the f 0 (ie, the smaller the lowest resonant frequency of the resonant cavity), the better the low frequency response of the Helmholtz resonant cavity 40. Therefore, the present invention adds a second Helmholtz resonant cavity 50 to the first Helmholtz resonant cavity 38, which is equivalent to increasing the value of V in the formula, thereby making f 0 smaller, thereby obtaining a lower frequency. Response.
然而，從上面公式可看出，除與V有關外，f0還與S、l及d均有關聯，其他參數的變化對f0所造成的影響並不一定弱於V對f0的影響，對應到本發明當中具體分析如下：However, as can be seen from the above formula, in addition to V, f 0 is also associated with S, l and d. The influence of other parameters on f 0 is not necessarily weaker than the effect of V on f 0 . Corresponding to the specific analysis of the present invention is as follows:
首先定義墊圈143的空腔149體積為V1，第一亥姆霍茲共振腔38的體積為V，空腔149的高度為h，直徑為D，通音孔147的截面積為S，通音孔147的深度為l，通音孔147的直徑為d。First, the volume of the cavity 149 of the gasket 143 is defined as V1, the volume of the first Helmholtz resonator 38 is V, the height of the cavity 149 is h, the diameter is D, and the cross-sectional area of the sound hole 147 is S, the sound is continuous. The depth of the hole 147 is 1, and the diameter of the sound hole 147 is d.
在極端情況下，將墊圈143的內徑縮小，使空腔149的直徑與通音孔147的直徑相等(即使D=d)，此時墊圈的空腔149與通音孔147連通而共同相當於圖5中的管道41，此時整個麥克風模組的共振腔的腔體體積即為第一亥姆霍茲共振腔38的體積，在此種情況下共振腔的最低共振頻率f1為：In the extreme case, the inner diameter of the washer 143 is reduced so that the diameter of the cavity 149 is equal to the diameter of the sound hole 147 (even if D = d), at which time the cavity 149 of the washer communicates with the sound hole 147 to be equivalent In the duct 41 in FIG. 5, the cavity volume of the resonant cavity of the entire microphone module is the volume of the first Helmholtz resonant cavity 38. In this case, the lowest resonant frequency f 1 of the resonant cavity is:
在其他情況下，墊圈143的空腔149的直徑要大於通音孔147的直徑(即D>d)，此時墊圈143的空腔149相當於第二亥姆霍茲共振腔50的腔體，其體積為V1。此時整個麥克風模組的共振腔的腔體體積即為第一亥姆霍茲共振腔38的體積與空腔149的體積之和V+V1，此種情況下共振腔的最低共振頻率f2為：In other cases, the diameter of the cavity 149 of the washer 143 is greater than the diameter of the sound hole 147 (i.e., D > d), at which time the cavity 149 of the washer 143 corresponds to the cavity of the second Helmholtz cavity 50. Its volume is V 1 . At this time, the cavity volume of the resonant cavity of the entire microphone module is the sum of the volume of the first Helmholtz resonant cavity 38 and the volume of the cavity 149 V + V 1 , in which case the lowest resonant frequency of the resonant cavity f 2 is:
為達到f2<f1的結果，(l+0.8d)(V+V1)必須要大於(l+h+0.8d)V，即：To achieve the result of f 2 <f 1 , (l+0.8d)(V+V 1 ) must be greater than (l+h+0.8d)V, ie:
> >
推導，得：Derivation, get:
可見，空腔149與第一亥姆霍茲共振腔38的體積比必須大於h/(l+0.8d)才能獲得比上述極端情況下更低的頻率回應。It can be seen that the volume ratio of the cavity 149 to the first Helmholtz resonator 38 must be greater than h/(l+0.8d) to achieve a lower frequency response than in the extreme case described above.
對應到具體的實際應用，通音孔147的直徑d與深度l大致相當，而墊圈143的高度受限於外殼10的尺寸，通常為通音孔147深度l的1~2倍左右(為方便討論，在此設定h=l.3l)，將這些比例關係代入上式，得V1/V>0.7。因此，可以看出空腔149的體積必須至少要大於第一亥姆霍茲共振腔38的體積的0.7倍，才能獲得比上述極端情況更小的最低共振頻率(即f2<f1)。否則，如果V1/V<0.7，就應當直接將墊圈143的空腔149的直徑D設為與通音孔147的直徑d相等，獲得更小的最低共振頻率(f1<f2)。Corresponding to a specific practical application, the diameter d of the sound hole 147 is substantially equivalent to the depth l, and the height of the washer 143 is limited by the size of the outer casing 10, which is usually about 1 to 2 times the depth l of the sound hole 147 (for convenience) In the discussion, h=l.3l) is set here, and these proportional relationships are substituted into the above equation to obtain V 1 /V>0.7. Therefore, it can be seen that the volume of the cavity 149 must be at least 0.7 times larger than the volume of the first Helmholtz resonator 38 in order to obtain a minimum resonance frequency (i.e., f 2 <f 1 ) which is smaller than the above extreme case. Otherwise, if V 1 /V < 0.7, the diameter D of the cavity 149 of the gasket 143 should be directly set equal to the diameter d of the sound hole 147 to obtain a smaller minimum resonance frequency (f 1 <f 2 ).
此外，由於墊圈143的空腔149為圓柱形，因此空腔149的體積V1滿足公式。將V1代入中，得Further, since the cavity 149 of the gasket 143 is cylindrical, the volume V 1 of the cavity 149 satisfies the formula . Substituting V 1 In,
即是說，D的取值要麼等於d，要麼大於(也可等於)。如果D位於d與之間將不能獲得最小的最低共振頻率。That is to say, the value of D is equal to d or greater than (may also equal ). If D is at d and The minimum minimum resonance frequency will not be obtained between.
更進一步地，如果已經滿足，空腔149的體積越大，則所能獲得的最低共振頻率就越小。因此，可以通過增大空腔149體積的方法來實現更低頻回應的效果。Further, if it has been met The larger the volume of the cavity 149, the smaller the lowest resonant frequency that can be obtained. Therefore, the effect of the lower frequency response can be achieved by increasing the volume of the cavity 149.
請參閱圖6，示出了本發明第二實施例的麥克風模組，其與第一實施例的區別在於墊圈143a的形狀有所不同。該第二實施例的墊圈143a的內側周面上進一步開設一與空腔149a連通的溝槽140a。該溝槽140a呈環形，其直徑自下至上逐漸增大。該溝槽140a的內表面為弧形。加入溝槽140a之後，整個墊圈143a所圍設的腔體的體積增大，因此可使麥克風模組獲得更佳的低頻回應效果。Referring to Fig. 6, there is shown a microphone module of a second embodiment of the present invention which differs from the first embodiment in the shape of the washer 143a. Further, a groove 140a communicating with the cavity 149a is further formed on the inner circumferential surface of the gasket 143a of the second embodiment. The groove 140a is annular and its diameter gradually increases from bottom to top. The inner surface of the groove 140a is curved. After the addition of the groove 140a, the volume of the cavity surrounded by the entire gasket 143a is increased, so that the microphone module can obtain a better low frequency response.
請參閱圖7，示出了本發明第三實施例的麥克風模組，其與第二實施例的區別在於墊圈143b溝槽140b結構不同。該第三實施例的墊圈143b的溝槽140b的直徑為自下至上逐漸減小。該溝槽140b的內表面也為弧面。該溝槽140b也與空腔149b連通。Referring to FIG. 7, a microphone module according to a third embodiment of the present invention is shown, which differs from the second embodiment in that the gasket 143b is different in structure from the groove 140b. The diameter of the groove 140b of the gasket 143b of the third embodiment is gradually reduced from the bottom to the top. The inner surface of the groove 140b is also a curved surface. The groove 140b is also in communication with the cavity 149b.
請參閱圖8，示出了本發明第四實施例的麥克風模組，其與第三實施例的區別也在於墊圈143c的溝槽140c結構不同。該第四實施例的墊圈143c的溝槽140c的直徑為自下至上先增大再減小。該溝槽140c的內表面也為弧面。該溝槽也與空腔149c連通。Referring to FIG. 8, a microphone module according to a fourth embodiment of the present invention is shown, which differs from the third embodiment in that the groove 140c of the washer 143c is different in structure. The diameter of the groove 140c of the gasket 143c of the fourth embodiment is increased from the bottom to the top and then decreased. The inner surface of the groove 140c is also a curved surface. The groove is also in communication with the cavity 149c.
綜上所述，本發明符合發明專利要件，爰依法提出專利申請。惟，以上所述者僅為本發明之較佳實施例，舉凡熟悉本案技藝之人士，在爰依本發明精神所作之等效修飾或變化，皆應涵蓋於以下之申請專利範圍內。In summary, the present invention complies with the requirements of the invention patent and submits a patent application according to law. The above description is only the preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art will be included in the following claims.
10．．．外殼10. . . shell
11．．．底蓋11. . . Bottom cover
111．．．底板111. . . Bottom plate
112、122、142．．．側板112, 122, 142. . . Side panel
113、123．．．收容空間113, 123. . . Containing space
114．．．支撐肋114. . . Support rib
115、144．．．扣鉤115, 144. . . Buckle
116．．．擋板116. . . Baffle
117．．．卡槽117. . . Card slot
118、146．．．臺階118, 146. . . Step
119．．．開槽119. . . Slotting
12．．．頂蓋12. . . Top cover
121、141．．．頂板121, 141. . . roof
124．．．扣孔124. . . Buckle hole
125．．．卡鉤125. . . Hook
127．．．通孔127. . . Through hole
128．．．限位凸緣128. . . Limit flange
13．．．側蓋13. . . Side cover
131．．．蓋板131. . . Cover
132．．．凸塊132. . . Bump
14．．．殼體14. . . case
140a、140b、140c．．．溝槽140a, 140b, 140c. . . Trench
143、143a、143b、413c．．．墊圈143, 143a, 143b, 413c. . . washer
147．．．通音孔147. . . Sound hole
148．．．定位凸緣148. . . Positioning flange
149、149a、149b、149c．．．空腔149, 149a, 149b, 149c. . . Cavity
20．．．電路板20. . . Circuit board
21．．．穿孔twenty one. . . perforation
30．．．麥克風30. . . microphone
300．．．引腳300. . . Pin
31．．．音腔31. . . Sound chamber
37．．．聲學孔37. . . Acoustic hole
38．．．第一亥姆霍茲共振腔38. . . First Helmholtz resonator
39．．．調音布39. . . Tuning cloth
40．．．亥姆霍茲共振腔40. . . Helmholtz resonator
41．．．管道41. . . pipeline
42．．．腔體42. . . Cavity
50．．．第二亥姆霍茲共振腔50. . . Second Helmholtz cavity
圖1為本發明第一實施例的麥克風模組的立體組裝圖。1 is a perspective assembled view of a microphone module according to a first embodiment of the present invention.
圖2為圖1所示麥克風模組的立體分解圖。2 is an exploded perspective view of the microphone module shown in FIG. 1.
圖3為圖1所示麥克風模組的另一視角的立體分解圖。3 is an exploded perspective view of another perspective view of the microphone module shown in FIG. 1.
圖4為圖1所示麥克風模組沿IV-IV線的剖面圖。4 is a cross-sectional view of the microphone module of FIG. 1 taken along line IV-IV.
圖5為一個亥姆霍茲共振腔的示意圖。Figure 5 is a schematic illustration of a Helmholtz resonator.
圖6為本發明第二實施例的麥克風模組的剖面圖。Figure 6 is a cross-sectional view showing a microphone module in accordance with a second embodiment of the present invention.
圖7為本發明第三實施例的麥克風模組的剖面圖。Figure 7 is a cross-sectional view showing a microphone module in accordance with a third embodiment of the present invention.
圖8為本發明第四實施例的麥克風模組的剖面圖。Figure 8 is a cross-sectional view showing a microphone module in accordance with a fourth embodiment of the present invention.
111．．．底板111. . . Bottom plate
113．．．收容空間113. . . Containing space
121．．．頂板121. . . roof
123．．．收容空間123. . . Containing space
128．．．限位凸緣128. . . Limit flange
132．．．凸塊132. . . Bump
141．．．頂板141. . . roof
147．．．通音孔147. . . Sound hole
149．．．空腔149. . . Cavity
31．．．音腔31. . . Sound chamber
37．．．聲學孔37. . . Acoustic hole
38．．．第一亥姆霍茲共振腔38. . . First Helmholtz resonator
39．．．調音布39. . . Tuning cloth
50．．．第二亥姆霍茲共振腔50. . . Second Helmholtz cavity
Claims (10)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201210133519 CN103384355A (en) | 2012-05-03 | 2012-05-03 | Microphone module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW201347567A true TW201347567A (en) | 2013-11-16 |
Family
ID=49492038
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW101117182A TW201347567A (en) | 2012-05-03 | 2012-05-15 | Microphone assembly |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN103384355A (en) |
| TW (1) | TW201347567A (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109218862B (en) * | 2018-08-31 | 2019-12-24 | 合翔(常州)电子有限公司 | Electroacoustic element and production process thereof |
| CN110996200B (en) * | 2019-12-26 | 2021-05-28 | 重庆蓝岸通讯技术有限公司 | Electronic equipment MIC components |
| CN115209277B (en) * | 2021-04-09 | 2025-07-25 | 深圳市韶音科技有限公司 | Earphone |
| CN115209287B (en) | 2021-04-09 | 2025-03-07 | 深圳市韶音科技有限公司 | A headset |
-
2012
- 2012-05-03 CN CN 201210133519 patent/CN103384355A/en active Pending
- 2012-05-15 TW TW101117182A patent/TW201347567A/en unknown
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| CN103384355A (en) | 2013-11-06 |
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