TW201345364A - 電子裝置殼體及其製造方法 - Google Patents
電子裝置殼體及其製造方法 Download PDFInfo
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- 238000000034 method Methods 0.000 title abstract 3
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- 238000001746 injection moulding Methods 0.000 claims description 7
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- 239000004033 plastic Substances 0.000 claims description 4
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- 239000004734 Polyphenylene sulfide Substances 0.000 claims description 3
- XECAHXYUAAWDEL-UHFFFAOYSA-N acrylonitrile butadiene styrene Chemical compound C=CC=C.C=CC#N.C=CC1=CC=CC=C1 XECAHXYUAAWDEL-UHFFFAOYSA-N 0.000 claims description 3
- 229920003229 poly(methyl methacrylate) Polymers 0.000 claims description 3
- 229920001707 polybutylene terephthalate Polymers 0.000 claims description 3
- 239000004926 polymethyl methacrylate Substances 0.000 claims description 3
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14336—Coating a portion of the article, e.g. the edge of the article
- B29C45/14344—Moulding in or through a hole in the article, e.g. outsert moulding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/0053—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor combined with a final operation, e.g. shaping
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0217—Mechanical details of casings
- H05K5/0243—Mechanical details of casings for decorative purposes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/0053—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor combined with a final operation, e.g. shaping
- B29C2045/0079—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor combined with a final operation, e.g. shaping applying a coating or covering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
- B29L2031/3481—Housings or casings incorporating or embedding electric or electronic elements
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
- Y10T428/12556—Organic component
- Y10T428/12569—Synthetic resin
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24851—Intermediate layer is discontinuous or differential
- Y10T428/24868—Translucent outer layer
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Casings For Electric Apparatus (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
一種電子裝置殼體，包括基體及設置於該基體上之圖案部，該基體上開設有通孔，該圖案部由透明之熱塑性塑膠注塑於該通孔內製成，該電子裝置殼體還包括裝飾膜，該裝飾膜通過物理氣相沉積之方法沉積於該基體及該圖案部之表面。本發明還提供一種上述電子裝置殼體之製造方法。
Description
本發明涉及一種電子裝置殼體及一種該電子裝置殼體之製造方法。
隨著移動通信技術之發展，各種電子裝置如移動電話及平板電腦等競相湧現，令消費者可隨時地享受移動技術帶來之種種便利，而這些電子裝置之外觀也越來越受到人們之關注與重視。
為了使電子裝置之外觀變之更美觀，習知之一種電子裝置殼體包括一基體及一設於基體上起裝飾作用之裝飾片，所述裝飾片通過膠水黏接於基體上。然而，採用膠水黏接之方式將裝飾片裝設於基體上，在跌落實驗中裝飾片很容易從基體上脫落。
有鑒於此，有必要提供一種裝飾片不易從基體上脫落之電子裝置殼體。
此外，還有必要提供一種製造上述電子裝置殼體之製造方法。
一種電子裝置殼體，包括基體及設置於該基體上之圖案部，該基體上開設有通孔，該圖案部由透明之熱塑性塑膠注塑於該通孔內製成，該電子裝置殼體還包括裝飾膜，該裝飾膜通過物理氣相沉積之方法沉積於該基體及該圖案部之表面。
一種電子裝置殼體之製造方法，包括以下步驟：
提供一金屬基體，在該基體上衝壓形成一通孔；
提供一注塑模具，該注塑模具包括一模腔，將上述金屬基體置於該模腔內，並向該模腔內注入熔融之透明之熱塑性塑膠，所述熔融之透明之熱塑性塑膠填充該通孔，冷卻凝固後形成一圖案部；
提供一物理氣相沉積鍍膜機，將具有圖案部之上述金屬基體置於物理氣相沉積鍍膜機內以在金屬基體及圖案部之表面上沉積一層裝飾膜。
上述電子裝置殼體中圖案部注塑於金屬基體10之通孔內，在注塑之過程中圖案部與金屬基體之間形成一熱結合力，使得注塑後之圖案部穩定地容置於通孔內。
請參閱圖1及圖2，本發明較佳實施例之電子裝置殼體100包括一金屬基體10、一設置於金屬基體10上之圖案部20，及一沉積於金屬基體10表面之裝飾膜30。金屬基體10上開設有一通孔12，圖案部20容置於通孔12內。圖案部20可為用以起標示作用之圖案、文字、商標等，圖案部20由透明之熱塑性塑膠注塑於通孔12內製得。裝飾膜30用以增強金屬基體10表面之耐酸堿和耐刮擦能力同時用以裝飾金屬基體10之表面。
圖案部20由透明之熱塑性塑膠形成。該透明之熱塑性塑膠可為環氧樹脂、聚碳酸酯（PC）、丙烯睛-苯乙烯-丁二烯共聚合物(ABS)、聚甲基丙烯酸甲酯（PMMA）、聚苯硫醚（PPS）及聚對苯二甲酸丁二醇酯（PBT）等樹酯中之一種或幾種之組合，優選添加有顏料之環氧樹脂。
製造上述電子裝置殼體100時可參照如下步驟進行：
提供一金屬基體10，金屬基體10由耐高溫之金屬材質製成，如不銹鋼及鋁合金材質等。對金屬基體10進行衝壓，以在金屬基體10上形成通孔12，再將通孔12周圍之毛刺去除。
請一併參閱圖3，提供一注塑模具200，其包括一上模220、一下模240及一形成於上模220與下模240之間之模腔260，將金屬基體10置於模腔260內，並向模腔260內注入熔融之透明之熱塑性塑膠，所述熔融塑膠填充通孔12而形成一圖案部20。冷卻注塑模具200，開模並取出設有圖案部20之金屬基體10。再對金屬基體10之表面進行拋光及打磨作業。
提供一物理氣相沉積鍍膜機（Physical Vapor Deposition，PVD），將具有圖案部20之上述金屬基體10置於PVD鍍膜機內以在金屬基體10及圖案部20之表面鍍上一層裝飾膜30。
上述電子裝置殼體100中圖案部20注塑於金屬基體10之通孔12內，在注塑之過程中圖案部20與金屬基體10之間形成一熱結合力，使得注塑後之圖案部20穩定地容置於通孔12內。上述電子裝置殼體100中裝飾膜30覆蓋於具有顏色之圖案部20上，使得圖案部20呈現出雙色之立體效果。
另外，本領域技術人員還可在本發明權利要求公開之範圍和精神內做其他形式和細節上之各種修改、添加和替換。當然，這些依據本發明精神所做之各種修改、添加和替換等變化，都應包含在本發明所要求保護之範圍之內。
100．．．電子裝置殼體
10．．．金屬基體
20．．．圖案部
30．．．裝飾膜
12．．．通孔
200．．．注塑模具
220．．．上模
240．．．下模
260．．．模腔
圖1係本發明較佳實施方式電子裝置殼體之立體圖。
圖2係圖1所示電子裝置殼體沿II-II線之剖視圖。
圖3係圖2所示電子裝置殼體之製造過程示意圖。
100．．．電子裝置殼體
10．．．金屬基體
20．．．圖案部
30．．．裝飾膜
12．．．通孔
Claims (10)
- 一種電子裝置殼體，包括基體及設置於該基體上之圖案部，其改良在於：該基體上開設有通孔，該圖案部由透明之熱塑性塑膠注塑於該通孔內製成，該電子裝置殼體還包括裝飾膜，該裝飾膜通過物理氣相沉積之方法沉積於該基體及該圖案部之表面。
- 如申請專利範圍第1項所述之電子裝置殼體，其中該透明之熱塑性塑膠為環氧樹脂、聚碳酸酯、丙烯睛-苯乙烯-丁二烯共聚合物、聚甲基丙烯酸甲酯、聚苯硫醚及聚對苯二甲酸丁二醇酯樹酯中之一種或幾種之組合。
- 如申請專利範圍第2項所述之電子裝置殼體，其中該透明之熱塑性塑膠為環氧樹脂。
- 如申請專利範圍第3項所述之電子裝置殼體，其中該環氧樹脂中添加有顏料。
- 如申請專利範圍第1項所述之電子裝置殼體，其中該金屬基體由耐高溫之金屬材質製成。
- 如申請專利範圍第5項所述之電子裝置殼體，其中該金屬材質為鋁合金。
- 如申請專利範圍第5項所述之電子裝置殼體，其中該金屬材質為不銹鋼。
- 一種電子裝置殼體之製造方法，包括以下步驟：
提供一金屬基體，在該基體上衝壓形成一通孔；
提供一注塑模具，該注塑模具包括一模腔，將上述金屬基體置於該模腔內，並向該模腔內注入熔融之透明之熱塑性塑膠，所述熔融之透明之熱塑性塑膠填充該通孔，冷卻凝固後形成一圖案部；
提供一物理氣相沉積鍍膜機，將具有圖案部之上述金屬基體置於物理氣相沉積鍍膜機內以在金屬基體及圖案部之表面上沉積一層裝飾膜。 - 如申請專利範圍第8項所述之電子裝置殼體之製造方法，其中在該金屬基體衝壓後對該金屬基體進行去毛刺處理。
- 如申請專利範圍第8項所述之電子裝置殼體之製造方法，其中該圖案部形成後，對該金屬基體及圖案部之表面進行拋光及打磨處理。
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012101160530A CN103379753A (zh) | 2012-04-19 | 2012-04-19 | 电子装置壳体及其制造方法 |
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|---|---|
| TW201345364A true TW201345364A (zh) | 2013-11-01 |
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| Country | Link |
|---|---|
| US (1) | US20130280550A1 (zh) |
| CN (1) | CN103379753A (zh) |
| TW (1) | TW201345364A (zh) |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104400960B (zh) * | 2014-12-15 | 2017-03-22 | 联想(北京)有限公司 | 一种喷涂颜色的方法 |
| EP3354452A4 (en) * | 2015-10-26 | 2018-11-21 | Huawei Technologies Co., Ltd. | Appearance structural member and appearance structural member manufacturing method |
| CN105818321A (zh) * | 2015-10-30 | 2016-08-03 | 维沃移动通信有限公司 | 一种金属结构件的制备方法及金属结构件 |
| CN106560316A (zh) * | 2016-05-26 | 2017-04-12 | 上海力桥自动化技术有限公司 | 一种外壳件抛光前的处理方法 |
| CN106102372B (zh) * | 2016-06-27 | 2019-06-28 | Oppo广东移动通信有限公司 | 一种壳体的净空区域的加工方法、壳体和移动终端 |
| WO2018028486A1 (en) | 2016-08-08 | 2018-02-15 | Guangdong Oppo Mobile Telecommunications Corp., Ltd. | Housing, method for manufacturing housing, and mobile terminal having housing |
| WO2018028372A1 (en) * | 2016-08-08 | 2018-02-15 | Guangdong Oppo Mobile Telecommunications Corp., Ltd. | Housing, method for manufacturing housing, and mobile terminal having housing |
| US10284696B2 (en) * | 2016-09-08 | 2019-05-07 | Guangdong Oppo Mobile Telecommunications Corp., Ltd. | Shell, method for manufacturing the same and mobile terminal having the same |
| CN106572212B (zh) * | 2016-09-08 | 2020-04-14 | Oppo广东移动通信有限公司 | 壳体、壳体制作方法及移动终端 |
| CN106738621B (zh) * | 2016-12-30 | 2019-11-05 | 江苏一开电力科技有限公司 | 壳体及其制备方法、电子装置 |
| CN107517551A (zh) | 2017-07-21 | 2017-12-26 | 广东欧珀移动通信有限公司 | 后盖的制造方法、后盖及电子装置 |
| CN107231774B (zh) * | 2017-07-31 | 2022-10-25 | Oppo广东移动通信有限公司 | 电子装置外壳、电子装置及电子装置外壳加工方法 |
| US10667426B2 (en) * | 2018-09-25 | 2020-05-26 | Apple Inc. | Housing construction |
| TW202236929A (zh) * | 2021-03-05 | 2022-09-16 | 微星科技股份有限公司 | 電子裝置機殼及其製造方法 |
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| US5989480A (en) * | 1996-01-31 | 1999-11-23 | Nissha Printing Co., Ltd. | Apparatus for molding patterned product and method of molding patterned product |
| CN1874656B (zh) * | 2005-06-03 | 2011-07-27 | 深圳富泰宏精密工业有限公司 | 便携式电子装置外壳及制作方法 |
| CN102069672B (zh) * | 2009-11-20 | 2013-12-25 | 深圳富泰宏精密工业有限公司 | 装饰性外壳的制作方法 |
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2012
- 2012-04-19 CN CN2012101160530A patent/CN103379753A/zh active Pending
- 2012-04-26 TW TW101115013A patent/TW201345364A/zh unknown
- 2012-09-27 US US13/628,482 patent/US20130280550A1/en not_active Abandoned
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| Publication number | Publication date |
|---|---|
| CN103379753A (zh) | 2013-10-30 |
| US20130280550A1 (en) | 2013-10-24 |
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