TW201318499A - Fixed machine for multilayer printed circuit board and fixing method thereof - Google Patents
Fixed machine for multilayer printed circuit board and fixing method thereof Download PDFInfo
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- 238000000034 method Methods 0.000 title claims abstract description 20
- 238000003825 pressing Methods 0.000 claims abstract description 102
- 230000007246 mechanism Effects 0.000 claims abstract description 23
- 238000002788 crimping Methods 0.000 claims description 5
- 230000008569 process Effects 0.000 abstract description 8
- 230000037303 wrinkles Effects 0.000 description 9
- 230000000694 effects Effects 0.000 description 6
- 238000012545 processing Methods 0.000 description 4
- 230000007812 deficiency Effects 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000011120 plywood Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 238000012552 review Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 230000032258 transport Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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Abstract
本發明為一種多層印刷電路板之固定機器及其固定方法，該固定機器包括機台以及固定機構，該固定機構設置於該機台內，包括第一壓著件以及至少兩第二壓著件，分別供壓合於一預定多層印刷電路板。而該固定方法包括透過該第一壓著件壓合於該多層印刷電路板中央處；以及透過該第一壓著件以及該等第二壓著件壓合於該多層印刷電路板中央及四周處。俾藉由本發明前述兩段式多層印刷電路板固定機器及其固定方法，本發明可以平整的壓合多層印刷電路板以進行各式鉚合加工。The invention relates to a fixing machine for a multilayer printed circuit board and a fixing method thereof, the fixing machine comprising a machine table and a fixing mechanism, wherein the fixing mechanism is disposed in the machine table, comprising a first pressing member and at least two second pressing members , respectively, for press-bonding to a predetermined multilayer printed circuit board. And the fixing method comprises: pressing the first pressing member to the center of the multilayer printed circuit board; and pressing the first pressing member and the second pressing member to be pressed in the center and the periphery of the multilayer printed circuit board; At the office. With the two-stage multilayer printed circuit board fixing machine and the fixing method thereof according to the present invention, the present invention can flat-press a multilayer printed circuit board for various riveting processes.
Description
本發明係一種多層印刷電路板之固定機器及其固定方法，尤指一種兩段式多層印刷電路板之固定機器及其固定方法。The invention relates to a fixing machine for a multilayer printed circuit board and a fixing method thereof, in particular to a fixing machine for a two-stage multilayer printed circuit board and a fixing method thereof.
隨著電子裝置產品的日漸輕、薄、短、小以及電子元件集積化之電路容量的增大，印刷電路板(Printed Circuit Board；PCB)作成三層以上之多層電路板逐漸的成為趨勢，而為了使得印刷電路板間能夠互相組合為一體，多層化印刷電路板一般是由兩面印刷電路板相黏而成。As the electronic device products become lighter, thinner, shorter, smaller, and the circuit capacity of electronic components is increased, a printed circuit board (PCB) is gradually becoming a multilayer circuit board with three or more layers. In order to enable the printed circuit boards to be integrated with each other, the multilayer printed circuit board is generally formed by bonding two-sided printed circuit boards.
為了將多層印刷電路板互相組合為一體，則需要一多層印刷電路板鉚合加工機台才可以完成，該種加工機台可以將多層印刷電路板進行結合，一般而言，目前鉚合多層印刷電路板的技術可以分為釘牢、焊接或是電磁加熱黏合等方法。In order to integrate the multilayer printed circuit boards into one body, a multi-layer printed circuit board riveting processing machine is required, and the processing machine can combine the multilayer printed circuit boards. Generally, the current multi-layered printed circuit boards are riveted. The technology of printed circuit boards can be divided into nailing, welding or electromagnetic heating bonding.
不論是哪種結合方法，在進行結合程序之前，都需要將多層印刷電路板疊置整齊才可以進行加工，現有的多層印刷電路板鉚合加工機台都包括有一加壓機構，當該多層印刷電路板輸送到機台內時，多層印刷電路板即藉由該加壓機構壓著以進行鉚合固定，藉以作為結合程序前的準備工作。Regardless of the bonding method, before the bonding process, the multilayer printed circuit boards need to be stacked neatly before processing, and the existing multilayer printed circuit board riveting processing machine includes a pressing mechanism when the multi-layer printing When the circuit board is transported into the machine table, the multi-layer printed circuit board is pressed by the pressing mechanism to perform riveting and fixing, thereby preparing for the assembly process.
然，現有的多層印刷電路板為包含有預定數目電路影像之內層與隔離層混合物所組成之多層薄膜，當固定時，多層印刷電路板中各印刷電路板不同各層互相連接所需的機械精準度即相當要求，因此，當加壓機構進行壓合固定時，若不能平整的壓合固定各層印刷電路板，則有可能因為各層印刷電路板皺摺的產生進一步造成良率不佳的問題。However, the existing multilayer printed circuit board is a multilayer film composed of a mixture of an inner layer and a separation layer containing a predetermined number of circuit images. When fixed, the mechanical precision required for connecting different layers of the printed circuit boards in the multilayer printed circuit board is fixed. The degree is quite required. Therefore, when the pressurizing mechanism is pressed and fixed, if the printed circuit boards of the respective layers are not pressed and fixed flatly, there is a possibility that the occurrence of wrinkles of the printed circuit boards of the respective layers further causes a problem of poor yield.
是以，要如何解決上述習用之問題與缺失，即為本發明之發明人與從事此行業之相關廠商所亟欲研究改善之方向所在者。Therefore, how to solve the above problems and deficiencies in the above-mentioned applications, that is, the inventors of the present invention and those involved in the industry are eager to study the direction of improvement.
故，本發明之發明人有鑑於上述缺失，乃搜集相關資料，經由多方評估及考量，並以從事於此行業累積之多年經驗，經由不斷試作及修改，始設計出此種兩段式多層印刷電路板之固定機器及其固定方法發明專利者。Therefore, in view of the above-mentioned deficiencies, the inventors of the present invention have collected relevant materials, and through multi-party evaluation and consideration, and through years of experience accumulated in the industry, through continuous trial and modification, the two-stage multi-layer printing has been designed. The invention relates to a fixed machine for a circuit board and a fixing method thereof.
本發明之第一目的在於提供一種兩段式多層印刷電路板固定機器。A first object of the present invention is to provide a two-stage multilayer printed circuit board fixing machine.
為了達到上述之目的，該固定機器包括機台以及固定機構。該固定機構，設置於該機台內，包括：第一壓著件，供壓合於一預定多層印刷電路板；以及至少兩第二壓著件，供壓合於該預定多層印刷電路板；其中，該第一壓著件具有第一位置與第二位置，於壓合之前的第一位置時，該第一壓著件係凸出於該等第二壓著件，於壓合期間的第二位置時，該第一壓著件係平行於該等第二壓著件。In order to achieve the above object, the stationary machine includes a machine table and a fixing mechanism. The fixing mechanism is disposed in the machine, and includes: a first pressing member for pressing on a predetermined multilayer printed circuit board; and at least two second pressing members for pressing against the predetermined multilayer printed circuit board; Wherein the first pressing member has a first position and a second position, and the first pressing member protrudes from the second pressing member during the first position before pressing, during the pressing In the second position, the first crimping member is parallel to the second crimping members.
由於本發明多層印刷電路板固定機器之第一壓著件具有第一位置與第二位置，於壓合之前的第一位置時，該第一壓著件係凸出於該等第二壓著件，藉此，當壓合多層印刷電路板時，該第一壓著件會先壓合到多層印刷電路板；於壓合期間的第二位置時，該第一壓著件係平行於該等第二壓著件，藉此，當壓合多層印刷電路板期間，可以藉由該第一壓著件與該等第二壓著件完整的壓合多層印刷電路板。故，本發明可以平整的壓合多層印刷電路板以進行各式鉚合加工，可以減少多層印刷電路板的皺摺、提升良率，進一步達到降低成本之效果。Since the first pressing member of the multilayer printed circuit board fixing machine of the present invention has a first position and a second position, the first pressing member protrudes from the second pressing position in the first position before the pressing Thereby, when the multilayer printed circuit board is pressed, the first pressing member is first pressed to the multilayer printed circuit board; when in the second position during the pressing, the first pressing member is parallel to the The second pressing member is used, whereby the multilayer pressing circuit board can be completely pressed by the first pressing member and the second pressing members during the pressing of the multilayer printed circuit board. Therefore, the present invention can flatten the multilayer printed circuit board to perform various riveting processes, can reduce the wrinkles of the multilayer printed circuit board, improve the yield, and further achieve the effect of reducing the cost.
本發明之第二目的在於提供一種利用前述多層印刷電路板之固定機器的固定方法，包括下列步驟：透過該第一壓著件壓合於該多層印刷電路板中央處；以及透過該第一壓著件以及該等第二壓著件壓合於該多層印刷電路板中央及四周處。A second object of the present invention is to provide a fixing method for a fixing machine using the foregoing multilayer printed circuit board, comprising the steps of: pressing the first pressing member against the center of the multilayer printed circuit board; and transmitting the first pressure The workpiece and the second crimping members are pressed against the center and the periphery of the multilayer printed circuit board.
由於本發明多層印刷電路板固定方法係先透過該第一壓著件壓合於該多層印刷電路板中央處，藉此，可以將多層印刷電路板中央皺摺處推向多層印刷電路板四周，再透過該第一壓著件以及該等第二壓著件壓合於該多層印刷電路板中央及四周處，藉此，可以將多層印刷電路板四周皺摺處推向側緣，故，本發明可以平整的壓合多層印刷電路板以進行各式鉚合加工，確實可以減少多層印刷電路板的皺摺。Since the method for fixing a multilayer printed circuit board of the present invention is first pressed through the first pressing member at the center of the multilayer printed circuit board, the central wrinkle of the multilayer printed circuit board can be pushed around the multilayer printed circuit board. And pressing the first pressing member and the second pressing members to be pressed at the center and the periphery of the multilayer printed circuit board, thereby pushing the wrinkles around the multilayer printed circuit board to the side edges, so The invention can flatten the laminated multilayer printed circuit board for various riveting processes, and can surely reduce the wrinkles of the multilayer printed circuit board.
為達成上述目的及功效，本發明所採用之技術手段及構造，茲繪圖就本發明較佳實施例詳加說明其特徵與功能如下，俾利完全了解。In order to achieve the above objects and effects, the technical means and the structure of the present invention will be described in detail with reference to the preferred embodiments of the present invention.
請參閱第一圖、第二圖、第三圖與第四圖所示，係為本發明較佳實施例之立體圖、立體透視圖、側視圖與局部示意圖。由圖中可清楚看出，本發明多層印刷電路板之固定機器，包括：Please refer to the first, second, third and fourth figures, which are perspective views, perspective views, side views and partial schematic views of a preferred embodiment of the invention. As is clear from the figure, the fixed machine of the multilayer printed circuit board of the present invention comprises:
機台1，該機台1可供一預定多層印刷電路板(圖中未示)進行預先固定及鉚合程序，由第一圖可看出，該機台1包括一作業區11以及兩操作台12，該操作台12分別設置於該作業區11兩側。該多層印刷電路板為習知包含有預定數目電路影像之內層與隔離層混合物所組成之多層薄膜，為所屬技術領域具有通常知識者可以瞭解，不再贅述。The machine table 1 can be pre-fixed and riveted by a predetermined multi-layer printed circuit board (not shown). As can be seen from the first figure, the machine table 1 includes a work area 11 and two operations. The table 12 is disposed on both sides of the work area 11 respectively. The multilayer printed circuit board is a multilayer film comprising a mixture of an inner layer and a spacer layer containing a predetermined number of circuit images, which will be understood by those of ordinary skill in the art and will not be described again.
而當進行多層印刷電路板預先固定及鉚合作業時，該機台1兩側之操作台12可分別配置有一操作人員，一側之操作人員可以將欲進行預先固定及鉚合作業之多層印刷電路板放置於該側操作台12上，操作台12即會將多層印刷電路板運輸至作業區11進行作業，當多層印刷電路板進行預先固定及鉚合完成後，該作業區11即將多層印刷電路板運輸至另一側之操作台12，另側操作台12之操作人員即可以將成品取出，並將欲進行預先固定及鉚合作業之多層印刷電路板放置於該側操作台12上，再進行相同作業流程。When the multi-layer printed circuit board is pre-fixed and riveted, the operating table 12 on both sides of the machine 1 can be respectively provided with an operator, and the operator on one side can perform multi-layer printing for pre-fixing and riveting. The circuit board is placed on the side console 12, and the operation panel 12 transports the multilayer printed circuit board to the work area 11 for work. When the multilayer printed circuit board is pre-fixed and riveted, the work area 11 is to be multi-layer printed. The circuit board is transported to the console 12 on the other side, and the operator of the other side console 12 can take out the finished product, and place a multilayer printed circuit board to be pre-fixed and riveted on the side console 12, Then carry out the same work flow.
藉由上述結構與流程，本發明可以節省作業台的配置，使得多層印刷電路板之預先固定及鉚合作業流程更順暢、快速，進一步達到降低成本之效果。With the above structure and flow, the present invention can save the configuration of the workbench, make the pre-fixation and riveting process of the multi-layer printed circuit board smoother and faster, and further achieve the effect of reducing the cost.
固定機構2，設置於該機台1內，由第二圖可看出，該固定機構2設置於該機台1作業區11之頂端位置，該固定機構2包括第一壓著件21以及至少兩第二壓著件22，供壓合於該多層印刷電路板，該第一壓著件21以及該等第二壓著件22分別包括彈性構件(圖中未示)，藉該彈性構件的設置，可以使得該第一壓著件21以及該等第二壓著件22上下進行彈性位移，以彈性壓合該多層印刷電路板。The fixing mechanism 2 is disposed in the machine table 1. As can be seen from the second figure, the fixing mechanism 2 is disposed at a top end position of the working area 11 of the machine table 1. The fixing mechanism 2 includes a first pressing member 21 and at least Two second pressing members 22 for pressing the multilayer printed circuit board, the first pressing member 21 and the second pressing members 22 respectively comprise an elastic member (not shown) by which the elastic member The first pressing member 21 and the second pressing members 22 are elastically displaced up and down to elastically press the multilayer printed circuit board.
其中，該第一壓著件21具有第一位置與第二位置，於壓合之前的第一位置時，該第一壓著件21係凸出於該等第二壓著件22，於壓合期間的第二位置時，該第一壓著件21係平行於該等第二壓著件22。於本實施例中，該第一壓著件21與該等第二壓著件22設置為圓盤態樣，該第二壓著件22的數量為四個，並且該第一壓著件21結合有一壓合板211，藉該壓合板211的設置，使得該第一壓著件21與該等第二壓著件22可以平整的壓合於多層印刷電路板。The first pressing member 21 has a first position and a second position. When the first pressing member 21 is in the first position before pressing, the first pressing member 21 protrudes from the second pressing member 22, and is pressed. The first pressing member 21 is parallel to the second pressing members 22 in the second position of the closing period. In this embodiment, the first pressing member 21 and the second pressing members 22 are disposed in a disk state, the number of the second pressing members 22 is four, and the first pressing member 21 is In combination with a pressure plate 211, the first pressing member 21 and the second pressing members 22 can be flatly pressed against the multilayer printed circuit board.
另外，請同時參閱第五圖所示，係為本發明較佳實施例之局部分解圖，由圖中可清楚看出，該機台1之操作台12包括有定位機構13，該定位機構13包括：基座131，該基座131固定於該作業區11；滑移塊132，該滑移塊132供於該基座131內滑移，開設有兩穿孔133，該滑移塊132設置有一第一磁性件135；定位柱134，該定位柱134固定設置於該滑移塊132，供定位該多層印刷電路板之側緣；第二磁性件136、137，該第二磁性件136、137分別設置於該基座131兩側壁；以及兩滑移柱138，分別設置於該基座131而貫穿該滑移塊132之兩穿孔133，該滑移塊132即藉由該兩滑移柱138進行限位滑移。In addition, please refer to FIG. 5, which is a partial exploded view of a preferred embodiment of the present invention. As can be clearly seen from the figure, the console 12 of the machine 1 includes a positioning mechanism 13, and the positioning mechanism 13 The base 131 is fixed to the working area 11 and the sliding block 132. The sliding block 132 is slidably disposed in the base 131, and two through holes 133 are defined. The sliding block 132 is provided with a hole 131. a first magnetic member 135; a positioning post 134 fixedly disposed on the sliding block 132 for positioning a side edge of the multilayer printed circuit board; a second magnetic member 136, 137, the second magnetic member 136, 137 The two sliding blocks 138 are respectively disposed on the two sidewalls of the base 131; and the two sliding columns 138 are respectively disposed on the base 131 and penetrate the two through holes 133 of the sliding block 132. The sliding block 132 is disposed by the two sliding columns 138. Perform limit slip.
其中，該穿孔133之數量不一定要設置為兩個，若設置為較多或較少也為可行的方案，只要能令該滑移塊132能於一預定軌道進行滑移即可，且該穿孔133可分別包括有軸承(圖中未示)，藉以乘載該兩滑移柱138。The number of the through holes 133 is not necessarily set to two. If it is set to be more or less, it is also feasible, as long as the sliding block 132 can be slipped on a predetermined track, and the The perforations 133 can each include a bearing (not shown) for carrying the two sliding columns 138.
另外，該滑移塊132藉由該第一磁性件135以及該第二磁性件136之間磁力的相斥或相吸而可滑移於該基座131內。於本實施例中，該第一磁性件135鄰近於第二磁性件136一端為N極，而該第二磁性件136即設置為N極；該第一磁性件135鄰近於第二磁性件137一端為S極，而該第二磁性件137即設置為S極，以達到相斥效果。相對應的，若該第一磁性件135鄰近於第二磁性件136一端為S極，而該第二磁性件136即設置為N極；該第一磁性件135鄰近於第二磁性件137一端為N極，而該第二磁性件137即設置為S極，以達到相吸效果，此方式也是一種可行的解決方案。In addition, the sliding block 132 can be slid into the base 131 by repulsive or attracting magnetic force between the first magnetic member 135 and the second magnetic member 136. In this embodiment, the first magnetic member 135 is adjacent to the second magnetic member 136 and has an N pole at one end, and the second magnetic member 136 is disposed as an N pole; the first magnetic member 135 is adjacent to the second magnetic member 137. One end is an S pole, and the second magnetic member 137 is set to an S pole to achieve a repulsive effect. Correspondingly, if the first magnetic member 135 is adjacent to the second magnetic member 136, the one end is the S pole, and the second magnetic member 136 is disposed as the N pole; the first magnetic member 135 is adjacent to the second magnetic member 137. It is an N pole, and the second magnetic member 137 is set to an S pole to achieve a phase suction effect, which is also a feasible solution.
當多層印刷電路板進行預先固定及鉚合作業前，操作人員會將欲進行預先固定作業之多層印刷電路板放置於該側操作台12上，而藉由該定位機構13限制多層印刷電路板的側緣，可以將多層印刷電路板定位於所需的位置，而由於該定位機構13之滑移塊132係藉由磁力而可滑移於該基座131內，當放置多層印刷電路板於操作台12時，還可以藉由該定位機構13來針對多層印刷電路板之位置進行微調，定位完成後，即可將多層印刷電路板運輸至作業區11進行預先固定及鉚合作業。Before the pre-fixation and riveting of the multilayer printed circuit board, the operator places the multilayer printed circuit board to be pre-fixed on the side console 12, and the positioning mechanism 13 limits the multilayer printed circuit board. The side edge can position the multilayer printed circuit board at a desired position, and since the sliding block 132 of the positioning mechanism 13 can be slid into the pedestal 131 by magnetic force, when the multilayer printed circuit board is placed for operation At the time of the stage 12, the position of the multilayer printed circuit board can also be finely adjusted by the positioning mechanism 13. After the positioning is completed, the multilayer printed circuit board can be transported to the work area 11 for pre-fixing and riveting.
請同時參閱第六圖、第七圖與第八圖所示，係為本發明較佳實施例之動作示意圖一、二與流程圖，由圖中可清楚看出，本發明之多層印刷電路板之固定方法，包括下列步驟：(110)透過該第一壓著件21壓合於該多層印刷電路板中央處；以及(120)透過該第一壓著件21以及該等第二壓著件22壓合於該多層印刷電路板中央及四周處。Please refer to the sixth, seventh and eighth figures, which are schematic diagrams of the first and second actions of the preferred embodiment of the present invention. The multilayer printed circuit board of the present invention can be clearly seen from the figure. The fixing method comprises the steps of: (110) pressing the first pressing member 21 to the center of the multilayer printed circuit board; and (120) transmitting the first pressing member 21 and the second pressing member 22 is pressed into the center and around the multilayer printed circuit board.
於步驟(110)中，當多層印刷電路板於機台1作業區11進行預先固定作業時，由於該第一壓著件21具有第一位置與第二位置，於壓合之前的第一位置時，該第一壓著件21係凸出於該等第二壓著件22，故先透過該第一壓著件21壓合於該多層印刷電路板中央處，藉此動作，可以將多層印刷電路板多餘的皺褶先行推擠到多層印刷電路板四周。In the step (110), when the multilayer printed circuit board is pre-fixed in the working area 11 of the machine table 1, since the first pressing member 21 has the first position and the second position, the first position before the pressing When the first pressing member 21 protrudes from the second pressing member 22, the first pressing member 21 is first pressed to the center of the multilayer printed circuit board, thereby performing multiple layers. Excess wrinkles on the printed circuit board are pushed around the multilayer printed circuit board.
而於步驟(120)中，於壓合期間的第二位置時，該第一壓著件21係平行於該等第二壓著件22，再透過該第一壓著件21以及該等第二壓著件22壓合於該多層印刷電路板中央及四周處，如此，即可以將由多層印刷電路板中央處推擠到四週之皺摺藉由第二壓著件22推向側緣處，俾藉由前述兩段式壓合固定步驟，本發明可以平整的壓合多層印刷電路板以進行結合作業等各式鉚合加工。In the step (120), in the second position during the pressing, the first pressing member 21 is parallel to the second pressing members 22, and then passes through the first pressing member 21 and the first portion. The pressing member 22 is pressed against the center and the periphery of the multilayer printed circuit board, so that the wrinkles pushed from the center of the multilayer printed circuit board to the periphery can be pushed to the side edges by the second pressing member 22, By the above two-stage press-fitting fixing step, the present invention can flat-press a multi-layer printed circuit board to perform various riveting processes such as bonding work.
其中，該第一壓著件21與該等第二壓著件22透過一彈性構件來彈性壓合該多層印刷電路板，而壓合方式可為該固定機構2下降以壓合多層印刷電路板或是該作業區11上升以壓合該多層印刷電路板，兩種都為可行的方案，本發明並不限制壓合方式。The first pressing member 21 and the second pressing members 22 are elastically pressed against the multilayer printed circuit board through an elastic member, and the pressing manner can be that the fixing mechanism 2 is lowered to press the multilayer printed circuit board. Or the working area 11 is raised to press the multilayer printed circuit board, both of which are feasible solutions, and the present invention does not limit the pressing mode.
請參閱全部附圖所示，相較於習用技術，本發明具有以下優點：Referring to the drawings, the present invention has the following advantages over conventional techniques:
本發明透過該第一壓著件21以及該等第二壓著件22之兩段式壓合多層印刷電路板，藉此，係先透過該第一壓著件21將多層印刷電路板中央處之皺摺先行推擠到多層印刷電路板四周，再透過該第一壓著件21以及該等第二壓著件22壓合於該多層印刷電路板中央及四周處，即可以將四周之皺摺推擠到多層印刷電路板側緣，本發明可以平整的將多層印刷電路板進行疊置固定，作為鉚合加工程序前的準備。The present invention presses the first pressing member 21 and the two pressing members 22 to press the multilayer printed circuit board in two stages, thereby first passing the first pressing member 21 to the center of the multilayer printed circuit board. The wrinkles are pushed to the periphery of the multilayer printed circuit board, and then pressed through the first pressing member 21 and the second pressing members 22 at the center and the periphery of the multilayer printed circuit board, so that the wrinkles can be surrounded. By folding to the side edge of the multilayer printed circuit board, the present invention can flatten and fix the multilayer printed circuit board as a preparation before the riveting process.
透過上述之詳細說明，即可充分顯示本發明之目的及功效上均具有實施之進步性，極具產業之利用性價值，且為目前市面上前所未見之新發明，完全符合發明專利要件，爰依法提出申請。唯以上所述著僅為本發明之較佳實施例而已，當不能用以限定本發明所實施之範圍。即凡依本發明專利範圍所作之均等變化與修飾，皆應屬於本發明專利涵蓋之範圍內，謹請 貴審查委員明鑑，並祈惠准，是所至禱。Through the above detailed description, it can fully demonstrate that the object and effect of the present invention are both progressive in implementation, highly industrially usable, and are new inventions not previously seen on the market, and fully comply with the invention patent requirements. , 提出 apply in accordance with the law. The above is only the preferred embodiment of the present invention, and is not intended to limit the scope of the invention. All changes and modifications made in accordance with the scope of the invention shall fall within the scope covered by the patent of the invention. I would like to ask your review committee to give a clear explanation and pray for it.
1．．．機台1. . . Machine
11．．．作業區11. . . Operating Area
12．．．操作台12. . . Console
13．．．定位機構13. . . Positioning mechanism
131．．．基座131. . . Pedestal
132．．．滑移塊132. . . Slip block
133．．．穿孔133. . . perforation
134．．．定位柱134. . . Positioning column
135．．．第一磁性件135. . . First magnetic piece
136、137．．．第二磁性件136, 137. . . Second magnetic piece
138．．．滑移柱138. . . Sliding column
2．．．固定機構2. . . Fixing mechanism
21．．．第一壓著件twenty one. . . First crimping piece
211．．．壓合板211. . . Plywood
22．．．第二壓著件twenty two. . . Second pressing piece
第一圖 係為本發明較佳實施例之立體圖。The first figure is a perspective view of a preferred embodiment of the invention.
第二圖 係為本發明較佳實施例之立體透視圖。The second drawing is a perspective view of a preferred embodiment of the invention.
第三圖 係為本發明較佳實施例之側視圖。The third drawing is a side view of a preferred embodiment of the invention.
第四圖 係為本發明較佳實施例之局部示意圖。The fourth drawing is a partial schematic view of a preferred embodiment of the invention.
第五圖 係為本發明較佳實施例之局部分解圖。Figure 5 is a partial exploded view of a preferred embodiment of the invention.
第六圖 係為本發明較佳實施例之動作示意圖一。Figure 6 is a schematic view of the operation of the preferred embodiment of the present invention.
第七圖 係為本發明較佳實施例之動作示意圖二。Figure 7 is a second schematic view of the operation of the preferred embodiment of the present invention.
第八圖 係為本發明較佳實施例之流程圖。The eighth figure is a flow chart of a preferred embodiment of the present invention.
1．．．機台1. . . Machine
11．．．作業區11. . . Operating Area
12．．．操作台12. . . Console
13．．．定位機構13. . . Positioning mechanism
Claims (9)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW100138224A TW201318499A (en) | 2011-10-21 | 2011-10-21 | Fixed machine for multilayer printed circuit board and fixing method thereof |
| CN2012101611709A CN102686054A (en) | 2011-10-21 | 2012-05-23 | Fixing machine for multi-layer printed circuit board and fixing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW100138224A TW201318499A (en) | 2011-10-21 | 2011-10-21 | Fixed machine for multilayer printed circuit board and fixing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201318499A true TW201318499A (en) | 2013-05-01 |
| TWI430730B TWI430730B (en) | 2014-03-11 |
Family
ID=46817208
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW100138224A TW201318499A (en) | 2011-10-21 | 2011-10-21 | Fixed machine for multilayer printed circuit board and fixing method thereof |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN102686054A (en) |
| TW (1) | TW201318499A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110213913B (en) * | 2019-07-16 | 2020-07-24 | 江西强达电路科技有限公司 | Riveting and clamping device for processing multilayer printed circuit board and working method thereof |
| CN114158206B (en) * | 2021-11-02 | 2022-06-21 | 深圳市方泰设备技术有限公司 | Laminating machine |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4408172B2 (en) * | 2000-07-21 | 2010-02-03 | ニチゴー・モートン株式会社 | Lamination method |
| JP4259838B2 (en) * | 2002-10-02 | 2009-04-30 | ニチゴー・モートン株式会社 | Laminating apparatus and laminating method |
| CN201063997Y (en) * | 2007-04-30 | 2008-05-21 | 汉达精密电子(昆山)有限公司 | Compressing assembly device |
| TW200934679A (en) * | 2008-02-05 | 2009-08-16 | Chuan Chieh Rubber Co Ltd | Method for synchronously processing rubber bodies |
-
2011
- 2011-10-21 TW TW100138224A patent/TW201318499A/en not_active IP Right Cessation
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Also Published As
| Publication number | Publication date |
|---|---|
| CN102686054A (en) | 2012-09-19 |
| TWI430730B (en) | 2014-03-11 |
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