TW201317500A - Light emitting element and thermo-electric separation device thereof - Google Patents

Abstract

The present invention relates to a light emitting element and its thermo-electric separation device. The light emitting element is pre-arranged with a circuit layout on a circuit board, and provided with at least one or more than one combinational spaces for allowing at least one or more than one light emitters respectively embedded into each combinational space. A base of each light emitter is made of high thermal conductive material, and the bottom of each light emitter is arranged with a wing extending outward for fixing to an circuit board outside the combinational space, and the bottom and the wing are located outside the combinational space to achieve the quick heat dissipating effect. A heat dissipation base can be arranged below the light emitting element for allowing at least one or more than one bottoms of the light emitters abutting and connecting to an abutting surface of the heat dissipation base. An isolation space is formed between the abutting surface and the bottom of the circuit for allowing air flowing smoothly, as well as achieving the purpose of dissipating heat quickly when the light emitting element emits light.

Description

Light-emitting element and thermoelectric separation device thereof

The invention provides a light-emitting element and a thermoelectric separation device thereof, in particular to a heat-dissipating device capable of assisting rapid heat dissipation of the light-emitting element and avoiding heat accumulation. The light-emitting element is assembled into the circuit board by using the light-emitting body to form a good heat dissipation effect and emit light. The component can be attached to the heat dissipation base to provide an isolation space between the circuit board and the heat dissipation base, thereby accelerating the convection of the hot air and improving the heat dissipation performance.

According to the acceleration of global warming, the awareness of energy saving and carbon reduction in the world is rising. Many methods for saving energy and resources have been used, and fluorescent lamps for lighting or traditional tungsten filament bulbs are used because of large power consumption. The volume is also large, the service life is short, it is not easy to recycle after disposal, and the glass fragments are quite dangerous after being broken, which not only wastes electric energy, but also does not conform to environmental protection demands. Therefore, some manufacturers have developed and replaced fluorescent lamps and tungsten light bulbs with LEDs. As a new lighting fixture, the light-emitting diode is small in size, long in service life, low in power consumption, and can be recycled and reused with common electronic components, etc., without causing environmental pollution and more environmentally friendly demands, then the light-emitting diode The body is used in a large number of lighting or indicator lights, such as: general traffic lights, red and yellow lights on the road, traffic lights for pedestrians, advertising lights, sign lights, vehicle lights, light-emitting diode (LED) bulbs Light-emitting diode (LED) fluorescent lamps or flashlights, etc., various lighting fixtures, also caused the use of LED lamps is used in large quantities, replacing the traditional lighting fixtures However, in the high-tech industry, the development of electronic components is becoming more and more small, and the density of electronic components is becoming more and more high, and the intensity of the unit area is relatively higher and higher, and the performance is increasing, and the total heat generation of electronic components is increasing year by year. If there is no good heat dissipation method to eliminate the heat energy generated by the electronic components, the temperature of overheating will cause electrons to dissipate electrons and thermal stress, resulting in a decrease in overall stability and a shortened service life of the electronic components. In the future, semiconductors and electronic components will tend to be designed with higher power and higher density. How to eliminate thermal energy such as semiconductors and electronic components is also a problem that operators must continue to face. At present, semiconductors or electronic components are in operation. High-density heat due to high-density energy (High Power Density). In the current heat-dissipation method, pure copper, aluminum or metal alloy is used as a base material for heat spread (Heat Spreaders), or heat pipe is used. Buried into the heat-dissipating base material to increase the speed of heat diffusion, but the cost of the heat-dissipating method is also greatly improved. Semiconductors, electronic components or light-emitting diode at the time of actual use, there are still many missing, such as:

(1) Semiconductors, electronic components or light-emitting diodes (LEDs) are prone to generate high-temperature heat during operation, causing the heat of electronic components to be difficult to dissipate and affecting the service life of the light-emitting diodes.

(2) Semiconductors, electronic components, or light-emitting diodes, etc., diffuse heat energy through a heat-dissipating material of pure copper or other metals, but because semiconductors, electronic components, or light-emitting diodes are directly attached to the surface of the heat-dissipating material, it is easy The heat is accumulated in the periphery of the semiconductor, the electronic component or the light-emitting diode, and is not easily dissipated, and the function of the heat-dissipating material to assist the diffusion of heat energy is limited.

Therefore, how to solve the problem and lack of heat generation and dissipation of various electronic components during operation, to avoid arranging too much thermal energy in the electronic components and their surroundings, and to quickly dissipate the thermal energy generated by the electrical components and the periphery, that is, It is the direction that the inventors and related manufacturers engaged in this industry are eager to study and improve.

Therefore, in view of the insufficiency and lack of the heat dissipation effect of the above-mentioned conventional electronic components, the inventors have collected relevant information, and through multi-party evaluation and consideration, and have been engaged in the industry for many years of experience, through continuous design and revision, It can be used to assist in the rapid heat dissipation of electronic components, light-emitting diodes, etc., through the isolation space between the light-emitting diode and the heat-dissipating pedestal, the invention of the convection of hot air, the acceleration of thermal energy, and the invention of the thermoelectric separation device.

The main purpose of the present invention is to provide a heat dissipating device, which is provided with a circuit layout, at least one or more bonding spaces, on the circuit board of the light-emitting element, so that the illuminants are respectively embedded in the respective combined spaces for the illuminants to penetrate through. The circuit board emits heat energy when the illuminants project light in the illumination, and is discharged from the bottom to the outside, so as not to accumulate on the circuit board, so that the illuminating element has a good heat dissipation effect.

The secondary object of the present invention is that the illuminating body of the illuminating element is disposed in the accommodating space inside the base, and the hem is outwardly convex at the bottom, and at least one or more illuminating wafers are disposed in the accommodating space, and The two-electrode pins for the at least one or more illuminating wafers extend to the outside of the accommodating space of the pedestal, and are electrically connected to the electrode contacts provided on the periphery of the bonding space on the circuit board, and the bottom portion is fixed by the wing edges. The bases are respectively assembled on the surface of the circuit board outside the combined space, and the bases are respectively assembled at the joint spaces of the circuit boards, and the bottom of the base is a joint space penetrating through the circuit boards, and protrudes an appropriate distance outside the bottom surface of the circuit board for illumination. When the body is in operation, the heat energy is reduced to the circuit board to prevent the circuit board from absorbing too much heat.

A further object of the present invention is to provide a heat dissipating pedestal under the illuminating element, that is, the at least one or more illuminating body bottom portions of the illuminating element are respectively abutted against and abutted against the resisting surface of the heat dissipating base, and are resisted An isolation space is formed between the surface and the bottom surface of the circuit board, so that the airflow can be smoothly circulated, and the auxiliary light-emitting element can be quickly radiated when it emits light.

Another object of the present invention is that each of the illuminants of the illuminating element has a V-shaped conical shape, and the outer rim of the pedestal is bent outwardly and then extends vertically downward to provide an outer annular wall. The bottom edge of the ring wall is further extended with a wing edge, and a deformation space is formed between the inner side of the outer ring wall and the base, so that the illuminants can be assembled in the joint space of the circuit board, and the outer ring wall of each illuminator is generated. The state of shrinkage and elastic deformation in the deformation space facilitates assembly of each illuminant in each joint space; and the deformation space of the outer edge of the base can be used to become a heat absorption section, and the heat dissipation base of the base can be absorbed and transmitted to the bottom. Holding the surface can also help the illuminator to dissipate heat.

In order to achieve the above objects and effects, the technical means and the structure of the present invention will be described in detail in the preferred embodiments of the present invention.

Please refer to the first, second, third and fourth figures, which are perspective exploded views, side exploded sectional views, perspective views of preferred embodiments, and perspective exploded views of preferred embodiments. It can be clearly seen that the light-emitting element of the present invention and the heat dissipating device thereof include the light-emitting element 1 and the heat-dissipating base 2, wherein the light-emitting element 1 includes the circuit board 11 and the light-emitting body 12, and the circuit board 11 has a pre- A circuit layout is provided, and a metal circuit layer 111, at least one or more bonding spaces 110 are formed on the surface of the circuit board 11, and at least one or more outer surfaces of the bonding space 110 are further provided with at least one or more electrode contacts 112. At least one or more combined spaces 110 can be used for assembling and embedding at least one or more illuminants 12, and each illuminant 12 has a base 121. The base 121 is provided with an accommodating space 120 and a bottom convex toward the outside. A wing edge 123 is provided for the bottom surface 1211 of each base 121 to extend outside the respective joint spaces 110, and the bases 121 can be assembled to the circuit board 11 by the wing edges 123 respectively. The outer bottom surface 110, 121 for the base located within the binding space 110, and the bottom surface of the base 121, side wings 123 are exposed to the space 110 external binding.

Each of the bases 121 of the illuminants 12 of the illuminating element 1 is internally recessed with an accommodating space 120, and at least one or more illuminating wafers 122 (which may be illuminating diode [LED] wafers) are disposed. The two electrode pins 1221 and 1222 of the light-emitting chip 122 are respectively extended from the top of the top of the base 121, and the electrode pins 1221 and 1222 are respectively connected to the electrodes of the metal circuit layer 111 electrically connected to the circuit board 11. At point 112, the sealant 13 can be processed in the accommodating space 120 of the base 121 to form the illuminant 12 (which can be a light-emitting diode [LED]).

The bottom edge 123 of each base 121 can be applied with an adhesive 124 on the top surface or by welding or screwing, and the base 121 can be passed through the wing 123 and assembled on the bottom surface of the joint space 110 of the circuit board 11 respectively. The outer side of the base 121 is located in the joint space 110, and the bottom surface of the base 121 and the wing edge 123 are exposed outside the joint space 110. The outer ring wall 1213 of the base 121 and the inner wall surface of the joint space 110 can maintain proper spacing to avoid illumination. The thermal energy of the wafer 122 is transferred to the wiring board 11 through the outer ring wall 1213.

When the light-emitting element 1 is used, the circuit board 11 is electrically connected to the power supply (which may be a dry battery, a lithium battery, a rechargeable battery, or a lamp power supply, etc.), and each of the illuminants 12 assembled on the circuit board 11 uses the respective illuminating wafers 122. When the light is emitted, the heat generated by each of the light-emitting chips 122 is dissipated outward from the bottom of the base 121 to avoid transferring too much thermal energy of each of the light-emitting bodies 12 to the circuit board 11, thereby preventing the circuit board 11 from accumulating too much thermal energy and affecting the circuits. The operation of electronic components.

Furthermore, the bottom of the circuit board 11 of the light-emitting element 1 can be relatively assembled with the heat-dissipating base 2, and the heat-dissipating base 2 is made of other materials such as copper material, aluminum material, alloy or graphite, which have good heat conduction effect. The bottom surface is provided with a resisting surface 21, and the base plate 11 and the base 121 of the at least one or more illuminators 12 are abutted against the abutting surface 21 of the heat dissipation base 2 by the bottom surface 1211, and A proper spacing is formed between the bottom surface of the circuit board 11 and the abutting surface 21 of the heat dissipation base 2 (the size may be approximately 0.5 cm, 1 cm or 1.5 cm, etc., and various pitch sizes are determined according to design conditions. The isolation space 20, which is not limited in size, forms a light-emitting element 1 having a heat sink.

The circuit board 11 of the above-mentioned light-emitting element 1 may be a circular, rectangular, polygonal, geometric or irregular shape plate, and the heat dissipation base 2 disposed opposite to the circuit board 11 may also be circular, rectangular, or A form of a polygon, a geometric shape, or an irregular shape.

When the illuminant 12 of the illuminating element 1 is illuminated and illuminated by the illuminating chip 122, the thermal energy generated by the illuminating body 12 is dissipated outward through the bottom veneer 1211, and the outer annular wall 1213 of the base 121 and the combined space can be utilized. The inner wall surface of 110 can maintain proper spacing, reduce the heat energy transmitted to the circuit board 11, and avoid a large amount of thermal energy accumulated on the circuit board 11 to prevent the circuit layout or various electronic components on the circuit board 11 from malfunctioning due to overheating. If the bottom of the light-emitting element 1 is oppositely assembled with the heat-dissipating base 2 and the base 121 of each of the light-emitting bodies 12 is provided, the heat generated by the light-emitting chips 122 is transmitted to the resisting surface 21 of the heat-dissipating base 2, The heat dissipation base 2 quickly absorbs the thermal energy of the base 121 of the illuminant 12, and the insulating space 20 between the bottom surface of the circuit board 11 and the abutting surface 21 allows hot air to flow through the isolation space 20 and the heat dissipation base. 2 external cold air convection, exchange, auxiliary heat sink base 2 to dissipate heat more quickly, and it is not easy to accumulate heat energy inside, so that the illuminant 12 can be cooled rapidly, the service life of the illuminant 12 can be prolonged, and the heat energy of the illuminant 12 can be reduced. It is sent to the circuit board 11 to avoid the accumulation of thermal energy on the circuit board 11. Moreover, the circuit board 11 of the light-emitting element 1 does not adhere to the resisting surface 21 of the heat-dissipating base 2, and forms an isolated space 20 of appropriate spacing. The heat energy at the bottom of the circuit board 11 can be convected with the outside air to form a circulation and exchange of hot and cold air, and heat energy can be prevented from being accumulated on the circuit board 11, that is, the circuit layout or other electronic components on the circuit board 11 are not affected, and the operation can be extended. The service life of the circuit board 1.

Please refer to the first, second, third and fourth figures, which are perspective exploded views, side exploded exploded cross-sectional views, perspective views of preferred embodiments, and perspective exploded views of preferred embodiments. It can be clearly seen that the illuminant 12 of the illuminating element 1 of the present invention can be shaped into a cylindrical base 121 or a conical base 121 (it can also be formed into other geometric shapes or irregular shapes, etc. The base 121 of the outer shape 121 of various shapes is accommodated in the base 121 of various shapes, and the partition space 1212 can be separated into plural numbers by using at least one or more partitions 1212. The illuminating chip 120 is provided with at least one or more illuminating wafers 122 (which may be illuminating diode [LED] wafers), so that the illuminating wafers 122 extend to the outside of the pedestal 121 with gold wires 1220, respectively. The electrode pins 1221 and 1222 are formed, and the illuminant 12 is processed by the encapsulation 13 so that at least one or more illuminating wafers 122 are respectively disposed in the accommodating space 120 of the pedestal 121 to form the illuminating light-emitting element 1.

In a preferred embodiment of the present invention, the base 121 of each of the illuminants 12 of the illuminating element 1 may have a V-shaped conical shape (or other configuration), and is bent outward from the top edge of each base 121. Then, the outer ring wall 1213 is vertically extended downward, and the bottom edge of the outer ring wall 1213 is further extended with a wing edge 123, so that the top surface of the wing edge 123 can be coated with an adhesive 124, welded or screwed, etc. In a manner, the outer side of the joint space 110 of the circuit board 11 is assembled by the wing 123, and the deformation space 1210 is formed between the inner side of the outer ring wall 1213 and the base 121. The outer ring wall 1213 and the wall surface of the joint space 110 are also formed. The pitch is such that each of the illuminants 12 is assembled in the joint space 110 of the circuit board 11, and the outer ring wall 1213 of each illuminator 12 is contracted and elastically deformed into the deformed space 1210, so that the illuminants 12 are assembled in each. The space 110 is combined; the deformation space 1210 of the outer edge of the base 121 can be used as a heat absorption section, and the heat energy of the base 121 can be absorbed, and then transmitted to the bottom surface of the heat dissipation base 2, and the heat sink 12 can be assisted to dissipate heat.

3, 4, 5, 6, 7, 8, 9, and 10 are a perspective view of a preferred embodiment of the present invention, an exploded perspective view of the preferred embodiment, and a side of the preferred embodiment. A side view of a preferred embodiment, a side view of another embodiment, a perspective view of another embodiment, a side cross-sectional view of another embodiment, an exploded perspective view of still another embodiment, and a side cross-sectional view of still another embodiment. It can be clearly seen from the figure that the illuminant 12 of the illuminating element 1 of the present invention can be resisted by the bottom veneer 1211 and the abutment of the heat sink base 2 through the base 121 of each illuminator 12. The surface 21 can be bonded, connected, and fixed between the bottom surface of the base 121 and the abutting surface 21 by a heat dissipating paste, a thermal conductive paste, or a soldering method, and the light emitting element 1 is fixed to the heat sink base 2 . Above.

When the illuminant 12 of the illuminating element 1 is illuminated or illuminated, the thermal energy generated by at least one or more of the illuminating wafers 122 of the illuminating body 12 can be transferred from the bottom of each of the pedestals 121 to the heat dissipating susceptor 2 for absorption through the heat dissipating base 2 The thermal energy of the illuminant 12 is matched with the base 121, the bottom surface of the circuit board 11 at the outer edge of the hem 123, and the isolation space 20 formed between the abutment surfaces 21 of the heat dissipation pedestal 2, for the hot air to circulate and convect with the outside cold air. And exchange, but can assist the heat dissipation base 2 to dissipate heat more quickly, and it is not easy to accumulate heat energy inside, so as to quickly dissipate the heat energy of the illuminant 12 and extend the service life of the illuminant 12 to heat the illuminating wafer 122. Transfer to the heat sink base 2.

A plurality of through holes 113 may be disposed on the circuit board 11, and each of the through holes 113 is respectively provided with a fixing member 114, and each of the through holes 113 of the circuit board 11 is disposed on the resisting surface 21 of the heat dissipation base 2, and a plurality of positioning holes are provided. 22, each of the fixing members 114 can pass through the respective through holes 113, and then be fixed to the positioning holes 22 of the heat dissipation base 2, so as to assemble and fix the circuit board 11 of the light-emitting element 1 to the heat dissipation base 2 Above the holding surface 21, the light-emitting element 1 can be more firmly bonded to the resisting surface 21 of the heat-dissipating base 2, and is not easily detached or loosened, so as to facilitate the mounting of the light-emitting element 1 and the heat-dissipating base 2 on the side wall surface or the mounting. In the ceiling and other locations.

The plurality of through holes 113 on the circuit board 11 and the plurality of positioning holes 22 of the heat dissipation base 2 may be screw holes, riveting holes or tip holes, and the plurality of fixing members 114 may be screws, rivets or spigots. The plurality of through holes 113 and the positioning holes 22 are combined by a plurality of fixing members 114.

Therefore, the above description is only a preferred embodiment of the present invention, and is not limited to the scope of the present invention. The light-emitting element and the thermoelectric separation device of the present invention are provided with a bonding space 110 by the wiring board 11 of the light-emitting element 1. The illuminant 12 is embedded in the illuminant 12, and the bottom surface 1211 of the illuminant 12 passes through the outside of the circuit board 11 to achieve rapid heat dissipation, and the thermal energy of the illuminant 12 is prevented from being accumulated on the circuit board 11; The circuit board 11 and the illuminant 12 are provided with a heat dissipation base 2, that is, the bottom surface 1211 of the illuminant 12 is butted and bonded through the abutting surface 21 of the heat dissipation base 2, and the bottom surface of the circuit board 11 and the heat dissipation base are provided. Between the abutting faces 21 of the seat 2, an isolated space 20 having an appropriate spacing is formed, so that the heat energy of the illuminating body 12 during the operation of the illuminating base 2 can be absorbed by the heat-dissipating base 2, and the air is circulated through the insulating space 20 The rapid exchange of hot and cold air, assisting the purpose of rapid heat dissipation, and the rapid cooling and dissipation of the heat generated by the illuminator 12 has the advantages of prolonging the service life of the illuminator 12, and the heat dissipation base 2 also has the advantages of rapid heat dissipation and difficulty. The practical effects of hoarding heat energy, so the purpose, efficacy, etc., and related equipment and devices that can achieve the above effects are covered by the present invention. Such simple modifications and equivalent structural changes should be included in this text. Within the scope of the invention patent, it is given to Chen Ming.

The above-described light-emitting element of the present invention and its thermoelectric separation device can have the following advantages when implemented in actual use, such as:

(1) The circuit board 11 of the light-emitting element 1 is provided with at least one or more joint spaces 110, and the base 12 of the at least one or more illuminants 12 is embedded and assembled in the joint space 110, and the base 12 The bottom portion protrudes from the outside of the joint space 110, thereby achieving rapid heat dissipation of the auxiliary illuminator 12, preventing the thermal energy of the illuminant 12 from being transmitted on the circuit board 11, and reducing the thermal energy of the circuit board 11 absorbing the illuminant 12.

(2) The illuminant 12 is embedded in the circuit board 11 of the illuminating element 1, and is abutted against the resisting surface 21 of the heat sink base 2 by the bottom surface 1211, and is disposed on the bottom surface of the circuit board 11 and the heat sink base 2 The insulating surface 20 is formed between the resisting surfaces 21, and the heat-dissipating base 2 absorbs the heat energy of the illuminating body 12 during illumination and illumination, and assists the thermal space to circulate through the isolation space 20 and convects with the external cold air, so that the illuminant 12 can be quickly Cooling and extending service life.

(3) The circuit board 11 of the light-emitting element 1 is not completely attached to the abutting surface 21 of the heat-dissipating base 2, and is provided with an appropriately spaced isolation space 20, and the air inside the isolation space 20 is convected with the outside air. The exchange and the circulation of hot and cold air help the circuit board 11 to dissipate heat and cool down, and it is not easy to accumulate heat energy, and does not affect the operation of various electronic components on the circuit board 11.

Therefore, the present invention is mainly directed to a design of a light-emitting element and a thermoelectric separation device thereof, wherein at least one or more bonding spaces are provided by a wiring board of the light-emitting element for at least one or more illuminants to be embedded, and the illuminant is provided. The bottom veneer is pierced from the outside of the circuit board, and the bottom surface of each illuminant is attached to the abutting surface of the heat dissipation base, and the space between the bottom surface of the circuit board and the resisting surface is formed to form an isolated space at an appropriate interval to achieve heat dissipation. The pedestal absorbs the thermal energy of the illuminant, and the convection of the air and the external air through the isolation space, the auxiliary illuminant quickly dissipates heat as the main protection focus, and can prolong the service life of the illuminant, and also achieve the utility of the circuit board not hoarding thermal energy, and does not affect The circuit layout of the circuit board or other electronic components operate, but the above is only a preferred embodiment of the present invention, and thus does not limit the scope of the patent of the present invention, so that it is simple to use the specification and the content of the present invention. Modifications, substitutions, and changes in equivalent principles are included in the scope of the patent of the present invention and are incorporated in the specification.

In summary, the above-mentioned light-emitting element and its thermoelectric separation device of the present invention can achieve its efficacy and purpose in practical implementation and application, and therefore the present invention is an excellent research and development, and is an application for conforming to the invention patent. The requirements, 提出 提出 提出 提出 提出 盼 盼 盼 盼 盼 盼 盼 盼 盼 盼 盼 盼 盼 盼 盼 盼 盼 盼 盼 盼 盼 盼 盼 盼 盼 审 审 审 审 审 审 审 审 审 审 审 审 审 审 审 审 审 审 审 审 审 审 审 审 审 爰

1. . . Light-emitting element

11. . . circuit board

110. . . Combined space

111. . . Metal circuit layer

112. . . Electrode contact

113. . . perforation

114. . . Fastener

12. . . illuminator

120. . . Housing space

121. . . Base

1210. . . Deformation space

124. . . Adhesive

13. . . Plastic closures

1211. . . Bottom veneer

1212. . . Partition

1213. . . Outer ring wall

122. . . Light emitting chip

1220. . . Gold Line

1221. . . Electrode pin

1222. . . Electrode pin

123. . . Wing

2. . . Cooling base

20. . . Isolated space

twenty one. . . Resisting surface

twenty two. . . Positioning hole

The first figure is a perspective exploded view of the present invention.

The second drawing is a side exploded sectional view of the present invention.

The third drawing is a perspective view of a preferred embodiment of the present invention.

The fourth figure is an exploded perspective view of a preferred embodiment of the present invention.

Figure 5 is a side elevational cross-sectional view of a preferred embodiment of the present invention.

Figure 6 is a side cross-sectional view of a preferred embodiment of the present invention.

Figure 7 is a perspective view of another embodiment of the present invention.

Figure 8 is a side cross-sectional view showing another embodiment of the present invention.

Figure 9 is a perspective exploded view of still another embodiment of the present invention.

Figure 10 is a side cross-sectional view showing still another embodiment of the present invention.

1. . . Light-emitting element

11. . . circuit board

110. . . Combined space

111. . . Metal circuit layer

112. . . Electrode contact

12. . . illuminator

120. . . Housing space

121. . . Base

122. . . Light emitting chip

1220. . . Gold Line

1221. . . Electrode pin

1222. . . Electrode pin

123. . . Wing

13. . . Plastic closures

Claims (10)

A light-emitting element, wherein: the light-emitting element comprises a circuit board having a line layout, and the circuit board is provided with at least one or more bonding spaces for respectively embedding and assembling at least one or more illuminants, and The illuminator is provided with a wing edge protruding outwardly at the bottom, and each illuminant is respectively provided with an electrode pin extending from the outer side of the top, and then the electrode of each illuminator is connected to the circuit board outside the respective combination space, respectively An electrode contact electrically connected to each electrode pin is provided. The illuminating element of claim 1, wherein the surface of the circuit board of the illuminating element is formed by processing a metal circuit layer of a predetermined circuit layout, and the metal circuit layer is disposed outside the at least one or more bonding spaces. At least one or more electrode contacts. The illuminating element according to claim 1, wherein at least one or more illuminants of the illuminating element are provided with a base for mounting at least one or more illuminating wafers, and at least one of the pedestals is disposed inside the pedestal. The accommodating space of the one or more illuminating chips, and the at least one or more illuminating chips are provided with two electrode pins extending to the outside of the pedestal and electrically contacting and conducting with the electrode contacts on the circuit board. The illuminating element according to claim 1, wherein at least one or more illuminants of the illuminating element are formed into a cylindrical base, a conical base or a base of geometric or irregular shape, and the base is Made of high thermal conductivity material of aluminum, copper or metal alloy. The illuminating element according to claim 1, wherein at least one or more illuminants of the illuminating element have a V-shaped conical shape, and the outer periphery of the top of the V-shaped base is bent downward and extends vertically. The annular wall is further provided with an annular wing edge by the outer peripheral edge of the outer annular wall, and a deformation space for elastically expanding and contracting the outer annular wall is formed between the inner side of the outer annular wall and the base. A light-emitting element and a thermoelectric separation device thereof, comprising a light-emitting element and a heat-dissipating base, wherein: the light-emitting element comprises a circuit board having a line layout, and the circuit board is provided with at least one or more combinations for the light-emitting body to be assembled through the assembly. Space, and each illuminating system has a base with a tapered shape, and is bent outwardly at the top edge of the base, and vertically extends downwardly to form an outer annular wall, and between the inner side of the outer annular wall and the base, for forming an outer ring wall elastic a telescopic deformation space, wherein the bottom edge of the outer ring wall is further provided with a wing edge extending outwardly to abut against the surface of the circuit board; the heat dissipation base is oppositely disposed under the light-emitting element, and the surface is provided with at least one or more light-emitting surfaces The body abuts against the butt joint, and forms an isolated space for the airflow between the resisting surface and the bottom surface of the circuit board. The illuminating element and the thermoelectric separation device thereof according to claim 6, wherein the surface of the circuit board of the illuminating element is formed by processing a metal circuit layer of a predetermined line layout, and the metal circuit layer is combined with at least one or more layers. Outside the space, at least one or more electrode contacts are provided. The illuminating element and the thermoelectric separation device thereof according to claim 6, wherein at least one or more bonding spaces of the illuminating element are provided for at least one or more illuminants, respectively, from above or below each bonding space. The embedded assembly is assembled in each combined space. The illuminating element and the thermoelectric separation device thereof according to claim 6, wherein at least one or more illuminants of the illuminating element are provided with a base for mounting at least one or more illuminating wafers, and the base is internally provided. The accommodating space for accommodating at least one or more illuminating wafers, and the at least one or more illuminating wafers are provided with two electrode pins extending to the outside of the pedestal; and the base of each illuminating body is V-shaped conical shape, and The peripheral edge of the top of the V-shaped base is bent downward to extend the vertical outer ring wall, and then the outer peripheral edge of the outer ring wall is provided with an annular wing edge, and the inner side of the outer ring wall and the base are formed to elastically expand and contract the outer ring wall. The deformation space. The light-emitting element according to claim 6, wherein the heat-dissipating base is made of a copper material, a copper alloy material, or an aluminum material or an aluminum alloy material.