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TW201303501A - 感光性樹脂組成物、感光性薄膜、稜紋圖型之形成方法、中空構造之形成方法及電子零件 - Google Patents

感光性樹脂組成物、感光性薄膜、稜紋圖型之形成方法、中空構造之形成方法及電子零件 Download PDF

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Publication number
TW201303501A
TW201303501A TW101110974A TW101110974A TW201303501A TW 201303501 A TW201303501 A TW 201303501A TW 101110974 A TW101110974 A TW 101110974A TW 101110974 A TW101110974 A TW 101110974A TW 201303501 A TW201303501 A TW 201303501A
Authority
TW
Taiwan
Prior art keywords
photosensitive resin
resin composition
hollow structure
photosensitive
film
Prior art date
Application number
TW101110974A
Other languages
English (en)
Chinese (zh)
Inventor
Sadaaki Katou
Shinjirou Fujii
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Publication of TW201303501A publication Critical patent/TW201303501A/zh

Links

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/08—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of resonators or networks using surface acoustic waves
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1064—Mounting in enclosures for surface acoustic wave [SAW] devices
    • H03H9/1092—Mounting in enclosures for surface acoustic wave [SAW] devices the enclosure being defined by a cover cap mounted on an element forming part of the surface acoustic wave [SAW] device on the side of the IDT's

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials For Photolithography (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Polymerisation Methods In General (AREA)
TW101110974A 2011-03-28 2012-03-28 感光性樹脂組成物、感光性薄膜、稜紋圖型之形成方法、中空構造之形成方法及電子零件 TW201303501A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011070174 2011-03-28

Publications (1)

Publication Number Publication Date
TW201303501A true TW201303501A (zh) 2013-01-16

Family

ID=46931286

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101110974A TW201303501A (zh) 2011-03-28 2012-03-28 感光性樹脂組成物、感光性薄膜、稜紋圖型之形成方法、中空構造之形成方法及電子零件

Country Status (3)

Country Link
JP (2) JP6089426B2 (ja)
TW (1) TW201303501A (ja)
WO (1) WO2012133579A1 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104977806A (zh) * 2014-04-11 2015-10-14 太阳油墨制造株式会社 感光性树脂组合物、干膜、固化物以及印刷电路板
TWI658325B (zh) * 2014-04-11 2019-05-01 日商太陽油墨製造股份有限公司 Photosensitive resin composition, dry film, cured product, and printed wiring board

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014120966A (ja) * 2012-12-18 2014-06-30 Nippon Dempa Kogyo Co Ltd 圧電部品
US9209380B2 (en) * 2013-03-08 2015-12-08 Triquint Semiconductor, Inc. Acoustic wave device
KR102646304B1 (ko) * 2017-02-23 2024-03-11 에이치디 마이크로시스템즈 가부시키가이샤 감광성 수지 조성물, 경화 패턴의 제조 방법, 경화물, 층간절연막, 커버 코트층, 표면 보호막, 및 전자부품
WO2021193091A1 (ja) * 2020-03-23 2021-09-30 東レ株式会社 感光性樹脂シート、電子部品、弾性波フィルター、及び弾性波フィルターの製造方法
JP7621072B2 (ja) * 2020-07-21 2025-01-24 東京応化工業株式会社 中空構造体の製造方法、及び中空パッケージの製造方法

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US5362605A (en) * 1993-05-10 1994-11-08 W. R. Grace & Co.-Conn. Photosensitive polymer composition for flexographic printing plates processable in aqueous media
JP2005062621A (ja) * 2003-08-18 2005-03-10 Sekisui Chem Co Ltd 光硬化性樹脂組成物、柱状スペーサ及び液晶表示素子
CN102290334B (zh) * 2005-07-05 2015-03-11 日立化成株式会社 半导体装置的制造方法
JP4992633B2 (ja) * 2006-10-04 2012-08-08 日立化成工業株式会社 感光性樹脂組成物及びこれを用いた感光性エレメント
JP4982197B2 (ja) * 2007-01-29 2012-07-25 富士フイルム株式会社 感光性樹脂組成物、パターン形成材料、画像形成方法、平版印刷版原版および平版印刷版の作成方法
JP2008239802A (ja) * 2007-03-27 2008-10-09 Hitachi Chem Co Ltd 感光性接着剤組成物、及び、基板の接着方法
JP2008248077A (ja) * 2007-03-30 2008-10-16 Sanyo Chem Ind Ltd 活性エネルギー線硬化型樹脂組成物
JP2009226571A (ja) * 2008-02-28 2009-10-08 Nippon Kayaku Co Ltd マイクロデバイス及びその製造方法
JP5201066B2 (ja) * 2008-06-19 2013-06-05 Ｊｓｒ株式会社 タッチパネルの保護膜形成用感放射線性樹脂組成物とその形成方法
JP5298675B2 (ja) * 2008-07-10 2013-09-25 日立化成株式会社 感光性樹脂組成物、ｓａｗフィルタ及びその製造方法
JP5206182B2 (ja) * 2008-07-10 2013-06-12 日立化成株式会社 感光性樹脂組成物、ｓａｗフィルタ及びその製造方法
JP4715877B2 (ja) * 2008-07-17 2011-07-06 住友ベークライト株式会社 感光性有機無機複合材料およびそれを用いた半導体装置
JP5239818B2 (ja) * 2008-12-16 2013-07-17 日立化成株式会社 感光性樹脂組成物、ｓａｗフィルタ及びその製造方法
JP5199938B2 (ja) * 2009-04-14 2013-05-15 日東電工株式会社 感光性接着剤組成物およびそれを用いて得られる電子部品用シール材
JP2010250032A (ja) * 2009-04-15 2010-11-04 Toyo Ink Mfg Co Ltd 感光性難燃性組成物及びその利用
JP5444833B2 (ja) * 2009-05-18 2014-03-19 日立化成株式会社 感光性樹脂組成物、リブパターンの形成方法及び電子部品
KR102148279B1 (ko) * 2010-05-20 2020-08-26 히타치가세이가부시끼가이샤 감광성 수지 조성물, 감광성 필름, 리브 패턴의 형성 방법, 중공 구조와 그 형성 방법 및 전자 부품
JP5707779B2 (ja) * 2010-08-24 2015-04-30 日立化成株式会社 感光性樹脂組成物、感光性フィルム、リブパターンの形成方法、中空構造の形成方法及び電子部品

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104977806A (zh) * 2014-04-11 2015-10-14 太阳油墨制造株式会社 感光性树脂组合物、干膜、固化物以及印刷电路板
TWI658325B (zh) * 2014-04-11 2019-05-01 日商太陽油墨製造股份有限公司 Photosensitive resin composition, dry film, cured product, and printed wiring board

Also Published As

Publication number Publication date
WO2012133579A1 (ja) 2012-10-04
JP6089426B2 (ja) 2017-03-08
JP2012215873A (ja) 2012-11-08
JP6332375B2 (ja) 2018-05-30
JP2017004017A (ja) 2017-01-05

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