201229500 六、發明說明： c ^^明所屬軒領 發明領域 本發明係有關於一種例如使用在檢查平面顯示器用之 玻璃基板、半導體基板或印刷基板等的檢查裝置之位置校 準裝置、位置校準方法及位置校準程式。 I：先前技術3 發明背景 以在’於液晶顯示器（LCD : Liquid Crystal Display)、 PDP(電漿顯示面板’ Plasma Display Panel)、有機EL(電致 發光’ ElectroLuminescence)顯示器或表面傳導型電子放射 元件顯示器（SED : Surface-conduction Electro-emitter Display)等之FPD(平面顯示器，Flat Panel Display)基板、半 導體晶圓或印刷基板等各種基板之製造中，為了提升其良 率，會在各圖案成形製程後，逐次地檢查是否存在有配線 之短路、連接不良、斷線或圖案不良等之缺陷。基板檢查 裝置係所謂透射照明型之基板檢查裝置，即：相較於載置 基板之浮起板而自下方照明基板，並拍攝檢查對象之基板 而進行基板檢查者。又，依照檢查對象之基板之不同，亦 會使用落射照明型之基板檢查裝置，即：自拍攝基板之拍 攝元件側照明者。 不過，在對玻璃基板等具有寬廣檢查對象面之基板進 行檢查或測定等之處理的基板檢查裝置中，在檢查檢查對 象面之特定位置時，會參照根據登錄在配方之座標所登錄 201229500 的樣板，進行檢查對象基板之對象圖案之型樣匹配，並進 行位置校準。然而，登錄在配方之對象圖案之座標與台上 實際之對象圖案之座標未必一致，依照情況之不同，必須 使拍攝部或基板移動而反覆複數次型樣匹配而檢索對象圖 案。 故’目前揭示有一種位置校準方法’且該位置校準方 法係預先設定第1樣板及第2樣板，而該第1樣板係藉由高倍 率所取得，該第2樣板係與業已縮小包含檢索對象影像之寬 廣領域的影像進行型樣匹配，又，當無法藉由第1樣板中的 型樣匹配取得對象圖案時，使用第2樣板進行型樣匹配者 (例如參照專利文獻1)。 先行技術文獻 專利文獻 [專利文獻1]曰本專利第3246616號公報 【發明内容J 發明概要 發明欲解決之課題 然而，專利文獻1所揭示之位置校準方法必須在所拍攝 的影像脫離檢查領域時，於所拍攝的位置將光學系統切換 成低倍率而取得廣範圍之低倍率影像後，再度地進行型樣 匹配，因此，會導致檢查時間之增加。又，藉由多達複數 次之拍攝部或基板之移動，亦會導致檢查時間之增加。 本發明係有鑑於前述而完成’目的係提供一種即使在 所拍攝的檢查對象之影像脫離檢查領域時，亦可縮短檢查 201229500 對象之位置校準所需之檢索時間而抑制檢查時間之增加的 位置校準裝置、位置校準方法及記錄有位置校準程式之電 腦可讀取記錄媒體。 用以欲解決課題之手段 為了解決前述課題並達成目的，有關本發明之位置校 準裝置係進行用於檢查測定之基板之位置校準者，又，包 含有：拍攝部，係拍攝前述基板之影像者；記憶部，係記 憶高倍配方影像及低倍配方影像，且前述高倍配方影像係 又疋進行則述檢查測定之測定處並藉由前述拍攝部所拍攝 者，則述低倍配方影像係包含前述高倍配方影像之視野領 域且具有比该而倍配方影像更廣範圍之視野領域，並藉 由前述拍攝部所拍攝者；檢索部，係檢索用於前述檢查測 定之檢查影像在前述低倍配方景彡像内之位置，且前述檢查 影像係以與前述記憶部所記憶的前述高倍配方影像同等之 倍率而藉由前述拍攝部所拍攝者；算出部，係於前述檢索 部之檢索結果為前述敎歧離前述檢查影狀視野領域 内時’算出包含該檢絲像及前述測定處之位置的位置資 訊者·’及控制部，係、根據前述算出部所算出的前述位置資 &將月J述拍攝移動成前述測定處進入前述檢查影像之 視野領域内後’使其拍攝檢查影像者。 為了解決前述課題並達成目的，有關本發明之位置校 準方法係位置校準裝置所進行，且該位置校準裝置係校準 基板影像之位置，並包含有：拍攝部，係拍攝用於檢查測 定之基板影像者；及記憶部，係崎、高倍配方影像及低倍 201229500 配方影像，且前述尚倍配方影像係設定進行前述檢查測定 之測定處者，前述低倍配方影像係包含前述高倍配方影像 之視野領域，且具有比該高倍配方影像更廣範圍之視野領 域者’又’前述位置校準方法包含有以下步驟：檢查影像 拍攝步驟，係拍攝檢查影像者，該檢查影像係進行測定之 基板的影像，且係以與前述高倍配方影像同等之倍率來拍 攝而進行檢查測定者；檢索步驟，係檢索前述檢查影像在 前述低倍配方影像内之位置者；算出步驟，係於前述檢索 步驟中的檢索結果為則述測定處脫離前述檢查影像之視野 領域内時，算出包含該檢查影像及前述測定處之位置的位 置資訊者；及移動拍攝步驟，係根據前述算出步驟中所算 出的前述位置資訊，將前述拍攝部移動成前述測定處進入 前述檢查影像之視野領域内後，使其拍攝檢查影像者。 為了解決刖述課通並達成目的’有關本發明之記錄有 位置校準程式之電腦可讀取記錄媒體係使位置校準裝置實 行以下程序，且該位置校準裝置係校準基板影像之位置， 並包含有：拍攝部，係拍攝用於檢查測定之基板影像者； 及記憶部，係記憶高倍配方影像及低倍配方影像，且前述 高倍配方影像係設定進行前述檢查測定之測定處者，前述 低倍配方影像係包含前述高倍配方影像之視野領域，且具 有比該高倍配方影像更廣範圍之視野領域者；又，前述程 序有：檢查影像拍攝程序，係拍攝檢查影像者，該檢查影 像係進行檢查之基板的影像，且係以與前述高倍配方影像 同等之倍率來拍攝而進行檢查測定者；檢索程序，係檢索 201229500 前达檢查影像在前述低倍配方影像内之位程 序’係於前魏t程序+的檢t , ^ 果為則逃測定處脫離前 =讀之視野領域内時’算出包含201229500 6. Description of the Invention: The present invention relates to a position aligning apparatus, a position aligning method, and the like, which are used, for example, in an inspection apparatus for inspecting a glass substrate, a semiconductor substrate, or a printed substrate for a flat panel display. Position calibration program. I: Prior Art 3 Background of the Invention In LCD (Liquid Crystal Display), PDP (Plasma Display Panel), Organic EL (Electro Luminescence) Electro Luminescence Display, or Surface Conduction Electron Radiation Element In the manufacture of various substrates such as an FPD (Flat Panel Display) substrate such as a display (SED: Surface-conduction Electro-emitter Display), a semiconductor wafer, or a printed substrate, in order to improve the yield, each pattern forming process is performed. After that, it is checked successively whether there is a defect such as a short circuit of the wiring, a poor connection, a disconnection, or a poor pattern. The substrate inspection device is a substrate inspection device that transmits light from the lower side than the floating plate on which the substrate is placed, and the substrate to be inspected is photographed to perform substrate inspection. Further, depending on the substrate to be inspected, an epi-illumination type substrate inspection device, i.e., the illuminator on the imaging element side of the self-photographing substrate, is also used. However, in the substrate inspection apparatus that inspects or measures the substrate having a wide inspection target surface such as a glass substrate, when the specific position of the inspection target surface is inspected, the template registered in 201229500 based on the coordinates registered in the recipe is referred to. The pattern matching of the object pattern of the inspection target substrate is performed, and position calibration is performed. However, the coordinates of the object pattern registered in the recipe and the coordinates of the actual object pattern on the stage do not necessarily coincide with each other. Depending on the situation, the imaging unit or the substrate must be moved to search for the target pattern by repeating the pattern matching. Therefore, 'the present invention discloses a position calibration method', and the position calibration method pre-sets the first template and the second template, and the first template is obtained by high magnification, and the second template is reduced and includes the search target. When the image of the wide area of the image is matched, the pattern matching is performed by the pattern matching in the first template, and the pattern matching is performed using the second template (see, for example, Patent Document 1). In the prior art, the positional calibration method disclosed in Patent Document 1 must be in the case where the captured image is separated from the inspection field, and the present invention is to solve the problem. After the optical system is switched to a low magnification at the photographed position and a wide range of low magnification images are obtained, the pattern matching is performed again, and thus the inspection time is increased. Moreover, the movement of the imaging unit or the substrate up to a plurality of times also causes an increase in the inspection time. The present invention has been made in view of the above, and aims to provide a positional calibration that suppresses an increase in inspection time by shortening the search time required for the position calibration of the 201229500 object even when the image of the image to be inspected is separated from the inspection field. The device, the position calibration method, and the computer on which the position calibration program is recorded can read the recording medium. Means for Solving the Problems In order to solve the above problems and achieve the object, the position calibration device according to the present invention performs position calibrating of a substrate for inspection and measurement, and includes an imaging unit that captures an image of the substrate. The memory unit is a memory high-definition formula image and a low-magnification formula image, and the high-definition formula image system is further described in the measurement section of the inspection and is photographed by the photographing unit, and the low-profile formula image system includes the foregoing The field of view of the high-definition image has a wider field of view than the image of the image, and is captured by the imaging unit; the search unit searches for the inspection image for the inspection and measurement in the low-profile formula a position in the image, and the inspection image is captured by the imaging unit at a magnification equivalent to the high-definition image stored in the memory unit; and the calculation unit is the search result of the search unit. When calculating the position in the field of view of the shadow field, the position of the position of the inspection screen and the position of the measurement unit is calculated. The operator's and the control unit are configured to move the image of the image to the field of view of the inspection image after the measurement is performed by the calculation unit. In order to solve the above problems and achieve the object, the position calibration method according to the present invention is performed by a position calibration device that aligns the position of the substrate image, and includes an imaging unit that captures a substrate image for inspection. And the memory department, the Kawasaki, the high-magnification formula image and the low-magnification 201229500 formula image, and the above-mentioned still-resolved image system is set to perform the above-mentioned inspection and measurement, and the low-profile formula image includes the field of view of the high-definition formula image. And the field of view having a wider range of the image than the high-definition formula, and the position calibration method includes the following steps: checking the image capturing step, and photographing the image, the image of the substrate being measured, and The image is taken at the same magnification as the high-definition image, and the search step is performed by searching for the position of the test image in the low-resolution image; the calculation step is that the search result in the search step is The measurement area is separated from the field of view of the aforementioned inspection image. And calculating a position information including the inspection image and the position of the measurement location; and the moving imaging step of moving the imaging unit into the measurement location into the inspection image based on the position information calculated in the calculation step After the field of view, let him shoot the image. In order to solve the problem and achieve the purpose, the computer-readable recording medium recorded with the position calibration program of the present invention causes the position calibration device to perform the following procedure, and the position calibration device calibrates the position of the substrate image, and includes : a photographing unit that photographs a substrate image for checking the measurement; and a memory unit that memorizes the high-magnification formula image and the low-magnification formula image, and the high-definition formula image system sets the measurement unit for performing the aforementioned inspection and measurement, and the low-order formula described above The image system includes the field of view of the high-definition formula image, and has a wider field of view than the high-resolution formula image; and the foregoing program includes: checking the image capturing program, and taking the image of the inspection image, the inspection image is inspected. The image of the substrate is imaged and photographed at the same magnification as the high-definition image, and the search program is used to search for the 201229500 pre-test image in the low-profile image. +Check t, ^ If the result is escape before the test is taken out = when reading the field of view Contain
測定處之位置的位置資訊者·艿必土 J + — ° ，移動拍攝裎序，係根據前 述算出耘序中所鼻出的前述位置 .^...^ ^ , 巩將則述拍攝部移動 t缝處進入前述檢查影像之視野 攝檢查影像者。 傻使/、？ 發明效果 二ΓΓΓ置校準裝置、位置校準方法及記錄有 電腦可讀取記錄媒體係作成預先登錄高倍 ^ 且别述南倍配方影像係包含測 疋處，刖述低倍配方影像係包含高倍配方影像，且具有比 局倍配方影像更廣範圍之視野，X，當藉由高倍率所取得 之檢查影賴雜__，會職絲像作成與低倍配 方影像之倍率时之像素解析度，並㈣檢查影像於低倍 配方影像中的位置，因此，具有即使是在所拍攝的檢查對 象之影像脫離檢查領域時，亦可縮短檢查對象之位置校準 所需之檢索時間而抑制檢查時間之增加的效果。 圖式簡單說明 第1圖係以模式顯示右Μ丄於α ^ 有關本發明之實施形態的平面顯 示器(FPD)檢查裝置之構造模式圖。 第2圖係顯不有關本發明之實施形態的配方影像登錄 處理之流程圖。 第3圖係顯不有關本發明之實施形態的F p D檢查裝置 201229500 之配方影像之模式圖。 第4圖係顯示有關本發明之實施形態的F P D檢查裝置 之配方影像之模式圖。 第5圖係顯示有關本發明之實施形態的線寬測定處理 之流程圖。 第6圖係顯示有關本發明之實施形態的F P D檢查裝置 之檢查影像之模式圖。 第7圖係顯示有關本發明之實施形態的FPD檢查裝置 之配方影像及檢查影像之模式圖。 第8圖係顯示有關本發明之實施形態的F P D檢查裝置 之配方影像及檢查影像之模式圖。 C實施方式3 用以實施發明之形態 以下，與圖式一同地詳細說明用以實施本發明之形 態。另，本發明並不受限於以下實施形態。又，於以下說 明中參照的各圖只不過是在可理解本發明内容之程度下概 略地顯示形狀、大小及位置關係。即，本發明並不僅限於 各圖中所例示的形狀、大小及位置關係。 首先，參照圖式，詳細地說明有關本發明之實施形態 的檢查裝置。另，於以下說明中，說明相對於檢查對象之 基板而移動光學系統單元之形式的基板檢查裝置，作為位 置校準裝置之例子。然而，本實施形態並不限於此，亦可 適用於相對於光學單元而移動基板之形式的基板檢查裝 置。又，基板檢查裝置係作成離線型者來說明，然而，亦 201229500 可為聯機型。 第1圖係顯示有關本實施形態的平面顯示器（FPD)檢查 裝置之概略構造模式圖。如第1圖所示，FPD檢查裝置1包 含有：基板處理部la，係載置所搬送構成矩形之基板W並 檢查者；及控制機構lb，係進行FPD檢查裝置1全體之控制者。 又，基板處理部la包含有··底座11，係作為架台者； 平台12，係底座11之頂板，並構成略呈矩形者；基板架η， 係固定於平台12上並保持基板W者；門型框架14，係沿著 一側邊跨越平台12者；光學單元16，係保持於門型框架14 者；及移動機構18，係使光學單元16連同門型框架14一起 移動者。 又，設置於門型框架14之移動機構18係例如設置於平 台12下。於平台12下亦設置X軸構件19,且該χ軸構件19係 沿著與門型框架14之長向呈正交之方向（χ方向）延伸。移動 機構18係於控制部20之控制下沿著χ軸構件19移動，藉此， 使光學單元16連同門型框架14一起沿著又方向移動。門型框 架14被稱作所謂龍門平台，並包含有γ軸構件15，且該γ軸 構件15係設置於與移動機構18之移動方向（χ方向）呈正交 之方向(Υ方向）。光學單元16鋪由可沿著γ轴構件Μ於門 型框架14鶴之移動機構17，簡於門型框㈣。移動機 構17係於控制部2G之控制下，沿著γ軸構件15於門型框架μ 移動。 底座11係藉由例如組合有塊狀之大理石或鋼材的框架 等对震性高之構件所構成。除此之外，於底油與設置面 201229500 (例如地面）間設置有例如藉由彈簧或油壓減震器等所構成 的振動吸收機構。藉此，可進一步地防止平台12及光學軍 元K之振動。 平台12包含有複數朝Y方向延伸且於搬送面上使基板 W浮起並載置而構成略呈板狀之浮起板。藉由將浮起板沿 者X方向排列’形成基板W之搬送路徑。依此，平台12係且 有各浮起板沿著X方向排列成竹簾狀之結構。於各浮起板設 置有複數吹出孔，且該吹出孔係藉由來自未圖示之空氣供 給部之空氣之供給，朝垂直上方吹出空氣。另，吹出孔宜 如拉格朗奇點之間隔般，以不會產生基板w之撓曲振動之 間隔來配置。又’基板w之定位方法可列舉如：使用支持 業已搬入平台12上之基板W而載置於平台12的舉升銷，以 及整列業已載置於平台12之基板W的整列機構等之方法。 光學單元丨6包含有：顯微鏡161，係調節視野領域者； 及拍攝部162 ’係拍攝業已藉由顯微鏡丨61調節視野領域或 焦點位置之基板W者。藉由解析利用該光學單元16所取得 之影像’可檢測基板W是否存在有缺陷。另，舉例言之， 光學單元16可適用以下於預定位置施行處理之處理單元， 即：進行對基板W之缺陷部分所進行的雷射照射修復或塗 布修正等之修復單元；進行配線等之尺寸測定、膜厚測定、 色測定等之測定單元等。又，光學單元16亦可為不具顯微 鏡161之拍攝形態。 顯微鏡161係縮小拍攝部162之拍攝視野而用以實現所 期望放大倍率之影像取得的放大光學系統。又，舉例言之， 10 201229500 拍攝部162包含有：LED等之照明部；聚光透鏡等之光學系 統；及CMOS影像感測器或CCD等之拍攝元件。照明部會 對拍攝元件之拍攝視野發出白色光等之照明光，並照明拍 攝視野内之被拍體。該光學系統係將來自該拍攝視野之反 射光聚光在拍攝元件之拍攝面，並將拍攝視野之被拍體影 像(基板W影像)成像於拍攝元件之拍攝面。拍攝元件係透過 拍攝面，接收來自該拍攝視野之反射光，並將該所接收的 光信號進行光電轉換處理而拍攝該拍攝視野之被拍體影 像。顯微鏡161係具有以下自動對焦機能，即：於#制部 之控制下，顯微鏡161本身或顯微鏡161於内部所具有的透 鏡系統會相對於基板w之拍攝面而朝垂直方向（2方 動’並自動地聚焦在被拍體者。自動對焦可檢測對比構成 最大之位置來聚焦，亦可使用雷射來聚焦。 塵 又，若FPD檢查裝置1包含有以下外裝，則可形成無 室’因此較為理想，即：至少包圍基板處理部i … ，且具π 設置於光學單元16上方並送入潔淨之空氣（以下稱作絮< 空氣）之FFU者。除了基板之搬入口與搬出 ' 及下部之導管 外，該無塵室係業經密閉之内部空間。 舉例言之’ FFU係送出業已除去粒子笨夕如 Τ <灰塵的潔淨 空氣。其結果’特別是將光學單元16之移動領域 ' 塵少之潔淨狀態。X ’集中在光學單元16附近而送== 淨之空氣係於無塵室内形成降流後，自排氣口 “ 、 辦氣。 控制機構lb包含有控制部20、收發部21、 輸入部22、 輸出部23、檢索部24、算出部25及記憶部26 控制機構lb 201229500 係藉由具有ROM、RAM等之電腦來實現。 控制部20係進行FPD檢查裝置1全體之控制。收發邛u 係具有遵從預定形式進行資訊之收發作為介面之機能， 例如與光學單元16之拍攝部161連接。另’亦可透過未圖= 之通信網路。 ~ 輸入部22係使用鍵盤、滑鼠、麥克風等來構成，並自 外部取得檢體之分析所必須的各種資訊或分析動作之护八 資汛等。輸出部23係使用顯示器、列印機、揚聲器等來構成' 檢索部24係檢索藉由光學單元16之拍攝部161所拍攝 的基板W之高倍率影像位於後述低倍配方影像〇2内的哪個 位置。又，檢索部24係根據檢索結果，判斷檢查對象之圖 案是否包含於高倍率影像内。 算出部25係自業已藉由檢索部24檢索的高倍率影像相 對於低倍率配方影像D 2之位置.，算出高倍率影像與高倍配 方影像D1之距離。另，如後所述，高倍配方影像〇1係放大 低倍配方影像之一部分之影像，且為包含檢查對象之圖案 之影像。 記憶部26係使用以下所構成，即：硬碟，係以磁力方 式記憶資訊者；及記憶體，係自硬碟載入基板處理部4實 行處理時有關該處理包含有關本實施形態之位置校準程式 的各種程式’並以電力方式記憶者。又，記憶部26係記憶 使用在後述線寬測定處理的高倍配方影像D1及低倍配方影 像D2。 其次，說明使用在型樣匹配之配方影像。第2圖係顯示 12 201229500 FPD檢查裝置1進行的配方影像登錄處理之流程圖。又，第 3、4圖係顯不配方影像之模式圖。首先，控制部2〇係透過 收發部21 ’以高料(作成倍率S1)轉II㈣騎161所拍 攝於登錄在gi方之測定座標巾包含測定對象之圖案的影像 (步驟S102)。舉例言之’如第3圖所示，所取得之影像係至 少包含測定對象之gj案以的高倍酉己方影像m。$，於高倍 配方影像D1中’拍攝成除了測定對象之圖案尺丨外，圖案R2 之σ卩刀亦會進入框架内，然而，亦可為圖案R2未進入框 架内之影像。 在取得尚倍配方影像D1後，於高倍配方影像D1上設定 測定處(步驟S104)。如第3圖所示，設定圖案R1中屬於測定 線寬之測定處的測定點P1、Μ。藉由設定測定點ρι、p2， 當拍攝影像内具有圖案尺丨時，會設定成測定測定點？1、p2 間之距離。舉例言之，測定點？1、p2係設定在圖案Ri與基 板表面間之濃淡改變之邊界部分。 若結束咼倍配方影像D1中的測定處之設定，則控制部 20會使記憶部26記憶該高倍配方影像D1(步驟sl〇6)。 其次，以低倍率（作成倍率S2(<S1))取得該測定座標中 的影像(步驟S108)。如第4圖所示，所取得之影像係至少包 含高倍配方影像D1之低倍配方影像£)2。此時，低倍配方影 像D2之視野領域之面積係高倍配方影像D1之視野領域之 面積之2倍以上。另，如第3、4圖所示，高倍配方影像〇1 之視野中心C1與低倍配方影像D2之視野中心C2宜一致。 若取得低倍配方影像D2，則控制部20會使記憶部26記 13 201229500 憶該低倍配方影像D2(步驟S110)。前述配方影像登錄處理 係與登錄在配方之測定座標有關來進行。當具有複數測定 座標時，會取得該測定座標份之高倍配方影像〇1及低倍配 方影像D2並記憶。另，當基板\^形成複數相同之圖案時， 亦可各測定座標通用而分別一個影像一個影像地登錄高倍 配方影像及低倍配方影像。 第5圖係顯示FPD檢查裝置1進行的線寬測定處理之流 程圖。又，第6至8圖係顯示檢查影像及配方影像之模式圖。 首先，控制部20係使光學單元16移動至測定座標（步驟 S202)。又，控制部20係以高倍率（倍率si)拍攝在測定座標 中的基板W之影像，並作成第6圖所示之檢查影像3〇而取得 影像（步驟S204)。 在取得檢查影像30後，控制部20係將步驟S204中所取 得之檢查影像30縮小成（S2/S1)倍（步驟S206)。藉由該縮小 處理，檢查影像30與低倍配方影像D2係構成同等之像素解 析度。 控制部20係使檢索部24檢索業已將檢查影像3〇縮小的 縮小影像40位於低倍配方影像D2上之何處（步驟S208)。如 第7圖所示，檢索部24係進行縮小影像40在低倍配方影像D2 内之位置之檢索’並判斷檢查影像30於低倍配方影像〇2上 所在之處。 若結束縮小影像4 0於低倍配方影像D 2内之位置之檢 索’則控制部20係算出檢查影像3〇中的測定處之位置（步驟 S210)。此時’舉例言之’控制部2〇係算出檢查影像3〇之視 201229500 野中心C3之座標。 若算出檢查影像30之視野中心C3之座標，則控制部2〇 係根據所算出的座標，判斷檢查影像30内是否具有測定處 (步驟S212)。在此，當判斷為檢查影像30内具有測定處時（步 驟S212 : Yes)，控制部2〇係轉移至步驟S218而進行測定處 之線寬測定處理。舉例言之，控制部2〇係測定第3圖所示之 測定點PI、P2間之距離。在結束線寬測定後，控制部2〇係 於具有下一個測定座標時（步驟S22〇 : Yes)，轉移至步驟 S202而進行下一個測定座標中的線寬測定處理。又，控制 部20係於不具下一個測定座標時（步驟S220: No)結束處理。 另一方面，當判斷為檢查影像30内不具測定處(脫離檢 查領域)時(步驟S212 : No)，控制部20係算出檢查影像3〇自 測定處之偏離量（步驟S214)。具體而言，如第8圖所示，控 制部20係使算出部25算出縮小影㈣(檢查影像3())之視^ 中心C3與低倍配方影像〇2之視野中心C2之距離及方向。控 制部20係根據算出部25所算出的偏離量之距離及方向，使 光學單元16移動成在高倍率(倍率S1)中的視野構成領域％。 在移動光學單元16後，控制部2〇係以高倍率(倍率叫 取得影像(步·216)。在取得f彡像後，控㈣2g係轉移至步 驟S218而進行線寬測定處理。 7 若藉由前述本實施形態，則作成預先登錄高倍配方影 像及低倍配方影像，且前述高倍配方影像係包含測定产口 前述低倍配㈣像聽含高倍配方麟，且具有比高=配 方影像更廣範圍之視野，又，當藉由高倍率所取得之檢查 15 201229500 影像脫離檢__，會將檢絲料成與㈣配方影像 之倍率同等之像素解析度’並檢索檢查影像於低倍配方影 像中的位置’因此’即使是在檢查影像脫離檢查領域時， 亦無須切換光學系統之倍率而可取得包含測定處 之檢查影 像。又’無顧行複數次之修改及雜匹配，且可藉由-次之移動動作’使光學單元移動至包含測定處之檢查領 域。藉此，可縮短檢查對象之位置校準所需之檢索時間， 並抑制檢查時間之增加。 又’藉由將低倍配方影像之視野領域作成高倍配方影 像之視野領域之2倍以上，即使檢查影像大幅地脫離測定 處’檢查影像亦會存在於低倍配方影像内，因此，可使低 倍配方影像内的檢查影像之檢索確實。 另，算出部25係說明將影像之視野中心之座標作為基 準而算出偏離量者，然而，算出用之基準點(座標）亦可為影 像之框架内之任意處。舉例言之，亦可將框架之角部作為 基準點，且亦可將對應於高倍配方影像D1内之測定處之點 作為基準。 如前所述，有關本發明之位置校準裝置、位置校準方 法及記錄有位置校準程式之電腦可讀取記錄媒體係進行有 效率之型樣匹配’且在縮短檢查時間方面是有用的。 【圖式簡單說明】 第1圖係以模式顯示有關本發明之實施形態的平面顯 示器（FPD)檢查裝置之構造模式圖。 第2圖係顯示有關本發明之實施形態的配方影像登錄 201229500 處理之流程圖。 第3圖係顯示有關本發明之實施形態的F P D檢查裝置 之配方影像之模式圖。 第4圖係顯示有關本發明之實施形態的F P D檢查裝置 之配方影像之模式圖。 第5圖係顯示有關本發明之實施形態的線寬測定處理 之流程圖。 第6圖係顯示有關本發明之實施形態的FPD檢查裝置 之檢查影像之模式圖。 第7圖係顯示有關本發明之實施形態的F P D檢查裝置 之配方影像及檢查影像之模式圖。 第8圖係顯示有關本發明之實施形態的F P D檢查裝置 之配方影像及檢查影像之模式圖。 【主要元件符號說明】 1...FPD檢查裝置 19...X軸構件 la...基板處理部 20...控制部 lb...控制機構 21...收發部 11…底座 22...輸入部 12...平台 23...輸出部 13...基板架 24...檢索部 14...門型框架 25...算出部 15... Y軸構件 26...記憶部 16...光學單元 30...檢查影像 17，18...移動機構 40...縮小影像 17 201229500 50.. .領域 161.. .顯微鏡 162.. .拍攝部 a，C2，C3…視野中心 D1...高倍配方影像 D2...低倍配方影像 PI，Ρ2...測定點 IU，R2...圖案 S102，S104，S106，S108 S110，S202，S204，S206 S208，S210，S212，S214 S216，S218，S220.·.步驟 W...基板 18The position information of the position of the measurement site, 艿必土J + - °, the moving shooting sequence, according to the above-mentioned position in the calculation of the nose in the order. ^...^ ^, the movement of the camera will be described At the t-slit, enter the field of view of the above-mentioned inspection image to check the image. Silly /,? Effect of the Invention The two-position calibration device, the position calibration method, and the recording of the computer-readable recording medium are created in advance to register a high magnification ^ and the description of the Nan-style recipe image system includes a test location, and the low-resolution recipe image system includes a high-power recipe image. And has a wider field of view than the localized formula image, X, when the inspection image obtained by the high magnification is __, the pixel resolution of the positional image is made with the magnification of the low-magnification image, and (4) Checking the position of the image in the low-resolution recipe image, so that even when the image of the image to be inspected is separated from the inspection area, the search time required for the position calibration of the inspection object can be shortened, and the increase of the inspection time can be suppressed. effect. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic structural view showing a flat display (FPD) inspection apparatus according to an embodiment of the present invention in a mode. Fig. 2 is a flow chart showing the recipe image registration processing of the embodiment of the present invention. Fig. 3 is a schematic view showing a recipe image of the F p D inspection apparatus 201229500 according to the embodiment of the present invention. Fig. 4 is a schematic view showing a recipe image of the FP inspection apparatus according to the embodiment of the present invention. Fig. 5 is a flow chart showing the line width measuring process in the embodiment of the present invention. Fig. 6 is a schematic view showing an inspection image of the FP inspection apparatus according to the embodiment of the present invention. Fig. 7 is a schematic view showing a recipe image and an inspection image of the FPD inspection apparatus according to the embodiment of the present invention. Fig. 8 is a schematic view showing a recipe image and an inspection image of the FP inspection apparatus according to the embodiment of the present invention. C. Embodiment 3 Mode for Carrying Out the Invention Hereinafter, the form for carrying out the invention will be described in detail together with the drawings. Further, the present invention is not limited to the following embodiments. Further, the drawings referred to in the following description are merely illustrative of the shape, size, and positional relationship to the extent that the present invention can be understood. That is, the present invention is not limited to the shapes, sizes, and positional relationships illustrated in the respective drawings. First, an inspection apparatus according to an embodiment of the present invention will be described in detail with reference to the drawings. Further, in the following description, a substrate inspection device in the form of moving an optical system unit with respect to a substrate to be inspected will be described as an example of a position alignment device. However, the present embodiment is not limited thereto, and is also applicable to a substrate inspecting apparatus in the form of moving a substrate with respect to an optical unit. Further, the substrate inspection device is described as being of an off-line type, however, the 201229500 may be an on-line type. Fig. 1 is a schematic structural view showing a flat panel display (FPD) inspection apparatus according to the present embodiment. As shown in Fig. 1, the FPD inspection apparatus 1 includes a substrate processing unit 1a for mounting a substrate W on which a rectangle is formed and a checker, and a control unit 1b for controlling the entire FPD inspection apparatus 1. Further, the substrate processing unit 1a includes a base 11 as a gantry; the platform 12 is a top plate of the base 11, and is formed into a substantially rectangular shape; and the substrate holder η is fixed to the platform 12 and holds the substrate W; The portal frame 14 spans the platform 12 along one side; the optical unit 16 is held by the portal frame 14; and the moving mechanism 18 moves the optical unit 16 together with the portal frame 14. Further, the moving mechanism 18 provided to the portal frame 14 is provided, for example, under the platform 12. An X-axis member 19 is also disposed under the platform 12, and the skeletal member 19 extends in a direction orthogonal to the longitudinal direction of the gantry frame 14 (χ direction). The moving mechanism 18 is moved along the reel member 19 under the control of the control portion 20, whereby the optical unit 16 is moved together with the portal frame 14 in the repetitive direction. The gantry frame 14 is referred to as a so-called gantry platform and includes a γ-axis member 15 which is disposed in a direction (Υ direction) orthogonal to the moving direction (χ direction) of the moving mechanism 18. The optical unit 16 is laid by a moving mechanism 17 which is slidable along the γ-axis member to the portal frame 14 and is simpler than the door frame (4). The moving mechanism 17 is moved along the γ-axis member 15 to the portal frame μ under the control of the control unit 2G. The base 11 is formed of a member having high vibration resistance by, for example, a frame in which block-shaped marble or steel is combined. In addition to this, a vibration absorbing mechanism composed of, for example, a spring or a hydraulic shock absorber or the like is provided between the base oil and the installation surface 201229500 (e.g., the ground). Thereby, the vibration of the stage 12 and the optical unit K can be further prevented. The stage 12 includes a plurality of floating plates that extend in the Y direction and that float and mount the substrate W on the transfer surface to form a substantially plate shape. The transport path of the substrate W is formed by arranging the floating plates in the X direction. Accordingly, the platform 12 is structured such that each of the floating plates is arranged in a bamboo curtain shape along the X direction. Each of the floating plates is provided with a plurality of blowing holes which are blown upward vertically by the supply of air from an air supply portion (not shown). Further, the blow-out holes are preferably arranged at intervals of the flexural vibration of the substrate w as in the interval of the Lagrangian dots. Further, the method of locating the substrate w may be, for example, a lift pin mounted on the stage 12 by supporting the substrate W that has been loaded onto the stage 12, and a method of arranging the entire array of the substrate W that has been placed on the stage 12. The optical unit 丨6 includes a microscope 161 for adjusting the field of view; and an imaging unit 162' for photographing the substrate W having the field of view or the focus position by the microscope 61. Whether or not the substrate W is defective can be detected by analyzing the image obtained by the optical unit 16. Further, for example, the optical unit 16 can be applied to a processing unit that performs processing at a predetermined position, that is, a repair unit that performs laser irradiation repair or coating correction on a defective portion of the substrate W; Measurement unit such as measurement, film thickness measurement, color measurement, and the like. Further, the optical unit 16 may be in a photographing form without the microscope 161. The microscope 161 is an amplifying optical system for reducing the imaging field of the imaging unit 162 for realizing image acquisition at a desired magnification. Further, for example, 10 201229500 The imaging unit 162 includes an illumination unit such as an LED, an optical system such as a condenser lens, and an imaging element such as a CMOS image sensor or a CCD. The illumination unit emits illumination such as white light to the field of view of the imaging element, and illuminates the subject in the field of view. This optical system condenses the reflected light from the imaging field on the imaging surface of the imaging element, and images the subject image (substrate W image) of the imaging field on the imaging surface of the imaging element. The imaging element receives the reflected light from the imaging field through the imaging surface, and photoelectrically converts the received optical signal to capture a subject image of the imaging field of view. The microscope 161 has the following autofocus function, that is, under the control of the #部部, the lens system of the microscope 161 itself or the microscope 161 has a lens system in the vertical direction with respect to the imaging surface of the substrate w (and Automatically focuses on the subject. Autofocus can detect the contrast to form the largest position to focus, or use laser to focus. Dust, if the FPD inspection device 1 contains the following exterior, it can form a no-chamber. Preferably, at least the substrate processing unit i ... is provided, and the FF is disposed above the optical unit 16 and sent to the clean air (hereinafter referred to as the floc < air). In addition to the substrate entrance and removal 'and Outside the lower duct, the clean room is sealed inside the space. For example, the FFU system has removed the clean air of the particles. The result is 'the moving field of the optical unit 16 especially' The clean state of dust is small. X 'concentrates near the optical unit 16 and sends == clean air is formed in the clean room to form a downflow, and the air is exhausted from the exhaust port. The control mechanism lb includes The control unit 20, the transmission/reception unit 21, the input unit 22, the output unit 23, the search unit 24, the calculation unit 25, and the storage unit 26 control unit lb 201229500 are realized by a computer having a ROM, a RAM, etc. The control unit 20 performs FPD. The control device 1 controls the entire device 1. The transmission/reception system has the function of transmitting and receiving information in accordance with a predetermined format as an interface, for example, connected to the imaging unit 161 of the optical unit 16. Alternatively, it can also be transmitted through a communication network not shown. The part 22 is configured by using a keyboard, a mouse, a microphone, etc., and acquires various information necessary for analysis of the sample or an analysis operation, such as an affiliation, etc. The output unit 23 uses a display, a printer, a speaker, and the like. The search unit 24 searches for which position of the high-magnification image of the substrate W captured by the imaging unit 161 of the optical unit 16 is located in the low-resolution recipe image 后 2 described later. Further, the search unit 24 determines based on the search result. Whether the pattern of the inspection target is included in the high-magnification image. The calculation unit 25 automatically calculates the position of the high-magnification image searched by the search unit 24 with respect to the low-magnification recipe image D 2 . The distance between the high-magnification image and the high-resolution image D1. In addition, as will be described later, the high-resolution image 〇1 is an image of a portion of the image of the low-resolution image, and is an image containing the pattern of the inspection object. The memory unit 26 uses the following The hard disk is a magnetic memory for storing information; and the memory is stored in the hard disk loading substrate processing unit 4, and the processing includes various programs related to the position calibration program of the present embodiment. In addition, the memory unit 26 uses the high-resolution recipe image D1 and the low-magnification recipe image D2 which are used for the line width measurement processing described later. Next, the recipe image used in the pattern matching will be described. The second figure shows 12 201229500 Flow chart of the recipe image registration process performed by the FPD inspection device 1. Also, Figures 3 and 4 show a pattern diagram of the unformed image. First, the control unit 2 transmits the image including the pattern of the measurement target on the measuring tape of the gi side by the high-frequency (producing magnification S1) to the second (four) riding 161 through the transmitting/receiving unit 21' (step S102). As an example, as shown in Fig. 3, the acquired image contains at least a high-resolution image m of the gj case of the measurement object. $, in the high-resolution formula image D1, the σ 卩 knife of the pattern R2 enters the frame in addition to the pattern ruler of the measurement object, however, the image of the pattern R2 does not enter the frame. After the sample composition image D1 is obtained, the measurement position is set on the high-resolution recipe image D1 (step S104). As shown in Fig. 3, the measurement points P1 and Μ at the measurement position of the measurement line width in the pattern R1 are set. By setting the measurement points ρι, p2, when there is a pattern ruler in the captured image, is it set to measure the measurement point? 1. The distance between p2. For example, the measurement point? 1. p2 is set at the boundary portion between the pattern Ri and the surface of the substrate. When the setting of the measurement position in the thumbnail image D1 is completed, the control unit 20 causes the memory unit 26 to memorize the high-resolution recipe image D1 (step sl6). Next, the image in the measurement coordinates is acquired at a low magnification (the magnification S2 (<S1)) (step S108). As shown in Fig. 4, the acquired image contains at least a low-magnification image of the high-resolution recipe image D1, £2. At this time, the area of the field of view of the low-magnification image D2 is more than twice the area of the field of view of the high-resolution image D1. In addition, as shown in FIGS. 3 and 4, the center of view C1 of the high-resolution formula image 〇1 and the center of view C2 of the low-magnification formula image D2 should be identical. When the low-magnification recipe image D2 is obtained, the control unit 20 causes the memory unit 26 to record the low-dature recipe image D2 201229500 (step S110). The recipe image registration processing described above is performed in association with the measurement coordinates registered in the recipe. When there is a plurality of measurement coordinates, the high-resolution formula image 1 and the low-magnification recipe image D2 of the measurement block are obtained and memorized. In addition, when the substrate \^ is formed into a plurality of patterns, the coordinates of the measurement and the low-resolution recipe image can be registered in one image by one image. Fig. 5 is a flow chart showing the line width measuring process performed by the FPD inspection apparatus 1. Further, Figures 6 to 8 show schematic diagrams of the inspection image and the recipe image. First, the control unit 20 moves the optical unit 16 to the measurement coordinates (step S202). Further, the control unit 20 captures the image of the substrate W in the measurement coordinates at a high magnification (magnification si), and creates an inspection image 3 as shown in Fig. 6 to acquire an image (step S204). After acquiring the inspection image 30, the control unit 20 reduces the inspection image 30 obtained in step S204 to (S2/S1) times (step S206). By the reduction processing, the inspection image 30 and the low-order recipe image D2 constitute the same pixel resolution. The control unit 20 causes the search unit 24 to search for the reduced image 40 that has been reduced in the inspection image 3〇 on the low-resolution recipe image D2 (step S208). As shown in Fig. 7, the search unit 24 performs a search for the position of the reduced image 40 in the low-resolution recipe image D2 and judges where the inspection image 30 is located on the low-resolution recipe image 〇2. When the search for reducing the position of the image 40 in the low-resolution recipe image D 2 is completed, the control unit 20 calculates the position of the measurement position in the inspection image 3 (step S210). At this time, the "exemplary" control unit 2 calculates the coordinates of the 201229500 field center C3 of the inspection image 3〇. When the coordinates of the field of view C3 of the inspection image 30 are calculated, the control unit 2 determines whether or not the measurement image 30 has a measurement point based on the calculated coordinates (step S212). When it is determined that there is a measurement site in the inspection image 30 (step S212: Yes), the control unit 2 proceeds to step S218 to perform line width measurement processing at the measurement site. For example, the control unit 2 measures the distance between the measurement points PI and P2 shown in Fig. 3. When the line width measurement is completed, the control unit 2 is configured to have the next measurement coordinate (step S22: Yes), and the process proceeds to step S202 to perform the line width measurement process in the next measurement coordinate. Further, the control unit 20 ends the processing when the next measurement coordinate is not present (step S220: No). On the other hand, when it is determined that there is no measurement (departure inspection area) in the inspection image 30 (step S212: No), the control unit 20 calculates the amount of deviation of the inspection image 3 from the measurement position (step S214). Specifically, as shown in Fig. 8, the control unit 20 causes the calculation unit 25 to calculate the distance and direction of the center of view C3 of the reduced shadow (4) (check image 3 ()) and the center of view C2 of the low-resolution recipe image 〇 2 . The control unit 20 moves the optical unit 16 to the field of view configuration field % at a high magnification (magnification S1) based on the distance and direction of the amount of deviation calculated by the calculation unit 25. After the optical unit 16 is moved, the control unit 2 picks up the image at a high magnification (magnification (step 216). After acquiring the image, the control (4) 2g shifts to step S218 to perform line width measurement processing. According to the embodiment of the present invention, the high-definition formula image and the low-magnification formula image are pre-registered, and the high-definition formula image system includes the above-mentioned low-mixing (four) image-receiving high-intensity formula, and has a wider ratio than the high-recipe image. Scope of view, in addition, when the inspection obtained by high magnification 15 201229500 image separation test __, will check the silk material to the same resolution as the (four) recipe image magnification 'and search for images in low-power formula images The position in the 'so that' even when checking the image out of the inspection field, the inspection image containing the measurement site can be obtained without switching the magnification of the optical system, and the modification and mismatch can be performed without any consideration. - the next movement action ' moves the optical unit to the inspection field including the measurement position. Thereby, the retrieval time required for the position calibration of the inspection object can be shortened, and the inspection time can be suppressed By adding the field of view of the low-magnification image to more than twice the field of view of the high-resolution image, even if the image is largely separated from the measurement, the image will be present in the low-resolution image. The search unit 25 can be used to determine the amount of deviation from the coordinate of the center of the field of view of the image. However, the reference point (coordinate) for calculation can also be an image. Anywhere within the framework. For example, the corner of the frame may be used as a reference point, and the point corresponding to the measurement point in the high-resolution formula image D1 may also be used as a reference. As described above, the present invention is The position calibration device, the position calibration method, and the computer-readable recording medium on which the position calibration program is recorded perform efficient pattern matching' and are useful in shortening the inspection time. [Simplified Schematic] Figure 1 The mode shows a structural schematic view of a flat panel display (FPD) inspection apparatus according to an embodiment of the present invention. Fig. 2 shows the implementation of the present invention. The flowchart of the recipe image registration 201229500 is processed. Fig. 3 is a schematic diagram showing the recipe image of the FPD inspection apparatus according to the embodiment of the present invention. Fig. 4 is a diagram showing the formulation of the FPD inspection apparatus according to the embodiment of the present invention. Fig. 5 is a flow chart showing a line width measurement process according to an embodiment of the present invention. Fig. 6 is a schematic view showing an inspection image of an FPD inspection apparatus according to an embodiment of the present invention. A schematic diagram showing a recipe image and an inspection image of an FPD inspection apparatus according to an embodiment of the present invention. Fig. 8 is a schematic view showing a recipe image and an inspection image of an FPD inspection apparatus according to an embodiment of the present invention. DESCRIPTION OF REFERENCE NUMERALS 1 : FPD inspection device 19 ... X-axis member la ... substrate processing portion 20 ... control portion lb ... control mechanism 21 ... transmission and reception portion 11 ... base 22 ... input Part 12: platform 23...output unit 13...substrate holder 24...search unit 14...gate frame 25...calculation unit 15...Y-axis member 26...memory unit 16... Optical unit 30... Check images 17, 18.. .moving mechanism 40...reducing image 17 201229500 50.. .Field 161...Microscope 162...Photographing unit a, C2, C3...Field of view D1...High magnification formula image D2...Low-magnification recipe image PI, Ρ2...measurement point IU, R2...pattern S102, S104, S106, S108 S110, S202, S204, S206 S208, S210, S212, S214 S216, S218, S220. ·. Step W...substrate 18