TW201202627A - Solid state lamp and bulb - Google Patents
Solid state lamp and bulb Download PDFInfo
- Publication number
- TW201202627A TW201202627A TW100107044A TW100107044A TW201202627A TW 201202627 A TW201202627 A TW 201202627A TW 100107044 A TW100107044 A TW 100107044A TW 100107044 A TW100107044 A TW 100107044A TW 201202627 A TW201202627 A TW 201202627A
- Authority
- TW
- Taiwan
- Prior art keywords
- light
- diffuser
- phosphor
- lamp
- heat sink
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V3/00—Globes; Bowls; Cover glasses
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
- F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
- F21K9/64—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction using wavelength conversion means distinct or spaced from the light-generating element, e.g. a remote phosphor layer
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
- F21V29/77—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
- F21V29/773—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Led Device Packages (AREA)
Abstract
Description
201202627 六、發明說明: 【發明所屬之技術領域】 本發明係關於固態燈及燈泡,且尤其係關於能夠產生全 向發射圖案的有效率且可靠之基於發光二極體(LED)的燈 .及燈泡。 本申請案主張以下各申請案之權利:2〇1〇年3月3曰申請 之美國臨時專利申請案第61/339,5 16號;2010年3月3曰申 請之美國臨時專利申請案第61/339,5 15號;2〇1〇年9月24曰 申請之美國臨時專利申請案第61/386 437號;2〇1〇年12月 19曰申請之美國臨時申請案第61/424,665號;2〇1〇年12月 19曰申請之美國臨時申請案第61/424,67〇號;2〇11年1月19 曰申請之美國臨時專利申請案第61/434,355號;2〇11年j月 23曰申請之美國臨時專利申請案第61/435,326號;及2〇ΐι 年1月24曰申請之美國臨時專利申請案第61/435,759號。本 申請案亦為以下各申請案之部分接續申請案且主張以下各 申請案之權利:2010年8月2曰申請之美國專利申請案第 12/848,825號;2010年9月24日申請之美國專利申請案第 12/889,719號,2010年12月22日申請之美國專利申請案第 12/975,820號,及2011年2月16日申請之美國專利申請案第 13/028,946號》 【先前技術】 白熾燈或燈泡或基於燈絲之燈或燈泡通常用作家用咬施 及商用設施之光源。然而,此等燈為效率極度低下之光 源,其多達95%的輸入能量損失,主要以熱或紅外線能量 154501.doc 201202627 之形式。白熾燈之一個常見替代形式(所謂的緊湊螢光燈 (CFL))在將電力轉換為光方面更有效但要求使用有毒材 料’該等有毒材料以及其各種化合物可造成慢性及急性中 毒且可導致環境污染。用於改良燈或燈泡之效率的一個解 決方案為使用固態器件(諸如,發光二極體(led))而非金 * 屬燈絲來產生光。 發光二極體一般包含夾於摻雜類型相反之層之間的半導 體材料之一或多個作用層。當將偏壓施加於該等摻雜層上 時’電洞及電子注入於作用層中,在該等作用層中其重組 合以產生光。光係自作用層且自led之各個表面發出》 為了在電路或其他相似配置中使用LED晶片,已知將 LED晶片封入於一封裝中以提供環境及/或機械保護、色彩 選擇、光聚焦及其類似者。LED封裝亦包括用於將LED封 裝電連接至外部電路的電導線、接點或跡線β在圖1中所 說明之典型LED封裝10中’借助於焊料結合或導電環氧樹 脂將單一LED晶片12安裝於反射杯13上。一或多個線結合 11將LED晶片12之歐姆接觸’連接至導線15A及/或15B,該 等導線可附接至反射杯13或與反射杯13形成一體。該反射 " 杯可填充有囊封劑材料16,該囊封劑材料16可含有諸如磷 光體之波長轉換材料。由LED發射之在第一波長下之光可 由磷光體吸收’該磷光體可回應地發射第二波長下之光。 接著將整個裝配件囊封於清澈保護樹脂14中,該保護樹脂 可模製成透鏡形狀以使自LED晶片12發射之光準直。 圖2展示習知LED封裝之另一實施例,習知led封裝包含 154501.doc 201202627 安裝至一載體上之一或多個LED晶片22,該載體諸如印刷 電路板(PCB)載體、基板或子基板23。安裝於子基板23上 之金屬反射器24環繞該(等)LED晶片22且反射由LED晶片 22發射之光使光遠離封裝20。反射器24亦提供對LED晶片 22之機械保護。在LED晶片22上之歐姆接觸與子基板23上 之電跡線25A、25B之間形成一或多個線結合連接件27。 接著以囊封劑26覆蓋所安裝之LED晶片22,囊封劑26可提 供對晶片之環境及機械保護同時亦充當透鏡。金屬反射器 24通常借助於焊料或環氧樹脂結合而附接至載體。 可藉由包含一或多個磷光體之轉換材料塗佈LED晶片 (諸如,圖2之LED封裝20中所找到之LED晶片),其中該等 磷光體吸收LED光之至少一些。LED晶片可發射不同波長 之光,使得其發射來自LED及磷光體之光的組合。可使用 許多不同方法用磷光體塗佈LED晶片,其中一種合適方法 描述於美國專利申請案第11/656,759號及第11/899,790號 中,該等專利申請案為Chitnis等人之申請案且皆題為 「Wafer Level Phosphor Coating Method and Devices Fabricated Utilizing Method」。或者,可使用諸如電泳沈 積(EPD)之其他方法來塗佈LED,其中一合適之EPD方法描 述於 Tarsa 等人之題為「Close Loop Electrophoretic Deposition of Semiconductor Devices」之美國專利申請案 第 ll/473,089號中。 亦已開發利用結合轉換材料之固態光源(諸如,LED)的 燈,該轉換材料與LED分離或位於LED之遠端。此等配置 154501.doc 201202627 揭示於Tarsa等人之題為「High Output Radial Dispersing Lamp Using a Solid State Light Source」之美國專利第 6,350,041號中。此專利中所描述之燈可包含經由分離器將 光透射至具有磷光體之分散器的固態光源。該分散器可使 光以所要圖案分散,及/或藉由經由磷光體或其他轉換材 料將光中之至少一些光轉換成不同波長而改變光之色彩。 在一些實施例中,分離器將光源與分散器隔開足夠距離, 以使得當光源載運室内照明所必要之升高電流時,來自光 源之熱將並不轉移至分散器。額外遠端磷光體技術描述於 Negley等人之題為r Lighting Deviee」之美國專利第 7,614,759號中。 併有遠鈿磷光體之燈的一個潛在缺點為其可具有非所要 之視覺或審美特性。舉例而言,當燈不產生光時,燈可具 有與標準愛迪生燈泡之典型白色或清澈外觀不同的表面色 彩。在一些例子中,燈可具有黃色或橙色外觀,其主要由 填光體轉換材料(諸如,黃色/綠色及紅色磷光體)產生。可 認為此外觀對於許多應用而言並非所要的’在該等應用中 當燈不照明時,其可造成關於周圍之建築元件之審美問 題。此情形可對消費者對此等類型之燈的總體接受度具有 負面影響。 另外,與在轉換過程期間在磷光層中產生之熱可經由附 近之日B片或基板表面傳導或耗散的保形或鄰近磷光體配置 相比’遠端璘光體酉己置可受制於不《足之導熱熱耗散路 徑。在無有效之熱耗散通路的情況下,熱隔離之遠端磷光 154501.doc 201202627 體可遭受升局之操作溫度,該升高之操作溫度在一些例子 中可甚至咼於可比較的保形經塗佈層中之溫度。此情形可 抵消藉由相對於晶片將磷光體置放於遠端所達成的一些或 所有益處。換言之,相對於led晶片之遠端碟光體置放可 減J或/肖除細因於在操作期間在led晶片内產生之熱的對 峨光層之直接生熱,但所得磷光體溫度減小可部分或全部 地歸因於在光轉換過程期間磷光層自身中產生之熱及缺少 用以耗散此所產生之熱的合適熱路徑而被抵消。 影響利用固態光源之燈的實施及接受度的另一問題與光 源自身發射之光的性質有關。對於將替換標準白熾燈泡之 固態光源而言,角度均勻性(亦被稱作發光強度分佈)亦係 重要的。標準白熾燈泡之燈絲與玻璃燈泡殼之間的幾何形 狀關係結合不需要電子器件或散熱片之事實允許來自白熾 燈泡之光按照一相對全向圖案發光。亦即,燈泡之發光強 度在垂直定向之燈泡之垂直平面中自燈泡之頂部至螺紋底 座跨越多個角度相對均勻地分佈’僅底座自身造成顯著光 阻礙。 為了製造基於LED光源(及相關聯轉換層)之有效率的燈 或燈泡,通常希望將LED晶片或封裝置放成共平面配置。 此促進製造且可藉由允許使用習知生產設備及製程而減少 製造成本。然而,LED晶片之共平面配置通常產生前向光 強度概況(例如,朗伯概況)。此等光束概況在固態燈或燈 泡意欲替換習知燈(諸如,傳統白熾燈泡)之應用中通常並 非所要的’習知燈具有更為全向之光束圖案。雖然可能將 15450I.doc 201202627 LED光源或封裝安裝成三維配置,但製造此等配置通常較 困難且昂貝。固態光源通常亦包括可能在一些方向上阻礙 光之電子電路及散熱片。 【發明内容】 在特定實施例中,本發明係關於一種使用固態光源之照 明單元,該等固態光源符合工業標準照明單元(諸如,ai9 白熾或螢光光源)之形狀,該等固態光源為此等照明單元 提供特定改良之效能特性(諸如,與能源之星㊣效能要求之 順應性)。此等照明單元可藉由使用固態光源(諸如,發光 二極體)、一波長轉換材料(諸如,一磷光體)、一擴散器元 件及一熱管理元件之各種組合來達成。在特定實施例中, 該等固態光源包含發射一第一波長之光(例如,藍光)之至 少一發光二極體,及發射一第二波長之光(例如,紅光)之 至少一發光二極體。該波長轉換材料包含一在該固態光源 之上的遠端波長轉換元件。該波長轉換元件包含至少一磷 光體,該至少一磷光體與該第一波長之光及該第二波長之 光中的至少一者相互作用以產生至少一第三波長之光(例 如 κ光)。该擴散器元件位於該波長轉換元件遠端且用 以產生更均勻之光發射。該熱管理元件包含一散熱片單 . 兀,該散熱片單元提供熱移除且包含可裝設於一標準白熾 或螢光光源(諸如,一 Α19燈泡)之燈泡殼内的一形狀。 在特定實施例中,本發明提供燈及燈泡,該等燈及燈泡 大體上包含以下各者之不同組合及配置:一光源、一或多 種波長轉換材料、相對於該光源分開定位或定位於遠端的 154501.doc 201202627 多個區或層’及一單獨擴散層。此配置允許製造有效率 的、可靠的且節省成本的燈及燈泡,且甚至在光源由 之一共平面配置組成的情況下,亦可提供一基本上全向發 射圖案。另外,此配置允許在該燈不照明時為了美觀而遮 蔽或隱蔽該等轉換區或層之外觀。本發明之各種實施例可 用以解決在製造適於直接替換傳統白熾燈泡之燈或燈泡的 過程中與利用有效率固態光源(諸如,LED)相關聯之許多 困難。本發明之實施例可經配置以適應所公認之標準大小 的輪廓(諸如,屬於常用燈(諸如,白熾燈泡)之彼等輪 廟)’藉此促進直接替換此等燈泡。 一根據本發明之照明器件之一實施例包含在一散熱片上 之一光源。亦包括一擴散器,該擴散器在該散熱片上且與 该光源間隔開。包括一波長轉換材料,該波長轉換材料在 «亥政熱片上且安置於該光源與該擴散器之間且與該光源及 該擴散器隔開。該燈經配置以裝設於A19燈泡殼内,同時 發射一實質上均勻發射圖案。 一根據本發明之照明器件之另一實施例包含在一散熱片 上之一光源。類似上述實施例,包括一擴散器,該擴散器 在。亥散熱片上且與該光源間隔開β包括一波長轉換材料, 該波長轉換材料在該散熱片上且安置於該光源與該擴散器 之間且與該光源及該擴散器隔開。該散熱片包含複數個散 ·、、、鰭片,每一散熱鰭片具有一自該照明器件之中心軸線向 外成角度之下部成角度部分,及一成角度而向該中心軸線 返回之上部部分,其中該照明器件發射一實質上均勻發射 154501.doc 201202627 圖案。 本發m態m施例包含—具有複數個散 熱鰭片之散熱片,及一安裝於該散熱片上之固態光源。包 括一磷光體載體,該磷光體載體在該散熱片上、在該光源 之上且與該光源間隔開。亦包括一擴散器,該擴散器在該 散熱片上、在㈣光體載體之上且與該碟光體載體間隔 開。該磷光體載體及該擴散器實質上為截頭球面形,以使 得該磷光體載體及該擴散器提供一雙圓頂結構,其中該燈 適應一標準大小輪廓,且發射一實質上均勻發射圖案。 本發明之此等及其他態樣及優點將自以下詳細描述及附 圖變得顯而易見,該等附圖藉助於實例說明本發明之特 徵》 【實施方式】 本發明係針對燈或燈泡結構之不同實施例’該等實施例 有效、可罪且節省成本,且在一些實施例中可提供來自方 向I"生發射光源(諸如,前向發射光源)之基本上全向發射圖 案°本發明亦針對使用固態發光器及遠端轉換材料(或磷 光體)以及遠端擴散元件或擴散器的燈結構。在一些實施 例中,擴散器不僅用以遮蔽磷光體以免燈使用者看到,且 亦可將來自遠端磷光體及/或燈之光源的光分散或重分佈 成所要發射圖案。在一些實施例中,擴散器圓頂可經配置 以將前向發射圖案分散成可用於一般照明應用之更全向圖 案。擴散器可用於具有二維以及三維形狀之遠端轉換材料 的實施例中,具有能夠將來自LED光源之前向發射轉換成 1545〇l.doc 201202627 可與標準白熾燈泡相當之光束概況的特徵之組合β 燈之一些實施例可具有在光源之上且與光源間隔開的圓 頂形(或截頭球面形)三維轉換材料(磷光體載體)。亦可包 括與轉換材料間隔開且在轉換材料之上的圓頂形擴散器, 以使得燈展現出雙圓頂結構。各個結構之間的空間可包含 光混合腔室,該等光混合腔室可不僅促進燈發射之分散且 亦促進色彩均勻性。光源與轉換材料之間的空間以及轉換 材料之間的空間可充當光混合腔室。其他實施例可包含可 形成額外混合腔室的額外轉換材料或擴散器。圓頂轉換材 料及圓頂形擴散器之次序可不同,以使得一些實施例可具 有在轉換材料内部之擴散器,同時其間之空間形成光混合 腔至此等配置僅為根據本發明之許多$同轉換材料及擴 散器配置中之少許。 根據本發明之一些燈實施例可包含具有一或多個晶 片或封裝之共平面配置的光源,其中發光器係安裝於平坦 或平面表面上。在其他實施例中,㈣晶片可並非共平 面,諸如係在基座或其他三維結構上q平面光源可降低 發光器配置之複雜性,使其製造更容易且更廉價 '然而, 共平面光源傾向於主 主要在別向方向上(諸如,按朗伯發射 圖案)來發光。在不同實施例中,可希望發射模擬習知白 熾燈泡之光圖㈣光圓t,f知白熾燈料在不同發射角 ㈣供幾乎均句之發射強度及色彩均勾性。本發明之不同 包含可將發射圆案自非均句變換成在一檢視角範 圍内貫質上均勻的特徵。 15450l.doc 12 201202627 在-些實施例中,一轉換層或區可包含一碌光體載體, 該鱗光體载體具有對於來自光源之光至少部分透明的導熱 材枓及各自吸收來自光源之光且發射不同波長之光的至少 一鱗光體材料。擴散器可包含-散射膜/粒子及相關聯之 载體(諸如,玻璃外殼),且可用以散射或重定向由光源及/ 或磷光體載體發射之光中的至少一些光以提供所要光束概 況。該擴散器之性質(諸如’幾何形狀、散射層之散射性 質、表面粗糙度或平滑度,及料散射層性質之空間分 佈)可用以控制各種燈性質,諸如依據檢視角而定之色彩 均勻性及光強度分佈。藉由遮蔽磷光體載體及其他内部燈 特徵,當該燈或燈泡不照明時,該擴散器提供一所要的總 體燈外觀。 可包括一散熱片結構,該散熱片結構可與光源熱接觸且 與磷光體載體及其他燈元件熱接觸以將熱耗散至周圍環境 中·。亦可包括電子電路以將電力提供至光源及提供其他能 力(諸如,調光等),且該等電路可包括藉以將電力施加至 燈之構件(諸如,螺紋旋座等)。 燈之不同實施例可具有許多不同形狀及大小,其中一些 實施例具有裝設至標準大小燈泡殼(諸如,如圖3中所展示 之A19大小燈泡殼3〇)中的尺寸。此使得燈特別可用作習知 白熾燈或燈泡及螢光燈或燈泡之替換物,其中根據本發明 之燈享有由其固態光源提供的減少之能量消耗及長使用壽 命。根據本發明之燈亦可適應其他類型之標準大小輪廓, 包括(但不限於)A21及A23。 I54501.doc •13· 201202627 在一些實施例中’光源可包含固態光源,諸如不同類型 之LED、LED晶片或LED封裝。在一些實施例中,可使用 單一 LED晶片或封裝,而在其他實施例中,可按不同類型 之陣列配置多個LED晶片或封裝。藉由使填光體與led晶 片熱隔離且具有良好熱耗散’可藉由較高電流位準來驅動 LED晶片’而未對填光體之轉換效率及其長期可靠性造成 有害效應。此情形可允許過激勵LED晶片以降低產生所要 發光通量所需之LED的數目的靈活性。此情形又可降低燈 之複雜性方面的成本。此等LED封裝可包含藉由可耐受升 高之發光通量之材料囊封的LED或可包含未經囊封之 LED。 根據本發明之一些LED燈可具有自約ΐ2〇〇 κ至3500 K之 相關色溫(CCT) ’而其他LED燈可自燈之頂部發射具有以 下發光強度分佈之光:在〇。至150。之範圍内變化不大於 10%。在其他實施例中,燈可發射具有以下發光強度分佈 之光:在0。至135。之範圍内變化不大於20%。在一些實施 例中’來自燈之總通量的至少5%係在135。至180。區中。其 他實施例可發射具有以下發光強度分佈之光:在〇。至12〇0 之範圍内變化不大於30%。在一些實施例中,LED燈具有 一色彩空間均勻性’使得隨著檢視角之改變,色度自一加 權平均點的變化不大於0.004。其他燈可符合對於60瓦特 白熾替換燈泡之發光效能、色彩空間均勻性、光分佈、演 色性指數、尺寸及底座類型之操作要求。 如下文更詳細描述,根據本發明之LED燈可具有發射不 154501.doc •14· 201202627 同波長光譜之光的許多不同類型之發光器。在一些實施例 中’根據本發明之原理之照明單元發射至少三個峰值波長 之光(例如,藍色、黃色及紅色)。至少一第一波長係由固 態光源發射(諸如,藍光)’且至少一第二波長係由波長轉 換元件發射(例如,綠光及/或黃光)。取決於實施例,第三 波長之光(諸如,綠光及/或紅光)可由固態光源及/或波長 轉換元件發射。在一些實施例中,該至少三個波長可由波 長轉換元件或固態光源發射。在一些實施例中,固態光源 可發射與波長轉換材料重疊、類似或相同的波長之光。舉 例而言,固態光源可包含發射與由波長轉換材料中之磷光 體發射之光重疊或實質上相同的波長之光(例如,紅光)的 LED ’例如,添加至波長轉換材料中之黃色磷光體之紅色 磷光體。 在一些實施例中,固態光源包含發射具有至少一不同峰 值光波長之光的至少一額外LED,及/或波長轉換材料包含 發射至少一不同峰值波長之至少一額外磷光體或發光物質 (lumiphor)。因此,照明單元發射具有至少四個不同峰值 光波長的光。 取決於貫施例,固態光源可包含單串或多串Led。波長 轉換元件可包括作為相異波長轉換元件保形地塗佈於固態 光源上、分散於固態光源之上及/或定位於固態光源遠端 之磷光體。舉例而言,使用塗佈或施配於固態光源中之個 別LED上之波長轉換材料的照明單元描述於以下申請案 中.van de Ven荨人之題為「[ED Lamp with High Color 154501.doc -15· 201202627201202627 VI. INSTRUCTIONS OF THE INVENTION: FIELD OF THE INVENTION The present invention relates to solid state lamps and light bulbs, and more particularly to efficient and reliable LED-based lamps capable of producing omnidirectional emission patterns. light bulb. The present application claims the following claims: US Provisional Patent Application No. 61/339, No. 5, filed March 3, 2011, and US Provisional Patent Application No. 3, filed March 3, 2010 61/339, 5 15; US Provisional Patent Application No. 61/386 437, filed September 24, 2011; US Provisional Application No. 61/424,665, filed December 19, 2010 No. 61/424,67 美国 of the US Provisional Application filed on December 19, 2011; US Provisional Patent Application No. 61/434,355, filed January 19, 2011; 2〇11 U.S. Provisional Patent Application Serial No. 61/435,326, filed on Jan. 23, 2011; and U.S. Provisional Patent Application No. 61/435,759, filed Jan. This application is also a continuation of the application of the following applications and claims the following applications: US Patent Application No. 12/848,825, filed on August 2, 2010, filed on September 24, 2010 U.S. Patent Application Serial No. 12/975,820, filed on Dec. 22, 2010, and U.S. Patent Application Serial No. 13/028,946, filed on Feb. 16, 2011. Incandescent or light bulbs or filament-based lamps or bulbs are commonly used as a source of light for household bites and commercial installations. However, these lamps are extremely inefficient sources of light with up to 95% of their input energy loss, primarily in the form of heat or infrared energy 154501.doc 201202627. A common alternative to incandescent lamps (so-called compact fluorescent lamps (CFLs)) is more efficient at converting electricity to light but requires the use of toxic materials. These toxic materials and their various compounds can cause chronic and acute poisoning and can lead to Environmental pollution. One solution for improving the efficiency of a lamp or bulb is to use a solid state device such as a light emitting diode instead of a gold filament to generate light. Light-emitting diodes typically comprise one or more active layers of a semiconductor material sandwiched between layers of opposite doping type. When a bias voltage is applied to the doped layers, the holes and electrons are injected into the active layer where they recombine to produce light. The light system is self-acting and is emitted from each surface of the LED. In order to use LED chips in circuits or other similar configurations, it is known to encapsulate LED wafers in a package to provide environmental and/or mechanical protection, color selection, light focusing and It is similar. The LED package also includes electrical leads, contacts or traces for electrically connecting the LED package to an external circuit. In a typical LED package 10 illustrated in Figure 1, 'a single LED wafer is soldered by means of solder bonding or conductive epoxy. 12 is mounted on the reflector cup 13. One or more wire bonds 11 connect the ohmic contacts ' of the LED wafer 12 to the wires 15A and/or 15B, which may be attached to or integral with the reflective cup 13. The reflective " cup may be filled with an encapsulant material 16, which may contain a wavelength converting material such as a phosphor. Light emitted by the LED at the first wavelength can be absorbed by the phosphor. The phosphor responsively emits light at the second wavelength. The entire assembly is then encapsulated in a clear protective resin 14 which can be molded into a lens shape to collimate light emitted from the LED wafer 12. 2 shows another embodiment of a conventional LED package comprising a 154501.doc 201202627 mounted to one or more LED wafers 22 on a carrier, such as a printed circuit board (PCB) carrier, substrate or sub- Substrate 23. A metal reflector 24 mounted on the submount 23 surrounds the (etc.) LED wafer 22 and reflects the light emitted by the LED wafer 22 to move the light away from the package 20. The reflector 24 also provides mechanical protection of the LED wafer 22. One or more wire bond connectors 27 are formed between the ohmic contacts on the LED wafer 22 and the electrical traces 25A, 25B on the submount 23. The mounted LED wafer 22 is then covered with an encapsulant 26 which provides environmental and mechanical protection to the wafer while also acting as a lens. Metal reflector 24 is typically attached to the carrier by means of solder or epoxy bonding. LED wafers (such as the LED chips found in LED package 20 of Figure 2) can be coated by a conversion material comprising one or more phosphors, wherein the phosphors absorb at least some of the LED light. The LED wafer can emit light of different wavelengths such that it emits a combination of light from the LED and the phosphor. LED wafers can be coated with phosphors in a number of different ways, one suitable method of which is described in U.S. Patent Application Serial No. 11/656,759, the entire disclosure of The title is "Wafer Level Phosphor Coating Method and Devices Fabricated Utilizing Method." Alternatively, other methods such as electrophoretic deposition (EPD) can be used to coat the LEDs, a suitable EPD method is described in U.S. Patent Application Serial No. ll. No. Lamps utilizing solid state light sources (such as LEDs) incorporating a conversion material have also been developed that are separate from or located at the distal end of the LED. Such a configuration is disclosed in U.S. Patent No. 6,350,041, to the name of "High Output Radial Dispersing Lamp Using a Solid State Light Source" by Tarsa et al. The lamp described in this patent can include a solid state light source that transmits light through a splitter to a disperser having a phosphor. The disperser can disperse the light in a desired pattern and/or change the color of the light by converting at least some of the light to a different wavelength via a phosphor or other conversion material. In some embodiments, the separator separates the source from the disperser a sufficient distance such that when the source carries the elevated current necessary for illumination in the room, heat from the source will not be transferred to the disperser. An additional remote phosphor technique is described in U.S. Patent No. 7,614,759, the entire disclosure of which is incorporated herein by reference. One potential disadvantage of having a phosphorescent lamp is that it can have undesirable visual or aesthetic characteristics. For example, when the light does not produce light, the light can have a surface color that is different from the typical white or clear appearance of a standard Edison light bulb. In some examples, the lamp can have a yellow or orange appearance that is primarily produced by a fill material conversion material such as a yellow/green and red phosphor. This appearance can be considered to be undesirable for many applications. In such applications, when the light is not illuminated, it can cause aesthetic problems with surrounding architectural elements. This situation can have a negative impact on the overall acceptance of these types of lamps by consumers. In addition, the "far-end phosphor" can be subject to a conformal or adjacent phosphor configuration that can be conducted in the phosphor layer during the conversion process by conduction or dissipation through the nearby B-plate or substrate surface. Does not "foot heat conduction heat dissipation path. In the absence of an effective heat dissipation path, the thermally isolated distal phosphor 154501.doc 201202627 may be subjected to an operating temperature that may be inferior to comparable conformal in some instances. The temperature in the coated layer. This situation can offset some or all of the benefits achieved by placing the phosphor at the distal end relative to the wafer. In other words, the placement of the remote disc relative to the LED wafer can reduce the direct heat generation of the phosphor layer due to the heat generated in the LED wafer during operation, but the resulting phosphor temperature is reduced. The small amount may be partially or fully attributed to the heat generated in the phosphor layer itself during the light conversion process and the lack of a suitable thermal path to dissipate the heat generated thereby. Another problem affecting the implementation and acceptance of lamps utilizing solid state light sources is related to the nature of the light emitted by the source itself. Angle uniformity (also known as luminous intensity distribution) is also important for solid state light sources that will replace standard incandescent bulbs. The geometric shape relationship between the filament of a standard incandescent bulb and the glass bulb shell, combined with the fact that no electronics or heat sink are required, allows light from an incandescent bulb to illuminate in a relatively omnidirectional pattern. That is, the luminous intensity of the bulb is relatively evenly distributed across the plurality of angles from the top of the bulb to the threaded base in the vertical plane of the vertically oriented bulb. Only the base itself causes significant light obstruction. In order to manufacture efficient lamps or bulbs based on LED light sources (and associated conversion layers), it is often desirable to place the LED wafers or closure devices in a coplanar configuration. This facilitates manufacturing and can reduce manufacturing costs by allowing the use of conventional production equipment and processes. However, coplanar configurations of LED chips typically produce a forward light intensity profile (e.g., a Lambertian profile). Such beam profiles are generally not desirable in applications where solid state lamps or lamps are intended to replace conventional lamps, such as conventional incandescent bulbs, where conventional lamps have a more omnidirectional beam pattern. Although it is possible to install the 15450I.doc 201202627 LED light source or package in a three-dimensional configuration, it is often difficult and expensive to fabricate such configurations. Solid state light sources also typically include electronic circuits and heat sinks that may block light in some directions. SUMMARY OF THE INVENTION In a particular embodiment, the present invention is directed to a lighting unit that uses a solid state light source that conforms to the shape of an industry standard lighting unit, such as an ai9 incandescent or fluorescent light source, for which the solid state light source is The lighting unit provides specific improved performance characteristics (such as compliance with ENERGY STAR positive performance requirements). Such illumination units can be achieved by using various combinations of solid state light sources (such as light emitting diodes), a wavelength converting material (such as a phosphor), a diffuser element, and a thermal management element. In a particular embodiment, the solid state light sources comprise at least one light emitting diode that emits light of a first wavelength (eg, blue light), and at least one light emitting light that emits light of a second wavelength (eg, red light) Polar body. The wavelength converting material includes a distal wavelength converting element above the solid state light source. The wavelength conversion element includes at least one phosphor that interacts with at least one of the first wavelength of light and the second wavelength of light to generate at least a third wavelength of light (eg, κ light) . The diffuser element is located at the distal end of the wavelength conversion element and is used to produce a more uniform light emission. The thermal management component includes a heat sink unit that provides heat removal and includes a shape that can be mounted within a bulb envelope of a standard incandescent or fluorescent light source, such as a 19 bulb. In a particular embodiment, the present invention provides a lamp and a light bulb that generally comprise different combinations and configurations of: a light source, one or more wavelength converting materials, positioned separately or positioned relative to the light source End 154501.doc 201202627 Multiple zones or layers' and a separate diffusion layer. This configuration allows for the manufacture of efficient, reliable, and cost effective lamps and bulbs, and can provide a substantially omnidirectional emission pattern even where the source is comprised of a coplanar configuration. In addition, this configuration allows the appearance of the transition zones or layers to be obscured or concealed for aesthetics when the lamp is not illuminated. Various embodiments of the present invention can be used to address many of the difficulties associated with utilizing efficient solid state light sources, such as LEDs, in the fabrication of lamps or bulbs suitable for directly replacing conventional incandescent bulbs. Embodiments of the present invention can be configured to accommodate recognized standard sized contours (such as those belonging to conventional lamps (such as incandescent bulbs)) thereby facilitating direct replacement of such bulbs. An embodiment of an illumination device according to the invention comprises a light source on a heat sink. Also included is a diffuser on the heat sink and spaced apart from the light source. A wavelength converting material is included on the Heizhen hot plate and disposed between the light source and the diffuser and spaced apart from the light source and the diffuser. The lamp is configured to be mounted within the A19 bulb housing while emitting a substantially uniform emission pattern. A further embodiment of a lighting device according to the invention comprises a light source on a heat sink. Similar to the above embodiment, a diffuser is included, the diffuser being. The semiconductor heat sink and spaced apart from the light source includes a wavelength converting material on the heat sink and disposed between the light source and the diffuser and spaced apart from the light source and the diffuser. The heat sink comprises a plurality of fins, fins, fins, each of the fins having an angled portion from an angle below the central axis of the illumination device, and an angle to the center axis In part, wherein the illumination device emits a substantially uniform emission pattern of 154501.doc 201202627. The present invention includes a heat sink having a plurality of heat radiating fins and a solid state light source mounted on the heat sink. A phosphor carrier is disposed on the heat sink, above and spaced apart from the light source. Also included is a diffuser on the heat sink, above (4) the light carrier and spaced apart from the optical carrier. The phosphor carrier and the diffuser are substantially frusto-spherical such that the phosphor carrier and the diffuser provide a dual dome structure, wherein the lamp accommodates a standard size profile and emits a substantially uniform emission pattern . The above and other aspects and advantages of the present invention will be apparent from the description and appended claims. Embodiments 'The embodiments are effective, sinful, and cost effective, and in some embodiments may provide a substantially omnidirectional emission pattern from a direction I" a source of emission (such as a forward emission source). The invention is also directed to A lamp structure using a solid state illuminator and a remote conversion material (or phosphor) and a distal diffusing element or diffuser. In some embodiments, the diffuser not only shields the phosphor from view by the light user, but also disperses or redistributes light from the source of the remote phosphor and/or lamp into the desired emission pattern. In some embodiments, the diffuser dome can be configured to disperse the forward emission pattern into a more omnidirectional pattern that can be used in general lighting applications. The diffuser can be used in embodiments having a two-dimensional and three-dimensional shape of the distal conversion material, having a combination of features capable of converting the forward emission from the LED source to a beam profile comparable to that of a standard incandescent bulb: 1545〇l.doc 201202627 Some embodiments of the beta lamp can have a dome-shaped (or truncated spherical) three-dimensional conversion material (phosphor carrier) above and spaced from the source. A dome shaped diffuser spaced apart from the conversion material and over the conversion material may also be included to cause the lamp to exhibit a dual dome structure. The space between the various structures can include light mixing chambers that not only promote dispersion of lamp emission but also promote color uniformity. The space between the light source and the conversion material and the space between the conversion materials can serve as a light mixing chamber. Other embodiments may include additional conversion materials or diffusers that may form additional mixing chambers. The order of the dome conversion material and the dome shaped diffuser can be varied such that some embodiments can have a diffuser inside the conversion material while the space therebetween forms a light mixing cavity to a configuration that is only a number of the same according to the present invention. A little bit of conversion material and diffuser configuration. Some lamp embodiments in accordance with the present invention may comprise a light source having a coplanar configuration of one or more wafers or packages, wherein the illuminators are mounted on a flat or planar surface. In other embodiments, the (iv) wafers may not be coplanar, such as on a pedestal or other three-dimensional structure. The q-plane light source may reduce the complexity of the illuminator configuration, making it easier and less expensive to manufacture. However, the coplanar light source tends to The main light is illuminated mainly in a different direction (such as according to the Lambertian emission pattern). In various embodiments, it may be desirable to emit a light pattern simulating a conventional incandescent light bulb (4) a light circle t, which is known to have an emission intensity and color uniformity at almost different emission angles at different emission angles (4). The difference of the present invention includes the ability to transform a circular from a non-uniform sentence into a uniform quality across a range of viewing angles. 15450l.doc 12 201202627 In some embodiments, a conversion layer or region can include a phosphor carrier having a thermally conductive material that is at least partially transparent to light from the source and each absorbing from the source Light and emitting at least one spheroidal material of light of different wavelengths. The diffuser can comprise a scattering film/particle and an associated carrier, such as a glass envelope, and can be used to scatter or redirect at least some of the light emitted by the light source and/or the phosphor carrier to provide a desired beam profile. . The properties of the diffuser (such as 'geometry, scattering properties of the scattering layer, surface roughness or smoothness, and spatial distribution of material scattering layer properties) can be used to control various lamp properties, such as color uniformity depending on the viewing angle and Light intensity distribution. By shielding the phosphor carrier and other internal lamp features, the diffuser provides a desired overall lamp appearance when the lamp or bulb is not illuminated. A heat sink structure can be included that is in thermal contact with the source and in thermal contact with the phosphor carrier and other lamp elements to dissipate heat to the surrounding environment. Electronic circuitry may also be included to provide power to the light source and provide other capabilities (such as dimming, etc.), and such circuitry may include components (such as a screw mount, etc.) through which electrical power is applied to the light. Different embodiments of the lamp can have many different shapes and sizes, some of which have dimensions that fit into a standard size bulb housing, such as the A19 size bulb housing 3 shown in Figure 3. This makes the lamp particularly useful as an alternative to conventional incandescent lamps or bulbs and fluorescent lamps or bulbs, wherein the lamp according to the invention enjoys reduced energy consumption and long life provided by its solid state light source. Lamps in accordance with the present invention can also accommodate other types of standard size profiles including, but not limited to, A21 and A23. I54501.doc • 13· 201202627 In some embodiments the light source may comprise a solid state light source, such as a different type of LED, LED wafer or LED package. In some embodiments, a single LED wafer or package can be used, while in other embodiments, multiple LED wafers or packages can be configured in different types of arrays. By thermally isolating the fill film from the led wafer and having good heat dissipation 'the LED chip can be driven by a higher current level' without detrimental effects on the conversion efficiency of the fill and its long-term reliability. This situation may allow over-excitation of the LED wafer to reduce the flexibility of the number of LEDs required to produce the desired luminous flux. This situation in turn reduces the cost of the complexity of the lamp. Such LED packages may include LEDs encapsulated by a material that can withstand elevated luminous flux or may include unencapsulated LEDs. Some LED lamps in accordance with the present invention may have a correlated color temperature (CCT)' from about ΐ2 〇〇 to 3500 K and other LED lamps may emit light having a distribution of the following illuminating intensity from the top of the lamp: at 〇. To 150. The change within the range is not more than 10%. In other embodiments, the lamp can emit light having a distribution of luminous intensity: at zero. To 135. The variation within the range is not more than 20%. In some embodiments, at least 5% of the total flux from the lamp is at 135. To 180. In the district. Other embodiments may emit light having the following luminous intensity distribution: at 〇. Change to no more than 30% within the range of 12〇0. In some embodiments, the LED lamp has a color space uniformity such that the chromaticity changes from a weighted average point by no more than 0.004 as the viewing angle changes. Other lamps meet the operational requirements for luminous efficacy, color space uniformity, light distribution, color rendering index, size, and base type for 60 watt incandescent replacement bulbs. As described in more detail below, an LED lamp in accordance with the present invention can have many different types of illuminators that emit light of a wavelength spectrum other than 154501.doc • 14·201202627. In some embodiments the illumination unit in accordance with the principles of the present invention emits at least three peak wavelengths of light (e.g., blue, yellow, and red). At least a first wavelength is emitted by a solid state light source (such as blue light) and at least a second wavelength is emitted by a wavelength conversion element (e.g., green light and/or yellow light). Depending on the embodiment, a third wavelength of light, such as green and/or red light, can be emitted by the solid state light source and/or wavelength conversion element. In some embodiments, the at least three wavelengths can be emitted by a wavelength converting element or a solid state light source. In some embodiments, the solid state light source can emit light of overlapping, similar or identical wavelengths to the wavelength converting material. For example, a solid state light source can include an LED that emits light (eg, red light) that overlaps or substantially the same wavelength as the light emitted by the phosphor in the wavelength converting material, eg, yellow phosphorescence added to the wavelength converting material. Red phosphor of the body. In some embodiments, the solid state light source comprises at least one additional LED that emits light having at least one different peak light wavelength, and/or the wavelength converting material comprises at least one additional phosphor or lumiphor that emits at least one different peak wavelength. . Thus, the illumination unit emits light having at least four different peak light wavelengths. Depending on the embodiment, the solid state light source can comprise a single string or multiple strings of Led. The wavelength converting element can include a phosphor that is conformally applied as a distinct wavelength converting element to a solid state light source, dispersed over a solid state light source, and/or positioned at a distal end of the solid state light source. For example, a lighting unit using a wavelength converting material coated or applied to individual LEDs in a solid state light source is described in the following application. "van Lamp" is entitled "[ED Lamp with High Color 154501.doc -15· 201202627
Rendering Index」之美國專利申請案第12/975 82〇號該 申請案已讓與給Cree,Inc.且以引用的方式併入本文中。波 長轉換元件可包括塗佈於磷光體載體之内表面及/或外表 面上及/或嵌有磷光體載體或與磷光體載體成一體的磷光 體粒子。擴散器元件可包括塗佈於擴散器之内表面及/或 外表面上及/或嵌入於擴散器内或與擴散器成一體的擴散 器粒子。在一些實施例中,擴散器包含諸如擦磨或粗糙化 之結構或特徵。 取決於實施例,關於LED光源與波長轉換材料之間的關 係之不同配置係可能的。在一些實施例中,遠端波長轉換 元件覆蓋所有LED光源。在其他實施例中,遠端波長轉換 元件覆蓋一些LED光源,而並非覆蓋所有LED光源。舉例 而言’遠端波長轉換元件覆蓋發射相同或類似波長之光 (例如,藍光)的LED,而並不覆蓋發射另一波長之光(例 如’紅光)之其他LED。在一些實施例中,至少一第一遠端 波長轉換元件覆蓋第一LED集合’且至少一第二波長轉換 元件覆蓋一第二LED集合。取決於實施例,照明單元可包 含在光學上搞合至經塗佈之波長轉換材料、經分散之波長 轉換材料及/或遠端波長轉換材料的LED。該等LED與波長 轉換材料之間的其他配置係可能的。 在本發明之一些實施例中,LED裝配件包括發射藍光之 LED封裝與發射紅光之其他led封裝。在一些實施例中, LED燈之LED裝配件包括具有至少兩個LED群組之LED陣 列’其中一個群組在照明時將發射具有440 nm至480 nm之 154501.doc 16· 201202627 主波長的光,且另一群組在照明時將發射具有605 nm至 63 0 nm之主波長的光。磷光體載體可經配置以吸收來自該 兩個波長光譜中之一者或兩者的光且重新發射光,且碟光 體載體可具有一或多個填光體,該一或多個碌光體中之每 一者可吸收光且重新發射不同波長之光(例如,波長降頻 轉換)。一些燈實施例可包含發射藍光及紅光之複數個 LED ’其中磷光體載體包含吸收藍光且重新發射黃光或綠 光之黃色磷光體,其中藍光之一部分穿過磷光體載體。來 自該(等)紅色LED之紅光穿過黃色/綠色磷光體,同時經歷 較少吸收或不經歷吸收’以使得燈發射藍光、黃光/綠光 及紅光之白光組合。在具有藍色LED及紅色LED之另外其 他實施例中,磷光體載體可包含黃色/綠色磷光體及一紅 色磷光體以有助於燈照明之紅色分量且輔助使Led光分 散。 在一些實施例中,該等LED可包含兩個群組,其中一 LED群組互連於第一串聯串中,且另一 LED群組互連於第 二串聯串中。此情形僅為該等LED可互連之許多種方式中 之一者’且應理解,該等LED可以許多不同的並聯及串聯 互連組合來配置。 在一些實施例中,根據本發明之燈可發射具有諸如8〇或 高於80之高演色性指數(CRI)的光。在一些其他實施例 中’燈可發射具有90或高於90之CRI的光。燈亦可產生具 有自2500 K至3500 K之相關色溫(CCT)的光。在其他實施 例中’光可具有自2700 K至3300 K之CCT。在另外其他實 154501.doc -17- 201202627 施例中’光可具有自約2725 K至約3045 K之CCT。在一些 實施例中,光可具有約2700 K或約3000 K之CCT。在光可 調之另外其他實施例中,可藉由調光而減小CCT。在此狀 況下,可將CCT減小至低達1500 K或甚至1200 K。在 實施例中’可藉由調光而增加CCT。取決於實施例,可基 於調光而改變其他輸出光譜特性。 應注意’ LED之其他配置可與本發明之實施例一起使 用。可使用每一類型的相同數目個LED,且可以變化之圖 案來配置LED封裝。可使用每一類型之單一 led。可使用 產生額外色彩之光的額外LED。藉由使用發射一或多個額 外色彩之一或多個LED及/或包含一或多個額外磷光體或發 光物質之波長轉換材料,照明單元之CRI可得以增加。發 光物質可與所有LED模組一起使用。一單一發光物質可與 多個LED晶片一起使用且多個LED晶片可包括於一個、一 些或所有LED器件封裝中。使用發射不同波長之光之lED 群組產生貫質上白光的更詳細實例可見於已頒發之美國專 利7,213,940中,該專利以引用的方式併入本文中。 根據本發明之-些燈實施例可包含第—固態發光器群組 及第-發光物質群組中該第一發光物質群組包括至少 一發光物質。該等燈亦包括第二固態發光器群組,其中該 第二固態發光器群組包括至少—固態發光器及至少一第一 電力線。該第—固態發光器群組中之每-固態發光器及該 第二固態發光器群組中之每一固態發光器可電連接至該第 一電力線。該第1態發光器群组中之每-固態發光器在 154501.doc 201202627 照明時可發射具有在430 nm至480 nm之範圍内的主波長之 光。該第一發光物質群組中之每一發光物質在被激勵時可 發射具有在約555 nm至約585 nm之範圍内的主波長之光。 該第二固態發光器群組中之每一固態發光器在照明時可發 射具有在600 nm至630 nm之範圍内的主波長之光。 若將電流施加至第一電力線,則在缺乏任何額外光之情 況下,以下各者之組合將產生在1931 CIE色度圖上具有χ, y座標之光混合物:(1)由該第一固態發光器群組發射的離 開照明器件之光,(2)由該第一發光物質群组發射的離開照 明器件之光,及(3)由該第二固態發光器群組發射的離開照 明器件之光。該等座標界定一點,該點位於丨93丨cie色度 圖上之黑體軌跡上之至少一點的十個麥克亞當橢圓内。此 光組合亦產生具有X,丫色彩座標之光的子混合物該等& 乂 色彩座標界定一點,該點位於1931 CIE色度圖上的由第一 點、第二點、第三點、第四點及第五點所界定的第一、第 二、第三、第四及第五連接線段封閉的區域内。第一點可 具有X’ y座標0.32, 〇_4〇,帛:點可具有x,y座標〇 36, 0.48’第三點可具有x,y座標〇.43〇45,第四點可具有 座標0.42, 0·42,且第五點可具有χ,y座標〇刊,〇 38。 本發明亦提供具有相對幾何形狀的特徵(諸如,咖孰 耗散器件或散熱片)之LED燈,該等㈣幾何形狀的特徵允 許燈發射圖案滿足以引用的方式併 町万式併入本文中的於2010年3 月22日修正的「一邀式1五£)廢之於 且之肖b源之星態計劃要求 {ENERGY STAR® Program Requirements fn τU.S. Patent Application Serial No. 12/975, filed on Jan. No. No. No. No. No. No. No. No. No. No. No. No. No. No. No No. No. No. No. No. The wavelength converting element may comprise phosphor particles coated on the inner and/or outer surface of the phosphor support and/or embedded with or integrated with the phosphor support. The diffuser element can include diffuser particles coated on the inner and/or outer surface of the diffuser and/or embedded in or integral with the diffuser. In some embodiments, the diffuser comprises a structure or feature such as abrading or roughening. Depending on the embodiment, different configurations regarding the relationship between the LED light source and the wavelength converting material are possible. In some embodiments, the remote wavelength conversion element covers all of the LED sources. In other embodiments, the remote wavelength conversion component covers some of the LED light sources and does not cover all of the LED light sources. For example, a remote wavelength conversion element covers an LED that emits light of the same or similar wavelength (e.g., blue light), but does not cover other LEDs that emit light of another wavelength (e.g., 'red light'). In some embodiments, at least one first remote wavelength conversion element covers a first set of LEDs and at least one second wavelength conversion element covers a second set of LEDs. Depending on the embodiment, the illumination unit can include LEDs that are optically coupled to the coated wavelength converting material, the dispersed wavelength converting material, and/or the remote wavelength converting material. Other configurations between the LEDs and the wavelength converting material are possible. In some embodiments of the invention, the LED assembly includes an LED package that emits blue light and other LED packages that emit red light. In some embodiments, the LED assembly of the LED lamp comprises an LED array having at least two groups of LEDs. One of the groups will emit light having a dominant wavelength of 154501.doc 16·201202627 with 440 nm to 480 nm when illuminated. And another group will emit light having a dominant wavelength of 605 nm to 63 0 nm when illuminated. The phosphor carrier can be configured to absorb light from one or both of the two wavelength spectra and re-emit light, and the optical carrier can have one or more fills, the one or more Each of the bodies can absorb light and re-emit light of different wavelengths (eg, wavelength down conversion). Some lamp embodiments can include a plurality of LEDs that emit blue and red light' wherein the phosphor carrier comprises a yellow phosphor that absorbs blue light and re-emits yellow or green light, with one portion of the blue light passing through the phosphor carrier. The red light from the (equal) red LED passes through the yellow/green phosphor while undergoing less or no absorption' to cause the lamp to emit a combination of white light of blue, yellow/green and red light. In still other embodiments having a blue LED and a red LED, the phosphor carrier can include a yellow/green phosphor and a red phosphor to aid in the red component of the illumination and to assist in dispersing the LED light. In some embodiments, the LEDs can comprise two groups, with one LED group interconnected in a first series string and another LED group interconnected in a second series string. This situation is only one of many ways in which the LEDs can be interconnected' and it should be understood that the LEDs can be configured in many different combinations of parallel and series interconnections. In some embodiments, a lamp in accordance with the present invention can emit light having a high color rendering index (CRI) such as 8 〇 or higher. In some other embodiments the 'lights can emit light having a CRI of 90 or higher. The lamp can also produce light with a correlated color temperature (CCT) from 2500 K to 3500 K. In other embodiments, the light may have a CCT from 2700 K to 3300 K. In other embodiments 154501.doc -17-201202627, the light may have a CCT from about 2725 K to about 3045 K. In some embodiments, the light can have a CCT of about 2700 K or about 3000 K. In still other embodiments of light tunable, the CCT can be reduced by dimming. In this case, the CCT can be reduced to as low as 1500 K or even as high as 1200 K. In an embodiment, the CCT can be increased by dimming. Depending on the embodiment, other output spectral characteristics can be varied based on dimming. It should be noted that other configurations of LEDs can be used with embodiments of the present invention. The same number of LEDs of each type can be used, and the LED package can be configured with varying patterns. A single led of each type can be used. Additional LEDs that produce extra color light can be used. The CRI of the illumination unit can be increased by using one or more LEDs emitting one or more additional colors and/or wavelength converting materials comprising one or more additional phosphors or luminescent materials. The luminescent material can be used with all LED modules. A single luminescent material can be used with multiple LED dies and multiple LED dies can be included in one, some or all of the LED device packages. A more detailed example of the use of a group of lEDs that emit light of different wavelengths to produce a white light in the continuum can be found in the issued U.S. Patent No. 7,213,940, which is incorporated herein by reference. Some of the lamp embodiments in accordance with the present invention can include the first solid state illuminator group and the first illuminant group of the first luminescent material group including at least one luminescent material. The lamps also include a second group of solid state illuminators, wherein the second group of solid state illuminators includes at least a solid state illuminator and at least a first power line. Each of the solid state illuminators in the first solid state illuminator group and the second solid state illuminator group can be electrically connected to the first power line. Each of the solid state illuminators in the first illuminator group emits light having a dominant wavelength in the range of 430 nm to 480 nm when illuminated by 154501.doc 201202627. Each of the first luminescent material groups, when excited, emits light having a dominant wavelength in the range of from about 555 nm to about 585 nm. Each of the solid state illuminators in the second set of solid state illuminators emits light having a dominant wavelength in the range of 600 nm to 630 nm when illuminated. If a current is applied to the first power line, in the absence of any additional light, a combination of the following will produce a mixture of light having a y, y coordinate on the 1931 CIE chromaticity diagram: (1) from the first solid state Light emitted by the illuminator group leaving the illumination device, (2) light emitted by the first illuminant group exiting the illumination device, and (3) emitted from the second solid state illuminator group leaving the illumination device Light. The coordinates define a point that lies within ten MacAdam ellipses of at least one point on the black body locus on the 丨93丨cie chromaticity diagram. This combination of light also produces a sub-mixture of light having X, 丫 color coordinates. The < 乂 color coordinates define a point on the 1931 CIE chromaticity diagram from the first point, the second point, the third point, the first The first, second, third, fourth and fifth connecting line segments defined by the four points and the fifth point are enclosed. The first point may have an X' y coordinate of 0.32, 〇_4〇, 帛: the point may have x, y coordinates 〇36, 0.48', the third point may have x, y coordinates 〇.43〇45, and the fourth point may have The coordinates are 0.42, 0·42, and the fifth point can have χ, the y coordinate is published, 〇38. The present invention also provides an LED lamp having features of a relative geometry, such as a curry dissipating device or a heat sink, the features of the (4) geometry permitting the lamp emission pattern to be incorporated herein by reference. The "Invitation 1 £5", which was amended on March 22, 2010, is abbreviated to the requirements of {ENERGY STAR® Program Requirements fn τ
ments for Integral LED 154501.doc •19· 201202627 /7 )」之要求。戎等相對幾何形狀允許光在〇。至135。之 平均值的20 /〇内分散,同時總發光通量之大於處在135。 至180。區中(在〇。、45。及9〇。方位角下量測)。相對幾何形 狀包括LED裝配件安裝寬度、高度、熱耗散器件寬度及唯 一向下斜切角。組合球體形磷光體載體或反射伞及擴散器 圓頂’該等幾何形狀將纟許光按此等嚴格的能源之星⑧要 求分散。本發明可減小使LED及電力電子器件熱能耗散所 需之表面積’且仍允許燈遵照ANSIA19燈輪靡。 本發明亦提供具有增強之發射效率之燈,其中根據本發 明之一些燈以65流明/瓦特(lpw)或65流明/瓦特以上之效 率發射。在其他實施例中’燈可以8〇 LPW或8〇 Lpw以上 之效率發光。在所有此等實施例中,燈可發射具有更合需 要之色溫(例如’ 3000 κ或3〇〇〇 κ以下,或在一些實施例 中,2700 Κ或2700 Κ以下)及更合需要之演色性指數(例 如,90或大於90之CRI)的光。 根據本發明之一些燈實施例可發射7〇〇流明或大於7〇〇流 明之光’而其他燈實施例可發射750流明或大於750流明之 光。另外其他燈實施例可發射8〇〇流明或大於800流明,其 中此等燈實施例中之一些燈實施例以丨〇瓦特或丨〇瓦特以下 發射此光。此等發射可提供所要亮度,同時提供以下額外 優點:能夠通過針對以小於1 〇 W的功率操作之燈的較不嚴 格之法規(例如,能源之星⑧)測試。此情形可導致可較快 引入市場之燈。此發射效率可為許多因素之結果,諸如: 散熱片之最大化鰭片面積、導致最小量之光被阻擂的最佳 154501.doc -20· 201202627 化光學器件,及使用遠端轉換材料,該遠端轉換材料可導 致比具有保形塗佈之轉換材料之發光器高的效能(8〇流明/ 瓦特或大於80流明/瓦特)。雖然實施例可包括具有保形塗 佈之波長轉換材料的發光器。因此,根據本發明之態樣之 照明單元的實施例可用以提供標準白熾60瓦特白熾燈泡的 基於LED之替換A-燈,該基於LED之替換A_燈可滿足能源 之星⑧效能要求。其他實施例可提供較高瓦特數白熾燈泡 (諸如,標準75瓦特或1〇〇瓦特白熾A19燈泡)之LED替換A-燈照明單元。在其他實施例中,該照明單元可替換標準4〇 瓦特白熾A19燈泡。根據本發明之態樣之照明單元的其他 實施例可用以替換其他標準形狀之白熾燈或螢光燈。 不同燈實施例亦可包含經配置以使得燈展現出相對較長 壽命之組件。在一些實施例中,壽命可為25,〇〇〇小時或 25,000小時以上,而在其他實施例中壽命可為⑽,〇⑽小 時或4G,_小時以上m卜其他實施射,壽命可為 5〇,〇〇〇小時或50,_小時以上。此等延長之壽命可能係在 (例如W流明/瓦特或80流明/瓦特以上之操作效率下且 可能處於不同溫度(諸如,抑及/或45。〇下。此壽命可使 用諸f不同方法來。第—種方法可為簡單地使該等燈 在其壽P内作’直至該等燈出故障為止。然巾此情形 可能常常需要延長之時間週期,從而使此方法在特定情況 下:實際。另一種可接受之方法為:#由使用燈中所使用 、生芮捤供牛之哥叩來5十异燈壽命。此資訊常常係由組件製 以料供’且常常列出在不同操作條件(諸如,溫度)下之 154501.doc -21 - 201202627 操作壽命。可接著佶用 已知方法利用此資料計算燈之壽 畎。第二種可接受之方沬 ^ 法為.藉由在升高之條件下(諸 如=南溫度或升高之電力或切換信號)操作燈而加速燈 之哥叩。此情形可造成較早燈故障,接著按已知方法利用 此資料判定在正常操作條件下燈之操作壽命。 本發明之不同實施例亦可包含安全特徵,該等安全特徵 保護特定電特徵或元件以免衫電特徵或元件在擴散器圓 頂及麟光體球體中之一者或兩者破裂的情況下曝露。此等 安全特徵可減少及/或消除由於與此等電特徵接觸而引起 的觸電之危險’且在一些實施例中,此等安全特徵可包含 覆蓋該等電特徵之電絕緣材料之不同配置。The requirements for ments for Integral LED 154501.doc •19· 201202627 /7 ). The relative geometry of 戎 allows the light to linger. To 135. The average value is dispersed within 20 / ,, while the total luminous flux is greater than 135. To 180. In the zone (in 〇., 45. and 9〇. Measurement under azimuth). The relative geometry includes LED assembly mounting width, height, heat dissipation device width, and a unique downward chamfer angle. Combining a spherical phosphor carrier or a reflecting umbrella and a diffuser dome these geometries will disperse the light in accordance with these strict ENERGY STAR 8 requirements. The present invention reduces the surface area required to dissipate thermal energy from LEDs and power electronics' and still allows the lamp to comply with ANSI A19 lamp rims. The present invention also provides a lamp having enhanced emission efficiency wherein some of the lamps in accordance with the present invention emit at a efficiency of 65 lumens per watt (lpw) or more than 65 lumens per watt. In other embodiments, the lamp can illuminate at an efficiency of 8 〇 LPW or more than 8 〇 Lpw. In all of these embodiments, the lamp can emit a more desirable color temperature (eg, '3000 κ or less, or in some embodiments, 2700 Κ or less than 2700 )) and more desirable color renderings. Light with a sex index (eg, 90 or greater than 90 CRI). Some lamp embodiments in accordance with the present invention can emit 7 lumens or more than 7 lumens of light' while other lamp embodiments can emit 750 lumens or greater than 750 lumens of light. Still other lamp embodiments can emit 8 lumens or more than 800 lumens, some of which are emitted below watts or watts. These emissions provide the desired brightness while providing the additional advantage of being able to pass the less stringent regulations (eg, Energy Star 8) for lamps operating at less than 1 〇 W. This situation can result in a light that can be introduced to the market faster. This emission efficiency can be the result of a number of factors, such as: the fin area that maximizes the fin area, and the best amount of light to be blocked. 154501.doc -20· 201202627 Vision optics, and the use of remote conversion materials, The distal conversion material can result in higher performance (8 〇 lumens per watt or greater than 80 lumens per watt) than an illuminator having a conformally coated conversion material. Although embodiments may include an illuminator having a conformal coated wavelength converting material. Thus, embodiments of the lighting unit in accordance with aspects of the present invention can be used to provide an LED-based replacement A-lamp of a standard incandescent 60 watt incandescent bulb that meets the ENERGY STAR 8 performance requirements. Other embodiments may provide LED replacement A-light illumination units for higher wattage incandescent bulbs, such as standard 75 watt or 1 watt incandescent A19 bulbs. In other embodiments, the lighting unit can replace a standard 4 watt wattled incandescent A19 bulb. Other embodiments of the lighting unit in accordance with aspects of the present invention can be used to replace other standard shaped incandescent or fluorescent lamps. Different lamp embodiments may also include components configured to cause the lamp to exhibit a relatively long life. In some embodiments, the lifetime may be 25, 〇〇〇 hours or more than 25,000 hours, while in other embodiments the lifetime may be (10), 〇 (10) hours or 4G, _ hours or more, other implementations, and the lifetime may be 5 〇, 〇〇〇 hours or 50, _ hours or more. Such extended life may be at operating efficiencies (eg, W lumens per watt or 80 lumens per watt and may be at different temperatures (such as, for example, / or 45. 〇. This life may be used in different ways) The first method may be to simply "make the lamps " in their lifetime P until the lamps fail. However, this situation may often require an extended period of time, thereby making the method in a particular situation: actual Another acceptable method is: #Used by the lamp, the oysters are used for the life of the cows. The information is often made from components and is often listed in different operations. Under the conditions (such as temperature) 154501.doc -21 - 201202627 operating life. Can be used to calculate the life of the lamp using known methods. The second acceptable method is to use Operating the lamp under high conditions (such as = south temperature or elevated power or switching signals) to accelerate the lamp. This situation can cause an earlier lamp failure, and then use this data to determine under normal operating conditions according to known methods. Operating life of the lamp Different embodiments of the present invention may also include security features that protect particular electrical features or components from exposure to electrical characteristics or components that may rupture in one or both of the diffuser dome and the spheroidal sphere. These security features may reduce and/or eliminate the risk of electric shock due to contact with such electrical features' and in some embodiments, such security features may include different configurations of electrically insulating materials covering the electrical features .
本發明提供允許以-簡單且相對便宜之配置達成長壽命 及有效率操作的特徵及特性H纟1合。燈可請流明/ 瓦特或大於80流明/瓦特之效能操作,同時仍產生8〇及高 於80或90及高於90的CRIe在一些實施例中,此效能可: 小於10瓦特下達成。此情形可提供於以下燈中:具有作為 其光源之LED及雙圓頂擴散器及轉換材料配置,同時仍裝 設於A19大小燈泡殼中且發射遵照能源之星⑧要求之均勻 光分佈的燈。具有此配置之燈亦可發射具有3〇〇〇 κ及3〇〇〇 K 以下或2700 Κ或2700 Κ以下之溫度的光。 本文中參考特定貫施例來描述本發明,但應理解,本發 明可以許多不同形式來體現且不應被解釋為限於本文中所 闡述之實施例。詳言之,在下文關於具有呈不同組態之一 個或多個LED或LED晶片或LED封裝的特定燈來描述本發 154501.doc -22- 201202627 明,但應理解,本發明可用於具有許多不同組態之許多其 他燈。下文之實施例係參考一或多個LED進行描述,但應 理解,此情形意欲涵蓋LED晶片及LED封裝。組件可具有 除所展示之彼等形狀及大小之外的不同形狀及大小,且可 包括不同數目個LED。亦應理解,下文所描述之實施例利 用共平面光源’但應理解,亦可使用非共平面光源。亦應 理解’燈之LED光源可包含一個或多個LED,且在具有一 個以上LED之實施例中,該等LED可具有不同之發射波 長。類似地,一些LED可具有鄰近或接觸之磷光層或區, 而其他LED可具有鄰近的不同組成之磷光層抑或根本不具 有鱗光層β 本文中參考轉換材料、波長轉換材料、遠端磷光體、磷 光體、磷光層及相關術語來描述本發明。此等術語之使用 不應被解釋為限制性的。應理解,術語「遠端磷光體」、 「磷光體」或「磷光層」之使用意欲涵蓋所有波長轉換材 料且同等地適用於所有波長轉換材料。 本文中所描述之實施例中之一些實施例包含一遠端磷光 體及一單獨遠端擴散器配置,其中一些實施例呈雙圓頂配 置。應理解,在其他實施例中,可能存在一具有轉換性質 與擴散性質兩者之單一圓頂狀結構,或可能存在具有轉換 材料與擴散器之不同組合的兩個以上圓頂。轉換材料及擴 散器:提供於各別圓頂中,或轉換材料及擴散器可一起處 於該等圓頂中之-或多者上。術語「11頂」不應被解釋為 『於任何特疋形狀。該術語可涵蓋許多不同的三維形狀, 154501.doc -23- 201202627 包括(但不限於)子彈形或球體形,或細長形。 本文中參考轉換材料來描述本發明,磷光層及磷光體載 體及擴散器位於彼此之遠端。在此内容脈絡中,遠端係沪 彼此間隔開及/或並未直接熱接觸。應進一步理解,合i 述主波長時,存在圍繞主波長之波長範圍或寬度,以使得 當論述主波長時,本發明意欲涵蓋在彼波長周圍之波長範 圍。 & 亦應理解,當諸如層、區或基板之元件被稱作「在」另 元件「上」時,其可直接在另一元件上或亦可存在介入 元件。此外,諸如「内」、「外」、「上」、「上方」、「下、 之下」及「下方」的相關術語及類似術語在本文中可用 以描述一層或另一區之關係。應理解,此等術語意欲涵蓋 諸圖中所描繪之定向以及器件之其他不同定向。 雖然在本文中可使用術語第一、第二等來描述各種元 件、組件、區、層及/或區段,但此等元件、組件、區、 層及/或區段不應受此等術語限制。此等術語僅用以區分 一元件、組件、區、層或區段與另一區、層或區段。因 此在不脫離本發明之教示的情況下’可將下文所論述之 第一元件、組件、區、層或區段稱為第二元件、組件、 區、層或區段。 本文中參考為本發明之實施例的示意性說明的橫截面圖 說明來描述本發明之實施例。因而,層之實際厚度可為不 同的’且預期到由於(例如)製造技術及/或公差而存在相對 於說明之形狀的差異。本發明之實施例不應被解釋為限於 154501.doc • 24· 201202627 本文中所說明之區之特定形狀,而是將包括由(例如)製造 而造成的形狀偏差。說明或描述為正方形或矩形之區將歸 因於正常製造公差而通常具有圓化或彎曲之特徵。因此, 圖中所說明之區本質上為示意性的且其形狀並不意欲說明 器件之區之精確形狀且並不意欲限制本發明之範疇。 圖4展示根據本發明之燈5〇的一實拖例,其包含具有光 學腔54之散熱片結構52 ’該光學腔54具有用於固持光源58 之平台56。雖然下文中參考光學腔來描述此實施例及一些 實紅例’但應理解’可提供無光學腔之許多其他實施例。 此等實施例可包括(但不限於)光源在燈結構之平面表面上 或在基座上。光源58可包含許多不同發光器,其中所展示 之貫靶例包含一 LED。可使用許多不同之市售led晶片或 led封裝’包括(但不限於)可購自位於N〇rth Car〇Hna, Durham之Cree,lnc·的LED晶片或LED封裝。應理解,可提 供無光學腔之燈貫施例,其中在此等其他實施例中LED係 以不同方式來安裝。以實例說明,光源可安裝至燈中之平 面表面’或可提供用於固持LED之基座。 可使用許多不同之已知安裝方法及材料將光源58安裝至 平台56,其中來自光源58之光自空腔54之頂部開口發射 出。在-些實施例中,光源58可直接安裝至平台%,而在 其他實施例中,可將光源包括於子基板或印刷電路板 (PCB)上’接著將該子基板或印刷電路板(pcB)安裝至平台 56。平台56及散熱片結構52可包含用於將電信號施加至光 源58的導電路徑,纟中該料電路徑中之—些為導電跡線 154501.doc -25- 201202627 L :線。平台56之部分亦可由導熱材料製成,且在-些實 例中’在操作期間產生之熱可散佈至平台且接著散佈至 散熱片結構。 .:、片結構52可至少部分包含一導熱材料,且可使用包 /同金屬(諸如,銅或鋁)或金屬合金之許多不同的導熱 “料鋼可具有高達400 W/m-k或400 W/m-k以上之熱導 率一些實施例中,散熱片可包含高純度鋁,高純度鋁 m·下可具有約2 1 〇 W/m_k之熱導率。在其他實施例 中散熱片結構可包含壓鑄鋁,壓鑄鋁具有約2〇〇 w/m_k …、導率。散熱片結構52亦可包含其他熱耗散特徵(諸 如,散熱縛片60),該等其他熱耗散特徵增加散熱片之表 面積以促進更有效率地耗散至環境中。在一些實施例中, 散熱鰭片60可由具有比散熱片之剩餘部分高的熱導率之材 料製成。在所展示之實施例中,以大體上水平定向來展示 鰭片60,但應理解,在其他實施例中,該等鰭片可具有垂 直或成角度定向。在另外其他實施例中,散熱片可包含主 動冷卻元件(諸如,風扇)以降低燈内之對流熱阻。在一些 實施例中,自磷光體载體之熱耗散係經由對流熱耗散與經 由散熱片結構52之傳導的組合來達成。不同熱耗散配置及 結構描述於Tong等人之題為「LED Lamp Inc〇rp〇ratingThe present invention provides features and characteristics that allow for long life and efficient operation in a simple and relatively inexpensive configuration. The lamp can be operated with lumens per watt or greater than 80 lumens per watt while still producing 8 turns and CRIe above 80 or 90 and above 90. In some embodiments, this performance can be achieved at less than 10 watts. This situation can be provided in a lamp that has an LED as its light source and a dual dome diffuser and conversion material configuration while still being mounted in an A19 size bulb and emitting a uniform light distribution that meets the requirements of Energy Star 8. . Lights with this configuration can also emit light with temperatures below 3 κ κ and 3 〇〇〇 K or at temperatures below 2700 Κ or 2700 。. The invention is described herein with reference to a particular embodiment, but it is understood that the invention may be embodied in many different forms and should not be construed as being limited to the embodiments set forth herein. In particular, the present invention is described below with respect to a particular lamp having one or more LED or LED wafers or LED packages in different configurations, but it should be understood that the invention can be used with many Many other lights of different configurations. The following examples are described with reference to one or more LEDs, but it should be understood that this scenario is intended to encompass LED wafers and LED packages. The components can have different shapes and sizes than those shown and can include a different number of LEDs. It should also be understood that the embodiments described below utilize coplanar light sources' but it should be understood that non-coplanar light sources can also be used. It should also be understood that the LED light source of the lamp may comprise one or more LEDs, and in embodiments having more than one LED, the LEDs may have different emission wavelengths. Similarly, some LEDs may have phosphor layers or regions adjacent or in contact, while other LEDs may have adjacent phosphor layers of different compositions or no scale layers at all. Reference conversion materials, wavelength converting materials, remote phosphors herein. The phosphors, phosphor layers, and related terms are used to describe the invention. The use of these terms should not be construed as limiting. It should be understood that the use of the terms "distal phosphor," "phosphor," or "phosphor layer" is intended to encompass all wavelength converting materials and is equally applicable to all wavelength converting materials. Some of the embodiments described herein include a distal phosphor and a separate distal diffuser configuration, some of which are in a dual dome configuration. It should be understood that in other embodiments, there may be a single dome-like structure having both conversion and diffusion properties, or there may be more than two domes having different combinations of conversion material and diffuser. Conversion material and diffuser: provided in separate domes, or the conversion material and diffuser may be together in one or more of the domes. The term "11" should not be interpreted as "in any particular shape." The term can cover many different three-dimensional shapes, 154501.doc -23- 201202627 including but not limited to bullet or sphere, or elongated. The invention is described herein with reference to a conversion material in which the phosphor layer and the phosphor carrier and diffuser are located at the distal end of each other. In this context, the distal ends are spaced apart from each other and/or are not in direct thermal contact. It will be further understood that when the dominant wavelength is referred to, there is a range or width of wavelengths around the dominant wavelength such that when discussing the dominant wavelength, the invention is intended to cover the wavelength range around the wavelength. It is also understood that when an element such as a layer, region or substrate is referred to as "on" another element, it can be directly on the other element or the intervening element can also be present. In addition, terms such as "inside", "outside", "upper", "above", "lower", "lower" and "lower" are used herein to describe the relationship of one layer or another. It is to be understood that the terms are intended to encompass the orientations depicted in the drawings and the various aspects of the embodiments. Although the terms first, second, etc. may be used to describe various elements, components, regions, layers and/or sections, these elements, components, regions, layers and/or sections are not to be limit. The terms are only used to distinguish one element, component, region, layer or section from another. The first element, component, region, layer or section discussed below may be referred to as a second element, component, region, layer or section, without departing from the teachings of the invention. Embodiments of the invention are described herein with reference to the cross- Thus, the actual thickness of the layers can be different' and it is contemplated that there may be differences in shape relative to the description due to, for example, manufacturing techniques and/or tolerances. The embodiments of the present invention should not be construed as being limited to the particular shapes of the regions described herein as 154501.doc • 24·201202627, but will include shape variations caused by, for example, manufacturing. Areas illustrated or described as square or rectangular will typically have rounded or curved features due to normal manufacturing tolerances. The area illustrated in the figures is, therefore, in the nature of the invention, and is not intended to limit the scope of the invention. 4 shows a real example of a lamp 5'' according to the present invention comprising a heat sink structure 52' having an optical cavity 54 having a platform 56 for holding a light source 58. Although this embodiment and some of the real red cases are described hereinafter with reference to optical cavities, it should be understood that many other embodiments without optical cavities may be provided. Such embodiments may include, but are not limited to, a light source on a planar surface of the lamp structure or on a pedestal. Light source 58 can include a number of different illuminators, with the illustrated target example comprising an LED. A number of different commercially available LED wafers or led packages can be used including, but not limited to, LED chips or LED packages available from Cree, Lnc, N.Rth Car〇Hna, Durham. It will be appreciated that a lampless embodiment can be provided without the optical cavity, wherein in other embodiments the LEDs are mounted in different ways. By way of example, the light source can be mounted to a flat surface in the lamp' or a susceptor for holding the LED can be provided. Light source 58 can be mounted to platform 56 using a number of different known mounting methods and materials, with light from source 58 being emitted from the top opening of cavity 54. In some embodiments, the light source 58 can be mounted directly to the platform %, while in other embodiments, the light source can be included on a sub-substrate or printed circuit board (PCB) 'and then the sub-substrate or printed circuit board (pcB) ) is mounted to platform 56. The platform 56 and heat sink structure 52 can include a conductive path for applying an electrical signal to the light source 58, some of which are conductive traces 154501.doc -25 - 201202627 L : line. Portions of the platform 56 may also be made of a thermally conductive material, and in some instances the heat generated during operation may be spread to the platform and then spread to the heat sink structure. The sheet structure 52 may comprise at least a portion of a thermally conductive material, and a plurality of different thermally conductive "materials of the package/same metal (such as copper or aluminum) or metal alloy may have up to 400 W/mk or 400 W/. Thermal Conductivity Above mk In some embodiments, the heat sink may comprise high purity aluminum, and the high purity aluminum may have a thermal conductivity of about 2 1 〇W/m_k. In other embodiments the heat sink structure may comprise die casting Aluminum, die cast aluminum has a conductivity of about 2 〇〇 w/m y ... , and the heat sink structure 52 may also include other heat dissipation features (such as heat sink tabs 60 ) that increase the surface area of the heat sink. To promote more efficient dissipation into the environment. In some embodiments, the heat sink fins 60 can be made of a material having a higher thermal conductivity than the remainder of the heat sink. In the illustrated embodiment, generally The upper horizontal orientation is to show the fins 60, but it should be understood that in other embodiments, the fins may have a vertical or angular orientation. In still other embodiments, the heat sink may comprise an active cooling element (such as a fan). To reduce the convective heat in the lamp In some embodiments, the heat dissipation from the phosphor carrier is achieved via a combination of convective heat dissipation and conduction through the heat sink structure 52. Different heat dissipation configurations and structures are described in Tong et al. "LED Lamp Inc〇rp〇rating
Remote Phosphor with Heat Dissipation Features and Diffuser Element」之美國專利申請案第61/339 5i6號中, 該申請案亦讓與給Cree,Inc·且以引用的方式併入本文中。 反射層53亦可包括在散熱片結構52上,諸如,在光學腔 15450I.doc -26· 201202627 54之表面上。在不具有光學腔之彼等實施例中,可包括在 光源周圍之反射層。在一些實施例中,表面可塗佈有對由 光源58及/或波長轉換材料發射之光(「燈光」)的燈可見波 長具有約75。/。或更多之反射率的材料,而在其他實施例 中,該材料對燈光可具有約85%或85%以上之反射率。在 另外其他實施例中’材料對燈光可具有約95%或95〇/〇以上 之反射率。 散熱片結構52亦可包含用於連接至電源(諸如,連接至 不同電插座)之特徵。在-些實施例中,散熱片結構可包 含用以裝設於習知電插座中之類型的特徵。舉例而言,散 熱片結構可包括用於安裝至標準螺紋旋座之特徵,該特徵 可包含可擰緊至螺紋旋座中的螺紋部分。在其他實施例 中,散熱片結構可包括標準插塞且電插座可為標準插口, 或散熱片結構可包含GU24底座單元,或散熱片結構可為 夾片且電插座可為接納並保持夾片的插座(例如,如許多 螢光燈中所使用此等僅為散熱片結構及插座之選項中 的少許,且亦可使用安全地將電自插座遞送至燈5〇的其他 配置。 根據本發明之燈可包含電源供應器或電力轉換單元,該 電源供應器或電力轉換單元可包含驅動器以允許燈泡由 AC線路電壓/電流供電且提供光源調光能力。在一些實施 例中’電源供應器可收容於燈散熱片(下文在圖42中所展 示之一實施例)内之空腔/外殼中,電源供應器可包含使用 非隔離之準諧振返馳拓撲之離線恆定電流LED驅動器。 154501.doc •27· 201202627 LED驅動器可裝設於燈内,且在一些實施例中,LED驅動 器可包含25立方公分或小於25立方公分之體積,而在其他 貫施例中’ LED驅動器可包含約22立方公分或小於22立方 公分之體積,且在另外其他實施例中,LED驅動器可包含 20立方公分或小於20立方公分之體積。在一些實施例中, 電源供應器可為非可調光的’但成本較低。應理解,所使 用之電源供應器可具有不同拓撲或幾何形狀,且亦可為可 調光的。具有調光器之實施例可展現出許多不同調光特 性,諸如,可向下相切調光至5%(前邊緣與後邊緣兩者)。 在根據本發明之一些調光電路中,藉由減少至LEE)之輸出 電流而實現調光。 電源供應器單元可包含以許多不同方式配置於印刷電路 板上之許多不同組件。電源供應器可自許多不同電源操作 且可展現出許多不同的操作特性。在一些實施例中,電源 供應器可經配置以自120伏特交流電(VAC)土10%信號操 作,同時提供大於200毫安(mA)及/或大於1〇伏特(V)之光 源驅動信號。在其他實施例中,驅動信號可能為大於3〇〇 及/或大於15 V ^在一些實施例中,驅動信號可能為約4〇〇 mA及/或約22 V。 電源供應器亦可包含允許電源供應器以相對較高等級之 效率操作的組件。效率之一量測可能為至電源供應器的輸 入能量之實際上作為光自燈光源輸出的百分比。大量能量 可能經由電源供應器之操作而損失。在一些燈實施例中, 電源供應器可操作以使得至電源供應器之輸入能量之丨〇 〇/。 154501.doc •28· 201202627 以上作為來自LED之絲射或輸^。在其他實施例中,輸 入此里之15%以上作為LED光輸出。在另外其他實施例 中,約17.5%之輸入能量作為LED光輸出,且在其他實施 例中,約18%或大於1 80/〇之輸入能量作為LED光輸出。 可在電源供應器周圍包括熱封灌(thermal p〇tting)材料或 其他合適之導熱材料,以用於進行保護且輔助使熱輻射離 開電源供應器組件。在電源供應器處於散熱片空腔中之實 施例中,熱封灌材料可填充該空腔之全部或部分以使得熱 封灌材料環繞電源供應器。可使用展現出以下各特性中之 一些特性或全部特性的許多不同的導熱材料:安全的、電 絕緣的、導熱的、具有低熱膨脹的,及具有足夠黏性使得 材料在固化之前不會從散熱片空腔中之裂紋漏出。一些實 施例可使用包含環氧樹脂及玻璃纖維的膠埋化合物,諸 如,可自Dow Corning,Inc購得者。 包括在空腔54之頂部開口之上的磷光體載體62,且包括 在磷光體載體62之上的圓頂形擴散器76。在所展示之實施 例中,磷光體載體覆蓋整個開口,且空腔開口經展示為圓 形的且麟光體載體62為圓盤。應理解,空腔開口及璃光體 載體可為許多不同形狀及大小。亦應理解,填光體載體62 可不覆蓋整個空腔開口。如下文進一步描述,擴散器76經 配置以將來自磷光體載體及/或LED之光分散成所要燈發射 圖案’且擴散器76可取決於其所接收之光及所要燈發射圖 案而包含許多不同形狀及大小。 可將根據本發明之磷光體載體的實施例特徵化為包含一 154501.doc -29· 201202627 轉換材料及導熱透光材料’但應理解,亦可提供不導熱之 磷光體載體。該透光材料可對於自光源58發射之光透明, 且該轉換材料應為吸收來自光源之波長之光且重新發射不 同波長之光的類型。在所展示之實施例中,導熱透光材料 包含一載體層64,且轉換材料包含磷光體载體上之磷光層 66。如下文進一步描述,不同實施例可包含導熱透光材料 及轉換材料之許多不同配置。 當來自光源58之光被璃光層66中之磷光體吸收時,光在 各向同性方向上被重新發射’其中約5〇〇/0之光係向前發射 且50。/。之光係向後發射至空腔54中。在具有保形填光層之 先前LED中,向後發射之光之顯著部分可被導引回至lED 中且光逃逸之可能性受LED結構之提取效率限制。對於一 些LED,提取效率可為約70。/。,因此自轉換材料導引回至 LED中之光的某百分比可能損失。在根據本發明之具有遠 端磷光體組態之燈中,LED位於空腔54之底部處的平台56 上,向後之磷光體光中之較高百分比的光撞擊空腔之表面 而非LED »對此等表面塗佈以反射層53增加了反射回至鱗 光層66(在碌光層66處,光可自燈發射)中之光之百分比。 此等反射層53允許光學腔使光子有效地再循環,且增加燈 之發射效率。應理解,反射層可包含許多不同材料及結 構’包括(但不限於)反射金屬或多層反射結構(諸如,分佈 式Bragg反射器)。在不具有光學腔之彼等實施例中,亦可 包括在LED周圍之反射層。 載體層64可由具有0.5 W/m-k或0.5 W/m-k以上之熱導率 154501.doc •30- 201202627 的許多不同材料製成,諸如石英、碳化矽(SiC)(熱導率為 〜120 W/m-k)、玻璃(熱導率為1·〇-ΐ·4 w/m-k)或藍寶石(熱 導率為〜40 W/m-k)。在其他實施例中,載體層64可具有大 於1.0 W/m-k之熱導率’而在其他實施例中,其可具有大 於5.0 W/m-k之熱導率。在另外其他實施例中,載體層M 可具有大於10 W/m-k之熱導率。在一些實施例中,載體層 可具有在1.4 W/m-k至10 W/m-k之範圍内的熱導率。碟光 體載體亦可視所使用之材料而具有不同厚度,其中合適之 厚度圍為0.1 mm至10 mm或10 mm以上。應理解,亦可 視用於載體層之材料之特性而使用其他厚度。材料應厚得 足以針對特定操作條件提供足夠的橫向散熱。大體而言, 材料之熱導率愈高,材料可能愈薄,同時仍提供必 执 耗散。不同因素可影響使用哪種載體層材料,不同因素包 括(但不限於)成本及對光源光之透明度。一些材料亦可能 更適合於較大直徑,諸如玻璃或石英。藉由在較大直徑之 載體層上形成磷光層且接著將載體層單切(singulati〇n)成 較小載體層,此等材料可提供降低之製造成本。在一些實 施例中,磷光體載體可包含聚合物或塑膠材料,其中磷光 體塗佈於磷光體載體之内表面及/或外表面上及/或嵌入於 或混合於聚合物或塑膠中。 許多不同磷光體可用於磷光層66中,其中本發明特別適 應於發射白光之燈。如上文所描述,在一些實施例中,光 源58可為基於LED之光源且可發射藍色波長光譜之光。磷 光層可吸收一些藍光且重新發射黃光。此情形允許燈發射 154501.doc •31 - 201202627 藍光與黃光之白光組合。在一些實施例中,藍色LED光可由 使用市售YAG:Ce磷光體之黃色轉換材料來轉換,但使用 由基於(Gd,Y)3(Al,Ga)5〇12:Ce 系統(諸如,Y3A150丨2:Ce(YAG)) 之磷光體製成之轉換粒子,可能獲得全範圍之寬廣黃光光 譜發射。可用於在與基於藍色發光LED之發光器一起使用 時產生白光的其他黃色磷光體包括(但不限於):U.S. Patent Application Serial No. 61/339, filed on Jan. No. No. No. No. No. No. No. No. No. No. No. Reflective layer 53 can also be included on heat sink structure 52, such as on the surface of optical cavity 15450I.doc -26·201202627 54. In embodiments that do not have an optical cavity, a reflective layer around the source can be included. In some embodiments, the surface may be coated with a visible wavelength of about 75 for the light emitted by the source 58 and/or the wavelength converting material ("light"). /. Or more reflective material, while in other embodiments, the material may have a reflectivity of about 85% or more for the light. In still other embodiments, the material may have a reflectivity of about 95% or more. The heat sink structure 52 may also include features for connection to a power source, such as to a different electrical outlet. In some embodiments, the heat sink structure can include features of the type for mounting in conventional electrical sockets. For example, the heat sink structure can include features for mounting to a standard threaded seat that can include a threaded portion that can be screwed into the threaded seat. In other embodiments, the heat sink structure may comprise a standard plug and the electrical socket may be a standard socket, or the heat sink structure may comprise a GU24 base unit, or the heat sink structure may be a clip and the electrical socket may receive and hold the clip The socket (for example, as used in many fluorescent lamps, is only a few of the options for the heat sink structure and the socket, and other configurations that safely deliver electricity from the socket to the lamp 5 can also be used. The light may include a power supply or power conversion unit that may include a driver to allow the light bulb to be powered by the AC line voltage/current and provide light source dimming capability. In some embodiments, the power supply may In a cavity/housing housed within a lamp heat sink (hereinafter one of the embodiments shown in Figure 42), the power supply can include an off-line constant current LED driver using a non-isolated quasi-resonant flyback topology. 154501.doc • 27· 201202627 The LED driver can be mounted in the lamp, and in some embodiments, the LED driver can comprise 25 cubic centimeters or less than 25 cubic centimeters. While in other embodiments the 'LED driver can comprise about 22 cubic centimeters or less than 22 cubic centimeters, and in still other embodiments, the LED driver can comprise 20 cubic centimeters or less than 20 cubic centimeters. In some implementations. In an example, the power supply can be non-dimmable 'but at a lower cost. It should be understood that the power supply used can have different topologies or geometries, and can also be dimmable. With a dimmer Embodiments may exhibit many different dimming characteristics, such as down-cutting to 5% (both front and back edges). In some dimming circuits in accordance with the present invention, by reducing to LEE) The output current is used to achieve dimming. The power supply unit can include many different components that are configured on the printed circuit board in many different ways. Power supplies can operate from many different power sources and can exhibit many different operating characteristics. In some embodiments, the power supply can be configured to operate from a 120 volt alternating current (VAC) 10% signal while providing a source drive signal greater than 200 milliamps (mA) and/or greater than 1 volt (V). In other embodiments, the drive signal may be greater than 3 〇〇 and/or greater than 15 V ^. In some embodiments, the drive signal may be about 4 mA and/or about 22 volts. The power supply can also include components that allow the power supply to operate at a relatively high level of efficiency. One measure of efficiency may be the percentage of the input energy to the power supply that is actually the output of the light from the light source. A large amount of energy may be lost through the operation of the power supply. In some lamp embodiments, the power supply is operable to cause an input energy to the power supply. 154501.doc •28· 201202627 The above is a wire shot or a wire from LED. In other embodiments, more than 15% of this is input as LED light output. In still other embodiments, about 17.5% of the input energy is used as the LED light output, and in other embodiments, about 18% or greater than the input energy of the LED light output. A thermal petching material or other suitable thermally conductive material may be included around the power supply for protection and to assist in directing the thermal radiation away from the power supply assembly. In embodiments where the power supply is in the heat sink cavity, the heat sealing material may fill all or part of the cavity such that the heat sealing material surrounds the power supply. Many different thermally conductive materials can be used that exhibit some or all of the following characteristics: safe, electrically insulating, thermally conductive, have low thermal expansion, and have sufficient viscosity so that the material does not dissipate heat before curing. Cracks in the cavity of the sheet leak. Some embodiments may use an embedded compound comprising an epoxy resin and glass fibers, such as those available from Dow Corning, Inc. A phosphor carrier 62 is included over the top opening of the cavity 54 and includes a dome shaped diffuser 76 over the phosphor carrier 62. In the illustrated embodiment, the phosphor carrier covers the entire opening, and the cavity opening is shown as being circular and the rim carrier 62 is a disk. It should be understood that the cavity opening and the glazing carrier can be of many different shapes and sizes. It should also be understood that the fill carrier 62 may not cover the entire cavity opening. As further described below, the diffuser 76 is configured to disperse light from the phosphor carrier and/or LED into a desired lamp emission pattern 'and the diffuser 76 can comprise many different depending on the light it receives and the desired lamp emission pattern. Shape and size. The embodiment of the phosphor carrier according to the present invention can be characterized as comprising a 154501.doc -29·201202627 conversion material and a thermally conductive light transmissive material' but it will be understood that a non-thermally conductive phosphor carrier can also be provided. The light transmissive material may be transparent to light emitted from source 58, and the conversion material should be of a type that absorbs light from the wavelength of the source and re-emits light of different wavelengths. In the illustrated embodiment, the thermally conductive light transmissive material comprises a carrier layer 64 and the conversion material comprises a phosphor layer 66 on the phosphor carrier. As further described below, various embodiments may include many different configurations of thermally conductive light transmissive materials and conversion materials. When the light from the source 58 is absorbed by the phosphor in the glazing layer 66, the light is re-emitted in the isotropic direction' wherein about 5 Å/0 of the light is emitted forward 50. /. The light is emitted back into the cavity 54. In previous LEDs with a conformal fill layer, a significant portion of the back-emitting light can be directed back into the lED and the likelihood of light escaping is limited by the extraction efficiency of the LED structure. For some LEDs, the extraction efficiency can be about 70. /. Therefore, a certain percentage of the light that is directed back to the LED from the conversion material may be lost. In a lamp having a remote phosphor configuration in accordance with the present invention, the LED is located on the platform 56 at the bottom of the cavity 54, with a higher percentage of the backward phosphor light striking the surface of the cavity rather than the LED » The surface coating with the reflective layer 53 increases the percentage of light that is reflected back to the scale layer 66 (at the light layer 66 where light can be emitted from the lamp). These reflective layers 53 allow the optical cavity to effectively recirculate photons and increase the emission efficiency of the lamp. It should be understood that the reflective layer can comprise a number of different materials and structures' including, but not limited to, reflective metal or multilayer reflective structures (such as distributed Bragg reflectors). In embodiments that do not have an optical cavity, a reflective layer around the LED can also be included. Carrier layer 64 may be made of many different materials having a thermal conductivity of 154501.doc • 30-201202627 above 0.5 W/mk or 0.5 W/mk, such as quartz, tantalum carbide (SiC) (thermal conductivity ~120 W/ Mk), glass (thermal conductivity 1·〇-ΐ·4 w/mk) or sapphire (thermal conductivity ~40 W/mk). In other embodiments, carrier layer 64 can have a thermal conductivity greater than 1.0 W/m-k and in other embodiments it can have a thermal conductivity greater than 5.0 W/m-k. In still other embodiments, the carrier layer M can have a thermal conductivity greater than 10 W/m-k. In some embodiments, the carrier layer can have a thermal conductivity in the range of from 1.4 W/m-k to 10 W/m-k. The disc carrier can also have different thicknesses depending on the material used, with a suitable thickness range of 0.1 mm to 10 mm or more. It should be understood that other thicknesses may be used depending on the characteristics of the material used for the carrier layer. The material should be thick enough to provide adequate lateral heat dissipation for specific operating conditions. In general, the higher the thermal conductivity of the material, the thinner the material may be, while still providing the necessary dissipation. Different factors can influence which carrier layer material is used, and different factors include, but are not limited to, cost and transparency to the source light. Some materials may also be more suitable for larger diameters such as glass or quartz. Such materials can provide reduced manufacturing costs by forming a phosphor layer on a larger diameter carrier layer and then singulating the carrier layer into smaller carrier layers. In some embodiments, the phosphor support can comprise a polymeric or plastic material, wherein the phosphor is applied to the inner and/or outer surface of the phosphor support and/or embedded or mixed in the polymer or plastic. A number of different phosphors can be used in the phosphor layer 66, with the invention being particularly suitable for emitting white light lamps. As described above, in some embodiments, light source 58 can be an LED based light source and can emit light of a blue wavelength spectrum. The phosphor layer absorbs some blue light and re-emits yellow light. This situation allows the lamp to emit 154501.doc •31 - 201202627 The combination of blue and yellow light. In some embodiments, the blue LED light can be converted by a yellow conversion material using a commercially available YAG:Ce phosphor, but using a system based on (Gd,Y)3(Al,Ga)5〇12:Ce (such as, The converted particles made of phosphor of Y3A150丨2:Ce(YAG)) may obtain a wide range of broad yellow spectral emission. Other yellow phosphors that can be used to produce white light when used with an illuminator based on a blue LED include, but are not limited to:
Tb3.xREx012:Ce(TAG) ; RE=Y、Gd、La、Lu ;或Tb3.xREx012: Ce(TAG) ; RE=Y, Gd, La, Lu; or
Sr2-x-yBaxCaySi〇4:Eu 〇 磷光層亦可配置有一個以上磷光體,該一個以上磷光體 混合於磷光層66中抑或作為載體層64上之第二磷光層。在 一些貫施例中,該兩個峨光體中之每一者可吸收LED光且 可重新發射不同色彩之光。在此等實施例中,可將來自該 兩個磷光層之色彩組合以用於達成具有不同白色色調之較 南CRI白色(暖白色)。此情形可包括可與來自紅色鱗光體 之光組合的上文之來自黃色磷光體之光。可使用不同紅色 墙光體,包括:The Sr2-x-yBaxCaySi〇4:Eu 磷 phosphor layer may also be provided with more than one phosphor, the one or more phosphors being mixed in the phosphor layer 66 or as the second phosphor layer on the carrier layer 64. In some embodiments, each of the two phosphors can absorb LED light and can re-emit light of a different color. In such embodiments, the colors from the two phosphor layers can be combined to achieve a more recent CRI white (warm white) with a different white hue. This situation may include light from the yellow phosphor above that may be combined with light from a red scale. Different red wall bodies can be used, including:
SrxCabxSiEu,Y ; Y=鹵化物;SrxCabxSiEu, Y; Y=halide;
CaSiAlN3:Eu ;或 Sr2.yCaySi〇4:Eu 其他磷光體可用以藉由將實質上所有光轉換成一特定色 彩而產生彩色發光。舉例而言,以下磷光體可用以產生綠 光:CaSiAlN3:Eu; or Sr2.yCaySi〇4:Eu Other phosphors can be used to produce colored illumination by converting substantially all of the light into a particular color. For example, the following phosphors can be used to produce green light:
SrGa2S4:Eu ;SrGa2S4: Eu;
Sr2-yBaySi〇4:Eu ;或 I54501.doc •32· 201202627Sr2-yBaySi〇4:Eu; or I54501.doc •32· 201202627
SrSi2〇2N2:Eu 〇 下文列出一些額外的適合用作磷光層66之轉換粒子的磷 光體,但可使用其他磷光體。每一磷光體展現在藍色及/ 或UV發光光譜中之激勵’提供一所要峰值發光,具有有 效率的光轉換,且具有可接受之斯托克位移(St〇kes shift): 黃色/綠色 (Sr,Ca,Ba)(Al,Ga)2S4:Eu2+SrSi2〇2N2:Eu 一些 Some additional phosphors suitable for use as the conversion particles of the phosphor layer 66 are listed below, but other phosphors may be used. Each phosphor exhibits excitation in the blue and/or UV luminescence spectrum to provide a desired peak luminescence with efficient light conversion and an acceptable Stokes shift: yellow/green (Sr, Ca, Ba) (Al, Ga) 2S4: Eu2+
Ba2(Mg,Zn)Si2〇7:Eu2+Ba2(Mg,Zn)Si2〇7:Eu2+
Gd〇 46Sr〇.3 1 A1i.23〇XF 1.3 8-EU2 + 0.06 (Bai-x-ySrxCay)Si04:EuGd〇 46Sr〇.3 1 A1i.23〇XF 1.3 8-EU2 + 0.06 (Bai-x-ySrxCay)Si04:Eu
Ba2Si04:Eu2+ 捧雜有Ce〗之LU3AI5O12 摻雜有 Eu2+之(Ca,Sr,Ba)Si202N2 CaSc204:Ce3 + (Sr,Ba)2Si04:Eu2+ 紅色Ba2Si04:Eu2+ is mixed with Ce's LU3AI5O12 doped with Eu2+(Ca,Sr,Ba)Si202N2 CaSc204:Ce3 + (Sr,Ba)2Si04:Eu2+ red
Lu203:Eu3 + (Sr2-xLax)(Cei-xEux)〇4 Sr2Cei.xEux〇4 Sr2-xEuxCe〇4 SrTi03:Pr3 + ,Ga3 +Lu203:Eu3 + (Sr2-xLax)(Cei-xEux)〇4 Sr2Cei.xEux〇4 Sr2-xEuxCe〇4 SrTi03:Pr3 + ,Ga3 +
CaAlSiN3:Eu2+CaAlSiN3: Eu2+
Sr2Si5N8:Eu2+ 154501.doc •33· 201202627 可使用不同大小之磷光體粒子,包括(但不限於)在料 米⑽)至30微米㈣或3〇微米㈣以上之範圍内的粒子。 在散射及混合色彩方面,較小粒子大小通常比較大之粒子 更佳,以提供更均勻之光。與較小粒子相比較,較大粒子 通常在轉換光方面更有效率,但發射較不均勻之光。在一 些實施例中,磷光體可在黏合劑中提供於磷光層“中,且 填光體亦可具有在黏合劑中的不同濃度或負載之填光體材 料。典型濃度在30重量%至70重量%之範圍内。在一實施 例中,磷光體濃度為約65重量%,且較佳均勻地分散於整 個遠端磷光體中。磷光層66亦可具有具不同轉換材料及不 同濃度之轉換材料的不同區。 不同材料可用於黏合劑,其中材料較佳在固化之後堅固 且實質上在可見波長光譜内為透明的。合適材料包括聚矽 氧、環氧樹脂、玻璃、無機玻璃、介電質、BCB、聚醯 胺、聚合物、乙基纖維素、溶膠凝膠玻璃及其混成物,其 中較佳材料為聚矽氧(此係由於聚矽氧在高功率LED中之高 透明度及可靠性)。合適之基於苯基及甲基之聚矽氧可自 Dow® Chemical購得。可使用許多不同的固化方法來使黏 合劑固化’此取決於諸如所使用之黏合劑之類型的不同因 素°不同固化方法包括(但不限於)熱固化、紫外線(uv)固 化、紅外線(IR)固化或空氣固化。在一些實施例中,黏合 劑可包含聚合材料或塑膠。 可使用不同製程來塗覆磷光層66,不同製程包括(但不 限於)喷塗、浸沒(浸塗)、旋塗、賤鐘、印刷、粉末塗佈、 154501.doc -34· 201202627 電泳沈積(EPD)、靜電沈積以及其他。如上文所提及,碟 光層66可連同黏合劑材料一起塗覆,但應理解,不要求黏 合劑。在另外其他實施例中,可分別地製造磷光層66且接 著將磷光層66安裝至载體層64。 在一實施例中’可將磷光體-黏合劑混合物喷塗或分散 於载體層64之上’接著使黏合劑固化以形成磷光層66。在 此等實施例中之一些實施例中,可將磷光體-黏合劑混合 物喷塗、傾注或分散至經加熱之載體層64上或之上,以使 得當磷光體黏合劑混合物接觸載體層64時,來自載體層64 之熱散佈至黏合劑中且使黏合劑固化。此等製程亦可包括 磷光體·黏合劑混合物中之溶劑,該溶劑可使混合物液化 且降低混合物之黏度’從而使得混合物可更適合於喷塗。 可使用許多不同溶劑,包括(但不限於)曱苯、苯、二曱苯 (zylene)或可自Dow Corning®購得之OS-20,且可使用不同 濃度之溶劑。當將溶劑-磷光體_黏合劑混合物喷塗或分散 於經加熱之載體層64上時,來自載體層64之熱使溶劑蒸 發,其中載體層之溫度影響溶劑蒸發之迅速程度。來自載 體層64之熱亦可使混合物中之黏合劑固化,從而在載體層 上留下固定的磷光層。可將載體層64加熱至許多不同溫 度,此視所使用之材料及所要之溶劑蒸發及黏合劑固化速 度而定。合適之溫度範圍為,但應理解,亦 可使用其他溫度。 在另外其他貫施例中,填光層6 6可僅塗佈以轉換粒子 層而無黏合劑。僅沈積此粒子層可藉由靜電或電泳沈積 154501.doc -35- 201202627 方法,或藉由使用混合有磷光體粒子之揮發性黏合劑或溶 劑來達成。可接著藉由熱燒盡或選擇性溶解來選擇性地移 除黏合劑或溶劑。在另外其他實施例中,可將磷光體粒子 嵌入於載體材料中。在此等實施例中,載體可包含諸如鹼 石灰玻璃或硼矽玻璃之玻璃材料,或諸如聚碳酸酯之塑膠 材料。各種沈積方法及系統描述於Donofrio等人之題為 「Systems and Methods for Application of Optical Materials toSr2Si5N8:Eu2+ 154501.doc •33· 201202627 Different sizes of phosphor particles can be used, including but not limited to particles in the range of from (10) to 30 microns (4) or 3 to 10 microns. In terms of scattering and mixing colors, smaller particles are usually better for larger particles to provide a more uniform light. Larger particles are generally more efficient at converting light than smaller particles, but emit less uniform light. In some embodiments, the phosphor may be provided in the phosphor layer "in the binder, and the filler may also have different concentrations or loads of filler material in the binder. Typical concentrations range from 30% to 70% In the range of % by weight, in one embodiment, the phosphor concentration is about 65% by weight, and is preferably uniformly dispersed throughout the distal phosphor. Phosphor layer 66 can also have different conversion materials and different concentrations of conversion. Different zones of material. Different materials can be used for the adhesive, where the material is preferably strong after curing and substantially transparent in the visible wavelength spectrum. Suitable materials include polyfluorene oxide, epoxy resin, glass, inorganic glass, dielectric BCB, polyamide, polymer, ethyl cellulose, sol-gel glass and their blends, of which the preferred material is polyfluorene (this is due to the high transparency and reliability of polyfluorene in high power LEDs). Suitable phenyl and methyl based polyoxyl oxides are commercially available from Dow® Chemical. Many different curing methods can be used to cure the binder' depending on, for example, the binder used. Different factors. Different curing methods include, but are not limited to, thermal curing, ultraviolet (uv) curing, infrared (IR) curing, or air curing. In some embodiments, the adhesive may comprise a polymeric material or a plastic. Different processes may be used. To coat the phosphor layer 66, different processes include, but are not limited to, spraying, immersion (dip coating), spin coating, cuckoo clock, printing, powder coating, 154501.doc -34·201202627 electrophoretic deposition (EPD), static electricity Deposition and others. As mentioned above, the disc layer 66 can be coated with the binder material, but it should be understood that no binder is required. In still other embodiments, the phosphor layer 66 can be separately fabricated and then phosphorescent. Layer 66 is mounted to carrier layer 64. In one embodiment 'a phosphor-binder mixture can be sprayed or dispersed over carrier layer 64' and the adhesive is then cured to form phosphor layer 66. In these embodiments In some embodiments, the phosphor-adhesive mixture can be sprayed, poured or dispersed onto or onto the heated carrier layer 64 such that when the phosphor binder mixture contacts the carrier layer 64, The heat from the carrier layer 64 is dispersed into the binder and the binder is cured. These processes may also include a solvent in the phosphor/binder mixture which liquefies the mixture and lowers the viscosity of the mixture' thereby making the mixture more Suitable for spraying. Many different solvents can be used, including but not limited to terpene, benzene, zylene or OS-20 available from Dow Corning®, and solvents can be used in different concentrations. When the solvent-phosphor_binder mixture is sprayed or dispersed on the heated carrier layer 64, the heat from the carrier layer 64 evaporates the solvent, wherein the temperature of the carrier layer affects the extent to which the solvent evaporates. From the carrier layer 64 Heat can also cure the binder in the mixture leaving a fixed phosphor layer on the carrier layer. The carrier layer 64 can be heated to a number of different temperatures depending on the materials used and the desired solvent evaporation and adhesive cure speed. Suitable temperature ranges are, but it should be understood that other temperatures may be used. In still other embodiments, the fill layer 66 can be applied only to convert the particle layer without a binder. The deposition of only this particle layer can be achieved by electrostatic or electrophoretic deposition of the method 154501.doc -35 - 201202627, or by using a volatile binder or solvent mixed with phosphor particles. The binder or solvent can then be selectively removed by hot burnout or selective dissolution. In still other embodiments, the phosphor particles can be embedded in a carrier material. In such embodiments, the carrier may comprise a glass material such as soda lime glass or borosilicate glass, or a plastic material such as polycarbonate. Various deposition methods and systems are described in Donofrio et al., "Systems and Methods for Application of Optical Materials to
Optical Elements」之美國專利申請公開案第2010/0155763號 中’且該公開案亦讓與給Cree,Inc_且以引用的方式併入本 文中。U.S. Patent Application Publication No. 2010/0155763, the disclosure of which is incorporated herein by reference.
填光層66可具有許多不同厚度,此至少部分取決於鱗光 體材料之濃度及待由峨光層66轉換的所要之光量。構光層 66可具有實質上相同厚度或變化之厚度,在一些實施例 中’該等厚度可調整或變化遠場中之所要光色或發射圖 案。轉換器可包含一層或多層不同磷光體材料,其中一些 多層配置描述於Hussell等人之題為「High Efficiency LEDThe fill layer 66 can have a number of different thicknesses depending, at least in part, on the concentration of the spheroidal material and the desired amount of light to be converted by the luminescent layer 66. The light-guiding layer 66 can have substantially the same thickness or varying thickness, and in some embodiments the thickness can adjust or vary the desired color or emission pattern in the far field. The converter may comprise one or more layers of different phosphor materials, some of which are described in Hussell et al. entitled "High Efficiency LED"
Lamp With Remote Phosphor and Diffuser Configuration」 之美國專利申請案第13/〇29,063號中,該申請案亦讓與給 Cree,Inc.且以引用的方式併入本文中。 應理解’可將各種添加劑包括於鱗光層66及載體層64中 或磷光層66與載體層64兩者中’以均勻地或選擇性地調整 或變化遠場中之發射色彩或強度以產生所要發射性質。可 使用許多不同的添加劑,包括(但不限於)二氧化欽 (Ti〇2)、氧化鋁(Al2〇3)、硫酸鋇(BaS04)。 154501.doc -36- 201202627 可以高於30%之濃度位準(磷光體負載)來塗覆根據本發 明之磷光層。其他實施例可具有高於50%之濃度位準,而 在另外其他實施例中,濃度位準可高於60%。在一些實施 例中,磷光層可具有在1〇微米至1〇〇微米之範圍内的厚 度’而在其他實施例中,磷光層可具有在40微米至50微米 之範圍内的厚度。在另外其他實施例中,磷光層可具有具 不同濃度之磷光體、不同量之磷光體或導致不同轉換特性 的不同性質的區。 上文所描述之方法可用以塗覆相同或不同磷光體材料之 多個層’且可使用已知技術(諸如,遮蔽製程)在載體層之 不同區域中塗覆不同磷光體材料。其他實施例可包含在鱗 光體載體中的均勻及/或非均勻分佈之磷光體,諸如沿著 載體具有不同磷光層厚度及/或不同磷光體材料濃度。可 能存在可發射相同或不同色彩之光的不同類型磷光體之多 個區域,諸如藉由具有不同磷光體之相異區。此等配置中 之一些配置可賦予磷光體載體一圖案化外觀,該等圖案中 之一些圖案包括(但不限於)條帶形、斑點形、十字形、鋸 齒形或此等圖案之任何組合。在另外其他實施例中,可能 存在可具有不同類型之磷光體材料的多個在遠端分離之磷 光體(例如,圓頂)。此等遠端磷光體中之每一者可具有可 按上文所描述之許多不同方式配置的—個或多個鱗光體。 上文所描述之方法提供針對磷光層66之某種厚度控制, 但對於甚至更大之厚度控制,可使用已知方法來研磨碟光 層以降低磷光層66之厚度或整平整個層之上的厚度。此研 154501.doc -37- 201202627 磨特徵提供附加之優點:能夠產生在CiE色度圖上之單一 分選等級内發光的燈。分選大體上為此項技術中已知的且 意欲確保以群組提供之LEd或燈發射在可接受之色彩範圍 内的光。可測試該等LED或燈並按色彩或亮度來將該等 LED或燈分類成不同分選等級(在此項技術中大體上稱作分 選)。每一分選等級通常含有來自一個色彩及亮度群組之 LED或燈,且通常係由一分選等級碼來識別。可藉由色度 (色彩)及發光通量(亮度)來分類白色發光led或燈。對碌 光層之厚度控制藉由控制由磷光層轉換之光源光之量而在 產生發射在目標分選等級内之光的燈之方面提供較大控 制。可知:供具有相同厚度之麟光層66的多個碟光體載體 62。藉由使用具有實質上相同發光特性之光源58,可製造 具有幾乎相同發光特性之燈,該等發光特性在一些例子中 可屬於單一分選等級内。在一些實施例中,燈發光屬於自 CIE圖上之點的標準偏差内,且在一些實施例中,該標準 偏差包含小於10·步階(10-step)麥克亞當橢圓(McAdams ellipse)。在一些實施例中,燈之發光屬於以CIExy(〇 313, 0.323)為中心之4-步階麥克亞當橢圓内。 在另外其他實施例中’峨光體載體62可包含反射或擴散 材料或元件以控制發射強度分佈。可(諸如)藉由使用上文 所描述之方法中之一者模製或塗佈而將此等材料或元件整 合於磷光體載體中。在另外其他實施例中,可分別建構反 射或擴散元件並將其附接至磷光體載體。此等材料及元件 中之一些材料及元件可為不透明的或部分不透明的,而其 154501.doc -38 - 201202627 他材料及元件可為本質上鏡面反射或擴散的(朗伯)。 可使用不同的已知方法或材料(諸如,導熱結合材料或 ,"、/由月曰)將磷光體載體62安袭及結合於空腔中之開口之 上。習知的導熱油脂可含有諸如氧化鈹及氮化鋁之陶瓷材 料,或諸如膠質銀之金屬粒子。在其他實施例中,可使用 導熱器件(諸如,夹鉗機構、螺絲或熱黏著劑)將磷光體載 體安裝於開口之上,從而將磷光體載體62緊緊地固持至散 熱片結構,以使熱導率最大化。在一實施例中,使用具有 約100 μη!之厚度及卜0.2 W/m_k之熱導率的熱油脂層。此 配置提供用於使熱自磷光層66耗散之有效導熱路徑。如上 文所提及,可提供無空腔之不同燈實施例,且除了在空腔 之開口之上外,磷光體載體亦可以許多不同方式來安裝。 在燈50之操作期間,碟光體轉換加熱集中於磷光層 中,諸如集中於磷光層66之中心中,大多數LED光在磷光 層66之中心撞擊磷光體載體62且穿過磷光體載體62。載體 層64之導熱性質使此熱在橫向上朝向磷光體載體62之邊緣 散佈,如由第一熱流70展示。在該等邊緣處熱穿過熱油脂 層且進入散熱片結構52中’如藉由第二熱流72展示,在散 熱片結構52中’熱可有效率地耗散至環境中。 如上文所論述,在燈50中,平台56與散熱片結構52可熱 連接或耦合》此耦合配置導致磷光體載體62與彼光源U至 少部分共用用於耗散熱之導熱路徑。來自光源58的穿過平 台56之熱(如由第三熱流74展示)亦可散佈至散熱片結構 52。自磷光體載體62流入至散熱片結構52中之熱亦可流入 154501,doc -39- 201202627 至平。56中。在其他實施例中,磷光體載體62及光源58可 具有用於耗散熱之單獨的導熱路徑,纟中此等單獨路徑被 稱作「解耦的」。 應理解’除了圖4中所展示之實施例之外,磷光體載體 可以許多不同方式來配置。填光層可在載體層之任一表面 上或可混合於載體層中。磷光體載體亦可包含可包括於磷 光層或載體層上或混合於磷光層或載體層中之散射層。亦 應理解’磷光體及散射層可不£蓋載體層之整個表面,且 在一些實施例中,轉換層及散射層可在不同區域中具有不 同濃度。亦應理解,磷光體載體可具有不同粗糙度或形狀 之表面以增強透過磷光體載體之發射。 如上文所提及,擴散器75經配置以將來自磷光體载體及 LED之光分散成所要燈發射圖案,且可具有許多不同形狀 及大小。在一些實施例中,擴散器亦可配置於磷光體載體 之上以在燈不發光時遮蔽磷光體載體。擴散器可具有用以 賦予實質上白色外觀的材料以在燈不發光時賦予燈泡白色 外觀。 具有不同形狀及屬性之許多不同擴散器可與燈5〇以及下 文所描述之燈一起使用,諸如以引用的方式併入本文中的 2 010 年 3 月 3 日申請之題為「LED Lamp With Rem〇te ph〇sph〇r and Diffuser Configuration」之美國臨時專利申請案第 61/339,515號中所描述之彼等燈。擴散器亦可採用不同形 狀,包括(但不限於)大體上不對稱的「扁形」,如2〇1〇年1〇 月 8日申請之題為「Non-uniform Diffuser to Scatter Light 154501.doc • 40· 201202627U.S. Patent Application Serial No. 13/29,063, the entire disclosure of which is incorporated herein by reference. It should be understood that 'a variety of additives may be included in the scale layer 66 and the carrier layer 64 or in both the phosphor layer 66 and the carrier layer 64' to uniformly or selectively adjust or vary the emission color or intensity in the far field to produce The nature to be emitted. Many different additives can be used including, but not limited to, dioxins (Ti〇2), alumina (Al2〇3), barium sulfate (BaS04). 154501.doc -36- 201202627 The phosphor layer according to the present invention can be coated with a concentration level higher than 30% (phosphor load). Other embodiments may have a concentration level above 50%, while in still other embodiments, the concentration level may be higher than 60%. In some embodiments, the phosphor layer can have a thickness in the range of 1 Å to 1 Å. In other embodiments, the phosphor layer can have a thickness in the range of 40 microns to 50 microns. In still other embodiments, the phosphor layer can have regions of phosphors of different concentrations, different amounts of phosphors, or different properties that result in different conversion characteristics. The methods described above can be used to coat multiple layers of the same or different phosphor materials' and different phosphor materials can be applied in different regions of the carrier layer using known techniques, such as masking processes. Other embodiments may include uniform and/or non-uniformly distributed phosphors in the scale carrier, such as having different phosphor layer thicknesses and/or different phosphor material concentrations along the carrier. There may be multiple regions of different types of phosphors that emit light of the same or different colors, such as by distinct regions having different phosphors. Some of these configurations may impart a patterned appearance to the phosphor carrier, some of which include, but are not limited to, strip, speckle, cross, sawtooth, or any combination of such patterns. In still other embodiments, there may be a plurality of remotely separated phosphors (e.g., domes) that may have different types of phosphor materials. Each of these remote phosphors can have one or more scales that can be configured in many different ways as described above. The method described above provides some thickness control for the phosphor layer 66, but for even greater thickness control, known methods can be used to grind the disc layer to reduce the thickness of the phosphor layer 66 or level the entire layer. thickness of. This study 154501.doc -37- 201202627 The grinding feature provides the added advantage of being able to produce a lamp that illuminates within a single sorting level on the CiE chromaticity diagram. Sorting is generally known in the art and is intended to ensure that the LEd or lamp provided in a group emits light in an acceptable color range. The LEDs or lamps can be tested and sorted into different sorting levels (generally referred to as sorting in the art) by color or brightness. Each sorting level typically contains LEDs or lights from a group of colors and brightness, and is typically identified by a sorting level code. White light LEDs or lamps can be classified by chromaticity (color) and luminous flux (brightness). The thickness control of the light layer provides greater control over the generation of the light that emits light within the target sorting level by controlling the amount of light source converted by the phosphor layer. It can be seen that a plurality of optical disk carriers 62 are provided for the light-emitting layer 66 having the same thickness. By using light sources 58 having substantially the same illumination characteristics, lamps having nearly identical illumination characteristics can be fabricated, which in some instances may fall within a single sorting level. In some embodiments, the lamp illumination is within a standard deviation from a point on the CIE map, and in some embodiments, the standard deviation comprises a Mc-dams ellipse of less than 10 steps. In some embodiments, the illumination of the lamp belongs to a 4-step MacAdam ellipse centered at CIExy (〇 313, 0.323). In still other embodiments, the phosphor carrier 62 can comprise a reflective or diffusing material or element to control the emission intensity distribution. These materials or elements can be integrated into the phosphor support, such as by molding or coating using one of the methods described above. In still other embodiments, the reflective or diffusing elements can be separately constructed and attached to the phosphor carrier. Some of these materials and components may be opaque or partially opaque, while their materials and components may be specularly reflective or diffuse (Lambert) in nature. The phosphor carrier 62 can be attacked and bonded to the opening in the cavity using a different known method or material, such as a thermally conductive bonding material or ", / by a New Moon. Conventional thermal greases may contain ceramic materials such as yttria and aluminum nitride, or metal particles such as colloidal silver. In other embodiments, a phosphor carrier can be mounted over the opening using a thermally conductive device such as a clamping mechanism, a screw or a thermal adhesive to hold the phosphor carrier 62 tightly to the heat sink structure such that Maximum thermal conductivity. In one embodiment, a layer of thermal grease having a thickness of about 100 μη! and a thermal conductivity of 0.2 W/m_k is used. This configuration provides an effective thermally conductive path for dissipating heat from the phosphor layer 66. As mentioned above, different lamp embodiments without cavities can be provided, and in addition to being above the opening of the cavity, the phosphor carrier can be mounted in many different ways. During operation of the lamp 50, the disk conversion heating is concentrated in the phosphor layer, such as concentrated in the center of the phosphor layer 66, most of which strikes the phosphor carrier 62 at the center of the phosphor layer 66 and passes through the phosphor carrier 62. . The thermally conductive nature of the carrier layer 64 causes the heat to spread laterally toward the edge of the phosphor carrier 62, as exhibited by the first heat stream 70. Heat is passed through the layer of thermal grease at the edges and into the fin structure 52. As shown by the second heat flow 72, heat can be efficiently dissipated into the environment in the heat sink structure 52. As discussed above, in the lamp 50, the platform 56 can be thermally coupled or coupled to the heat sink structure 52. This coupling configuration causes the phosphor carrier 62 to share at least a portion of the light source U with a thermally conductive path for dissipating heat. Heat from source 58 through platform 56 (as shown by third heat flow 74) may also be distributed to heat sink structure 52. The heat flowing from the phosphor carrier 62 into the fin structure 52 can also flow into 154501, doc-39-201202627 to level. 56. In other embodiments, phosphor carrier 62 and light source 58 may have separate thermally conductive paths for dissipating heat, such separate paths being referred to as "decoupled." It should be understood that the phosphor carrier can be configured in many different ways than the embodiment shown in FIG. The light-filling layer can be on either surface of the carrier layer or can be mixed in the carrier layer. The phosphor support may also comprise a scattering layer which may be included on the phosphor layer or carrier layer or mixed in the phosphor layer or carrier layer. It should also be understood that the phosphor and scattering layer may not cover the entire surface of the carrier layer, and in some embodiments, the conversion layer and the scattering layer may have different concentrations in different regions. It should also be understood that the phosphor support may have surfaces of different roughness or shape to enhance transmission through the phosphor support. As mentioned above, the diffuser 75 is configured to disperse light from the phosphor carrier and LED into a desired lamp emission pattern and can have many different shapes and sizes. In some embodiments, the diffuser can also be disposed over the phosphor carrier to shield the phosphor carrier when the lamp is not emitting light. The diffuser can have a material to impart a substantially white appearance to impart a white appearance to the bulb when the lamp is not illuminated. Many different diffusers having different shapes and attributes can be used with the lamp 5 〇 and the lamps described below, such as the application entitled "LED Lamp With Rem", filed on March 3, 2010, incorporated herein by reference. The lamps described in U.S. Provisional Patent Application Serial No. 61/339,515, the entire disclosure of which is incorporated herein by reference. The diffuser can also be of different shapes, including (but not limited to) a substantially asymmetrical "flat shape", such as the application for "Non-uniform Diffuser to Scatter Light 154501.doc" on January 8th, 2nd 40· 201202627
Into Uniform Emission Pattpm . ^Into Uniform Emission Pattpm . ^
Pattern」之美國專利申請案第 12/901,405號中,該申古主安,、,?丨m 、丁茨甲°月案以引用的方式併入本文中》 根據本發明之燈可包含除上文所插述之彼等特徵之外的 許多不同特再次參看圖4,在彼等燈實施例中,空腔 54可填充有透明導熱材料以進_步增強燈之熱耗散。空腔 傳導材料可提供用於耗散來自光源58之熱的次要路徑。來 自光源之熱仍將經由平台56傳導,但亦可穿過空腔材料至 散熱片結構52。此情形將允許光源58之較低操作溫度,但 對於磷光體載體62造成升高之操作溫度的危險。此配置可 用於許多不同實施例中,但特別適用於具有較高光源操作 溫度之燈(與磷光體載體之操作溫度相比較)。此配置在可 谷忍對填光體載體層之額外加熱的應用中允許更有效率地 自光源散佈熱。 如上文所論述’根據本發明之不同燈實施例可配置有許 多不同類型之光源。在一實施例中,可使用八個或九個 LED,該八個或九個LED藉由兩個電線而串聯連接至電路 板。可接著將該等電線連接至上文所描述之電源供應器單 元。在其他實施例中,可使用八個或九個以上或八個或九 個以下LED,且如上文所提及,可使用可自Cree,Inc.購得 之 LED,包括八個 XLamp® XP-E LED 或四個 XLamp® XP-G LED。不同的單串LED電路描述於以下美國專利申請案 中:van de Ven等人之題為「Color Control of Single String Light Emitting Devices Having Single String Color Control」之 美國專利申請案第12/566,195號,及van de Ven等人之題為 154501.doc •41 · 201202627In the U.S. Patent Application Serial No. 12/901,405, in the form of the pattern, the application of the ancient singer, ,,?丨m, 茨茨甲° case is incorporated herein by reference. The lamp according to the invention may comprise many different features than those recited above, again referring to Figure 4, at their lamps In an embodiment, the cavity 54 can be filled with a transparent thermally conductive material to enhance the heat dissipation of the lamp. The cavity conductive material can provide a secondary path for dissipating heat from the source 58. Heat from the source will still be conducted via the platform 56, but may also pass through the cavity material to the fin structure 52. This situation will allow for a lower operating temperature of the source 58, but a risk of an elevated operating temperature for the phosphor carrier 62. This configuration can be used in many different embodiments, but is particularly well suited for lamps with higher light source operating temperatures (compared to the operating temperature of the phosphor carrier). This configuration allows for more efficient heat dissipation from the source in the application of the additional heating of the filler carrier layer. As discussed above, different lamp embodiments in accordance with the present invention can be configured with many different types of light sources. In one embodiment, eight or nine LEDs can be used, which are connected in series to the circuit board by two wires. The wires can then be connected to the power supply unit described above. In other embodiments, eight or more than eight or eight or fewer LEDs may be used, and as mentioned above, LEDs available from Cree, Inc. may be used, including eight XLamp® XP- E LED or four XLamp® XP-G LEDs. </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; Van de Ven et al. titled 154501.doc •41 · 201202627
Solid State Lighting Apparatus with Compensation Bypass Circuits and Methods of Operation Thereof」之美國專利申請案 第12/704,730號,該兩個申請案皆以引用的方式併入本文 中〇 圖5展示根據本發明之燈1 〇〇的再一實施例,燈1 〇〇包含 在散熱片結構105内之光學腔102。類似上述實施例,亦可 提供無燈空腔之燈100,其中LED安裝於散熱片105之表面 上或安裝於具有不同形狀的三維結構或基座結構上。基於 平面LED之光源104安裝至平台106,且磷光體載體108安 裝至空腔102之頂部開口,其中磷光體載體108具有上文所 描述之彼等特徵中之任一特徵。在所展示之實施例中,磷 光體載體108可呈平坦圓盤形狀(例如,遠端二維波長轉換 元件)且包含導熱透明材料及磷光層。磷光體載體108可藉 由如上文所描述之導熱材料或器件而安裝至空腔。空腔 102可具有反射表面以增強發射效率,如上文所描述。 來自光源104之光穿過磷光體載體108,在磷光體載體 108中,該光之一部分由磷光體載體108中之磷光體轉換成 不同波長之光。在一實施例中,光源1 可包含藍色發光 LED,且磷光體載體108可包含如上文所描述之黃色磷光 體,該黃色磷光體吸收藍光之一部分且重新發射黃光。燈 100發射LED光與黃色磷光體光之白光組合。類似上文, 光源104亦可包含發射不同色彩之光的許多不同LED,且 磷光體載體可包含其他磷光體以產生具有所要色溫及演色 性之光。 154501.doc •42- 201202627 燈100亦包含安裝於空腔1〇2之上的成形之擴散器圓頂 110,該擴散器圓頂11〇包括諸如上文所列出之彼等擴散或 散射粒子的擴散或散射粒子。散射粒子可提供於可固化之 黏合劑中’該可固化之黏合劑係以大體圓頂形狀形成。在 所展不之實施例中,圓頂i丨〇安裝至散熱片結構丨〇5,且在 與散熱片結構105相反之末端處具有放大部分。可使用如 上文所論述的不同黏合劑材料,諸如聚碎氧、環氧樹脂、 玻璃、無機玻璃、介電質、BCB、聚醯胺、塑膠、聚合物 及其混成物。在一些實施例中,可將白色散射粒子用於具 有白色之圓頂’白色圓頂隱藏光學腔中磷光體載體丨〇8中 之磷光體的色彩。此賦予整個燈1〇〇白色外觀,與磷光體 之色彩相比,該白色外觀大體上在視覺上更被消費者接受 或更吸引消費者。在一實施例中,擴散器可包括白色二氧 化鈦粒子,白色二氧化鈦粒子可賦予擴散器圓頂ιι〇總體 白色外觀。 擴散器圓頂110可提供以下添加之優點:使自光學腔發 射之光按照更均勻圖案分佈。如上文所論述,來自光學腔 中之光源的光可按照大體上朗伯圖案來發射,且圓頂110 之形狀以及散射粒子之散射性質使得光按照更全向發射圖 案自圓頂發射。經工程設計之圓頂可在不同區中具有不同 濃度之散射粒子或可經成形為特定發射圖案。 在美國,由美國環境保護署及美國能源部聯合執行的能 源之星®計劃公佈了一種用於整合式LED燈之標準,對於 色衫與角度均勻性兩者之量測技術描述於能源之星②計劃 154501.doc -43- 201202627 要求中’ S亥能源之星®計劃在上文以引用的方式併入本文 中。對於垂直定向之燈,在相對於初始平面45。及90。之垂 直平面中量測發光強度。該強度將與燈之整個〇。至丨35。區 的平均強度相差不超過20°/。’其中零度經界定為燈泡殼之 頂部。另外’來自燈之總通量之5%將在1 3 5。至1 80。區中。 在一些實施例(包括下文所描述之彼等實施例)中,圓頂 可經工程設計以使得來自燈之發射圖案遵照以引用的方式 併入本文中的於2010年3月22日修正的「一邀禮之 能源之星⑧計劃要求(ENERGY STAR® Pr〇gram Requirements /or /«iegra/ 1<3/72声)」之全向發射準則。此標準中之由 本文中之燈滿足的一要求在於:發射均勻性必須在自〇。至 135之檢視下的平均值之20%内。另一要求在於:來自燈 之總通量之5%以上必須在135。至180。發射區中發射,其中 量測係在0。、45。及90。方位角下進行^如上文所提及,本 文中所描述之不同燈實施例亦可包含滿足能源之星⑧標準 的Α-型(例如,Α19)修整LED燈泡。本發明提供有效率 的、可靠的且節省成本的燈。在一些實施例中,整個燈可 包含可快速且容易地裝配之五個組件。 類似上述實施例’燈100可包含裝設於習知電插座中之 類型的安裝機構112,安裝機構112連接至散熱片1〇5。在 所展示之實施例中’燈1〇〇包括用於安裝至標準螺紋旋座 的螺紋部分112。類似上述實施例,燈1 〇〇可包括標準插塞 且電插座可為標準插口,或電插座可包含GU24底座單 元’或燈100可為夾片且電插座可為接納並保持該夾片之 154501.doc • 44· 201202627 如許多螢光燈中所使用)。 文所描述之電源供應器或電 插座(例如, 含固持如上 内部空腔或外殼。 放熱片結構亦可包 力轉換單元組件之 又所提及,燈100之特徵中 工 可被告#、坚将徵之間的空間 ]被田作混合腔室,其中弁 *中先㈣6與鱗光體载體刚之間的 工間匕s第一光現合腔室磁 間的m人 ⑽與擴散器110之 1的二間可包έ —第二光混 吁科+ +A a 至具令该混合腔室促進 该燈之均勾的色彩及強度發射。相同情形可適用於下文之 具有不同形狀的磷光體載體及擴散器的實施例。在其他實 施例中’ τ包括形成額外混合腔室之額外擴散器及/或磷 光體載體,且擴散器及/或磷光體載體可以不同次序來配 置0 根據本發明之不同燈實施例可具有許多不同形狀及大 小。圖6展示根據本發明之燈12〇的另—實施例,燈12峨 似於燈1〇〇,且類似地包含散熱片結構125中之光學腔 122,其中光源124安裝至光學腔122中之平台126。類似上 文,散熱片結構無需具有光學腔,且光源可提供於除散熱 片結構之外的其他結構上。此等結構可包括具有光源之平 面表面或基座。磷光體載體128藉由熱連接件而安裝於空 腔開口之上。燈120亦包含安裝至散熱片結構125、在光學 腔之上的擴散器圓頂130 »擴散器圓頂13〇可由與上文所描 述之擴散器相同的材料製成,但在此實施例中,圓頂13〇 為球體形、橢圓形或蛋形的以提供不同之燈發射圖案,同 時仍遮蔽來自填光體載體128中之碟光體的色彩。 154501.doc -45- 201202627 應理解,在其他燈實施例中,鱗光體載體可採用許多不 同形狀’包括不同的三維形狀。術語「三維」意欲意謂除 如上述實施例中所展示的平面之外的任何形狀。圖7至圖 1〇展不根據本發明之三維磷光體載體之不同實施例,但麻 理解’該料光體載體亦可採用許多其他形狀。如上文二 論述’㈣光體吸收並线發射光時,其係以各向同性方 式發射,使得三維鱗光體載體用以轉換來自光源之光且亦 使來自光源之光分散。類似上述擴散器,不同形狀之三維 載體層可按照具有不同特性之發射圖案來發光,此部分取 決於光源之發射圖案。可接著使擴散器與磷光體載體之發 射匹配以提供所要燈發射圖案。 圖7展示半球形形狀之磷光體載體丨54,磷光體载體154 包含半球形載體155及磷光層156。半球形載體! 55可由與 上文所描述之載體層相同的材料製成,且磷光層可由與上 文所描述之磷光層相同的材料製成,且散射粒子可如上文 所描述包括於載體及磷光層中。 在此實施例中,將磷光層156展示為在載體155之外表面 上’但應理解’填光層可位於載體之内層上,與載體混 合’或以上三種情況之任何組合。在一些實施例中,在外 表面上具有磷光層可使發射損失最小化。當發光器光被磷 光層156吸收時,光係全向發射,且一些光可向後發射並 被諸如LED之燈元件吸收。磷光層156亦可具有與半球形 載體155不同之折射率,使得自磷光層向前發射之光可自 載體155之内表面向後反射。此光亦可歸因於被燈元件吸 154501.doc • 46- 201202627 收而損失。在磷光層156位於載體155之外表面上的情況 下’向前發射之光不需要穿過載體155且將不會由於反射 而損失。向後發射之光將碰到載體之頂部,在該頂部處, 至少一些光將反射回。此配置導致來自磷光層156的被發 射回至載體中的光之減少,在載體中,光可被吸收。 可使用上文所描述之相同方法中的許多方法來沈積磷光 層156。在一些例子中,載體155之三維形狀可能要求額外 步驟或其他製程以提供必要之覆蓋。在喷塗溶劑_磷光體_ 黏合劑混合物的實施例中,可如上文所描述對載體加熱, 且可能需要多個喷嘴以提供在載體之上的所要覆蓋(諸 如,近似均勻覆蓋)。在其他實施例中,可使用較少喷 嘴,同時旋轉載體以提供所要覆蓋,類似上文,來自載體 15 5之熱可使溶劑蒸發且幫助使黏合劑固化。 在另外的其他實施例中,可經由浸水製程(emersi〇n process)形成磷光層,藉此可在載體155之内表面或外表面 上形成填光層,但其特別適用於形成於内表面上。載體 155可至少部分填充有黏附至載體之表面的磷光體混合 物,或以其他方式使載體155接觸磷光體混合物。可接著 自載體排出該混合物,從而在表面上留下磷光體混合物 層,可接著使該磷光體混合物層固化。在一實施例中,混 合物可包含聚氧化乙烯(PE0)及磷光體。可填充載體且接 著將載體排空,從而留下PE0-磷光體混合物層,可接著熱 固化該PE0-磷光體混合物層。PE〇蒸發或被熱驅散,從而 留下磷光層。在一些實施例中,可塗覆黏合劑以進一步固 154501.doc -47- 201202627 定填光層,而在其他訾始也丨士 舟他貫施例中,磷光體可保留而無黏合 劑。 類似用以塗佈平面載體層之製程,此等製程可用於三維 載體中以塗覆可具有相同或不同的碗光體材料之多個構光 層。磷光層亦可塗覆於載體之内部與外部兩者上,且可具 有在載體之不同區令具有不同厚度的不同類型。在另外的 其他實施例中,可使用不同製程,諸如,對載體塗佈以瑞 光體材料薄片,其可熱形成至載體。 在利用載體155之燈中’發光器可配置於載體之底座 處,以使得來自發光器之光向上發射且穿過載體155。在 一些實施例中,發光器可按照大體上朗伯圖案發光,且載 體可幫助使光按照更均勻圖案分散。 圖8展示根據本發明之三維磷光體載體157的另一實施 例,二維磷光體載體157包含子彈形載體158及在載體之外 表面上的磷光層159。載體158與磷光層159可使用與上文 所描述之方法相同的方法由與上文所描述之材料相同材料 形成。不同形狀之磷光體載體可與不同發光器一起使用以 提供所要的總體燈發射圖案。圖9展示根據本發明之三維 磷光體載體160的再一實施例,三維磷光體載體16〇包含球 體形狀載體161及在載體之外表面上的構光層162。載體 161與磷光層162可使用與上文所描述之方法相同的方法由 與上文所描述之材料相同材料形成》 圖10展示根據本發明之再一實施例鱗光體載體163,碗 光體載體163具有大體上球體形狀載體164以及窄頸部分 154501.doc -48· 201202627 164。類似上述實施例, 外表面上的填光層166, 磷光體载體164包括在载體164之 碟光層166係由與上文所描述之材 料相同的材料製成且係使用與上 文所描述之方法相同的方 法形成。在-些實施例中’具有類似於載體164之形狀的 鱗光體載體可能在轉換發光器光及將來自光源的呈朗伯圖 案之光重新發射成更均勻發射圖案方面更有效率。 圖11至圖13展示根據本發明之燈17〇之另一實施例,燈 170具有散熱片結構172、光學腔174、光源176、擴散器圓 頂178’及螺紋部分18〇。此等特徵可由與上文所描述之類 似特徵相同的材料使用相同方法製成。此實施例亦包含三 維波長轉換元件182(例如,包括導熱透明材料及至少一磷 光層之磷光體載體p取決於實施例,波長轉換元件包含 在鱗光體載體之内部、外部及/或嵌入於鱗光體載體内的 (多個)填光層。在此實施例中,波長轉換元件在散熱片結 構172上(例如,安裝至散熱片結構172且熱耦合或連接至 散熱片結構172)。在其他實施例中,一電絕緣元件(未圖 不)可處於散熱片結構與波長轉換元件之間,且波長轉換 儿件可由該電絕緣元件保持。電料元件可包括(多個)開 口,該(多個)開口在光源176(例如,LED)之上以允許光穿 過同時覆蓋散熱片結構172以防觸電。在—些實施例中, 電絕緣元件亦可充當反射器。在此實施例中,磷光體載體 182為球體形或球形,且發光器經配置以使得來自光源之 光穿過磷光體載體182,在磷光體載體182中,至少—此光 被轉換。 — 154501.doc 49- 201202627 磷光體載體182之三維形狀提供磷光體載體182與光源 176之間的自然分離《因此,光源176並不安裝於形成光學 腔的散熱片中之凹座中。實情為,在此實施例中,光源 176安裝於散熱片結構172之頂面上,其中光學腔174係藉 由磷光體載體182與散熱片結構172之頂部之間的空間形 成。此配置可允許來自光學腔1 74之較少朗伯發射,此係 因為不存在阻擋或重定向側向發射之光學腔側面。在其他 實施例中,光源176位於安裝元件(未圖示)上,安裝元件諸 如印刷電路板 '金屬芯板或在其上安裝光源之其他元件。 在一些實施例中,安裝元件可包括諸如補償及/或控制電 路(未圖示)之其他電子器件,且熱耦合至散熱片結構172。 補償及/或控制電路可包括微處理器、特殊應用積體電 路,或電耦接至電源供應器單元及光源176之其他處理電 路。在一些實施例中,控制電路或其部分可位於具有電源 供應器單元之散熱片空腔/外殼内,及/或安裝於安裝元件 之與LED相反的表面上。補償及/或控制電路可包含如以下 美國專利申請案中所描述之電路:van de Ven等人之題為 「Color Control of Single String Light Emitting Devices Having Single String Color Control」之美國專利申請案第 12/566,195 號,及van de Ven等人之題為「Solid State Lighting Apparatus with Compensation Bypass Circuits and Methods of Operation Thereof」之美國專利申請案第12/704,730號,該兩個申請 案在上文以引用的方式併入本文中。U.S. Patent Application Serial No. 12/704,730, the disclosure of which is incorporated herein in In still another embodiment of the crucible, the lamp 1 is included in the optical cavity 102 within the fin structure 105. Similar to the above embodiment, a lampless cavity lamp 100 can also be provided, wherein the LEDs are mounted on the surface of the heat sink 105 or mounted on a three-dimensional structure or pedestal structure having a different shape. A planar LED based light source 104 is mounted to the platform 106 and a phosphor carrier 108 is mounted to the top opening of the cavity 102, wherein the phosphor carrier 108 has any of the features described above. In the illustrated embodiment, the phosphor carrier 108 can be in the shape of a flat disk (e.g., a distal two-dimensional wavelength converting element) and comprises a thermally conductive transparent material and a phosphor layer. The phosphor carrier 108 can be mounted to the cavity by a thermally conductive material or device as described above. The cavity 102 can have a reflective surface to enhance emission efficiency, as described above. Light from source 104 passes through phosphor carrier 108, which is partially converted by the phosphor in phosphor carrier 108 into light of different wavelengths. In an embodiment, light source 1 can comprise a blue light emitting LED, and phosphor carrier 108 can comprise a yellow phosphor as described above that absorbs a portion of the blue light and re-emits yellow light. Lamp 100 emits a combination of LED light and white phosphor of yellow phosphor light. Like the above, light source 104 can also include a plurality of different LEDs that emit light of different colors, and the phosphor carrier can include other phosphors to produce light having a desired color temperature and color rendering properties. 154501.doc • 42- 201202627 The lamp 100 also includes a shaped diffuser dome 110 mounted above the cavity 1〇2, the diffuser dome 11 including such diffusing or scattering particles as listed above Diffusion or scattering particles. The scattering particles can be provided in a curable binder. The curable binder is formed in a generally dome shape. In the illustrated embodiment, the dome i is mounted to the heat sink structure 丨〇5 and has an enlarged portion at the end opposite the heat sink structure 105. Different binder materials such as polyoxygen, epoxy, glass, inorganic glass, dielectric, BCB, polyamide, plastic, polymers, and mixtures thereof, as discussed above, can be used. In some embodiments, white scattering particles can be used for the color of the phosphor in the phosphor carrier 丨〇8 in a white dome with a white dome' This gives the entire lamp a white appearance which is generally more visually acceptable to the consumer or more attractive to the consumer than the color of the phosphor. In one embodiment, the diffuser can comprise white titanium dioxide particles, and the white titanium dioxide particles can impart an overall white appearance to the diffuser dome. The diffuser dome 110 provides the added benefit of distributing the light emitted from the optical cavity in a more uniform pattern. As discussed above, light from a source in the optical cavity can be emitted in a substantially Lambertian pattern, and the shape of the dome 110 and the scattering properties of the scattering particles cause the light to be emitted from the dome in a more omnidirectional emission pattern. Engineered domes can have different concentrations of scattering particles in different zones or can be shaped into specific emission patterns. In the United States, the ENERGY STAR® program, jointly implemented by the US Environmental Protection Agency and the US Department of Energy, has published a standard for integrated LED lights. The measurement techniques for both color shirt and angular uniformity are described in Energy Star. 2 Program 154501.doc -43- 201202627 The requirements of the 'S Hai Energy Star® Program are incorporated herein by reference. For a vertically oriented lamp, it is 45 relative to the initial plane. And 90. The luminous intensity is measured in a vertical plane. This intensity will be the same as the lamp. As for 35. The average strength of the zones differs by no more than 20°/. 'The zero degree is defined as the top of the bulb shell. In addition, 5% of the total flux from the lamp will be at 135. To 180. In the district. In some embodiments, including the embodiments described below, the dome may be engineered such that the emission pattern from the lamp is as amended on March 22, 2010, incorporated herein by reference. The omnidirectional emission criteria for the ENERGY STAR® Pr〇gram Requirements /or /«iegra/ 1<3/72 sounds. One requirement in this standard that is met by the lamps herein is that the uniformity of emission must be self-defeating. Within 20% of the average value under the 135 view. Another requirement is that more than 5% of the total flux from the lamp must be at 135. To 180. The emission is in the launch area, where the measurement is at zero. 45. And 90. Performing at azimuth angles As mentioned above, the different lamp embodiments described herein may also include a Α-type (e.g., Α 19) trim LED bulb that meets the ENERGY STAR 8 standard. The present invention provides an efficient, reliable, and cost effective lamp. In some embodiments, the entire lamp can include five components that can be assembled quickly and easily. The lamp 100, like the above-described embodiment, may include a mounting mechanism 112 of the type installed in a conventional electrical socket, the mounting mechanism 112 being coupled to the heat sink 1〇5. In the illustrated embodiment the 'lamp 1' includes a threaded portion 112 for mounting to a standard threaded seat. Like the above embodiments, the lamp 1 can include a standard plug and the electrical socket can be a standard socket, or the electrical socket can include a GU24 base unit 'or the lamp 100 can be a clip and the electrical socket can receive and hold the clip 154501.doc • 44· 201202627 as used in many fluorescent lights). The power supply or electrical socket described herein (for example, including the internal cavity or the outer casing as described above. The heat release structure can also be referred to as the force conversion unit assembly, and the characteristics of the lamp 100 can be defended by The space between the levies] is the mixing chamber of the field, in which the 弁*中中(4)6 and the scalar carrier are just between the 匕s s first light-matching chamber magnetic between the m-person (10) and the diffuser 110 The two of the two can be wrapped - the second light mixing + + A a to the color and intensity emission of the mixing chamber to promote the uniformity of the lamp. The same situation can be applied to the following different shapes of phosphorescence Embodiments of bulk carriers and diffusers. In other embodiments 'τ includes additional diffusers and/or phosphor carriers that form additional mixing chambers, and the diffusers and/or phosphor carriers can be configured in different orders. The different lamp embodiments of the invention can have many different shapes and sizes. Figure 6 shows another embodiment of a lamp 12 根据 according to the present invention, the lamp 12 resembling a lamp 1 类似, and similarly includes a heat sink structure 125 Optical cavity 122, wherein light source 124 is mounted to optics Platform 126 in 122. Similar to the above, the heat sink structure need not have an optical cavity, and the light source can be provided on other structures than the heat sink structure. Such structures can include a planar surface or pedestal with a light source. The carrier 128 is mounted over the cavity opening by a thermal connector. The lamp 120 also includes a diffuser dome 130 mounted to the heat sink structure 125 above the optical cavity. The diffuser dome 13 can be as described above. The described diffusers are made of the same material, but in this embodiment, the domes 13 are spherical, elliptical or egg-shaped to provide different lamp emission patterns while still obscuring from the filler carrier 128. The color of the dish. 154501.doc -45- 201202627 It should be understood that in other lamp embodiments, the scale carrier can take many different shapes 'including different three-dimensional shapes. The term "three-dimensional" is intended to mean the implementation as described above. Any shape other than the plane shown in the examples. Figures 7 to 1 show different embodiments of the three-dimensional phosphor carrier not according to the present invention, but it is understood that the material carrier can also adopt many other As discussed in the above two (4), when the light body absorbs and emits light in a line, it is emitted in an isotropic manner, so that the three-dimensional scale carrier is used to convert light from the light source and also disperse light from the light source. The diffuser, the three-dimensional carrier layer of different shapes, can emit light according to an emission pattern having different characteristics depending on the emission pattern of the light source. The diffuser can then be matched to the emission of the phosphor carrier to provide the desired lamp emission pattern. A hemispherical shaped phosphor carrier crucible 54 is shown, the phosphor carrier 154 comprising a hemispherical carrier 155 and a phosphor layer 156. The hemispherical carrier! 55 can be made of the same material as the carrier layer described above, and the phosphor layer can be The same material as the phosphor layer described above is made, and the scattering particles can be included in the carrier and the phosphor layer as described above. In this embodiment, the phosphor layer 156 is shown as being on the outer surface of the carrier 155 'but it should be understood that the light-filling layer can be on the inner layer of the carrier, mixed with the carrier' or any combination of the above three. In some embodiments, having a phosphor layer on the outer surface minimizes emission losses. When the illuminator light is absorbed by the phosphor layer 156, the light system is emitted omnidirectionally, and some of the light can be emitted backwards and absorbed by a lamp element such as an LED. Phosphor layer 156 may also have a different index of refraction than hemispherical carrier 155 such that light emitted forward from the phosphor layer may be retroreflected from the inner surface of carrier 155. This light can also be attributed to the loss of the light element 154501.doc • 46- 201202627. In the case where the phosphor layer 156 is located on the outer surface of the carrier 155, the light emitted forward does not need to pass through the carrier 155 and will not be lost due to reflection. The light that is emitted backwards will hit the top of the carrier where at least some of the light will be reflected back. This configuration results in a reduction in light from the phosphor layer 156 that is emitted back into the carrier where it can be absorbed. Phosphor layer 156 can be deposited using many of the same methods described above. In some examples, the three-dimensional shape of the carrier 155 may require additional steps or other processes to provide the necessary coverage. In embodiments where the solvent _phosphor _ binder mixture is sprayed, the carrier can be heated as described above, and multiple nozzles may be required to provide the desired coverage (e.g., near uniform coverage) over the carrier. In other embodiments, fewer nozzles can be used while rotating the carrier to provide the desired coverage, similar to the above, the heat from the carrier 15 can evaporate the solvent and help cure the adhesive. In still other embodiments, the phosphor layer can be formed via an ink immersion process whereby a fill layer can be formed on the inner or outer surface of the carrier 155, but is particularly suitable for forming on the inner surface . The carrier 155 can be at least partially filled with a phosphor mixture adhered to the surface of the carrier, or otherwise contact the carrier 155 with the phosphor mixture. The mixture can then be discharged from the support to leave a layer of phosphor mixture on the surface which can then be cured. In one embodiment, the mixture may comprise polyethylene oxide (PEO) and a phosphor. The support can be filled and the support then evacuated leaving a layer of PE0-phosphor mixture which can then be thermally cured. The PE crucible evaporates or is dissipated by heat, leaving a phosphor layer. In some embodiments, the adhesive may be applied to further secure the 144501.doc -47 - 201202627 fill layer, while in other applications, the phosphor may be retained without the binder. Similar to the process for coating a planar carrier layer, such processes can be used in a three-dimensional carrier to coat a plurality of light-constituting layers that can have the same or different bowl-light materials. The phosphor layer can also be applied to both the interior and exterior of the carrier and can be of different types having different thicknesses in different regions of the carrier. In still other embodiments, different processes can be used, such as coating the carrier with a sheet of a thinner material that can be thermally formed to the carrier. In the lamp utilizing the carrier 155, the illuminator can be disposed at the base of the carrier such that light from the illuminator is emitted upwardly and through the carrier 155. In some embodiments, the illuminator can illuminate in a substantially Lambertian pattern, and the carrier can help disperse the light in a more uniform pattern. Figure 8 shows another embodiment of a three-dimensional phosphor carrier 157 comprising a bullet-shaped carrier 158 and a phosphor layer 159 on the outer surface of the carrier, in accordance with the present invention. Carrier 158 and phosphor layer 159 can be formed from the same materials as described above using the same methods as described above. Different shaped phosphor carriers can be used with different illuminators to provide the desired overall lamp emission pattern. Figure 9 shows a further embodiment of a three-dimensional phosphor carrier 160 comprising a sphere-shaped carrier 161 and a light-guiding layer 162 on the outer surface of the carrier, in accordance with the present invention. The carrier 161 and the phosphor layer 162 may be formed of the same material as described above using the same method as described above. FIG. 10 shows a scale carrier 163 according to still another embodiment of the present invention, a bowl of light. Carrier 163 has a generally spherical shape carrier 164 and a narrow neck portion 154501.doc -48·201202627 164. Similar to the above embodiment, the light-filling layer 166 on the outer surface, the phosphor carrier 164 comprising the optical layer 166 of the carrier 164 is made of the same material as described above and is used as described above. The method described is formed in the same way. A scale carrier having a shape similar to carrier 164 in some embodiments may be more efficient in converting illuminator light and re-emitting the Lambertian light from the source into a more uniform emission pattern. 11 through 13 show another embodiment of a lamp 17 according to the present invention having a heat sink structure 172, an optical cavity 174, a light source 176, a diffuser dome 178', and a threaded portion 18A. These features can be made using the same method as the materials of the similar features described above. This embodiment also includes a three-dimensional wavelength converting element 182 (eg, a phosphor carrier p comprising a thermally conductive transparent material and at least one phosphor layer, depending on the embodiment, the wavelength converting element being contained within, outside and/or embedded in the scale carrier The light-filling layer(s) within the scale carrier. In this embodiment, the wavelength conversion element is on the heat sink structure 172 (eg, mounted to the heat sink structure 172 and thermally coupled or coupled to the heat sink structure 172). In other embodiments, an electrically insulating element (not shown) may be between the heat sink structure and the wavelength converting element, and the wavelength converting member may be held by the electrically insulating element. The electrical element may include an opening(s). The opening(s) are above the light source 176 (eg, LED) to allow light to pass through while covering the heat sink structure 172 to prevent electrical shock. In some embodiments, the electrically insulating element can also act as a reflector. In an example, the phosphor carrier 182 is spherical or spherical, and the illuminator is configured such that light from the source passes through the phosphor carrier 182, in the phosphor carrier 182, at least - the light is converted — 154501.doc 49- 201202627 The three-dimensional shape of the phosphor carrier 182 provides a natural separation between the phosphor carrier 182 and the light source 176. Thus, the light source 176 is not mounted in a recess in the heat sink forming the optical cavity. In this embodiment, the light source 176 is mounted on the top surface of the heat sink structure 172, wherein the optical cavity 174 is formed by the space between the phosphor carrier 182 and the top of the heat sink structure 172. This configuration allows for optical Less Lambertian emission of cavity 1 74, since there is no side of the optical cavity that blocks or redirects lateral emission. In other embodiments, light source 176 is located on a mounting component (not shown), such as a printed circuit. The board 'metal core board or other component on which the light source is mounted. In some embodiments, the mounting component may include other electronics such as compensation and/or control circuitry (not shown) and is thermally coupled to the heat sink structure 172. The compensation and/or control circuitry can include a microprocessor, a special application integrated circuit, or other processing circuitry electrically coupled to the power supply unit and source 176. In an embodiment, the control circuit or portion thereof may be located within a heat sink cavity/housing having a power supply unit and/or mounted on a surface of the mounting component opposite the LED. The compensation and/or control circuitry may comprise Circuits described in U.S. Patent Application: U.S. Patent Application Serial No. 12/566,195, to Van de Ven et al., entitled "Color Control of Single String Light Emitting Devices Having Single String Color Control", and van de Ven et al. U.S. Patent Application Serial No. 12/704,730, the entire disclosure of which is incorporated herein by reference.
在燈170之實施例中,利用用於光源176之藍色發光LED 154501.doc •50· 201202627 及在鱗光體載體中的黃色及紅色鱗光體組合。此情形可使 仵磷光體載體182呈黃色或橙色,且擴散器圓頂178遮蔽此 色彩,同時使燈光分散成所要發射圖案。在燈17〇中,用 於平台之傳導路經與用於散熱片結構之傳導路徑耦合,但 應理解,在其他貫施例中,用於平台之傳導路徑與用於散 熱片結構之傳導路徑可解耦。 圖14展不根據本發明之燈19〇的一實施例燈19〇包含如 上文所描述安裝於散熱片194上之八個LED光源192 »該等 發光器可包含許多不同類型之LED,該等不同類型之 可以。午^不同方式耗接在一起’且在所展示之實施例中為 串聯連接的。請注意,在此實施例中,發光器不安裝於光 學腔中’而是改為安裝於散熱片194之頂部平面表面上。 圖15展不圖14中所展示之燈190,其中球體形磷光體載體 196安裝於圖14中所展示之光源192之上。圖15中所展示之 燈190可與擴散器198(如上文所描述)組合以形成具有分散 的光發射之燈。 如上文所提及’磷光體載體可包含多個轉換材料,諸如 黃色/綠色及紅色磷光體。此等磷光體可提供用於白光燈 發射之黃光/綠光分量。然而’在不同實施例中,此等光 为里可直接自LED晶片提供’而不是經由填光體轉換來提 供。此等不同配置可提供特定優點,包括(但不限於)需要 較低操作功率且可藉由消除對特定礙光體之需要而較廉價 的燈。在其他實施例中,此等色彩分量中之特定分量可直 接自不同色彩之LED晶片提供。舉例而言,發射之紅色分 154501.doc •51 - 201202627 量可直接自如以下申請案中所描述之紅色發光LED提供: Yuan 等人之題為「LED Lamp With Remote Phosphor and Diffuser Configuration Utilizing Red Emitters」之美國臨時專 利申請案第61/424,670號,該申請案以引用的方式併入本 文中。 圖16及圖17展示根據本發明之燈250之另一實施例,燈 250類似於以下申請案中所展示及描述之彼等燈:2010年3 月 3 曰申請的且題為「Lamp With Remote Phosphor and Diffuser Configuration」之美國臨時專利申請案第61/3 39,515 號,及2010年10月8日申請的且題為「Non-uniform Diffuser to Scatter Light Into Uniform Emission Pattern」之美國專利申 請案第12/901,405號,該兩個申請案以引用的方式併入本 文中。 燈250包含散熱片252,以及圓頂形磷光體載體254及圓 頂形擴散器256,該圓頂形磷光體載體254及該圓頂形擴散 器256可由與上文所描述之材料相同的材料使用與上文所 描述之相同方法製成。該燈亦包含LED 258,在此實施例 中,LED 258安裝於散熱片252之平面表面259上,其中磷 光體載體及擴散器在LED晶片258之上。LED晶片258及磷 光體載體254可包含上文所描述之配置及特性中之任一 者,諸如,一些實施例具有紅色及藍色發光LED晶片。磷 光體載體可包含上文所描述之磷光體材料中之一或多者, 但較佳包含吸收藍光且發射黃光之磷光體以使得燈發射藍 光、紅光及黃光之白光組合。 154501.doc -52- 201202627 燈250可包含裝設於習知電插座中之類型的安裝機構 259。在所展示之實施例中,燈25〇包括用於安裝至標準螺 紋旋座的螺紋部分260。類似上述實施例,燈25〇可包括標 準插塞且電插座可為標準插口,或可包含GU24底座單 元,或燈250可為夾片且電插座可為接納並保持該夾片之 插座(例如’如許多螢光燈中所使用)。 根據本發明之燈可包含如上文所描述之電源供應器或電 力轉換單元,該電源供應器或電力轉換單元可配置於散熱 片内之空腔或外殼中。如上文,此等可包含驅動器以允許 燈泡由AC線路電壓/電流供電且提供光源調光能力。在一 些實施例中,電源供應器可包含使用非隔離之準諧振返驰 拓撲之離線恆定電流LED驅動器。LED驅動器可裝設於燈 250内,諸如裝設於本體部分262中。在一些實施例中,電 源供應器可為非可調光的,但成本相對較低。應理解,所 使用之電源供應器可具有許多不同拓撲或幾何形狀且可以 許多不同方式來配置。 不同燈組件可具有許多不同形狀且可以許多不同方式來 配置。詳言之,散熱片可以許多不同方式來配置以滿足所 要大小、熱管理特性及所要發射特性。如圖3中所展示, 可用於A19標準大小的相對特定的且受約束之燈泡殼可導 致散熱片之不同形狀及大小的有限選項。對於具有允許燈 滿足特定發射特性(諸如,如上文所描述的能源之星⑧計 劃)之特徵的LED燈而言,此情形尤其成立。 圖U展不根據一根據本發明之散熱片之散熱片3〇〇的一 15450l.doc •53- 201202627 實施例’散熱片300能夠使得LED、磷光體載體及擴散器 圓頂安裝於其上以形成燈。散熱片300可由與上文所論述 之導熱材料相同的導熱材料製成。散熱片3〇〇可用於許多 不同燈中,但尤其經設定大小以適應A19燈泡殼要求,同 時具有允許燈按能源之星⑧發射要求發射光的成角度之表 面0 散熱片300可具有圓柱形芯/外殼3〇2以收容如上文所論 述之電力控制單元。散熱片300亦可具有散熱鰭片3〇4,散 熱縛片304經設計以使熱傳導遠離燈之產熱組件(諸如, LED、電力電子器件等)„散熱鰭片3〇4可具有許多不同形 狀及大小且可由上文所描述之許多導熱材料製成。在不同 實施例中亦可能存在許多不同數目個散熱鰭片3〇4,一些 實施例具有在20個與60個之間的散熱鰭片。其他實施例可 具有30至50個散熱鰭片,而其他實施例可具有35至4〇個散 熱縛片。在一實施例中’散熱片452可具有約38個散熱鰭 片。可減少散熱鰭片3〇4之數目,但此情形可導致用以耗 散熱之表面積之對應減少。當使用較少個鰭片時,可使用 較大鰭片,但此情形可導致不可接受量之光被該等鰭片阻 擋或可導致鰭片伸到A19燈泡殼外部。 該等散熱鰭片304可各自具有實質上相同的形狀,但在 其他實施例中,該等散熱鰭片304可具有不同形狀。該等 散·.’、鰭片304中之每一者可具有下部部分3〇6,下部部分 係乂允許散熱片裝設於A19燈泡殼之中間成角度部分中 的方式經設定大小且遠離散熱片304之中心成角度。在所 154501.doc •54- 201202627 f5= 例中,下部部分306係以相對於垂直方向約 (或相對於水平方向60。)成角度,但應理解,該等鰭片 :具有許多其他角度。詳言《,下部部分可具有相對於垂 向成大於150之角度的韓片。散熱片之頂部部分地 可朝向散熱片30()之中心向回成角度’此角度係取決於所 要發射特性而選擇°在—些實施射,利用此散熱片之燈 可發射'經配置以發射滿足如上文所描述的能源之星⑧發 射特J·生之光。4 s之且如下文進一步描述頂部部分地 可成角度以便不阻擋在向下方向上自燈發射的太多光,同 時仍提供用於熱耗散之所要表面積。 圖19至圖22展示根據本發明之燈45〇之_實施例,燈45〇 利用具有類似於圖18中所展示之散熱鰭片的散熱鰭片453 之散熱片452。燈450之内部組件最佳展示於圖2〇及圖21 中。類似上述貫施例,燈450包含圓頂形磷光體載體454及 圓頂形擴散器456。該燈亦包含LED 458,在此實施例中, LED 458安裝於散熱片452之平面表面上,其中磷光體載體 454及擴散器45 6在LED 45 8之上。如同本文中所描述之其 他LED燈,LED晶片45 8、擴散器456及磷光體載體454可包 含上文所描述之形狀、配置及特性中之任一者,諸如,一 些實施例具有紅色及藍色發光LED晶片。磷光體载體454 可包含上文所描述之磷光體材料中之一或多者,一些實施 例包含吸收藍光且發射黃光之磷光體以使得燈發射藍光、 紅光及黃光之白光組合。 燈450可包含裝設於習知電插座中之類型的安裝結構, 154501.doc -55- 201202627 諸如用於旋人標準螺紋旋座中之螺紋部分彻,以及上文 所提及之替代安裝機構1頂形擴散器可為許多不同形狀 ^大小,且在所展示之實施例中為「扁形」,且在不同區 段中可具有不同量之擴散器’上述兩者如併入上文中之美 國專利申請案第12/901,405號中所描述。 使用習知安裝方法將LED 458安裝於印刷電路板牝2上, 其中使用安裝螺絲466將PCB 462安裝至散熱片平台464, 安裝螺絲466穿過PCB 462且旋入散熱片平台—中之螺絲 孔467中。應理解,許多其他實施例可利用不同安裝方法 及機構。磷光體載體454亦安裝至平台464且在lED 458之 上,以使得來自LED之光穿過磷光體载體454 〇通道468提 供於平台464周圍,擴散器圆頂456之下邊緣擱置於通道 468中。可使用已知安裝材料及方法將磷光體載體454及擴 散器圓頂456安裝於適當位置中。在此實施例中,擴散器 圓頂擱置於通道468中在LED 458下方,且波長轉換元件 454搁置於通道473中在LED 458上方。波長轉換元件454、 擴散器圓頂456、LED 458及/或散熱片452之頂面的相對安 裝位置可取決於實施例而變化。 藉由提供通道468 ’可將擴散器圓頂456配置於散熱片 452中之較低處。此情形可提供若干優點。此情形可導致 擴散器圓頂456與散熱鰭片453之間的重疊以促進熱耗散。 此配置可允許擴散器圓頂456亦處於較低處,以輔助允許 燈450適應所要長度(諸如,A19燈泡殼中所提供之彼等長 度)。此情形亦導致擴散器圓頂456之下邊緣位於磷光體載 154501.doc -56- 201202627 體454之下邊緣下方,使得磷光體載體基本上在此擴散器 圓頂456内升高。此情形將磷光體載體454置於較接近於擴 散器圓頂456之中心處,此可促進來自燈45〇之均勻分佈。 可能存在造成磷光體載體454可相對於擴散器圓頂456升高 之距離的實際極限的一些因素。舉例而言,若磷光體載體 454升高得太接近於擴散器圓頂456,則來自磷光體載體 454之黃光可能透過擴散器圓頂456可見。此情形對於一些 燈使用者而言可能是不美觀的。在不同實施例中,磷光體 載體454可相對於擴散器圓頂456升高不同量。在一些實施 例中,磷光體球體之下邊緣升高之距離可在〇與3〇爪爪之 間’而在其他實施例中’磷光體球體之下邊緣升高之距離 可在5 mm至15 mm之範圍内。在另外其他實施例中,磷光 體球體之下邊緣可能升高約1〇 mm。 燈450亦經配置以通過特定卫業墜落及破裂測試。pcB 462可包含在曝露之情況下可造成觸電危險的電導體、跡 線,或組件。為了滿足此等破裂測試,燈45〇可經配置以 使得在擴散器圓頂456及鱗光體載體454中之—者或兩者破 裂之情況下(諸如’由於墜落),不存在造絲電危險的曝 露、、件為了減及/或防止此危險,燈“〇包含覆蓋PCB 462之#刀的電絕緣層47〇。該絕緣層可經配置以覆蓋載運 電L號之電導體、跡線,或電組件。可使用許多不同的絕 緣材料I括(但不限於)諸如聚碳酸醋之不同塑膠。可與 燈分別地形成絕緣層且將其安裝於適當位置中,或可在將 PCB 462安裝於適當位置中後便直接在燈上形成絕緣層。 154501.doc -57- 201202627 可在絕緣層470上提供窗472,其中LED 458配置於窗472 中以使得層470不會阻擋來自LED之發射。窗472之邊緣可 為成角度的,此情形提供一額外優點··表面經配置以將側 向發射之LED光向上反射向磷光體載體,在磷光體載體處 該LED光可有助於有用的燈發射。 絕緣層470進一步包含經設定大小以固持磷光體載體454 之下邊緣的絕緣層突出部分或通道473。可藉由將磷光體 載體454置放並安裝至絕緣層且在突出部分470内而迅速地 且容易地將磷光體載體454配置於其所要位置中,該突出 部分使磷光體載體454在適當位置中對準。絕緣層470延伸 至散熱片通道468中,在散熱片通道468中,絕緣層470對 準且固持於通道468中的適當位置中介於擴散器圓頂45 6與 通道468之表面之間。絕緣層470亦可包含第二絕緣層突出 部分或通道473以固持擴散器圓頂456之下端,其中突出部 分或通道473允許迅速地且容易地將擴散器圓頂456置放並 安裝至絕緣層470、在磷光體載體454與LED 458之上的適 當位置中。 根據本發明之絕緣層之不同實施例可經配置以提供有效 率之燈製造。在一些實施例中,絕緣層470可與燈450分別 形成,且可分別將絕緣層、磷光體載體454及擴散器圓頂 456裝配到雙圓頂單元475(圖20中所展示)中。可迅速地且 容易地將該雙圓頂單元安裝至散熱片並與散熱片對準,其 中第二絕緣層突出部分或通道473位於散熱片突出部分468 中。可接著使用已知方法及材料將單元475安裝於適當位 154501.doc -58 - 201202627 置中。藉由提供單獨的雙圓頂單元475,根據本發明之燈 亦可經配置以使得單元475可為可移除的及可替換的。在 單元475出故障或有損害或為了允許接近燈之其他部分以 用於修復或替換(諸如,PCB 462)的狀況下,可能尤其需 要此情形。應理解,其他實施例可包含一具有分別形成之 磷光體載體454及絕緣層之單獨單元,且接著將該單獨單 元安裝至散熱片452。可接著將擴散器圓頂456安裝至絕緣 層470、在磷光體載體454之上。此等配置亦可允許以與分 選LED非常相同之方式按發射特性來分選該等單元。 在一些實施例中,電絕緣元件47〇、波長轉換元件454 及/或擴散器圓頂456包含機械耦接或保持機構(諸如,搭扣 或配合犬起及凹口),以使得可容易地將雙圓頂單元475裝 在一起作為一單一單元(例如,搭扣配合因而,當製造 具有不同光學特性之不同LED燈泡時,可容易地替換及/或 安裝(install)具有不同光學特性之單元。另外,若消費者 f要不同特性’則消費者可替換現有LED燈泡上之雙圓頂 單元47S在一些實施例甲,電絕緣元件47〇可包含機械耦 接機構’料機械純機構使得能夠时容易地且以機械 方式(例如,藉由搭扣或配合突起)將雙圓頂單元475安裝至 LED燈泡之散熱片或外殼。在此等實施例巾此等機械安 裝或,持特徵係關於電絕緣元件47〇進行描述,但此等特 'σ藉由並非電絕緣之單獨元件或連同電絕緣元件一起來 提供。使波長轉換元件454及/或擴散器圓頂456作為一體 式配置或連接在一起作為一單元可提供製造優點。舉例而 154501.doc •59· 201202627 吕,可量測該單元之光學特性,且可(諸如)在丨93丨CIE圖 之區中分選該單元。因此,可選擇該等單元且使該等單元 與固態光源配合以達成具有所要光學特性之照明單元,且 可允許具有相同或類似發射特性之燈及/或燈泡之一致製 造。此情形可幫助促進消費者對根據本發明之燈之滿意 度。 現參看圖22 ,燈450經展示為具有圍繞其之Α19燈泡殼/ 輪廓476,燈450經設定大小及經成形以裝設於Α19燈泡殼 476内。詳言之,散熱片452之下部部分478經定位、經設 定大小及經成形以裝設於燈泡殼之成角度之中間部分48〇 中。擴散器圓頂、散熱片及愛迪生連接器之形狀及安裝允 許對燈設定大小以使得燈之總長度在α19燈泡殼内β 散熱片452之上部部分482可具有許多不同角度,所展示 之角度提供所要熱管理,同時仍允許遵照能源之星⑧效能 要求的均勻發射。亦即,散熱片應提供用以耗散熱之所要 表面積’而同時不阻撲自擴散器圓頂456發射之過量光。 在所展示之實施例中,可自在散熱片上方之相交點485量 測角度’與成角度之表面重合之線486在該相交點485處相 交。兩個線486之間的角度可為量測上部部分中之散熱轉 片表面之角度的一種方式。在所展示之實施例中,相交點 485在燈450之最低點上方139 mm處。此情形對應於上部成 角度之表面480之間的約42。之量測角度。應理解,可使用 許多其他的量測角度,諸如60。或60。以下、5〇。或5〇。以下 及/或40。或40。以下的角度。在此等不同實施例中,重合線 154501.doc -60- 201202627 在散熱片450上方之不同點處相交。在其他實施例中可 使用不同的角度量測方法。 一些實施例可進一步藉cb 丁 I·!· _ ^措由不比所展示之擴散器圓頂456 寬的散熱片452來特徵化。此情形進一步幫助燈45〇留在 A19燈泡殼内,同時仍不阻擋來自擴散器圓頂㈣之光。 如上文所响述,根據本發明之燈實施例可提供遵照能源 之星⑧要求之發射分佈。允許實現能源之星⑧光順應性的 散熱片結構依賴於以下各者之間的平衡:鰭片之數目、鰭 片厚度' ‘_片沿發射表面之輪廓(例如’擴散器圓頂)延伸 的距離,及鰭片相對於燈之垂直軸線之角度。對於經配置 以適應A-型燈(A19、A21、A23)之ANSI標準輪廓同時仍提 供規定的L70壽命所需之足夠散熱片自積的實施例,此等 參數可直接衫響散熱鰭片之大小 '形狀 '數目及位置。舉 例而言,在散熱鰭片453之當前實施例中,鰭片453沿發射 表面之輪廓延伸的距離愈大,鰭片相對於垂直軸線之角度 就愈大,且鰭片有可能可允許較少的受阻礙面積(例如, 較少鰭片或較薄鰭片),此情形可允許燈45〇達成能源之星 ®光分佈。應理解,附圖中所展示的且在上文所論述的散 . 熱鰭片實施例僅為可滿足所要燈發射及大小要求的散熱鰭 - 片配置之一些實施例。 圖23及圖24說明燈之相對幾何形狀可能對燈之發射特性 具有的影響。首先參看圖23,展示類似於圖19至圖22中所 展示之燈450的燈500,且對於相同或類似特徵,在描述此 圖時將使用上文之相同參考數字。 154501.doc •61- 201202627 首先參看圖23’包括自磷光體載體454之中心至散熱鰭 片453之尖端的中心線502。若燈具有更多地充當自燈之中 心發射之習知燈絲的光源,則光將自燈之中心在所有方向 上發射’其中一些光沿著中心線502發射。對於以此方式 發射之光’添加散熱鰭片453之頂部區域的表面積將對燈 發射概況具有極少影響。然而’如本文中所描述之破光體 球體更多地充當體積發光器(v〇lumetric emitter),整個表 面以約略朗伯方式發光。第一三角形504說明一特定球體 表面積。對於在水平線下方小於67.5。之角度下的發射,光 可能至少部分被散熱鰭片453阻擋且可能對向下光分佈具 有極少影響。對於第一三角形504中之以高於67 5。角發射 的發射區域,光有助於總的燈發射。 第一箭頭506a、第二箭頭506b及第三箭頭5〇6(:展示自磷 光體載體454上的第一三角形内之不同位置之不同發射角 度,且可說明更多的鰭片表面積可能對自此等不同位置發 射之光具有的影響。第一箭頭5〇6a說明自磷光體載體454 上較高的區域發射之光,此等區域具有對向下光分佈之最 大可能的貢獻(由於包括(但不限於)磷光體載體454、擴散 器圓頂456及散熱片452的燈500組件之幾何形狀)。如藉由 第二箭頭506b及第三箭頭506c展示,球體上較低處之^射 區域對來自燈之向下分佈提供愈來愈少的貢獻。來自球體 之下部部分之發射極少有助於自燈之向下發射,而來自球 體上之較高處的發射顯著有助於自燈5〇〇之向下發射。: 現參看圖24,燈500經展示為具有第二三角形5〇8,第二 154501.doc • 62 - 201202627 三角形508表示對散熱鰭片添加之額外表面積。對於自球 體之下部部分之發射,添加之表面積對被散顏片M3阻 擋之光量具有極少影響,但來自此等區域之發射對自燈之 向下發射具有極少貢獻1比之下,自球體上之較高處發 射之光受到很大影響。如自箭頭51()可見,肖第一箭頭 5〇8a相比較,光可不受阻礙地發射之角度升高了,第一箭 頭508a展示來自圖23之上部角度。此情形又減少了不受阻 礙地向下發射的光量。此情形可造成燈不達到能源之星⑧ 發射特性。作為替代方案’可在縛片丨之較低處添加較大 鰭片表面積,但此情況可造成散熱片之大小超過Ai9燈泡 殼。上文所描述之不同實施例中所提供的角度提供了一角 度,以允許燈保持在A19燈泡殼内且具有所要均勻發射, 同時仍允許散熱鰭片具有用以耗散來自燈之熱的必要表面 積0 應理解,擴散器圓頂可採用許多不同形狀,以提供導致 所要燈發射特性的在磷光體載體與擴散器圓頂之間的動態 關係°在一些實施例中’擴散器圓頂之形狀可至少部分取 決於填光體載體之形狀而達成所要燈大小及發射特性。圖 25至圖28展示根據本發明的扁擴散器圓頂56〇之一實施例 的尺寸。 如上文及併入本文中之專利申請案中所論述,根據本發 明之擴散器圓頂可具有不同區,該等不同區散射及透射來 自燈光源的不同量之光以幫助產生所要燈發射圖案。在一 些實施例中’散射及透射不同量之光的不同區可藉由在不 154501.doc -63· 201202627 同區處用不同量之擴散材料塗佈擴散器圓頂來達成。此情 形又可修改光源之輸出光束強度概況以提供改良之發射特 性,如上文所描述。 在一些實施例中,本發明可依賴於擴散器元件(亦即, 擴散器圓頂)與擴散器塗層散射性質之組合來產生燈之所 要遠場強度概況。在不同實施例中,擴散器厚度及位置可 取決於不同因素,諸如擴散器圓頂幾何形狀、光源配置及 自磷光體載體發射之光的圖案。 在實施例中,擴散器圓頂可經配置以將二維LED、 LED陣列、平坦磷光體轉換層或三維磷光體載體之發射強 度概況轉換成較寬廣之光束概況,諸如與A19白熾燈大小 及能源部(DOE)能源之星®發射特性相關聯的光束概況。 此情形可使得能夠製造習知白熾燈泡的基於LED之有效率 且節省成本之替換物。 已發現部分及/或非均勻塗層產生寬廣之光束強度概 /兄°亥荨光束強度概況為白織燈替換物所要的且在均勻發 光強度分佈方面滿足能源之星®順應性。非均勻塗層亦可 提供達成能源之星®順應性的能力,而與散熱片及擴散器 球體幾何形狀無關。一般意義上,在清澈或均勻塗佈之擴 散器圓頂上適當置放足夠的部分塗層可操縱穿過擴散器圓 頂之可見光子(light photon)的散射及強度概況使之處於較 佳角度。在能源之星⑧順應性的狀況下,一配置可為重定 向可見光子以使得高角度下之發射強度大於12〇。。此等配 置可提供使用廉價二維光源而同時滿足A19大小及能源之 154501.doc -64- 201202627 星⑧發射標準之燈。實施例之部分塗層可作為覆蓋擴散器 之一百分比且僅具有單一照明器區(lighter)的塗層而存 在,或該等塗層可作為沿著擴散器之特定區的環或帶而鋪 展。 圖29展示擴散器圓頂58〇之一實施例,擴散器圓頂58〇具 有覆蓋其表面大部分的均勻塗層582及具有更多擴散材料 的較厚帶塗層584。在所展示之實施例中,較厚帶塗層5 以特定檢視角範圍跨越擴散器圓頂58〇周圍,其中帶塗層 584防止彼特定區中更多光逃逸,使得光以較高或較低之 角度離開。 圖30為展示典型白熾燈592、擴散器圓頂具有均勻擴散 性質之LED燈594及擴散器圓頂具有具更多擴散材料的帶 (或區域)的LED燈596之發射強度概況的曲線圖59〇。概況 594展示均勻塗層之低檢視角或軸向光強度低於扔。與1〇5。 之間的角度下的強度。現參看概況596,45。與1〇5。之間的 強度小於軸向光之強度。由於此強度偏移,光在大於1〇5。 之角度下更強烈。概況596展示具有非均勻塗層之燈可提 供等同於且在一些狀況下優於白熾燈的發光分佈。 圖31展示圖30中所展示之發射概況596的較靠近視圖, 該圖展示具有具不均勻塗層(亦即,較多擴散器之帶或區 域)之擴散器的LED燈的發射強度對檢視角曲線。圖32為列 出與發射圖3 1中所展示之概況的燈之效能相比較的能源之 星⑧順應性資料的表格。與能源之星⑧順應性相關的因素 中之一者為最小值對平均值之比。具有均勻塗層之一些燈 154501.doc -65- 201202627 可達到幾乎高達26%之值》藉由比較,圖3〇中所展示之發 射概況能夠達成約17%之值且遵照「小於2〇%」的要求。 在此狀況下,在擴散器圓頂上或擴散器圓頂内之正確位置 中(其在45。與105。之間)置放具有額外擴散材料之帶塗層提 供所要之加寬發射概況。 如上文所提及,額外擴散器可提供於擴散器圓頂上之許 多不同帶或區域中。本發明之另一實施例包含可包括多個 部分塗層之非均勻塗層。該等部分塗層可使用本申請案中 所描述之任何方法來塗覆,其中一種方法為喷塗至擴散器 圓頂上。可將額外擴散器之—塗層沈積於擴散器球體中部 附近,諸如在約45。至1〇5。之檢視角範圍中。可接著將額 外擴散器之第二塗層沈積於擴散器圓頂之頂部處以覆蓋〇〇 至約45。之檢視角。此等經組合之塗層阻擋〇。與ι〇5。之間 的可見光子之大部分而允許更多光以較高角度穿過擴 散器圓頂。現參看圖33,圓33為與來自典型白熾燈之概況 602相比較的具有具此兩部分塗層之擴散器圓頂的燈之發 射強度概況600。該等概況極其類似,且如圖34中之表格 中所展示此兩部分非均勻組態達成能源之星⑧順應 性。 請注意’一些實施例之實驗已展示,㈣薄的第一帶提 供了最J值對平均值之比的一些減小(例&,至 27%)。藉由進-步增厚第,使該比降低更多(自μ 至24%)'亦經由實驗判定一旦將額外擴散器塗覆於擴散 器圓頂之頂部處(在約。至45。之範圍中),便達成13%至19% 154501.doc • 66 - 201202627 的最小值對平均值之比。此僅為可根據本發明用以產生所 要燈發射特性的許多不同擴散器帶配置中之一者。 根據本發明之擴散器的不同實施例可包含沿著内表面及 外表面之任一方向變化的散射性質。在一些實施例中,該 擴散器可包含一透明材料(基板),該透明材料在其内表面 上包含一具有變化之散射性質的散射膜。其他實施例可包 3具有在内表面及/或外表面上及/或嵌入於擴散器元件58〇 内之散射膜的透明球體。該等散射膜可具有許多不同厚 度,此至少部分取決於所使用之膜/黏合劑材料、散射材 料之類型及膜中之散射材料之密度。在一些實施例中透 明球體可具有在微米之範圍中的散射膜厚 度,其中該膜係在該球體之内部及/或外部上。在使用基 於纖維素之黏合劑的實施例中,膜厚度可在〇·米至_ 微米之範圍中’其中該膜係在該球體之内部及/或外部 上。在使用基於纖維素之黏合_ —些實施例中,基於氧 化紹之散射粒子可與具有W微米至4()微米之直徑的一些 粒子一起使用。 在另外其他實施例中,撼私努& 擴散益可包含透明球體,且散射 膜可包含基於曱基矽氧烷之黏合劑 A 、 鄉σ劑其中該膜係在該球體 之内。Ρ及/或外部上。在此等竇 寺實施例令,該膜之厚度可在 °·1微米至700微米之範圍中,且可包含由不同材料製成之 散射粒子。一些實施例可包含氧化铭散射粒子,其中此等 實施例具有在°·1微米至4.0微米之範圍中的粒子厚产 該等膜之厚度可大於上文所尨々从 又 文所描这之彼等膜厚度,且可利 154501.doc •67- 201202627 用。不同黏合劑及粒子材料。如所論述,擴散器圓頂及擴散 裔可包含上文所描述之任何材料且可使用上文所描述之方 法中之任一種方法來塗覆。在一些實施例中,擴散器之黏 合劑材料可為有機聚合物(諸如,乙基纖維素、硝化纖維 素或聚(氧化乙烯))或無機聚合系統(諸如,聚矽氧或聚矽 酸乙酯)。在另外其他實施例中,黏合劑可包含搪瓷。在 一些實施例中,擴散器可包含氧化鋁、二氧化矽、氧化 鈦、二氧化鈦或其組合之散射粒子,其中一些實施例具有 在自0.1微米至ι·〇微米之範圍中的粒徑。在一些實施例 中,擴散器球體材料可為硼矽玻璃、鹼石灰玻璃或熱塑性 聚碳酸酯。一實施例可包含分散於乙基纖維素黏合劑令的 直徑為約0.5微米至0.8微米之氧化鋁粒子。含有氧化鋁粒 子及乙基纖維素之溶液的溶劑可為乙酸乙酯、乙醇、異丙 醇、乙二醇單乙醚醋酸酯及鄰苯二曱酸二丁酯。上文所描 述之範圍可適用於具有所要發射效率(諸如,大於85%)的 燈。具有較厚層可導致較低之燈發射效率。 圖3 5為展示非均勻散射膜622之一實施例的厚度變化的 曲線圖620 ’非均勻散射膜622位於如上文所描述的扁擴散 器624之内表面上。膜622之厚度係在不同高度下量測的且 範圍係自約21微米之厚度及1 〇 mm之高度至約200微米之厚 度及30 mm之高度。在擴散器之頂部處,膜之厚度為約44 微米。應理解’此等厚度可取決於如上文所論述之許多因 素而變化’諸如擴散器形狀、黏合劑材料、散射粒子之類 型等。 154501.doc •68· 201202627 圖36至圖41展示根據本發明的具有以不同方式配置之不 同擴散層的擴散器圓頂之不同實施例。此等實施例僅提供 作為實例,且應理解,可依照本發明提供許多不同配置。' 圖36展示擴散器圓頂630,擴散器圓頂63〇具有均勻外部 擴散器塗層632,及在均勻塗層632上之外部部分塗層 634。可使用許多不同方法(諸如,喷塗或浸塗)來塗覆部分 塗層634。圖37展示具有均勻内部擴散塗層642及部分外部 塗層644的擴散器圓頂640,該等塗層可使用不同方法(諸 如,喷塗或浸塗)來塗覆。圖38展示具有均勻外部塗層652 及部分内部塗層654的擴散器圓頂65〇β圖39展示具有均勻 外部塗層662及具變化之厚度的部分内部塗層664的擴散器 圓頂660。圖40展示具有具變化之厚度的部分内部塗層672 的清澈或透明擴散器圓頂670。圖41亦展示具有多個内部 塗層682、684之清澈或透明擴散器圓頂68〇,該等塗層中 之全部塗層或一些塗層可具有變化之厚度。 雖然上文之多數論述係針對使擴散器圓頂之區域中的擴 散特性變化,但應理解,遠端磷光體(磷光體載體)可具有 具不同濃度之轉換材料的區域。此情形亦可有助於產生所 要發射概況以及所要光特性。在一些實施例中,磷光體載 體可在頂部處或頂部周圍具有增加之轉換材料,但該增加 可在其他區域中。亦應理解,類似擴散器塗層,可以上文 所私述之不同内部及外部塗層組合中之任一者來將轉換材 料塗覆於磷光體載體上。 對於擴散器圓頂與磷光體載體兩者,可將塗層材料混合 15450l.doc •69· 201202627 於形成圆頂之材料中。此情形可允許在不停止沈積擴散器 或磷光體材料之情況下製造擴散器圓頂或磷光體載體。擴 散器圓頂與磷光體載體兩者可形成為所要形狀,其中所要 材料與圓頂成一體。此情形可特別適用於由可容易得到的 且容易使用之材料(諸如,塑膠)形成擴散器圓頂及/或磷光 體載體。此擴散材料及/或轉換材料亦可以不同濃度配置 於圓頂材料之不同區域中,且亦可在不同區中包含不同擴 散或轉換材料。 應理解,上文所描述之配置同等適用於除上文所描述之 燈泡型之外的照明應用。上述特徵中之全部特徵或一些特 徵亦適用於區域及管型照明。亦即,此等不同類型之燈可 利用不同形狀之遠端轉換材料及不同形狀之遠端擴散^ 如同上述實施例,遠端擴散器可具有具增加之擴散特性的 區域,或可具有幫助產生所要發射概況的形狀。 應理解,根據本發明之燈或燈泡可以除上文所描述之實 施例之外的許多^时式來配L上述實施例係參考遠端 磷光體進行論述,但應理解,替代實施 填光層之至少-些LED。此㈣可特料用於具 類型之發光器發射不同色彩之光的光源的燈。此等實施例 另外可具有上文所描述之特徵中之—些特徵或全部特徵。 圖42展示在A19大小燈泡殼7〇1内的根據本發明 的另一實施例。燈700利用具有散熱鰭片7〇3之散1片 衝(類似於上文所描述之彼等,但具有稍微不同之形狀卜 類似上述實施例,燈700包含圓頂形磷光體載體7〇4及圓頂 154501.doc •70- 201202627 形擴散器706。亦類似上述實施例,LED(未圖示)可安裝於 散熱片702之平面表面上,同時磷光體載體7〇4及擴散器 7〇6在該等LED之上。該等LED晶片、擴散器7〇6及磷光體 載體704可包含上文所描述之形狀、配置及特性中之任一 者。燈700亦可包含裝設於習知電插座中之類型的安裝機 構708,在此實施例中,安裝機構7〇8可包含用於旋入標準 螺紋旋座令之螺紋部分,以及上文所提及之替代安裝機 構。圓頂形擴散器7〇6可為許多不同形狀及大小,且在所 展不之實施例中為「扁形」,且在不同區段中可具有不同 量之擴散器,如上文所描述。 散熱片702可包含收容電源供應器單元712之空腔/外殼 71〇。電源供應器單元71〇可具有上文所論述的電源供應器 單元之特徵、元件或特性中之任一者,包括(但不限於)導 熱封灌材料。電源供應器單元712包含固持複數個電子元 件716之PCB 714,該複數個電子元件716將電源電力轉換 成led驅動信號,且亦可允許對由燈7〇〇發射之光調光。 在燈700中將PCB 714展示為垂直安裝於空腔/外殼710内, 仁應理解,在其他實施例中,PCB可以其他方式及以不同 定向來安裝’且電源供應器單元712可包含一個以上 PCB。 已參考不同形狀及大小之磷光層或磷光體載體描述上述 實%例’但其他實施例可包含除上文所描述之彼等形狀及 大j之外的不同形狀及大小。以實例說明,圖43至圖46展 於根據本發明之燈或燈泡中以達成所要燈或燈泡大 154501.doc 201202627 小或發射圖案的磷光體載體718、720、722及724之額外實 施例。此等僅為本發明預期之許多不同形狀中之一些形 狀。 雖然已參考本發明之特定較佳組態詳細描述本發明,但 其他型式係可能的。舉例而言,關於各種實施例來描述了 本發明之LED燈泡之不同特徵或態樣,但應理解,可關於 本文中所描述之該等實施例中之任一者以類似方式併有及 使用彼等特徵或態樣中之每一者,如一般熟習此項技術者 將理解°因此,本發明之精神及範疇不應限於上文所描述 之型式。 【圖式簡單說明】 圖1展示先前技術LED封裝之一實施例的截面圖; 圖2展示先前技術LED封裝之另一實施例的截面圖; 圖3展示A19替換燈泡之大小規格; 圖4為根據本發明之燈之一實施例的截面圖; 圆5為根據本發明之燈之一實施例的截面圖; 圖6為根據本發明之燈之一實施例的截面圖; 圖7至圖1〇為根據本發明之磷光體載體之不同實施例的 截面圖; 圖11為根據本發明之燈之一實施例的透視圖; 圖丨2為圖11中所展示之燈的截面圖; 圖13為圖U中所展示之燈的分解圖; 圖丨4為根據本發明之燈之一實施例的透視圖; 圖15為具有磷光體載體的圖14中之燈的透視圖; 154501.doc •72- 201202627 圖16為根據本發明之燈之一實施例的分解圖; 圖17為圖16中所展示之燈的截面圖; 圖1 8為根據本發明之散熱片之一實施例的側視圖; 圖19為根據本發明之燈之一實施例的透視圖; 圖20為圖19中所展示之實施例的透視分解圖; 圖21為圖19中所展示之實施例的截面圖; 圖22為圖19中所展示之實施例的側視圖; 圖23為圖18中所展示之燈之一部分的截面圖; 圖24為圖18中所展示之燈之一部分的另一截面圖,該燈 具有一不同散熱鰭片配置; 圖25至圖28為根據本發明之擴散器圓頂的側視圖; 圖29為根據本發明之擴散器圓頂之另一實施例的側視 圖; 圖30為展示根據本發明之燈的比較發射概況的曲線圖; 圖31為展示根據本發明之燈的發射概況的曲線圖; 圖3 2為展示根據本發明之燈之一實施例的發射特性的表 格; 圖33為展示根據本發明之特定燈實施例之發射概況的曲 線圖; 圖34為展示根據本發明之燈之一實施例的發射特性的表 格; 圖35為展示根據本發明之擴散器中的擴散器層厚度之一 實施例的曲線圖; 圖36至圖41展不根據本發明之擴散器圓頂的不同實施 154501.doc •73· 201202627 例; 圖42為根據本發明之燈之另一實施例的截面圖;及 圖43至圖46為根據本發明之磷光體載體之不同實施例的 截面圖。 【主要元件符號說明】 10 典型發光二極體(LED)封裝 11 線結合 12 LED晶片 13 反射杯 14 清澈保護樹脂 15A 導線 15B 導線 16 囊封劑材料 20 LED封裝 22 LED晶片 23 子基板 24 金屬反射器 25A 電跡線 25B 電跡線 27 線結合連接件 30 A19大小燈泡殼 50 燈 52 散熱片結構 53 反射層 154501.doc -74- 201202627 54 光學腔 56 平台 58 光源 60 散熱鰭片 62 磷光體載體 64 載體層 66 填光層 70 第一熱流 72 第二熱流 74 第三熱流 75 擴散器 76 圓頂形擴散器 100 燈 102 光學腔 104 光源 105 散熱片結構 106 平台 108 磷光體載體 110 成形擴散器圓頂 112 安裝機構/螺紋部分 120 燈 122 光學腔 124 光源 125 散熱片結構 154501.doc -75- 201202627 126 平台 128 磷光體載體 130 擴散器圓頂 132 螺紋部分 154 磷光體載體 155 半球形載體 156 磷光層 157 三維磷光體載體 158 子彈形載體 159 磷光層 160 三維磷光體載體 161 球體形狀載體 162 磷光層 163 磷光體載體 164 球體形狀載體 165 窄頸部分 166 磷光層 170 燈 172 散熱片結構 174 光學腔 176 光源 178 擴散器圓頂 180 螺紋部分 182 三維波長轉換元件/磷光體載體 154501.doc -76- 201202627 190 燈 192 LED光源 194 散熱片 196 圓頂形磷光體載體 198 擴散器 250 燈 252 散熱片 254 圓頂形磷光體載體 256 圓頂形擴散器 258 發光二極體(LED) 259 散熱片之平面表面/安裝機構 260 螺紋部分 262 本體部分 300 散熱片 302 圓柱形芯/外殼 304 散熱鰭片 306 下部部分 308 散熱片之頂部部分 450 燈 452 散熱片 453 散熱鰭片 454 圓頂形磷光體載體/波長轉換元件 456 圓頂形擴散器 458 LED晶片 154501.doc -77- 201202627 460 螺紋部分 462 印刷電路板 464 散熱片平台 466 安裝螺絲 467 螺絲孔 468 通道/散熱片突出部分 470 電絕緣層/電絕緣元件 472 窗 473 絕緣層突出部分或通道 475 雙圓頂單元 476 A19燈泡殼/輪廓 478 散熱片之下部部分 480 燈泡殼之成角度之中間部分 482 散熱片之上部部分 485 相交點 486 線 500 燈 502 中心線 504 第一三角形 506a 第一箭頭 506b 第二箭頭 506c 第三箭頭 508 第二三角形 508a 第一箭頭 154501.doc -78- 201202627 510 560 580 582 584 590 592 594 596 600 602 610 620 622 624 630 632 634 640 642 644 650 652 箭頭 扁擴散器圓頂 擴散器圓頂 均勻塗層 較厚帶塗層 曲線圖 典型白熾燈 擴散器圓頂具有均勻擴散性質之led燈 擴散器圓頂具有具更多 的LED燈 發射強度概況 概況 表格 曲線圖 非均勻散射膜 扁擴散器 擴散器圓頂 均勻外部擴散器塗層 外部部分塗層 擴散器圓頂 均勻内部擴散塗層 部分外部塗層 擴散器圓頂 均勻外部塗層 擴散材料的帶(或區域) 154501.doc -79- 201202627 654 660 662 664 670 672 680 682 684 700 701 702 703 704 706 708 710 712 714 716 718 720 722 726 部分内部塗層 擴散器圓頂 均勻外部塗層 部分内部塗層 擴散器圓頂 部分内部塗層 擴散器圓頂 内部塗層 内部塗層 燈 A19大小燈泡殼 散熱片 散熱鰭片 圓頂形磷光體載體 圓頂形擴散器 安裝機構 空腔/外殼 電源供應器單元 印刷電路板(PCB) 電子元件 磷光體載體 磷光體載體 磷光體載體 磷光體載體 154501.doc -80-In the embodiment of the lamp 170, the blue LED 154501 for the light source 176 is utilized. Doc •50· 201202627 and a combination of yellow and red scales in a scale carrier. In this case, the germanium phosphor carrier 182 is yellow or orange, and the diffuser dome 178 shields the color while dispersing the light into the desired pattern. In the lamp 17〇, the conduction path for the platform is coupled to the conduction path for the heat sink structure, but it should be understood that in other embodiments, the conduction path for the platform and the conduction path for the heat sink structure Decoupling. Figure 14 shows an embodiment of a lamp 19A not according to the present invention. The lamp 19A includes eight LED light sources 192 mounted on the heat sink 194 as described above. The illuminators can comprise a plurality of different types of LEDs. Different types can be. The noon is dissipated in different ways' and in the illustrated embodiment is connected in series. Note that in this embodiment, the illuminator is not mounted in the optical cavity, but instead is mounted on the top planar surface of the heat sink 194. Figure 15 shows a lamp 190 as shown in Figure 14, in which a spherical phosphor carrier 196 is mounted over the light source 192 shown in Figure 14. The lamp 190 shown in Figure 15 can be combined with a diffuser 198 (as described above) to form a lamp with dispersed light emission. As mentioned above, the phosphor support may comprise a plurality of conversion materials such as yellow/green and red phosphors. These phosphors provide a yellow/green component for the emission of white light. However, in various embodiments, such light can be provided directly from the LED wafer rather than via a fill-in conversion. These different configurations may provide certain advantages including, but not limited to, lamps that require lower operating power and that are less expensive by eliminating the need for a particular light barrier. In other embodiments, certain of these color components may be provided directly from LED chips of different colors. For example, the red color of the emission is 154501. Doc •51 - 201202627 The quantity can be provided directly from the red LEDs described in the following application: Yuan et al., US Patent Provisional Application No. 61/424,670 entitled "LED Lamp With Remote Phosphor and Diffuser Configuration Utilizing Red Emitters" The application is incorporated herein by reference. Figures 16 and 17 show another embodiment of a lamp 250 in accordance with the present invention, the lamps 250 being similar to those shown and described in the following application: March 3, 2010, filed with the title "Lamp With Remote U.S. Patent Application Serial No. 61/3, 39, 515, issued to U.S. Patent Application Serial No. PCT-A------ /901, 405, the disclosures of which are incorporated herein by reference. The lamp 250 includes a heat sink 252, and a dome shaped phosphor carrier 254 and a dome shaped diffuser 256, which may be of the same material as described above. It was made using the same method as described above. The lamp also includes an LED 258, which in this embodiment is mounted on a planar surface 259 of the heat sink 252 with the phosphor carrier and diffuser over the LED wafer 258. LED wafer 258 and phosphor carrier 254 may comprise any of the configurations and characteristics described above, such as some embodiments having red and blue light emitting LED wafers. The phosphor support may comprise one or more of the phosphor materials described above, but preferably comprises a phosphor that absorbs blue light and emits yellow light such that the lamp emits a combination of white light of blue, red and yellow light. 154501. Doc - 52 - 201202627 The lamp 250 can include a mounting mechanism 259 of the type installed in conventional electrical outlets. In the illustrated embodiment, the lamp 25A includes a threaded portion 260 for mounting to a standard threaded seat. Like the above embodiments, the lamp 25A can include a standard plug and the electrical socket can be a standard socket, or can include a GU24 base unit, or the light 250 can be a clip and the electrical socket can be a socket that receives and holds the clip (eg, 'As used in many fluorescent lights). The lamp according to the present invention may comprise a power supply or a power conversion unit as described above, which may be disposed in a cavity or housing within the heat sink. As above, these may include drivers to allow the bulb to be powered by the AC line voltage/current and provide source dimming capability. In some embodiments, the power supply can include an off-line constant current LED driver using a non-isolated quasi-resonant flyback topology. The LED driver can be mounted within the lamp 250, such as in the body portion 262. In some embodiments, the power supply can be non-dimmable, but at a relatively low cost. It should be understood that the power supply used can have many different topologies or geometries and can be configured in many different ways. Different lamp assemblies can have many different shapes and can be configured in many different ways. In particular, the heat sink can be configured in many different ways to meet the desired size, thermal management characteristics, and desired emission characteristics. As shown in Figure 3, the relatively specific and constrained bulb housings available for the A19 standard size can result in limited options for different shapes and sizes of fins. This is especially true for LED lamps having the characteristics that allow the lamp to meet certain emission characteristics, such as the Energy Star 8 program as described above. Figure U shows a 15450l which is not based on a heat sink 3 of a heat sink according to the present invention. Doc • 53- 201202627 Embodiment The heat sink 300 enables the LED, phosphor carrier and diffuser dome to be mounted thereon to form a lamp. The heat sink 300 can be made of the same thermally conductive material as discussed above. The heat sink 3 can be used in many different lamps, but is especially sized to accommodate the A19 bulb housing requirements, while having an angled surface that allows the lamp to emit light as required by the ENERGY STAR 8 emission. The heat sink 300 can have a cylindrical shape. Core/housing 3〇2 to accommodate the power control unit as discussed above. The heat sink 300 may also have heat dissipating fins 3〇4, which are designed to allow heat to be transmitted away from the heat generating components of the lamp (such as LEDs, power electronics, etc.). The heat sink fins 3〇4 may have many different shapes. And sized and can be made of many of the thermally conductive materials described above. There may also be many different numbers of heat sink fins 3〇4 in different embodiments, some embodiments having between 20 and 60 heat sink fins Other embodiments may have 30 to 50 heat sink fins, while other embodiments may have 35 to 4 heat sink tabs. In one embodiment, the heat sink 452 may have about 38 heat sink fins to reduce heat dissipation. The number of fins 3〇4, but this situation can result in a corresponding reduction in the surface area used to dissipate heat. When fewer fins are used, larger fins can be used, but this can result in an unacceptable amount of light being The fins may block or may cause the fins to extend outside of the A19 bulb shell. The fins 304 may each have substantially the same shape, but in other embodiments, the fins 304 may have different shapes. The same. ', each of the fins 304 may have a lower portion 3〇6, the lower portion of the system allowing the heat sink to be mounted in the intermediate angular portion of the A19 bulb shell to be sized and away from the center of the heat sink 304 angle. At 154501. Doc •54- 201202627 f5= In the example, the lower portion 306 is angled about (or relative to the horizontal direction 60) relative to the vertical, but it should be understood that the fins: have many other angles. In detail, the lower portion may have a Korean piece that is at an angle greater than 150 with respect to the vertical direction. The top of the heat sink can be partially angled back towards the center of the heat sink 30(). This angle is selected depending on the desired emission characteristics. The light can be emitted using the heat sink. Meet the ENERGY STAR 8 launching J. Life Light as described above. 4 s and as further described below the top portion can be angled so as not to block too much light emitted from the lamp in the downward direction while still providing the desired surface area for heat dissipation. 19 through 22 show an embodiment of a lamp 45 in accordance with the present invention. The lamp 45A utilizes a heat sink 452 having heat sink fins 453 similar to the heat sink fins shown in FIG. The internal components of lamp 450 are best shown in Figure 2A and Figure 21. Similar to the above embodiment, the lamp 450 includes a dome shaped phosphor carrier 454 and a dome shaped diffuser 456. The lamp also includes an LED 458, which in this embodiment is mounted on a planar surface of the heat sink 452 with the phosphor carrier 454 and diffuser 45 6 above the LED 45 8 . As with other LED lamps described herein, LED wafer 458, diffuser 456, and phosphor carrier 454 can comprise any of the shapes, configurations, and characteristics described above, such as some embodiments having red and blue Color LED chip. Phosphor support 454 can comprise one or more of the phosphor materials described above, some embodiments comprising a phosphor that absorbs blue light and emits yellow light such that the lamp emits a combination of white light of blue, red, and yellow light. The lamp 450 can comprise a mounting structure of the type mounted in a conventional electrical socket, 154501. Doc -55- 201202627 For example, the threaded portion for use in a mandrel standard threaded seat, and the alternative mounting mechanism 1 mentioned above, the top diffuser can be of many different shapes, and in the illustrated embodiment The medium is "flat" and can have different amounts of diffusers in different sections, both of which are described in U.S. Patent Application Serial No. 12/901,405, incorporated herein by reference. The LED 458 is mounted on the printed circuit board 牝2 using a conventional mounting method in which the PCB 462 is mounted to the heat sink platform 464 using mounting screws 466, the mounting screws 466 are passed through the PCB 462 and screwed into the heat sink platform - the screw holes in the heat sink platform 467. It should be understood that many other embodiments may utilize different mounting methods and mechanisms. Phosphor carrier 454 is also mounted to platform 464 and above lED 458 such that light from the LEDs passes through phosphor carrier 454, channel 468 is provided around platform 464, and the lower edge of diffuser dome 456 rests in channel 468. in. Phosphor carrier 454 and diffuser dome 456 can be mounted in position using known mounting materials and methods. In this embodiment, the diffuser dome rests in channel 468 below LED 458 and wavelength converting element 454 rests in channel 473 above LED 458. The relative mounting positions of the top surfaces of the wavelength converting element 454, the diffuser dome 456, the LED 458, and/or the heat sink 452 may vary depending on the embodiment. The diffuser dome 456 can be disposed at a lower portion of the heat sink 452 by providing a channel 468'. This situation can provide several advantages. This situation can result in an overlap between the diffuser dome 456 and the heat sink fins 453 to promote heat dissipation. This configuration may allow the diffuser dome 456 to also be lower to assist in allowing the lamps 450 to accommodate the desired length (such as the lengths provided in the A19 bulb housing). This situation also causes the lower edge of the diffuser dome 456 to be located on the phosphor carrier 154501. Doc - 56 - 201202627 Below the lower edge of body 454, the phosphor carrier is raised substantially within this diffuser dome 456. This situation places the phosphor carrier 454 closer to the center of the diffuser dome 456, which promotes uniform distribution from the lamps 45. There may be some factors that cause the practical limit of the distance that the phosphor carrier 454 can be raised relative to the diffuser dome 456. For example, if the phosphor carrier 454 is raised too close to the diffuser dome 456, yellow light from the phosphor carrier 454 may be visible through the diffuser dome 456. This situation may be unsightly for some light users. In various embodiments, the phosphor carrier 454 can be raised by a different amount relative to the diffuser dome 456. In some embodiments, the lower edge of the phosphor sphere can be raised between the 〇 and the 3 〇 pawl' while in other embodiments the distance from the lower edge of the phosphor sphere can be between 5 mm and 15 Within the range of mm. In still other embodiments, the lower edge of the phosphor sphere may increase by about 1 mm. Lamp 450 is also configured to pass a specific fall and rupture test. The pcB 462 can include electrical conductors, traces, or components that can pose a risk of electric shock in the event of exposure. In order to satisfy such rupture tests, the lamp 45A can be configured such that in the event that either or both of the diffuser dome 456 and the scale carrier 454 are broken (such as 'because of a fall), there is no wire making Dangerous exposure, in order to reduce and/or prevent this hazard, the lamp "〇 contains an electrically insulating layer 47〇 covering the #462 of the PCB 462. The insulating layer can be configured to cover the electrical conductors, traces carrying the L-number , or electrical components. Many different insulating materials can be used, including but not limited to different plastics such as polycarbonate. The insulating layer can be formed separately from the lamp and mounted in place, or the PCB 462 can be used. Once installed in the proper position, the insulation layer is formed directly on the lamp. 154501. Doc-57-201202627 A window 472 can be provided on the insulating layer 470, wherein the LEDs 458 are disposed in the window 472 such that the layer 470 does not block emissions from the LEDs. The edge of window 472 can be angled, which provides an additional advantage that the surface is configured to reflect laterally emitted LED light upward toward the phosphor carrier, which can be useful at the phosphor carrier. The light is emitted. The insulating layer 470 further includes an insulating layer protrusion or channel 473 that is sized to hold the lower edge of the phosphor carrier 454. The phosphor carrier 454 can be quickly and easily disposed in its desired position by placing and mounting the phosphor carrier 454 to the insulating layer and within the protruding portion 470, the protruding portion placing the phosphor carrier 454 in place Aligned in. The insulating layer 470 extends into the fin channel 468 where the insulating layer 470 is aligned and held in place in the channel 468 between the diffuser dome 45 6 and the surface of the channel 468. The insulating layer 470 can also include a second insulating layer protrusion or channel 473 to hold the lower end of the diffuser dome 456, wherein the protruding portion or channel 473 allows the diffuser dome 456 to be quickly and easily placed and mounted to the insulating layer 470, in a suitable location above the phosphor carrier 454 and the LED 458. Different embodiments of the insulating layer in accordance with the present invention can be configured to provide efficient lamp fabrication. In some embodiments, insulating layer 470 can be formed separately from lamp 450, and insulating layer, phosphor carrier 454, and diffuser dome 456 can be assembled into dual dome unit 475 (shown in Figure 20), respectively. The dual dome unit can be quickly and easily mounted to the heat sink and aligned with the heat sink, wherein the second insulating layer projection or channel 473 is located in the heat sink projection 468. Unit 475 can then be mounted in the appropriate position using known methods and materials 154501. Doc -58 - 201202627 Centered. By providing a separate dual dome unit 475, the lamp in accordance with the present invention can also be configured such that unit 475 can be removable and replaceable. This may be especially desirable in situations where unit 475 fails or is damaged or in order to allow access to other portions of the lamp for repair or replacement, such as PCB 462. It should be understood that other embodiments may include a separate unit having a separately formed phosphor carrier 454 and an insulating layer, and then the individual unit is mounted to the heat sink 452. The diffuser dome 456 can then be mounted to the insulating layer 470 over the phosphor carrier 454. These configurations may also allow for the sorting of the cells in the same manner as the sorting LEDs by the emission characteristics. In some embodiments, the electrically insulating element 47, the wavelength converting element 454, and/or the diffuser dome 456 comprise a mechanical coupling or retention mechanism (such as a snap or fit dog and notch) to make it easy to The dual dome units 475 are assembled together as a single unit (e.g., snap fit, thus, when manufacturing different LED bulbs having different optical characteristics, units having different optical characteristics can be easily replaced and/or installed) In addition, if the consumer f wants different characteristics, then the consumer can replace the double dome unit 47S on the existing LED bulb. In some embodiments, the electrical insulating element 47 can include a mechanical coupling mechanism. The dual dome unit 475 is easily and mechanically mounted (e.g., by snaps or mating projections) to the heat sink or outer casing of the LED bulb. In these embodiments, such mechanical mounting or holding features are Electrically insulating elements 47A are described, but such 's' are provided by separate elements that are not electrically insulated or together with electrically insulating elements. Wavelength converting elements 454 and/or diffusers The domes 456 are integrally configured or connected together as a unit to provide manufacturing advantages. For example, 154501. Doc •59· 201202627 Lu, the optical characteristics of the unit can be measured, and the unit can be sorted, for example, in the area of the 丨93丨CIE diagram. Thus, the units can be selected and mated with a solid state light source to achieve a lighting unit having the desired optical characteristics, and can permit consistent fabrication of lamps and/or bulbs having the same or similar emission characteristics. This situation can help to promote consumer satisfaction with the lamp according to the present invention. Referring now to Figure 22, lamp 450 is shown having a bulb housing/profile 476 around it, and lamp 450 is sized and shaped to fit within Α19 bulb housing 476. In particular, the lower portion 478 of the heat sink 452 is positioned, sized, and shaped to fit within the angled intermediate portion 48 of the bulb housing. The shape and mounting of the diffuser dome, heat sink, and Edison connector allows the lamp to be sized such that the overall length of the lamp within the alpha 19 bulb housing can be varied from the angle of the upper portion 482 of the beta fin 452 to the angle shown. It is required to be thermally managed while still allowing uniform emission in accordance with ENERGY STAR 8 performance requirements. That is, the heat sink should provide the desired surface area for dissipating heat while not obstructing the excess light emitted from the diffuser dome 456. In the illustrated embodiment, a line 486 that can be measured from the intersection point 485 above the heat sink and coincident with the angled surface intersects at the intersection 485. The angle between the two lines 486 can be one way to measure the angle of the heat sink surface in the upper portion. In the illustrated embodiment, the intersection point 485 is 139 mm above the lowest point of the lamp 450. This situation corresponds to about 42 between the upper angled surfaces 480. Measuring angle. It should be understood that many other measurement angles, such as 60, can be used. Or 60. Below, 5〇. Or 5〇. Below and / or 40. Or 40. The following angles. In these various embodiments, the coincidence line 154501. Doc -60- 201202627 intersect at different points above the heat sink 450. Different angle measurement methods can be used in other embodiments. Some embodiments may further be characterized by a heat sink 452 that is not wider than the diffuser dome 456 as shown. This situation further helps the lamp 45 to remain in the A19 bulb envelope while still not blocking light from the diffuser dome (4). As noted above, the lamp embodiment in accordance with the present invention can provide an emission profile that is compliant with Energy Star 8. The heat sink structure that allows ENERGY STAR 8 light compliance depends on the balance between the number of fins, the thickness of the fins'' along the contour of the emitting surface (eg 'diffuser dome') Distance, and the angle of the fin relative to the vertical axis of the lamp. For embodiments that are configured to accommodate the ANSI standard profile of A-type lamps (A19, A21, A23) while still providing sufficient fin self-producting for the specified L70 life, these parameters can directly illuminate the fins The number and location of the size 'shape'. For example, in the current embodiment of the heat sink fin 453, the greater the distance the fin 453 extends along the contour of the emitting surface, the greater the angle of the fin relative to the vertical axis, and the fins may be less likely to be allowed. The obstructed area (eg, fewer fins or thinner fins) may allow the lamp 45 to achieve an ENERGY STAR® light distribution. It should be understood that the variations shown in the figures and discussed above. The hot fin embodiment is only some embodiments of a heat sink fin configuration that meets the desired lamp emission and size requirements. Figures 23 and 24 illustrate the effect that the relative geometry of the lamp may have on the emission characteristics of the lamp. Referring first to Figure 23, a lamp 500 similar to the lamp 450 shown in Figures 19 through 22 is shown, and for the same or similar features, the same reference numerals will be used in describing the figure. 154501. Doc • 61- 201202627 Referring first to Figure 23', a centerline 502 is included from the center of the phosphor carrier 454 to the tip end of the heat sink fin 453. If the lamp has more of a light source that acts as a conventional filament from the center of the lamp, then light will be emitted from all directions in the center of the lamp' some of which is emitted along centerline 502. The surface area of the top region of the heat sink fins 453 added to the light emitted in this manner will have little effect on the lamp emission profile. However, the photochromic sphere as described herein acts more as a v〇lumetric emitter, and the entire surface illuminates in a roughly Lambertian manner. The first triangle 504 illustrates a particular sphere surface area. For less than 67 below the horizontal line. 5. At the angle of the emission, the light may be at least partially blocked by the heat sink fins 453 and may have little effect on the downward light distribution. For the first triangle 504, it is higher than 67 5 . The emission area of the angular emission, the light contributes to the total light emission. First arrow 506a, second arrow 506b, and third arrow 5〇6 (: exhibit different angles of emission from different locations within the first triangle on the phosphor carrier 454, and may indicate that more fin surface area may be self The effects of the light emitted at these different locations. The first arrow 5〇6a illustrates the light emitted from the higher region of the phosphor carrier 454, which regions have the greatest possible contribution to the downward light distribution (due to inclusion ( However, it is not limited to the phosphor carrier 454, the diffuser dome 456, and the geometry of the lamp 500 assembly of the heat sink 452. As shown by the second arrow 506b and the third arrow 506c, the lower portion of the sphere is formed. There is less and less contribution to the downward distribution from the lamp. The emission from the lower part of the sphere contributes little to the downward emission from the lamp, while the emission from the upper part of the sphere contributes significantly to the self-lighting 5 The downward emission is performed. Referring now to Figure 24, the lamp 500 is shown as having a second triangle 5〇8, a second 154501. Doc • 62 - 201202627 Triangle 508 represents the extra surface area added to the heat sink fins. For the emission from the lower part of the sphere, the added surface area has little effect on the amount of light blocked by the diffused sheet M3, but the emission from these areas has little contribution to the downward emission from the lamp, on a self-sphere The light emitted at a higher point is greatly affected. As can be seen from arrow 51(), the angle of the unobstructed emission of light is increased by comparing the first arrow 5〇8a, and the first arrow 508a exhibits an angle from the upper portion of Fig. 23. This situation in turn reduces the amount of light that is emitted downward without hindrance. This situation can cause the lamp to not reach the ENERGY STAR 8 emission characteristics. As an alternative, a larger fin surface area can be added at the lower portion of the tab, but this can cause the fin to exceed the size of the Ai9 bulb. The angles provided in the different embodiments described above provide an angle to allow the lamp to remain within the A19 bulb housing and have the desired uniform emission while still allowing the heat sink fins to have the need to dissipate heat from the lamp. Surface Area 0 It should be understood that the diffuser dome can take many different shapes to provide a dynamic relationship between the phosphor carrier and the diffuser dome that results in the desired lamp emission characteristics. In some embodiments, the shape of the diffuser dome The desired lamp size and emission characteristics can be achieved, at least in part, depending on the shape of the filler carrier. Figures 25 through 28 show the dimensions of one embodiment of a flat diffuser dome 56 in accordance with the present invention. As discussed above and in the patent application incorporated herein, a diffuser dome in accordance with the present invention can have different zones that scatter and transmit different amounts of light from a light source to help produce a desired lamp emission pattern. . In some embodiments, different regions that scatter and transmit different amounts of light can be used by 154501. Doc -63· 201202627 The same area is achieved by coating the diffuser dome with different amounts of diffusion material. This situation, in turn, modifies the output beam intensity profile of the source to provide improved emission characteristics, as described above. In some embodiments, the present invention may rely on a combination of diffuser elements (i.e., diffuser domes) and diffuser coating scattering properties to produce a desired far field strength profile of the lamp. In various embodiments, the diffuser thickness and position may depend on various factors, such as the diffuser dome geometry, the source configuration, and the pattern of light emitted from the phosphor carrier. In an embodiment, the diffuser dome can be configured to convert an emission intensity profile of a two-dimensional LED, LED array, flat phosphor conversion layer, or three-dimensional phosphor carrier into a broader beam profile, such as with an A19 incandescent lamp size and The beam profile associated with the DOE ENERGY STAR® emission characteristics. This situation may enable an LED-based efficient and cost effective alternative to conventional incandescent bulbs. Partial and/or non-uniform coatings have been found to produce a broad beam intensity profile that is desirable for white woven lamp replacements and meets ENERGY STAR® compliance in terms of uniform illuminance intensity distribution. Non-uniform coatings also provide ENERGY STAR® compliance, independent of heat sink and diffuser sphere geometry. In general, proper placement of a sufficient portion of the coating on the clear or uniformly coated diffuser dome manipulates the scattering and intensity profile of the light photon passing through the dome of the diffuser to a better angle. In the case of ENERGY STAR 8 compliance, a configuration may be to redirect the visible light so that the emission intensity at high angles is greater than 12 〇. . These configurations provide an inexpensive 2D source while meeting A19 size and energy 154501. Doc -64- 201202627 Star 8 launches a standard light. A portion of the coating of an embodiment may be present as a coating covering a percentage of the diffuser and having only a single illuminator, or the coating may be spread as a ring or strip along a particular region of the diffuser . Figure 29 shows an embodiment of a diffuser dome 58 having a uniform coating 582 covering a substantial portion of its surface and a thicker coating 584 having more diffusing material. In the illustrated embodiment, the thicker coating 5 spans the diffuser dome 58〇 with a particular viewing angle range, wherein the coating 584 prevents more light from escaping in a particular zone, such that the light is higher or higher. Leave at a low angle. 30 is a graph showing an emission intensity profile of a typical incandescent lamp 592, a diffuser dome with uniform diffusion properties, and a diffuser dome with a band (or region) of LED lamps 596 having more diffusing material. Hey. Overview 594 shows that the uniform coating has a low inspection angle or axial light intensity that is lower than throwing. With 1〇5. The strength between the angles. See overview 596, 45. With 1〇5. The intensity between the two is less than the intensity of the axial light. Due to this intensity shift, the light is greater than 1〇5. It is more intense from the perspective. Profile 596 shows that a lamp with a non-uniform coating can provide an illumination distribution that is equivalent and, in some cases, superior to an incandescent lamp. 31 shows a closer view of the emission profile 596 shown in FIG. 30, showing an emission intensity versus view of an LED lamp having a diffuser with a non-uniform coating (ie, a band or region of more diffusers). Angle curve. Figure 32 is a table listing Energy Star 8 compliance data compared to the performance of the lamp that emits the overview shown in Figure 31. One of the factors associated with ENERGY STAR 8 compliance is the ratio of the minimum to the mean. Some lamps with a uniform coating 154501. Doc -65- 201202627 can achieve almost as high as 26%. By comparison, the emission profile shown in Figure 3〇 can achieve a value of about 17% and comply with the requirement of "less than 2〇%". In this case, the coating with additional diffusion material is placed in the correct position on the diffuser dome or within the diffuser dome (between 45 and 105) to provide the desired broadened emission profile. As mentioned above, additional diffusers can be provided in many different zones or regions on the diffuser dome. Another embodiment of the invention includes a non-uniform coating that can include a plurality of partial coatings. These partial coatings can be applied using any of the methods described in this application, one of which is spray onto the diffuser dome. The coating of the additional diffuser can be deposited near the middle of the diffuser sphere, such as at about 45. To 1〇5. In the range of inspection angles. A second coating of the additional diffuser can then be deposited at the top of the diffuser dome to cover 〇〇 to about 45. Inspection perspective. These combined coatings block the imperfections. With ι〇5. A large portion of the visible light between them allows more light to pass through the diffuser dome at a higher angle. Referring now to Figure 33, circle 33 is an emission intensity profile 600 of a lamp having a diffuser dome having the two-part coating as compared to a profile 602 from a typical incandescent lamp. These profiles are very similar and the two-part non-uniform configuration shown in the table in Figure 34 achieves ENERGY STAR 8 compliance. Please note that the experiments of some of the examples have shown that the (iv) thin first band provides some reduction in the ratio of the most J value to the average (eg & to 27%). By increasing the ratio by step-by-step, the ratio is reduced more (from μ to 24%). It is also experimentally determined that once an additional diffuser is applied to the top of the diffuser dome (at about 45. In the range), it will reach 13% to 19% 154501. Doc • 66 - 201202627 The ratio of the minimum to the mean. This is only one of many different diffuser strip configurations that can be used in accordance with the present invention to produce the desired lamp emission characteristics. Different embodiments of the diffuser in accordance with the present invention can include scattering properties that vary along either of the inner and outer surfaces. In some embodiments, the diffuser can comprise a transparent material (substrate) comprising a diffusing film having varying scattering properties on its inner surface. Other embodiments may include a transparent sphere having a diffusing film on the inner and/or outer surface and/or embedded in the diffuser element 58A. The scattering films can have a number of different thicknesses depending, at least in part, on the film/binder material used, the type of scattering material, and the density of the scattering material in the film. In some embodiments the transparent spheres can have a diffuse film thickness in the range of microns, wherein the film is on the interior and/or exterior of the sphere. In embodiments in which a cellulose-based binder is used, the film thickness can range from 〇·m to _ microns where the film is attached to the interior and/or exterior of the sphere. In the use of cellulose based adhesives - in some embodiments, the oxidized scattering particles can be used with some particles having a diameter of from W microns to 4 () microns. In still other embodiments, the diffusion and diffusion can comprise a transparent sphere, and the scattering film can comprise a mercapto-based alkane-based binder A, wherein the film is within the sphere. Ρ and / or external. In these sinus embodiments, the film may have a thickness in the range of from 1 micrometer to 700 micrometers and may comprise scattering particles made of different materials. Some embodiments may comprise oxidized scattering particles, wherein such embodiments have a range of from 1 micron to 4. Thickness of the particles in the range of 0 micrometers The thickness of the films may be greater than the thickness of the films described above, and may be 154501. Doc •67- 201202627 used. Different binders and particle materials. As discussed, the diffuser dome and diffuser can comprise any of the materials described above and can be coated using any of the methods described above. In some embodiments, the binder material of the diffuser can be an organic polymer (such as ethyl cellulose, nitrocellulose or poly(ethylene oxide)) or an inorganic polymerization system (such as polyfluorene or poly(ethylene phthalate) ester). In still other embodiments, the binder may comprise enamel. In some embodiments, the diffuser may comprise scattering particles of alumina, cerium oxide, titanium oxide, titanium dioxide, or a combination thereof, some of which have Particle size in the range of 1 micron to ι·〇 micron. In some embodiments, the diffuser sphere material can be borosilicate glass, soda lime glass, or a thermoplastic polycarbonate. An embodiment may comprise a dispersion of the ethylcellulose binder to a diameter of about 0. 5 microns to 0. 8 micron alumina particles. The solvent containing a solution of alumina particles and ethyl cellulose may be ethyl acetate, ethanol, isopropanol, ethylene glycol monoethyl ether acetate or dibutyl phthalate. The ranges described above are applicable to lamps having desired emission efficiencies (such as greater than 85%). Having a thicker layer can result in lower lamp emission efficiency. Figure 35 is a graph 620 showing the thickness variation of one embodiment of the non-uniform scattering film 622. The non-uniform scattering film 622 is located on the inner surface of the flat diffuser 624 as described above. The thickness of film 622 is measured at various heights and ranges from a thickness of about 21 microns and a height of 1 〇 mm to a thickness of about 200 microns and a height of 30 mm. At the top of the diffuser, the thickness of the film is about 44 microns. It should be understood that such thicknesses may vary depending on a number of factors as discussed above, such as diffuser shape, binder material, scattering particles, and the like. 154501. Doc • 68· 201202627 Figures 36 to 41 show different embodiments of a diffuser dome having different diffusion layers configured in different ways in accordance with the present invention. These embodiments are provided merely as examples, and it should be understood that many different configurations may be provided in accordance with the present invention. Figure 36 shows a diffuser dome 630 having a uniform outer diffuser coating 632 and an outer partial coating 634 on the uniform coating 632. The partial coating 634 can be applied using a number of different methods, such as spraying or dip coating. Figure 37 shows a diffuser dome 640 having a uniform internal diffusion coating 642 and a portion of the outer coating 644, which coatings can be applied using different methods, such as spraying or dip coating. 38 shows a diffuser dome 65 having a uniform outer coating 652 and a portion of the inner coating 654. FIG. 39 shows a diffuser dome 660 having a uniform outer coating 662 and a portion of the inner coating 664 having a varying thickness. Figure 40 shows a clear or transparent diffuser dome 670 having a portion of internal coating 672 having a varying thickness. Figure 41 also shows a clear or transparent diffuser dome 68 having a plurality of inner coatings 682, 684, all or some of which may have varying thicknesses. While most of the discussion above has been directed to varying the diffusion characteristics in the region of the diffuser dome, it should be understood that the distal phosphor (phosphor carrier) can have regions of varying concentrations of conversion material. This situation can also help to produce the desired emission profile as well as the desired light characteristics. In some embodiments, the phosphor carrier can have an increased conversion material at or around the top, but the increase can be in other regions. It will also be appreciated that similar to the diffuser coating, the conversion material can be applied to the phosphor support by any of the various internal and external coating combinations described above. For both the diffuser dome and the phosphor carrier, the coating material can be mixed 15450l. Doc •69· 201202627 in the material forming the dome. This situation may allow the fabrication of a diffuser dome or phosphor carrier without stopping deposition of the diffuser or phosphor material. Both the diffuser dome and the phosphor carrier can be formed into a desired shape in which the desired material is integral with the dome. This situation may be particularly useful for forming diffuser domes and/or phosphor carriers from materials that are readily available and easy to use, such as plastic. The diffusion material and/or the conversion material may also be disposed in different regions of the dome material at different concentrations, and may also include different diffusion or conversion materials in different regions. It should be understood that the configurations described above are equally applicable to lighting applications other than the bulb type described above. All or some of the above features are also applicable to regional and tubular lighting. That is, these different types of lamps can utilize different shapes of distal conversion materials and different shapes of distal diffusion. As with the above embodiments, the distal diffuser can have regions with increased diffusion characteristics, or can help produce The shape of the profile to be launched. It should be understood that a lamp or bulb in accordance with the present invention may be discussed in addition to the embodiments described above. The above embodiments are discussed with reference to a remote phosphor, but it should be understood that instead of implementing a light-filling layer At least some LEDs. This (4) can be specifically used for lamps of the type having an illuminator that emits light of different colors. These embodiments may additionally have some or all of the features described above. Figure 42 shows another embodiment in accordance with the present invention within an A19 size bulb housing 〇1. The lamp 700 utilizes a scatter of one sheet having heat sink fins 7 〇 3 (similar to those described above, but having a slightly different shape similar to the above embodiment, the lamp 700 comprising a dome shaped phosphor carrier 7 〇 4 And the dome 154501. Doc •70- 201202627 Shaped diffuser 706. Also similar to the above embodiment, an LED (not shown) can be mounted on the planar surface of the heat sink 702 with the phosphor carrier 7〇4 and the diffuser 7〇6 above the LEDs. The LED chips, diffuser 7〇6, and phosphor carrier 704 can comprise any of the shapes, configurations, and characteristics described above. The lamp 700 can also include a mounting mechanism 708 of the type mounted in a conventional electrical socket. In this embodiment, the mounting mechanism 7A can include a threaded portion for screwing in a standard threaded rotary seat, and the above An alternative installation agency is mentioned. The dome-shaped diffusers 7〇6 can be of many different shapes and sizes, and are "flat" in the disclosed embodiments, and can have different amounts of diffusers in different sections, as described above. The heat sink 702 can include a cavity/housing 71 that houses the power supply unit 712. The power supply unit 71A can have any of the features, elements, or characteristics of the power supply unit discussed above, including but not limited to, a thermally conductive potting material. The power supply unit 712 includes a PCB 714 holding a plurality of electronic components 716 that convert the power supply to a led drive signal and may also dim the light emitted by the lamp 7A. The PCB 714 is shown mounted vertically within the cavity/housing 710 in the lamp 700, it being understood that in other embodiments, the PCB can be mounted in other ways and in different orientations and the power supply unit 712 can include more than one PCB. The above examples have been described with reference to phosphorescent or phosphorescent carriers of different shapes and sizes. However, other embodiments may include different shapes and sizes other than those described above and large j. By way of example, Figures 43 through 46 are shown in a lamp or bulb according to the present invention to achieve a desired lamp or bulb 154501. Doc 201202627 Additional embodiments of small or emissive patterned phosphor carriers 718, 720, 722 and 724. These are just a few of the many different shapes contemplated by the present invention. Although the invention has been described in detail with reference to a particular preferred embodiment of the invention, other forms are possible. For example, various features or aspects of the LED light bulb of the present invention are described with respect to various embodiments, but it should be understood that it can be used and used in a similar manner with respect to any of the embodiments described herein. Each of these features or aspects will be understood by those skilled in the art. Therefore, the spirit and scope of the present invention should not be limited to the above described. BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 shows a cross-sectional view of one embodiment of a prior art LED package; Figure 2 shows a cross-sectional view of another embodiment of a prior art LED package; Figure 3 shows the size specification of the A19 replacement bulb; A cross-sectional view of one embodiment of a lamp in accordance with the present invention; a circle 5 is a cross-sectional view of one embodiment of a lamp in accordance with the present invention; and Figure 6 is a cross-sectional view of one embodiment of a lamp in accordance with the present invention; Figure 7 to Figure 1 BRIEF DESCRIPTION OF THE DRAWINGS Figure 11 is a perspective view of one embodiment of a lamp in accordance with the present invention; Figure 2 is a cross-sectional view of the lamp shown in Figure 11; Figure 13 Figure 4 is a perspective view of one embodiment of a lamp in accordance with the present invention; Figure 15 is a perspective view of the lamp of Figure 14 with a phosphor carrier; 154501. Doc 72-201202627 Figure 16 is an exploded view of one embodiment of a lamp in accordance with the present invention; Figure 17 is a cross-sectional view of the lamp shown in Figure 16; Figure 18 is an embodiment of a heat sink according to the present invention Figure 19 is a perspective view of an embodiment of the lamp in accordance with the present invention; Figure 20 is a perspective exploded view of the embodiment shown in Figure 19; Figure 21 is a cross-sectional view of the embodiment shown in Figure 19; Figure 22 is a side elevational view of the embodiment of the lamp shown in Figure 18; Figure 23 is a cross-sectional view of a portion of the lamp shown in Figure 18; Figure 24 is another cross-sectional view of a portion of the lamp shown in Figure 18, The luminaire has a different heat sink fin configuration; Figures 25 through 28 are side views of a diffuser dome in accordance with the present invention; and Figure 29 is a side elevational view of another embodiment of a diffuser dome in accordance with the present invention; A graph of a comparative emission profile of a lamp according to the present invention; FIG. 31 is a graph showing an emission profile of a lamp according to the present invention; and FIG. 32 is a table showing emission characteristics of an embodiment of a lamp according to the present invention; 33 is a diagram showing a particular lamp embodiment in accordance with the present invention Figure 34 is a table showing emission characteristics of an embodiment of a lamp according to the present invention; Figure 35 is a graph showing one embodiment of a thickness of a diffuser layer in a diffuser according to the present invention; 36 to 41 show different implementations of the diffuser dome according to the present invention 154501. Doc • 73·201202627 Example; Figure 42 is a cross-sectional view of another embodiment of a lamp in accordance with the present invention; and Figures 43 through 46 are cross-sectional views of different embodiments of a phosphor carrier in accordance with the present invention. [Main component symbol description] 10 Typical light-emitting diode (LED) package 11 Wire bond 12 LED chip 13 Reflector cup 14 Clear protective resin 15A Wire 15B Wire 16 Encapsulant material 20 LED package 22 LED chip 23 Sub-substrate 24 Metal reflection 25A Electrical Trace 25B Electrical Trace 27 Wire Bonding Connector 30 A19 Size Bulb Shell 50 Lamp 52 Heatsink Structure 53 Reflective Layer 154501. Doc -74- 201202627 54 Optical cavity 56 Platform 58 Light source 60 Heat sink fin 62 Phosphor carrier 64 Carrier layer 66 Filling layer 70 First heat flow 72 Second heat flow 74 Third heat flow 75 Diffuser 76 Dome diffuser 100 Light 102 Optical cavity 104 Light source 105 Heat sink structure 106 Platform 108 Phosphor carrier 110 Forming diffuser dome 112 Mounting mechanism / threaded portion 120 Lamp 122 Optical cavity 124 Light source 125 Heat sink structure 154501. Doc -75- 201202627 126 Platform 128 Phosphor carrier 130 Diffuser dome 132 Threaded portion 154 Phosphor carrier 155 Hemispherical carrier 156 Phosphor layer 157 Three-dimensional phosphor carrier 158 Bullet carrier 159 Phosphor layer 160 Three-dimensional phosphor carrier 161 Sphere shape Carrier 162 phosphor layer 163 phosphor carrier 164 sphere shape carrier 165 narrow neck portion 166 phosphor layer 170 lamp 172 fin structure 174 optical cavity 176 light source 178 diffuser dome 180 threaded portion 182 three-dimensional wavelength conversion element / phosphor carrier 154501. Doc -76- 201202627 190 Lamp 192 LED light source 194 Heat sink 196 Dome-shaped phosphor carrier 198 Diffuser 250 Lamp 252 Heat sink 254 Dome-shaped phosphor carrier 256 Dome diffuser 258 Light-emitting diode (LED) 259 Flat surface/mounting mechanism of the heat sink 260 Threaded portion 262 Body portion 300 Heat sink 302 Cylindrical core/housing 304 Heat sink fin 306 Lower portion 308 Heat sink top portion 450 Lamp 452 Heat sink 453 Heat sink fin 454 Dome-shaped phosphor Body carrier / wavelength conversion element 456 dome shaped diffuser 458 LED chip 154501. Doc -77- 201202627 460 Threaded part 462 Printed circuit board 464 Heat sink platform 466 Mounting screw 467 Screw hole 468 Channel / Heat sink protruding part 470 Electrical insulation / Electrical insulation element 472 Window 473 Insulation protruding part or channel 475 Double dome Unit 476 A19 bulb housing/profile 478 fin lower portion 480 bulb intermediate portion 482 fin upper portion 485 intersection point 486 line 500 lamp 502 center line 504 first triangle 506a first arrow 506b second arrow 506c third arrow 508 second triangle 508a first arrow 154501. Doc -78- 201202627 510 560 580 582 584 590 592 594 596 600 602 610 620 622 624 630 632 634 640 642 644 650 652 Arrow flat diffuser dome diffuser dome uniform coating thicker coated curve typical incandescent Lamp diffuser dome with uniform diffusion properties of the led lamp diffuser dome with more LED lamp emission intensity profile profile table graph non-uniform scattering film flat diffuser diffuser dome uniform external diffuser coating outer portion coating Layer diffuser dome uniform internal diffusion coating part outer coating diffuser dome uniform outer coating diffusion material strip (or area) 154501. Doc -79- 201202627 654 660 662 664 670 672 680 682 684 700 701 702 703 704 706 708 710 712 714 716 718 720 722 726 Partial internal coating diffuser dome uniform outer coating part inner coating diffuser dome part Internal Coating Diffuser Dome Internal Coating Internal Coating Lamp A19 Size Bulb Shell Heatsink Heat Sink Dome Shape Phosphor Carrier Dome Diffuser Mounting Mechanism Cavity/Shell Power Supply Unit Printed Circuit Board (PCB) Electronic component phosphor carrier phosphor carrier phosphor carrier phosphor carrier 154501. Doc -80-
Claims (1)
Applications Claiming Priority (13)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US33951610P | 2010-03-03 | 2010-03-03 | |
| US33951510P | 2010-03-03 | 2010-03-03 | |
| US12/848,825 US8562161B2 (en) | 2010-03-03 | 2010-08-02 | LED based pedestal-type lighting structure |
| US38643710P | 2010-09-24 | 2010-09-24 | |
| US12/889,719 US9523488B2 (en) | 2010-09-24 | 2010-09-24 | LED lamp |
| US42467010P | 2010-12-19 | 2010-12-19 | |
| US42466510P | 2010-12-19 | 2010-12-19 | |
| US12/975,820 US9052067B2 (en) | 2010-12-22 | 2010-12-22 | LED lamp with high color rendering index |
| US43435511P | 2011-01-19 | 2011-01-19 | |
| US43532611P | 2011-01-23 | 2011-01-23 | |
| US43575911P | 2011-01-24 | 2011-01-24 | |
| US13/028,946 US9062830B2 (en) | 2010-03-03 | 2011-02-16 | High efficiency solid state lamp and bulb |
| US13/034,501 US9057511B2 (en) | 2010-03-03 | 2011-02-24 | High efficiency solid state lamp and bulb |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW201202627A true TW201202627A (en) | 2012-01-16 |
Family
ID=46756169
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW100107044A TW201202627A (en) | 2010-03-03 | 2011-03-02 | Solid state lamp and bulb |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TW201202627A (en) |
-
2011
- 2011-03-02 TW TW100107044A patent/TW201202627A/en unknown
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