201132443 六、發明說明： 【發明所屬之技術領域】 、本發明係關於由玻璃等脆性材料構成之基板分斷方 法兩特別是關於對〇.lmm以下之薄玻璃基板沿分斷預定線 使雷射光移動同時照射，將玻璃基板分斷為個別之單位要 素之方法。 【先前技術】 圖5係顯不針對板厚為〇5mm以上之玻璃基板在格 子狀地形成刻劃槽後（交又刻劃）將基板分斷為個別之單 位要素（製品）之場合之以往例之圖。一般在玻璃基板之 板厚為0.5mm以上而較厚之場合，可對基板以雷射照射形 成刻劃槽（不貫通基板之裂痕）。 在,+此場合，先使刀輪等輕微衝撞玻璃基板G之一端緣 形成觸發部T!(初期龜裂）。之後從已形成之觸發部Τ|往 第1方向（X方向）掃瞄雷射光束之光束點，接著以追隨後 方近處之方式喷射冷媒，利用基板内之深度方向之熱應力 刀布形成第1刻劃槽Si。其次，於玻璃基板G之與設有觸 發部L之端緣正交之端緣形成觸發部，從觸發部丁2往與 第1刻劃槽S!正交之第2方向（γ方向）利用深度方向之 熱應力形成第2刻劃槽s2。 此等第1刻劃槽Sl、帛2刻劃槽S2並非完全分斷基板 者’而係以半切之狀態被保持。之後，藉由施加外力使玻 璃基板G彎曲並沿刻劃槽（裂痕）分斷，取出形成於基板 201132443 上之個別之單位要素（製品）。 如上述操作而獲得之玻璃基板之單位要素201132443 VI. Description of the Invention: [Technical Field] The present invention relates to a substrate breaking method composed of a brittle material such as glass, and particularly relates to a laser beam which is disposed along a predetermined line of a thin glass substrate of less than 1 mm. A method in which a glass substrate is divided into individual unit elements by simultaneous irradiation. [Prior Art] Fig. 5 shows a case where a glass substrate having a thickness of 〇5 mm or more is formed by dividing a substrate into individual unit elements (products) after forming a scribed groove in a lattice shape (crossing and scribing) Illustration of the example. Generally, when the thickness of the glass substrate is 0.5 mm or more and the thickness is thick, the substrate can be irradiated with a laser to form a scribed groove (a crack that does not penetrate the substrate). In this case, the cutter wheel or the like is slightly struck against one end edge of the glass substrate G to form the trigger portion T! (initial crack). Then, the beam point of the laser beam is scanned from the formed trigger portion 往| in the first direction (X direction), and then the refrigerant is ejected in the vicinity of the trailing portion, and the thermal stress knives in the depth direction of the substrate are used to form the first 1 slotted Si. Next, a trigger portion is formed on the edge of the glass substrate G orthogonal to the edge on which the trigger portion L is provided, and the trigger portion is used in the second direction (γ direction) orthogonal to the first scribed groove S! The thermal stress in the depth direction forms the second scribed groove s2. These first scribed grooves S1 and 帛2 scribed grooves S2 are not completely separated from the substrate and are held in a half-cut state. Thereafter, the glass substrate G is bent by an external force and cut along the scribed grooves (cracks), and the individual unit elements (products) formed on the substrate 201132443 are taken out. Unit element of the glass substrate obtained as described above
Gi外， 1外，佔大多數之中間 不之部分）無觸發部，Outside of Gi, 1 outside, which is the middle part of the majority, no trigger part,
端緣之觸發部為起點貫通基板之裂痕進展。因此，已知基 板會突然被完全分斷（全切）。 成有觸發部之端緣部分之單位要素g 部分之單位要素G2 (以交叉剖面線顯 形成有平滑且漂亮之分斷端面。亦即 雷射光束形成刻劃槽之場合雖係為 要’但在分斷為單位要素而成為製品 為傷痕殘存。因此，觸發部殘存之區 製品排除’從位於其餘之區域之單位 具體而言，係使用由雷射光束形成之光束點，對保持 於平台上之玻璃基板G使光束點相對移動同時從先於玻璃 基板G之端緣形成之觸發部使光束點沿分斷預定線掃瞄並 加熱。藉此於分斷預定線上使壓縮應力產生。接著，以冷 卻機構以追隨已被加熱之部分之方式急冷^如上述操作使 壓縮應力區域之後部產生拉伸應力區域，以前後方向之應 力分布使貫通玻璃基板G之裂痕產生而分斷基板。藉此分 斷為形成於基板之各個別之單位要素（製品）。 4 201132443 專利文獻1 :日本特開2004-155159號公報 專利文獻2 :曰本特開200 1 -1 7〇786號公報 【發明内容] [發明欲解決之課題] 近年來，為了追求單位要素（製品）之輕量化，被要 求使玻璃基板之板厚較薄。因此，逐漸使用板厚Q i_以 下之薄玻璃基板做為基板。 然而，若欲使用雷射光束於χ_γ方向交叉切割，在於 X方向或Υ方向之任一方掃瞄雷射光束時由於板厚非常 薄而被完全分斷（全切），無法交又切割。因此，在使用 此種薄玻璃基板之場合’如H 6(a)所示，Μ玻璃基板 G之—端緣形成X方向用之觸發部τι，從此觸發部丁|往X 方向掃猫雷射光束而將如圖6(b)所示之長方形之玻璃基 板〇3完全分斷（全切）。其次，於長方形玻璃基板^之端 緣設Y方向用之觸發部T3，從此觸發部γ方向掃瞎雷 射光束而完全分斷（全切）為個別之單位要素。 如上述操作而被分斷之單位要素h係如圖6( c )所示， 於全部皆於雷射光束照射面側之端緣有觸發部L或觸發τ T3之痕跡殘留。觸發部之存在使外觀變差。因此，—。 發部做為傷痕殘存之單位要素從製品排除，會卜 都無法獲得。 民°σ 此外，即使容許有觸發部之痕跡殘留之單位要素4 、 製品，如_ 7所示，可能於觸發部做成時於觸發部前= 201132443 =小傷痕產生，此等觸發部、傷痕會於作為表面之破璃 基板之雷射光束照射面之向之破璃 因，故端面強度會劣化。“口 微小裂痕之原 之表面之電子電路等帶來早位要素 # 水电路切斷4重大之惡影響之虞。 另卜，右以形成電子電路等之側之面為「表 觸發部形成於「背面」侧 ： RS 從彦面」側進行雷射照射及 二為了 1:Γ表面便不會有觸發部之傷痕產生。然而， 接觸丰Α面」照射雷射而載置為將反面即「表面」側 接觸平台並進行雷私日 琨仃：射照射，會因與平台面 電路之破手，而有電子 面」側接…= 因此’有持續載置為「背 ==::面」接觸…之下側照射，故加= 择s 力驟無論如何都會變複雜，技術上之固難卢 增加且裝置成本増大。 <田難度 針對上述問題’本發明係以提供在於板厚1G以下 破螭基板上形成有單位要素 ’ 位要女京〔裟。之％合，以不影響單 位要素之方式分斷之方法為目的。 [解決課題之技術手段] 段上:達Γ上述目的，在本發明係採用如下之技術手 分斷方、法/發明之基板分斷方法係一種脆性材料基板之 分斷預4板厚h0以下之脆性材料基板單侧面之端緣於 疋’”之基端部形成觸發部；藉由從設有此觸發部之 目反側之面以相對於觸發部之位置為起點使雷射光束 束點沿分斷預定線掃瞒並隨之使冷媒對加熱部分喷射 6 201132443 而將基板從分斷預定線分斷。 [發明之效果] 根據本發明之分斷方法，在板厚1-0以下之基板係與板 厚較厚之場合（03mm以上）不同即使在於基板端形成 龜裂時從與設有龜裂之面之相反側之面照射雷射之場合， 龜裂亦可做為觸發部發揮作用。因此，從與設有觸發部（初 期龜裂）之面之相反側之面以相對於觸發部之位置為起點 使雷射光束刀斷預定線掃晦而分斷。因此可以於分^彳& 於雷射光束照射面側之端緣沒有觸發部且無傷痕之漂亮之 狀態分斷。藉此，於分斷後之製品沒有觸發部之漂亮之表 面（雷射光束照射面）與有觸發部或小傷痕被明確區分， 可選擇漂亮之表面做為電子電路形成等之使用面，可將起 因於氣小裂痕之電路之切斷等防患於未然。 本發明中，在板厚L0以下之脆性材料基板單側面之端 緣於第1分斷預定線之基端部形成第丄觸發部；藉由從設 有此第1觸發部之面之相反側之面以相對於第1觸發部之 二置為起點使雷射光束之光束點沿第丨分斷預定線掃晦並The trigger portion of the end edge is a crack originating from the substrate. Therefore, it is known that the substrate is suddenly completely broken (full cut). The unit element G2 of the unit element g portion having the edge portion of the trigger portion (the cross section line is formed with a smooth and beautiful broken end surface. That is, the laser beam forms a scribed groove, but it is required to be In the case of breaking into unit elements, the product remains as a scar. Therefore, the product remaining in the triggering portion excludes 'from the unit located in the remaining area, specifically, the beam spot formed by the laser beam is used, and is held on the platform. The glass substrate G relatively moves the beam spot while scanning and heating the beam spot along the breaking predetermined line from the trigger portion formed before the edge of the glass substrate G. Thereby, compressive stress is generated on the predetermined line. The cooling mechanism is quenched so as to follow the heated portion. As described above, a tensile stress region is generated in the rear portion of the compressive stress region, and the stress distribution in the front and rear directions causes cracks to pass through the glass substrate G to break the substrate. The division is a unit element (product) formed on the substrate. 4 201132443 Patent Document 1: JP-A-2004-155159 Patent Document 2: 曰本[Invention of the Invention] In recent years, in order to reduce the weight of a unit element (product), it is required to make the thickness of the glass substrate thin. Therefore, it is gradually used. A thin glass substrate having a thickness of Q i_ or less is used as a substrate. However, if a laser beam is to be cross-cut in the χ γ direction, the laser beam is scanned in either the X direction or the Υ direction because the thickness is very thin. It is completely broken (full cut), and cannot be cut and cut. Therefore, in the case of using such a thin glass substrate, as shown by H 6 (a), the end edge of the glass substrate G forms a trigger portion for the X direction. From then on, trigger the laser beam to sweep the cat's laser beam in the X direction and completely break the rectangular glass substrate 〇3 as shown in Fig. 6(b). Secondly, set the edge of the rectangular glass substrate The triggering portion T3 for the Y direction sweeps the laser beam from the direction of the trigger portion γ and completely breaks (completely cuts) into individual unit elements. The unit element h that is divided as described above is as shown in Fig. 6(c) As shown, all of them are at the edge of the side of the laser beam irradiation surface The trace of the trigger part L or the trigger τ T3 remains. The presence of the trigger part deteriorates the appearance. Therefore, the unit part of the hair part is excluded from the product as a residual element of the scar, and the memory is not available. The unit element 4 and the product with traces of the triggering part are shown in _7, and may be in front of the triggering part when the triggering part is made. = 201132443 = small scars are generated. These triggering parts and scars may be used as the surface of the glass. The surface of the laser beam on the substrate is broken, so the strength of the end face is degraded. The electronic circuit on the surface of the original micro-cracks brings about the major adverse effects of the early elemental element #水电路断4. In addition, the surface on the side to which the electronic circuit or the like is formed is "the surface trigger portion is formed on the "back side" side: RS is irradiated with laser light from the side of the face", and the second surface is not damaged by the trigger portion. produce. However, the contact with the Fengmian surface is irradiated with a laser and placed on the opposite side, that is, the "surface" side is in contact with the platform and is subjected to a thunderstorm: the radiation is irradiated, and the electronic surface is formed due to the broken hand of the platform surface circuit.接...= Therefore, there is a continuous loading of "back ==:: face" contact...the lower side of the illumination, so the addition of = s force will become complicated anyway, the technical difficulty is increased and the cost of the device is large. <Field Difficulties In view of the above problems, the present invention provides a unit element in which a unit thickness is formed on a substrate having a thickness of 1 G or less. The % combination is for the purpose of breaking the method without affecting the unit elements. [Technical means for solving the problem] On the above-mentioned object, in the present invention, the following technique is used. The hand-breaking method of the hand-breaking method and the method of the invention is a breaking of a brittle material substrate of 4 pieces of thickness h0 or less. The edge of the single side of the brittle material substrate forms a trigger portion at the base end of the 疋'"; the laser beam spot is made from the surface opposite to the trigger portion from the surface on which the trigger portion is provided The board is separated from the predetermined line by the blow of the predetermined line and the refrigerant is sprayed to the heating portion 6 201132443. [Effects of the Invention] According to the breaking method of the present invention, the thickness is 1-0 or less. When the substrate is thicker than the plate thickness (03 mm or more), even if the laser is irradiated from the surface opposite to the surface on which the crack is formed when the substrate is cracked, the crack can be used as a trigger. Therefore, the surface of the laser beam is cut off from the surface on the opposite side to the surface on which the trigger portion (initial crack) is provided, starting from the position of the trigger portion, and is broken.彳& at the edge of the side of the laser beam The beautiful state with the trigger part and no flaws is broken. By this, the beautiful surface (the laser beam irradiation surface) of the product without the trigger part is clearly distinguished from the trigger part or the small flaw, and the beautiful one can be selected. The surface is used as a surface for the formation of an electronic circuit, etc., and the cutting of the circuit due to small cracks can be prevented. In the present invention, the edge of the single side surface of the brittle material substrate having a thickness L0 or less is first. a base end portion of the predetermined line is formed to form a second trigger portion; the beam point of the laser beam is made from a surface opposite to the surface on which the first trigger portion is provided with respect to the first trigger portion Break the predetermined line along the third 晦 and
^之使冷媒對加熱部分噴射而將基板分斷為長方H -人：：被分斷為長方形之基板之形成有前述第Μ發部之 相同單側面之端緣於與前述第！分斷預定線正交之第2分 : 預定線之基端部形成第2觸發部；藉由從設有此第2觸 佶街μ面之相反側之面以相對於帛2觸發部之位置為起點 對力献光束之光束點沿第2分斷預定線掃猫並隨之使冷媒 對加熱部分喷射而將基板分斷為單位要素亦可。 201132443 藉此，可不於表面形成觸發部痕跡而確實製作於縱橫 具有分斷面之單位要素（製品）。 【實施方式】 於以下基於顯示其實施形態之圖式詳細說明本發明之 分斷方法之詳細。 圖1為顯示本發明之分斷方法之實施態樣之立體圖， 圖2為顯示第i觸發部與第！方向（χ方向）之分斷預定線 之玻璃基板之立體圖，® 3為顯示第2觸發部與第2方向 (Υ方向）之分斷預定線之長方形破璃基板之立體圖，圖4 為被分斷為單位要素之玻璃基板之立體圖。 以本發明方法分斷之玻璃基板1係以0.1mm以下之薄 板厚形成’被以適當之固定機構’例如空氣吸引機構等保 持於支持平台2。於玻璃基板丨上縱橫地形成❹數之單位 要素（成為製品之單位）。 於支持平 上之玻璃基板 之壓縮應力之 雷射光學系統 使貫通裂痕沿 之前端安裝有 雷射光學 前排列為一列 搭載玻璃基板 1沿分斷預定線分斷而使㈣1 Μ局部性 加熱手段之雷射光學系、统3、以及藉由追隨此 3並冷卻已加熱之區域來使拉伸應力產生並 分斷預定線進展之冷卻機構4。於冷卻機構4 噴射冷煤之喷嘴4a。 系統3及冷卻機構4係以雷射光學系統3在 ’被共通之保持構彳5支持，形成為可相對 1之支持平台2沿排列方向移動。 8 201132443 於支持平台2之下方設有可藉由升降機構上下移 刀輪8。 < 基板1之端緣係以比支持平台2之端稍往外側伸出之 狀態被載置。在沿分斷預^線分斷時，在玻璃基板1之端 緣於沿X方向之第i分斷預定線6a之基端部形成第！觸發 部7a。第1觸發部7a係藉由使刀輪衝撞端緣來形成。 如圖1 '圖2所示，對設有此第！觸發部乃之面之背 面側，以相對於第1觸發部7a之位置為起點使雷射光學系 統3及冷卻機構4沿第1分斷預定線6a相對移動。藉此， 以因雷射光束之加熱而產生之壓縮應力與因冷卻機構4之 急冷而產生之拉伸應力之前後方向之分布將玻璃基板丨分 斷為如圖3所示之橫長之長方形之基板la。在此場合由 於玻璃基板1之板厚為〇丨mm以下而較薄，故不會因前後 方向之壓縮應力與拉伸應力而以位於相反面之第1觸發部 7a為起點形成刻劃槽而會被突然分斷。 其次’在被分斷為長方形之玻璃基板U之形成有第1 觸發部7a之相同面之端緣使用刀輪8於與第1分斷預定線 6a正交而於γ方向延伸之第2分斷預定線6b之基端部形成 第2觸發部7b。 對設有此第2觸發部7b之面之背面側，以相對於第2 觸發部7b之位置為起點使雷射光學系統3、冷卻機構4沿 第2分斷預定線6b相對移動。 藉此’以位於相反面之第2觸發部7b為起點，以前後 方向之壓縮應力與拉伸應力之應力分布將玻璃基板la分斷 201132443 為如圖4所示之單位要素丨匕。 々上述破刀斷之單位要素lb於雷射光束照 緣沒有觸發部之谪忧嫌如如 』阳側之知 P之痕跡殘留。藉此’分斷後之 發部之漂亮之表面报# m , 竹以無觸 辰面Φ成。因此，可選擇無觸發部古 表面做為電子電路箄 ""冗之 路η… 可將起因於微小裂痕之電 路之切斷荨防患於未然。 以上雖已針對本發明之代表性之實施㈣日月，但本發 特定於上述之實施形態者，可在達成其目的且不超 出申睛專利範圍之範圍内適#修正、變更。 [產業上之可利用性] 本發明之分斷方法除玻璃基板外，亦可利用於將由 石夕、陶究、化合物半導體等脆性材料構成之薄板厚之基板 分斷之場合。 【圖式簡單說明】 圖1為顯示實施本發明之分斷方法之一實施態樣之立 體圖》 u 圖2為顯示第丨觸發部與第丨方向（χ方向）之分斷預 定線之玻璃基板之立體圖。 圖3為被分斷為長方形之玻璃基板之立體圖。 圖4為被分斷為單位要素之玻璃基板之立體圖。 圖5為說明以往之玻璃基板之分斷方法之圖。 圖6為以使用以往之雷射光束之分斷方法分斷〇 lmrn 以下之薄玻璃基板之場合之圖。 10 201132443 圖7為一般之觸發部形成部分之擴大立體圖 【主要元件符號說明】 1 玻璃基板 la 被分斷 lb 被分斷 2 支持平 3 雷射光 4 冷卻機 4a 喷嘴 6a 第1分 6b 第2分 7a 第1觸 7b 第2觸 為長方形之玻璃基板 為單位要素之玻璃基板 台 學系統 構 斷預定線 斷預定線 發部 - 發部 11^ The refrigerant is sprayed on the heating portion to break the substrate into a rectangular H-person:: the edge of the substrate which is divided into a rectangular shape and formed with the same single side of the first hair-emitting portion is the same as the foregoing! The second point where the predetermined line is orthogonal: the base end portion of the predetermined line forms a second trigger portion; and the position of the trigger portion with respect to the 帛2 is obtained from the surface on the opposite side of the second contact surface The beam point of the beam of the force beam is used as a starting point to sweep the cat along the second predetermined line and the refrigerant is sprayed on the heating portion to separate the substrate into unit elements. In this way, it is possible to form a unit element (product) having a cross-section in the vertical and horizontal directions without forming a trace of the trigger portion on the surface. [Embodiment] The details of the breaking method of the present invention will be described in detail below based on the drawings showing the embodiments thereof. 1 is a perspective view showing an embodiment of the breaking method of the present invention, and FIG. 2 is a view showing an ith triggering portion and a first! In the direction (χ direction), the perspective view of the glass substrate of the predetermined line is broken, and the product 3 is a perspective view of the rectangular glass substrate showing the predetermined line of the second trigger portion and the second direction (Υ direction), and FIG. 4 is divided into A perspective view of a glass substrate broken into unit elements. The glass substrate 1 which is cut by the method of the present invention is formed to have a thin plate thickness of 0.1 mm or less and is held by the support platform 2 by an appropriate fixing mechanism such as an air suction mechanism. The unit element (the unit of the product) of the number of turns is formed vertically and horizontally on the glass substrate. The laser optical system supporting the compressive stress of the flat glass substrate causes the through crack to be arranged along the front end with the laser optics arranged in a row to mount the glass substrate 1 along the predetermined line to break (4) 1 Μ local heating means The optical system, the system 3, and the cooling mechanism 4 that generates and breaks the predetermined line by following the 3 and cooling the heated region. The cold coal nozzle 4a is sprayed to the cooling mechanism 4. The system 3 and the cooling mechanism 4 are supported by the laser optical system 3 in a common holding structure 5, and are formed to be movable in the arrangement direction with respect to the support platform 2 of 1. 8 201132443 Below the support platform 2, there is a cutter wheel 8 that can be moved up and down by the lifting mechanism. < The edge of the substrate 1 is placed in a state of being slightly extended outward from the end of the support platform 2. At the end of the glass substrate 1, the end portion of the glass substrate 1 is formed at the base end portion of the i-th breaking predetermined line 6a in the X direction! Trigger portion 7a. The first trigger portion 7a is formed by causing the cutter wheel to collide with the end edge. As shown in Figure 1 'Figure 2, the pair is equipped with this! On the back side of the surface of the trigger portion, the laser optical system 3 and the cooling mechanism 4 are relatively moved along the first breaking planned line 6a with respect to the position of the first trigger portion 7a. Thereby, the glass substrate is separated into a horizontally long rectangular shape as shown in FIG. 3 by the distribution of the compressive stress generated by the heating of the laser beam and the tensile stress generated by the rapid cooling of the cooling mechanism 4. The substrate la. In this case, since the thickness of the glass substrate 1 is 〇丨mm or less, the scribed groove is formed by the first trigger portion 7a located on the opposite side from the compressive stress and the tensile stress in the front-rear direction. Will be suddenly broken. Next, the end of the same surface on which the first trigger portion 7a is formed in the rectangular glass substrate U is divided into the second branch extending in the γ direction by the cutter wheel 8 orthogonal to the first breaking planned line 6a. The base end portion of the broken planned line 6b forms the second trigger portion 7b. On the back side of the surface on which the second trigger portion 7b is provided, the laser optical system 3 and the cooling mechanism 4 are relatively moved along the second predetermined line 6b with respect to the position of the second trigger portion 7b. Thereby, the glass substrate la is divided by the stress distribution of the compressive stress and the tensile stress in the front and rear directions with the second trigger portion 7b located on the opposite side as the starting point. 201132443 is the unit element 如图 shown in Fig. 4 .单位The unit element lb of the above-mentioned broken blade is not ignorant of the triggering of the laser beam. The sensation of the positive side of P is residual. By this, the beautiful surface of the hairline after the break is reported as #m, and the bamboo is formed by the touchless surface. Therefore, you can choose the non-trigger ancient surface as the electronic circuit 箄 "" redundant road η... can prevent the cutting of the circuit caused by tiny cracks. Although the above is a representative implementation of the present invention (4), the present invention is specific to the above-described embodiments, and may be modified or changed within the scope of achieving the object and not exceeding the scope of the patent application. [Industrial Applicability] The breaking method of the present invention can be used for dividing a substrate having a thin plate thickness composed of a brittle material such as Shi Xi, Ceramics, and a compound semiconductor, in addition to the glass substrate. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view showing an embodiment of a breaking method for carrying out the present invention. FIG. 2 is a glass substrate showing a predetermined breaking line of a third triggering portion and a second direction (χ direction). Stereo view. 3 is a perspective view of a glass substrate that is divided into rectangles. 4 is a perspective view of a glass substrate that is broken into unit elements. Fig. 5 is a view for explaining a method of dividing a conventional glass substrate. Fig. 6 is a view showing a case where a thin glass substrate of 〇 lmrn or less is divided by a conventional breaking method of a laser beam. 10 201132443 Figure 7 is an enlarged perspective view of the general trigger portion forming part [Description of main component symbols] 1 Glass substrate la is divided lb is divided 2 Supports flat 3 Laser light 4 Cooler 4a Nozzle 6a 1st point 6b 2nd point 7a 1st touch 7b The second touch is a rectangular glass substrate, and the glass substrate of the unit element is cut off. The predetermined line breaks the predetermined line hair part - the hair part 11