201139136 六、發明說明： 【發明所屬之技術領域】 本發明係關於基板搬運夾具用複合薄片體及基板搬運 夾具，尤其是，與以構成將電子構件等安裝於FPC基板等 基板時所使用之基板搬運夾具爲目的之基板搬運夾具用複 合薄片體、及使用其之基板搬運夾具相關。 【先前技術】 例如，疊層著聚醯亞胺薄膜及配線電路用導體之薄片 狀具之可撓性之印刷電路基板（Flexible Printed Circuits :以下，稱爲FPC基板），又薄又具柔軟性，近年來，做 爲用以構成小型電子機器之電路的基材，佔有極爲重要的 地位。 經由安裝製程，於如上述之FPC基板安裝著各種電子 構件。對FPC基板之電子構件的安裝，例如，係由錫膏焊 接印刷製程、電子構件裝配製程、迴焊製程、切割製程等 所構成。此種電子構件之連續安裝線時，係使F P C基板保 持於平坦化狀態，亦即，保持於不會剝離之狀態，而於各 製程內及各製程間進行搬運。 以搬運FPC基板爲目的之搬運夾具，例如，日本特開 2003 -2 73 5 8 1號公報之提案，係將由具有黏著性之矽橡膠 所構成之薄片接著·固定於支持體上而構成之搬運托板。 其次，依據該提案，相較於利用傳統接著膠帶之固定方法 等，可追求作業性之提高並防止品質之劣化》 -5- 201139136 然而，上述先前技術之提案，於通常爲200〜260 °C程 度之高溫環境下進行處理之迴焊製程時，矽橡膠所含有之 低分子矽氧烷會以釋氣之形態被釋出，此種氣體若接觸電 子構件之接點部，將發生接點不良的問題。 爲了解決上述問題，日本特開2004-363438號公報提 出了將不含矽氧烷之氟橡膠系彈性薄片配設於支撐板上之 基板搬運夾具的提案。 然而，氟橡膠系之彈性薄片，於迴焊製程之200〜260 °C溫度下，呈現對被附著體之FPC基板及支撐板之黏著性 劣化的傾向。換言之，有高溫環境下呈現黏著性降低的問 題。所以，迴焊製程時，可能發生被保持於彈性薄片之 FPC基板剝離、或彈性薄片從支撐板剝離的情形。 爲了解決上述問題，本專利申請人已於日本特開 2009- 1 70487號公報提出以下之提案，亦即，即使於迴焊 溫度下，對被附著體之基板及支撐板亦具有夠高之黏著力 ，於迴焊製程，可確實地固定保持基板而不會從支撐板剝 離之氟橡膠系基板搬運夾具用黏著橡膠薄片。 然而，傳統提案之基板搬運夾具用黏著橡膠薄片，薄 片本身不具所謂之彈性，所以，處理能力性較差，處理上 較爲不便。雖然追求薄片厚肉化來提升處理能力性，然而 ，欠缺經濟性，而且，正好與薄片薄肉化之期望背道而馳 〇 此外，所謂被附著物之FPC基板，於進入搬運過程前 之初期階段，有時背面會呈現凹凸（主要係導體及構件預 -6- 201139136 先被埋設於基板內部所導致），故期待可實施與該凹凸完 美配對之技巧的基板搬運夾具用薄片。尤其是，多品種少 量生產之現場對其有特別大的期望。同時，傳統例時，係 以與FPC基板背面之凹凸完美配對的方式，對應各對象製 品進行玻璃環氧基板表面（需要1〜2個月之加工期間）之 切削。此時，FPC基板係以黏著膠帶進行固定。 此外，被附著物之FPC基板的背面（疊層方向下方之 位置），通常會讓使用材料之聚醯亞胺露出。此時，在使 FPC基板背面之聚醯亞胺與氟橡膠密貼的狀態下，進行加 壓、或施加迴焊溫度程度之溫度時，雙方之黏著相容性可 能會過佳，然而，大幅提高密貼性，有時將導致極難將 FPC基板從氟橡膠剝離的情形。此時，施加較大的力來勉 強剝離的話，可能會導致FPC基板破損。 此外，與支撐板之密貼時，支撐板表面之凹凸亦可能 導致少許氣泡殘留之問題。氟橡膠之氣體障壁性高，加溫 將導致氣泡的膨脹。 有鑑於以上之事實，本發明之目的，係在提供一種基 板搬運夾具用薄片，薄片本身具有彈性，處理能力性提高 ，處理更爲便利，此外，可對應薄片薄肉化之期望。 此外，提供可實施與FPC基板背面之凹凸完美配對之 技巧的基板搬運夾具用薄片。 此外，提供對FPC基板具有適當黏著性之基板搬運夾 具用薄片。 此外，提供對支撐板之黏著性亦優良，該接合面之氣 201139136 泡殘留極少而可解決加熱製程之膨脹等問題的基板搬運夾 具用薄片。 【發明內容】 爲了解決上述課題，本發明係被固定於支撐板上而用 以構成基板搬運夾具之基板搬運夾具用複合薄片體，該複 合薄片，在固定於支撐板上之前的狀態，係由具有：耐熱 性樹脂薄膜、形成於該耐熱性樹脂薄膜之一方平面且已經 過硫化處理之氟橡膠層、以及形成於該耐熱性樹脂薄膜之 另一方平面且未硫化之氟橡膠糊層之疊層體所構成。 此外，本發明之基板搬運夾具用複合薄片體之良好實 施形態，前述耐熱性樹脂薄膜係由從聚醯亞胺、聚醚醯亞 胺、聚醚颯、聚苯硫、以及聚醚酮之群組所選出之1種所 構成。 此外，本發明之基板搬運夾具用複合薄片體之良好實 施形態，前述已經過硫化處理之氟橡膠層，係將含有氟橡 膠、硫化劑、及共交聯劑之橡膠摻合物配設於耐熱性樹脂 薄膜上並實施硫化處理而形成。 此外，本發明之基板搬運夾具用複合薄片體之良好實 施形態，前述未硫化之氟橡膠糊層，係將含有以氟橡膠爲 主要成份之橡膠摻合物配設於耐熱性樹脂薄膜上而形成。 此外，本發明之基板搬運夾具用複合薄片體之良好實 施形態，前述未硫化之氟橡膠糊層，係除了氟橡膠以外， 尙將含有硫化劑及共交聯劑之橡膠摻合物、或含有硫化劑 -8 - 201139136 及共交聯劑之一方的橡膠摻合物配設於耐熱性樹脂薄膜上 而形成。 此外，本發明之基板搬運夾具用複合薄片體之良好實 施形態，其構成上，前述耐熱性樹脂薄膜之厚度爲1 〇〜50 /im，前述已經過硫化處理之氟橡膠層之厚度爲5〜50ym ，前述未硫化之氟橡膠糊層之厚度爲5〜3〇vm。 此外，本發明之基板搬運夾具用複合薄片體之良好實 施形態，由前述疊層體所構成之複合薄片的構成上，總厚 爲 20 〜130# m。 此外，本發明之基板搬運夾具用複合薄片體之良好實 施形態，前述未硫化之氟橡膠糊層側係被固定於支撐板上 ，而用以固定被搬運至前述已經過硫化處理之氟橡膠層上 之基板，前述已經過硫化處理之氟橡膠層之構成上，表面 粗細度爲Ra = 0.1〜10/z m。 本發明之基板搬運用夾具，係疊層著具耐熱性之支撐 板、及前述基板搬運夾具用複合薄片體而構成。 本發明係疊層著具耐熱性之支撐板、及前述基板搬運 夾具用複合薄片體而形成之基板搬運用夾具的製造方法， 該方法係切割基本之大小的基板搬運夾具用複合薄片體來 準備基礎複合薄片體，並將該基礎複合薄片體之未硫化之 氟橡膠糊層側固定於支撐板上而構成。 此外，本發明之基板搬運用夾具之製造方法的良好實 施形態，係於基礎複合薄片體上，疊層•固定有預先配合 存在於搬運對象之基板背面凹部形狀而準備之基板搬運夾 -9 - 201139136 具用複合薄片體切割片而構成。 此外，本發明之基板搬運用夾具之製造方法的良好實 施形態，係以前述切割片之未硫化之氟橡膠糊層側做爲位 於疊層方向下方之固定面來構成。 本發明之基板搬運夾具用複合薄片體，因爲係如上所 述之構成，故薄片本身具有彈性，處理能力性獲得提升， 處理更爲便利。此外，可以對應薄片薄肉化之要求。此外 ’因爲薄片可以薄肉化，故爲可實施與FPC基板背面之凹 凸完美配對之技巧的薄片。此外，對FPC基板具有適當黏 著性，而具有優良之黏著性及剝離性。支撐板之黏著性亦 優良’該接合面之殘留氣泡亦極少，而不會發生加熱製程 之膨脹等問題。 【實施方式】 以下，針對用以實施本發明之形態進行詳細說明。 第1圖係本發明之基板搬運夾具用複合薄片體30的剖 面圖’第2圖係依序疊層著支撐板10、基板搬運夾具用複 合薄片體30、以及FPC基板50等被附著體之狀態的剖面圖 〇 本發明之基板搬運夾具用複合薄片體30,係固定於支 撑板10上而用以構成基板搬運夾具之薄片體。通常之使用 方法，係將基板搬運夾具用複合薄片體30(以下，亦簡稱 爲「複合薄片體30」）疊層於支撐板10之上，於該複合薄 片體30之上，則疊層著FPC基板等被附著體（以下，亦簡 201139136 稱爲「FPC基板50」）。 此外，本發明之複合薄片體3 0之槪念，並未限 面所示之片狀物，也包含所謂帶狀形態之物在內。 態之物時，亦可切割成片狀來使用，亦可從捲附於 帶狀物連續拉出帶狀物來使用。 以下，針對各構成要素進行詳細說明。 <支撐板1〇> 用以構成供本發明之基板搬運夾具用複合薄片 定之支撐板1 0的材料，例如，可以使用纖維強化環 (尤其是，玻璃環氧樹脂）、聚醚楓、聚丙烯酸酯 亞胺、銘、氧化銘、氮化銘、銘合金、不錄鋼、鎂 。尤其是’最好爲纖維強化環氧樹脂（尤其是，玻 樹脂）。 支撐板10與複合薄片體30之固定，係利用複合 30表面之黏著力來實施。因此，複合薄片體30表面 力劣化時’很簡單即可更換新品來使用。此外，爲 支撐板10與複合薄片體30之固著力，只要於安裝過 使複合薄片體30表面產生交聯即可。支撐板10之 0.3〜5mm程度。 <複合薄片體30之構成> 複合薄片體30，如第1圖所示，於固定至支撐 前的狀態’係由具有：耐熱性樹脂薄膜3 5、形成於 制爲圖 帶狀形 滾筒之 體30固 氧樹脂 、聚醯 合金等 璃環氧 薄片體 之黏著 了提高 程設法 厚度爲 板上之 該耐熱 -11 - 201139136 性樹脂薄膜3 5之一方平面3 6之已經過硫化處理的氟橡膠層 3 7、以及形成於耐熱性樹脂薄膜之另一方平面3 4之未硫化 的氟橡膠糊層33之疊層體所構成。亦可以介由未圖示之中 間層而爲4層以上之疊層體，然而，通常如第】圖所示，以 3層疊層體爲佳》 此處，「於固定至支撐板上之前的狀態」，係爲了明 確界定發明之構成及技術範圍。亦即，如後面所述，本發 明之未硫化的氟橡膠糊層33中，有時會預先含有硫化劑或 共交聯劑，此時，例如，若爲已經過迴焊製程，則不能將 氟橡膠糊層3 3稱爲未硫化。所以，必須明確地標明於那一 時點爲未硫化。 耐熱性樹脂薄膜3 5 用以構成複合薄片體30之大致中央部之耐熱性樹脂薄 膜35的材料，可以從聚醯亞胺、聚醚醯亞胺、聚醚颯、聚 苯硫、以及聚醚酮之群組所選取。尤其是，最好爲聚醯亞 胺。藉由此種耐熱性樹脂薄膜35可以發揮複合薄片體30之 所謂芯材的機能，故可以使複合薄片體3 0具有剛性，而提 升處理能力性，且可追求複合薄片體3 0之整體厚度的薄層 化。 耐熱性樹脂薄膜35之厚度應爲10〜50// m，10〜30 更佳，最好爲12〜25/zm程度。其厚度爲lOjtzm以下時 ，有難以發揮所謂芯材之機能的問題。此外，其厚度超過 50#πι時，有無法實現複合薄片體30之整體厚度薄層化的 -12- 201139136 問題。 已經過硫化處理之氟橡膠層3 7 於第1圖所示耐熱性樹脂薄膜3 5之一方平面3 6上，形 成著已經過硫化處理之氟橡膠層3 7。該已經過硫化處理之 氟橡膠層3 7，如圖所示，實施形態時，係位於複合薄片體 3 0之頂層，用以黏著•固定FPC基板50等（參照第2圖）。 已經過硫化處理之氟橡膠層3 7，係將含有氟橡膠、硫 化劑、以及共交聯劑之橡膠摻合物配設於耐熱性樹脂薄膜 上，並進行硫化處理而形成。 .氟橡膠之良好實例，例如，可以使用二氟乙烯/六氟 乙烯（VDF/HFP)系共聚物、二氟乙烯/六氟乙烯/四氟乙 烯（VDF/HFP/TFE)系共聚物、二氟乙烯/全氟烷基乙烯 基醚/四氟乙烯（VDF/PAVE/TFE )系共聚物、二氟乙烯/ 全氟烷基乙烯基醚/六氟乙烯（VDF/PAVE/HFP)系共聚物 、二氟乙烯/全氟烷基乙烯基醚/六氟乙烯/四氟乙烯（ VDF/P AVE/HFP/TFE )系共聚物等。 氟橡膠之市販品，可以VITON (登錄商標）GTL、同 GTL-S、同 GFLT、同 GFLT-S、同 GF、同 GF-S、同 GBL、 同GBL-S(以上，DUPONT ELASTOMER (股）公司製） 等爲例。 硫化劑，尤其是，應使用非硫黃硫化劑之有機過氧化 物。有機過氧化物之良好實例’如2,5_二甲基-2,5_雙（t-丁基過氧基）己烷、過氧化二異丙苯、雙（t_ 丁基過氧基 -13- 201139136 )二異丙基苯等。其中，又以2,5-二甲基-2,5-雙（t-丁基 過氧基）己烷爲佳。 上述硫化劑，相對於氟橡膠100重量份，應爲0.5〜1G 重量份，1〜8重量份更佳，最好爲1〜5重量份。選擇配合 量時，不但於常溫下，於迴焊溫度（通常，200〜260 °C ) 下，對被附著體（FPC基板50 )是否也具有夠高黏著力係 重要的條件。 共交聯劑（交聯助劑）之良好實例，如三烯丙基異三 聚氰酸酯（TAIC)、三烯丙基異三聚氰酸酯預聚合物（ TAIC預聚合物）、三甲代烯丙基異氰酸酯（TMAIC )、三 聚氰酸三烯丙酯、.三烯丙基苯三甲酸酯、N，N’-m-苯基二 馬來酸跣亞胺、三甲醇基丙烷三甲基丙烯酸酯等。 上述共交聯劑，相對於氟橡膠1〇〇重量份，應爲0.5〜 10重量份，1〜8重量份更佳，最好爲1〜5重量份。選擇配 合量時，與上述硫化劑時相同，不但於常溫下，於迴焊溫 度（通常，200〜260 °C)下，對被附著體（FPC基板50) 是否也具有夠高黏著力係重要的條件。 上述橡膠組成物，在未背離本發明之作用效果的範圍 ，可以含有導電性粒子、氧化鋅、氫氧化鈣、氧化鎂等吸 附劑、或各種充塡劑等其他成份。尤其是，從防止帶電、 防止FPC基板50之污染的觀點而言，含有導電性之碳黑、 碳奈米管等也是良好的實施形態。 用以形成上述已經過硫化處理之氟橡膠層3 7的良好方 法，係於耐熱性樹脂薄膜3 5之一方平面3 6上，以輥塗法、 -14- 201139136 刮塗法、擠壓塗佈法等塗佈橡膠組成物之薄膜，然後 施以塗膜之硫化'交聯爲目的之加熱處理即可。 硫化（交聯）方式，可以利用硫化罐之交聯方式 熱筒加壓硫化（鼓式硫化機等）等之連續交聯方式、 用模具之交聯方式等爲例。此外，以本發明之複合薄 3 0來進行帶狀形態物之成形時，必須選擇上述硫化方 中之利用硫化罐之交聯方式、或加熱筒加壓硫化等之 交聯方式。硫化條件（加熱條件），例如，1次加熱| 〜200°c溫度範圍之5〜20分鐘程度，2次加熱爲180、 °C範圍之2〜6小時程度。 已經過硫化處理之氟橡膠層37的厚度應爲5〜50^ 10〜40# m更佳，最好爲15〜30# m程度。該厚度爲ί 以下時，有無法形成均一覆膜的問題。此外，該厚度 50#m時，效果沒有差異，然而，有無法追求複合薄 3 0整體之厚度薄層化的問題。 已經過硫化處理之氟橡膠層3 7之表面3 8，應刻意 形成凹凸之粗面處理。粗面處理之方法，例如，於硫 ，可以利用對橡膠表面壓印用以使表面粗面化之擠壓 樹脂薄膜（PET等）、或含浸樹脂之基布等來轉印凹 之方法等來進行處理。 上述粗面處理之結果，已經過硫化處理之氟橡膠 表面38的表面粗細度Ra(JIS BO601)應爲0.1〜10/z 最好爲0.2〜5/z m。 該Ra値爲0. 1 /z m以下時，密貼固定於已經過硫化 ，實 、加 及利 片體 式當 連續 | 150 -250 m 1 > β m 超過 片體 實施 化時 板、 凸面 層3 7 處理 -15- 201139136 之氟橡膠層37表面38之FPC基板50 ’於製程結束後將難以 剝離。結果，被強制剝離之FPC基板50可能受損。尤其是 ，聚醯亞胺露出於被附著體之FPC基板5 0等之背面時（一 般都會露出）’該傾向極爲明顯。 另一方面，Ra値超過10"m時，與FPC基板50沒有足 夠的固著性，於製程途中可能發生剝離。 未硫化之氟橡膠糊層33 如第1圖所示，於耐熱性樹脂薄膜35之另一方平面34 ，形成有未硫化之氟橡膠糊層33。該未硫化之氟橡膠糊層 33，如圖所示，實施形態時，係位於複合薄片體30之底層 而黏著•固定於支撐板10上。 未硫化之氟橡膠糊層3 3，係於耐熱性樹脂薄膜3 5上配 設含有以氟橡膠爲主要成份之橡膠摻合物而形成。只要至 固定於支撐板1 〇上之前爲止，可維持未硫化狀態，未硫化 之氟橡膠糊層33中亦可含有硫化劑或共交聯劑等。換言之 ，未硫化之氟橡膠糊層，除了氟橡膠以外，尙將含有硫化 劑及共交聯劑之橡膠摻合物、或含有硫化劑及共交聯劑之 一方的橡膠摻合物配設於耐熱性樹脂薄膜上而形成。上述 所代表之意思，係「未硫化之氟橡膠糊層3 3」與未經過硫 化處理之氟橡膠層爲同義。 本發明時，係藉由利用未硫化之氟橡膠糊層3 3來進行 與支撐板1 〇之固定，不但可以得到良好黏著性，且可得到 以下之極優效果。亦即，未硫化之氟橡膠糊層33，對支撐 -16- 201139136 板10表面之凹凸有良好之追隨性，而呈現疊層作業時接合 面氣泡殘留極少之效果。傳統上，使用氣體障壁性高之氟 橡膠（已經過硫化之橡膠）時，有時接合面之極小間隙會 殘留氣泡》殘留之氣泡無法排除，於加溫製程（例如，迴 焊溫度（通常，200〜260°C )可能發生膨脹之問題。本專 利發明可以解決該問題。 然而，未硫化之氟橡膠糊層3 3中，若含有硫化劑及共 交聯劑，固定於支撐板1 〇後，於迴焊溫度（通常，200〜 2 60°C )下，將促進氟橡膠糊層33之硫化。 此時，於未硫化狀態下之氟橡膠糊層3 3與支撐板1 〇的 固定，將更爲強固。 氟橡膠，適度地從前述列舉之材料等進行選用即可。 硫化劑及共交聯劑亦同樣。配合比等只要與上述相同 即可。 亦可含有導電性粒子、吸附劑、及各種充塡劑等其他 成份。 用以形成未硫化之氟橡膠糊層3 3之良好方法，係以擠 壓塗佈法等於耐熱性樹脂薄膜3 5之另一方平面3 4上塗佈橡 膠組成物之薄膜即可。不實施硫化處理。 未硫化之氣橡膠糊層33之厚度，應爲5〜30// m’最好 爲10〜20/zm程度。該厚度爲5ym以下時，有無法均一固 定的問題。此外，該厚度若超過3 0 μ m則效果不變，然而 ，有無法追求複合薄片體3 0整體之厚度薄層化的問題。 依據上述內容，針對複合薄片體30之連續製造方法進 -17- 201139136 行說明。 首先，先於耐熱性樹脂薄膜35之一方平面36上，將含 有氟橡膠、硫化劑、以及共交聯劑之橡膠組成物配設成薄 膜狀，進行加熱來實施硫化處理，而形成已經過硫化處理 之氟橡膠層37。其次，於耐熱性樹脂薄膜35之另一方平面 3 4上，將含有以氟橡膠爲主要成份之橡膠組成物配設成薄 膜狀，而形成未硫化之氟橡膠糊層33。不實施硫化處理。 分別將脫模薄片（薄膜）貼附於未硫化之氟橡膠糊層3 3表 面及已經過硫化處理之氟橡膠層37的表面。上述複合薄片 體30之總厚，應爲20〜130/zm，25〜90/zm更佳，最好爲 SOym 以下（30 〜49/zm)。 複合薄片體3 0，被以滾筒或片狀之狀態製品化，並對 應支撐板1 〇之形態等進行適度裁切來使用。 本發明之複合薄片體30，如第2圖所示，可以只是將 —片薄片介設於支撐板10與FPC基板50之間，然而，本發 明之複合薄片體3 0，因爲薄片具有彈性（剛性）且厚度較 薄，如第6圖所示，可以採用對應FPC基板50背面之凹凸形 狀來使用的方法，亦即，可以在與FPC基板50背面之凹凸 形狀完美配對下，實施部分疊合的技巧。 例如，如第6圖所示，除了原本當做1片薄片來使用而 切割成爲基礎之複合薄片體30A以外，尙準備預先配合存 在於搬運對象之FPC基板50背面之凹部形狀的複合薄片體 切割片30B、30C、及30D。 該等切割片30B、30C、30D之大小等格式設定，可以 •18- 201139136 預先依據FPC基板50之導體及構件之設計格式來求取，或 者，預先實測FPC基板50背面之凹凸分佈來求取。該等切 割片30B、30C、30D，係以與FPC基板50背面之凹凸形狀 完美配對之方式，疊合於基礎之複合薄片體3 0A或特定切 割片30B之上。 切割寬度（例如，係第6圖之切割片30B、30C、及 3 0D之各橫向寬度）爲10mm以下，尤其是，以簡單實驗已 確認到，5mm以下者，無需利用切割片來進行凹部之塡埋 補充。超過1 〇mm時，則呈現其段差對黏著性明顯產生不 良影響的傾向。如第6圖所示，單純疊合操作對已經過硫 化處理之氟橡膠層37與未硫化之氟橡膠糊層33間之黏著性 所產生影響，因爲係相同之氟橡膠系，已確認沒有剝離等 特別之問題。 <針對基板搬運夾具構成之說明> 藉由將本發明之複合薄片體30疊層固定於支撐板1〇上 來構成基板搬運夾具。 第3 A圖係用以固定本發明之複合薄片體3 0之支撐板之 一實施形態的平面圖。第3B圖係第3A圖之（I )-(丨）的 剖面透視圖。 如第3A圖及第3B圖所示，於支撐板10，形成有例如疊 層複合薄片體3〇時用以吸引支撐板1〇與複合薄片體30間之 空氣來提高兩者密貼性之吸引用貫通孔1 1 (圖面中，圖示 著5個）、及用以將基板搬運夾具載置於安裝裝置之特定 -19- 201139136 位置的位置校正用貫通孔15(圖面中，圖示著4個）。 如前面所述，支撐板10之厚度爲0.3〜5mm程度 第4A圖係具備第3A、B圖所示之支撐板1〇之本發明之 基板搬運夾具之一實施形態的平面圖。第4B圖係第4A圖之 (II) - ( II)的剖面透視圖。 藉由將複合薄片體30貼合於支撐板1〇上，而得到如第 4 A及B圖所示之本發明的基板搬運夾具70。 貼合複合薄片體30之方法，可以爲將複合薄片體30載 置於支撐板10上後，以滾筒等壓附之方法、或一邊從吸引 用貫通孔25吸引空氣一邊沖擊壓附之方法等。此處，利用 支撐板10與複合薄片體30貼合之固定，因爲係利用複合薄 片體30之未硫化氟橡膠糊層33所具有之黏著力，兩構件間 無需另外使用黏著劑或接著劑等。所以，可以簡單地構成 基板搬運夾具70。 如第4圖所示，於基板搬運夾具70，形成著被載置於 其上之FPC基板50的位置校正用貫通孔71 (圖示例中，爲6 個）。該貫通孔71，可以於貼合支撐板10與複合薄片體30 後，利用鑽頭等之機械加工來形成。 <基板搬運夾具之使用方法> 第5圖係第4圖所示之基板搬運夾具70的使用狀況剖面 圖。 如第5圖所示，於用以構成基板搬運夾具70之複合薄 片體30之已經過硫化處理的氟橡膠層37表面，黏著固定著 -20- 201139136 被搬運之FPC基板50。FPC基板50之固定’例如’依以下 之要領來實施。 形成於FPC基板50之貫通孔51與形成於基板搬運夾具 70之貫通孔71成爲一致時，藉由插入插銷80 ’來進行FPC 基板50之位置校正，而且，於該位置，利用複合薄片體30 之已經過硫化處理之氟橡膠層37表面的黏著力，黏著固定 FPC基板50。 黏著固定著FPC基板50之基板搬運夾具70，被固定於 安裝裝置90之特定位置的載置部91。基板搬運夾具70之固 定，例如，以下述方法來實施。亦即，以形成在用以構成 基板搬運夾具70之支撐板10的貫通孔15與形成在安裝裝置 9〇之載置部91的孔92成爲一致之方式，使基板搬運夾具70 載置於載置部91，並藉由將插銷99插入貫通孔15及孔92來 固定雙方。 <實施例> 以下，以具體實施例來針對本發明進行更詳細之說明 (實施例1 ) 依下述要領來製造本發明之複合薄片體30的實施例1 樣本。 (1 )準備厚度25 /z m之聚醯亞胺薄膜（商品名稱： kapt〇n : DU pont-toray ( ^ )公司製）做爲用以構 -21 - 201139136 成耐熱性樹脂薄膜35之材料。 (2 )準備下述氟橡膠摻合物3 7 ’，用以形成已經過硫 化處理之氟橡膠層37。 (氟橡膠摻合物37’） •氟橡膠 （VDF/PAVA/TFE系共聚物；商品名稱 VITON (登錄商標）GLT-200S ； DUPONT ELASTOMER ( 股）公司製）…〗〇〇重量份 •硫化劑 （2,5-二甲基-2,5-雙（t-丁基過氧基）己 烷；商品名稱PERHEXA25B;曰油（股）公司製）…3重 量份 .共交聯劑 （三烯丙基異三聚氰酸酯；商品名稱 TAIC ；日本化成（股）公司製）…3重量份 (3)準備下述氟橡膠摻合物33’，用以形成未硫化之 氟橡膠糊層33 " (氟橡膠摻合物33’） •氟橡膠 （VDF/PAVA/TFE系共聚物；商品名稱 VITON (登錄商標）GLT-200S ； DUPONT ELASTOMER ( 株）社製）100重量份 •硫化劑 （2,5·二甲基-2,5-雙（t-丁基過氧基）己 烷；商品名稱PERHEXA25B ;曰油（股）公司製）…3重 量份 .共交聯劑 （三烯丙基異三聚氰酸酯；商品名稱 -22- 201139136 TAIC ；曰本化成（股）公司製）…3重量份 (樣本之製作） 於上述耐熱性樹脂薄膜35之一面上，利用輥塗塗佈方 法，塗佈氟橡膠摻合物3 7 ’，然後，以利用表面粗化之擠 壓板的沖壓方法，使橡膠表面變粗糙而賦予凹凸後，再以 170°C實施1〇分鐘之1次硫化及以200 °C實施4小時之2次硫 化，來形成已經過硫化處理之氟橡膠層3 7。 硫化後之氟橡膠層37之厚度爲3〇em。氟橡膠層37之 表面粗細度Ra爲1.3 64 " m。 其次，於以上述方式形成之2層疊層體之耐熱性樹脂 薄膜35的另一面上，利用輕塗塗佈方法，塗佈氟橡膠慘合 物33’，形成厚度20#m之未硫化的氟橡膠糊層33。複合薄 片體30之整體厚度爲80// m。 藉由將如上所製作之本發明之複合薄片體3 0的實施例 1樣本與由玻璃環氧基板所構成之支撐板10進行固定.組 合，而形成基板搬運夾具70。此時，複合薄片體30與支撐 板10可以在接合面沒有氣泡下進行接合。其次，利用該夾 具70實施FPC基板之載置固定，並實施各種電子構件之安 裝實驗。對FPC基板之電子構件的安裝，係由錫膏焊接印 刷製程、電子構件裝配製程、迴焊製程、切割製程所構成 〇 依據實驗結果，複合薄片體30兩面之黏著力極爲良好 ，尤其是，FPC基板之裝卸沒有問題。此外，以傳統沒有 -23- 201139136 之薄膜水準所製作的複合薄片體30，處理能力性亦極爲良 好。 (實施例2 ) 依下述要領來製造本發明之複合薄片體3 0的實施例2 樣本。 分別將上述實施例1之耐熱性樹脂薄膜35的厚度變更 爲13/zm、將已經過硫化處理之氟橡膠層3 7的厚度變更爲5 #m、以及將未硫化之氟橡膠糊層33的厚度變更爲5ym。 複合薄片體30之整體厚度爲23;zm。其餘與上述實施例1相 同’製作實施例2樣本的複合薄片體30。 利用該複合薄片體30，實施與實施例1相同之實驗。 結果，即使進一步追求複合薄片體30之薄層化，複合 薄片體30兩面之黏著力亦極爲良好，尤其是，FPC基板之 裝卸沒有問題。此外，以傳統沒有之薄膜水準所製作之複 合薄片體30，處理能力性亦極爲良好。 (實施例3 ) 依下述要領來製造本發明之複合薄片體30的實施例3 樣本。 . 將上述實施例1之氟橡膠層37表面粗細度Ra變更爲 。其餘與上述實施例丨相同，製作實施例3樣本之 複合薄片體30。 利用該複合薄片體3〇’實施與實施例1相同之實驗。 -24- 201139136 結果，即使進一步追求複合薄片體30之薄層化’複合 薄片體30兩面之黏著力亦極爲良好，尤其是’ FPC基板之 裝卸沒有問題。 (實施例4 ) 依下述要領來製造本發明之複合薄片體30的實施例3 樣本。 將上述寳施例1之氟橡膠層3 7表面粗細度Ra變更爲 2 _ 060 # m。其餘與上述實施例1相同，製作實施例4樣本的 複合薄片體3 0。 利用該複合薄片體3 0，實施與實施例1相同之實驗。 結果，即使進一步追求複合薄片體30之薄層化，複合 薄片體30兩面之黏著力亦極爲良好，尤其是，FPC基板之 裝卸沒有問題。 由以上之結果可以得知本發明之效果。 亦即，本發明係用以構成固定於支撐板上之基板搬運 夾具的基板搬運夾具用複合薄片體，該複合薄片在固定至 支撐板前之狀態，因爲係由具有耐熱性樹脂薄膜、形成於 該耐熱性樹脂薄膜之一方平面之已經過硫化處理的氟橡膠 層、以及形成於該耐熱性樹脂薄膜之另一方平面之未硫化 之氟橡膠糊層的疊層體所構成，故薄片本身具有彈性，且 可提高處理能力性並方便處理。此外，可以對應追求薄片 薄肉化之要求。此外，因爲薄片可薄肉化，故係可實施與 FPC基板背面之凹凸完美配對之技巧的薄片。此外，對 -25- 201139136 FPC基板具有適當黏著性，有優良之黏著性及剝離性。支 撐板之黏著性亦優良，該接合面之氣泡殘留亦極少，也可 解決加熱製程之膨賬等問題。 本發明之產業上的利用可能性方面，本發明，尤其是 ，可以利用於將電子構件安裝於FPC基板或玻璃基板等基 板之電子機器產業一般。 【圖式簡單說明】 第1圖係本發明之基板搬運夾具用複合薄片體的剖面 圖。 第2圖係依序疊層著支撐板、基板搬運夾具用複合薄 片體、以及FPC基板等之被附著體之狀態的剖面圖。 第3Α圖係固定著本發明之基板搬運夾具用複合薄片體 的支撐板之一例的平面圖，第3Β圖係第3Α圖之（I) -(I )剖面透視圖。 第4Α圖係本發明之基板搬運夾具之一例的平面圖，第 4Β圖係第4Α圖之（II) · ( II)剖面透視圖。 第5圖係第4圖所示之基板搬運夾具之使用狀況之一例 的剖面圖。 第6圖係可實施與FPC基板背面之凹凸完美配對之技巧 而形成之基板搬運夾具用複合薄片體的模式剖面圖。 【主要元件符號說明】 10 支撐板 -26- 201139136 1 1 :貫通孔 1 5 :貫通孔 30 :複合薄片體 30A :複合薄片體 3 0B :切割片 3 0 C :切割片 3 0D :切割片 33 :氟橡膠糊層 34 :另一方平面 3 5 :耐熱性樹脂薄膜 36 : —方平面 37 :氟橡膠層 3 8 :表面 5 0: F P C基板 5 1 :貫通孔 7 〇 :基板搬運夾具 7 1 :貫通孔 8 0 :插銷 90 :安裝裝置 9 1 :載置部 92 :孔 99 :插銷[Technical Field] The present invention relates to a composite sheet for a substrate transporting jig and a substrate transporting jig, and more particularly to a substrate used for mounting an electronic component or the like on a substrate such as an FPC board. A composite sheet for a substrate transfer jig for the purpose of transporting jigs, and a substrate transfer jig using the same. [Prior Art] For example, a flexible printed circuit board (hereinafter referred to as an FPC board) having a laminate of a polyimide film and a conductor for wiring circuits is thin and flexible. In recent years, it has occupied an extremely important position as a substrate for forming a circuit for a small electronic device. Various electronic components are mounted on the FPC board as described above via the mounting process. The mounting of the electronic component of the FPC board is constituted, for example, by a solder paste soldering process, an electronic component mounting process, a reflow process, a cutting process, and the like. When such an electronic component is continuously mounted, the F P C substrate is maintained in a flat state, that is, it is held in a state where it is not peeled off, and is transported in each process and between processes. A transfer jig for the purpose of transporting an FPC substrate, for example, Japanese Laid-Open Patent Publication No. 2003-273-51, the disclosure of which is incorporated herein by reference. Pallet. Secondly, according to the proposal, it is possible to pursue improvement in workability and prevent deterioration of quality compared to the conventional method of fixing the adhesive tape, etc. -5- 201139136 However, the above prior art proposal is usually 200 to 260 °C. When the reflow process is carried out under the high temperature environment, the low molecular weight oxime contained in the ruthenium rubber is released in the form of outgassing. If the gas contacts the contact portion of the electronic component, the contact failure will occur. The problem. In order to solve the above problem, Japanese Laid-Open Patent Publication No. 2004-363438 proposes a substrate transfer jig in which a fluororubber-free elastic sheet containing no siloxane is disposed on a support plate. However, the fluororubber-based elastic sheet tends to deteriorate the adhesion to the FPC board and the support sheet of the adherend at a temperature of 200 to 260 °C in the reflow process. In other words, there is a problem that the adhesion is lowered in a high temperature environment. Therefore, in the reflow process, peeling of the FPC substrate held by the elastic sheet or peeling of the elastic sheet from the support sheet may occur. In order to solve the above problem, the applicant of the present application has proposed the following proposal in Japanese Laid-Open Patent Publication No. 2009-17070, that is, even at the reflow temperature, the substrate and the support plate of the attached body have a high enough adhesion. In the reflow process, the adhesive rubber sheet for the fluororubber-based substrate conveyance jig that holds the substrate without being peeled off from the support plate can be surely fixed. However, the conventionally proposed substrate handling jig uses adhesive rubber sheets, and the sheets themselves do not have so-called elasticity, so the handling ability is poor and the handling is inconvenient. Although the pursuit of thin slices of meat to improve the processing capacity, however, lack of economy, and just contrary to the expectation of thin slices of meat, in addition, the so-called attached FPC substrate, in the early stages before entering the handling process, sometimes Since the back surface is uneven (mainly conductor and member pre--6-201139136 is embedded in the inside of the substrate), it is expected that a sheet for a substrate conveyance jig that can be perfectly matched with the unevenness is desired. In particular, there are particularly high expectations for the variety of production sites. At the same time, in the conventional example, the surface of the glass epoxy substrate (requiring a processing period of 1 to 2 months) is performed for each of the target products so as to perfectly match the irregularities on the back surface of the FPC board. At this time, the FPC substrate was fixed with an adhesive tape. Further, the back surface of the FPC substrate to be attached (the position below the lamination direction) usually exposes the polyimide of the material to be used. In this case, when the polyimide and the fluororubber on the back surface of the FPC substrate are pressed together, and the temperature at which the reflow temperature is applied is applied, the adhesion compatibility between the two may be excessive. However, the adhesion is large. Increasing the adhesion sometimes causes a situation in which it is extremely difficult to peel the FPC substrate from the fluororubber. At this time, if a large force is applied to peel off, the FPC board may be damaged. In addition, when it is closely attached to the support plate, the unevenness of the surface of the support plate may also cause a problem of a little air bubble remaining. Fluororubber has a high gas barrier property, and heating will cause the bubble to expand. In view of the above, it is an object of the present invention to provide a sheet for a substrate transporting jig which has elasticity, which is improved in handling ability, is more convenient to handle, and can be made to meet the expectation of thinning of the sheet. Further, a sheet for a substrate conveyance jig that can perform a perfect match with the unevenness on the back surface of the FPC board is provided. Further, a sheet for a substrate transporting jig having an appropriate adhesion to an FPC substrate is provided. Further, it is excellent in adhesion to the support plate, and the air for the joint surface 201139136 has a small amount of residual bubbles, and can solve the problem of the expansion of the heating process and the like. SUMMARY OF THE INVENTION In order to solve the above problems, the present invention is a composite sheet for a substrate transporting jig that is fixed to a support plate and constitutes a substrate transporting jig, and the composite sheet is in a state before being fixed on the support plate. And a heat-resistant resin film, a fluororubber layer formed on one side of the heat-resistant resin film and having been subjected to vulcanization treatment, and a laminate of the fluororubber paste layer formed on the other side of the heat-resistant resin film and not being vulcanized Body composition. Further, in a preferred embodiment of the composite sheet for a substrate transporting jig according to the present invention, the heat resistant resin film is composed of a group of polyimine, polyether oxime, polyether oxime, polyphenylene sulfide, and polyether ketone. One of the selected groups is composed. Further, in a preferred embodiment of the composite sheet for a substrate transporting jig of the present invention, the fluororubber layer which has been subjected to the vulcanization treatment is provided with a rubber blend containing a fluororubber, a vulcanizing agent, and a co-crosslinking agent. The resin film is formed by subjecting it to a vulcanization treatment. Further, in a preferred embodiment of the composite sheet for a substrate transporting jig of the present invention, the unvulcanized fluororubber paste layer is formed by disposing a rubber blend containing fluororubber as a main component on a heat resistant resin film. . Further, in a preferred embodiment of the composite sheet for a substrate transporting jig according to the present invention, the unvulcanized fluororubber paste layer is a rubber blend containing a vulcanizing agent and a co-crosslinking agent, or a fluororubber. A vulcanizing agent -8 - 201139136 and a rubber blend of one of the co-crosslinking agents are formed by being disposed on a heat-resistant resin film. Further, in a preferred embodiment of the composite sheet for a substrate transporting jig of the present invention, the heat resistant resin film has a thickness of 1 〇 50 50 / um, and the fluororubber layer which has been subjected to the vulcanization treatment has a thickness of 5 〜 50 ym, the thickness of the unvulcanized fluororubber paste layer is 5 to 3 〇 vm. Further, in a preferred embodiment of the composite sheet for a substrate transfer jig of the present invention, the composite sheet composed of the laminate has a total thickness of 20 to 130 #m. Further, in a preferred embodiment of the composite sheet for a substrate transporting jig of the present invention, the unvulcanized fluororubber paste layer side is fixed to the support plate for fixing and being transported to the previously vulcanized fluororubber layer. The upper substrate, the fluororubber layer which has been subjected to the vulcanization treatment, has a surface roughness of Ra = 0.1 to 10/zm. The substrate transfer jig of the present invention is formed by laminating a heat-resistant support plate and a composite sheet for the substrate transfer jig. The present invention relates to a method of manufacturing a substrate transport jig formed by laminating a heat-resistant support sheet and a composite sheet for a substrate transport jig, which is prepared by cutting a composite sheet for a substrate transport jig of a basic size. The base composite sheet is formed by fixing the unvulcanized fluororubber paste layer side of the base composite sheet to a support plate. Further, in a preferred embodiment of the method for manufacturing a substrate-carrying jig of the present invention, the substrate-carrying clip 9 is prepared by laminating and fixing a shape of a recessed portion of the back surface of the substrate to be transported in advance on the base composite sheet. 201139136 is composed of a composite sheet cutting piece. Further, in a preferred embodiment of the method for producing a substrate-carrying jig of the present invention, the unvulcanized fluororubber paste layer side of the dicing sheet is formed as a fixing surface located below the lamination direction. Since the composite sheet for a substrate transporting jig of the present invention is configured as described above, the sheet itself has elasticity, and the handling ability is improved, and the handling is more convenient. In addition, it can meet the requirements of thin slices of flakes. In addition, since the sheet can be thinned, it is a sheet which can perform a technique of perfectly matching the concave and convex portions on the back surface of the FPC substrate. In addition, it has an appropriate adhesion to the FPC substrate, and has excellent adhesion and peelability. The adhesion of the support plate is also excellent. The remaining bubbles of the joint surface are also extremely small, and the problem of expansion of the heating process does not occur. [Embodiment] Hereinafter, embodiments for carrying out the invention will be described in detail. 1 is a cross-sectional view of a composite sheet body 30 for a substrate transporting jig of the present invention. FIG. 2 is a view in which a support sheet 10, a composite sheet body 30 for a substrate transporting jig, and an attached body such as an FPC board 50 are laminated in this order. Cross-sectional view of the state The composite sheet body 30 for a substrate conveyance jig of the present invention is fixed to the support plate 10 to constitute a sheet of the substrate conveyance jig. In the usual method, a composite sheet body 30 for substrate transporting jigs (hereinafter also simply referred to as "composite sheet body 30") is laminated on a support sheet 10, and laminated on the composite sheet body 30. An adherend such as an FPC board (hereinafter referred to as "FPC board 50") is also referred to as 201139136. Further, the complication of the composite sheet 30 of the present invention is not limited to the sheet shown, and includes a so-called belt-like form. In the case of a state, it may be cut into sheets for use, or may be used by continuously pulling the ribbon from the roll attached to the tape. Hereinafter, each component will be described in detail. <Support Plate 1〇> A material for constituting the support plate 10 for the composite sheet for a substrate conveyance jig of the present invention, for example, a fiber reinforced ring (especially, glass epoxy resin), polyether maple, or the like may be used. Polyacrylate imine, Ming, Oxidation, Nitrogen, Ming alloy, non-recorded steel, magnesium. In particular, it is preferable to use a fiber-reinforced epoxy resin (especially, a glass resin). The fixing of the support plate 10 to the composite sheet 30 is carried out by the adhesion of the composite 30 surface. Therefore, when the surface of the composite sheet 30 is deteriorated, it is very simple to replace it with a new one. Further, the fixing force of the support plate 10 and the composite sheet 30 may be such that cross-linking occurs on the surface of the composite sheet 30 after the attachment. The support plate 10 is about 0.3 to 5 mm. <Configuration of Composite Sheet 30> As shown in Fig. 1, the composite sheet body 30 has a heat-resistant resin film 35 and is formed into a belt-shaped roller in a state before being fixed to the support. The body 30 is made of a glass epoxy sheet such as a solid oxide resin or a polyfluorene alloy, and the adhesion is increased to the thickness of the heat-resistant -11 - 201139136 resin film 3 5 square plane 3 6 has been vulcanized fluorine The rubber layer 37 and the laminate of the unvulcanized fluororubber paste layer 33 formed on the other flat surface 34 of the heat resistant resin film are formed. It is also possible to use a laminate of four or more layers via an intermediate layer (not shown). However, as shown in the first drawing, it is preferable to use a three-layer laminate. Here, "before fixing to the support plate" The state is to clearly define the composition and technical scope of the invention. That is, as will be described later, in the unvulcanized fluororubber paste layer 33 of the present invention, a vulcanizing agent or a co-crosslinking agent may be contained in advance, and in this case, for example, if it has been subjected to a reflow process, it cannot be The fluororubber paste layer 3 3 is referred to as unvulcanized. Therefore, it must be clearly marked at that point as unvulcanized. The heat-resistant resin film 3 5 is a material for forming the heat-resistant resin film 35 at the substantially central portion of the composite sheet 30, and may be made of polyimide, polyether oxime, polyether oxime, polyphenylene sulfide, and polyether. The group of ketones is selected. In particular, it is preferably polyimine. The heat-resistant resin film 35 can exhibit the function of a so-called core material of the composite sheet 30, so that the composite sheet body 30 can have rigidity, improve handling ability, and can pursue the overall thickness of the composite sheet body 30. Thin layering. The thickness of the heat resistant resin film 35 should be 10 to 50 / / m, more preferably 10 to 30, and most preferably about 12 to 25 / zm. When the thickness is 10 μm or less, it is difficult to exhibit the function of the so-called core material. Further, when the thickness exceeds 50 #πι, there is a problem that the overall thickness of the composite sheet 30 cannot be thinned by -12-201139136. The fluororubber layer 37 which has been vulcanized is formed on one of the square planes 36 of the heat-resistant resin film 35 shown in Fig. 1 to form a fluororubber layer 37 which has been subjected to vulcanization treatment. The fluororubber layer 3 7 which has been subjected to the vulcanization treatment is as shown in the figure, and is placed on the top layer of the composite sheet 30 for adhering and fixing the FPC board 50 and the like (see Fig. 2). The fluororubber layer 37 which has been subjected to the vulcanization treatment is formed by disposing a rubber blend containing a fluororubber, a vulcanizing agent, and a co-crosslinking agent on a heat-resistant resin film and subjecting it to a vulcanization treatment. A good example of the fluororubber, for example, a copolymer of difluoroethylene/hexafluoroethylene (VDF/HFP), a copolymer of difluoroethylene/hexafluoroethylene/tetrafluoroethylene (VDF/HFP/TFE), and two Fluoroethylene/perfluoroalkyl vinyl ether/tetrafluoroethylene (VDF/PAVE/TFE) copolymer, difluoroethylene/perfluoroalkyl vinyl ether/hexafluoroethylene (VDF/PAVE/HFP) copolymer , a difluoroethylene/perfluoroalkyl vinyl ether/hexafluoroethylene/tetrafluoroethylene (VDF/P AVE/HFP/TFE) copolymer, and the like. Fluororubber is commercially available as VITON (registered trademark) GTL, with GTL-S, with GFLT, with GFLT-S, with GF, with GF-S, with GBL, with GBL-S (above, DUPONT ELASTOMER (share) Company system) and so on. For vulcanizing agents, in particular, organic peroxides other than sulfur vulcanizing agents should be used. Good examples of organic peroxides such as 2,5-dimethyl-2,5-bis(t-butylperoxy)hexane, dicumyl peroxide, bis(t-butylperoxy)- 13-201139136) Diisopropylbenzene and the like. Among them, 2,5-dimethyl-2,5-bis(t-butylperoxy)hexane is preferred. The vulcanizing agent should be 0.5 to 1 G by weight, more preferably 1 to 8 parts by weight, even more preferably 1 to 5 parts by weight, per 100 parts by weight of the fluororubber. When the blending amount is selected, it is important to have a high adhesion to the adherend (FPC substrate 50) at the reflow temperature (normally, 200 to 260 °C) at room temperature. Good examples of co-crosslinking agents (crosslinking aids) such as triallyl isocyanurate (TAIC), triallyl isocyanurate prepolymer (TAIC prepolymer), top three Allyl isocyanate (TMAIC), triallyl cyanurate, triallyl benzoic acid ester, N,N'-m-phenyl dimaleic acid ruthenium imine, trimethylolpropane three Methacrylate and the like. The above co-crosslinking agent should be 0.5 to 10 parts by weight, more preferably 1 to 8 parts by weight, even more preferably 1 to 5 parts by weight, per part by weight of the fluororubber. When the blending amount is selected, it is important to have a high adhesion to the adherend (FPC substrate 50) at the reflow temperature (normally, 200 to 260 ° C) at the normal temperature as in the case of the above-mentioned vulcanizing agent. conditions of. The rubber composition may contain other components such as conductive particles, an adsorbent such as zinc oxide, calcium hydroxide or magnesium oxide, or various types of filling agents, without departing from the effects of the present invention. In particular, from the viewpoint of preventing charging and preventing contamination of the FPC board 50, conductive carbon black, carbon nanotubes, and the like are also excellent embodiments. A good method for forming the above-mentioned vulcanized fluororubber layer 37 is applied to a square plane 36 of the heat-resistant resin film 35 by roll coating, -14-201139136, and extrusion coating. The film of the rubber composition is applied by a method, and then subjected to heat treatment for the purpose of vulcanization of the coating film. The vulcanization (crosslinking) method can be exemplified by a cross-linking method of a vulcanization tank, a continuous cross-linking method such as hot-pressurization vulcanization (such as a drum vulcanizer), and a cross-linking method using a mold. Further, when the strip-shaped form is formed by the composite thin film of the present invention, it is necessary to select a cross-linking method in which the vulcanization tank is cross-linked or the heat-exchange tube is vulcanized or the like in the above-mentioned vulcanization. The vulcanization conditions (heating conditions), for example, 1 time of heating | ~200 ° C temperature range of 5 to 20 minutes, 2 times of heating to 180, ° C range of 2 to 6 hours. The thickness of the fluororubber layer 37 which has been subjected to the vulcanization treatment should preferably be 5 to 50 ^ 10 to 40 # m, preferably 15 to 30 ° m. When the thickness is ί or less, there is a problem that a uniform film cannot be formed. Further, when the thickness is 50 #m, there is no difference in the effect. However, there is a problem that the thickness of the composite thin film 30 cannot be thinned. The surface 3 of the fluororubber layer 37 which has been vulcanized should be deliberately formed into a rough surface. The method of the rough surface treatment, for example, a method of transferring a concave surface by using a pressed resin film (PET or the like) for roughening a surface of a rubber surface, or a base cloth impregnated with a resin, etc., may be used for the sulfur. Process it. As a result of the rough surface treatment, the surface roughness Ra (JIS BO601) of the fluororubber surface 38 which has been subjected to the vulcanization treatment should be 0.1 to 10/z, preferably 0.2 to 5/z m. When the Ra 値 is 0.1 or less, the adhesive is fixed to the already vulcanized, and the solid and the slab are continuous. 150 - 250 m 1 > β m exceeds the sheet, and the convex layer 3 7 The FPC substrate 50' of the surface 38 of the fluororubber layer 37 of Process -15-201139136 will be difficult to peel off after the end of the process. As a result, the FPC substrate 50 that is forcibly peeled off may be damaged. In particular, when the polyimine is exposed on the back surface of the FPC substrate 50 or the like to be attached (generally exposed), the tendency is extremely remarkable. On the other hand, when Ra 値 exceeds 10 " m, the FPC substrate 50 does not have sufficient fixing property, and peeling may occur during the process. Unvulcanized fluororubber paste layer 33 As shown in Fig. 1, an unvulcanized fluororubber paste layer 33 is formed on the other flat surface 34 of the heat-resistant resin film 35. The unvulcanized fluororubber paste layer 33, as shown in the figure, is placed on the bottom layer of the composite sheet 30 and adhered and fixed to the support sheet 10. The unvulcanized fluororubber paste layer 3 is formed by disposing a rubber blend containing a fluororubber as a main component on the heat-resistant resin film 35. The unvulcanized state can be maintained until it is fixed to the support plate 1 ,, and the unvulcanized fluororubber paste layer 33 may contain a vulcanizing agent or a co-crosslinking agent. In other words, the unvulcanized fluororubber paste layer, in addition to the fluororubber, is provided with a rubber blend containing a vulcanizing agent and a co-crosslinking agent, or a rubber blend containing one of a vulcanizing agent and a co-crosslinking agent. The heat resistant resin film is formed on the film. The above means that the "unvulcanized fluororubber paste layer 3" is synonymous with the fluororubber layer which has not been subjected to the sulfurization treatment. In the present invention, by fixing the support sheet 1 by using the unvulcanized fluororubber paste layer 3, not only good adhesion can be obtained, but also the following excellent effects can be obtained. That is, the unvulcanized fluororubber paste layer 33 has a good followability to the unevenness of the surface of the support plate of the -16-201139136, and exhibits an effect of extremely little residual air bubbles on the joint surface during the lamination operation. Conventionally, when a fluorine rubber having a high gas barrier property (a rubber that has been vulcanized) is used, bubbles may remain in a very small gap of the joint surface. The residual bubbles cannot be removed in the heating process (for example, the reflow temperature (usually, 200~260 ° C) The problem of expansion may occur. The patented invention can solve this problem. However, if the vulcanizing agent and the co-crosslinking agent are contained in the unvulcanized fluororubber paste layer 3, it is fixed on the support plate 1 At the reflow temperature (usually, 200 to 2 60 ° C), the vulcanization of the fluororubber paste layer 33 is promoted. At this time, the fluororubber paste layer 3 3 in the unvulcanized state is fixed to the support plate 1 ,, The fluororubber may be appropriately selected from the materials listed above, etc. The vulcanizing agent and the co-crosslinking agent are also the same. The mixing ratio and the like may be the same as described above. The conductive particles and the adsorbent may also be contained. And other ingredients such as various filling agents. A good method for forming the unvulcanized fluororubber paste layer 3 is to apply rubber to the other flat surface 3 4 of the heat-resistant resin film 35 by extrusion coating. The film of the composition The vulcanization treatment is not carried out. The thickness of the unvulcanized gas rubber paste layer 33 should be 5 to 30 / / m', preferably 10 to 20 / zm. When the thickness is 5 μm or less, there is a problem that uniformity cannot be fixed. Further, if the thickness exceeds 30 μm, the effect does not change. However, there is a problem that the thickness of the entire composite sheet 30 cannot be thinned. According to the above, the continuous manufacturing method of the composite sheet 30 is advanced. 17-201139136 First, a rubber composition containing a fluororubber, a vulcanizing agent, and a co-crosslinking agent is placed in a film shape on one of the square planes 36 of the heat-resistant resin film 35, and is heated to perform vulcanization treatment. The fluororubber layer 37 which has been subjected to the vulcanization treatment is formed. Next, on the other flat surface 34 of the heat-resistant resin film 35, the rubber composition containing the fluororubber as a main component is disposed in a film form to form an unformed The vulcanized fluororubber paste layer 33. The vulcanization treatment is not carried out. The release sheet (film) is attached to the surface of the unvulcanized fluororubber paste layer 3 and the surface of the fluororubber layer 37 which has been subjected to the vulcanization treatment, respectively. The total thickness of the sheet 30 should be 20 to 130/zm, more preferably 25 to 90/zm, and most preferably SOym or less (30 to 49/zm). The composite sheet 30 is in a state of being rolled or sheet-shaped. The product is formed and appropriately cut according to the shape of the support plate 1 , etc. The composite sheet 30 of the present invention, as shown in FIG. 2 , may be simply disposed on the support sheet 10 and the FPC substrate 50 . However, the composite sheet 30 of the present invention, because the sheet has elasticity (rigidity) and a small thickness, as shown in Fig. 6, a method corresponding to the uneven shape of the back surface of the FPC board 50 can be used, that is, The technique of partially overlapping can be performed under perfect matching with the concave-convex shape on the back surface of the FPC substrate 50. For example, as shown in Fig. 6, in addition to the composite sheet body 30A which is cut into a base sheet and used as a base, the composite sheet cutting sheet having the shape of a recess existing on the back surface of the FPC board 50 to be transported is prepared in advance. 30B, 30C, and 30D. The format of the dicing sheets 30B, 30C, and 30D can be determined in advance according to the design format of the conductors and members of the FPC board 50, or the bump distribution on the back surface of the FPC board 50 can be measured in advance. . The cut sheets 30B, 30C, and 30D are superposed on the base composite sheet 30A or the specific cut sheet 30B in such a manner as to perfectly match the uneven shape on the back surface of the FPC board 50. The cutting width (for example, the lateral widths of the cutting pieces 30B, 30C, and 30D in Fig. 6) is 10 mm or less. In particular, it has been confirmed by a simple experiment that, in the case of 5 mm or less, it is not necessary to use the cutting piece for the concave portion.塡 buried supplement. When it exceeds 1 〇mm, there is a tendency that the step difference has a significant adverse effect on the adhesion. As shown in Fig. 6, the simple lamination operation affects the adhesion between the vulcanized fluororubber layer 37 and the unvulcanized fluororubber paste layer 33, and since it is the same fluororubber system, it has been confirmed that there is no peeling. And so on. <Description of Configuration of Substrate Transfer Clamp> The substrate transfer jig is configured by laminating and fixing the composite sheet 30 of the present invention on the support plate 1A. Fig. 3A is a plan view showing an embodiment of a support plate for fixing the composite sheet 30 of the present invention. Fig. 3B is a sectional perspective view of (I) - (丨) of Fig. 3A. As shown in FIGS. 3A and 3B, when the laminated composite sheet 3 is formed, for example, the support sheet 10 is used to attract air between the support sheet 1〇 and the composite sheet 30 to improve the adhesion therebetween. The through hole 1 1 for suction (five in the figure) and the through hole 15 for position correction for placing the substrate conveyance jig at the position of the mounting device -19-201139136 (in the drawing, Show 4). As described above, the thickness of the support plate 10 is about 0.3 to 5 mm. Fig. 4A is a plan view showing an embodiment of the substrate transfer jig of the present invention including the support plate 1A shown in Figs. 3A and B. Figure 4B is a cross-sectional perspective view of (II) - (II) of Figure 4A. By bonding the composite sheet 30 to the support plate 1 to obtain the substrate conveyance jig 70 of the present invention as shown in Figs. 4A and 4B. The method of laminating the composite sheet body 30 may be a method in which the composite sheet body 30 is placed on the support sheet 10, and then pressed by a roller or the like, or a method of suctioning and pressing while sucking air from the suction through hole 25, and the like. . Here, the fixing of the support sheet 10 to the composite sheet 30 is carried out, because the adhesive force of the unvulcanized fluororubber paste layer 33 of the composite sheet 30 is utilized, and it is not necessary to additionally use an adhesive or an adhesive between the two members. . Therefore, the substrate transfer jig 70 can be simply configured. As shown in Fig. 4, in the substrate conveyance jig 70, the position correction through holes 71 (six in the illustrated example) of the FPC board 50 placed thereon are formed. The through hole 71 can be formed by mechanical processing such as a drill after bonding the support plate 10 and the composite sheet 30. <Usage Method of Substrate Transfer Clamp> Fig. 5 is a cross-sectional view showing the use state of the substrate transfer jig 70 shown in Fig. 4. As shown in Fig. 5, the FPC substrate 50 to be transported -20-201139136 is adhered to the surface of the vulcanized fluororubber layer 37 of the composite sheet body 30 constituting the substrate transfer jig 70. The fixing of the FPC board 50 is carried out, for example, in the following manner. When the through hole 51 formed in the FPC board 50 coincides with the through hole 71 formed in the board conveyance jig 70, the position of the FPC board 50 is corrected by inserting the plug 80', and the composite sheet 30 is used at this position. The adhesion of the surface of the fluororubber layer 37 which has been subjected to the vulcanization treatment is fixed to the FPC board 50. The substrate transfer jig 70 to which the FPC board 50 is attached is fixed to the mounting portion 91 at a specific position of the mounting device 90. The fixing of the substrate conveyance jig 70 is carried out, for example, by the following method. In other words, the substrate carrying jig 70 is placed on the through hole 15 formed in the support plate 10 for constituting the substrate transfer jig 70 so as to coincide with the hole 92 formed in the mounting portion 91 of the mounting device 9A. The portion 91 is fixed by inserting the pin 99 into the through hole 15 and the hole 92. <Examples> Hereinafter, the present invention will be described in more detail by way of specific examples (Example 1) A sample of Example 1 of the composite sheet body 30 of the present invention was produced in the following manner. (1) A polyimide film (trade name: kapt〇n: manufactured by DU pont-toray (^)) having a thickness of 25 / z m was prepared as a material for forming a heat-resistant resin film 35 of -21 - 201139136. (2) The following fluororubber blend 3 7 ' is prepared for forming the fluororubber layer 37 which has been subjected to the sulfurization treatment. (Fluorine rubber blend 37') • Fluororubber (VDF/PAVA/TFE copolymer; trade name VITON (registered trademark) GLT-200S; DUPONT ELASTOMER (manufactured by the company))...〇〇重量份•Vulcanizing agent (2,5-Dimethyl-2,5-bis(t-butylperoxy)hexane; trade name PERHEXA25B; manufactured by Oyster Sauce Co., Ltd.) 3 parts by weight. Co-crosslinking agent (triene) Propyl iso-cyanurate; trade name TAIC; manufactured by Nippon Kasei Co., Ltd.) 3 parts by weight (3) The following fluororubber blend 33' was prepared for forming an unvulcanized fluororubber paste layer 33. " (fluororubber blend 33') • fluororubber (VDF/PAVA/TFE copolymer; trade name VITON (registered trademark) GLT-200S; manufactured by DUPONT ELASTOMER Co., Ltd.) 100 parts by weight • vulcanizing agent ( 2,5·Dimethyl-2,5-bis(t-butylperoxy)hexane; trade name PERHEXA25B; oyster sauce (manufactured by the company)) 3 parts by weight. Co-crosslinking agent (triene Iso-polycyanate; trade name-22-201139136 TAIC; 曰本化成(股制公司))) 3 parts by weight (production of sample) in the above heat-resistant tree On one surface of the film 35, a fluororubber blend 3 7 ' is applied by a roll coating method, and then the surface of the rubber is roughened by a pressing method using a roughened surface to impart unevenness, and then The vulcanized rubber layer 37 which has been subjected to the vulcanization treatment was formed by performing one-time vulcanization at 170 ° C for one minute and two-time vulcanization at 200 ° C for 4 hours. The vulcanized fluororubber layer 37 has a thickness of 3 〇em. The surface roughness Ra of the fluororubber layer 37 was 1.3 64 " m. Next, on the other surface of the heat-resistant resin film 35 of the two-layer laminated body formed as described above, the fluororubbery defect 33' is applied by a light coating method to form an unvulcanized fluorine having a thickness of 20 #m. Rubber paste layer 33. The composite sheet body 30 has an overall thickness of 80 // m. The substrate transport jig 70 is formed by fixing and combining the sample of the first embodiment of the composite sheet 30 of the present invention produced as described above and the support sheet 10 made of a glass epoxy substrate. At this time, the composite sheet 30 and the support sheet 10 can be joined without a bubble on the joint surface. Next, the mounting and fixing of the FPC board was carried out by the jig 70, and mounting experiments of various electronic components were carried out. The mounting of the electronic components of the FPC substrate is composed of a solder paste soldering process, an electronic component assembly process, a reflow process, and a cutting process. According to the experimental results, the adhesion of the composite sheet 30 on both sides is extremely good, especially, FPC There is no problem with the loading and unloading of the substrate. In addition, the composite sheet 30, which is conventionally produced without the film level of -23-201139136, is also extremely excellent in handling ability. (Example 2) A sample of Example 2 of the composite sheet 30 of the present invention was produced in the following manner. The thickness of the heat-resistant resin film 35 of the above-described first embodiment was changed to 13/zm, the thickness of the fluororubber layer 37 which had been subjected to the vulcanization treatment was changed to 5 #m, and the unvulcanized fluororubber paste layer 33 was changed. The thickness was changed to 5 μm. The composite sheet 30 has an overall thickness of 23; zm. The remaining composite sheet 30 of the sample of Example 2 was produced in the same manner as in the above Example 1. The same experiment as in Example 1 was carried out using the composite sheet 30. As a result, even if the thinning of the composite sheet 30 is further pursued, the adhesion of both sides of the composite sheet 30 is extremely good, and in particular, the loading and unloading of the FPC substrate is not problematic. Further, the composite sheet 30 produced by a conventional film level is also excellent in handling ability. (Example 3) A sample of Example 3 of the composite sheet body 30 of the present invention was produced in the following manner. The surface roughness Ra of the fluororubber layer 37 of the above-described first embodiment was changed to . The composite sheet 30 of the sample of Example 3 was produced in the same manner as in the above Example. The same experiment as in Example 1 was carried out using this composite sheet 3'. -24- 201139136 As a result, even if the thin layer of the composite sheet 30 is further pursued, the adhesion of both sides of the composite sheet 30 is extremely good, and in particular, the loading and unloading of the 'FPC board is not problematic. (Example 4) A sample of Example 3 of the composite sheet body 30 of the present invention was produced in the following manner. The surface roughness Ra of the fluororubber layer 37 of the above-mentioned Example 1 was changed to 2 _ 060 # m. The composite sheet 30 of the sample of Example 4 was produced in the same manner as in the above Example 1. The same experiment as in Example 1 was carried out using the composite sheet 30. As a result, even if the thinning of the composite sheet 30 is further pursued, the adhesion of both sides of the composite sheet 30 is extremely good, and in particular, the loading and unloading of the FPC substrate is not problematic. From the above results, the effects of the present invention can be known. That is, the present invention is a composite sheet for a substrate transporting jig that is configured to be fixed to a substrate transporting jig on a support plate, and the composite sheet is formed in the state before being fixed to the support plate, and is formed of a heat-resistant resin film. The fluororubber layer which has been subjected to the vulcanization treatment on one of the heat-resistant resin films, and the laminate of the unvulcanized fluororubber paste layer formed on the other flat surface of the heat-resistant resin film, the sheet itself has elasticity. It can improve processing ability and facilitate processing. In addition, it is possible to meet the requirements of thin slices of meat. In addition, since the sheet can be thinned, it is possible to implement a sheet which is perfectly matched with the unevenness of the back surface of the FPC substrate. In addition, the -25-201139136 FPC substrate has appropriate adhesion, excellent adhesion and peelability. The adhesion of the support plate is also excellent, and the bubble remaining on the joint surface is also extremely small, and the problem of the expansion of the heating process can be solved. In view of the industrial use possibilities of the present invention, the present invention can be utilized, in particular, in an electronic equipment industry in which an electronic component is mounted on a substrate such as an FPC board or a glass board. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a cross-sectional view showing a composite sheet for a substrate conveyance jig of the present invention. Fig. 2 is a cross-sectional view showing a state in which a support sheet, a composite sheet for a substrate conveyance jig, and an adherend such as an FPC board are laminated in this order. Fig. 3 is a plan view showing an example of a support plate of a composite sheet for a substrate transporting jig of the present invention, and Fig. 3 is a perspective view showing a cross section (I) - (I) of Fig. 3. Fig. 4 is a plan view showing an example of a substrate transporting jig of the present invention, and Fig. 4 is a (II) cross-sectional perspective view of Fig. 4; Fig. 5 is a cross-sectional view showing an example of the use state of the substrate conveyance jig shown in Fig. 4. Fig. 6 is a schematic cross-sectional view showing a composite sheet for a substrate transporting jig formed by performing a technique of perfectly matching the irregularities on the back surface of the FPC board. [Main component symbol description] 10 Support plate -26- 201139136 1 1 : Through hole 1 5 : Through hole 30 : Composite sheet 30A : Composite sheet 3 0B : Cutting sheet 3 0 C : Cutting sheet 3 0D : Cutting sheet 33 : fluororubber paste layer 34 : the other side plane 3 5 : heat resistant resin film 36 : - square plane 37 : fluororubber layer 3 8 : surface 5 0 : FPC board 5 1 : through hole 7 〇 : substrate conveyance jig 7 1 : Through hole 80: Plug 90: Mounting device 9 1 : Mounting portion 92: Hole 99: Pin