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TW201129994A - Anisotropic conducting film and method for manufacturing the same - Google Patents

Anisotropic conducting film and method for manufacturing the same

Info

Publication number
TW201129994A
TW201129994A TW099133204A TW99133204A TW201129994A TW 201129994 A TW201129994 A TW 201129994A TW 099133204 A TW099133204 A TW 099133204A TW 99133204 A TW99133204 A TW 99133204A TW 201129994 A TW201129994 A TW 201129994A
Authority
TW
Taiwan
Prior art keywords
manufacturing
same
resin layer
conducting film
anisotropic conducting
Prior art date
Application number
TW099133204A
Other languages
Chinese (zh)
Other versions
TWI456595B (en
Inventor
Tatsurou Fukaya
Takayuki Matsushima
Jun Yamamoto
Ryota Aizaki
Katsuya Kudo
Kazutaka Furuta
Original Assignee
Sony Chem & Inf Device Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Chem & Inf Device Corp filed Critical Sony Chem & Inf Device Corp
Publication of TW201129994A publication Critical patent/TW201129994A/en
Application granted granted Critical
Publication of TWI456595B publication Critical patent/TWI456595B/en

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    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
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    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
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    • C09J7/10—Adhesives in the form of films or foils without carriers
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  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Non-Insulated Conductors (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Laminated Bodies (AREA)

Abstract

To simultaneously mount electronic components of differing sizes with high accuracy. An anisotropic conductive film has a two-layer structure of a first resin layer 11, having a tacking force of 200 kPa or more and a second resin layer 12 containing conductive particles. By loading the electronic components on the first resin layer 11, sharing of IC, FPC and SMD becomes possible and simultaneous mounting becomes possible.
TW099133204A 2009-09-30 2010-09-29 Anisotropic conductive film and method of manufacturing same TWI456595B (en)

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TWI664783B (en) * 2014-03-31 2019-07-01 日商迪睿合股份有限公司 Anisotropic conductive film, method for manufacturing the same, connection structure, and method for manufacturing connection structure
TWI711052B (en) * 2014-02-04 2020-11-21 日商迪睿合股份有限公司 Anisotropic conductive film and manufacturing method thereof
TWI755470B (en) * 2018-01-16 2022-02-21 優顯科技股份有限公司 Conductive film, optoelectronic semiconductor device and manufacturing method of the same

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US10412837B2 (en) * 2012-08-29 2019-09-10 Dexerials Corporation Anisotropic conductive film and method of producing the same
JP5956362B2 (en) * 2013-02-19 2016-07-27 デクセリアルズ株式会社 Anisotropic conductive film, connection method, and joined body
KR101665160B1 (en) * 2013-05-31 2016-10-11 제일모직주식회사 Anisotropic conductive film, the composition thereof and the display device using thereof
JP6428325B2 (en) * 2014-02-04 2018-11-28 デクセリアルズ株式会社 Anisotropic conductive film and manufacturing method thereof
JP2015149126A (en) * 2014-02-04 2015-08-20 デクセリアルズ株式会社 Anisotropic conductive film and manufacturing method thereof
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Publication number Priority date Publication date Assignee Title
JP2009041019A (en) * 2003-01-07 2009-02-26 Sekisui Chem Co Ltd Curable resin composition, adhesive epoxy resin paste, adhesive epoxy resin sheet, conductive connection paste, conductive connection sheet, and electronic component joined body
JP4282417B2 (en) * 2003-09-12 2009-06-24 ソニーケミカル＆インフォメーションデバイス株式会社 Connection structure
JP5099284B2 (en) * 2005-02-24 2012-12-19 ソニーケミカル＆インフォメーションデバイス株式会社 Anisotropic connection sheet material
JP2007169469A (en) * 2005-12-22 2007-07-05 Toray Ind Inc Adhesive composition for electronic device, method for producing the same, and adhesive sheet for electronic device using the same
JP5013067B2 (en) * 2007-01-22 2012-08-29 ソニーケミカル＆インフォメーションデバイス株式会社 Anisotropic conductive film

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Publication number Priority date Publication date Assignee Title
TWI711052B (en) * 2014-02-04 2020-11-21 日商迪睿合股份有限公司 Anisotropic conductive film and manufacturing method thereof
US11309270B2 (en) 2014-02-04 2022-04-19 Dexerials Corporation Anisotropic conductive film and production method of the same
TWI664783B (en) * 2014-03-31 2019-07-01 日商迪睿合股份有限公司 Anisotropic conductive film, method for manufacturing the same, connection structure, and method for manufacturing connection structure
TWI755470B (en) * 2018-01-16 2022-02-21 優顯科技股份有限公司 Conductive film, optoelectronic semiconductor device and manufacturing method of the same

Also Published As

Publication number Publication date
JP2011076808A (en) 2011-04-14
KR20120098646A (en) 2012-09-05
TWI456595B (en) 2014-10-11
HK1174153A1 (en) 2013-05-31
CN102668250A (en) 2012-09-12
CN102668250B (en) 2015-06-17
JP5398455B2 (en) 2014-01-29
WO2011040458A1 (en) 2011-04-07

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