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TW201129600A - Solder resist composition and printed circuit board - Google Patents

Solder resist composition and printed circuit board

Info

Publication number
TW201129600A
TW201129600A TW099113673A TW99113673A TW201129600A TW 201129600 A TW201129600 A TW 201129600A TW 099113673 A TW099113673 A TW 099113673A TW 99113673 A TW99113673 A TW 99113673A TW 201129600 A TW201129600 A TW 201129600A
Authority
TW
Taiwan
Prior art keywords
solder resist
resist composition
printed circuit
circuit board
photopolymerization initiator
Prior art date
Application number
TW099113673A
Other languages
Chinese (zh)
Other versions
TWI527838B (en
Inventor
Mami Nousaka
Yoshikazu Daigo
Shigeru Ushiki
Original Assignee
Taiyo Ink Mfg Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiyo Ink Mfg Co Ltd filed Critical Taiyo Ink Mfg Co Ltd
Publication of TW201129600A publication Critical patent/TW201129600A/en
Application granted granted Critical
Publication of TWI527838B publication Critical patent/TWI527838B/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0385—Macromolecular compounds which are rendered insoluble or differentially wettable using epoxidised novolak resin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
    • Y10S430/1055—Radiation sensitive composition or product or process of making
    • Y10S430/114—Initiator containing

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Materials For Photolithography (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Polymerisation Methods In General (AREA)
  • Macromonomer-Based Addition Polymer (AREA)

Abstract

The invention provides a solder resist composition capable of preventing the reduction of reflectance caused by deterioration of discoloration and having high reflectance and high resolution, and printed circuit boards obtained by using the solder resist agent formed by thereof. The solder resist composition is characterized by containing (A) carboxyl-containing resin having no aromatic ring, (B) bisacylphosphine oxide based photopolymerization initiator, (C) monoacylphosphine oxide based photopolymerization initiator, (D) photopolymerizable monomer. (E) rutile type titanium oxide, (F) epoxy compound, (G) organic solvent and (H) antioxidant.
TW099113673A 2010-02-17 2010-04-29 Solder resist composition and printed circuit board TWI527838B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010032935A JP2011170050A (en) 2010-02-17 2010-02-17 Solder resist composition and printed circuit board

Publications (2)

Publication Number Publication Date
TW201129600A true TW201129600A (en) 2011-09-01
TWI527838B TWI527838B (en) 2016-04-01

Family

ID=43811860

Family Applications (1)

Application Number Title Priority Date Filing Date
TW099113673A TWI527838B (en) 2010-02-17 2010-04-29 Solder resist composition and printed circuit board

Country Status (4)

Country Link
JP (1) JP2011170050A (en)
KR (1) KR20110095095A (en)
CN (2) CN102004394A (en)
TW (1) TWI527838B (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011030580A1 (en) * 2009-09-10 2011-03-17 積水化学工業株式会社 Photosensitive composition and printed wiring board
JP2011227308A (en) * 2010-04-20 2011-11-10 Taiyo Holdings Co Ltd Solder resist composition and print circuit board
JP2011215384A (en) * 2010-03-31 2011-10-27 Taiyo Holdings Co Ltd Solder resist composition and printed-circuit board
JP2013184996A (en) * 2012-03-06 2013-09-19 Hitachi Chemical Co Ltd Resin composition for optical material and cured product of the same
JP6131549B2 (en) * 2012-09-06 2017-05-24 日立化成株式会社 Photosensitive resin composition, photosensitive film, and method for producing circuit board
WO2014077171A1 (en) * 2012-11-16 2014-05-22 富士フイルム株式会社 White photosensitive resin composition, white cured film, white pattern, and method for producing white pattern
CN102981366A (en) * 2012-11-29 2013-03-20 惠州市容大油墨有限公司 Solder-resistance composite and application to printed circuit board
JP6463079B2 (en) * 2014-03-18 2019-01-30 太陽インキ製造株式会社 Curable resin composition, dry film, cured product and printed wiring board
KR20150108744A (en) * 2014-03-18 2015-09-30 다이요 잉키 세이조 가부시키가이샤 Curable resin composition, dry film, cured product and printed wiring board
CN104559456A (en) * 2014-12-25 2015-04-29 无锡德贝尔光电材料有限公司 White solder-resist ink for LED
CN107203095B (en) * 2017-07-19 2020-08-18 江苏广信感光新材料股份有限公司 A kind of white alkali-soluble photosensitive composition and its preparation method and application
JP7165473B2 (en) * 2018-12-27 2022-11-04 太陽インキ製造株式会社 Curable resin composition, dry film and cured product using the same, and electronic component having the same

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19812859A1 (en) * 1998-03-24 1999-09-30 Basf Ag Mixtures of photoinitiators
SE9904080D0 (en) * 1998-12-03 1999-11-11 Ciba Sc Holding Ag Fotoinitiatorberedning
JP2004318047A (en) * 2003-03-31 2004-11-11 Sumitomo Bakelite Co Ltd Photosensitive resin composition, laminate, wiring board, and flexible wiring board
JP4340272B2 (en) * 2006-05-30 2009-10-07 太陽インキ製造株式会社 Photocurable / thermosetting solder resist composition and printed wiring board using the same
JP4538484B2 (en) * 2006-10-24 2010-09-08 太陽インキ製造株式会社 Photocurable thermosetting resin composition and printed wiring board using the same
TWI357536B (en) * 2006-10-24 2012-02-01 Taiyo Ink Mfg Co Ltd Photosetting and thermosetting solder resist ink c
KR100904348B1 (en) * 2006-10-24 2009-06-23 다이요 잉키 세이조 가부시키가이샤 Photocurable thermosetting resin composition and printed wiring board using same
JP4994922B2 (en) * 2007-04-06 2012-08-08 太陽ホールディングス株式会社 Solder resist composition and cured product thereof
JP2009194222A (en) * 2008-02-15 2009-08-27 Denki Kagaku Kogyo Kk White alkali-developable photocurable / thermosetting solder resist composition and metal base circuit board using the same
JP2010014767A (en) * 2008-07-01 2010-01-21 Denki Kagaku Kogyo Kk Alkali developable photocurable/heat curable solder resist composition and metal base circuit board using the same
TWI408150B (en) * 2008-10-17 2013-09-11 Taiyo Ink Mfg Co Ltd A solder resist composition and a printed circuit board using the same
JP5749886B2 (en) * 2009-12-28 2015-07-15 株式会社タムラ製作所 Curable resin composition and printed wiring board using the same
JP5325805B2 (en) * 2010-01-29 2013-10-23 株式会社タムラ製作所 Photosensitive resin composition and printed wiring board using cured film thereof

Also Published As

Publication number Publication date
CN102707569A (en) 2012-10-03
JP2011170050A (en) 2011-09-01
KR20110095095A (en) 2011-08-24
TWI527838B (en) 2016-04-01
CN102004394A (en) 2011-04-06
CN102707569B (en) 2016-03-30

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