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TW201129277A - Housing for electronic device and method for making the same - Google Patents

Housing for electronic device and method for making the same Download PDF

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Publication number
TW201129277A
TW201129277A TW99102921A TW99102921A TW201129277A TW 201129277 A TW201129277 A TW 201129277A TW 99102921 A TW99102921 A TW 99102921A TW 99102921 A TW99102921 A TW 99102921A TW 201129277 A TW201129277 A TW 201129277A
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Taiwan
Prior art keywords
woven
electronic device
piece
fiber material
layer
Prior art date
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TW99102921A
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Chinese (zh)
Inventor
yue-ping Liu
You-Li Liu
Hsiang-Jung Su
Wen-Te Lai
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Fih Hong Kong Ltd
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Priority to TW99102921A priority Critical patent/TW201129277A/en
Publication of TW201129277A publication Critical patent/TW201129277A/en

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Abstract

A housing for electronic device is provided which includes a substrate and a plurality of assembling members. The substrate includes a fibre layer, a metal inlayer embedded in the fibre layer, and a plastic layer bonding the fibre layer. One surface of fibre layer opposite to the plastic layer defines a plurality of holes to expose parts of the metal inlayer. The assembling members are respectively connected with the metal inlayer from the corresponding holes. A method for making the present housing is also provided.

Description

201129277 六、發明說明: 【發明所屬之技術領娀】 剛本發明係_,種電子裝置外殼及其製作方法。 【先前技術】 [0002] 一般而言,行動電話、電腦、π却 遊戲機及個人數位助理f _電子=外殼係由_材質或金屬數= 不銹鋼、鋁合金及鎂合金)贺 ^ 出成型方式製得’該方法可—/、中’塑膠外殼以射 然,塑料殼強度不足,容成i出幾乎所有結構, 〇 ★ 易磨損和破裂,且盆矣而帝 騎喷漆等裝飾處理。而以金屬材概士八表面需 除其製作過程複雜、生產遇期'之金屬外殼, , 當之重量,而使得金屬朴#之外’還因金屬具有相 ,一般在製得金屬外毂後,還 輕質化之要求。又 在金屬外殼表面形成保護層、~ 噴漆:、電鑛等方式 方式費時費工。 或形成各式裝飾圖案, [0003] Ο 相較於塑膠及金屬’纖維材料卜 ‘ 具有較輕之品質、高強声 兔纖維或玻璃纖維 後本身可形成裝飾紋路致=優點’且纖維材料藉由 應用於電子t置外殼,然 因此,纖維材料已經 卡鉤等裝配結構之外殼、,、使三維立體外形及 定難度。 冑維材料來成型還存 【發明内容】 [0004]有鑒於此,有必要接伹 卡納㈣峡 輕質、強度較高,同時 卡鉤等裝配結構之電子|置·。 圆斜,還有Μ提供_種上述電 〇"102921 她號麵1 171 、置外殼之製作 201129277 ο [0006] —種電子裝置外殼,其包括一基體及連接於該基體上之 若干裝配件,該基體包括一纖維材料層、嵌設於該纖維 材料層中之一金屬嵌件及結合於該纖維材料層上之一塑 膠層,該纖維材料層與該塑膠層相背之表面對應金屬嵌 件之區域開設有若干開孔,該裝配件經該開孔與該金屬 嵌件連接。 [0007] —種電子裝置外殼之製作方法,包括如下步驟: [0008] 分別製作一金屬嵌件和若干裝配件,該金屬嵌件包括若 干連接部; [0009] 提供一模具,該模具包括一母模及一公模,母模與公模 配合形成一模腔; [〇〇1〇] 提供未固化之預浸有樹脂之纖維編織布,並將其裁剪出 相同形狀之一第一編織片及一第二編織片; [0011] 將該第一編織片貼合於母模内,放置該金屬嵌件於第一 編織片上,再貼合第二編織片於該第一編織片上,使該 金屬嵌件包裹在第一編織片與第二編織片之間; [0012] 向模腔内注射一塑膠層與第二編織片結合,冷卻後該塑 膠層與第一編織片、第二編織片及金屬嵌件結合為一體 形成一基體; [0013] 去除覆蓋於連接部上之部分第一編織片,以露出連接部 [0014] 藉由焊接之方式將所述裝配件與連接部連接 099102921 表單編號Α0101 第4頁/共17頁 0992005544-0 201129277 [0015] [0016] Ο [0017] [0018] Ο 099102921 上述電子裝置外殼之基體主要由纖維材料構成,同時於 纖維材料層中嵌設一金屬嵌件,然後再藉由焊接之方式 將裝配件與金屬嵌件固接,由此在以纖維材料為主之外 殼上形成裝配結構,使電子裝置外殼既具有較輕之重量 ’又具有較高之強度和較佳之裝飾效果,而且便於裝配 〇 實施方式】 清參閱圖1 ’本發明較佳實施例之電子裝置外殼100以一 手機電、池蓋為例’包括一基體10及連接於基體10上之若 干裝配件30 〇 請參閱圖2,基體10包括一織維材料層12、嵌設於纖維材 料層12中之一金屬嵌件13及結合於纖維材料層12上之一 塑膠層14。201129277 VI. Description of the Invention: [Technical Profile of the Invention] The invention is just the invention, the electronic device casing and the manufacturing method thereof. [Prior Art] [0002] In general, mobile phones, computers, π-game consoles, and personal digital assistants f_Electronics=Shells are made of _material or metal number = stainless steel, aluminum alloy, and magnesium alloy. The method can be made - ', the medium' plastic shell to shoot, the plastic shell is not strong enough to accommodate almost all structures, 〇 ★ easy to wear and rupture, and the basin and the emperor riding paint and other decorative treatment. In addition, the surface of the metal material is required to be complicated by the production process, and the metal casing of the production period, and the weight of the metal, which makes the metal outside the metal, has a phase, usually after the metal outer hub is produced. , also the requirements of lightweight. It also takes a time to work on the surface of the metal casing to form a protective layer, ~ painting: electric ore. Or forming a variety of decorative patterns, [0003] Ο compared to plastic and metal 'fibrous material' has a lighter quality, high-strength acoustic rabbit fiber or glass fiber itself can form a decorative texture = advantage 'and fiber material by It is applied to the electronic t-shell, and therefore, the fiber material has been hooked and the like, and the three-dimensional shape and difficulty are made.胄 材料 材料 材料 【 【 【 [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ Round obliquely, and also provided by _ 上述 上述 102 102 102 102 102 102 102 102 102 102 102 102 102 102 102 102 102 102 102 2011 0006 0006 0006 0006 0006 0006 0006 0006 0006 0006 0006 0006 0006 0006 0006 0006 0006 0006 0006 0006 0006 0006 0006 0006 0006 0006 0006 0006 0006 0006 0006 0006 The substrate comprises a layer of fibrous material, a metal insert embedded in the layer of fibrous material, and a plastic layer bonded to the layer of fibrous material, the surface of the fibrous material layer opposite the plastic layer corresponding to the metal embedded The opening of the piece is provided with a plurality of openings through which the fitting is connected to the metal insert. [0007] A method for manufacturing an electronic device casing, comprising the steps of: [0008] separately manufacturing a metal insert and a plurality of fittings, the metal insert comprising a plurality of connecting portions; [0009] providing a mold, the mold comprising a a master mold and a male mold, the master mold and the male mold cooperate to form a cavity; [〇〇1〇] provides an uncured pre-impregnated fiber woven fabric and cuts it into one of the same shape as the first woven sheet And a second woven sheet; [0011] attaching the first woven sheet to the master mold, placing the metal insert on the first woven sheet, and then attaching the second woven sheet to the first woven sheet, a metal insert is wrapped between the first woven piece and the second woven piece; [0012] a plastic layer is injected into the cavity to be combined with the second woven piece, and after cooling, the plastic layer is combined with the first woven piece and the second woven piece Forming a base body together with the metal insert; [0013] removing a portion of the first woven sheet covering the connecting portion to expose the connecting portion [0014] connecting the fitting and the connecting portion by way of welding 099102921 No.Α0101 Page 4/Total 17 Page 0992 005544-0 201129277 [0015] [0018] Ο 099102921 The base of the electronic device casing is mainly composed of a fiber material, and a metal insert is embedded in the fiber material layer, and then welded. The method is to fix the fitting with the metal insert, thereby forming an assembly structure on the outer shell of the fiber material, so that the electronic device shell has both a lighter weight and a higher strength and better decorative effect, and For the purpose of assembly, please refer to FIG. 1 . The electronic device housing 100 of the preferred embodiment of the present invention includes a mobile phone and a battery cover as an example. A base 10 and a plurality of assembly 30 connected to the base 10 are provided. 2, the substrate 10 includes a layer of the weaver material 12, a metal insert 13 embedded in the fibrous material layer 12, and a plastic layer 14 bonded to the fibrous material layer 12.

I 請進一步參閱圖3,該纖維材料層12由纖維材料製成之第 一編織片121及第二編織片123層疊形感,其中第一編織 片1 21上形成有若干開孔1212 ν該纖錐材料選自碳纖維材 料、玻璃纖維材料、克維拉(Kevler)纖維材料及混編 (Hybrid)纖維材料中之一種,本實施例優選碳纖維材 料或玻璃纖維材料。該第一編織片121與第二編織片123 分別由具有紋路之纖維編織布浸泡於樹脂中,使樹脂充 分滲浸到纖維編織布之内部及外表面,再進行加壓、加 熱等使纖維編織布硬化而結合為一體。第—編織片121及 第二編織片123之厚度分別為〇. 2〜〇. 3mm。所述纖維編織 布之紋路可以為直紋、橫紋及斜紋等。 請進一步參閱囷4,金屬嵌件13大致為薄片狀,其被包覆 表單編號A0101 第5頁/共17頁 0992005544-0 [0019] 201129277 於第一編織片121與第二編織片123之間。金屬嵌件13包 括一本體131及連接於本體131之若干連接部133。本實 施例之本體131為環形薄片,其厚度大約為0. 2mm。為了 具有更小之重量,本體131可做成任意有利於輕質化之具 體形狀。所述連接部133從本體131之周緣延伸出,並且 分別與所述開孔1212之位置對應。金屬嵌件13可由不銹 鋼、銅、鈦合金等金屬材料製成,本實施例優選為不銹 鋼。 [0020] 還請參閱圖3,塑膠層14與第二編織片123結合,其形成 電子裝置外殼100之最外層。塑膠層14為透明塑膠製成。 [0021] 請參閱圖1,裝配件30分別從對應之開孔1212與連接部 133連接。裝配件30可為卡扣、卡鉤等電子裝置外殼100 之裝配結構。裝配件30由不銹鋼、銅、鈦合金等金屬材 料製成,本實施例優選為不銹鋼。 [0022] 上述電子裝置外殼1 0 0之較佳實施例之製作方法包括以下 步驟: [0023] 首先,分別製作金屬嵌件13和裝配件30。金屬嵌件13和 裝配件30均可藉由衝壓方式分別製作。 [0024] 請參閱圖5所示,提供一成型模具40,該模具40包括一母 模41及一與該母模41配合之一公模43。母模41與公模43 配合形成一模腔45,該模腔45與電子裝置外殼100除該裝 配件30以外之形狀及尺寸相對應。 [0025] 提供未固化之預浸纖維編織布,並將其裁剪出相同形狀 之第一編織片121及第二編織片123。該預浸纖維編織布 099102921 表單編號A0101 第6頁/共17頁 0992005544-0 201129277 上/又泡有熱固性樹脂或熱塑性樹脂。該纖維編織布由選 炭纖維材料、玻璃纖維材料、克維拉纖維材料及混蝙 纖維材料中之一種製成。 [0026] [0027] Ο [0028] Ο [0029] [0030] 將第編織片121貼合於與公模43相對之母模41之表面上 ’接著將金屬嵌件13放置於第—編織片121上,再將第二 =片123貼合於該第一編織片⑵上,使金屬嵌们犄 匕裹在第一編織片121與第二編織片123之間。 =閲圖6,將母模41與公模43合模,並向模腔仙 =塑膠,罐卿阶,同輪剛。^ 力)之成型壓力。該溶融之塑膠充填模腔Μ =塑膝層U,並且塑膠層14與第二編織片123結合 =後’塑膠層14與第-編織片121、第二編心寺 屬嵌件13結合為一體,由此成型為該 之基體10。該塑膠層14之厚度大約為G 9〜ul外毅100 ==射_等方式去除覆蓋於金屬嵌件13之_ 第-編織片121,以形成所述開孔12 133。 出連接邹 藉由焊接之方式將裝配件3〇與連接部133連接, 該電子裝置外殼1〇〇之製作。 由此完成 可以理解,該纖維材料層12還可由二層 疊層形成。 上之編織片121 可以理解,為了使電子裝置外殼100表面具有更$ ” 度,還可於塑謬層14表面塗覆_層透明油漆,如H光亮 099102921 表單編號A0101 第7頁/共17頁 0992005544-0 [0031] 201129277 [0032] 上述電子裝置外殼100之基體10主要由纖維材料構成,同 時於纖維材料層巾欲設―金屬料U,然後再藉由 之方式將裝配件3〇與金屬嵌件固接,由此在以 ^ ^ 1 纖*維材料 為主之外殼上形成裝配結構,使電子展置外殼1 〇 〇 而 較輕之重量’又具有較高之強度和較佳之裝飾效果足具有 且便於裝配Ο [0033] [0034] 【圖式簡單說明】 圖1為本發明較佳實施例電子裝置外般之組裝示专圖 圖2為本發明較佳實施例電子裝置外较之基體之 意圖; 剖视 不 [0〇35]圖3為本發明較佳實施例電子裝置外殼之基體之另 示意圖; [0036]圖4為本發明較佳實施例電子裝置外殼之金屬歲件 園, 剖視 之示意 [0037] 圖5為製作本發明較佳實施例電子裝置外殼之第 、第二預浸布及金屬歲件放,母模時,公模與母镇 模不意圖; 預浸布 之合 [0038] 圖6為圖5注入熔融之塑膠後,成型該基體示黃圖 【主要元件符號說明】 [0039] 電子裝置外殼·· 1〇〇 [〇〇4〇]基體:1〇 [0041] 纖維材料層:12 [0042] 第一編織片:1 21 099102921 表單編號Α0101 第8頁/共17頁 0992005544-0 201129277 [0043] [0044] [0045] [0046] [0047] [0048] [0049] ❹ [0050] -[0051] [0052] [0053] 開孔: 1212 第二編 織片:123 金屬嵌件:13 本體: 131 連接部 :133 塑膠層 :14 裝配件 :30 模具: 40 母模= 41 公模: 43 模腔: 45 099102921 表單編號A0101 第9頁/共17頁 0992005544-0I further referring to FIG. 3, the fibrous material layer 12 is formed by laminating the first woven piece 121 and the second woven piece 123 made of a fiber material, wherein the first woven piece 1 21 is formed with a plurality of openings 1212 ν. The cone material is selected from the group consisting of a carbon fiber material, a glass fiber material, a Kevler fiber material, and a hybrid fiber material. This embodiment is preferably a carbon fiber material or a glass fiber material. The first woven piece 121 and the second woven piece 123 are respectively immersed in the resin by a fiber woven cloth having a texture, so that the resin is sufficiently immersed in the inner and outer surfaces of the fiber woven fabric, and then the fiber is woven by pressurization, heating, or the like. The cloth is hardened and combined into one. The thickness of the first woven piece 121 and the second woven piece 123 are respectively 〇. 2~〇. 3mm. The texture of the fiber woven fabric may be straight, horizontal or twill. Please further refer to 囷4, the metal insert 13 is substantially in the form of a sheet, which is covered by the form number A0101, page 5 / page 17 0992005544-0 [0019] 201129277 between the first woven piece 121 and the second woven piece 123 . The metal insert 13 includes a body 131 and a plurality of connecting portions 133 connected to the body 131. 2毫米。 The body of the present invention is a thickness of about 0. 2mm. In order to have a smaller weight, the body 131 can be formed into any specific shape that is advantageous for weight reduction. The connecting portion 133 extends from the periphery of the body 131 and corresponds to the position of the opening 1212, respectively. The metal insert 13 may be made of a metal material such as stainless steel, copper or titanium alloy, and this embodiment is preferably stainless steel. Referring also to FIG. 3, the plastic layer 14 is bonded to the second woven sheet 123, which forms the outermost layer of the electronic device housing 100. The plastic layer 14 is made of transparent plastic. [0021] Referring to FIG. 1, the fittings 30 are respectively connected to the connecting portion 133 from the corresponding opening 1212. The fitting 30 can be an assembly structure of the electronic device housing 100 such as a buckle or a hook. The fitting 30 is made of a metal material such as stainless steel, copper or titanium alloy, and this embodiment is preferably stainless steel. [0022] The manufacturing method of the preferred embodiment of the electronic device housing 1000 includes the following steps: [0023] First, the metal insert 13 and the fitting 30 are separately fabricated. Both the metal insert 13 and the fitting 30 can be separately produced by stamping. Referring to FIG. 5, a molding die 40 is provided. The mold 40 includes a master mold 41 and a male mold 43 mated with the master mold 41. The female mold 41 cooperates with the male mold 43 to form a cavity 45 corresponding to the shape and size of the electronic device housing 100 other than the assembly 30. [0025] An uncured prepreg fiber woven fabric is provided and cut into a first woven piece 121 and a second woven piece 123 of the same shape. The prepreg woven fabric 099102921 Form No. A0101 Page 6 of 17 0992005544-0 201129277 On/with foamed thermosetting resin or thermoplastic resin. The fiber woven fabric is made of one of a carbon fiber material, a glass fiber material, a Kevlar fiber material, and a mixed bat fiber material. [0028] [0030] [0030] [0030] The first woven sheet 121 is attached to the surface of the female mold 41 opposite to the male mold 43. Then the metal insert 13 is placed on the first woven sheet. On the 121, the second = sheet 123 is attached to the first woven sheet (2), and the metal inserts are wrapped between the first woven sheet 121 and the second woven sheet 123. = Read Figure 6, the master mold 41 and the male mold 43 are clamped, and the mold cavity = plastic, cans, and the same wheel. ^ Force) molding pressure. The molten plastic filling cavity Μ = plastic knee layer U, and the plastic layer 14 is combined with the second woven piece 123 = the rear plastic layer 14 is combined with the first woven piece 121 and the second woven heart temple insert 13 Thereby, the base body 10 is formed. The plastic layer 14 has a thickness of about G 9 ul y 100 == ray _ or the like to remove the _ woven sheet 121 covering the metal insert 13 to form the opening 12 133. The connection device 3 is connected to the connection portion 133 by soldering, and the electronic device housing 1 is manufactured. It is thus understood that the fibrous material layer 12 can also be formed from a two-layer laminate. In the upper woven sheet 121, it can be understood that in order to make the surface of the electronic device housing 100 more "degree", the surface of the plastic layer 14 can also be coated with _ layer transparent paint, such as H bright 099102921 Form No. A0101 Page 7 / Total 17 pages 0992005544-0 [0031] The base 10 of the electronic device casing 100 is mainly composed of a fiber material, and at the same time, a metal material U is required for the fiber material layer, and then the assembly 3 is metal and the metal is used. The insert is fixed, thereby forming an assembly structure on the outer casing mainly composed of ^^1 fiber* material, so that the electronic display case 1 is lighter and has a higher strength and better decorative effect. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is an external assembly diagram of an electronic device according to a preferred embodiment of the present invention. FIG. 2 is an external view of an electronic device according to a preferred embodiment of the present invention. 3 is a schematic view of a base of an electronic device casing according to a preferred embodiment of the present invention; [0036] FIG. 4 is a perspective view of a metal case of an electronic device casing according to a preferred embodiment of the present invention. , the schematic view of the section [0037] 5 is for making the first and second prepreg and the metal piece of the electronic device casing of the preferred embodiment of the present invention, and the male mold and the female mold are not intended; the prepreg is combined [0038] FIG. 6 is Figure 5 After injecting the molten plastic, the base is shown in yellow. [Main component symbol description] [0039] Electronic device housing · 1〇〇[〇〇4〇] Substrate: 1〇[0041] Fiber material layer: 12 [ 0042] First woven piece: 1 21 099102921 Form number Α 0101 Page 8 / Total 17 page 0992005544-0 201129277 [0044] [0046] [0049] [0049] [0049] [0050] [0053] Opening: 1212 Second woven piece: 123 Metal insert: 13 Body: 131 Connection: 133 Plastic layer: 14 Assembly: 30 Mold: 40 Female mold = 41 Male mold: 43 Cavity: 45 099102921 Form No. A0101 Page 9 / Total 17 Page 0992005544-0

Claims (1)

201129277 七、申請專利範圍: 1 . 一種電子裝置外殼,其包括一基體及連接於該基體上之若 干金屬裝配件,其改良在於:該基體包括一纖維材料層、 嵌設於該纖維材料層中之一金屬嵌件及結合於該纖維材料 層上之一塑膠層,該纖維材料層與該塑膠層相背之表面對 應金屬嵌件之區域開設有若干開孔,該裝配件經該開孔與 該金屬嵌件連接。 2 .如申請專利範圍第1項所述之電子裝置外殼,其中該纖維 材料層由纖維材料製成之第一編織片及第二編織片層疊形 成,該金屬嵌件包覆於該第一編織片與第二編織片之間。 3. 如申請專利範圍第2項所述之電子裝置外殼,其中該第一 編織片與第二編織片分別由具有紋路之纖維編織布浸泡於 樹脂後經硬化結合成一體。 4. 如申請專利範圍第3項所述之電子裝置外殼,其中該金屬 嵌件包括若干連接部,所述開孔形成於該第一編織片上對 應於所述連接部之位置。 5 .如申請專利範圍第3項所述之電子裝置外殼,其中該纖維 編織布由選自碳纖維材料、玻璃纖維材料、克維拉纖維材 料及混編纖維材料中之一種製成。 6 .如申請專利範圍第2項所述之電子裝置外殼,其中該塑膠 層與該第二編織片結合,該塑膠層由透明塑膠製成。 7 . —種電子裝置外殼之製作方法,包括如下步驟: 分別製作一金屬嵌·件和若干裝配件,該金屬散件包括若干 連接部; 提供一模具,該模具包括一母模及一公模,母模與公模配 099102921 表單編號A0101 第10頁/共17頁 0992005544-0 201129277 合形成一模腔; 提供未固化之預浸有樹脂之纖維編織布,並將其裁剪出相 同形狀之一第一編織片及一第二編織片; 將該第一編織片貼合於母模内,放置該金屬嵌件於第一編 織片上,再貼合第二編織片於該第一編織片上,使該金屬 嵌件包裹在第一編織片與第二編織片之間; 向模腔内注射一塑膠層與第二編織片結合,冷卻後該塑膠 層與第一編織片、第二編織片及金屬嵌件結合為一體形成 一基體; Ο 8 . 去除覆蓋於連接部上之部分第一編織片,以露出連接部; 藉由焊接之方式將所述裝配件與連接部連接。 如申請專利範圍第7項所述之方法,其中該纖維編織布由 選自碳纖維材料、玻璃纖維材料、克維拉纖維材料及混編 纖維材料中之一種製成。 如申請專利範圍第7項所述之方法,其中所述連接部上之 部分第一編織片藉由鐳射雕刻之方式去除。 10 . Ο 如申請專利範圍第7項所述之方法,其中該電子裝置外殼 之製作方法還包括於該塑膠層塗覆一層透明油漆。 099102921 表單編號Α0101 第11頁/共17頁 0992005544-0201129277 VII. Patent application scope: 1. An electronic device casing comprising a base body and a plurality of metal fittings connected to the base body, wherein the base body comprises a fiber material layer embedded in the fiber material layer. a metal insert and a plastic layer bonded to the layer of fibrous material, the surface of the fibrous material layer opposite the surface of the plastic layer corresponding to the metal insert is provided with a plurality of openings through which the fitting is The metal insert is connected. 2. The electronic device casing of claim 1, wherein the fibrous material layer is formed by laminating a first woven piece and a second woven piece made of a fibrous material, the metal insert being coated on the first woven fabric. Between the sheet and the second woven sheet. 3. The electronic device casing of claim 2, wherein the first woven piece and the second woven piece are respectively immersed in a resin by a fiber woven cloth having a texture and then hardened and integrated. 4. The electronic device casing of claim 3, wherein the metal insert comprises a plurality of connecting portions formed on the first woven sheet at positions corresponding to the connecting portion. 5. The electronic device casing of claim 3, wherein the fiber woven fabric is made of one selected from the group consisting of a carbon fiber material, a glass fiber material, a Kevlar fiber material, and a mixed fiber material. 6. The electronic device casing of claim 2, wherein the plastic layer is combined with the second woven sheet, the plastic layer being made of transparent plastic. 7. A method of manufacturing an electronic device housing, comprising the steps of: separately fabricating a metal insert and a plurality of fittings, the metal scrap comprising a plurality of connecting portions; providing a mold, the mold comprising a female mold and a male mold , female and male models with 099102921 Form No. A0101 Page 10 / Total 17 pages 0992005544-0 201129277 Form a cavity; Provide uncured pre-impregnated fiber woven fabric and cut it into one of the same shape a first woven piece and a second woven piece; the first woven piece is attached to the master dies, the metal insert is placed on the first woven piece, and the second woven piece is attached to the first woven piece, so that The metal insert is wrapped between the first woven piece and the second woven piece; a plastic layer is injected into the cavity to be combined with the second woven piece, and after cooling, the plastic layer is combined with the first woven piece, the second woven piece and the metal The inserts are integrally joined to form a base body; Ο 8. A portion of the first woven sheet covering the connecting portion is removed to expose the connecting portion; and the fitting is connected to the connecting portion by welding. The method of claim 7, wherein the fiber woven fabric is made of one selected from the group consisting of a carbon fiber material, a glass fiber material, a Kevlar fiber material, and a mixed fiber material. The method of claim 7, wherein a portion of the first woven sheet on the connecting portion is removed by laser engraving. 10. The method of claim 7, wherein the method of fabricating the electronic device housing further comprises applying a layer of clear paint to the plastic layer. 099102921 Form number Α0101 Page 11 of 17 0992005544-0
TW99102921A 2010-02-02 2010-02-02 Housing for electronic device and method for making the same TW201129277A (en)

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103079368A (en) * 2011-10-26 2013-05-01 仁宝电脑工业股份有限公司 chassis
TWI504510B (en) * 2012-12-20 2015-10-21 Compal Electronics Inc Composite material and method of forming the same
US9242446B2 (en) 2012-05-11 2016-01-26 Asustek Computer Inc. Manufacturing method of composite material
CN115674752A (en) * 2022-09-26 2023-02-03 歌尔科技有限公司 Carbon fiber composite material shell, preparation method thereof and electronic equipment

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103079368A (en) * 2011-10-26 2013-05-01 仁宝电脑工业股份有限公司 chassis
US9242426B2 (en) 2011-10-26 2016-01-26 Compal Electronics, Inc. Composite plate structure and manufacturing method thereof
TWI551208B (en) * 2011-10-26 2016-09-21 仁寶電腦工業股份有限公司 cabinet
US9242446B2 (en) 2012-05-11 2016-01-26 Asustek Computer Inc. Manufacturing method of composite material
TWI504510B (en) * 2012-12-20 2015-10-21 Compal Electronics Inc Composite material and method of forming the same
CN115674752A (en) * 2022-09-26 2023-02-03 歌尔科技有限公司 Carbon fiber composite material shell, preparation method thereof and electronic equipment

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