201125463 六、發明說明： 【發明所屬之技術領域】 [0001] 本發明涉及一種電子裝置殼體及其製作方法。 [先前技術3 [0002] 隨著移動通訊、藍牙等技術之發展，實現該等應用之電 子裝置具有愈來愈多之功能，然，該等電子裝置之體積 向著輕、薄之方向發展，故，如何簡化該等電子裝置中 内置元件之結構、減小該等内置元件之體積對於簡化整 個電子裝置之結構及降低該電子裝置之體積具有非常重 〇 要之作用。天線作為電子裝置中一收發信號之重要元件 ，其結構之簡化及體積之減小對於簡化整個電子裝置之 結構及降低該電子裝置之體積具有關鍵作用。 [0003] 習知電子裝置包括一本體、一天線輻射體及一殼體。該 天線輻射體藉由熱熔或黏貼之方式固定於本體上。該殼 體藉由卡合之方式固定於該本體上並覆蓋該天線輻射體 〇 〇 [0004] 然，藉由上述方法製作之天線輻射體完全暴露於本體外 ，很容易被劃傷或破壞，故可影響天線輻射體之性能及 電子裝置之通訊性能。另，殼體裝配於本體上時，殼體 與天線輻射體之間會存在間隙。因此不利於減小電子裝 置之體積。 【發明内容】 [0005] 有鑒於此，有必要提供一種與天線輻射體一體成型之電 子裝置殼體。 099100845 表單編號A0I01 第3頁/共15頁 0992001702-0 201125463 [0006] 另外，還有必要提供一種上述電子裝置殼體之製作方法 〇 [0007] —種電子裝置殼體，其包括一第一本體和一第二本體， 該第一本體之材質包含有可鐳射活化物，該第一本體藉 由鐳射活化並電鍍或化學鍍後而形成一天線輻射體，該 第二本體形成於該第一本體上並覆蓋該天線輻射體，且 該天線輻射體包括至少一部分地露出於所述第一本體及 第二本體外部之端子。 [0008] 一種電子裝置殼體之製作方法，其包括如下步驟： [0009] 提供一第一成型模具及一第二成型模具，該第一成型模 具具有一一次成型型腔，該第二成型模具具有一二次成 型型腔； [0010] 向所述一次成型型腔中注塑含可鐳射活化物之塑膠形成 電子裝置殼體之第一本體； [0011] 鐳射活化所述第一本體之表面； [0012] 將所述被活化之第一本體之表面金屬化形成一天線輻射 體； [0013] 向所述二次成型型腔中注塑塑膠以形成一第二本體，該 第二本體與該第一本體相結合並將天線輻射體部分的覆 蓋。 [0014] 相較於習知技術，本發明電子裝置殼體之天線輻射體藉 由兩次注塑成型而形成於電子裝置之殼體中，該電子裝 置殼體可將天線輻射體進行保護，防止天線輻射體被劃 099100845 表單編號A0101 第4頁/共15頁 0992001702-0 201125463 傷或損壞，保證了電子裝置之通訊性能。另，該天線輻 射體藉由LDS技術形成於電子|置殼體内，故無須考慮殼 體與天線H射體之間存在卩切:之_，可減小電子裝置 之體積。 【實施方式】 _請參_1及圖2，本發明較佳實施方式之電子裝置殼體 10包括-第-本體11、—第二本體13及一形成於第一本 體11及第-本體13之間之天線轄射體15，該天線輕射體 ◎ 15至少一端延伸至第—本體11及第二本體13之外部。 [0016]該第一本體11以注塑成型之方式製成。注塑成型第一本 體11之材質可為熱塑性塑膠、有機填充物及可鐳射活化 物之混合物。所述熱塑性塑膠可為耷氣乙烯、聚對苯二 甲酸乙一醇s曰'丙烯睛-笨乙烯_丁二烯共聚合物（ABS)、 聚碳酸酯（PC)、聚醯亞胺、液晶聚合物、聚醚醯亞胺、 聚苯硫、聚颯、聚笨乙烯、乙二醇改性聚酯及聚丙烯聚 合物中之一種或多種。本發明較佳實施例之第一本體u 〇 之熱塑性塑膠優選丙烯睛-苯乙烯_ 丁二烯共聚合物與聚 碳酸酯之混合物或聚碳酸酯。有機填充物優選矽酸和/或 矽酸衍生物。所述可鐳射活化物可為不導電之基於尖晶 石之高階氧化物’如含銅尖晶石等。於所述注塑成型第 一本體11之混合物中，其中熱塑性塑膠之百分含量可於 65-75%之間’有機填充物之百分含量可於22-28%之間， 不導電之基於尖晶石之高階氧化物之百分含量可於3_7% 之間。所述不導電之基於尖晶石之高階氧化物可被鐳射 活化而析出金屬晶核並覆蓋於第一本體Π之表面。 099100845 表單編號A0101 第5頁/共15頁 0992001702-0 201125463 [0017] 所述天線輻射體15為一形成於第一本體11之預選表面之 電鍍層。該電鍍層包括依次形成於該預選表面之電鍍銅 層、電鍍鎳層及電鍍金層。所述電鍍銅層主要起天線之 作用；所述電鍍鎳層為保護層，其用於防止電鍍銅層被 氧化；所述電鍍金層具有良好之導通率，以保證天線輻 射體15之性能。該天線輻射體15可採用鐳射直接成型（ LDS，laser direct structuring)之方法對所述第 一本體11表面之預選區域先進行鐳射活化，使該預選區 域之不導電基於尖晶石之高階氧化物之金屬晶核析出於 表面，而後對該預選區域進行電鍍而制得。 [0018] 該第二本體13以注塑成型之方式製成。注塑成型第二本 體13之材料採用可塑材料如聚氣乙烯、聚對苯二甲酸乙 二醇酯、丙烯睛-苯乙烯-丁二烯共聚合物、聚碳酸酯、 聚醯亞胺、液晶聚合物、聚醚醯亞胺、聚苯硫、聚颯、 聚苯乙烯、乙二醇改性聚酯及聚丙烯聚合物中之一種或 多種。本發明較佳實施例之第二本體13優選丙烯睛-苯乙 烯-丁二烯共聚合物與聚碳酸酯之混合物。所述第二本體 13材料之熔融溫度低於第一本體11材料之熔融溫度。 [0019] 本發明較佳實施方式之製作所述電子裝置殼體1 0之方法 包括如下步驟： [0020] 提供一第一成型模具及一第二成型模具，該第一成型模 具具有——次成型型腔，該第二成型模具具有一二次成 型型腔； [0021] 請一併參閱圖3及圖4,向所述一次成型型腔中注塑含可 099100845 表單編號A0101 第6頁/共15頁 0992001702-0 201125463201125463 VI. Description of the Invention: [Technical Field of the Invention] [0001] The present invention relates to an electronic device housing and a method of fabricating the same. [Prior Art 3 [0002] With the development of technologies such as mobile communication and Bluetooth, electronic devices that implement such applications have more and more functions, and the volume of such electronic devices is moving toward a light and thin direction. How to simplify the structure of the built-in components in the electronic devices and reduce the volume of the built-in components has a very important role in simplifying the structure of the entire electronic device and reducing the volume of the electronic device. As an important component of a signal transmission and reception in an electronic device, the simplification of the structure and the reduction of the volume play a key role in simplifying the structure of the entire electronic device and reducing the volume of the electronic device. [0003] A conventional electronic device includes a body, an antenna radiator, and a housing. The antenna radiator is fixed to the body by heat fusion or adhesion. The housing is fixed to the body by a snapping manner and covers the antenna radiator. [0004] The antenna radiator prepared by the above method is completely exposed to the outside of the body, and is easily scratched or damaged. Therefore, it can affect the performance of the antenna radiator and the communication performance of the electronic device. In addition, when the housing is mounted on the body, there is a gap between the housing and the antenna radiator. Therefore, it is not conducive to reducing the volume of the electronic device. SUMMARY OF THE INVENTION [0005] In view of the above, it is necessary to provide an electronic device housing integrally formed with an antenna radiator. 099100845 Form No. A0I01 Page 3 of 15 0992001702-0 201125463 [0006] In addition, it is also necessary to provide a method for manufacturing the above electronic device housing. [0007] An electronic device housing includes a first body And a second body, the material of the first body comprises a laser activator, the first body is activated by laser and electroplated or electrolessly plated to form an antenna radiator, and the second body is formed on the first body The antenna radiator is covered and covered, and the antenna radiator includes terminals exposed at least partially outside the first body and the second body. [0008] A method for manufacturing an electronic device housing, comprising the steps of: [0009] providing a first molding die and a second molding die, the first molding die having a primary molding cavity, the second molding The mold has a secondary molding cavity; [0010] molding a plastic containing a laser activator into the first molding cavity to form a first body of the electronic device housing; [0011] laser activating the surface of the first body [0012] metallizing the surface of the activated first body to form an antenna radiator; [0013] molding plastic into the overmolded cavity to form a second body, the second body and the The first body combines and covers the antenna body portion. [0014] Compared with the prior art, the antenna radiator of the electronic device casing of the present invention is formed in the housing of the electronic device by two injection molding, and the electronic device housing can protect the antenna radiator from being prevented. The antenna radiator is marked 099100845 Form No. A0101 Page 4 / Total 15 Page 0992001702-0 201125463 Injury or damage, ensuring the communication performance of the electronic device. In addition, the antenna radiator is formed in the electronic housing by the LDS technology, so that there is no need to consider the flaw between the housing and the antenna H, which can reduce the volume of the electronic device. The electronic device housing 10 of the preferred embodiment of the present invention includes a first body 11 , a second body 13 , and a first body 11 and a body 13 . The antenna between the antennas 15 and the at least one end of the antenna light body ◎ 15 extends to the outside of the first body 11 and the second body 13. [0016] The first body 11 is made by injection molding. The first body of the injection molded body 11 may be a mixture of a thermoplastic plastic, an organic filler, and a laser activator. The thermoplastic plastic may be neodymium ethylene, polyethylene terephthalate s 曰 'acrylonitrile-stupid ethylene-butadiene copolymer (ABS), polycarbonate (PC), polyimine, liquid crystal polymerization One or more of polyether phthalimide, polyphenylene sulfide, polyfluorene, polystyrene, ethylene glycol modified polyester, and polypropylene polymer. The thermoplastic body of the first body u 较佳 of the preferred embodiment of the invention is preferably a mixture of acrylonitrile-styrene-butadiene copolymer and polycarbonate or polycarbonate. The organic filler is preferably a citric acid and/or a citric acid derivative. The laser activatable material can be a non-conductive spinel-based high order oxide such as a copper-containing spinel or the like. In the mixture of the injection molded first body 11, wherein the percentage of the thermoplastic plastic can be between 65-75%, the percentage of the organic filler can be between 22-28%, and the non-conductive is based on the tip. The percentage of the higher order oxide of the spar can be between 3 and 7%. The non-conductive spinel-based high-order oxide can be activated by laser to precipitate a metal crystal nucleus and cover the surface of the first body crucible. 099100845 Form No. A0101 Page 5 of 15 0992001702-0 201125463 [0017] The antenna radiator 15 is a plating layer formed on a preselected surface of the first body 11. The plating layer includes an electroplated copper layer, an electroplated nickel layer, and an electroplated gold layer sequentially formed on the preselected surface. The electroplated copper layer functions mainly as an antenna; the electroplated nickel layer is a protective layer for preventing the electroplated copper layer from being oxidized; and the electroplated gold layer has a good conductivity to ensure the performance of the antenna radiator 15. The antenna radiator 15 can be laser-activated by a laser direct structuring (LDS) method to pre-select the surface of the first body 11 to make the pre-selected region non-conductive based on the spinel-based high-order oxide. The metal crystal nucleus is deposited on the surface and then electroplated to the preselected region. [0018] The second body 13 is made by injection molding. The material of the injection molded second body 13 is made of a plastic material such as polyethylene, polyethylene terephthalate, acrylonitrile-styrene-butadiene copolymer, polycarbonate, polyimine, liquid crystal polymerization. One or more of polyether phthalimide, polyphenylene sulfide, polyfluorene, polystyrene, ethylene glycol modified polyester, and polypropylene polymer. The second body 13 of the preferred embodiment of the invention is preferably a mixture of a acrylonitrile-styrene-butadiene copolymer and a polycarbonate. The melting temperature of the material of the second body 13 is lower than the melting temperature of the material of the first body 11. [0019] The method for fabricating the electronic device housing 10 of the preferred embodiment of the present invention includes the following steps: [0020] providing a first molding die and a second molding die, the first molding die having Forming a cavity, the second molding die has a secondary molding cavity; [0021] Please refer to FIG. 3 and FIG. 4 together, and molding into the primary molding cavity can include 099100845 Form No. A0101 Page 6 / Total 15 pages 0992001702-0 201125463
[0022] [0023] ❹ 鐳射活化物之塑膠以形成電子裝置殼體之第一本體11。 所述可鐳射活化物可為不導電之基於尖晶石之高階氧化 物，如含銅尖晶石。所述塑膠可為聚氯乙烯、聚對苯二 甲酸乙二醇酯、丙烯睛-苯乙烯-丁二烯共聚合物（ABS)、 聚碳酸酯（PC)、聚醯亞胺、液晶聚合物、聚醚醯亞胺、 聚苯硫、聚颯、聚苯乙烯、乙二醇改性聚酯及聚丙烯聚 合物中之一種或多種。本發明較佳實施例之第一本體11 優選丙烯睛-苯乙烯-丁二烯共聚合物與聚碳酸酯之混合 物或聚碳酸酯。 於第一本體11之表面預選一任意之區域，並使用鐳射照 射該預選之區域，使該區域之不導電之基於尖晶石之高 階氧化物之金屬離子析出表面，而使該預設區域活化成 為導體。I 將第一本體11被活化之預選區域金屬化制得天線輻射體 15。所述金屬化之方法可採用電鍍或化學鍍等。由於第 一本體11未被鐳射活化之區域為不導電體，故電鍍時僅 於被活化之預選區域上可電鍍上金屬層，而制得所述天 線輻射體15。電鍍時可先電鍍一銅層，然後電鍍一鎳層 。為保證天線輻射體15之性能，可於鎳層上再電鍍一金 層0 [0024] 再將第一本體11及形成於第一本體11之天線輻射體15放 置於二次成型型腔中，並向所述二次成型型腔中注塑塑 膠形成第二本體13，該第二本體13結合於第一本體11之 一側並將天線輻射體15部分覆蓋，使得天線輻射體15之 至少一端151由第一本體11及第二本體13之間延伸而形成 099100845 表單編號A0101 第7頁/共15頁 0992001702-0 201125463 一端子以連接其他電子元件。注塑成型第二本體13之塑 膠可選自可塑材料如聚氣乙烯、聚對苯二甲酸乙二醇酯 、丙烯睛-苯乙烯-丁二烯共聚合物、聚碳酸酯、聚醯亞 胺、液晶聚合物、聚醚醯亞胺、聚苯硫、聚颯、聚苯乙 烯、乙二醇改性聚酯及聚丙烯聚合物中之一種或多種。 本發明較佳實施例之第二本體13優選丙烯睛-笨乙烯-丁 二烯共聚合物與聚碳酸酯之混合物。所述第二本體13材 料之熔融溫度低於第一本體11材料之熔融溫度。 [0025] 本發明所述之電子裝置殼體10可應用於無線通訊產品如 筆記本電腦、手機等產品中。 [0026] 本發明較佳實施方式之電子裝置殼體1 0之製作方法將天 線輻射體15藉由兩次注塑成型而形成於電子裝置之殼體 中，該電子裝置殼體10可將天線輻射體15進行保護，防 止天線輻射體15被劃傷或損壞，保證電子裝置之通訊性 能。另，該天線輻射體15藉由LDS技術形成於電子裝置殼 體10内，故無須考慮殼體與天線輻射體15之間存在間隙 之問題，可減小電子裝置之體積。 [0027] 另外，本領域技術人員還可於前述公開之範圍及精神内 做其他形式及細節上之各種修改、添加及替換。當然， 該等依據本發明精神所做之各種修改、添加及替換等變 化，均應包含於本發明所要求保護之範圍之内。 【圖式簡單說明】 [0028] 圖1係本發明較佳實施方式電子裝置殼體之立體示意圖。 [0029] 圖2係圖1中電子裝置殼體之局部分解示意圖。 099100845 表單編號A0101 第8頁/共15頁 0992001702-0 201125463 [0030] 圖3係圖1中電子裝置殼體之天線輻射體形成於第一本體 上之立體示意圖。 [0031] 圖4係沿圖1中IV-1V方向之局部剖視圖。 【主要元件符號說明】 [0032] 殼體：10 [0033] 第一本體：11 [0034] 第二本體：13 ^ [0035] 天線輻射體：15 [0036]端子：151 ❹ 099100845 表單編號A0101 第9頁/共15頁 0992001702-0[0023] [0023] The plastic of the laser activator forms the first body 11 of the electronics housing. The laser activatable material can be a non-conductive, spinel-based high-order oxide such as a copper-containing spinel. The plastic may be polyvinyl chloride, polyethylene terephthalate, acrylonitrile-styrene-butadiene copolymer (ABS), polycarbonate (PC), polyimine, liquid crystal polymer One or more of polyetherimide, polyphenylene sulfide, polyfluorene, polystyrene, ethylene glycol modified polyester, and polypropylene polymer. The first body 11 of the preferred embodiment of the invention is preferably a mixture of acrylonitrile-styrene-butadiene copolymer and polycarbonate or polycarbonate. Preselecting an arbitrary region on the surface of the first body 11 and irradiating the preselected region with laser light to cause the non-conductive spinel-based high-order oxide metal ions to precipitate on the surface, thereby activating the predetermined region Become a conductor. I. The antenna body 15 is obtained by metallizing the pre-selected region in which the first body 11 is activated. The metallization method may employ electroplating or electroless plating or the like. Since the region where the first body 11 is not activated by the laser is a non-conducting body, the metal radiator can be plated only on the activated preselected region during electroplating to produce the antenna radiator 15. When plating, a copper layer is first plated and then a nickel layer is plated. In order to ensure the performance of the antenna radiator 15, a gold layer may be electroplated on the nickel layer. [0024] The first body 11 and the antenna radiator 15 formed on the first body 11 are placed in the secondary molding cavity. Forming a second body 13 into the overmolded cavity, the second body 13 is coupled to one side of the first body 11 and partially covers the antenna radiator 15 such that at least one end of the antenna radiator 15 is 151. Formed by the first body 11 and the second body 13 to form 099100845 Form No. A0101 Page 7 / Total 15 Page 0992001702-0 201125463 One terminal to connect other electronic components. The plastic injection molded second body 13 may be selected from the group consisting of plastic materials such as polyethylene, polyethylene terephthalate, acrylonitrile-styrene-butadiene copolymer, polycarbonate, polyimine, One or more of a liquid crystal polymer, a polyether phthalimide, a polyphenylene sulfide, a polyfluorene, a polystyrene, an ethylene glycol modified polyester, and a polypropylene polymer. The second body 13 of the preferred embodiment of the invention is preferably a mixture of a acrylonitrile-styrene ethylene-butadiene copolymer and a polycarbonate. The melting temperature of the material of the second body 13 is lower than the melting temperature of the material of the first body 11. [0025] The electronic device housing 10 of the present invention can be applied to products of wireless communication products such as notebook computers, mobile phones, and the like. The manufacturing method of the electronic device housing 10 of the preferred embodiment of the present invention forms the antenna radiator 15 in a housing of the electronic device by two injection molding, and the electronic device housing 10 can radiate the antenna. The body 15 is protected to prevent the antenna radiator 15 from being scratched or damaged, and to ensure the communication performance of the electronic device. Further, the antenna radiator 15 is formed in the electronic device casing 10 by the LDS technique, so that it is not necessary to consider the problem of the gap between the casing and the antenna radiator 15, and the volume of the electronic device can be reduced. [0027] In addition, various modifications, additions and substitutions in other forms and details may be made by those skilled in the art. It is a matter of course that various modifications, additions and substitutions made in accordance with the spirit of the invention are included in the scope of the invention as claimed. BRIEF DESCRIPTION OF THE DRAWINGS [0028] FIG. 1 is a perspective view of a housing of an electronic device according to a preferred embodiment of the present invention. 2 is a partial exploded view of the electronic device housing of FIG. 1. 099100845 Form No. A0101 Page 8 of 15 0992001702-0 201125463 [0030] FIG. 3 is a perspective view showing the antenna radiator of the electronic device housing of FIG. 1 formed on the first body. 4 is a partial cross-sectional view taken along line IV-1V of FIG. 1. [Main component symbol description] [0032] Housing: 10 [0033] First body: 11 [0034] Second body: 13 ^ [0035] Antenna radiator: 15 [0036] Terminal: 151 ❹ 099100845 Form No. A0101 9 pages / total 15 pages 0992001702-0