201106442 六、發明說明： 【發明所屬之技術領域】 本發明係關於一種吸盤裝置之設計，特別是關於一種能吸附 保持半導體晶圓等導體或半導體，並能吸附保持液晶面板用的玻 璃板與觸控面板用的玻璃板、塑膠板等絕緣體之靜電吸盤組裝裝 置。 # 【先前技術】 於使用半導體晶圓來製造半導體積體電路時，或製造使用了 玻璃基板、薄膜等絕緣性基板之液晶面板時，為了將被吸附體吸 p付並保持於縱部位’係使關械财法來運作之麵夾盤或是 真空夾盤等。然而，機械夾盤或是真空缝存在有難以將被吸附 體均勻的保持於預定位置、無法在真空中使財問題。為了解決 上述所提到的問題’因此，近年來係使用能解決這些問題的靜電 •夾盤裝置。 靜電夾皿裳置的主要部分為成為内部電極之導電性支撐構 件，以及覆蓋導電性支撐構件之電介質材料，而能吸附被吸附體。 對靜電夾盤裝置⑽内部電極施加電壓，藉此於被吸_與支擇 構件之間產生電位差，而於電介f層之間生靜電性的吸附力。如 此’被吸附體會被導電性支撑構件大致平坦地支撐。 中華民國專利公開號第2008326〇4號專利案中提出一種靜電 夾盤裝置。該靜電夾錄置的目的之—係提供—種於絕緣性有機 201106442 薄膜上層豐陶而藉此提升對物理性外力的承受力，且具有良好 的耐電^特性以及良好的吸附力之靜電夾盤裝置 ，本發明的另一 的系提i、種於絕緣性有機薄膜層疊有用以吸附被吸附體的陶 免層之靜1夾錄置，其巾，前述陶錢的吸附面的表面粗輪度 Ra為7. Oy m以下。 然而，上述所提到之靜電夹盤裝置，將喊層疊於有機薄膜 雖;、河以強化對於物理性外力的承受力以及具有良好的耐電 [特! 生及吸附性’但是以現有的技術而言，喊有著加工不易以 及成本較高之問題。因此，如何财喊較佳之吸附力，又能夠 降低靜電夹錄置的製造成本，成為—待解決之問題。 由此可見’ S知的靜電夾錄置所触之問題及不足，實非 一良善之設計者’而亟待加以改良。 本案毛月人|^於上述靜電夾盤裝置所衍生的各項問題及不 、° “力以改良創新’並經多年苦心孤f旨潛^研究後，終於 成功研發完縣件靜钱舰裝裝置。 【發明内容】 —種靜電吸盤組裝裝置，藉由本創 ’以產生較佳之吸附力。 本發明之一目的即是提供 作所提供之靜電吸盤組裝裴置 靜泰2肚述胸目的之靜電域組«置，包括-基板、-且：絕緣層’及-保護膜。基板具有一頂面及一底面， 土 〃有複數個貝孔由頂面貫通至底面，靜電線路經由曝 201106442 光顯衫、钱刻固於基板之頂面，絕緣層經由黏著劑固設於靜 包線路上方，保護膜貼附於絕緣層之上；靜電線路具有對應於基 板之貝孔之導線連接孔，用以使導線經由貫孔連接於導線連接 孔並將電力經由導線導通至靜電線路，使通電之後之靜電線路 與待吸附體之間產生電位差’並藉由靜電線路與待吸附體之間之 電位差’使形成於靜電線路上方之絕緣層產生靜電吸附力，而將 待吸附體予以吸附。 經由本發明所採狀技術手段，由於本發明係藉由靜電線路 通電之後使職層產生靜電吸附力，ii經由形成於絕緣層上方之 保護膜將待吸附體予以吸附。藉此，不但簡化了習用之靜電失盤 之結構，縮短了製造過程帽花費之時間。而且，由於本發明: 用高介電係數之絕緣材料取代了習用的陶曼層，不但保留了陶竞 層所擁有的良好的吸附力，而且由於絕緣層之製造技術較為單 純，製作過程較為料，而且製造f用也比喊便宜許S。藉此， 不但解決了習用技術中’陶竟層加工不易之問題，而且，也曰大幅 降低了製造過程中所耗費之成本，有利於大量生產。 田 【實施方式】 及f審查委Λ方便瞭解本發明之其他特_容與優點， ㈣達蚊贿能触祕現，轉本發合_，詳細說 請同時參_-®至第三圖 第-圖係顯示本發明靜電吸盤 201106442 ’、且裝4置之77#示,I、® ’第二圖係顯示本發明靜電吸盤組裝裝置 之結合示賴，第三_、顯示本發明之靜電吸盤組錄置之底視 圖。如圖所示，本發日贈電吸盤組裝裝置⑽包括—基板丨、一靜 電線路2、一絕緣層3，及一保護膜4。 基板1具有-頂面11及一底面12，且基板丄兩側分別具有一 貫孔13a、13b ’貫孔13a、13b由基板i之頂面u貫通至基板工 之底面12。其令，基板i係為玻璃纖維或是電木材質以pcB製程 鲁 之方式製造而成，保護膜4係以塑膠材質所製成。 靜電線路2固設於基板丨之· u，且靜電線路2兩側分別 具有-導線連接孔21a、21b，二導線連接孔叫、训分別對應於 基板1兩側之貫孔13a、13b。接著將絕緣層3以熱壓貼合之_ 結合於靜電線路2上方，並且將保護膜4貼附於絕緣層3上方x。 其中，靜電線路2係由複數個電極所組成，而且靜電線路2係以 曝光、顯影或蝕刻之方式固設於基板1。 “ 在本實施例巾，層3是藉由轉紐之崎舰 定於靜電線路2。其中，由於黏著劑有著便宜，以及取得容易 點。因此’綱職有.物_嶋^本^ 之較佳實施_已’當然也可以藉由綁喊是魏 ： 層3固設於靜電線路2。 ^ x : 參閱第四圖’其侧示本發明之剖面圖。如圖所干， 線如、5b經由基板1之貫孔版、_接於靜電線路2 = 連接孔L並將電力經由導線5a、5b_靜 201106442 使得通電之後之靜電線路2與待吸附體6之間產生電位差。此時， 形成於靜電線路2表面之絕緣體3則因為靜電線路2與待吸附體6 之間电位差的關係而產生靜電吸附力。藉此，則本發明之靜電吸 盤組裳裳置100可以大致平坦地將待吸附體6予以吸附。本發明 之靜電吸盤組裝裝置除了能吸附保持料體晶圓等導體辭 導體之外’也可以適用於觸控面板。 在本發明之較佳實施例中，由於本發明係使用靜電吸附的原 _理將待吸附體6予以吸附，解決了傳統技術中，在真空組合機内， 因為無法使用負壓來固定待吸附體之問題。 而且，由於本發明係使用高介電係數之絕緣材料來取代習用 的陶究層’因此，不但具有與陶錢相同之良好之吸附力，而且 解決了制技射，喊層加工不易之問題。再者，由於製造技 術較為單純’製作過程㈣科，*且製造f用也_舰宜許 多，大幅降低了製造過程中所耗費之成本，有利於大量生產。 上列詳細卿係崎本發明之—可行實關之具體說明，惟 該實施例並非用以限制本發明之專利範圍，凡未脫離本發明技藝 精神所為之等效實施或變更，均應包含於本案之專利範圍中。 …综上所述，杨不但在技術獅上確屬創新，並能較習用物 如增進上衫項功效，應已充分符合新酿及進步性之法定發明 專利要件纽{巾請’騎貴局核准本件發明專利申請 案’以勵發明’至感德便。 201106442 【圖式簡單說明】 第一圖係顯示本發明靜電吸盤組裝裝置之分離示意圖。 第二圖係顯示本發明靜電吸盤組裝裝置之結合示意圖。 第三圖係顯示本發明靜電吸盤組裝裝置之底視圖。 第四圖係顯示本發明靜電吸盤組裝裝置較佳實施例之示意圖。 【主要元件符號說明】 • 100...靜電吸盤組裝裝置 1.. .基板 11.. .頂面 12.. .底面 13a、13b...貫孔 2.. .靜電線路 21a、21b...導線連接孔 • 3...絕緣層 4.. .保護膜 5a、5b...導線 6.. .待吸附體201106442 VI. Description of the Invention: [Technical Field] The present invention relates to a design of a chuck device, and more particularly to a glass plate and a contact for adsorbing and holding a semiconductor wafer or the like, and capable of adsorbing and holding a liquid crystal panel Electrostatic chuck assembly device for insulators such as glass plates and plastic plates for control panels. [Previous technique] When a semiconductor integrated circuit is manufactured using a semiconductor wafer, or when a liquid crystal panel using an insulating substrate such as a glass substrate or a thin film is manufactured, in order to absorb and hold the object to be adsorbed in the vertical portion A chuck or vacuum chuck that allows the operation of the machine to operate. However, in the case of a mechanical chuck or a vacuum slit, it is difficult to uniformly hold the object to be adsorbed at a predetermined position, and it is impossible to cause a problem in a vacuum. In order to solve the above-mentioned problems, therefore, in recent years, an electrostatic chuck device capable of solving these problems has been used. The main part of the electrostatic chuck is a conductive support member that becomes an internal electrode, and a dielectric material that covers the conductive support member, and can adsorb the adsorbed body. A voltage is applied to the internal electrodes of the electrostatic chuck device (10), whereby a potential difference is generated between the attracted and the selective members, and an electrostatic adsorption force is generated between the dielectric layers f. Thus, the adsorbed body is supported substantially flat by the conductive support member. An electrostatic chuck device is proposed in the Patent Publication No. 2008326〇4 of the Republic of China. The purpose of the electrostatic chuck recording is to provide an electrostatic chuck with an excellent resistance to electrical forces and a good adsorption force, which is applied to the upper layer of insulating organic 201106442 film to enhance the physical external force. The apparatus, another aspect of the present invention, is used for laminating an insulating organic film to absorb the static layer of the ceramic layer of the adsorbed body, and the towel has a rough surface of the surface of the adsorption surface of the pottery money. Ra is below 7. Oy m. However, the above-mentioned electrostatic chuck device will be laminated on an organic film; the river is used to strengthen the resistance to physical external forces and has good electric resistance [speciality and adsorption] but with existing technology. Words, shouting has the problem of not being easy to process and costly. Therefore, how to spur a better adsorption force and reduce the manufacturing cost of electrostatic chuck recording becomes a problem to be solved. From this, it can be seen that the problems and deficiencies touched by the S-known electrostatic chucks are not a good designer's and need to be improved. In this case, Maoyue people | ^ in the above-mentioned electrostatic chuck device derived from the problems and not, ° "force to improve innovation" and after many years of painstaking research, finally successfully developed the county piece of money [Invention] A type of electrostatic chuck assembly device is used to generate a better adsorption force by the present invention. It is an object of the present invention to provide an electrostatic chuck assembly provided by the static electricity of the static body of the Jingtai 2 The domain group «sets, includes - substrate, - and: insulating layer' and - protective film. The substrate has a top surface and a bottom surface, the soil has a plurality of shell holes extending from the top surface to the bottom surface, and the electrostatic circuit is exposed through the exposure 201106442 The shirt and the money are fixed on the top surface of the substrate, the insulating layer is fixed on the static envelope line via the adhesive, and the protective film is attached on the insulating layer; the electrostatic circuit has a wire connection hole corresponding to the hole of the substrate, Connecting the wire to the wire connection hole via the through hole and conducting electric power to the static circuit via the wire, so that a potential difference is generated between the static circuit and the object to be adsorbed after the power is applied, and between the static electricity line and the object to be adsorbed The potential difference generates an electrostatic adsorption force on the insulating layer formed above the electrostatic circuit, and adsorbs the body to be adsorbed. According to the technical means of the present invention, since the present invention electrostatically adsorbs the working layer after being energized by the electrostatic circuit The force ii adsorbs the body to be adsorbed through the protective film formed over the insulating layer, thereby simplifying the structure of the conventional electrostatic disk loss and shortening the time taken for the manufacturing process cap. Moreover, since the present invention: The dielectric material of the dielectric coefficient replaces the conventional Tauman layer, which not only retains the good adsorption power possessed by the Tao Jing layer, but also because the manufacturing technology of the insulating layer is relatively simple, the production process is relatively expected, and the manufacturing f is also used. It is cheaper to make S. This not only solves the problem that the ceramic tile processing is not easy in the conventional technology, but also greatly reduces the cost in the manufacturing process and is beneficial to mass production. Field [implementation] and f review Euphemistically, it is convenient to understand other special features and advantages of the present invention. (4) Dust mosquitoes can be secreted and transferred to the present _, please refer to _-® to The three-figure diagram shows the electrostatic chuck 200106442' of the present invention, and the 77 of the apparatus is shown, and the second diagram shows the combination of the electrostatic chuck assembly apparatus of the present invention, and the third embodiment shows the present invention. The bottom view of the electrostatic chuck group is recorded. As shown in the figure, the present invention provides a power chuck assembly device (10) including a substrate, an electrostatic circuit 2, an insulating layer 3, and a protective film 4. The substrate 1 has a top The surface 11 and the bottom surface 12 have a uniform hole 13a, 13b on both sides of the substrate. The through holes 13a and 13b pass through the top surface u of the substrate i to the bottom surface 12 of the substrate. The substrate i is made of fiberglass or The electric wood is manufactured by the method of pcB process, and the protective film 4 is made of plastic material. The electrostatic circuit 2 is fixed on the substrate u u, and the two sides of the static circuit 2 have a wire connection hole 21a 21b, the two wire connection holes are called, and the training corresponds to the through holes 13a, 13b on both sides of the substrate 1. Next, the insulating layer 3 is bonded to the electrostatic wiring 2 by heat-pressing, and the protective film 4 is attached over the insulating layer 3. The electrostatic circuit 2 is composed of a plurality of electrodes, and the electrostatic circuit 2 is fixed to the substrate 1 by exposure, development or etching. "In the embodiment of the towel, layer 3 is set on the static circuit 2 by the switch of the Nagasaki. Among them, because the adhesive is cheap, and easy to obtain. Therefore, the 'employment has the object _ 嶋 ^ this ^ Good implementation _ already 'of course can also be slammed by Wei: Layer 3 is fixed on the static circuit 2. ^ x : Refer to the fourth figure' side view of the cross-sectional view of the invention. As shown in the figure, line, 5b Via the via stencil of the substrate 1, _ is connected to the static circuit 2 = the connection hole L, and the electric power is passed through the wires 5a, 5b_ static 201106442 so that a potential difference is generated between the static circuit 2 after the energization and the body 6 to be adsorbed. The insulator 3 on the surface of the electrostatic circuit 2 generates an electrostatic adsorption force due to the potential difference between the electrostatic circuit 2 and the body 6 to be adsorbed. Thus, the electrostatic chuck group 100 of the present invention can be substantially flat to be adsorbed. The body 6 is adsorbed. The electrostatic chuck assembly device of the present invention can be applied to a touch panel in addition to being able to adsorb and hold conductor conductors such as a material wafer. In a preferred embodiment of the present invention, the present invention is used. The original adsorption of electrostatic adsorption will be adsorbed 6 Adsorption, which solves the problem in the conventional technology, in the vacuum combination machine, because the negative pressure cannot be used to fix the object to be adsorbed. Moreover, since the present invention uses a high dielectric constant insulating material to replace the conventional ceramic layer' Therefore, not only has the same good adsorption power as the pottery money, but also solves the problem that the technical shooting and the shouting layer are not easy to process. Moreover, since the manufacturing technology is relatively simple, the production process (four) section, * and the manufacture of f is also used. It is preferable to reduce the cost of the manufacturing process and to facilitate the mass production. The above detailed description of the invention is not limited to the scope of the patent of the present invention. Equivalent implementations or changes that do not depart from the spirit of the invention should be included in the scope of the patent of the present invention. In summary, Yang is not only innovative in the technical lion, but also can be used in the past. The efficacy of the item should be fully in line with the new brewing and progressive statutory invention patents. The new article {to invite you to approve the invention patent application 'to invent the invention' 201106442 [Simplified description of the drawings] The first figure shows the separation diagram of the electrostatic chuck assembly device of the present invention. The second figure shows the combination of the electrostatic chuck assembly device of the present invention. The third figure shows the electrostatic chuck assembly device of the present invention. The bottom view is a schematic view showing a preferred embodiment of the electrostatic chuck assembly device of the present invention. [Main component symbol description] • 100... electrostatic chuck assembly device 1.. substrate 11.. top surface 12. .. bottom surface 13a, 13b...through hole 2... electrostatic line 21a, 21b... wire connection hole • 3... insulation layer 4.. protective film 5a, 5b... wire 6... Adsorbed body