201033529 '六、發明說明： 【發明所屬之技術領域】 本發明係涉及一種半導體照明裝置，尤係關於 一種發光二極體燈具及其所採用的光引擎。 【先前技術】 人們由於長期過度依賴石化燃料，除造成能源 短缺及石油價格高漲而牽綷經濟發展，更使全球二 〇 氧化碳與有害氣體的排放濃度日益增加，導致地球 暖化所引起的氣候反常、生態環境的破壞、以及對 人類生存的危害日益顯現，為永續經營人類賴以生 存的地球生態環境，必須同時解決能源危機與環境 污染問題，開發新能源及再生能源是推動節約能源 及高效率使用能源最重要的策略，而傳統照明所消 耗的能源極為可觀，發展照明節能將是最重要的新 能源科技，而半導體照明採用高功率高亮度的發光 ® 二極體（LED)為光源，該新光源以其高發光效率、節 能、長壽、環保（不含汞）、啟動快、抗震、指向性 等優點，具有廣泛取代傳統照明光源的潛力。 LED由於將輸入電能的80%〜90%轉變成為熱 量，只有10%〜20%轉化為光能，且由於LED晶片面 積小發熱密度高，因此發展LED照明的關鍵必須先 解決散熱問題；優良的LED燈散熱系統可在同等輸 入功率下得到較低的工作溫度，延長LED的使用壽 4 201033529 #r 命’或在同樣的溫度限制範圍0，增加輸入功率或 晶片密度，從而增加LED ,登的亮度；結點溫度 (Junction temperature)是衡4 LED燈散熱性能的重 要，術指標’由於散熱不良導致的結點溫度升高， 將嚴重影響到發光波長、光強、光效和使用壽命。 ^應用高功率高亮度LED在照明的新光源上，必 須配合高效率的散熱機構以儘量降低LED的結點溫 參 度，才能發揮上述諸多優點，否則照明裝置的發光 壳度、使用壽命將大打折扣，影響所及將使該照明 裝置的節能效果不彰，並直接衝擊該照明裝置的可 靠度，引發嚴重的光衰甚至使照明裝置失效。 習知半導體照明裝置嘗試將光源發光時釋出的 熱量藉由增加散熱面積來達成，惟，在有限的照明 裝置容許空間内，如何將該熱量快速而均勻的傳輸 藝到所述散熱面積上，以及如何將傳輸到所述散熱面 積上的該熱量快速移除，成為降低led光源結點溫 度的重要’因此’提供一種輕巧、符合長期穩 定、無須外加動力，且可隨光源的發熱溫度變化自 動調節移熱能力，並可在任何方位使用時均能將光 源的熱量快速散發的自發式移熱裝置，成為半導體 照明產業的挑戰。 【發明内容】 有馨於此’有必要提供一種具有高散熱效率之 5 201033529 全方位發光二極體燈具，並提供一種該發光二極體 燈具所採用的光引擎。 一種發光二極體燈具，包括一光學部、一電氣 部及一散熱部。該光學部包括至少一發光二極體光 • 源及一出光通道，用以提供所需的照明亮度與發光 特性及對發光二極體光源保護；該電氣部包括一護 罩及一電路板’用以提供發光二極體光源所需要之 ❹ 驅動電源、控制電路及電源管理；該散熱部包括一 §史於電氣部的護罩與光學部之間的熱交換迴路裝 置。該熱交換迴路裝置包括一散熱器、一吸熱板、 一筒狀的管件、一第一蓋板及一環形的第二蓋板， 該散熱器包括一筒狀的散熱基座及呈放射狀分佈於 該散熱基座之外周面的複數鰭片，該吸熱板密封地 設於散熱基座靠近光學部的一端部，所述發光二極 體光源設於吸熱板朝向光學部的一外表面上，該管 ® 件設於散熱基座内並與散熱基座之内周面間隔一距 離，該第一蓋板密封地設於管件靠近光學部的一端 部並與吸熱板間隔一距離，該環形的第二蓋板設於 散熱基座及管件靠近護罩的一端部並與該散熱基座 及管件雄、封接合’由所述散熱基座、吸熱板、管件、 弟一蓋板及苐一蓋板合圍形成一密閉的第一腔體， 並於管件内形成一朝向護罩開口的第二腔體，該第 一腔體之内侧壁面設有多孔性的毛細結構，所述毛 細結構内填充有工作流體。 6 201033529 一種光引擎，包括至少一發光二極體光源及熱 交換迴路裝置。該熱交換迴路裝置包括一散熱器、 一吸熱板、一筒狀的管件、一第一蓋板及一環形的 第二蓋板，該散熱器包括一筒狀的散熱基座及呈放 * 射狀分佈於該散熱基座之外周面的複數鰭片，該吸 熱板密封地設於散熱基座的底端，所述發光二極體 光源設於吸熱板的一外表面上，該管件設於散熱基 參 座内並與散熱基座之内周面間隔一距離，該第一蓋 板密封地設於管件的頂端並與吸熱板間隔一距離， 該環形的第二蓋板設於散熱基座及管件的頂端並與 該散熱基座及管件密封接合，由所述散熱基座、吸 熱板、管件、第一蓋板及第二蓋板合圍形成一密閉 的第一腔體，並於管件内形成一朝向護罩開口的第 二腔體’該第一腔體之内側壁面設有多孔性的毛細 結構，所述毛細結構内填充有工作流體。 G 本發明具有如下優點： 提供一種長期穩定、無須外加動力，且可隨發 光一極體光源的溫度變化而自發調整散熱能力的高 效率發光二極體燈具，藉由迴流到蒸發部的高次冷 度冷凝液，將發光二極體光源的熱量快速導離，確 保發光二極體燈具發揮高光效、長壽命、穩定出光 之功效。 提供一種高散熱效率的發光二極體燈具，藉由 201033529 交換迴路裝置中以相變化的潛熱交換及液 款 了自土式的高效率散熱循環，並 '通：輸入發光二極體光源之高、低功率變化而自 動調即第-腔體中的相變化程度，確保光引擎發 全方位的解熱功能。 ❹201033529 'VI. Description of the Invention: TECHNICAL FIELD OF THE INVENTION The present invention relates to a semiconductor lighting device, and more particularly to a light emitting diode lamp and a light engine employed therefor. [Prior Art] Due to long-term excessive dependence on fossil fuels, in addition to causing energy shortages and high oil prices, the economic development is hindered, and the global concentration of carbon dioxide and harmful gases is increasing, resulting in the climate caused by global warming. Abnormality, destruction of the ecological environment, and harm to human survival are increasingly manifested. To sustain the operation of the earth's ecological environment on which human beings depend, it is necessary to solve both the energy crisis and environmental pollution. The development of new and renewable energy is to promote energy conservation and high. Efficiency is the most important strategy for using energy, while traditional lighting consumes a lot of energy. Developing lighting energy is the most important new energy technology, while semiconductor lighting uses high-power, high-brightness luminescence® diodes (LEDs) as the light source. The new light source has the potential to widely replace traditional illumination sources due to its high luminous efficiency, energy saving, longevity, environmental protection (without mercury), fast start-up, seismic resistance, and directivity. Since LED converts 80%~90% of input power into heat, only 10%~20% is converted into light energy, and since the LED chip area is small and the heat density is high, the key to developing LED lighting must first solve the heat dissipation problem; The LED lamp cooling system can obtain a lower operating temperature at the same input power, extending the life of the LED. 4, 201033529 #r life' or in the same temperature limit range 0, increase the input power or wafer density, thereby increasing the LED, boarding Brightness; Junction temperature is an important factor in the heat dissipation performance of the LED 4 lamp. The increase in junction temperature due to poor heat dissipation will seriously affect the wavelength, intensity, efficacy and service life of the LED. ^Application of high-power high-brightness LEDs on the new light source of illumination, must cooperate with high-efficiency heat dissipation mechanism to minimize the junction temperature of the LED, in order to exert the above advantages, otherwise the illumination device's luminous shell and service life will be large. The discount will affect the energy saving effect of the lighting device and directly impact the reliability of the lighting device, causing severe light decay or even invalidating the lighting device. Conventional semiconductor lighting devices attempt to achieve the heat released by the light source by increasing the heat dissipation area, but how to transfer the heat to the heat dissipation area quickly and uniformly within a limited space of the illumination device. And how to quickly remove the heat transferred to the heat dissipating area becomes an important factor for reducing the junction temperature of the LED light source. Therefore, it provides a light, long-term stable, no external power, and can automatically change with the heating temperature of the light source. The spontaneous heat transfer device that can adjust the heat transfer capability and can quickly dissipate the heat of the light source in any orientation becomes a challenge for the semiconductor lighting industry. SUMMARY OF THE INVENTION It is necessary to provide a 201033529 omnidirectional light-emitting diode lamp with high heat dissipation efficiency, and to provide a light engine for the light-emitting diode lamp. A light-emitting diode lamp includes an optical portion, an electrical portion and a heat dissipating portion. The optical portion includes at least one light emitting diode source and a light exit channel for providing desired illumination brightness and light emitting characteristics and protection for the light emitting diode light source; the electrical portion includes a shield and a circuit board The ❹ driving power supply, the control circuit and the power management required for providing the illuminating diode light source; the heat dissipating portion includes a heat exchange circuit device between the shroud and the optical portion of the electric department. The heat exchange circuit device includes a heat sink, a heat absorbing plate, a tubular tube member, a first cover plate and an annular second cover plate. The heat sink includes a cylindrical heat dissipation base and is radially distributed. a plurality of fins on a peripheral surface of the heat dissipation base, the heat absorption plate is sealingly disposed at an end of the heat dissipation base adjacent to the optical portion, and the light emitting diode light source is disposed on an outer surface of the heat absorption plate facing the optical portion. The tube member is disposed in the heat dissipation base and spaced apart from the inner circumferential surface of the heat dissipation base. The first cover plate is sealingly disposed at an end of the tube member near the optical portion and spaced apart from the heat absorption plate by a distance. The second cover plate is disposed at one end of the heat dissipation base and the pipe member near the shield and is coupled to the heat dissipation base and the pipe member. The heat dissipation base, the heat absorption plate, the pipe member, the brother cover and the cover are covered by the cover plate. Forming a sealed first cavity, and forming a second cavity facing the opening of the shield in the tube member, the inner wall surface of the first cavity is provided with a porous capillary structure, and the capillary structure is filled with Working fluid. 6 201033529 A light engine comprising at least one light emitting diode source and a heat exchange circuit device. The heat exchange circuit device includes a heat sink, a heat absorbing plate, a tubular tube member, a first cover plate and an annular second cover plate. The heat sink includes a cylindrical heat dissipation base and is mounted a plurality of fins distributed on a peripheral surface of the heat dissipation base, the heat absorption plate is sealingly disposed at a bottom end of the heat dissipation base, and the light emitting diode light source is disposed on an outer surface of the heat absorption plate, wherein the tube is disposed on the outer surface of the heat absorption plate The first base plate is sealingly disposed at a top end of the pipe member and spaced apart from the heat absorbing plate at a distance from the heat sink base. The annular second cover plate is disposed on the heat dissipation base. And the top end of the pipe member is sealingly engaged with the heat dissipation base and the pipe member, and the heat dissipation base, the heat absorbing plate, the pipe member, the first cover plate and the second cover plate are enclosed to form a sealed first cavity body, and is disposed in the pipe member Forming a second cavity toward the opening of the shroud. The inner side wall surface of the first cavity is provided with a porous capillary structure filled with a working fluid. G The invention has the following advantages: providing a high-efficiency light-emitting diode lamp with long-term stability, no need for external power, and capable of spontaneously adjusting heat dissipation capability with temperature change of the light-emitting one-pole light source, by reflowing to the evaporation portion The cold condensate quickly guides the heat of the light-emitting diode light source to ensure the high luminous efficiency, long life and stable light output of the light-emitting diode lamp. Providing a high-efficiency light-emitting diode lamp with a phase change latent heat exchange and a liquid-based high-efficiency heat-dissipation cycle in the 201033529 switching circuit device, and the pass: the input light-emitting diode light source is high The low power changes and the automatic adjustment is the degree of phase change in the first cavity, ensuring that the light engine emits a full range of antipyretic functions. ❹
提供一種適用於不同方位使用的迴路冷卻發光 一極體燈具，藉由毛細結構的強大毛細力、散熱器 及管件的大吸熱與大散熱面積，確保該發光二極體 燈具在任何使用方位下均能提供足夠的冷凝液迴流 至蒸發部，有效防止乾化現象，使該發光二極體燈 具在啟用中悝常維持在高效率的穩定出光狀態。 提供一種高散熱效率的發光二極體燈具，藉由 持續在熱交換迴路裝置中以相變化的潛熱交換及液 相的顯熱交換，將發光二極體光源的熱量快速而均 勻的傳輸到散熱器及管件上，以及藉由直接接觸冷 凝機制及高次冷度冷卻液（highly subcooled coolant) 的高效率熱傳機制將傳輸到所述散熱面積上的熱量 快速移除。 【實施方式】 以下參照圖1至圖6，對本發明發光二極體燈具 予以進一步說明。 圖1係本發明發光二極體燈具100第一實施例 之組裝剖面示意圖，圖2係圖1所示發光二極體燈 201033529 具100中光引擎21之放大圖，圖3係圖2所示光引 擎21之立體分解圖。該發光二極體燈具1〇〇主要包 括一光學部10、一散熱部20及一電氣部30。 光學部10係設置於散熱部2〇前方，包括一發 光二極體光源11及一出光通道12。該發光二極體 光源11為一體成型件，包括一導熱基板ηι以及設 於該導熱基板111上的至少一發光體112與複數電 ❹ 極（圖未示）’其中所述發光體112係由至少一發光 一極體晶片經透明封裝所形成。該發光二極體光源 U與散熱部20中一吸熱板24的一吸熱面241之間 的緊密熱接觸，可先在發光二極體光源11與吸熱面 之間塗抹一層熱界面材料（TIM)，再將已套裝電絕緣 塾片的複數螺絲（圖未示）分別穿過發光二極體光源 11上的複數固定孔（圖未示），以便鎖固於該吸熱板 24之吸熱面241上所設對應螺孔（圖未示）達成，亦 ® 可藉由迴焊方式將發光二極體光源n直接黏貼 (SMT)於該吸熱板24之吸熱面241上達成，以使發 光二極體光源11之發熱面與散熱部2〇之吸熱板24 的吸熱面241緊密熱接觸。該發光二極體光源1：1的 發光可藉電線114電性連接發光二極體光源η之電 極與電氣部30中的一電路板31以及藉由電線311 電性連接該電路板31與外部電源達成。 出光通道12包括至少一光杯ι21及設於該光杯 201033529 121内的一導光罩122，其中該光杯121為向外擴散 的錐面以導引該發光二極體光源Π向外射出光 線，該光杯121底部設有供該發光二極體光源11凸 伸至該光杯121内的通孔123，導光罩122為包括 至少一光學鏡片124的罩蓋，以提供發光二極體燈 具100所需的照明分佈、發光特性及對發光二極體 光源11保護的功能。上述導光罩122中的光學鏡片 124亦可在封裝過程中直接與該發光二極體光源u 一體成型，以避免二次光學造成的光損耗。 在實際應用時，上述發光二極體光源11亦可由 複數分離的發光體組合而成，此時出光通道12中的 光杯121及導光罩122可以是對應於該複數分離的 發光體分開設置，亦可以只用一個光杯121及導光 罩122的配置。 電氣部30係設置於散熱部20後方，包括電路 板31、一護罩32及設於該護罩32頂端的一燈頭 33。該電路板31設於護罩32内並與發光二極體光 源11的電極及與外部電源電連接，所述外部電源除 可為電池或電瓶等直流電源外，亦可透過電源轉換 器將父流市電轉換為適合該發光二極體光源11的 直流電源，本實施例僅以燈頭33與市電連接的方式 說明’以搭配該電路板31提供該發光二極體光源 11之驅動電源及發光二極體燈具1 〇〇之電源管理； 201033529Providing a circuit-cooled illuminating one-pole luminaire suitable for use in different orientations, ensuring that the illuminating diode lamp is in any use orientation by the strong capillary force of the capillary structure, the large heat absorption of the radiator and the tube and the large heat dissipation area. It can provide enough condensate to flow back to the evaporation part to effectively prevent the drying phenomenon, so that the light-emitting diode lamp is often maintained in a high-efficiency stable light-emitting state during the activation. Providing a light-emitting diode lamp with high heat dissipation efficiency, the heat of the light-emitting diode light source is quickly and uniformly transmitted to the heat dissipation by continuously changing the latent heat exchange and the sensible heat exchange of the liquid phase in the heat exchange circuit device. The heat transferred to the heat dissipating area is quickly removed by the high efficiency heat transfer mechanism by direct contact with the condensation mechanism and the highly subcooled coolant. [Embodiment] Hereinafter, a light-emitting diode lamp of the present invention will be further described with reference to Figs. 1 to 6 . 1 is a schematic cross-sectional view showing a first embodiment of a light-emitting diode lamp 100 of the present invention, and FIG. 2 is an enlarged view of the light-emitting diode lamp 201033529 shown in FIG. An exploded view of the light engine 21. The illuminating diode lamp 1 〇〇 mainly includes an optical portion 10, a heat dissipating portion 20, and an electric portion 30. The optical portion 10 is disposed in front of the heat dissipating portion 2, and includes a light emitting diode light source 11 and an light exiting channel 12. The light-emitting diode light source 11 is an integrally formed member, and includes a heat-conducting substrate ηι and at least one illuminant 112 and a plurality of electric illuminators (not shown) disposed on the heat-conducting substrate 111. At least one of the light emitting body wafers is formed by transparent packaging. The intimate thermal contact between the light emitting diode light source U and a heat absorbing surface 241 of a heat absorbing plate 24 in the heat dissipating portion 20 may first apply a thermal interface material (TIM) between the light emitting diode light source 11 and the heat absorbing surface. Then, the plurality of screws (not shown) that have been provided with the electrically insulating cymbals are respectively passed through a plurality of fixing holes (not shown) on the light-emitting diode light source 11 so as to be locked on the heat absorbing surface 241 of the heat absorbing plate 24. The corresponding screw hole (not shown) is achieved, and the light-emitting diode light source n can be directly adhered (SMT) to the heat absorbing surface 241 of the heat absorbing plate 24 by reflow soldering to make the light-emitting diode The heat generating surface of the light source 11 is in close thermal contact with the heat absorbing surface 241 of the heat absorbing plate 24 of the heat radiating portion 2 . The light emitting diode 1:1 light source can be electrically connected to the electrode of the light emitting diode light source η and a circuit board 31 of the electrical part 30 by the electric wire 114, and electrically connected to the circuit board 31 and the external part by the electric wire 311. The power is reached. The light exiting channel 12 includes at least one light cup ι21 and a light guide cover 122 disposed in the light cup 201033529 121, wherein the light cup 121 is an outwardly diffusing tapered surface to guide the light emitting diode light source to be emitted outward In the light, the bottom of the light cup 121 is provided with a through hole 123 for the light emitting diode 11 to protrude into the light cup 121. The light guide cover 122 is a cover including at least one optical lens 124 to provide a light emitting diode. The illumination distribution, the illuminating characteristics, and the function of protecting the illuminating diode light source 11 required for the body luminaire 100. The optical lens 124 in the light guide cover 122 can also be integrally formed with the light emitting diode light source u during the packaging process to avoid optical loss caused by secondary optics. In a practical application, the light-emitting diode light source 11 may be combined by a plurality of separate light-emitting bodies. At this time, the light cup 121 and the light guide cover 122 in the light-emitting channel 12 may be separately arranged corresponding to the plurality of separated light-emitting bodies. It is also possible to use only one configuration of the light cup 121 and the light guide cover 122. The electrical unit 30 is disposed behind the heat dissipating portion 20 and includes a circuit board 31, a shroud 32, and a base 33 provided at the top end of the shroud 32. The circuit board 31 is disposed in the shield 32 and electrically connected to the electrodes of the LED light source 11 and to an external power source. The external power source may be a DC power source such as a battery or a battery, or may be a parent through a power converter. The current source is converted into a DC power source suitable for the light-emitting diode light source 11. In this embodiment, only the lamp head 33 is connected to the commercial power source, and the driving power supply and the light-emitting diode of the light-emitting diode light source 11 are provided in conjunction with the circuit board 31. Power management for polar lamps 1 2010; 201033529
該護罩32係罩蓋該電路板31的—環狀的殼體，該 A罩32底部鎖固有—底座34，該底座34上設有連 通電氣部30與散熱部2〇的複數通孔341，該護罩 32内壁有複數^位座奶以便與電路板上所 設對應的定位柱312接合以固定該電路板31 ;該護 罩32頂部之壁面上設有複數具較大開口的氣孔 322 ’以供氣流進出電氣部3〇，從而將電路板產 生的熱量一併散出；另外，該護罩32上還設置有一 圍設於所述氣孔322⑽塵i 35，以防止外部的灰 塵進入電氣部30之護罩32内。 散熱部20包括設於電氣部3〇之護罩32與光學 部10之間的-熱交換迴路裝置22，並由發光二極 體光源11與該熱交換迴路裝置22組成一光引擎 21。該熱交換迴路裝置22包括一散熱器23、一吸 熱板24…管件25、-第-蓋板26及—環形的第 二蓋板27。 由於本發明所述散熱器23的形狀可以隨燈具的 設計形狀而有所不同，並達到相同的散熱功效，因 此以下僅以圓形筒體為例予以說明。 該散熱器23由導熱性佳的材質製成，包括一圓 筒狀的散熱基座231及呈放射狀分佈於該散熱基座 231之外周面的複數籍片232，該吸熱板為由導 熱性佳的材質製成的一圓形的板體，所述吸埶板Μ 11 201033529 — 密封地設於散熱基座231之底部（即靠近光學部1〇 的一端部），該吸熱板24的外表面為吸熱面241， 所述發光二極體光源n設於該吸熱面241上並與該 吸熱面241緊密熱接觸；該管件25呈圓筒狀，設於 散熱基座231内，該管件25之外周面251與散熱基 座231之内周面233間隔一距離，從而在两者之間 形成一環狀的第一空間281 ;第一蓋板26為由導熱 性佳的材質製成的一圓形板體，該第一蓋板26密封 地設於管件25之底部（即靠近光學部1〇的一端部） 並與吸熱板24間隔一距離，從而在第一蓋板26與 吸熱板24之間形成一第二空間282，該第二空間282 與第一空間281之底端連通；該第二蓋板27為由導 熱性佳的材質製成的一圓環形的板體，設於散熱基 座231及管件25之頂部（即靠近護罩32的一端部） 並將散熱基座231與管件25之間的第一空間281之 φ 頂端密封’從而由所述散熱基座231、吸熱板24、 管件25、第一蓋板26及第二蓋板27合圍形成一密 閉的第一腔體28 ’並於管件25内形成一朝向護罩 32開口的第二腔體252’所述第一腔體28包括位於 散熱基座231與管件25之間的第一空間281及位於 吸熱板24與第一蓋板26之間的第二空間282，該 第一腔體28内侧壁面鋪設有多孔性的毛細結構，並 於該毛細結構中填充有可隨發光二極體光源u的 溫度變化而產生不同沸騰程度的工作流體226。 12 201033529 該第一腔體28内於吸熱板24、第一蓋板26及 第二蓋板27之内表面分別鋪設有數層緊密排列的 金屬網，以構成多孔性的毛細結構221、222、223， 所述管件25之外周面251與散熱基座231之内周面 233上亦分別鋪設有數層緊密排列的金屬網，以構 成環狀的多孔性毛細結構224、225，該管件25之 外周面251上所設毛細結構224之頂端與底端分別 延伸至與第二蓋板27之内表面上所設毛細結構223 及第一蓋板26之内表面上所設毛細結構222相接， 該散熱基座231之内周面233上所設毛細結構225 之頂端與底端分別延伸至與第二蓋板27之内表面 上所設的毛細結構223及吸熱板24之内表面上所設 毛細結構221相接。第一腔體28内位於吸熱板24 與第一蓋板26之間的第二空間282被區隔為底部接 近發光二極體光源11並與毛細結構221相對應的一 φ 液相微流通道區2831、頂部與毛細結構222相對應 的一冷凝區284，以及位於該液相微流通道區2831 與冷凝區284之間的一蒸汽通道區2832，並由所述 液相微流通道區2831與蒸汽通道區2832構成一蒸 發部283 ;散熱基座231與管件25之間呈環狀的第 一空間281則被區隔為内側對應毛細結構224的一 環狀的冷凝區286、外侧對應毛細結構225的一環 狀的冷凝區287、位於該兩冷凝區286、287之間的 一環狀的低流阻蒸汽通道288、以及頂部對應毛細 13 201033529 結構223的一冷凝區289。 組裝該熱交換迴路裝置22時，首先，將圓筒狀 的管件25與圓環狀的第二蓋板27接合，使中心設 有一通孔271的第二蓋板27套設於管件25之頂端 外緣所設的一凹槽253内，將第一蓋板26之邊緣鑲 嵌於該管件25之底端内緣所設的一凹槽254内，以 封閉該管件25的底部，並在第一蓋板26與第二蓋 φ 板27的内表面及管件25之外周面251上鋪設毛細 結構222、223、224 ;然後在散熱基座231的内周 面233鋪設毛細結構225，將管件25與第一蓋板26 容置於散熱基座231内，並將圓環狀的第二蓋板27 的外緣鑲嵌於該散熱基座231之頂端内緣所設的一 卡槽234中；在吸熱板24之内表面鋪設毛細結構 221後，再將吸熱板24之邊緣鑲嵌於散熱基座231 之底端内緣所設的一卡槽235中（圖2所示），於第 ® —腔體28内填充工作流體226並密封，從而形成所 述的熱交換迴路裝置22,其中上述任何接合處均採 用完全密封以防止工作流體226的洩漏。 當啟動發光二極體燈具100時，蘊含於毛細結 構221中的液相工作流體226吸收由發光二極體光 源11傳至吸熱板24的熱量而迅速汽化膨脹升壓， 並釋出蒸發潛熱成為高熱焓的飽和蒸汽，隨即導引 所述蒸汽快速流經蒸發部283之低流阻的蒸汽通道 14 201033529 區2832，並朝周邊擴散至具較低壓的環狀蒸汽通道 288中，所述蒸汽通道288的周圍為佈設毛細結構 224、225、223的冷凝區286、287、289 ;當由蒸發 部283產生的飽和蒸汽流直接與較冷的冷凝區 286、287、289接觸時，觸發直接接觸冷凝（direct contact condensation)的高效率散熱機制，所述飽和 蒸汽在此過程中被冷凝成飽和溫度的液相工作流體 226而釋出蒸發潛熱，該液相工作流體226隨即被 吸入蒸汽通道288周邊的毛細結構223、224、225 中。進入毛細結構225内的冷凝液藉由與散熱基座 231的内周面233直接接觸，將該冷凝液的熱量傳 導至所述散熱基座231之外周面所設具有大散熱面 積的鰭片232，並藉由冷熱空氣在鰭片232間交互 更替的自然循環而將該熱量散至大氣以進一步降 溫；進入毛細結構224内的冷凝液藉由與管件25之 外周面251直接接觸，並藉由外界空氣與管件之内 周面255進行熱交換而將該冷凝液的熱量散至大 氣；進入毛細結構223内的冷凝液藉由與第二蓋板 27之内表面直接接觸，並藉由外界空氣與第二蓋板 27之外表面272進行熱交換而將該冷凝液的熱量散 至大氣；進入毛細結構222内的冷凝液藉由與第一 蓋板26之内表面直接接觸，並藉由外界空氣與第一 蓋板26之外表面261進行熱交換而將該冷凝液的熱 量散至大氣。另外，藉由毛細力及冷凝液自身的重 15 201033529 力使該冷凝液迴流至蒸發部283的毛細結構221， 從而避免蒸發部283的冷卻液體供應不足而導致乾 化現象，直接影響該熱交換迴路裝置22的移熱極限 容量。 該發光二極體燈具100中，藉由第一腔體28内 的相變化工作流體226與熱源及熱沉（heat sink)的大 面積接觸，不但大幅提升移熱與散熱容量，且由於 相變化工作流體226與所述大面積熱源及熱沉（heat sink)的直接接觸，達到均勻分擔熱負荷而大幅提升 移熱與散熱效率。 綜上所述，該發光二極體燈具100中，散熱部 20之熱交換迴路裝置22係為一高效率的散熱裝 置，藉由工作流體226持續在所述熱交換迴路裝置 22中以相變化的潛熱（latent heat)交換及液相的顯熱 (sensible heat)交換進行自發式的高效率熱交換循 環；為達此目的，除藉由工作流體226在蒸發部283 與冷凝區286、287、289的自發式相變化循環中， 液、汽分離且循單一方向傳熱外，並在第一腔體28 内的冷凝區286、287、289使冷凝液流經似海棉般 的所述毛細結構224、225、223，藉由其強大的毛 細力迅速將該冷凝液朝蒸發部283迴流，並在該冷 凝液的所述迴流過程中進行直接散熱降溫，使迴流 至蒸發部283的工作流體226形成一高次冷度的冷 16 201033529 卻液，以提升發光二極體光源11的冷卻效率；上述 藉由熱交換迴路裝置22中工作流體226的自發式熱 交換循環，確保持續以高散熱效率移除該發光二極 體光源11發光時所釋出的熱量。 在所述熱交換迴路裝置22之第一腔體28内填 充的工作流體226係採用具有低沸騰溫度（或易汽化） 及同蒸發潛熱的流體，例如酒精、冷珠劑、純水等， # 如將該迴路裝置23抽至適當的真空度可達到更佳 的相變化效果，使工作流體226在高或低的操作溫 度下均能產生不同程度的沸騰，從而該熱交換迴路 裝置22的工作流體226可隨發光二極體光源u的 溫度變化而自發性的產生對應的蒸汽量，藉由相變 化的蒸發潛熱父換達到尚效熱傳的功效，從而可縮 小散熱部20的尺寸及輕化發光二極體燈具1〇〇 ;在 所述熱交換迴路裝置22中提供高毛細力的毛細結 ® 構221、221、223、224、225，除金屬網外，亦可 採用粉沫燒結、金屬絲、微細溝槽等方式或上述方 式的組合；另外，所述散熱部20中，管件25及散 熱基座231之形狀並不局限於本實施所示之圓形筒 體’也可以為其他形狀，如矩形筒體或多邊形筒體， 所述吸熱板24、第一蓋板26及第二蓋板27之形狀 可根據管件25及散熱基座231之形狀進行變換。 所述發光二極體燈具100可在不同操作方位下 17 201033529 % 提供足夠的高次冷度之冷凝液迴流至蒸發部283, 尤其將該發光二極體燈具100朝上照射時，冷凝區 286、287、289的迴流方向與重力方向相反，藉由 本實施例所述蒸汽通道228周邊設置的毛細結構 224、225、223，可提供高毛細力的吸液功效，以克 服重力對迴流冷凝液的流阻，確保隨時提供蒸發部 283足夠的低溫液相工作流體226，以防止乾化現象 φ 的發生’從而可將該發光二極體燈具100的應用領 域拓展至需要隨著動態發光二極體光源11而自行 調變其散熱容量之應用，包括需要隨時變化功率的 輸出及需要隨時改變照射方向的狀況，例如：舞台 燈、情境燈、探照燈及動態的洗牆燈等，發揮該發 光二極體燈具100全方位的散熱功能。 圖4係本發明發光二極體燈具中光引擎21a另 一實施例之組裝剖面示意圖；本實施例之光引擎2la ❹ 與第一實施例中光引擎21的結構基本相同，主要區 別在於：本實施例中，第一腔體252内於管件25a 之内周面255上設有沿管件25a之轴向延伸的複數 鰭片256’第二蓋板27a之外表面272上亦設有複數 鰭片273，藉由所述鰭片256、273以增加散熱面積 達到強化蒸汽冷凝的散熱效果；另外，在與底板26 相對應的蒸汽通道區2832的中間區域内填滿緊實 排列的金屬網，以構成多孔性毛細結構227，藉由 所述毛細結構227將吸熱板24之内表面上所設毛細 18 201033529 l 結構221與底板26之内表面上所設毛細結構222相 連接，以增強冷凝液迴流到蒸發部283之毛細力， 達到發光二極體燈具在變動出光方向時提升冷凝液 迴流的抗重力能力，並使迴流至第一蓋板26所設毛 細結構222内的冷凝液順利送達吸熱板24，進一步 強化光引擎21a的散熱能力。 圖5係本發明發光二極體燈具100a第二實施例 φ 之組裝剖面示意圖；本實施例之發光二極體燈具 100a與第一實施例之發光二極體燈具100的主要區 別在於：該發光二極體燈具100a採用圖4中所示之 光引擎21a ;另外，該發光二極體燈具100a的散熱 部20a還包括設於熱交換迴路裝置22a與電氣部30a 之護罩32a之間的一風扇29,該風扇29包括一扇框 291及一扇輪292,該扇輪292可旋轉地安裝於扇框 291的一頂板293上，該頂板293上設有複數氣流 G 開口 294,扇框291與電氣部30a之底座34a之間設 有一筒狀的間隔件201，該間隔件201上設有複數 氣流開口 202作為風扇29運作時的進風或排風口， 所述底座34a上未設置通孔341，從而將散熱部20a 與電氣部30a相隔離，護罩32a之頂壁設有複數具 較小開口的氣孔322a以供氣流進出電氣部30a，從 而將電路板31所産生之熱量散發。發光二極體燈具 100a除可藉由冷熱空氣的自然對流散熱外，並於發 光二極體光源11的結點溫度超過設定值時由控制 19 201033529 ι 電路啟動風扇29以強化散熱能力；本實施例針對高 功率發光二極體光源11的散熱需求而使用風扇 29，並由氣流開口 202引入外界的冷卻氣流吹向鰭 片232、273、256來強化散熱能力。另外，該發光 二極體燈具l〇〇a亦可以採用圖2中所示光引擎21。 圖6係本發明發光二極體燈具100b第三實施例 之組裝剖面示意圖；本實施例與第一實施例的主要 φ 區別在於：本實施例中，電氣部30b的一電路板31b 設於管件25之第一腔體252内，並藉由電路板31b 上所設定位柱312b與管件25之内周面255上所設 定位座321b的結合將該電路板31b固定於管件25 之内周面255，因電路板31b未設於護罩32b内， 護罩32b相比於第一實施例中的護罩32具有一較短 的長度，從而使該發光二極體燈具100b的整體長度 縮短而更加輕巧。另外，該發光二極體燈具100b亦 ⑩ 可以採用圖4中所示光引擎21a。 由上述的實施方式已進一步清楚說明本發明的 技術特徵及達成之功效，包括： (1)本發明提供一種長期穩定、無須外加動 力，且可隨發光二極體光源的溫度變化而自發調整 散熱能力的高效率發光二極體燈具，藉由迴流到蒸 發部的高次冷度冷凝液，將發光二極體光源的熱量 快速導離，確保發光二極體燈具發揮高光效、長壽 20 201033529 \ 命、穩定出光之功效。 .()“本七明提供一種咼散熱效率的發光二極體 — 燈^ ’藉由持續在熱交換迴路I置中以相變化的潛 熱交換及液相的顯熱交換，進行自發式的高效率散 熱循環，並輯著輸人發光二極體光狀高、低功 率變化而自動5周節第一腔體中的相變化程度，確保 光引擎發揮全方位的解熱功能。 參 （3)本發明提供一種適用於不同方位使用的迴 路冷卻發光：極體燈具，藉由毛細結構的強大毛細 力、散熱器及管件的大吸熱與大散熱面積，確保該 發光一極體燈具在任何使用方位下均能提供足夠的 冷凝液迴流至蒸發部，有效防止乾化現象，使該發 光二極體燈具在啟用中恆常維持在高效率的穩定出 光狀態。 φ (4)本發明提供一種高散熱效率的發光二極體 燈具，藉由持續在熱交換迴路裝置中以相變化的潛 熱乂換及液相的顯熱交換，將發光二極體光源的熱 量快速而均勻的傳輸到散熱器及管件上，以及藉由 直接接觸冷凝機制及高次冷度冷卻液的高效率熱傳 機制將傳輸到所述散熱面積上的熱量快速移除。 綜上所述，本發明確已符合發明專利之要件， 遂依法提出專利申請。惟，以上所述者僅為本發明 之較佳實施例，自不能以此限制本案之申請專利範 21 201033529 圍。舉凡熟悉本案技藝之人士援依本發明之精神所 作之等效修飾或變化，皆應涵蓋於以下申請專利範 圍内。 【圖式簡單說明】 圖1係本發明發光二極體燈具第一實施例之組 裝剖面示意圖。 圖2係圖1所示發光二極體燈具中光引擎之放 大圖。 圖3係圖2所示光引擎之立體分解圖。 圖4係本發明發光二極體燈具中光引擎另一實 施例之組裝剖面示意圖。 圖5係本發明發光二極體燈具第二實施例之組 裝剖面示意圖。 圖6係本發明發光二極體燈具第三實施例之組 裝剖面示意圖。 φ 【主要元件符號說明】 光學部 10 導熱基板111 發光二極體燈具100、100a、100b 發光二極體光源11 發光體 112 114、311 出光通道12 121 導光罩 122 123 、 271 、 341 124 散熱部 20、20a 201 氣流開口 202、294 電線 光杯 通孔 光學鏡片 間隔件 22 201033529 熱交換迴路裝置22、22a 光引擎 21、21a 毛細結構 221 、222 、 223 、 224 ' 225 > 227 工作流體 226 散熱器 23 散熱基座 231 卡槽 234 、 235 縛片 232 ' 256 、 273 吸熱板 24 内周面 233 > 255 吸熱面 241 管件 25、25a 外周面 251 第二腔體 252 凹槽 253 、254 第一蓋板 26 外表面 261 、272 第二蓋板 27 、 27a 第一腔體 28 第一空間 281 第二空間 282 蒸發部 283 液相微流通道區 2831 蒸汽通道 288 蒸汽通道區 2832 冷凝區 284 、286 、 287 、 289 風扇 29 扇框 291 扇輪 292 頂板 293 電氣部 30、 30a 、 30b 電路板 31、 31b 定位柱 312、312b 護罩 32、 32a > 32b 定位座 321 、321b 氣孔 322 、 322a 燈頭 33 底座 34 、 34a 防塵蓋 35 23The cover 32 is an annular casing that covers the circuit board 31. The bottom of the A cover 32 is locked to the base 34. The base 34 is provided with a plurality of through holes 341 connecting the electrical portion 30 and the heat dissipation portion 2〇. The inner wall of the shield 32 has a plurality of sockets for engaging with the corresponding positioning posts 312 provided on the circuit board to fix the circuit board 31; the wall surface of the top of the shield 32 is provided with a plurality of air holes 322 having larger openings. 'In order to prevent the external dust from entering the electrical environment Inside the shroud 32 of the portion 30. The heat dissipating portion 20 includes a heat exchange circuit device 22 disposed between the shield 32 of the electric portion 3 and the optical portion 10, and the light emitting diode device 11 and the heat exchange circuit device 22 constitute a light engine 21. The heat exchange circuit unit 22 includes a heat sink 23, a heat absorbing plate 24, a tube member 25, a - cover plate 26, and a second annular cover plate 27. Since the shape of the heat sink 23 of the present invention may vary depending on the design shape of the luminaire and achieve the same heat dissipation effect, the following description will be made by taking only a circular cylinder as an example. The heat sink 23 is made of a material having good thermal conductivity, and includes a cylindrical heat dissipation base 231 and a plurality of pieces 232 radially distributed on the outer circumferential surface of the heat dissipation base 231. The heat dissipation plate has good thermal conductivity. a circular plate body made of the material, the suction plate Μ 11 201033529 - sealingly disposed at the bottom of the heat dissipation base 231 (ie, near the end of the optical portion 1), the outer surface of the heat absorbing plate 24 The heat absorbing surface 241 is disposed on the heat absorbing surface 241 and is in close thermal contact with the heat absorbing surface 241. The tube member 25 is cylindrical and disposed in the heat dissipation base 231. The tube member 25 is The outer peripheral surface 251 is spaced apart from the inner peripheral surface 233 of the heat dissipation base 231 by a distance therebetween to form an annular first space 281 therebetween; the first cover plate 26 is a circle made of a material having good thermal conductivity. The first cover plate 26 is sealingly disposed at the bottom of the tubular member 25 (ie, near the end of the optical portion 1) and spaced apart from the heat absorbing plate 24 so as to be at the first cover plate 26 and the heat absorbing plate 24 Forming a second space 282, the second space 282 is in communication with the bottom end of the first space 281; The second cover plate 27 is an annular plate body made of a material having good thermal conductivity, and is disposed on the top of the heat dissipation base 231 and the pipe member 25 (ie, near one end of the shield 32) and the heat dissipation base 231 and The φ top seal of the first space 281 between the tube members 25 is surrounded by the heat dissipation base 231, the heat absorbing plate 24, the tube member 25, the first cover plate 26 and the second cover plate 27 to form a sealed first cavity. 28' and forming a second cavity 252' facing the opening of the shield 32 in the tube member 25. The first cavity 28 includes a first space 281 between the heat dissipation base 231 and the tube member 25 and is located at the heat absorbing plate 24 a second space 282 between the first cover plates 26, the inner wall surface of the first cavity 28 is covered with a porous capillary structure, and the capillary structure is filled with a temperature change of the light-emitting diode light source u. Working fluid 226 of varying boiling degrees. 12 201033529 In the first cavity 28, a plurality of closely arranged metal meshes are respectively arranged on the inner surfaces of the heat absorbing plate 24, the first cover plate 26 and the second cover plate 27 to form a porous capillary structure 221, 222, 223 The outer peripheral surface 251 of the tubular member 25 and the inner peripheral surface 233 of the heat dissipation base 231 are also respectively provided with a plurality of closely arranged metal meshes to form annular porous capillary structures 224 and 225, and the outer peripheral surface of the tubular member 25 The top end and the bottom end of the capillary structure 224 disposed on the 251 respectively extend to the capillary structure 223 disposed on the inner surface of the second cover plate 27 and the capillary structure 222 disposed on the inner surface of the first cover plate 26, the heat dissipation The top end and the bottom end of the capillary structure 225 disposed on the inner peripheral surface 233 of the base 231 extend to the capillary structure 223 provided on the inner surface of the second cover plate 27 and the capillary structure provided on the inner surface of the heat absorbing plate 24, respectively. 221 is connected. The second space 282 in the first cavity 28 between the heat absorbing plate 24 and the first cover plate 26 is partitioned into a φ liquid phase microfluidic channel whose bottom is close to the light emitting diode light source 11 and corresponds to the capillary structure 221. a region 2831, a condensing zone 284 corresponding to the top of the capillary structure 222, and a vapor channel region 2832 between the liquid phase microfluidic channel region 2831 and the condensation zone 284, and the liquid phase microfluidic channel region 2831 Forming an evaporation portion 283 with the steam passage region 2832; the first space 281 having an annular shape between the heat dissipation base 231 and the pipe member 25 is partitioned into an annular condensation zone 286 corresponding to the inner corresponding capillary structure 224, and the outer corresponding capillary An annular condensation zone 287 of structure 225, an annular low flow resistance vapor passage 288 between the two condensation zones 286, 287, and a condensation zone 289 of the top corresponding capillary 13 201033529 structure 223. When the heat exchange circuit unit 22 is assembled, first, the cylindrical tube member 25 is joined to the annular second cover plate 27, and the second cover plate 27 having a through hole 271 in the center is sleeved on the top end of the tube member 25. In a recess 253 provided in the outer edge, the edge of the first cover plate 26 is embedded in a recess 254 provided at the inner edge of the bottom end of the tubular member 25 to close the bottom of the tubular member 25, and is first The capillary structure 222, 223, 224 is laid on the inner surface of the cover plate 26 and the second cover φ plate 27 and the outer circumferential surface 251 of the pipe member 25; then the capillary structure 225 is laid on the inner circumferential surface 233 of the heat dissipation base 231, and the pipe member 25 is The first cover plate 26 is received in the heat dissipation base 231, and the outer edge of the annular second cover plate 27 is embedded in a card slot 234 provided at the inner edge of the top end of the heat dissipation base 231; After the capillary structure 221 is disposed on the inner surface of the board 24, the edge of the heat absorbing board 24 is embedded in a card slot 235 provided in the inner edge of the bottom end of the heat dissipation base 231 (shown in FIG. 2). The working fluid 226 is filled and sealed to form the heat exchange circuit means 22, wherein any of the above joints are completely Seal to prevent leakage of the working fluid 226. When the illuminating diode lamp 100 is activated, the liquid phase working fluid 226 contained in the capillary structure 221 absorbs the heat transferred from the illuminating diode source 11 to the heat absorbing plate 24, rapidly vaporizes and expands the pressure, and releases the latent heat of evaporation. The hot turbulent saturated steam then directs the steam to rapidly flow through the low flow resistance steam passage 14 201033529 zone 2832 of the evaporation section 283 and diffuses toward the periphery into the lower pressure annular steam passage 288, the steam The periphery of the passage 288 is a condensation zone 286, 287, 289 in which the capillary structures 224, 225, 223 are disposed; when the saturated vapor flow generated by the evaporation portion 283 is in direct contact with the cooler condensation zones 286, 287, 289, direct contact is triggered. A high efficiency heat dissipation mechanism of direct contact condensation, which is condensed to a saturated temperature liquid phase working fluid 226 during this process to release latent heat of vaporization, which is then drawn into the periphery of the steam passage 288. In the capillary structure 223, 224, 225. The condensate entering the capillary structure 225 is in direct contact with the inner circumferential surface 233 of the heat dissipation base 231, and the heat of the condensate is conducted to the fins 232 having a large heat dissipation area on the outer circumferential surface of the heat dissipation base 231. And dissipating the heat to the atmosphere for further cooling by a natural circulation of hot and cold air alternating between the fins 232; the condensate entering the capillary structure 224 is in direct contact with the outer peripheral surface 251 of the tube member 25, and by The outside air exchanges heat with the inner peripheral surface 255 of the pipe member to dissipate the heat of the condensate to the atmosphere; the condensate entering the capillary structure 223 is in direct contact with the inner surface of the second cover plate 27, and is surrounded by the outside air. Heat exchange with the outer surface 272 of the second cover plate 27 to dissipate the heat of the condensate to the atmosphere; the condensate entering the capillary structure 222 is in direct contact with the inner surface of the first cover plate 26, and is externally The air exchanges heat with the outer surface 261 of the first cover plate 26 to dissipate the heat of the condensate to the atmosphere. In addition, the condensate is returned to the capillary structure 221 of the evaporation portion 283 by the capillary force and the weight of the condensate itself 15 201033529, thereby preventing the cooling liquid supply of the evaporation portion 283 from being insufficient to cause a drying phenomenon, directly affecting the heat exchange. The heat transfer limit capacity of the loop device 22. In the LED luminaire 100, the large-area contact between the phase change working fluid 226 in the first cavity 28 and the heat source and the heat sink not only greatly increases the heat transfer and heat dissipation capacity, but also changes due to phase change. The direct contact between the working fluid 226 and the large-area heat source and the heat sink achieves uniform sharing of heat load and greatly improves heat transfer and heat dissipation efficiency. In summary, in the LED device 100, the heat exchange circuit device 22 of the heat dissipating portion 20 is a highly efficient heat dissipating device, and the phase change is continuously performed in the heat exchange circuit device 22 by the working fluid 226. The latent heat exchange and the sensible heat exchange of the liquid phase perform a spontaneous high efficiency heat exchange cycle; for this purpose, in addition to the working fluid 226 in the evaporation section 283 and the condensation zone 286, 287, In the spontaneous phase change cycle of 289, the liquid and vapor are separated and heat is transferred in a single direction, and the condensation zone 286, 287, 289 in the first cavity 28 causes the condensate to flow through the sponge-like capillary. The structures 224, 225, and 223 rapidly return the condensate to the evaporation portion 283 by its strong capillary force, and perform direct heat dissipation and cooling during the reflow of the condensate to return the working fluid to the evaporation portion 283. 226 forms a high-cold cooling cold 16 201033529 liquid to improve the cooling efficiency of the light-emitting diode light source 11; the above-mentioned spontaneous heat exchange cycle of the working fluid 226 in the heat exchange circuit device 22 ensures continuous high heat dissipation effectiveness The heat released when the light-emitting diode light source 11 emits light is removed. The working fluid 226 filled in the first cavity 28 of the heat exchange circuit device 22 is a fluid having a low boiling temperature (or easy vaporization) and a latent heat of vaporization, such as alcohol, cold bead, pure water, etc. If the loop device 23 is pumped to a suitable degree of vacuum, a better phase change effect can be achieved, so that the working fluid 226 can produce different degrees of boiling at high or low operating temperatures, thereby working the heat exchange circuit device 22. The fluid 226 spontaneously generates a corresponding amount of steam according to the temperature change of the light-emitting diode light source u, and the effect of the heat transfer by the latent heat of vaporization of the phase change is achieved, thereby reducing the size and lightness of the heat radiating portion 20. a light-emitting diode lamp 1 is provided; a capillary structure 221, 221, 223, 224, 225 having a high capillary force is provided in the heat exchange circuit device 22, and in addition to the metal mesh, powder sintering may be used. a wire or a fine groove or the like, or a combination of the above; and the shape of the tube 25 and the heat dissipation base 231 in the heat dissipation portion 20 is not limited to the circular cylinder shown in the present embodiment. shape, The shape of the heat absorbing plate 24, the first cover plate 26, and the second cover plate 27 can be changed according to the shape of the tube member 25 and the heat dissipation base 231, such as a rectangular cylinder or a polygonal cylinder. The illuminating diode luminaire 100 can provide sufficient high-order condensate backflow to the evaporation portion 283 under different operating orientations, and the condensing zone 286 is illuminating, especially when the illuminating diode illuminator 100 is irradiated upward. The reflow direction of the 287, 289 is opposite to the direction of the gravity. The capillary structure 224, 225, 223 disposed around the steam passage 228 of the embodiment can provide a high capillary force liquid absorbing effect to overcome the gravity to the reflux condensate. The flow resistance ensures that the low-temperature liquid working fluid 226 of the evaporation portion 283 is provided at any time to prevent the occurrence of the drying phenomenon φ, thereby expanding the application field of the light-emitting diode lamp 100 to the need for the dynamic light-emitting diode The application of the light source 11 to adjust its heat dissipation capacity, including the need to change the power output at any time and the need to change the direction of the illumination at any time, such as: stage lights, situation lights, searchlights and dynamic wall washers, etc. The body lamp 100 has a full range of heat dissipation functions. 4 is a schematic cross-sectional view showing another embodiment of the light engine 21a in the light-emitting diode lamp of the present invention; the light engine 2la 本 of the embodiment is basically the same as the light engine 21 of the first embodiment, and the main difference is: In the embodiment, the inner surface 255 of the tubular member 25a is provided with a plurality of fins 256' extending along the axial direction of the tubular member 25a. The outer surface 272 of the second cover 27a is also provided with a plurality of fins. 273, the fins 256, 273 are used to increase the heat dissipation area to enhance the heat dissipation effect of the steam condensation; in addition, the intermediate portion of the vapor passage region 2832 corresponding to the bottom plate 26 is filled with the tightly arranged metal mesh to The porous capillary structure 227 is formed by the capillary structure 227 connecting the capillary 181 of the inner surface of the heat absorbing plate 24 to the capillary structure 222 disposed on the inner surface of the bottom plate 26 to enhance the condensate reflux. The capillary force to the evaporation portion 283 reaches the anti-gravity capability of the condensate returning when the light-emitting diode lamp changes the light-emitting direction, and the condensate returned to the capillary structure 222 of the first cover 26 is smoothly sent. The heat absorbing plate 24 is further provided to further enhance the heat dissipation capability of the light engine 21a. 5 is a schematic cross-sectional view showing a second embodiment of the light-emitting diode lamp 100a of the present invention; the main difference between the light-emitting diode lamp 100a of the present embodiment and the light-emitting diode lamp 100 of the first embodiment is that the light is emitted. The diode lamp 100a uses the light engine 21a shown in FIG. 4. In addition, the heat radiating portion 20a of the LED lamp 100a further includes a heat exchange circuit device 22a and a shroud 32a of the electric portion 30a. The fan 29 includes a fan frame 291 and a fan wheel 292. The fan wheel 292 is rotatably mounted on a top plate 293 of the fan frame 291. The top plate 293 is provided with a plurality of airflow openings 294, and a fan frame 291. A cylindrical spacer 201 is disposed between the base portion 34a of the electrical portion 30a. The spacer member 201 is provided with a plurality of airflow openings 202 as air inlets or exhaust openings when the fan 29 is operated. No through holes are formed in the base 34a. 341, the heat dissipating portion 20a is separated from the electric portion 30a, and the top wall of the shroud 32a is provided with a plurality of air holes 322a having small openings for the airflow to and from the electric portion 30a, thereby dissipating the heat generated by the circuit board 31. The light-emitting diode lamp 100a can be cooled by the natural convection of the hot and cold air, and the fan 29 is activated by the control 19 201033529 ι circuit to enhance the heat dissipation capability when the junction temperature of the light-emitting diode light source 11 exceeds the set value; For example, the fan 29 is used for the heat dissipation requirement of the high-power light-emitting diode light source 11, and the cooling airflow introduced into the outside by the airflow opening 202 is blown toward the fins 232, 273, and 256 to enhance the heat dissipation capability. In addition, the light-emitting diode lamp 10a can also adopt the light engine 21 shown in FIG. 6 is a schematic cross-sectional view showing the assembly of the third embodiment of the light-emitting diode lamp 100b of the present invention; the main φ of the first embodiment is different from that of the first embodiment: in the embodiment, a circuit board 31b of the electrical portion 30b is disposed on the pipe member. The circuit board 31b is fixed to the inner circumferential surface of the pipe member 25 by the combination of the position post 312b set on the circuit board 31b and the seat 321b set on the inner circumferential surface 255 of the pipe member 25 in the first cavity 252 of the second plate 252. 255, since the circuit board 31b is not disposed in the shield 32b, the shield 32b has a shorter length than the shield 32 in the first embodiment, thereby shortening the overall length of the light-emitting diode lamp 100b. More lightweight. In addition, the light-emitting diode lamp 100b can also adopt the light engine 21a shown in FIG. The technical features and the achieved effects of the present invention are further clarified by the above embodiments, including: (1) The present invention provides a long-term stability, no need for external power, and can spontaneously adjust heat dissipation according to temperature changes of the light-emitting diode light source. The high-efficiency light-emitting diode lamp with high capacity can quickly guide away the heat of the light-emitting diode light source by returning to the high-order cold condensate of the evaporation portion, ensuring that the light-emitting diode lamp exhibits high luminous efficiency and longevity. 20 201033529 Life, stable light effect. () "Ben Qiming provides a light-emitting diode with a heat-dissipating efficiency - the lamp ^' is spontaneously high by continuing the heat exchange circuit I with phase-changing latent heat exchange and liquid phase sensible heat exchange The efficiency heat dissipation cycle, and the degree of phase change in the first cavity of the 5-week section is automatically changed by the high-light and low-power change of the input LED, ensuring that the light engine can exert an all-round anti-heating function. The invention provides a circuit cooling illumination suitable for different orientations: a polar body lamp, which ensures the light-emitting one-pole lamp in any use orientation by the strong capillary force of the capillary structure, the large heat absorption of the radiator and the pipe fitting and the large heat dissipation area. Both can provide sufficient condensate to flow back to the evaporation portion to effectively prevent the drying phenomenon, so that the light-emitting diode lamp is constantly maintained in a high-efficiency stable light-emitting state during the activation. φ (4) The present invention provides a high heat dissipation efficiency. The light-emitting diode lamp rapidly and uniformly transmits the heat of the light-emitting diode light source by continuously changing the latent heat of the phase change and the sensible heat exchange of the liquid phase in the heat exchange circuit device. The heat transferred to the heat dissipating area is quickly removed to the heat sink and the pipe and the high efficiency heat transfer mechanism by direct contact with the condensing mechanism and the high-order cooling coolant. In summary, the present invention has indeed In accordance with the requirements of the invention patent, the patent application is filed according to law. However, the above description is only a preferred embodiment of the present invention, and it is not possible to limit the patent application scope of the case 21 201033529. Those who are familiar with the skill of the case The equivalent modifications or variations of the spirit of the present invention are intended to be included in the following claims. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic cross-sectional view showing the assembly of a first embodiment of a light-emitting diode lamp of the present invention. Figure 1 is an exploded perspective view of the light engine of the light-emitting diode lamp shown in Figure 1. Figure 3 is an exploded perspective view of the light engine shown in Figure 2. Figure 4 is an assembly section of another embodiment of the light engine in the light-emitting diode lamp of the present invention. Fig. 5 is a schematic cross-sectional view showing the second embodiment of the illuminating diode lamp of the present invention. Fig. 6 is a schematic cross-sectional view showing the third embodiment of the illuminating diode lamp of the present invention. φ [Description of main component symbols] Optical section 10 Thermally conductive substrate 111 Light-emitting diode lamp 100, 100a, 100b Light-emitting diode light source 11 Light-emitting body 112 114, 311 Light-emitting path 12 121 Light-shielding cover 122 123, 271, 341 124 Portion 20, 20a 201 Airflow opening 202, 294 Wire cup through hole optical lens spacer 22 201033529 Heat exchange circuit device 22, 22a Light engine 21, 21a Capillary structure 221, 222, 223, 224 '225 > 227 Working fluid 226 Radiator 23 heat sink base 231 card slot 234, 235 tab 232 '256, 273 heat sink 24 inner peripheral surface 233 > 255 heat sink surface 241 tube 25, 25a outer peripheral surface 251 second cavity 252 recess 253, 254 a cover plate 26 outer surface 261, 272 second cover plate 27, 27a first cavity 28 first space 281 second space 282 evaporation portion 283 liquid phase micro flow channel region 2831 steam passage 288 steam passage region 2832 condensation zone 284 286, 287, 289 Fan 29 Fan frame 291 Fan wheel 292 Top plate 293 Electrical part 30, 30a, 30b Circuit board 31, 31b Positioning post 312, 312b Shield 32, 32a & Gt 32b positioning seat 321 , 321b air hole 322 , 322a lamp holder 33 base 34 , 34a dust cover 35 23