201028635 六、發明說明： 【發明所屬之技術領域】 本發明涉及一種散熱裳置，特別涉及-種蒸發器 及應用該蒸發器之回路式熱管。 【先前技術】 ❹ ❹ —隨著中央處理器（CPU)等電子元件功率之不斷 提尚，散熱問題越來越受到人們之重視。回路式埶 r(1〇〇Pheatpipe)由於其高效之熱傳導性能而被; 為一種有效之傳熱元件應用於散熱領域中。 ，、先回路式熱f之毛細結構附著於回路式執管 之内管壁’並將蒸發腔與補償腔連成—體，當㈣ 式熱管工作時’位於蒸發腔之毛細結構吸收埶量， j腔之毛細結構上之熱量—部分被蒸發腔内之工 抓體吸收’而其餘部分熱量傳遞至位於補償腔内 之毛細結構上，使得補償腔内之卫作流體蒸發產 生與預定工作方向反向之壓力，降低回路式熱管之 差同時’補償腔之毛細結構表面生成大量 札，，该等氣泡影響補償腔内工作流體滲透率，造 成蒸發腔工作流體燒幹，產生斷流現象，以致於回 路式熱管失效。 【發明内容】 庫爾於此’有必要提供-種防止斷流之蒸發器及 ^用該蒸發器之回路式熱管。 3 201028635 一種蒸發器包括一中空殼體以及一具有一穿孔 * ⑼板’該隔板設置在該t空殼體内’並將該蒸發 • 器内部分隔形成—蒸發腔和-補償腔，該蒸發腔^ 設有毛細結構，該毛細結構具有—延伸部，該延 部穿過該隔板上之穿孔伸入到該補償腔中。 一種回路式熱管，包括—蒸發ϋ及-連接該Μ 器相對兩端組成一回路之管路，該回路内填充有工 參 作液體，該蒸發器包括一中空殼體，該中空殼體内 =置一隔板’該隔板將蒸發器内部分成蒸發腔和補 ♦腔，該蒸發腔 ^ ^ Δ4- J.Ur 一 “、、知胫円°又有毛細結構，該毛細結構穿過 隔板伸入補償腔内。 與習知技術相比，蒸發器之蒸發腔内之毛細結構 穿過隔板伸人補償腔内’使暴露在補償腔内之毛細 ΐ構之面積減少’從而減少了傳入補償腔内之熱 ❹ 1有效保證了回路式熱管之有效壓差，同時，減 二補该腔之毛細結構表面生成之氣泡，有效保證補 二腔内工作液體之滲透率，防止蒸發腔工作液體燒 t ’延長了本發明回路式熱管之使用壽命，同時， 提升了回路式熱管之工作效率。 【實施方式】 其二：：圖V本發明-較佳實施方式之回路式熱 =m ig、連接該蒸發器1G之相對兩端之 官路20及套設於管路20上之複數散熱鰭片30。該 4 201028635 管路2〇連接基於5|， m 10之相對兩端 ::圖2°:〜::)密封回路，路内填^ 所述管路20可由與工作液乍H可為水、酒精等。 士， 乍液體相谷之可撓性材料製 -發執雷m 蒸發器10之一端吸收201028635 VI. Description of the Invention: [Technical Field] The present invention relates to a heat dissipating skirt, and more particularly to an evaporator and a loop type heat pipe using the same. [Prior Art] ❹ ❹ With the continuous improvement of the power of electronic components such as the central processing unit (CPU), the heat dissipation problem has received more and more attention. The loop type ( r (1〇〇Pheatpipe) is used for its efficient heat transfer performance; it is an effective heat transfer element used in the field of heat dissipation. , the capillary structure of the first loop type heat f is attached to the inner tube wall of the loop type tube and connects the evaporation chamber and the compensation chamber into a body, and when the (four) type heat pipe works, the capillary structure located in the evaporation chamber absorbs the amount of enthalpy, The heat on the capillary structure of the j-cavity—partially absorbed by the workpiece in the evaporation chamber' and the rest of the heat is transferred to the capillary structure located in the compensation chamber, so that the evaporation of the fluid in the compensation chamber is opposite to the predetermined working direction. The pressure is reduced to reduce the difference between the loop heat pipes and the surface of the capillary structure of the compensation chamber generates a large number of slabs, which affect the permeability of the working fluid in the cavity, causing the working fluid of the evaporation chamber to dry and generate a flow interruption phenomenon, so that The loop heat pipe fails. SUMMARY OF THE INVENTION It is necessary to provide an evaporator for preventing shut-off and a loop type heat pipe using the same. 3 201028635 An evaporator comprising a hollow casing and a plate having a perforated * (9) plate disposed in the t-vacant casing and separating the interior of the evaporator - an evaporation chamber and a compensation chamber, The evaporation chamber is provided with a capillary structure having an extension extending through the perforations in the partition into the compensation chamber. A loop type heat pipe comprising: an evaporation crucible and a pipeline connecting the opposite ends of the crucible to form a loop, the loop is filled with a work piece as a liquid, and the evaporator comprises a hollow shell, the hollow shell Inner=Setting a partition plate' The partition plate divides the inside of the evaporator into an evaporation chamber and a buffer chamber. The evaporation chamber ^ ^ Δ4 - J.Ur has a capillary structure, and the capillary structure passes through The partition extends into the compensation chamber. Compared with the prior art, the capillary structure in the evaporation chamber of the evaporator passes through the partition and extends into the compensation chamber to reduce the area of the capillary structure exposed in the compensation chamber. The heat input into the compensation cavity 1 effectively ensures the effective pressure difference of the loop heat pipe, and at the same time, reduces the bubble generated on the surface of the capillary structure of the cavity, effectively ensuring the permeability of the working liquid in the cavity and preventing evaporation. The cavity working liquid burning t' prolongs the service life of the loop type heat pipe of the present invention, and at the same time, improves the working efficiency of the loop type heat pipe. [Embodiment] FIG. 2: FIG. V - The loop type heat of the preferred embodiment of the present invention m ig, connecting the evaporator 1 The official road 20 of the opposite ends of G and the plurality of heat dissipation fins 30 disposed on the pipeline 20. The 4 201028635 pipeline 2〇 connection is based on the opposite ends of 5|, m 10: Fig. 2°:~: :) Sealing circuit, filling in the road ^ The pipeline 20 can be made of water, alcohol, etc. with the working fluid 。H. ,, 乍 liquid phase valley flexible material system - hair lifting m evaporator 10 one end absorption
装發'，CPU產生之熱量，並使工作液體 H/、、乳沿官路2〇流出，經過散熱鰭片30冷卻， 將^冷卻為液體’液體由管路2〇流入蒸發器ι〇 ， 端’如此’回路式熱管完成了工作液體由蒸 以〜之過程。該等散熱鰭片30靠近蒸發器1〇 吸熱之一端，以冷卻蒸氣。在本實施例中，散埶鳍 片30所套設之部分管路2〇被壓扁。在其他實施例 中，散熱鰭片30所套設之部分管路2〇可以不被壓 扁。可以理解地，管路20上可以安裝其他散熱元件， 用來冷卻管路20内之蒸氣。 請一併參閱圖2和圖3，所述蒸發器1Q包括一 中空殼體11及一設置在該中空殼體u内之隔板 12，該隔板12將中空殼體内部分隔形成一蒸發 腔14及一補償腔16 ’蒸發腔14之内表面設置有毛 細結構18 ’該毛細結構18穿過該隔板12延伸入補 償腔16内。 所述殼體11為一圓柱狀結構，其包括一呈圓筒 形之圍壁120及由該圍壁120相對兩端垂直向内延 5 201028635 伸之二側壁110,該二側壁110分別設有一通孔以供 - 所述管路20穿設。該殼體11可由導熱性能良好之 . 金屬材料製成，如銅等。 所述隔板12上設置有一穿孔以供所述毛細結構 18穿過。該隔板12之周緣與所述殼體11之圍壁120 緊密結合。該隔板12垂直於所述殼體11之圍壁 120。在其他實施例中，該隔板12可以不垂直於所 • 述殼體11之圍壁120。在本實施例中，該隔板12之 穿孔開設於隔板之中心。在其他實施例中，該隔板 12之穿孔開設於該隔板12之其他位置。 所述蒸發腔14通過所述殼體11之一侧壁110 與所述管路20連通，所述補償腔16通過另一侧壁 110與該管路20連通。較佳地，該蒸發腔14之軸向 長度大於補償腔16之軸向長度。該蒸發腔14所在 之殼體11與上述發熱電子元件熱接觸。 所述毛細結構18為多孔狀結構，其可為燒結粉 末（sintered powder )、微細溝槽（fine grooves )、 編織網目（mesh )、纖維（fiber )或上述型式之複 合式毛細構造。該毛細結構18大致呈圓筒狀，包括 與所述隔板12貼設之一圓盤狀之基部180、從該基 部180之一側面周緣垂直延伸之一呈筒狀之週邊壁 部182及由該基部180另一侧面垂直延伸之一延伸 部184。該壁部182和基部180貼附於所述蒸發腔 6 201028635 14之内表面。該延伸部184穿過所述隔板12之穿孔 - 伸入所述補償腔16内，並浸入存儲於該補償腔16 _ 内之工作液體中。該延伸部184與補償腔16内表面 相隔設置。該基部180形成該毛細結構18之封閉 端，該壁部182靠近管路20之一端形成開放端，從 而在蒸發腔14中形成一蒸氣通道140。該蒸氣通道 140沿毛細結構18之軸向延伸，且與管路20連通。 該蒸氣通道140之橫截面積大於管路20之橫截面 ® 積，以便蒸發腔14内之工作液體蒸發後產生之蒸氣 進入管路20内。 可以理解地，所述蒸發器10之殼體11不限於圓 柱狀結構，例如，長方體結構亦適用。相應地，所 述隔板12之外部輪廓即周緣隨著蒸發器10之殼體 11之結構之改變而改變，只要保證隔板12之周緣與 殼體11之圍壁120緊密結合即可，達到防止存儲於 〇 補償腔16内之工作液體與所述毛細結構18之基部 180直接接觸之目的。當然，所述毛細結構18之基 部180和壁部182之外部輪廓也隨之改變，只要保 證該基部180和壁部182貼附於所述蒸發腔14之内 表面即可。 操作時，回路式熱管之蒸發腔14内工作液體從 發熱電子元件吸熱蒸發成蒸氣，產生之蒸氣彙聚於 蒸發腔14中之蒸氣通道140内，該等蒸氣在蒸發腔 7 201028635 14產生較大之蒸氣壓，使得蒸發腔14和補償腔16 . 產生有效壓差，該壓差促使蒸氣由蒸發腔14經管路 _ 20向補償腔16運動，在蒸氣通過管路20向補償腔 16運動過程中，蒸氣在散熱鰭片30所在之管路20 處被冷卻為液體，由於蒸發腔14内仍然源源不斷地 供應蒸氣，因此蒸發腔14和補償腔16之有效壓差 仍然存在，該壓差迫使被散熱鰭片30冷卻之液體繼 續向補償腔16運動，並存儲於補償腔16内，然後， 由伸入補償腔16内之毛細結構18之延伸部184吸 收工作液體，並通過基部180及壁部182進入蒸發 腔14内進行下一次迴圈。整個過程完成了發熱電子 元件與散熱鰭片30間之熱量交換。通過這種方式， 工作液體反復蒸發、冷凝，不斷地吸熱、放熱，從 而達到良好之熱交換之目的。 與習知技術相比，蒸發器10之殼體11内之隔板 G 12有效阻擋毛細結構18之基部180與存儲於補償腔 16内之工作液體直接接觸，減少了毛細結構18與工 作液體接觸面積，即減少了毛細結構18之反向蒸發 面積，降低了補償腔16内之蒸氣壓力，有效保證了 回路式熱管之有效壓差。另外，毛細結構18通過延 伸部184浸入補償腔16内之工作液體中，傳遞到延 伸部184之熱量能夠被迅速冷卻，減少了延伸部184 表面生成之氣泡，有效保證補償腔16内工作液體之 滲透率，使延伸部184吸收補償腔16内之工作液體 8 201028635 到基部180和壁部182，以防止蒸發腔14工作液體 燒幹，造成斷流，延長了本發明回路式熱管之使用 壽命，同時，提升了回路式熱管之工作效率。 综上所述，本發明確已符合發明專利之要件，遂 依法提出㈣申請。惟’以上所述者僅為本發明之 較佳實施方式’自不能以此限制本案之申請專利範 圍。舉凡m案技藝之人士援依本發明之精神所The heat generated by the CPU is generated, and the working liquid H/, the milk flows out along the official road 2, and is cooled by the heat-dissipating fins 30, and is cooled to a liquid. The liquid flows from the pipeline 2 into the evaporator ι. The end of the 'so-loop-type heat pipe completes the process of working the liquid by steaming ~. The heat dissipation fins 30 are adjacent to one end of the heat absorption of the evaporator 1 to cool the vapor. In the present embodiment, part of the line 2 of the enthalpy fin 30 is squashed. In other embodiments, a portion of the conduit 2 that the heat sink fin 30 is sleeved may not be flattened. It will be appreciated that other heat dissipating elements may be mounted on the line 20 for cooling the vapor within the line 20. Referring to FIG. 2 and FIG. 3 together, the evaporator 1Q includes a hollow casing 11 and a partition 12 disposed in the hollow casing u. The partition 12 separates the interior of the hollow casing. An evaporation chamber 14 and a compensation chamber 16 'the inner surface of the evaporation chamber 14 are provided with a capillary structure 18' through which the capillary structure 18 extends into the compensation chamber 16. The housing 11 is a cylindrical structure, and includes a cylindrical surrounding wall 120 and two side walls 110 extending perpendicularly from opposite ends of the surrounding wall 120. The two side walls 110 are respectively provided with a through hole. A hole is provided for the passage of the pipe 20. The housing 11 can be made of a metal material such as copper or the like which has good thermal conductivity. A perforation is provided in the partition 12 for the capillary structure 18 to pass through. The periphery of the partition 12 is tightly coupled to the surrounding wall 120 of the casing 11. The partition 12 is perpendicular to the surrounding wall 120 of the housing 11. In other embodiments, the partition 12 may not be perpendicular to the surrounding wall 120 of the housing 11. In this embodiment, the perforations of the partition 12 are formed in the center of the partition. In other embodiments, the perforations of the partition 12 are formed at other locations of the partition 12. The evaporation chamber 14 communicates with the line 20 through a side wall 110 of the housing 11, and the compensation chamber 16 communicates with the line 20 through another side wall 110. Preferably, the axial length of the evaporation chamber 14 is greater than the axial length of the compensation chamber 16. The housing 11 in which the evaporation chamber 14 is located is in thermal contact with the above-described heat-generating electronic component. The capillary structure 18 is a porous structure which may be a sintered powder, fine grooves, a mesh, a fiber, or a composite capillary structure of the above type. The capillary structure 18 has a substantially cylindrical shape, and includes a disk-shaped base portion 180 attached to the partition plate 12, and a cylindrical peripheral wall portion 182 extending perpendicularly from a side surface of one side of the base portion 180 and One side of the base 180 extends perpendicularly to one of the extensions 184. The wall portion 182 and the base portion 180 are attached to the inner surface of the evaporation chamber 6 201028635 14 . The extension 184 extends through the perforations of the partition 12 into the compensation chamber 16 and is immersed in the working fluid stored in the compensation chamber 16 _. The extension 184 is spaced apart from the inner surface of the compensation chamber 16. The base portion 180 forms a closed end of the capillary structure 18 which forms an open end adjacent one end of the conduit 20 to form a vapor passage 140 in the evaporation chamber 14. The vapor passage 140 extends in the axial direction of the capillary structure 18 and is in communication with the conduit 20. The cross-sectional area of the vapor passage 140 is greater than the cross-sectional area of the conduit 20 so that vapor generated by evaporation of the working fluid in the evaporation chamber 14 enters the conduit 20. It is to be understood that the casing 11 of the evaporator 10 is not limited to a cylindrical structure, and for example, a rectangular parallelepiped structure is also applicable. Correspondingly, the outer contour of the partition 12, that is, the circumference, changes with the structure of the casing 11 of the evaporator 10, as long as the peripheral edge of the partition 12 is tightly coupled with the surrounding wall 120 of the casing 11, The purpose of preventing direct contact of the working liquid stored in the crucible compensation chamber 16 with the base portion 180 of the capillary structure 18 is prevented. Of course, the outer contours of the base portion 180 and the wall portion 182 of the capillary structure 18 are also changed as long as the base portion 180 and the wall portion 182 are attached to the inner surface of the evaporation chamber 14. During operation, the working liquid in the evaporation chamber 14 of the loop-type heat pipe evaporates from the heat-generating electronic component to vapor, and the generated vapor converges in the vapor channel 140 in the evaporation chamber 14, which vapor is generated in the evaporation chamber 7 201028635 14 The vapor pressure causes the evaporation chamber 14 and the compensation chamber 16 to produce an effective pressure differential that causes vapor to move from the evaporation chamber 14 through the line -20 to the compensation chamber 16, as the vapor moves through the line 20 toward the compensation chamber 16. The vapor is cooled to a liquid at the line 20 where the heat sink fins 30 are located. Since the vapor is still continuously supplied in the evaporation chamber 14, the effective pressure difference between the evaporation chamber 14 and the compensation chamber 16 still exists, and the pressure difference forces the heat to be dissipated. The liquid cooled by the fins 30 continues to move toward the compensation chamber 16 and is stored in the compensation chamber 16, and then the working liquid is absorbed by the extension 184 of the capillary structure 18 extending into the compensation chamber 16 and passes through the base 180 and the wall portion 182. Enter the evaporation chamber 14 for the next loop. The entire process completes the heat exchange between the heat-generating electronic component and the heat sink fins 30. In this way, the working fluid is repeatedly evaporated, condensed, and continuously absorbs heat and exotherms, thereby achieving good heat exchange. The partition G 12 in the housing 11 of the evaporator 10 effectively blocks the base 180 of the capillary structure 18 from direct contact with the working liquid stored in the compensation chamber 16 as compared with the prior art, reducing the contact of the capillary structure 18 with the working fluid. The area, that is, the reverse evaporation area of the capillary structure 18 is reduced, and the vapor pressure in the compensation chamber 16 is reduced, thereby effectively ensuring the effective pressure difference of the loop type heat pipe. In addition, the capillary structure 18 is immersed in the working liquid in the compensation chamber 16 through the extending portion 184, and the heat transferred to the extending portion 184 can be rapidly cooled, reducing the bubble generated on the surface of the extending portion 184, and effectively ensuring the working liquid in the compensation chamber 16. The permeability causes the extension portion 184 to absorb the working liquid 8 201028635 in the compensation chamber 16 to the base portion 180 and the wall portion 182 to prevent the working liquid of the evaporation chamber 14 from being dried, causing a current interruption and prolonging the service life of the loop type heat pipe of the present invention. At the same time, the working efficiency of the loop heat pipe is improved. In summary, the present invention has indeed met the requirements of the invention patent, and the (4) application is filed according to law. However, the above description is only a preferred embodiment of the present invention, and the scope of the patent application of the present invention is not limited thereto. Those who are skilled in the m case will be assisted by the spirit of the invention.
作之等效修飾或變化，皆應涵蓋於以下中請專利範 圍内。 【圖式簡單說明】Equivalent modifications or changes shall be covered in the following patents. [Simple description of the map]
圖 圖 係本發明回路式熱管一較佳實施方式 之立 圖2係圖1中回路式熱管 圖3係圖1中回路式熱管 【主要元件符號說明】 之部分剖視圖。 工作原理之示意圖 蒸發器 10 側壁 110 隔板 12 蒸氣通道 140 毛細結構 18 壁部 182 管路 20 殼體 11 圍壁 120 蒸發腔 14 補償腔 16 基部 180 延伸部 184 散熱鰭片 30Fig. 2 is a circuit type heat pipe of Fig. 1. Fig. 3 is a partial cross-sectional view of the circuit type heat pipe of Fig. 1 [description of main components]. Schematic diagram of the working principle Evaporator 10 Side wall 110 Separator 12 Vapor channel 140 Capillary structure 18 Wall 182 Pipeline 20 Housing 11 Enclosure 120 Evaporation chamber 14 Compensation chamber 16 Base 180 Extension 184 Heat sink fins 30