TW201026812A - Antistatic high temperature-resistant polyimide tape - Google Patents

Abstract

This invention is related to an antistatic high temperature-resistant polyimide tape, containing: a polyimide substrate having two principle surfaces, an electroconductive layer that is coated on at least one principle surface of the aforementioned substrate and contains at least one electroconductive polymer, a siloxane priming coat applied on the aforementioned electroconductive layer, and a siloxane binding agent layer applied on the siloxane priming coat.

Description

201026812 VI. Description of the Invention: [Technical Field] The present invention relates to a tape', particularly to an antistatic high temperature resistant polyimide tape. [Prior Art] • With the rapid development of electronic technology, the physical size of integrated circuits is gradually shrinking, the integration level is increasing, and more new polymer materials are widely used, electrostatic discharge is becoming more and more important, and electrostatic protection problems are also More and more 10 to more widespread attention. Among them, printed circuit boards (PCBs) require high-temperature masking tape in the wave soldering or reflow soldering process to protect their gold fingers and some components. For example, in recent years, the maximum temperature of lead-free reflow has reached 280 ° C - 300 ° C. If some components are sensitive, they are easily affected by the generated static electricity (static electricity generated during the process of peeling off the PCB from the tape), so the Φ #面 requires 冋/ 胄 胄 has a good high temperature resistance, that is, after S high temperature Peel-free adhesive residue, on the other hand, it also requires high-temperature masking tape to have anti-static work problem: A strong anti-static tape still exists as (1)·to (four) cut layer and substrate agent, its electrostatic conductivity is mainly (four) w material type Tim' will not be able to play normal two, "humidity" in high temperature environment 20 201026812. Introduce conductive metal particles or polymer particles into the adhesive, keep the static electricity, and the humidity of the environmental towel , --:, surface or slightly raised micron-sized conductive particles due to direct contact - some micro-one (this can cause short circuit; on the other hand, after the tape is peeled off 5, a small amount of conductive particles can be left on the surface of the device; the introduction of conductive particles, Will affect some properties of the adhesive itself, such as reducing the bonding strength, cohesive strength, etc. (3) · due to the substrate or primer or adhesive layer alone or simultaneously add conductive materials, turn belt The light transmittance is significantly reduced, which is not conducive to checking whether there is air bubbles or residual glue in the adhesive layer after the PCB is overheated. 1〇胄 For the above problems, some inventors provide the following solutions. For example, US Patent Publication No. US2006025 1892Α1 discloses An antistatic single-sided or double-sided tape characterized by the presence of a conductive undercoat between the substrate and the subbing layer comprising conductive metal particles or a conductive polymer, polypropylene or phenolic or rubber resin And a cross-linking agent, which can be applied by a general coating method; the coating thickness of the primer is in the range of 0.5 to 25 μm; the structure of the single-sided tape is: a rubber layer/conductive primer/substrate; The structure of the glue is a rubber-coated conductive primer/substrate/conductive primer layer, a glue layer/conductive primer/substrate/adhesive layer; the adhesive of the tape is an acrylic pressure-sensitive adhesive; but the tape does not have high temperature resistance. Performance; 20 US Patent 1; 85, 631, 079 discloses a high temperature resistant antistatic tape; the adhesive layer of the tape is an acrylic sub-sensitive adhesive containing surface conductive coated particles having a particle diameter of less than 1 micrometer; the tape can be immersed in a molten gold state Tin water (235t ~ 265 ° C) remains stripped without residue after at least 5 seconds. 4 201026812 5 10 15 20 European Patent EP 422 919 also discloses an antistatic high temperature resistant tape. The tape comprises a substrate, an intermediate conductive layer (base) Between the material and the adhesive layer, the conductive kick layer. The substrate comprises a high temperature resistant polyimide film. The intermediate conductive layer is a polymer coating containing conductive particles, or a metal vacuum layer, or a composite foil, the surface thereof The resistance is not less than 1χ1〇7 ohm. The conductive adhesive layer is a conductive particle containing larger particles. The conductive particles can even extend out of the rubber surface and connect the contact surface to the intermediate conductive layer. When the intermediate conductive layer uses aluminum foil, the adhesive system is used. For the organic enamel pressure sensitive adhesive, the enamel primer needs to be coated on the aluminum foil before the enamel is applied. At this time, after the punctured aluminum foil is pierced and the enamel is applied, the puncturing point directly contacts the adherend and conducts the anti-static effect, so that no conductive particles need to be added in the adhesive layer. However, in the case of a large tension, the above-mentioned bending is easy to recover, and the piercing point will fail, thereby losing the electrostatic function. In addition, U.S. Patent No. 5,637,368 discloses a high temperature resistant antistatic tape. The structure of the tape is (in order): polyimine film / tantalum pentoxide coating / enamel coating / silicone. The antimony pentoxide coating is formed by a specific coating method by using an aqueous pentoxide pentoxide dispersion (containing a polymer having a sulfonic acid group). Bismuth pentoxide is an opaque substance. In summary, the high temperature antistatic tape disclosed in the above patents satisfies the functions of high temperature and antistatic to a certain extent, but does not simultaneously overcome the problems described above. The high resistance that can eliminate the above problems at the same time makes it necessary to develop a temperature antistatic tape. SUMMARY OF THE INVENTION 5 201026812 Amine adhesive is to provide a high temperature and antistatic antimony. It not only has good antistatic property and high temperature resistance, but also avoids problems caused by ionic additives and conductive particles, and has Good light transmittance. 5 10 15 The present invention provides an adhesive tape comprising: a conductive layer comprising two main tr amine substrates, a conductive polymer coated on at least one major surface of the substrate, disposed on the conductive The layer is coated with an oxygen-fired primer, and the layer is coated with a (four) oxygen wire mixture layer. The tape according to some embodiments of the present invention has good antistatic properties (e.g., 'the static voltage produced by the tape when peeled off is less than just volts (7)), the contact with the substrate with the electrical particles of the fabric, and the high temperature resistance (10), for example. It is resistant to 10 minutes or more at C), has good light transmittance, and is easy to prepare (for example, prepared by a general coating method) and thus has excellent overall properties. The knee strap of the present invention is particularly suitable for over-wave soldering or reflow soldering of PCB sensitive components. • [Embodiment] In the present invention, unless otherwise specified, the term "adhesive tape, not limited to a belt shape" also includes, for example, a sheet shape, and any other shape that matches the application. The present invention provides - An adhesive tape comprising: a polyimide substrate comprising two major surfaces, a conductive layer comprising at least one conductive polymer coated on at least one major surface of the substrate, and a stone disposed on the conductive layer The base layer of the oxoxane and the layer of the argon oxide adhesive disposed on the base of the siloxane. 25 In the present invention, there is no limitation on the substrate of the polyimide, and the general use of 6 201026812 in the field of tape Amine substrates can be used in the present invention. According to certain preferred embodiments, the conductive polymer in the tape of the present invention is selected from the group consisting of polythiophene, polythiophene and polyvinylbenzenesulfonic acid complex (PEDT/PSS). , polyaniline, polyfuran, polybenzenesulfonic acid, and a mixture of each of them. According to certain preferred embodiments, the conductive polymer in the tape of the present invention accounts for 20 to 50 of the total weight of the conductive layer. Weight. /. According to In some preferred embodiments, the conductive ruthenium layer in the adhesive tape of the present invention further comprises an aqueous resin, a crosslinking agent, a dispersant, a coupling agent, a doping agent, a deionized water/solvent mixture, and a pH adjustment. At least one of the agents, wherein the aqueous resin includes, but is not limited to, an acrylic resin, a polyurethane, an epoxy resin, a phenol resin, an organic germanium dispersion, or a modified resin of the above resin. The aqueous resin preferably accounts for the total weight of the conductive layer. The crosslinking agent includes, but is not limited to, melamine, two or more functional nitrogen-acrylic nitriles, 15 isocyanate or a prepolymer thereof. The crosslinking agent preferably occupies a conductive layer. The coupling agent is, for example, 1 to 25% by weight of the total amount of the coupling agent, such as decane-type coupling agent, such as κΗ56〇, 0 KH550', which preferably accounts for 0.1 to 5% by weight based on the total weight of the conductive layer. However, it is not limited to metal salts, Lewis acids, aprotic polar solvents (such as dimethylformamide (DMF), dimethylacetamide (DMAC), N-methyl 20 pyrrolidone (NMP), etc.), And a mixture thereof. The dopant preferably accounts for the total weight of the conductive layer The pH adjusting agent includes, but not limited to, ammonia water, dimethylethanolamine, and a mixture thereof, and the pH adjusting agent preferably accounts for 0.1 to 0.2% by weight based on the total weight of the conductive layer. In some preferred embodiments, the conductive layer 7 201026812 of the tape of the present invention has a coating thickness of 0.1 to 0.5 μm and a relatively low cost, which is another outstanding advantage of the tape of the present invention. The surface resistivity of the conductive layer in the adhesive tape of the present invention is 1χ1〇5~q. 5 10 15 ❹ 20 According to some preferred embodiments, the primer used in the adhesive tape of the present invention is Shi Xi oxygen. Burning primers, such as SS4191 of Momentive New Materials Group (Shanghai, China), 7499 (organic tin) of Dow Corning (Shanghai, China), and KR-3006A of Shin-Etsu (Taipei, Republic of China). According to certain preferred embodiments, the siloxane adhesive in the adhesive layer of the tape of the present invention is a condensed (organotin catalyzed) decane adhesive. Such as the Momentive New Materials Group's PSA61〇/518 'Dow Corning's 7406/7355/7566/280A. The structure of the above tape can be expanded into a double-sided tape, and the structures on both sides can be the same or different. For example, it may be separately coated on both sides of the substrate: a conductive layer comprising at least one conductive polymer', a naphthenic primer disposed on the conductive layer, and a lanthanum oxide disposed on the undercoat of the siloxane. Agent layer. It is also possible to coat a conductive layer comprising at least one conductive polymer on one side of the substrate, a (4) neocoat coated on the conductive layer, and a layer of a phthalocyanine adhesive disposed on the oxy-oxygen primer. On the other side of the substrate, a layer of a buffer of a naphthenic base coat and a crushed emulsion was separately applied. The tape of the present invention may have a release film adhered to the adhesive layer. The invention will now be described in detail in conjunction with the drawings and embodiments. The detailed description is not intended to limit the scope of the invention. The scope of the invention is defined by the appended claims. In the present invention, 8 201026812 Unless otherwise specified, 'percentage, parts, ratio, etc. are based on weight. BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a schematic view showing the structure of an embodiment of an adhesive tape according to the present invention. In Fig. 1, 'from bottom to top is substrate i, conductive coating 2, primer 3 = glue layer 4. — 5 Example: Abbreviation and physical comparison table: ❿

KH550 3-glycidoxypropyltrimethoxydecane

DMF

DMAC A-75 L-W75

BPO DCBPO .Methyl-branched amine dimercapto-ethyl amide-pyro-burning 鲖 75% BPO and crystallization water mixture 75% BPO and crystallization water mixture benzoic acid benzophenone 2.4-one gas peroxide benzoic acid Chinese medicine group Chemical Reagent Co., Ltd. (analytical grade) Sinopharm Chemical Reagent Co., Ltd. (analytical grade) Sinopharm Chemical Reagent Co., Ltd. (analytical grade) ΐ7 Kema (Changshu) Chemistry: Company _ Akzo Nobel China, 1468 Nanjing West Road, Shanghai 3rd Floor, Xin Building, Shanghai, China 9 201026812 ❿ D604 Non-ionic Fluoride Surfactant 1 Gas Chemicals (China) Investment Co., Ltd. Sancure 825 HD-MB019 Ammonia vinegar acrylate Xiaojin Huili Applied Chemicals Co., Ltd. DMAE II Mercaptoethanolamine Sinopharm Chemical Reagent Co., Ltd. (analytical grade) BaytranP complex of polythiophene with sodium sulphate HCStark, Germany A-187 3-glycidyloxypropyltrimethoxydecane Motulnan New Materials Group, Address: No. 227, Libing Road, Zhangjiang Hi-Tech Park, Shanghai 50MD07 2rml transparent fluorinated release pet film Siliconeature Italy SILFLU 75MD07 W 3mil Fluorine-free PET white opaque film Siliconeature Italy Cymel 325 Mercapto etherification high imino melamine resin US Cytec TSXS~ Test method: 5 I. Static dissipative time 1. Tester with ESD gloves Put the pre-cut i5〇mmx 201026812 150mm sample into the static dissipative instrument (Model 406C, ElectroTech Systems, Inc. (ETS)) test room; 2. Zero the sample surface charge test value, and add the sample instantaneously. 5000V high voltage; 5 3. Press the test button, the applied voltage immediately stops, record the static dissipation time; in general, if it exceeds 30s, it is considered to be good insulation, manually stop the test; below 0.01S, it has the function of conducting static electricity. . Second, unwinding static voltage test 10 1. Place the tape (width 25mm, length 33m, core diameter 76.2mm) on the IMASS tester (model SP-2000), unwind at 2286mm/min 2. Bring the static protective gloves, hold the 3M718 static tester, and illuminate the area where the tape is unwound, and test the static voltage generated by the unwinding process. 3. Test on the south temperature 1. Lay the 25mm wide tape on the 2mm thick 50mm X 150mm steel plate, and then put it into the 20-box oven that has been raised to 280 degrees Celsius; 2. Remove the steel plate immediately after 10 minutes. There is no bubble between the steel plate and the fish eye, and the high temperature peeling tape has no residual glue; after cooling to room temperature, there is no residual glue after peeling off. 25 IV. Evaluation of Transparency 201026812 • Stick the tape on the circuit board (PCB). Visually assess the transparency of the tape. The standard is as follows: 0: The components under the tape are completely invisible; 1: The components under the tape are faintly visible. ; 5 2: Clearly visible components under the tape. Example 1 1. Raw material substrate: 6051 '25 μm thick polyimine film, by Tianxing Tianyuan Electric Material Co., Ltd.; 10 Shixioxane primer: SS4191 (SS4191A, SS4191B, SS4192C, SS4259C) Maitu South New Materials Group (Shanghai) offers · siloxane adhesive: 7406, supplied by Dow Corning (Shanghai); A-75, 75% BPO; Akzo Nobel (Changshu); Conductive coating: BaytronP, by HCStark (Germany); 5 Sancure 825, water-based polyurethane, supplied by Shanghai Yuanhe Chemical; D604, non-ionic fluorine surfactant, by Air Products (China) Investment Co., Ltd. (Shanghai); A-187 , decane coupling agent' provided by Momentive New Materials Group (Shanghai); NMP, reagent grade; 20 dimercaptoethanolamine, reagent grade; water, deionized water; isopropanol, reagent grade. 2. Preparation method 25 2.1 Formulation 12 201026812 A. Formulation of conductive coating: Table 1 Conductive coating formula (unit: gram)

5

Baytran P 3.320 50% DMAE 0.096 NMP 0.218 Deionized water 4.600 Isopropanol 4.600 Sancure 825 0.570 n-butanol 0.250 A-187 0.003 D 604 0.008 Solids, % 1.00% Note: Add the ingredients in turn and slowly while stirring B. Primer formulation: Table 2: Naphthenic basecoating formula (unit: gram) Butanone 14.1 Zhenggeng 57.6 30% SS4191A 8 100% SS4191B 0.181 43% SS4192C 0.088 50% SS4259C 0.176 Solid content, 3% C Gel Formulation 13 201026812 Table 3 7406 Oxane Adhesive Formulation (Unit: gram) 7406 100 10% A-75 22.40 Toluene 30 Total: 152.40 Solid Content, 3 8% 2.2 Preparation Process The above conductive coating mixture is used A 250 LPI screen printing roll was applied to the side of a 25 Φ micron thick polyimide surface and dried in an oven with a maximum oven temperature of 180 °C. The coating thickness is controlled to be 0.1 to 0.5 μm. Then coating a 0.1~0.5 micron thick porphyrin undercoat on the conductive coating layer and drying, the maximum setting temperature is 140 ° C; finally, coating the decyl oxide primer on the bottom layer of the oxirane, and Drying and curing, the thickness of the glue is 25~30 microns. 2.3 Performance 10 Table 4 Test performance of Example 1 Performance test Test method Viscosity to steel plate: (waiting 24h at 23C) 0.20 N/mm ASTMD-3330 Tensile strength: 115 N/25mm ASTMD-882 Elongation at break: > 40 % total tape thickness: 0.059 mm ASTMD-3652 breakdown voltage: 6.0 Kv ASTMD-149 static dissipation time: <0.01s static voltage generated as previously described: unwinding process <100 V as previously described, 90 In/min unwinding speed 201026812: peeling from FPC <100 V As described above, '90 in/min unwinding speed, only face temperature without residue, bubble 280 °C lOmins transparency 2 Visual example 2 1. Raw materials Substrate: 605 25 μm thick polyimide film, by Tianjin Tianyuan Electrician® 5 Materials Co., Ltd.; 矽 底 底 :: SS4191 (SS4191A, SS4191B, SS4192C, SS4259C) by Momentive New Materials Group Provided; Alkane adhesive: 7355, supplied by Dow Corning; A-75, supplied by AkzoNobel; 10 DCBPO, supplied by Degussa; Conductive coating: Baytron P, by HCStark; HD-MB019, by Beijing Jinhui Li Applied Chemicals Co., Ltd. provides 256 Division; 325 Provided by Cytec; 15 D604, supplied by American Air Chemistry; A-187, supplied by Momentive New Materials Group (Shanghai); NMP, reagent grade; dimercaptoacetamide, reagent grade; water, water ionized water 20 isopropyl alcohol, reagent grade. 15 201026812 2. Preparation method 2.1 Formulation A. Formulation of conductive coating: Table 5 Conductive coating formula (unit: gram)

5

Baytran P 6.600 50% DMAE 0.096 NMP 0.218 Deionized water 5.000 Isopropyl alcohol 5.000 HD-MD019 0.300 Cymel 325 0.080 n-butanol 0.250 A-187 0.003 D 604 0.008 Solids content, % 1.04% Note: The raw materials are added in sequence and B. Primer formulation: Table 6: Oxane basecoat formulation (unit: gram) Butanone 14.1 n-heptane 57.6 30% SS4191A 8 100% SS4191B 0.181 43% SS4192C 0.088 50% SS4259C 0.176 Solid Content, 3% 16 201026812 C. Glue Formulation Table 7 Oxane Adhesive Formulation (Unit: gram)

7355 100 10% A-75 22.40 toluene 30 Total: 152.40 Solids, 3 8% 5

2.2 Preparation process is the same as in Example 1. 2.3 Performance Table 8 Test performance of Example 2 Performance test Test method Viscosity to steel plate: (waiting 24h at 23C) 0.28 N/mm ASTMD-3330 Tensile strength: 115 N/25mm ASTMD-882 Elongation at break: > 40 % Total thickness of tape: 0.050 mm ASTMD-3652 Breakdown voltage: 6.0 Kv ASTMD-149 Static dissipative time: <0.01 S Static voltage generated as described above: unwinding process <100V As previously mentioned, 90 in/min unwinding speed 201026812: stripping from FPC <100V as previously described, 90 in/min unwinding speed while sub-small temperature without residue, bubble 280 ° C lOmins transparency 2 visual example 3 1. Raw material reference 5 10 15 Substrate: 605 25 μm thick polyimide film, by Tianjin Tianyuan Electrical Material Co., Ltd.; Oxygenane primer: SS4191 (SS4191A, SS4191B, SS4192C, SS4259C) Provided by Momentive New Materials Group (Shanghai); siloxane adhesive: 7355, supplied by Dow Corning (Shanghai); 7406, supplied by Dow Corning (Shanghai); A-75, supplied by Acme (Changshu); Conductive coating :Baytron P, by HCStark (German ); HD-MB019, provided by the Beijing Jinhweili Applied Chemical Products Co., Ltd.;

Cymel 325, supplied by Cytec (Shanghai); D 604, supplied by American Air Chemistry (Shanghai); A-187, supplied by Momentive New Materials Group (Shanghai); NMP, reagent grade; dimethylacetamide , reagent grade; water, water ionized water; 18 201026812 isopropanol, reagent grade; release membrane: SILFLU 50MD07, supplied by Siliconenature; SILFLU 75MD07W, supplied by Siliconenature. 2. Preparation method 2.1 Formulation A. Formulation of conductive coating:

10 Table 9 conductive coating formula (unit: gram) Baytran P 6.600 50% DMAE 0.096 NMP 0.218 deionized water 5.000 isopropanol 5.000 HD-MD019 0.300 Cymel 325 0.080 n-butanol 0.250 A-187 0.003 D 604 0.008 solid content, % 1.04% Note: Each raw material is added in sequence and slowly added while stirring; B. Primer formulation: Table 10 Oxane basecoating formula (unit: gram) Butanone 14.1 Zhenggeng 57.6 30% SS4191A 8 19 201026812 100% SS4191B 0.181 43% SS4192C 0.088 50% SS4259C 0.176 Solids, 3% c. Glue Formulation Table 1 1 7355 Oxane Adhesive Formulation (Unit: gram)

7355 100 10% DCBPO 22.40 Benzene 30 Total: 152.40 Solids, 38% 5 Table 12 7406 Hydroxide Adhesive Formulations (Units·g) 7406 100 10% A-75 22.40 Toluene 30 Total: 152.40 Solids, 38 %

2.2 Preparation process First, a conductive coating, a siloxane topcoat, and a 7406 decane adhesive were applied to the side of the PI film. The process and coating thickness were the same as in Example 1. Then, the white fluorination was repeated online. Type film (SILFLU 50MD07W). Next, on the other side of the PI (the other side is combined with the release film), a naphthenic base coat and a 7355 矽 20 201026812 oxy-fired adhesive are respectively applied, and the thickness of the shixi oxygen burning adhesive is 0.05 mm. Finally, the online composite SILFLU75MD07 release film. 2.3 Performance 5 Table 13 Test performance of Example 3 Performance test Test method Viscosity to steel plate: 7355 rubber surface 0.40 N/mm ASTMD-3330 7406 rubber surface 0.20 N/mm Tensile strength: 115 N/25mm ASTMD-882 elongation at break Rate: >40 % Total tape thickness: 0.105 mm ASTMD-3652 Breakdown voltage: 6.5 Kv ASTMD-149 Static dissipation time: <0.01 S Static voltage generated as described above: self-unwinding <100 V as before The stripping from FPC <100 V is as described above, the unwinding speed of 90 in/min is free of residual glue, the bubble is 280 ° C lOmins transparency 2 Visual Example 4 1. Raw material 21 201026812 Substrate: 6051, 25 Micron thick polyimide film, by Tianjin Tianyuan Electrical Material Co., Ltd.; 矽 底 底 :: SS4191 (SS4191A, SS4191B, SS4192C, SS4259C) provided by Momentive New Materials Group (Shanghai); 5 矽 oxygen Alkane binder: 7355, supplied by Dow Corning (Shanghai); 7406, supplied by Dow Corning (Shanghai); A-75, supplied by Acme (Changshu); Conductive coating: BaytronP, by HCStark (Germany); 〇HD- MB019, Waterborne Polyacrylic Acid, by Beijing Gold Huili Ying 10 is provided by Chemical Products Co., Ltd.;

Cymel 325, supplied by Cytec (Shanghai); D 604, supplied by American Air Chemistry (Shanghai); A-187, supplied by Momentive New Materials Group (Shanghai); NMP, reagent grade; 15 dimethylacetate Amine, reagent grade; water, water ionized water; φ isopropanol, reagent grade; release membrane: SILFLU 50MD07, supplied by Siliconenature; SILFLU 75MD07W, supplied by Siliconenature. 20 2. Preparation method 2.1 Formulation A. Formulation of conductive coating: Table 14 Conductive coating formula (unit: gram) 22 201026812

Baytran P 1.65 50% DMAE 0.096 NMP 0.218 Deionized water 4.5 Isopropyl alcohol 4.5 HD-MD019 0.570 Sancure 325 0.14 n-butanol 0.250 A187 0.003 D604 0.008 Solids content, % 1.04% Note: The ingredients are added sequentially and stirred slowly. Slow addition; B. Primer formulation: Table 15 oxirane primer formulation (unit: gram) butanone 14.1 gamma burn 57.6 30% SS4191A 8 100% SS4191B 0.181 43% SS4192C 0.088 50% SS4259C 0.176 solid content, 3% 5 C. Glue Formulation Table 161 7355 Oxane Adhesive Formulation (Unit: gram) 23 201026812 7355 100 10% DCBPO 22.40 Toluene 30 Total: 152.40 Solid Content, 3 8% Table 17 7406 Oxane Adhesive Formulation (Unit: g) 7406 100 10% A-75 22.40 Toluene 30 Total: 152.40 Solids, 38%

2.2 Preparation process 5 First, a conductive coating, a siloxane top coat, a 7406 矽 oxy-burn adhesive were applied to the side of the PI film, and the process and coating thickness were the same as in Example 1; then the white fluorinated release was repeated online. Membrane (SILFLU 50MD07W). Next, a conductive coating, a siloxane topcoat and a 7355 oxirane adhesive were applied to the other side of the PI, and the thickness of the siloxane adhesive layer was 〇.〇5 mm. Finally online compound 1〇 SILFLU75MD07 release film. 2.3 Performance Table 1 8 Test Performance of Example 3|Test|Test Method 24 201026812 Adhesion to Steel Plate: 7355 Rubber Surface 0.40 N/mm ASTMD-3330 7406 Rubber Surface 0.20 N/mm Tensile Strength: 115 N/25mm ASTMD- 882 Elongation at break: >40 % Total thickness of tape: 0.105 mm ASTMD-3652 Breakdown voltage: 6.5 Kv ASTMD-149 Static dissipative time: <0.01 S Static voltage generated as described above: Stripped from FPC <100 V As mentioned above, 90 in/min unwinding speed 13⁄4 temperature without residue, bubble 280 ° C lOmins transparency 2 visual comparison 1 1. Raw material substrate: 6051, 25 μm thick polyimide film, Tianjin Tianyuan Electric 5 Materials Co., Ltd.; 矽 底 底 primer: SS4191 (SS4191A, SS4191B, SS4192C, SS4259C) provided by Momentive New Materials Group (Shanghai); decane binder: 7355, by Dow Corning ( Shanghai) Provided; A-75, provided by Arkema (Changshu). 25 201026812 2. Preparation method 2.1 Formulation A. Primer formulation: Table 19: Oxygenane primer formulation (unit: gram) Butanone ΤΪΓΡ ''" n-heptane rTe 30% SS4191A 8 — 100% SS4191B οΤΐΤΐ — 43% SS4192C 〇88 ~~~ 50% SS4259C~ 〇ΤΪ76 ~~~ Solid content, 3%^~ ^

C. Glue Formulation Table 20 Oxygenane Binder Formulation (Unit: gram) 7355 Ϊ00~~~--- 10% Α-75 2^40 Toluene--------- 30 Total: 152.40 — Solid Content The preparation process of 3 8% 10 2·2 was the same as that of Example 1, except that no conductive layer was applied, and only the decane-based primer and the oxalate-based adhesive were applied. 2·3 performance 26 201026812 Table 21 Example 2 Test performance Performance test Test method Viscosity to steel plate: (waiting 24 h at 23 ° C) 0.28 N/mm ASTMD-3330 鬃 Tensile strength: 115 N/25 mm ASTMD- 882 Elongation at break: >40 % - Total thickness of tape: 0.050 mm ASTMD-3652 Breakdown voltage: 6,0 Kv ASTMD-149 Static dissipative time: > 20S Static voltage generated as described above: unwinding process 5,000 -10,00 ον As before, the unwinding speed of 90 in/min: stripping from FPC >5000V As mentioned above, the unwinding speed of 90 in/min has no residue on the local temperature, and the bubble is 280 〇C lOmins Transparency 2 Visually Comparative Example 2 An adhesive tape prepared according to the method disclosed in Example 1 of EP422919 was tested for performance according to the test method of Example 2, and the transmittance was 0 or 1. The electrostatic discharge time is less than 0.01S. Temperature resistance: up to 5 seconds at 250 degrees Celsius. 27 201026812 [Schematic Description of the Drawings] Fig. 1 is a schematic view showing the structure according to an embodiment of the present invention. [Main component symbol description] 1 substrate 2 conductive coating 3 primer 4 layer

28

Claims (1)

201026812 VII. Patent application scope: 胶带. A tape comprising: a polyimide substrate comprising two major surfaces, a conductive layer comprising at least one conductive polymer coated on at least one major surface of the substrate, and an arrangement The diarrhea primer on the conductive layer and the siloxane adhesive layer on the bottom layer of the siloxane. The tape of the first aspect of the invention, wherein the conductive polymer is selected from the group consisting of polyporphin, polyporphin and poly (phenylene oxide) complex, polyaniline, polyfuran, polybenzenesulfonic acid One or a mixture of two or more. 3. The tape of claim 1, wherein the conductive poly 10 compound comprises 20 to 50% by weight of the total weight of the conductive layer. 4. The tape of claim 2, wherein the conductive The layer further includes at least one selected from the group consisting of an aqueous resin, a dispersant, a coupling agent, a dopant, a deionized water/solvent mixture, and a pH adjuster. 5. The tape of claim 4, wherein the 15 further comprises a crosslinking agent. 6. The tape of claim 4, wherein the aqueous resin is selected from the group consisting of an acrylic resin, a polyurethane resin, an epoxy resin, a phenolic resin, an organic germanium dispersion, or a mixture of the foregoing. 7. As claimed in claim 4, the tape is intended to account for 40 to 70% by weight of the total weight of the conductive layer. The tape of the invention of claim 5, wherein the ruthenium is selected from the group consisting of melamine, two- or more-functional aziridines, or a prepolymer thereof, and two or more thereof. a mixture of the above substances. 29 201026812 觚 胶带 The tape described in item 5 of the patent application scope is 1 to 25% by weight based on the total weight of the conductive layer. 1〇, as described in claim 4, the tape is a Shixi-burning coupling agent. 5 丨 1. The tape described in claim 4 of the patent application is 0.1 to 5 weight 〇/〇 of the total weight of the conductive layer. 12. The sling tape as described in claim 4 of the patent scope is selected from the group consisting of metal salts, materials (four), aprotic polar solvents, 13. The knee band 10 as claimed in claim 4 of the total weight of the conductive layer. 〇.1~0.5% by weight. 14. The ankle according to claim 4, wherein the agent is selected from the group consisting of ammonia, dimethylethanolamine, or a mixture thereof. 15. For the tape described in item 4 of the patent scope, the agent accounts for 0 i~〇 2% by weight of the total weight of the conductive layer. 15 I6. The tape of the invention as claimed in claim 1 has a coating thickness of from 1 to 0.5 μm. 17. The tape of claim 1, wherein the burnt adhesive layer is a condensed aerobic oxide pressure sensitive layer. 18. For the tape described in item 1 of the patent application, 2" double-sided tape. 19 'As claimed in claim 1, the tape has the same structure on both sides. 20. The tape of claim 1, wherein the release layer is provided on the layer of the alumite adhesive. Wherein the crosslinking agent' is the coupling agent' wherein the coupling agent' is the dopant or a mixture thereof. Wherein the dopant is wherein the pH is adjusted wherein the pH is adjusted wherein the conductive layer is the argon oxide, wherein the tape is wherein the tape is further included at 30