201002140 六、發明說明： 【發明所屬之技術領域】 本發明係關於有機發光二極體（OLED)裝置之領域，且 尤其係關於模組化OLED裝置。 【先前技術】 有機LED(OLED)具有若干有吸引力之特徵，諸如極佳的 視覺外觀、擴散分布之光源、極薄或甚至可撓、斷電時對 透明、鏡狀或黑色之選擇，及形狀上幾乎完全之2D自由 度。此等特性使其理想地適用於標誌應用，在該等標誌應 用中使用不同大小及色彩之發光字母及圖形符號來吸引消 費者。 在此應用領域中，視消費者請求而需要不同大小及形狀 之OLED裝置。然而，尤其對於較大大小而言，該等OLED 裝置之製造係困難且昂貴的。 【發明内容】 本發明之一目標為可以以容易、便利且低廉之方式提供 亦呈較大尺寸大小之定製的OLED。 此目標藉由多個OLED裝置及一用於電接觸該等OLED裝 置之界面之集合而達成，其中獨立地囊封每一 OLED裝 置，且其中該界面經調適用於接觸不同類型之經囊封的 OLED裝置。 因此，本發明允許藉由組合多個較小OLED裝置而構成 之呈不同大小及形式之OLED裝置，該多個較小OLED裝置 自身經囊封（亦即，密封）。此意謂與先前技術裝置相對 138702.doc 201002140 比，根據本發明，該集合之每一 OLED裝置獨立地為一完 整0LED，使得有可能以定製方式組合此等單一 0LED裝 置。 此意謂本發明係關於一複合0LED裝置，其由可被層壓 至一透明結構化互連基板上之複數個0LED片段裝置組 成。可具有字符形式之該等OLED片段裝置組成構建塊之 集合。結合個別基板結構化（例如，藉由雷射剝银），有可 能產生任何所要大小及形狀之OLED裝置。該複合OLED裝 置準備被層壓於任一目標基板（例如，玻璃板）上。 層壓避免昂貴之標準OLED製造過程，其中僅沈積整個 基板區域之一部分且針對每一設計改變需要新的蔽蔭遮 罩。藉由標準設備可容易地進行層壓及結構化。 根據本發明之一較佳實施例，將OLED裝置層壓至充當 界面之透明互連基板上。關於此情形，尤其較佳地，該透 明互連基板由聚對苯二甲酸乙二酯、聚萘二甲酸乙二酯、 聚醚砜、聚醯亞胺、玻璃、陶瓷、金屬、半導體或其組合 中之至少一者製成。該互連基板層可充當額外保護層以延 長OLED片段裝置之壽命。 另外，根據本發明之一較佳實施例，透明互連基板包含 一透明電極，該透明電極係由至少導電聚合材料、透明導 電氧化物及金屬（尤其為銦-錫-氧化物、鋅-銦-氧化物、摻 銘 ZnO、Ga-In-Sn-O、Sn〇2、Zn-In-Sn-0、Ga-In-O、金、 銀、鋁、銥、鎳、鉻或其組合）製成。 此外，根據本發明之一較佳實施例，透明互連基板包含 138702.doc 201002140 導包層。關於此情形’尤其較佳地，該導電層包含至少 兩们區域，該至少兩個區域由用於使該等區域彼此電絕緣 1隙刀離。較佳地至少一經囊封之沉印裝置係經故置 橫跨該間隙。較估 ^ 1佳地’夕個經囊封之OLED裝置係經放置 .橫跨該間隙且此等多個OLED裝置以並聯連接。此確保在 施加怪^電壓之情況下，對於所有形狀具有相同亮度。 ‘ 較佳結構化方法為雷射㈣及㈣。其他較佳方法包括 (.):^或頜外導電層（諸如可用於個別 段之互連的銘）之層 壓:載體基板與〇LED片段裝置之間的接觸較佳經由導電 黏著劑、超音波熔接等而完成。 祀據本I明之另—較佳實施例，導電材料之額外層係提 供作為匯流排條。因此，視情況地，低歐姆匯流排條可用 於f各種0LED片段中經改良的亮度均勻性。該匯流排條 為諸如銘、銅、銀等之高導電材料之額外層。可較佳地利 用小的铭條帶、銅條帶或銀條帶之高反射率及鏡狀外觀而 C 將匯流排條結構之不透明性用作農飾特徵。此外’其可用 以隱藏片段/載體基板之接觸。 &佳地將片& $置及可選匯流排條元件層壓至結構化載 月丑土板上名員外4擇為圖案化至目標基板上之匯流排 .條。此可使用標準技術完成。對於層廢而言，較佳使用壓 力/熱/紫外線活化黏著劑。可直接將所得之雙層裝置層壓 至目標基板（例如，麵板）上。視情況地，根據本發明之 一較佳實施例，另外的覆蓋落可用以囊封OLED片段。 【實施方式】 138702.doc 201002140 本發明之此等及其他態樣將自後文所描述之實施例而顯 而易見且將參看後文所描述之實施例而加以闡明。 自圖1可見根據本發明之一較佳實施例的多個OLED裝置 1及用於電接觸該等OLED裝置1之界面2之集合。根據本發 明之此較佳實施例’該等OLED裝置1自身各自經囊封且接 著被層壓至該界面2上’該界面2係由具有導電ιτΟ層4之結 構化載體基板3製成。 在圖2中較為詳細地展示一 〇LED裝置1連同其片段堆 疊。此OLED片段堆疊自頂至底包含一上部障壁層5、一陰 極層6、一有機層7、一陽極層8、一下部障壁層9，及一透 明可撓之基板10(例如，聚醯亞胺）。 如自圖3及圖4進一步可見，可以不同方式將包含〇led 裝置1之集合層壓於玻璃板丨丨上。雖然根據展示於圖3中之 實施例’該集合直接層壓至玻璃板^上且由一 PVB箔12覆 蓋，但根據展不於圖4中之實施例，使用一層間pVB箔j 3 用於將該集合層壓至玻璃板i 1上。 另外’自圖5可見具有呈字符形狀之〇led裝置1之集 合。根據本發明之此較佳實施例，一陽極14及一陰極15之 門有間隙1 6。呈子符形狀之OLED裝置1經放置橫跨間隙 16且分別借助於接觸陽極14之接觸點17及接觸陰極Η之接 觸點1 8與陽極1 4及陰極15電連接。 自Θ 6可見可修改此實施例使得提供作為匯流排條 之低歐姆金屬條19用於接觸單—〇LED裝置i。此等低歐姆 匯流排條1 9提供在該等〇 L E D裝置丨中經改良之亮度均句 138702.doc 201002140 性。匯流排條19係由諸如鋁、銅或銀之高導電材料之額外 層製成。利用小金屬條帶之高反射率及鏡狀外觀將匯流排 條19之不透明性用作装飾特徵。此外，其用以隱藏片段/ 載體基板接觸（亦即，現為不可見之接觸點丨7、丨8)。自圖 7，可見具有經層壓之匯流排條丨9之該配置的橫截面圖。201002140 VI. Description of the Invention: TECHNICAL FIELD OF THE INVENTION The present invention relates to the field of organic light emitting diode (OLED) devices, and more particularly to modular OLED devices. [Prior Art] Organic LEDs (OLEDs) have several attractive features, such as excellent visual appearance, diffused distribution of light sources, extremely thin or even flexible, choices for transparency, mirroring or black when power is off, and Almost full 2D degrees of freedom in shape. These characteristics make it ideal for signage applications where illuminating letters and graphic symbols of different sizes and colors are used to attract consumers. In this field of application, OLED devices of different sizes and shapes are required depending on the consumer's request. However, the manufacture of such OLED devices is difficult and expensive, especially for larger sizes. SUMMARY OF THE INVENTION One object of the present invention is to provide a custom OLED that is also of a larger size in an easy, convenient, and inexpensive manner. This object is achieved by a plurality of OLED devices and a collection of interfaces for electrically contacting the OLED devices, wherein each OLED device is independently encapsulated, and wherein the interface is adapted to contact different types of encapsulated OLED device. Accordingly, the present invention allows OLED devices of different sizes and forms to be formed by combining a plurality of smaller OLED devices that are themselves encapsulated (i.e., sealed). This means that, in contrast to prior art devices, 138702.doc 201002140, according to the present invention, each OLED device of the set is independently a complete OLED, making it possible to combine these single OLED devices in a customized manner. This means that the present invention is directed to a composite OLED device that is comprised of a plurality of OLED segment devices that can be laminated to a transparent structured interconnect substrate. The OLED segment devices, which may have the form of characters, constitute a collection of building blocks. In combination with individual substrate structuring (e.g., by laser stripping by laser), it is possible to produce OLED devices of any desired size and shape. The composite OLED device is ready to be laminated to any target substrate (e.g., a glass plate). Lamination avoids expensive standard OLED fabrication processes in which only one portion of the entire substrate area is deposited and a new shade mask is required for each design change. Lamination and structuring can be easily performed by standard equipment. In accordance with a preferred embodiment of the invention, the OLED device is laminated to a transparent interconnect substrate that acts as an interface. In this case, it is particularly preferred that the transparent interconnect substrate is composed of polyethylene terephthalate, polyethylene naphthalate, polyether sulfone, polyimide, glass, ceramic, metal, semiconductor or At least one of the combinations is made. The interconnect substrate layer can serve as an additional protective layer to extend the life of the OLED segment device. In addition, according to a preferred embodiment of the present invention, the transparent interconnect substrate comprises a transparent electrode composed of at least a conductive polymeric material, a transparent conductive oxide and a metal (especially indium-tin-oxide, zinc-indium). - oxide, ZnO, Ga-In-Sn-O, Sn 〇 2, Zn-In-Sn-0, Ga-In-O, gold, silver, aluminum, lanthanum, nickel, chromium or a combination thereof to make. Moreover, in accordance with a preferred embodiment of the present invention, the transparent interconnect substrate comprises a 138702.doc 201002140 cladding layer. In this case, it is particularly preferred that the electrically conductive layer comprises at least two regions which are used to electrically insulate the regions from each other by a gap. Preferably, at least one of the encapsulated printing devices is disposed across the gap. It is estimated that the OLED device is placed over the gap and the plurality of OLED devices are connected in parallel. This ensures the same brightness for all shapes with the application of a voltage. ‘The preferred methods of structuring are lasers (4) and (4). Other preferred methods include (.): or lamination of an outer conductive layer (such as the one that can be used for the interconnection of individual segments): the contact between the carrier substrate and the 〇LED segment device is preferably via a conductive adhesive, super The sound wave is welded and the like is completed. According to another preferred embodiment of the present invention, an additional layer of electrically conductive material is provided as a bus bar. Thus, as appropriate, low ohmic bus bars can be used to improve the brightness uniformity of the various OLED segments. The bus bar is an additional layer of highly conductive material such as Ming, copper, silver, and the like. The high reflectivity and mirror-like appearance of a small strip of inscription, copper strip or silver strip can be preferably used. C The opacity of the bus bar structure is used as an agricultural feature. Furthermore, it can be used to hide the contact of the segment/carrier substrate. & Jiadi laminates the film & $ and optional bus bar components to the busbar on the structured ugly board to be patterned onto the target substrate. This can be done using standard techniques. For layer waste, it is preferred to use a pressure/heat/ultraviolet activating adhesive. The resulting two-layer device can be directly laminated to a target substrate (e.g., a panel). Optionally, in accordance with a preferred embodiment of the present invention, additional overlays can be used to encapsulate the OLED segments. [Embodiment] 138702.doc 201002140 These and other aspects of the present invention will be apparent from the embodiments described hereinafter. 1 shows a plurality of OLED devices 1 and a collection of interfaces 2 for electrically contacting the OLED devices 1 in accordance with a preferred embodiment of the present invention. According to this preferred embodiment of the invention, the OLED devices 1 are themselves encapsulated and subsequently laminated to the interface 2. The interface 2 is made of a structured carrier substrate 3 having a conductive layer 4 of conductive material. A stack of LED devices 1 along with its segments is shown in greater detail in FIG. The OLED segment stack includes an upper barrier layer 5, a cathode layer 6, an organic layer 7, an anode layer 8, a lower barrier layer 9, and a transparent flexible substrate 10 from top to bottom (for example, Polycrystalline amine). As further seen in Figures 3 and 4, the collection comprising the 〇led device 1 can be laminated to the glass sheet stack in different ways. Although the assembly is directly laminated to the glass sheet and covered by a PVB foil 12 according to the embodiment shown in FIG. 3, an interlayer pVB foil j 3 is used for the embodiment according to FIG. This collection was laminated to a glass plate i1. Further, a collection of the 〇led device 1 having a character shape can be seen from Fig. 5. According to this preferred embodiment of the invention, the gates of an anode 14 and a cathode 15 have a gap 16. The sub-shaped OLED device 1 is placed across the gap 16 and electrically connected to the anode 14 and the cathode 15 by means of a contact 17 contacting the anode 14 and a contact 18 contacting the cathode. It can be seen that this embodiment can be modified such that a low ohmic metal strip 19 as a bus bar is provided for contacting the single-turn LED device i. These low ohmic bus bars 1 9 provide improved brightness uniformity 138702.doc 201002140 in these 〇 L E D devices. The bus bar 19 is made of an additional layer of highly conductive material such as aluminum, copper or silver. The opacity of the bus bar 19 is used as a decorative feature by the high reflectivity and mirror-like appearance of the small metal strip. In addition, it is used to hide the segment/carrier substrate contacts (i.e., now invisible contact points 丨7, 丨8). A cross-sectional view of this configuration with laminated bus bars 9 can be seen from Figure 7.
最後，自圖8可見本發明之另一經修改之實施例，根據 該實施例，陽極丨4經結構化。此意謂陽極14包含多個平行 條帶20 中鄰近條帶2〇藉由間隙21分別彼此分離且彼此 電絕緣。為了個別地連接各別〇LED裝置丨，使用夾至經結 構化之陽極1 4上之連接杯趣9 9 m ,1 —Γ 〜史按祀木22。因此，可以以一容易方式 達成QLED裝置1之定製集合。 雖然在圖式及先前描述中已t羊細說明並描述本發明，但 應將該說明及描述考慮為說明㈣例#性的而非限制性 的；本發明並不限於所揭示之實施例。 ，習此項技術者可在實踐本發明過程中自對圖式、揭示 :奋及隨附中請專利範圍之研究而理解並實現所揭示之實 施例之其他變化。纟中請專利範圍中，詞「包含」不排除 其他元件或步驟’ Μ「―」不排除複數。僅僅在互相不 =的㈣項巾敍述某些措施之事實並不表示此等措施之組 °有W地使用。不應將中請專利範圍中之任何參考符 號解釋為限制範疇。 【圖式簡單說明】 圖1展不根據本發明之—較佳實施例之多個〇led裝置及 於電接觸該等OLED裝置之界面之集合； 138702.doc 201002140 圖2以橫截面圖較為詳細地展示一 OLED裝置連同其片段 堆疊； 圖3展示包含以第一方式層壓於玻璃板上之多個OLED裝 置之集合； 圖4展示包含以第二方式層壓於玻璃板上之多個OLED裝 置之集合； 圖5展示具有呈字符形狀之OLED裝置之集合； 圖6展示一經修改使得作為匯流排條之低歐姆金屬條被 提供之實施例； 圖7展示具有經層壓之匯流排條之該配置的橫截面圖；及 圖8展示本發明之另一經修改之實施例，根據該實施例 將陽極結構化。 【主要元件符號說明】 1 OLED裝置 2 界面 3 結構化載體基板 4 導電ITO層 5 上部障壁層 6 陰極層 7 有機層 8 陽極層 9 下部障壁層 10 透明可撓之基板 11 玻璃板 138702.doc 201002140 12 PVB 箔 13 層間PVB箔 14 陽極/結構化陽極 15 陰極 16 間隙 17 接觸陽極之接觸點 18 接觸陰極之接觸點 19 低歐姆金屬條 20 條帶 21 間隙 22 連接托架 138702.docFinally, another modified embodiment of the invention can be seen from Figure 8, according to which the anode crucible 4 is structured. This means that the anode 14 comprises a plurality of parallel strips 20 adjacent strips 2, separated from one another by gaps 21 and electrically insulated from one another. In order to individually connect the individual LED devices, use a connection cup clipped to the structured anode 14 for 9 9 m, 1 - Γ ~ history by elm 22. Therefore, the customized set of QLED devices 1 can be achieved in an easy manner. The present invention has been described and described in detail in the drawings and the foregoing description. Other variations of the disclosed embodiments can be understood and effected by those skilled in the art of practicing the invention. In the scope of patents, the word "include" does not exclude other components or steps ' Μ '―" does not exclude plural. The mere fact that certain measures are described in (a) items that do not indicate each other does not mean that the group of such measures is used. Any reference symbol in the scope of the patent is not to be construed as limiting. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a combination of a plurality of 〇led devices according to the preferred embodiment of the present invention and an interface for electrically contacting the OLED devices; 138702.doc 201002140 FIG. 2 is more detailed in cross-sectional view An OLED device is shown stacked along with its segments; Figure 3 shows a collection comprising a plurality of OLED devices laminated to a glass plate in a first manner; Figure 4 shows a plurality of OLEDs comprising a second layer laminated to a glass plate Figure 5 shows a collection of OLED devices having a shape of a character; Figure 6 shows an embodiment in which a low ohmic metal strip as a bus bar is modified; Figure 7 shows a bus bar with laminated A cross-sectional view of the configuration; and Figure 8 shows another modified embodiment of the invention in which the anode is structured in accordance with this embodiment. [Main component symbol description] 1 OLED device 2 interface 3 structured carrier substrate 4 conductive ITO layer 5 upper barrier layer 6 cathode layer 7 organic layer 8 anode layer 9 lower barrier layer 10 transparent flexible substrate 11 glass plate 138702.doc 201002140 12 PVB foil 13 interlayer PVB foil 14 anode/structured anode 15 cathode 16 gap 17 contact point of contact anode 18 contact point of contact cathode 19 low ohmic metal strip 20 strip 21 gap 22 connection bracket 138702.doc