201007113 六、發明說明： 【發明所屬之技術領域】 本發明係Μ於-錄熱>；，係將從功率元件或發光元件產生 之熱以良好效率發散餅部之散熱用熱模組等的構成材料。 【先前技術】 元件或發光元件之所謂發熱性元件，係採用 將從該等發熱性元件產生的熱發散到發 Ο tit”在此，散熱機構’係指散熱器(熱沉:—趙) 或具有散熱功能之框體，或熱模組等。 因此自身產生的熱而過熱，自身的溫度上升’ 持發ϊΐ ϊϊ:ϊ或光學特性下_性能劣化。因此，為了維 耕產k細良好效率 接觸中;;其為中了=熱性元件與熱沉間之 屬板======作=糾，但是若以單想之金 ;片對於要求重量儘可能減小的可 ί。f此，最近散熱片之材料，有人提“ 知且散熱效果尚的石別(例如參照專利文獻1及2): 使石K不iiiS容問題。而，為了 網，;而:體化並加工為散熱片之例(參照構成之 並㈣石黑鉛等黑鉛粉末片化得到之石墨薄膜， _成之無機物質臈等:該=於石墨 等彎曲部部分_軟性為其特ir ““裝於電子設備 201007113 專利文獻1 :日本特開平^240706號公報 專利文獻2 :日本特開2003-168882號公報 專利文獻3 :日本特開2005-229100號公報 專利文獻4 :曰本特開2008-78380號公報 【發明内容】 (發明欲解決之問題） 但是，使用石墨材作為熱電傳導層構成 熱片時會產生碳粉等粉塵。當使散孰只φ人从裁切該散 之間之作業進行時必需ί該熱性元件與熱沉 者於安裝於熱沉之電子模組，可能造成電短‘ 又’依照上述專利文獻3揭示 特性，但是，金顧維從散W j 了得非常優異散熱 維係屬麻須。該金屬纖維，若理該金屬纖 子模組’尚可能發生電短路等不良現象。、散”、、I模組等之電 所以’本發明提供一種散埶 :良:會效產率生發;; (解決間題之nr不利影響之破粉等粉塵* 素片浸實驗’結果發現若利用使纖維 =，形成之散熱片物 易等的作‘ 依據上述理S，本發明&塵。 片之製造方法。 i 要曰在於提供以下之散熱片及散熱 之聚係纖維素片浸满過聚轉聚合物而得 合而成散熱片。本發明3 ft或其巾之—面使金屬層緊密接 散熱片，可以如下3種方法形成。 201007113 使纖之第1散熱片之第1方法，包含以下步驟： 潤St面各聚合物而產生聚轉浸潤片；於聚轉浸 層。®及#面兩面或其中之—面姻真空蒸鍍法形成金屬 明之第1散刻之第2方法，包含以下步驟： 而產生聚_濁片;於_ 形成金屬ί 面或其#之—面，將金屬微粒子印刷固定而 使纖ΐΐϊϊΐΓ之第1散熱片之第3方法，包含以下步驟： 獨產生聚轉浸潤片;於聚•各浸 本發y 1__法形成金屬層。 得之聚吡咯浸潤片之主^及過聚°比咯聚合物之而 將金屬片黏接而成散熱片。兩面I、中之一面介由黏接構件 維素㈣含π步驟之方法製造··使纖 態之轉而產生聚对浸ί片3浸過氯化銅之纖維素片接觸氣體狀 (發明之效果） φ 而得rtttf之第1及第2散熱片，包含浸潤過聚轉聚人物 裝=:=性 散熱片利用之聚°比略聚合物為π共輕系 201007113 π f輛系聚合物如後述，具有雙鍵與單鍵交替排列之構造 主2物測由於該主鍵發生熱性質之異向性。亦即為 系U之V比咯聚合物，被認為具備於沿該主鍵之方向比 ϊϊί於ί該主鏈之方向’熱傳導率增大之性質。因此，π共輛系 明巧之熱特性的異向性被認為有效貢獻於本谷 月之散…片二有^滿足上述〜利之熱性質的表現。 t有效冷卻發熱性元件’必需使發熱性元件與散熱献 2 ίίίϊ度經常_較發熱性元件更低之溫度。而且，^ 片或熱沉接觸處之财愈為低溫，發熱性元件G 熱性元件與熱沉間之熱阻愈小，發熱性元= 如所周知，熱阻係指相對於單位時間之發熱量 值U藉，ί近似的發熱性元件(高溫部)與熱沉(低溫部)ρ::埶 f導係數之倒，以發熱性元件之接_積求得。熱 時，於單位面積通過發熱性元件與熱沉之間熱能，、除以 之溫度差求得。亦即，熱阻係代表溫度^導 易程度的數値’練値愈大代表溫度愈不易傳導。 部之於熱沉之低溫部係包圍發熱性元件等高溫 ϊ ]圍情形’亦能^義熱阻。如後述，可計算發執 = 易發散’綱熱性元件自身之溫度容ΐ /及第2散熱片，具有以下熱特性：將從盘散敎 =之溫=愈單:=大之麵量一 構成亦:能 201007113 又， 處理中不發：sr切ΐ理等工作 構成======綠，㈣相當於 極薄的金屬層緊密接合於聚片以真空蒸鑛法形成，故可將 構成===第金=片之第2方法，由於相當於 極薄之金屬層能緊密接屬合===用印刷技術形成，因此， 遍、ί，造本發明之第1散熱片之第3方法，由於相當於 金屬層能«接合^屬電餘觀，耻，極薄之 -依; 接合於聚吼略浸潤片，可有效減低熱阻。胃由使金屬層緊推 輕質化。 散“、、片，口此此以低成本製造且容易達成 【實施方式】 (用於實施發明之最佳形態） 該等各圖。該等ί 發 ms 祕本㈣之實施形態。 參關1(A)及⑻說明本發明之實施形態之第}及第2散熱片 2〇1〇〇7113 2 之構成及其製造方法。圖1(A)及(B)各為於垂直第1散熱片及第“ 散熱片之主面及背面切斷之概略剖面構造圖。 士為了減低發熱性元件與熱沉之間之熱阻而插入之散熱片，有 需要會在發熱性元件與散熱片之間，或熱沉與散熱片之間夾 ，著電絕緣膜而固定。又，利用黏接構件等，以使散熱片與發熱 性疋件緊密接合，或使熱沉與散熱片緊密接合。 〃， 但，有時會不需要電絕緣而散熱片插入發熱性元件與熱沉之 ‘垃需要散熱片永久地黏接固定於發熱性元件與熱沉而僅是 壓即可的情形。於此情形’散熱片與發熱性元件或熱沉係 © 黏接1^及=)中省略有日夺會附隨於餘片使用之電絕緣膜或 ΐίϊϊί 散熱片也可適當設置用以於電絕緣 接構件4'。、祕^匕性70件，或於散熱片緊密接合熱沉的黏 一面緊密接合金屬層而構18a*背面⑽至少其中 主面18a及背面18b各报中，顯示聚吡咯浸潤片18之 也可形成金屬層16及金朗2G 及金屬層2G之例’但是201007113 VI. Description of the Invention: [Technical Field of the Invention] The present invention relates to a heat recording module for dissipating heat from a power element or a light-emitting element with good efficiency. Composition material. [Prior Art] A so-called heat-generating element of an element or a light-emitting element is a heat-dissipating heat generated from the heat-generating element to a hairpin tit "here, the heat-dissipating mechanism" means a heat sink (heat sink: - Zhao) or The frame with heat dissipation function, or the heat module, etc. Therefore, the heat generated by itself is overheated, and its own temperature rises. 持 持 ϊϊ ϊ ϊ ϊ 光学 光学 光学 光学 光学 光学 光学 光学 光学 光学 光学 光学 光学 光学 光学 光学 光学 光学 光学 光学 光学 光学 光学 。 。 。 In contact;; it is medium = the board between the thermal element and the heat sink ================================================================================== In the material of the heat sink recently, it has been mentioned that "the stone which is known and has a heat-dissipating effect (see, for example, Patent Documents 1 and 2): makes the stone K not iiiS. However, for the sake of the net, the body is formed into a heat sink (refer to the composition of (4) graphite film obtained by black lead powder such as stone black lead, _ into the inorganic substance 臈, etc.: The bending portion _softness is its special ir "" is attached to the electronic device 201007113. Patent Document 1: Japanese Patent Laid-Open No. Hei. No. 2003-168882 Patent Document 2: Japanese Patent Laid-Open Publication No. 2003-168882 Patent Document 3: JP-A-2005-229100 [Patent Document 4: JP-A-2008-78380] SUMMARY OF THE INVENTION (Problems to be Solved by the Invention) However, when a hot material is formed using a graphite material as a thermoelectric conductive layer, dust such as carbon powder is generated. When the φ person performs the work between cutting the scatter, the thermal element and the heat sink are attached to the electronic module mounted on the heat sink, which may cause the electric short 'again' according to the above-mentioned Patent Document 3, but the gold Gu Wei has a very good heat dissipation and is a whisker. The metal fiber, if the metal fiber module is 'can be short-circuited, such as electric short circuit, etc., I, etc. Therefore, the present invention provides a埶:Good: the effect rate of hair growth;; (Resolve the negative impact of nr adversely affecting the dust and other dust * The film immersion test results found that if the use of fiber =, the formation of the heat sink is easy to wait for 'based on the above The invention is a method for manufacturing a sheet. The method for manufacturing a sheet is to provide a heat sink by providing a heat dissipating sheet and a heat dissipating polymerized cellulose sheet which are impregnated with a polycondensation polymer. The present invention is 3 ft. The first method of making the first heat sink of the fiber includes the following steps: The first method of making the first heat sink of the fiber includes the following steps: The second method of forming the first scatter of the metal on the two sides of the poly-dip layer, the slab and the surface of the slab, and the vacuum evaporation method, the second method of forming the first scatter of the metal, comprising the following steps: producing a poly- turbid sheet; forming a metal _ The third method of printing or fixing the metal fine particles to fix the first heat sink of the fiber, or the surface of the first surface, comprises the following steps: separately producing a poly-infiltrated sheet; forming a y 1__ method in each of the immersed sheets Metal layer. The main and poly-polypyrrole of polypyrrole infiltrated tablets The metal sheet is bonded to form a heat sink. One side of the two sides, one of the two sides is made by the method of the π-step of the adhesive member (4), and the fiber is turned to produce the poly-dip. The cellulose sheet of copper chloride is in contact with the gas (the effect of the invention) φ and the first and second fins of the rtttf are included, and the infiltrated polycondensation group is included: ===The heat sink is used to form a polymer The π-light system 201007113 π f-based polymer, as will be described later, has a structure in which a double bond and a single bond are alternately arranged. The main body 2 is measured by the thermal property of the primary bond, that is, the V-pyromerization of the system U. The substance is considered to have a property of increasing the thermal conductivity in the direction along the main bond than in the direction of the main chain. Therefore, the anisotropy of the thermal characteristics of the π-common system is considered to be an effective contribution to the spread of the Moon Valley. t Effective cooling of the heat-generating element 'must make the heat-generating element and the heat-dissipating temperature often lower than the heat-generating element. Moreover, the wealth of the contact between the sheet or the heat sink is low, and the thermal resistance between the heat-generating component G and the heat sink is smaller, and the heat-generating element = as is well known, the heat resistance refers to the heat generation per unit time. The value U is borrowed, and the heat-generating element (high temperature portion) and the heat sink (low temperature portion) ρ:: 埶f are inverted, and the heat-generating element is obtained. In the case of heat, the unit area is obtained by the thermal energy between the heat generating element and the heat sink, and the temperature difference is divided. That is, the thermal resistance system represents the number of temperatures and the degree of conductivity. The greater the temperature, the more difficult the temperature is to conduct. The low temperature part of the heat sink surrounds the high temperature such as the heat generating element, and the surrounding case can also be used for thermal resistance. As will be described later, it is possible to calculate the temperature tolerance of the heat-generating element itself and the second heat sink, and have the following thermal characteristics: the temperature will be from the disk = the temperature = the more single: the larger the face Also: 201007113 Also, no treatment during processing: sr cutting and other work composition ====== green, (d) equivalent to a very thin metal layer tightly bonded to the polycrystalline film formed by vacuum distillation, so it can be composed === The second method of the gold=sheet, since the metal layer corresponding to the extremely thin layer can be closely connected to the combination === is formed by the printing technique, therefore, the third heat sink is made of the third heat sink of the present invention. The method, because the equivalent of the metal layer can be "joining ^ is a balance of power, shame, very thin - according to; bonding to the poly-smear slightly infiltrated sheet, can effectively reduce the thermal resistance. The stomach is made lighter by pushing the metal layer. The "," and "slots" are manufactured at low cost and are easy to achieve. [Embodiment] (Best form for carrying out the invention) These figures are the implementation forms of the HTML secrets (4). (A) and (8) illustrate a configuration of a first embodiment and a second heat sink 2〇1〇〇7113 2 according to an embodiment of the present invention, and a method of manufacturing the same. Fig. 1 (A) and (B) are vertical first heat sinks. And the schematic cross-sectional structure diagram of the main surface and the back surface of the heat sink. In order to reduce the thermal resistance between the heat generating component and the heat sink, it is necessary to fix the heat sink between the heat generating component and the heat sink or between the heat sink and the heat sink. Further, an adhesive member or the like is used to closely bond the heat sink to the heat generating member or to closely bond the heat sink to the heat sink. 〃 However, there is a case where electrical insulation is not required and the heat sink is inserted into the heat generating element and the heat sink. The heat sink is permanently bonded to the heat generating element and the heat sink, and only the pressure is applied. In this case, the heat sink is attached to the heat-dissipating component or the heat-dissipating component or the heat-sinking component. The electrical insulating film attached to the remaining film or the heat sink can also be appropriately set for electricity. Insulating member 4'. 70 pieces of secret, or the heat sink is closely bonded to the adhesive side of the heat sink, and the metal layer is tightly joined to the 18a* back surface (10), at least the main surface 18a and the back surface 18b are respectively reported, and the polypyrrole infiltration sheet 18 is also displayed. Example of forming metal layer 16 and Jinlang 2G and metal layer 2G
Q 所示為了形成本實施形態之第1散熱片種製造方法，如以下 第1方法，包含以下步驟： 使纖維素片浸潤過聚吡咯 時稱為第(1-14)步驟）； 〇物而製作聚吡咯浸潤片（以下有 於聚吡咯浸潤片至少其中— 下有時稱為第(1_1_2)步驟）。 用真空蒸鍍法形成金屬層（以 第1方法係包含以下步驟： 使纖維素片浸潤聚^比哈聚入 為第(1-2-1)步驟）； 口而製作聚吡咯浸潤片（以下也稱 於聚吡咯浸潤片之至少其中〜 /、 面將金屬微粒子印刷固定而形 201007113 成金屬層(以下也稱為第(1-2-2)步驟）。 第3方法包含以下步驟： 為第浸潤聚爾合物而製作聚轉賴（以下也稱 稱為^之⑽卜触電_綱層(以下也 ❹ ❹ 辛片、步驟及第(叫)步驟’係製作使纖維 ίίίϊ: ii而得到聚吡咯浸潤片之共通步驟，故以下 驟起刺。製作該聚°轉浸潤片之步驟，包含第(μ 切ϋ1)步驟’係使纖維素片含浸於氯化銅之步驟，以如下方 式實施。例如，將過渡作業用之厚度為 2mol/l之氯化銅水溶财 二Τ，次泡於浪度 藉此，實施第(2-1)步驟t '充刀心入慮紙_町啊）。 後述熱特性之評價’係對於在此説明之使用過 i 紙試作之聚鱗浸则為構成要素構^之散埶片i Ϊ紙=’ 片不限於利用過遽作業用厚度為〇.二之 轉緣极峨_料製作 吡咯ίίϊ步m含^有氯化銅之纖維素片接觸氣體狀態之 將已滲入氯化銅之濾紙罩蓋該、經氣化之ϋ 過聚轉聚合物之錢。 ☆域賊軸』 而、,ί it法中，第(1_1_2)步驟’係於該聚轉浸潤片至少立中- Ϊ 成金屬層之步驟。金屬層可適當選擇銅了I、 束過熱倾#金屬於真空中氣化， 圍不必為聚‘么片空蒸錄之範 設定適當的蒸鍍範圍。 一 可視政熱片利用形態 第2方法中’第〇2_2)步驟’係於該聚对浸潤片至少其中一 201007113 面，使用印刷技術將金屬微粒子印刷固定以實現。此時，與上述 (1-1-2)步驟之情形相同’印刷範圍不需為聚吡咯浸潤片之主面或背 面整面。可視散熱片之利用形態設定適當印刷範圍。 第3方法中，第(1-3-2)步驟’係藉由於該聚吡咯浸潤片至少其 中一面，使用電鍍液將金屬層電鐘實現。電鐘液可於例如蒸餾水 500ml (milliliter)加入硫酸銅i5〇g及硫酸2〇mi並攪拌，使硫酸錮 完全，而製備。將該電舰蚊為35t：，於聚 面及背面實施電鍍。實施電鍍時，係將聚吡咯浸潤片連接在陰極， 形成厚度0.02mm之銅層。 製作僅於聚〇比洛浸潤片之主面及背面其中之一面形成金屬層 而，之散熱片時，可將未形成金屬層側之面以高分子薄膜等絕緣 體薄膜覆蓋’並實施第(1-1-2)步驟、第(1-2-2)步驟及第(1-3-2)步驟。 同樣地，若以僅使聚吡咯浸潤片之主面及背面形成金屬層之 ，域露出之方式，將未形成金屬層之區域以高分子薄膜等絕緣體 薄膜覆蓋後，實施第(1·1·2)步驟、叫丨)步驟及第(1_3_2)步驟，則 可製作僅於必要的區域形成金屬層之散熱片。亦即，可視散埶片 利用之_，適當以第(1小2)步驟、第(1_2_2)步觀 g 設定形成金屬層之範圍。 圖1⑼所示實施形態之第2散熱片，係纖維素片浸潤過聚啦 咯聚合物得到之聚吡咯浸潤片26之主面26a及背面26b至少其中 =一面介由黏接構件黏接金屬片而構成。圖1(B)中，顯示聚吡咯 浸潤片26之主面26a介由黏接構件24黏接金屬片22,於背面2你 介由黏接構件28黏接金屬片30構成之散熱片，但是 22及金屬片30其中之一即可。 屬乃 黏接構件24及28 ’可射糊服遞AN(股)公㈣雙面谬 帶(產品編號祕50)或為CEMEDINE(股)公司製為丙稀酸改質石夕 酮樹脂的cemedine(產品編號SX720W)等利用。 、 <散熱片之熱性質之驗證> 參照圖2至® 5’說明本發明實施形態之散熱片之熱性質的驗 201007113 圖2顯示供說明本發明實施形態之散熱片之熱性質的驗證實 驗的圖式，係大概顯示發熱性元件40、電配線板42、散熱片44、 及熱沉46配置關係之剖面構造圖。 發熱性元件40使用1W之發光二極體。電配線板42使用公 知之萬用印刷基板。該萬用印刷基板，使用以玻璃環氧樹脂材料 形成之SUNHAYATO(股）公司製萬用印刷基板（型號： ICB_93SHG)。熱沉46使用Is製之厚度〇.5mm的銘板熱沉。 電配線板42、散熱片44、及熱沉46各裁切成60mm之正方 形’以圖2所示疊合。發熱性元件40，配置成在距離60mm之正 魯 方形的一邊為5mm之位置，其一邊與距垂直的2邊為等距離之位 置。 散熱片44，各使用本發明實施形態之第！散熱片、第2散熱 片’及比較用之石墨材構成之散熱片驗證各別的熱的特性。又， 為了比較，就不利用該等散熱片而直接將電配線板42與熱沉46 接觸之構成的情形的熱特性亦進行驗證。 散熱片之熱特性之評價，如圖2所示，利用觀測CH1-CH8 合計8處對於發熱性元件40開始通電開始時起算之溫度時間變化 行。cm、CH3、CH5及CH7 ’顯示電配線板42之設有發熱 性元件40側的表面的溫度測定點。又，CH2、CH4 ” ' 46之财電配線板42之側及減侧之表面之 如圖2所示，CH1係設定於發熱性元件4〇正 4點，CH3、CH5及CH7各係距發熱性元件4〇為15酿、 之位置所設定之溫度測定點。 件4〇正下方之溫度測定點，㈣、CH6及 件4〇為15mm、30麵及45mm之位置所設定之溫U點、。 表1齡-連串散熱片之熱舰評價中求出之大小 $ = 及Π所示縱攔t ’顯示散熱片44各使用第ι ^ 2 片44時之熱阻大小。 打縱攔中’顯不未設置散 2〇1〇〇7113In order to form the first heat sink type manufacturing method of the present embodiment, the following method includes the following steps: when the cellulose sheet is infiltrated into the polypyrrole, it is referred to as the step (1-14); A polypyrrole infiltrated sheet is produced (hereinafter, at least one of the polypyrrole infiltrated sheets is sometimes referred to as the first (1_1_2) step). The metal layer is formed by a vacuum evaporation method (the first method includes the following steps: infiltrating the cellulose sheet into the first step (1-2-1); and forming a polypyrrole infiltrated sheet (hereinafter) Also referred to as at least a portion of the polypyrrole infiltrated sheet, the metal particles are printed and fixed to form a metal layer of 201007113 (hereinafter also referred to as step (1-2-2). The third method comprises the following steps: Infiltrating the polymer to make a poly-turn (hereinafter also referred to as ^10 (10), electric shock _ _ layer (the following is also ❹ 辛 辛 辛, steps and the first step) made the fiber ίίίϊ: ii The common step of the polypyrrole infiltrated sheet, so the following step is performed. The step of preparing the poly-dip infiltrated sheet comprises the step of impregnating the cellulose sheet with copper chloride in the step (μ cut 1), and is carried out as follows For example, the copper chloride water having a thickness of 2 mol/l for the transition operation is dissolved in the water, and the second time is soaked in the wave, and the step (2-1) is carried out to carry out the process of filling the paper into the paper _ cho. The evaluation of the thermal characteristics described later is a component of the polyscale immersion test used in the paper described herein. ^ 之 埶 i = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = The filter paper which has been infiltrated with copper chloride covers the vaporized ϋ polymerized polymer. ☆ domain thief axis 』,, ί it method, the first (1_1_2) step is attached to the fusion infiltration The film is at least in the middle - Ϊ into a metal layer step. The metal layer can be appropriately selected from copper I, the beam is superheated and the metal is vaporized in a vacuum, and it is not necessary to set an appropriate evaporation range for the poly's film. A visual political sheet is obtained by using at least one of the 201007113 faces of the pair of infiltrated sheets in the second method of the second embodiment, using printing technology to print and fix the metal particles. In this case, the above (1) -1-2) The same procedure is used. 'The printing range does not need to be the main surface or the back surface of the polypyrrole infiltrated sheet. The appropriate printing range can be set according to the use form of the heat sink. In the third method, the first method (1-3-2) The step 'by using at least one of the polypyrrole infiltrated sheets, using a plating solution to metal The electric clock can be prepared by adding copper sulfate i5〇g and sulfuric acid 2〇mi to, for example, 500 ml of distilled water and stirring to make the barium sulfate complete. The electric mosquito is 35t: Electroplating is performed on the back side. When electroplating is performed, a polypyrrole infiltrated sheet is attached to the cathode to form a copper layer having a thickness of 0.02 mm. The metal layer is formed only on one of the main surface and the back surface of the polypyridyl infiltrated sheet. In the case of a sheet, the surface on the side where the metal layer is not formed may be covered with an insulating film such as a polymer film, and the steps (1-1-2), (1-2-2), and (1-3-2) may be carried out. In the same manner, when a metal layer is formed only on the main surface and the back surface of the polypyrrole infiltrated sheet, the region in which the metal layer is not formed is covered with an insulating film such as a polymer film, and then the first step is performed. ·1·2) Step, 丨) step and (1_3_2) step, it is possible to produce a heat sink in which a metal layer is formed only in a necessary region. That is, the range in which the metal layer is formed is appropriately set by the first (1 small 2) step and the (1_2_2) step g. The second heat sink of the embodiment shown in Fig. 1 (9) is a main surface 26a and a back surface 26b of the polypyrrole infiltration sheet 26 obtained by infiltrating the poly-lalocene polymer into the cellulose sheet, at least one of which is bonded to the metal sheet via the adhesive member. And constitute. In Fig. 1(B), the main surface 26a of the polypyrrole infiltrated sheet 26 is bonded to the metal sheet 22 via the bonding member 24, and the heat sink is formed by bonding the metal sheet 30 to the back surface 2 through the bonding member 28. One of 22 and the metal piece 30 can be used. The adhesive members 24 and 28' can be smear-coated with AN (shares) male (four) double-sided enamel tape (product number secret 50) or cemedine modified by CEMEDINE Co., Ltd. as acrylic acid modified sulphuric acid resin (Product No. SX720W) and other uses. <Verification of Thermal Properties of Heat Sink> A thermal property test of the heat sink according to the embodiment of the present invention will be described with reference to Figs. 2 to 5'. 201007113 Fig. 2 shows verification of the thermal properties of the heat sink according to the embodiment of the present invention. The experimental drawing schematically shows a cross-sectional structural view showing the arrangement relationship of the heat generating element 40, the electric wiring board 42, the heat sink 44, and the heat sink 46. The heat generating element 40 uses a 1 W light emitting diode. The electric wiring board 42 uses a known universal printed circuit board. For the versatile printed circuit board, a universal printed circuit board (Model: ICB_93SHG) manufactured by SUNHAYATO Co., Ltd., which is formed of a glass epoxy resin material, is used. The heat sink 46 uses a nameplate heat sink of thickness 〇5 mm made of Is. The electric wiring board 42, the heat sink 44, and the heat sink 46 are each cut into a square shape of 60 mm, which is superposed as shown in Fig. 2. The heat generating element 40 is disposed at a position of 5 mm from one side of a square of 60 mm, and one side thereof is equidistant from two sides perpendicular to each other. The fins 44 are each used in the embodiment of the present invention! The fins composed of the fins, the second fins, and the comparative graphite material verify the respective thermal characteristics. Moreover, for comparison, the thermal characteristics of the case where the electric wiring board 42 and the heat sink 46 were directly contacted without using these heat sinks were also verified. As a result of evaluating the thermal characteristics of the heat sink, as shown in Fig. 2, the temperature time change from the start of energization of the heat generating element 40 at eight points in the total of CH1-CH8 is observed. The cm, CH3, CH5, and CH7' indicate the temperature measurement points of the surface of the electric wiring board 42 on the side where the heat generating element 40 is provided. Further, as shown in FIG. 2 on the side of the financial circuit board 42 and the side of the subtraction side of CH2, CH4"' 46, CH1 is set at 4 points of the heat generating element 4, and the distance between CH3, CH5, and CH7 is different. The temperature measurement point set by the position of the 15th material is the temperature measurement point set at the position of the 15th, and the temperature measurement point immediately below the 4th, (4), CH6 and 4〇 is the temperature U point set at the position of 15mm, 30th surface and 45mm, Table 1 Age - Series of heat sinks in the heat ship evaluation of the size of the $ = and Π shows the vertical block t ' shows the heat sink 44 each use the first ι ^ 2 piece 44 when the thermal resistance size. 'The display is not set to 2〇1〇〇7113
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攔it A〜H麻之橫攔中，各顯示以T 2朗之雜値。A :i挪相===之Block the A ~ H hemp in the cross, each display with T 2 Lang miscellaneous. A : i phase shift ===
$値，F欄顯示CH6與相接於挪之空間之間之】，= ! CH7與相接於CH7之郎之間 ^ Z ❹ 接於CH8之空間之間之熱_。 賴不CH8與相 -----間變4匕。杉 有刻度，縱軸係溫度以。C刻度顯示刻度。…勺平促顯 熱片。在此’與上述第i散熱片之情形同樣，^^ 之萬用印刷基板與散制44直接緊密接合，== 線板^ 熱沉與散熱片44直接緊密接合。 馮…、’儿46之鋁製 如圖3所示，設定於發熱性元件4〇正下 之溫度魏，於職_酿雜的贱二輔 =顯示本發明之實施形態之第丨散熱片作為散埶 ，CH1〜CH8之溫度之時間變化。橫軸之 分為，用 岐，縱軸係溫度以。C刻度顯示刻度。 乂刀為早位顯不 12 201007113 ίί c:CHrjf達5坑並成為熱平衡狀態。溫度測 疋點CH2〜CH8，溫度比起cm約低吹。 如表1之_卿’本發明實郷態之第i散 片44使用時，熱阻値約為212<t/w〜37 3<t/w。‘、為散… 44夕本發明之實施形態之第1散熱片作為散熱片 =^情形比較，散熱片44使用專利文獻3揭示之將習知3=$値, F column shows CH6 and the space between the adjacent space, = ! CH7 is connected to the CH7 lang ^ Z 热 The heat _ between the space of CH8. Lai does not CH8 and phase ----- change 4匕. The cedar has a scale, and the vertical axis is the temperature. The C scale shows the scale. ...spoon to promote the hot film. Here, as in the case of the above-described ith heat sink, the versatile printed substrate is directly and tightly bonded to the bulk 44, and == the heat sink and the heat sink 44 are directly in close contact. Feng..., 'Aluminum 46' is made of aluminum, as shown in Fig. 3, and is set to the temperature below the heat-generating element 4〇, and is used to display the second heat sink of the embodiment of the present invention. Diffusion, the time change of the temperature of CH1 ~ CH8. The horizontal axis is divided into 岐, and the vertical axis is the temperature. The C scale shows the scale. The file is not early. 12 201007113 ίί c: CHrjf reaches 5 pits and becomes in thermal equilibrium. The temperature is measured at points CH2 to CH8, and the temperature is lower than that of cm. When the ith sheet 44 of the present invention is used in the present invention, the thermal resistance 値 is about 212 < t / w 〜 37 3 < t / w. ‘, 散散... The first heat sink of the embodiment of the present invention is used as a heat sink = ^. In comparison, the heat sink 44 is disclosed in Patent Document 3;
3 ΐί並—體化構成之雜散熱片（JAPAN3 ΐί and body composition of the heat sink (JAPAN
irCH8之溫度之時間變化。該散熱片之厚度為㈣酿。L ❻ ❹ 之松軸將時咖分為單偏，雜將溫度机為刻度顯 >y% ° 如圖4所示，設定於發熱性元件4〇正下方之溫度測定點chi 之溫度變化’ ^開始對發熱性元件發光二極體通電3分鐘後到達 49.1 C。並且最終到it 57.5°c成為熱平衡狀態。溫度 〜CH8，溫度比起CH1約低l5°C〜18t：。 β^ 社如ί if所示縱攔所示，石墨片以金屬線構成之網狀體夾 持而-體化構成之散熱片作為散熱片44使 曹⑽〜ήταν。 …丨偃扪曷 圖5顯示不使用散熱片44而直接使電配線板42與執沉4 觸之構成時’ CH1〜⑽之溫度之時間變化。橫軸顯示時間 單位顯示刻度，縱軸將溫度以。C為刻度顯示。 ” 如圖5所示，設定於發熱性元件4〇正下方之溫度測定點⑽ 中之溫度變化，於開始對發熱性元件發光二極體通電3分鐘後， 到達93.6〇C。又，可觀察到溫度隨著時間有上升的傾向。 定點CH2〜CH8，溫度比起CH1約低60。(：。 溫度測定點CH2及CH4〜CH8中，給予溫度變化之曲線極為 接近’圖5中，以2條虛線顯不之間’給予CH2及CH4〜ch8之 溫度變化的曲線一致。因此，圖5中省略提供於CH2及CH4〜CH8 之溫度變化各別的曲線。 上述圖3及圖4所示使用散熱片時’設定於發熱性元件4〇正 13 201007113 下方之溫度败點cm之溫度變化，停留在机至6g 相對於此，不使用圖5所示散熱片時， ，，， 又 。，如表1之111縱欄所示，不利用散熱片44時，埶The time of the temperature of irCH8 changes. The thickness of the heat sink is (four) brewed. L ❻ ❹ The loose shaft divides the coffee into a single offset, and the temperature is the scale of the temperature. y% ° As shown in Fig. 4, the temperature change of the temperature measurement point chi is set directly below the heat generating element 4〇' ^ Start energizing the light-emitting element LEDs for 3 minutes and reach 49.1 C. And eventually it became a thermal equilibrium state at it 57.5 °c. Temperature ~CH8, the temperature is about 15 ° C ~ 18t lower than CH1. As shown by the if if shown in the column, the graphite sheet is sandwiched by a mesh body composed of metal wires, and the heat sink formed as a heat sink 44 is used to make Ca(10)~ήταν. Fig. 5 shows the time change of the temperature of 'CH1 to (10) when the electric wiring board 42 and the sinker 4 are directly touched without using the heat sink 44. The horizontal axis shows the time unit and the vertical axis displays the temperature. C is the scale display. As shown in Fig. 5, the temperature change in the temperature measurement point (10) set immediately below the heat generating element 4〇 reaches 93.6 〇C after the energization of the heat generating element light-emitting diode is started for 3 minutes. The temperature tends to rise with time. The temperature is fixed at CH2 to CH8, which is about 60 lower than that of CH1. (: The temperature measurement points CH2 and CH4 to CH8 give the temperature change curve very close to 'Fig. 5, to 2 The curves showing the temperature changes of CH2 and CH4 to ch8 are identical between the dotted lines. Therefore, the curves for the temperature changes provided by CH2 and CH4 to CH8 are omitted in Fig. 5. The above-mentioned Figs. 3 and 4 are used. When the heat sink is set, the temperature change of the temperature at the lower point of the heat-generating element 4〇正13 201007113 is stopped, and it stays at the machine to 6g. When the heat sink shown in Fig. 5 is not used, As shown in the 111 column of Table 1, when the heat sink 44 is not used,
G 另-方面，確認藉由利用本發曰月之散熱 優異之將習知石墨;UX金屬線構成之網狀體夾持並 散熱片達成同等或更高的熱發散效果。此外，本發明之散^， J有不會發生對於電子模組造成不梅彡響之碳粉特塵的優異特 <構成散熱片之聚合物之選擇> 、本發明之散熱片_浸潤過聚轉聚合物之聚对浸潤 成。但是令比嘻以外也存在能利用之聚合物(polymer)。例如， 可從聚噻吩(polythiophene)、聚苯胺(p〇lyaniline)，及聚亞苯基亞乙 ❹ 烯基(polyphenylene-vinylen# π共軛系聚合物之中適當選 用。 π共輛系聚合物’具有為雙鍵與單鍵交替排列之構造的骨格 (主鍵）。π共輛系聚合物’由於該主鏈產生熱性質之異向性 具備比起沿著該主鏈為垂直之方向，沿著該主鏈之方向的執傳導 率較大之性質。因此，若於平行於本發明之散熱片表面之g向配 ^⑽、聚合物使朝向主鏈之方向，據認為π共辩、聚合物會 有效貝獻於展現為本發明之散熱片特徵之平行於散熱片表面之熱 擴散率αρ大於對於垂直方向之熱擴散率％之熱性質二 … 14 201007113 【圖式簡單說明】 圖1(A)、(Β)顯示本發明實施形態之散熱 面之方向_之概略剖面構造圖，⑷為第〗散^ 散熱片之概略剖面構造圖。 ）為第2 驗之圖 ^ 2顯不供說明本發明實施形態之散熱片之熱性質之驗讓實 ，3顯2本發明實施形態之第丨散熱片作為散熱 〜CH8之溫度之時間變化。 了 Qjl Ο 作4顯不將習知之石墨片以金屬線構狀網狀體夾持而〜 構成之散气片作為散熱片時，CH1〜CH8之溫度之時間^體 圖5 __不伽散刻而直 成時，CH1〜CH8之溫度之時間變化。 兴…％接觸樽 【主要元件符號說明】 16、20〜金屬層 18、26〜聚nb咯浸潤片 18a、26a〜聚吡咯浸潤片之主面 18b、26b〜聚吡咯浸潤片之背面 22、30〜金屬片 24、28〜黏接構件 40〜發熱性元件 42〜電配線板 44〜散熱片 46〜熱沉G In other respects, it is confirmed that by using the heat dissipation of the present invention, the conventional graphite is used; the mesh body composed of the UX metal wire is sandwiched and the heat sink achieves the same or higher heat dissipation effect. In addition, the present invention has an excellent feature of the toner which does not cause squeaking of the electronic module, <selection of the polymer constituting the heat sink>, the heat sink of the present invention_infiltration The poly-polymerized polymer is infiltrated into a polymer. However, there are also polymers that can be used in addition to 嘻. For example, it can be suitably selected from polythiophene, polyphenylene (p〇lyaniline), and polyphenylene-vinylen# π conjugated polymer. π-common polymer 'The skeleton (primary key) having a structure in which the double bond and the single bond are alternately arranged. The π-common polymer' has an anisotropic property due to the thermal property of the main chain and is perpendicular to the direction along the main chain. The nature of the conduction in the direction of the main chain is large. Therefore, if the g-direction (10) parallel to the surface of the fin of the present invention and the polymer are oriented toward the main chain, it is considered that π is synergistic and polymerized. The material will be effectively presented as a heat sink characteristic of the present invention. The thermal diffusivity αρ parallel to the surface of the heat sink is greater than the thermal property of the thermal diffusivity % in the vertical direction... 14 201007113 [Simplified Schematic] Figure 1 A) and (Β) show a schematic cross-sectional structural view of the direction of the heat dissipating surface according to the embodiment of the present invention, and (4) is a schematic cross-sectional structural view of the first heat dissipating fin. The second drawing is shown in Fig. 2 Thermal properties of the heat sink of the embodiment of the present invention The first heat sink of the embodiment of the present invention is used as the heat dissipation time of the heat dissipation ~CH8. Qjl Ο 4 shows that the conventional graphite sheet is sandwiched by a metal wire mesh structure and the temperature of CH1 to CH8 is the same as that of the heat dissipating film. Figure 5 __Do not scatter When it is straightforward, the temperature of CH1 to CH8 changes with time. ......% contact 樽 [Main component symbol description] 16, 20~ metal layer 18, 26~ poly nb swelled sheet 18a, 26a~ polypyrrole infiltrated sheet main surface 18b, 26b~ polypyrrole infiltrated sheet back 22, 30 - metal piece 24, 28 - bonding member 40 - heat generating element 42 - electric wiring board 44 - heat sink 46 ~ heat sink