TW200950686A - Socket guide, socket unit, electronic component test apparatus, and method of controlling socket temperature - Google Patents

Abstract

A socket guide (90) comprises a socket guide main body (91) in contact with a socket (80) and a heat source portion (93) capable of heating or cooling the socket guide main body (91). In the socket guide main body (91), air introduction channels (92a) for introducing the air into the socket (80) from outside and an air exhaust channel (92b) for exhausting the air outside from the socket (80) are formed as air passages. The socket (80) comprises a plurality of contact pins (82), a socket main body (81) for supporting the contact pins (82), and a floating plate (83) provided above the main body (81) of the socket. In the socket main body (81), air passages (84) which communicate with the air introduction channels (92a) formed in the main body (91) of the socket guide are formed.

Description

200950686 VI. Description of the Invention: The present invention relates to a plug-in socket test device, and the present invention relates to an electronic component test lead-in device, a plug-in base unit, and the above-mentioned electronic component socket Temperature control method. [Prior Art] In the manufacturing process of an IC component, an electronic component test device is used to test the performance or function of the finally manufactured electronic component. Generally, the electronic component testing device includes a tester body, a processor, and a test head, and a socket for mounting the tested lc component is provided on the test head. In the above electronic component testing device, in the state in which the component is mounted on the socket, a test signal is supplied from the tester body to the test head, and the test signal is applied from the socket to the ic & The response signal read by the Ic component is transmitted from the test: head to the tester body, thereby testing the electrical characteristics of the component. ❹ I In the test of the above-mentioned core parts, the thermal stress of high temperature or low temperature is often applied to the 1C component for testing. For example, a method of applying thermal stress to the element is a method of heating or cooling the 1C element before it is carried to the test head. In this case, it is preferable to heat or cool the IC component to be tested in advance while heating or cooling the socket to which the 1C component to be tested is mounted. If there is a temperature difference between the tested 1C component and the socket, when the tested Ic component is mounted on the socket, heat conduction is generated between the IC component to be tested and the socket, which may be applied to the The thermal stress of the IC component of the test is weakened.

2192-10325-PF 200950686 The method of heating the IC socket is a method of heating the socket holder that is connected to the socket by the heater as shown in Patent Document i, and as shown in Patent Document 2 'Method of flowing heated gas into the socket. [Problem to be Solved by the Invention] Since the material of the socket body is usually a plastic resin having low heat conductivity, such as the patent document, for example, the patent document As shown in Fig. 1, heating the socket guide only by the heater does not efficiently heat the socket, and it is difficult to bring the socket to a desired temperature. On the other hand, in the method of Patent Document 2, in order to supply the heating gas, it is necessary to additionally provide an air heater externally. The distance between the external air heater and the docking station is usually long, so that the temperature of the heated gas drops during the flow of the gas, making it impossible to obtain the desired temperature at the docking station. In view of the above-mentioned realities, it is an object of the present invention to provide a temperature control for a docking station guide, a docking station unit, an electronic component testing device, and a docking station that can effectively control a docking station at a desired temperature. method. Means for Solving the Problems In order to achieve the above object, first, the present invention provides a socket guide member which is disposed adjacent to a socket having a contact terminal which can be in contact with an external terminal of an electronic component to be tested. Leading? I guiding the component of the tested 2 sub-element such that the tested electronic component is mounted at an adjacent position of the socket, and is characterized by being capable of heating the plug-in guide or

2192-10325-PF 4 200950686 Cooling heat source; and forming a flow path capable of supplying fluid to the docking station (Invention 1). The fluid may be, for example, a gas such as air, or may be a liquid such as water. According to the above invention (Invention 1), first, the socket guide is heated or cooled to a desired temperature by a heat source. Since the socket guide and the socket are adjacent, the socket is also heated or cooled by heat conduction from the heated or cooled socket guide. "Second, by circulating fluid to the heat source The flow path of the heated or cooled plug-in guide, the fluid is also heated or cooled 'the fluid is supplied to the plug-in base ^the fluid is heated or cooled because the plug-in guide and the docking seat abut The temperature is directly supplied to the socket, thereby heating or cooling the socket to a desired temperature. As described above, according to the above invention (Invention 1), it is possible to efficiently control the docking station at a desired temperature. Furthermore, since the fluid is heated or cooled by the f-mounting guide, it is not necessary to previously adjust the temperature of the fluid supplied to the plug-in guide member. 'It is not necessary to be different from the plug-in guide. Other heat sources. However, it is also within the scope of the invention to provide such other heat sources. In the above invention (invention), it is preferred that one end of the flow path is a fluid inlet, and the other end of the stomach/gut path is a fluid outlet opening to the socket (Invention 2) » In the above invention (Invention η In this case, it is preferable to form a guide path for guiding the fluid from the outside to the socket, and a discharge path for transferring the fluid from the socket to the outside as the flow path (Invention 3).

/ In the above invention (Invention 2), it is preferred that the flow path is a snake so that the heat source causes the flow path to reach the desired 2192-10325-PF 5 200950686 4 /IV Degree of Temperature Second, the present invention provides a docking station unit, comprising: a socket having a contact terminal that can be in contact with an external terminal of the electronic component to be tested; and the above-described plug-in holder (Invention i ~4). In the above invention (Day 5) towel is preferred: the socket includes a connecting material, a socket body that supports the connecting terminal, and the socket body is formed on the socket body The flow path of the lead is connected, and the fluid can be supplied to the flow path of the connection terminal (Invention 6). In the above invention (Invention 6), it is preferable that the socket has a floating member on the body of the socket, which determines the position of the electronic component to be tested and supports the electronic component to be tested, and the connection terminal The slidable manner is opened at a side of the flow path formed in the plug-in body toward the gap between the plug-in body and the floating member (Invention 7). A third aspect of the present invention provides an electronic component testing apparatus characterized by comprising: the above-described plug holder guide provided on a test head (Invention 1 to; and a fluid capable of supplying a fluid to a flow path of the plug holder) Supply device (Invention 8). Fourth, the present invention provides an electronic component testing device, comprising: the above-mentioned plug-in base unit (Inventions 5 to 7) disposed on a test head; and capable of supplying fluid to the socket A fluid supply device for the flow path of the plug-in holder in the unit (Invention 9). In the above invention (Inventions 8, 9), the fluid supply device does not have a heat source (Invention 1). The invention provides a temperature control method for the socket, and 2192-10325-PF - . 200950686 and the temperature control method of the socket of the contact terminal of the contact end of the 4 electronic component to be tested, the pot 4 is the main material —# The eight features are: using the above-described plug-in guide bow member (Inventions 1 to 4), the sonar temple 1 is supplied to the flow path of the plug-in guide member 11). The first invention provides a temperature control method for a socket, which is a temperature control method for a socket having a contact terminal which can be in contact with a terminal of a component to be tested, characterized in that the above-mentioned socket unit is used.

5 to 7), a fluid is supplied to the flow path of the plug-in guide in the plug-in unit (Invention 12). In the above invention (b) 12, it is also possible to apply heat to the fluid supplied to the yoke of the socket holder (Invention 13). EFFECT OF THE INVENTION According to the present invention, the docking station can be efficiently controlled at a desired temperature. Furthermore, the fluid supply means for supplying fluid to the socket holder does not need to be provided with other heat sources than the heat source of the socket holder. [Embodiment] Hereinafter, embodiments of the present invention will be described in detail based on the drawings. 1 is a plan view showing a processor of an embodiment of the present invention, and FIG. 2 is a cross-sectional view showing a side portion of a processor of the same embodiment (a cross-sectional view taken in the middle of FIG. 1). A plan sectional view of the socket unit in the component testing device is shown in a side view of the socket unit of the electronic component testing device. Furthermore, an example of the type of the IC component to be tested shown in Fig. 4 is that the external terminal has a BGA package or a csp (chip size package) package.

2192-10325-PF 7 200950686 External terminals are available with lead SOP (small outline, etc., but the invention is not limited thereto, such as QFP (quad flat package) package).

As shown in Figures 1 and 2, this 眚 眚 刑 能 能 能 能 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子. The test head 3 and the tester 2 are connected by the electric wire 21 by the test head 300 and the tester 20. Further, the transport handler processor H) supplies the pre-test IC member on the supply tray stored in the disc storage 4G1, and presses it on the socket 80 of the contact portion 3G1 of the test head coffee by the test. After the test of the head 300 and the electric 绫Z1 仃I c , , , , , , , , 依据 依据 依据 依据 依据 依据 依据 依据 依据 依据 依据 依据 依据 依据 依据 依据 依据 依据 依据 依据 依据 依据 依据 依据 依据 依据 依据 依据 依据 依据 依据 依据 依据 依据on. The processor 10 is mainly composed of a measurement #q η τ field determination 30, a 1C element storage unit 40, a loading unit 50, and an unloading unit 60. The IC component accommodating part 40, in *a, 糸 is the IC component before and after the test, and mainly includes: the storage 401 for the supply tray, the storage 401 for the classification disk, the storage for the classification disk 4, 2, and the empty disk Warehousing 403, and tray transporting device 4〇4. In the supply tray, the storage tray is stored in a stack; in the middle, 4, a plurality of supply trays carrying the plurality of 1C components before the test are accumulated, and in the present embodiment, as shown in Fig. 1, two are provided. The supply tray is stored 401. The discs for the sorting discs are 40? I# & The discs containing the plural number of the complex IC components after the test are accumulated, and in the implementation of the sound, the four discs are provided as shown in Fig. 1. Use the warehouse to reserve 402. By setting up 4 sorting discs with warehousing 402, it is possible to accept τ according to the test | _ ° Divide IC components into up to 4 categories for storage. .

2192-10325-PF 200950686 Two-disc storage 403 for accommodating all the pre-test 1C elements 20 loaded in the supply tray storage unit 供应1 are supplied to the test unit 30. Moreover, the number of each of the storages 401 to 403 can be appropriately set as needed. In the first drawing, the disk transport device 404' is a transport device that can move in the X-axis and z-axis directions, and mainly includes an X-axis direction track 4〇4a, a movable head portion 404b, and four adsorption pads 404c, and the operation range thereof is It includes a range of storage trays 4, 1 part of the classification tray storage 402, and an empty tray storage area 4〇3. In the disk transport device 404, the X-axis direction trajectory 404a fixed to the base 12 of the processor 1 unilaterally supports the movable head portion 404b movable in the x-axis direction, and the movable head portion 4 〇 4b includes ζ An axial direction actuator (not shown) and four suction pads 4〇4c at the front end. The disk transport device 404 adsorbs the empty disk that is kept empty in the supply tray storage 401 by the adsorption pad 404c, and is raised by the x-axis actuator, and the movable head 40 is in the z-axis direction. The rail 4〇4a slides and is transported to the supply tray for storage 4〇1. Similarly, in the storage tray storage 4〇2, when the knife disc is full of the tested Ic component, the empty disc is adsorbed and maintained from the empty disc storage 403, and is raised by the actuator in the z-axis direction. The movable heads 卩4〇4b are slid on the X-axis direction rail 404a, and are transported to the sorting tray storage 402. The loading unit 50 is a portion for feeding the Ic element before the test from the supply/disassembly 4 of the IC element storage unit 40 to the test unit, and mainly includes: the loading unit transport device 501, and two manned persons. S buffer section 5G2 (in Figure 1

2192-10325-PF 9 200950686

In the negative direction of the X-axis, the heating plate 503 D J is inserted into the unit transporting device 5〇1' to connect the IC component housing portion 4. The IC element on the supply tray of the supply storage 4G1 moves to the heating plate 5〇3, and simultaneously moves the IC element on the heating plate 503 to the cutting buffer portion 5〇2, mainly including the γ-axis direction track 501a, The x-axis direction rail 5〇ib, the movable head unit 5G1C, and the adsorption unit 5Gld. The loading range of the loading unit 5 is indicated by the range of the supply tray storage 401, the heating plate 5〇3, and the two loading buffer units 502. As shown in Fig. 1, the "loading unit transporting means 501" and the two γ-axis direction rails 501a are fixed to the base 12 of the processor 1A, and the X-axis direction rails 501b are interposed therebetween. Slide in the γ axis direction. a yaw-axis direction rail 5 (Ub that supports a movable head portion 501c having a z-axis direction actuator (not shown) so as to be slidable in the X-axis direction. As shown in Fig. 2, the movable head 5 lc is The adsorption unit 5〇ld having the adsorption pad 501e at the lower end portion is driven by the z-direction actuator, so that the four adsorption units 501d can be independently lowered in the z-axis direction. The portion 501d is coupled to a negative pressure source (not shown) to suck air from the adsorption pad 501e to generate a negative pressure, whereby the π element can be adsorbed and maintained, and by stopping the suction of air from the adsorption pad 5〇16, The IC element can be released. The heating plate 503 is a heating source for applying a predetermined heat pressure to the Ic element, for example, a metal heat transfer plate having a heat source (not shown) at the lower portion. The upper side of the 5 0 3 is formed to withstand the 丨c component

The plurality of recesses 503ae dan s of 2192-10325-PF 200950686 can replace the heat source with a cooling source. The loading buffer unit 5m 廿 γ is a device for moving the 1C element in the loading unit from the loading unit and transporting the test unit to and from the test unit, and the device is 502b. Mainly includes: buffer table stealing and X-axis direction, rushing 5° 2a, one side of the X-axis direction actuator 502b fixed on the base of the processor 10, the end of the arm is holding k ❿ 支 ° branch # ' as the first As shown in the figure, on the upper surface side of the buffer table 5〇2a, a flat rectangular recess 502c for receiving a 1C element is formed by 4 m. 1 ～ The 1C component before the test can be sent from the county disk storage 401 to the heating plate 503 by the manned transport device 501, and after the heating plate 503 is heated to a predetermined temperature, the strict 4 #再再-人The loading unit transport unit 501 is sent to the loading buffer unit 5〇2', and then the loading buffer unit 502 is introduced into the test unit 3〇. The test 胄 30' is a portion for electrically contacting the external terminal (solder ball) of the κ element to be tested with the contact pin 82 of the socket 8{) of the contact portion 30 to perform the test. The test unit 3G mainly includes a test unit transport device 31A. The test unit transport device 310 is a device that moves the 1C element between the loading balance unit 502, the unloading buffer unit 602, and the test head 300.

The test unit transports the device 31. The two X-axis direction supporting members 311a' slidable in the direction of the ¥ axis are supported by the base 12 fixed to the processor 10.

The upper two Y-axis directions 311. The movable head portion 312 is a support portion of the movable portion 312 of the central portion of the support member #311a in each X-axis direction, and includes a loading buffer portion 5〇2 and an unloading buffer portion 6〇2, and a test. The range of the head 300. Furthermore, each branch is in a group of γ-axis orbits.

2192-10325-PF 11 200950686 311 simultaneous action Ή.9, in the X-axis direction support element "la movable #, ', control in a manner that does not interfere with each other." Each movable head 312a Gan The contact arm 315... has four contact arms 315 in the lower part. The four touches 5 positive mounting systems correspond to the plug sockets (4), and the contact arms are provided with the adsorption portion 317 at the lower end portion as shown in FIG. Each of the adsorption units 317 and the anodic, sr θ, and 3 Π are attracted to the air to generate a negative pressure source (not shown), and are adsorbed. Furthermore, & Ic element, . 'by stopping the emptying of the 1C element from the adsorption unit 3丨7 and to the process gas, the 头部 can be released by the movable head 312

The element in the Y-axis direction and I b will maintain the "solid 1C 300 contact portion. n move" can be pressed against the test head test head _ contact portion 301, in the plug socket 80, 4 sockets There are four, and the M n lanthanum is arranged to coincide with the configuration of the contact arm of the movable head 312 of the test portion transport device η " 310 ^ ^ 啁 啁 315 . In addition, the insertion of the seven-person docking station 80 additionally includes the details from the early 7^7 0 as will be described later. As shown in Fig. 2, on the base 12 of the test portion 3, the contact point of the test head 300 is 〇°P 11 ', and the contact portion 301 of the test head 300 faces the opening. Its sigh is set to be able to press and align the 1C component. = 4 pre-tests placed on the buffer section 5.2

Two =: delivery device 31. When the four contacts of the contact portion J are tested, the buffer portion 602 is again moved by the test portion transport device 310, and then sent to the unloading portion buffer portion 602.

2192-1G325-PF 12 200950686 Uninstall. P 60 is to send the X Α...H"0 of the j IC component accommodating portion 40 after the test to the fini Q. The knives mainly include: the unloading portion of the shoe but the buffer portion 6〇 2 2 devices.) The unloading buffer unit 6G2 in the positive direction of the x-axis is the operating range of the ic 310, and the operating range of the P-loading door unloading unit transport device 601 is ❿ 动器 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . On the upper surface side of the buffer table 602a, four recesses are used to receive the ic element. The unloading section transport device (4) will be unloaded.

The device is moved to the device for classifying the IC ^ A button on the magazine for the classification disc, and the electric device includes: the Y-axis direction track 601 fini the axis direction track 6 〇, the movable head ε, the adsorption portion 601d . The unloading portion transports the range of the actuator 601, and includes two unloading buffer portions 6G2 and a range for classifying discs. As shown in Fig. 1, the two rails 601a of the unloading unit transport unit 6〇1 are fixed to the base 12 of the processor 1〇, and the X-axis direction rails 602b are placed so that the eight-axis system can be placed on the shaft. Slide in the direction. The X-axis direction rail 602b supports a movable head portion 601c having a Z-axis direction actuator (not shown) so as to be slidable in the x-axis direction. a movable head 邛 601c' has four adsorption portions 610 d having adsorption pads at the lower end portion, and by arranging the Z-axis side toward the actuators (four), the four adsorption portions 601d can be independently placed in the ζ Lifting in the direction of the axis.

2192-10325-PF 13 200950686

The post-test IC element mounted on the unloading buffer unit 602 is discharged from the test unit 30 to the unloading unit 60', and is then discharged from the loading buffer unit 6〇2 to the sorting tray by the unloading unit transport unit 6〇1. Warehouse 4〇2 classification disk. P Here, the plug-in unit 7〇 of the present embodiment will be described in detail. The socket unit 70' shown in Figures 3 and 4 is disposed on the contact portion 301 of the test head 3'' shown in Fig. 2' including: the socket 8〇, and the socket 8〇 Seat guide 90. As shown in Fig. 4, the socket 80 includes a plurality of contact pins 82, a socket body 81 for supporting the contact pins 82, and a floating plate 83 provided on the socket body 81. The central portion of the socket body 81 is a concave portion, and the periphery thereof is a convex portion. The arrangement of the plurality of contact pins H and the solder balls of the κ element is disposed in the concave portion of the socket body 81. The floating plate 83' is provided in a floating shape by a resilient member (not shown) in the recessed portion of the socket body 81. The floating plate 83 is provided with a plurality of holes through which the contact pins 82 are slid. The floating plate 83 described above fixes and supports the ic element at a predetermined position, and 'prevents the contact pin 82 from falling. As shown in Fig. 4, there is a gap between the upper surface of the recessed portion of the socket body 81 and the bottom surface of the floating phase 83, and the base of the contact pin 82 exists in the gap on the socket body 81 to form a fluid. The flow of the gas = cold ". As shown in the figure, one end of the gas flow path 84 is opened, and the end of the convex portion of the path body 81 is a gas inlet 84i. Further, the other end of the gas flow path 84 faces the gap between the upper surface of the recessed portion of the socket body 81 and the bottom surface of the floating plate 83, which is a gas outlet 842.

2192-10325-PF 14 200950686 The socket guide 90 is used to guide the contact arm 315 of the tested Ic component 2 so that the test IC component 2 is mounted at a specific position of the socket 8,, such as the third and 4, which includes: a socket guide body 91 disposed around the socket 8; a contact with the socket guide body 91, and capable of heating or cooling the socket guide body 91. Heat source portion 93. The central portion of the socket guide body 91 has a rectangular opening, and the contact pin 82 of the socket 80 is exposed at this opening. The socket guide body ❹91 is preferably made of a material having good thermal conductivity, for example, a metal such as an aluminum alloy. As shown in Fig. 4, the socket holder 9 is brought into contact with the upper surface of the insertion portion of the socket holder body 91 in the vicinity of the opening portion of the socket holder body 91. The socket guide body 91 is formed by introducing a gas from the outside into the gas introduction path of the socket 80, and discharging the gas from the socket 8 to the external gas discharge path 92b as a gas fluid. Flow path. One end of the gas introduction path 92a is opened at the outer periphery of the plug holder main body ,, and this opening is a gas inlet 921. At this gas inlet 921, a pipe connected to a gas supply device (not shown) is connected. The other end of the gas introduction path 92a is opened below the opening of the insertion stand guide body 91, and this end is a gas outlet 922. The gas outlet 922 formed in the gas introduction path 92a of the plug-in holder main body 91 is formed at a position corresponding to the gas inlet 841 of the gas flow path 84 of the plug-in holder main body 81, whereby the socket The gas introduction path 92a of the guide body 91 and the gas flow path 84 of the insertion body 81. Furthermore, the gas of this embodiment

The introduction path 92a' is formed as two slits 2192-10325-PF 15 200950686 which sandwich the socket holder body 91 and which are meandering (as shown in Fig. 3). The length of the body introduction path 92a can be "the end of the so-called double-long sound line gas discharge path 92b" by making the air path "snake like this" as compared with the case where the gas introduction path 92a is linear. Opening at the inner circumference of the socket guide ^ is the gas inlet of the ice, and the other is ... "the end of the gas discharge path 92b is open at the outer periphery of the socket guide body 91, and the end outlet is similar . Furthermore, in the present embodiment, the gas discharge path is moved to cool the opening portion of the socket guide body 91, respectively.

(as shown in Figure 3). In the present embodiment, the gas inlet 923 of the gas discharge path 92b and the gas outlet 922 of the gas introduction 4 92a are respectively located at or adjacent to the edge of the opening of the plug-in holder main body 91. The gas is supplied from the gas supply means (4) through the piping to the gas inlet 921. of the gas passage 92a. In the present embodiment, the gas supply does not have a heat source for heating or cooling the gas, but supplies a gas at a normal temperature.

The source portion 93 has, for example, a heater or a Pittier device, and a temperature sensor can be provided as needed. The heat source portion 93' of the present embodiment is disposed on the upper surface of the plug-in holder body 9 as shown in Fig. 4, but is not limited thereto. The plug-in unit 70 is inserted. The temperature control method of the socket 80. Here, the temperature at which the socket 8 is at a high temperature is controlled as an example. The first 'heat source portion 93 (for example, the heat source portion of the built-in heater), the socket guide body 91 is inserted. Heat to the desired temperature because of the socket guide

2I92M0325-PF 16 200950686 The body 91 is in contact with the socket body 81. Therefore, by inserting the socket guide body 91, heat is transmitted from the socket holder body 91, so that the socket body 81 is known. And the contact pin 82 provided on the dock body 81 is also heated. However, since the socket body 81 is usually made of a plastic resin having low thermal conductivity, it is sometimes impossible to achieve the desired temperature by the second "gas supplied from the gas supply device" and flow into the plug guide. The gas inlet 921 of the 瑕* body introduction path 92a of the splicing body 91 reaches the gas outlet 922 through the meandering gas introduction path 92a. Since the plug holder body 91 is heated by the heat source portion 93, the gas passing through the gas introduction path 92a is also heated. In particular, since the gas introduction path 92a is meandering, and the time during which the gas stays in the plug holder main body 91 becomes long, the gas is sufficiently heated. r· The gas heated in the plug guide body 91 flows from the gas outlet 922 of the gas introduction path 92a of the plug holder body 91 into the gas inlet 841 of the gas flow path 84 of the plug body φ body. Then, it flows out from the gas outlet 842 through the gas flow path 84. Here, the flow path of the heated gas (heating gas) in the plug-in holder main body 91 before flowing out from the gas outlet 842 of the gas flow path 84 of the plug-in housing body 81 is short, so that it flows here. The temperature of the heated gas on the road hardly decreases. The socket body 81 is heated and floated from the gas outlet of the gas flow path 84 of the socket body 81 at a gap between the upper surface of the concave portion of the heating gas 'flow plug-in holder body 81 and the bottom surface of the floating plate 83. Plate 83, and also heat is present at the base of the empty (four) contact pin 82. Followed by heating gas

2192-10325-PF 17 200950686 The body is separated from the upper side of the floating plate 83 by the gap between the contact pin 82 and the hole of the floating plate 83. At the time of enthalpy, the heated gas heats the entire contact #f* 82. Thereby, the 'mounting socket 8G is heated to a desired temperature (and the same temperature of 1 (: element 2). In this state, the IC component 2 to which high-temperature thermal stress is applied is mounted on the socket 80, 1C When the external terminal of the element 2 is in contact with the contact pin 82, the contact pin 82 and the floating plate 83 in contact with the package of the IC tg member 2 are heated to a desired temperature by heating the gas. Therefore, the temperature of the 1C element 2 In a state where the 1C element 2 is mounted on the socket 80, the heating gas exiting from the upper side of the floating plate 83 is sprayed to the IC component 2, and the inflow opening is at the inner periphery of the socket guide body 91. The gas inlet 923' of the gas discharge passage 92b is discharged to the outside through the gas outlet passage 92b from the gas outlet 924. Further, the gas discharged from the gas outlet 924 can be circulated back to the gas supply device through the piping. The type of socket unit 70, as described above, can efficiently control the socket 80 to a desired temperature, and further, the gas supplied to the socket 80 is inserted in the adjacent socket 8 The socket guide 9 is heated sufficiently to reach the socket 80 The gas supply device does not need to have a heat source such as a gas heater. Next, the operation flow of the transport/test of the processor 丨0 will be described. First, the loading unit transport device 5〇1 is used. The adsorption pads 501e of the four adsorption portions 501d are adsorbed and held by the four IC elements on the supply tray at the uppermost position of the supply tray storage 401 of the IC component housing portion 4''.

2192-10325-PF 18 200950686 The loading unit transport device 501' continues to hold four 1C elements, and the four 1C elements are raised by the Z-axis direction actuator of the movable head 5〇lc to make the X-axis orbit The 501b slides on the Y-axis direction rail 501a, and the movable head portion 501c slides on the x-axis direction rail 5〇1b and moves to the loading unit 50.

Then, the loading unit transport unit 5〇1 performs position determination on the concave portion 5〇3a of the heating plate 5〇3, and the actuator in the z-axis direction of the movable head unit 5〇lc is extended to release the adsorption pad 501e. 1 (: the component falls into the concave portion 5〇3a of the heating plate 5〇3: After the IC element is heated to a predetermined temperature by the heating plate 503, the person picks up the heated four by the loading section conveying device 50丨The C element is moved to the upper side of the loading buffer unit 5〇2 in standby. The loading unit transport unit 5 (Π, the buffer σ 5〇2a of the loading buffer unit 5〇2 in standby) The upper position is determined such that the Z-axis direction actuator of the movable head is extended to release the Η: element held by the adsorption pad 501e of the adsorption unit 5〇1, and the Ic element is carried on the buffer portion 502c. In the battle input buffer portion, η9, 4, the four 1C elements are placed on the concave portion 502c of the buffer table 502a, and the X gentleman upper λ wheel direction actuator 502b is extended, and the four 1C elements are loaded from the loading unit 5 The operating range of the cutting loader transport device 501 is moved to the operating range of the test portion transport device 31. As described above, when the Ic component is carried The operation of the buffer table 5 of the test unit transport device 31〇 (4) ^19, when the country is in the middle, the moving unit 312 of the test unit transport device 31 moves to the bearing _ ^ , and the stamp is placed on the buffer 502a The 1C element on the recess 5〇2c. Next, the Z-axis actuator of the item 312 is enabled.

2192-10325-PF 1=9 The adsorption portion 31 7 of 200950686 The concave portion of σ 502a is adsorbed by the four contact arms gig of the movable head 312 and is maintained on the buffer 502c of the implantation buffer portion 5〇2. Ic components. The four holders of the c-members move up in the movable direction of the c-sleeve actuator. 312', by the test portion transporting device 31 of the movable head gig, the branch movable head M2 » the branch member 311 & slides on the γ-axis direction rail 311, and the contact arm 315 of the moving head, 312 The 'clamps' gripped by the adsorption portion 317 are transported to the four sockets (4) of the contact portion 3〇1 of the test head 3〇〇, and then the spurs 312 are actuated to grasp the direction of the cymbal. 1 (: the component is in contact with this, 315' is attached to the socket (4) by the socket holder 90, and the external terminal of the component 2 is in contact with the contact pin 82 (see the 4, during the contact, the electrical signal is transmitted and received through the contact pin 82, and the test of the component 2 is completed. (As described herein, since the socket 8 () is heated to a desired temperature, The temperature of the ic element 2 is not lowered by being mounted on the socket 80 because the test is performed in a state in which the thermal stress of the desired temperature is applied to the ICtc member 2. After the end of the test of the 1C element 2, the test is performed. The part transporting device raises the component after the test by the contraction of the actuator in the Z-axis direction of the movable head 3, so that the support is movable X axis direction supporting member 3Ua portion 312 slidable in the channel 311 and the Y-axis direction, the movable 4 (1 holding the head of the contact arm 312 grip 315: element 2 is moved to the test section in the conveyance apparatus

2192-10325-PF 20 .200950686 Above the buffer table 6〇2a of the unloading buffer unit 6〇2 in the operating range. ° Attachment: The movable portion 312' extends the Z-axis direction actuator to release the four 1C elements into the recesses 6〇2c of the buffer table 602a by releasing the suction and 17C. The unloading buffer unit 602' carries the four IC elements after the test, drives the I-axis direction actuator 602b, and sends the IC element from the test portion 3 of the test unit 3 to the unloading unit 6G. The operating range of the unloading unit transporting device 601. Then, the movable head cymbal (4) (10) of the unloading portion transporting device 601 located above the unloading buffer unit 602 is extended in the z-axis direction actuator by the movable head. The four adsorption portions 6Gld of the P 6G1C adsorb and hold the tested *subtracter of the concave portion 6Q2c of the buffer table 6G2a of the unloading buffer portion 6G2. The unloading unit transport device 60 raises four 1s (the element Φ pieces are raised by the Z-sleeve direction actuators that hold the movable head portions 601c of the four 1C elements after the test) so that the X-axis direction rails 6 The slid is slid on the Y-axis direction rail 601a, and the movable head portion 601c is slid on the X-axis direction trajectory 6〇1b, and moved to the sorting disc storage 4〇2 of the 1C component accommodating portion 40. Then, according to the 兀As a result of the measurement, each IC component is carried on the sorting disc located at the top of each sorting disc storage 402. As described above, the Ic component test is performed once. The embodiment described above is w+ ^ J The present invention is not limited to the above embodiments, and thus various embodiments disclosed in the above embodiments may be variously modified based on the spirit of the present invention, and are also included in

2192-10325-PF 21 200950686 Within the scope of the invention. For example, the gas discharge path 92b of the socket holder body 91 may be omitted. Further, the gas flow path 84 of the plug-in holder 80 is omitted, and the gas is introduced from the gas introduction path 923 of the plug-in holder main body 91. (4) The heating gas is directly sprayed onto the contact pin 82 of the socket 80. Further, the socket 8 does not have the floating plate 83. Industrial Applicability ❹ The present invention is applicable to an electronic component testing device that applies high-temperature or low-temperature thermal stress to an electronic component to perform testing. [Simple description of the drawing] Fig. 1 shows the invention __ Jgs. JI|| At ^ The plan view of the electronic component testing device of the monthly embodiment. The gossip 2 diagram shows the side section of the electronic component testing device of the same embodiment (the ί-ι sectional view in Fig. 1). The third circle shows a plan sectional view of the dock unit in the same electronic component device. τ J Τ ❹ Figure 4 shows the same as Lei Yang; 1u section. Side of the socket unit of the sub 7° measuring and reducing device [Description of main components] 1 electronic component testing device 2 1C component (electronic component) 1〇 electronic component processing device (processor) 70 plug connector unit 80 seat

2192-10325-PF 22 200950686 81 socket body 82 contact pin (connection terminal) 8 3 floating plate (floating element) 84 gas flow path 90 socket holder guide 91 socket holder body 92a gas introduction path (Flow path) 921 gas inlet (fluid inlet) 922 gas outlet (fluid outlet) 92b gas discharge path (flow path) 93 heat source portion 315 contact arm (retaining element of the electronic component to be tested) 2192-10325-PF 23

Claims (1)

200950686 VII. Patent application scope: 1. A socket guide member disposed adjacent to a socket having a contact terminal that can contact an external terminal of the electronic component to be tested, the socket holder guiding the clamping An element of the electronic component to be tested, such that the electronic component to be tested is mounted at a predetermined position of the socket, characterized by having a heat source capable of heating or cooling the socket holder; and forming a fluid capable of supplying the The flow path of the docking station. 2. The socket guide as described in the patent application range μ, the flow The end of the path is the fluid person π 'the other end of the flow path is the fluid outlet opening to the socket. What is the plug-in guide described in 1 item? The element is formed as described in the patent application. The fluid is introduced into the socket from the outside. The plug guide as described in claim 1 or 2, the flow path is meandering so that the fluid passing through the flow path reaches a desired temperature by the heat source. A plug-in socket unit, comprising: a plug-in socket having a contact terminal that can be in contact with an external terminal of the electronic component to be tested; and the plug-in socket according to any one of items 1 to 4, as claimed in the patent application The scope of the first lead. 6. The socket unit according to claim 5, wherein the socket comprises a connection terminal and a pure seat body that cuts the connection terminal, and the socket body is formed on the socket body The Niuzhiliu Road is connected to 2192-10325-PF 24 200950686 and is capable of supplying the fluid to the flow path of the connection terminal. 7. The docking station unit of claim 6, wherein the socket has a floating 7L member on the socket body, which determines the position of the tested electronic component and supports the tested power. And the connecting terminal is slidably penetrated at an end of the plugging body that is a flow path of the U, facing the socket body and the floating element The gap is open. ❹ 8·- an electronic component testing device, comprising: a socket guide member according to any one of the items of claim 4; and capable of supplying a fluid to the plug A fluid supply device for the flow path of the seat guide. 9. An electronic component testing device, comprising: a socket unit disposed on a test head as disclosed in any of claims 5 to 7; and wherein the fluid is supplied to the plug a fluid supply device for the flow path of the docking station guide in the seat unit. An electronic component testing device as described in claim 8 or claim 9 wherein the fluid supply device does not have a heat source. A temperature control method for a socket, which is a temperature control method for a socket having a contact terminal that can be in contact with an external terminal of a measured electronic component, characterized in that: The docking station guide of any of the items 4, wherein the fluid is supplied to the flow path of the socket holder. 2192-10325-PF 25 200950686 12. A temperature control method for a socket, which is a temperature control method of a socket having a contact terminal that can be in contact with an external terminal of an electronic component to be tested, characterized in that: The docking station unit according to any one of the items of the present invention, wherein the fluid is supplied to the flow path of the plug-in holder in the plug-in unit. 13. The socket temperature control method of claim 2 or 2 does not apply heat to the fluid supplied to the socket guide. 2192-10325-PF 26