TW200943118A - Method and apparatus for managing test result data generated by a semiconductor test system - Google Patents
Method and apparatus for managing test result data generated by a semiconductor test systemInfo
- Publication number
- TW200943118A TW200943118A TW097149395A TW97149395A TW200943118A TW 200943118 A TW200943118 A TW 200943118A TW 097149395 A TW097149395 A TW 097149395A TW 97149395 A TW97149395 A TW 97149395A TW 200943118 A TW200943118 A TW 200943118A
- Authority
- TW
- Taiwan
- Prior art keywords
- result data
- test result
- data generated
- managing
- test system
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2832—Specific tests of electronic circuits not provided for elsewhere
- G01R31/2834—Automated test systems [ATE]; using microprocessors or computers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Tests Of Electronic Circuits (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/960,396 US20090164931A1 (en) | 2007-12-19 | 2007-12-19 | Method and Apparatus for Managing Test Result Data Generated by a Semiconductor Test System |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW200943118A true TW200943118A (en) | 2009-10-16 |
Family
ID=40790171
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW097149395A TW200943118A (en) | 2007-12-19 | 2008-12-18 | Method and apparatus for managing test result data generated by a semiconductor test system |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US20090164931A1 (zh) |
| TW (1) | TW200943118A (zh) |
| WO (1) | WO2009086020A2 (zh) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108845557A (zh) * | 2017-04-28 | 2018-11-20 | 爱德万测试公司 | 用软件应用编程接口对自动化测试特征进行用户控制 |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2941802B1 (fr) * | 2009-02-02 | 2016-09-16 | Ippon | Procede de detection de composants electroniques atypiques |
| US8400176B2 (en) * | 2009-08-18 | 2013-03-19 | Formfactor, Inc. | Wafer level contactor |
| US8589736B2 (en) * | 2011-08-12 | 2013-11-19 | Tata Consultancy Services Limited | System and method for automatic test data generation for relational testing |
| US10429437B2 (en) * | 2015-05-28 | 2019-10-01 | Keysight Technologies, Inc. | Automatically generated test diagram |
| US11782809B2 (en) * | 2020-06-30 | 2023-10-10 | Tektronix, Inc. | Test and measurement system for analyzing devices under test |
Family Cites Families (52)
| Publication number | Priority date | Publication date | Assignee | Title |
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| US3781683A (en) * | 1971-03-30 | 1973-12-25 | Ibm | Test circuit configuration for integrated semiconductor circuits and a test system containing said configuration |
| US3827820A (en) * | 1971-08-20 | 1974-08-06 | J Hoffman | Drill dispensing container |
| US4038599A (en) * | 1974-12-30 | 1977-07-26 | International Business Machines Corporation | High density wafer contacting and test system |
| US4523144A (en) * | 1980-05-27 | 1985-06-11 | Japan Electronic Materials Corp. | Complex probe card for testing a semiconductor wafer |
| JPS5951109B2 (ja) * | 1980-08-29 | 1984-12-12 | 富士通株式会社 | エ−ジング装置における高温部と低温部の接続方法 |
| US4455654B1 (en) * | 1981-06-05 | 1991-04-30 | Test apparatus for electronic assemblies employing a microprocessor | |
| US4706018A (en) * | 1984-11-01 | 1987-11-10 | International Business Machines Corporation | Noncontact dynamic tester for integrated circuits |
| US4780670A (en) * | 1985-03-04 | 1988-10-25 | Xerox Corporation | Active probe card for high resolution/low noise wafer level testing |
| US4837622A (en) * | 1985-05-10 | 1989-06-06 | Micro-Probe, Inc. | High density probe card |
| US5476211A (en) * | 1993-11-16 | 1995-12-19 | Form Factor, Inc. | Method of manufacturing electrical contacts, using a sacrificial member |
| US5103557A (en) * | 1988-05-16 | 1992-04-14 | Leedy Glenn J | Making and testing an integrated circuit using high density probe points |
| US4899099A (en) * | 1988-05-19 | 1990-02-06 | Augat Inc. | Flex dot wafer probe |
| DE4012839B4 (de) * | 1989-04-26 | 2004-02-26 | Atg Test Systems Gmbh & Co.Kg | Verfahren und Prüfvorrichtung zum Prüfen von elektrischen oder elektronischen Prüflingen |
| US5070297A (en) * | 1990-06-04 | 1991-12-03 | Texas Instruments Incorporated | Full wafer integrated circuit testing device |
| JP2928592B2 (ja) * | 1990-06-20 | 1999-08-03 | 株式会社日立製作所 | 半導体ｌｓｉ検査装置用プローブヘッドの製造方法および検査装置 |
| US5090118A (en) * | 1990-07-31 | 1992-02-25 | Texas Instruments Incorporated | High performance test head and method of making |
| US5187020A (en) * | 1990-07-31 | 1993-02-16 | Texas Instruments Incorporated | Compliant contact pad |
| US5162728A (en) * | 1990-09-11 | 1992-11-10 | Cray Computer Corporation | Functional at speed test system for integrated circuits on undiced wafers |
| US5148103A (en) * | 1990-10-31 | 1992-09-15 | Hughes Aircraft Company | Apparatus for testing integrated circuits |
| US5172050A (en) * | 1991-02-15 | 1992-12-15 | Motorola, Inc. | Micromachined semiconductor probe card |
| US5323107A (en) * | 1991-04-15 | 1994-06-21 | Hitachi America, Ltd. | Active probe card |
| US5261155A (en) * | 1991-08-12 | 1993-11-16 | International Business Machines Corporation | Method for bonding flexible circuit to circuitized substrate to provide electrical connection therebetween using different solders |
| US5357523A (en) * | 1991-12-18 | 1994-10-18 | International Business Machines Corporation | Memory testing system with algorithmic test data generation |
| GB2263980B (en) * | 1992-02-07 | 1996-04-10 | Marconi Gec Ltd | Apparatus and method for testing bare dies |
| US5442282A (en) * | 1992-07-02 | 1995-08-15 | Lsi Logic Corporation | Testing and exercising individual, unsingulated dies on a wafer |
| US5389556A (en) * | 1992-07-02 | 1995-02-14 | Lsi Logic Corporation | Individually powering-up unsingulated dies on a wafer |
| US5648661A (en) * | 1992-07-02 | 1997-07-15 | Lsi Logic Corporation | Integrated circuit wafer comprising unsingulated dies, and decoder arrangement for individually testing the dies |
| JPH0653299A (ja) * | 1992-07-31 | 1994-02-25 | Tokyo Electron Yamanashi Kk | バーンイン装置 |
| US5243274A (en) * | 1992-08-07 | 1993-09-07 | Westinghouse Electric Corp. | Asic tester |
| JP3135378B2 (ja) * | 1992-08-10 | 2001-02-13 | ローム株式会社 | 半導体試験装置 |
| US5363038A (en) * | 1992-08-12 | 1994-11-08 | Fujitsu Limited | Method and apparatus for testing an unpopulated chip carrier using a module test card |
| KR970010656B1 (ko) * | 1992-09-01 | 1997-06-30 | 마쯔시다 덴기 산교 가부시끼가이샤 | 반도체 테스트 장치, 반도체 테스트 회로칩 및 프로브 카드 |
| US5422574A (en) * | 1993-01-14 | 1995-06-06 | Probe Technology Corporation | Large scale protrusion membrane for semiconductor devices under test with very high pin counts |
| US5367254A (en) * | 1993-02-01 | 1994-11-22 | International Business Machines Corporation | Test probe assembly using buckling wire probes within tubes having opposed overlapping slots |
| KR960011265B1 (ko) * | 1993-06-25 | 1996-08-21 | 삼성전자 주식회사 | 노운 굳 다이 어레이용 테스트 소켓 |
| US5570032A (en) * | 1993-08-17 | 1996-10-29 | Micron Technology, Inc. | Wafer scale burn-in apparatus and process |
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| US5491426A (en) * | 1994-06-30 | 1996-02-13 | Vlsi Technology, Inc. | Adaptable wafer probe assembly for testing ICs with different power/ground bond pad configurations |
| US6577148B1 (en) * | 1994-08-31 | 2003-06-10 | Motorola, Inc. | Apparatus, method, and wafer used for testing integrated circuits formed on a product wafer |
| WO1996008056A1 (en) * | 1994-09-06 | 1996-03-14 | The Whitaker Corporation | Ball grid array socket |
| JP2632136B2 (ja) * | 1994-10-17 | 1997-07-23 | 日本電子材料株式会社 | 高温測定用プローブカード |
| US5495667A (en) * | 1994-11-07 | 1996-03-05 | Micron Technology, Inc. | Method for forming contact pins for semiconductor dice and interconnects |
| US5701085A (en) * | 1995-07-05 | 1997-12-23 | Sun Microsystems, Inc. | Apparatus for testing flip chip or wire bond integrated circuits |
| US5642054A (en) * | 1995-08-08 | 1997-06-24 | Hughes Aircraft Company | Active circuit multi-port membrane probe for full wafer testing |
| US5600257A (en) * | 1995-08-09 | 1997-02-04 | International Business Machines Corporation | Semiconductor wafer test and burn-in |
| US5686842A (en) * | 1995-08-31 | 1997-11-11 | Nat Semiconductor Corp | Known good die test apparatus and method |
| US5736850A (en) * | 1995-09-11 | 1998-04-07 | Teradyne, Inc. | Configurable probe card for automatic test equipment |
| US5764072A (en) * | 1996-12-20 | 1998-06-09 | Probe Technology | Dual contact probe assembly for testing integrated circuits |
| US6513043B1 (en) * | 2000-09-01 | 2003-01-28 | Syntricity, Inc. | System and method for storing, retrieving, and analyzing characterization data |
| US6845280B1 (en) * | 2002-11-26 | 2005-01-18 | Advanced Micro Devices, Inc. | Work in progress management program interface |
| US6941232B2 (en) * | 2003-01-28 | 2005-09-06 | Texas Instruments Incorporated | Method and apparatus for performing multi-site integrated circuit device testing |
-
2007
- 2007-12-19 US US11/960,396 patent/US20090164931A1/en not_active Abandoned
-
2008
- 2008-12-18 WO PCT/US2008/087547 patent/WO2009086020A2/en not_active Ceased
- 2008-12-18 TW TW097149395A patent/TW200943118A/zh unknown
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108845557A (zh) * | 2017-04-28 | 2018-11-20 | 爱德万测试公司 | 用软件应用编程接口对自动化测试特征进行用户控制 |
| CN108845557B (zh) * | 2017-04-28 | 2023-08-08 | 爱德万测试公司 | 用软件应用编程接口对自动化测试特征进行用户控制 |
Also Published As
| Publication number | Publication date |
|---|---|
| US20090164931A1 (en) | 2009-06-25 |
| WO2009086020A3 (en) | 2009-09-03 |
| WO2009086020A2 (en) | 2009-07-09 |
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