200946707 六、發明說明： 【發明所屬之技術領域】 本發明與一種用於塗佈基板之塗佈裝置有關，該 裝置包括至少兩個彼此相鄰配置的處理腔室、置於兩 相鄰處理腔室之間的一分離平板、以及用於排空處理 腔室的唧送裝置。200946707 VI. Description of the Invention: [Technical Field] The present invention relates to a coating apparatus for coating a substrate, the apparatus comprising at least two processing chambers disposed adjacent to each other, placed in two adjacent processing chambers A separating plate between the chambers and a feeding device for evacuating the processing chamber.
【先前技術】 用於塗佈基板之塗佈裝置係已為廣知且廣用於不 同應用之工業中。舉例而言，在建築玻璃上塗佈熱絕 緣層以增進其熱傳導性。工業上使用塗層的其他例子 為平面電視、電腦顯示器或太陽能電池，其包括具有 不同膜層之平坦平面基板，以使功能性單元將陽光轉 換為電流或將電訊號轉換為光發射。 因此，對於可於大型平坦平面基板上沉積膜層之 方法與裝置的需求日漸提高，因&，需要可以高沉積 精確度進行快速、自動、有效率之塗佈製程的塗佈裝 置。 習知技藝中所知之不同塗佈裝置的例子可見於 DE 103 48 281 A1、DE 1〇3 52 144 幻與 Ep ⑺ η 39 A2等專利文件。 DE 103 48 281 A1揭露了一種用於平坦、 矩形或 方形基板的真空處理裝置，其具有 ，田基板處理機構 3 200946707 分隔之兩個真空腔室。DE 103 48 281 A1之處理機構 可使基板在不暴露至大氣的情況下從一止動器（1〇ck) 移動至一處理腔室。 在DE 195 52 28C2中也揭露了一種包括兩個處理 腔至的塗佈裝置，這兩個處理腔室彼此相距一距離並 由一導管予以連接，其可藉由共同唧送裝置而排空真 空腔室。 ❹ 雖然具有兩處理腔室之上述塗佈裝置會產生充足 的塗佈結果，但上述塗佈裝置設計的一個缺點在於將 基板自一處理腔室移動至另一處理腔室所需之處理時 間。因此，在習知技藝中已知提供所謂的同軸塗佈裝 置，其中基板係自一處理腔室連續移動至下一個處理 腔室’而不留下沿著通過處理腔室之基板通道提供之 真空氣氛。這種塗佈裝置的例子係揭露於de 1〇3 52 144 A1 與 EP 171 73 39 A2 中。 ❿ DE 1〇3 52 144 A1之塗佈裝置包括不同的塗佈區 段，其中材料係濺鍍至移動於濺鍍源之靶材下方或上 方、或於塗佈t程期間靜止的基板上。在塗佈區段之 間、以及在塗佈裝置的出口處具有果區段以排空基板 通道與處理處理腔室，以進行_製程。由於塗佈區 段之間配置了泵區段，這種設備需要大量空間。 EP 171 73 39揭露了 —種同軸式塗佈ί置，其分 別使用相鄰的腔室或平行通道，一種是將基板傳輸通 過處理腔室，而一種是將遮罩與載體反送傳輸以及清 4 200946707 潔。這樣的設計非常節省空間’且為有效率的工作裝 置。當第二通道不僅使用於遮罩或載體之反送傳輸、 而也用於平行塗佈製程時，這種具有平行通道通過相 鄰真空或處理腔室之共軸塗佈裝置也可有效增加此裝 置的容納量。 雖然已對塗佈製程的發展與塗佈裝置的設計耗費 大量心力’但仍有改進之需要。 ❹ 【發明内容】 發明目的 因此，本發明的一項目的在於提供一種具有較佳效率且 同時可進行高品質沉積的塗佈裝置。 故，本發明的一項目的在於減少這種塗佈裝置所需的空 間，並減少用於生產這種裝置的材料使用。此外，這種裝置 應可盡可能地輕易被製造且可簡單運作。 ® 技術手段 上述目的係由具有申請專利範圍第1項所述特徵之裝置 加以實現。 根據本發明，提供了一種塗佈裝置，其包括彼此相鄰配 置且由置於其間之一分離平板予以分隔的至少兩個處理腔 室。這種雙胞式塗佈裝置的基本設計使處理腔室的架構簡 單，且製造成本減少。此外，這種設計亦節省空間。 本發明之塗佈裝置進一步包括唧送裝置以排空處理腔 200946707 室，因為在許多塗佈製程（例如：濺鍍）中需要使用較低壓 力或真空條件。 根據本發明，兩處理腔室之間的分離平板包括一導管， 其至少一末端與該唧送裝置連接，且另一末端具有至少一抽 吸開口以供兩處理腔室使用。然而，也可提供至少兩個抽吸 開口，其各供每一處理腔室使用，以分別及獨立地排空處理 腔室。 〇 具有整合之導管的分離平板之設計也使塗佈裝置具有節 省空間之架構，這是因為不需在分隔的泵區段中配置唧送裝 置而使整體裝置長度變長，而可將唧送裝置放置在任意或使 用者限定之位置。 此外，在分離平板處、或在其中提供導管可強化分離平 板，使得分離平板可形成為具有較小厚度而減少分離平板的 材料使用。除此之外，兩處理腔室使用相同的唧送裝置可於 ® 相鄰處理腔室中產生相同的壓力條件，因此可進一步降低分 離平板的強度與硬度需求。 導管可以不同形式配置在分離平板處或其内；舉例而 言，導管可置於分離平板與主要表面平行之之平面外的一側 處，然也可將導管置於分離平板内，且特別是在分離平板的 凹槽内、或在分離平板的雙壁式結構内所形成的空間中。在 此情況下，分離平板與主要表面平行的平面會切割該導管。 關於導管配置的所有不同設計會導致分離平板藉由導管 200946707 而強化，因此可減少分離平板的厚度。 較佳為，導管是以氣密方式配置在分離平板處，以避免 製程腔室透過導管與分離平板交界面處的開口而互相污染。 導管本身的形式可根據導管配置在分離平板處的方式而不 同；當導管是配置在分離平板的凹槽中時，導管可形成為不 受分離平板影響之管狀；然而，導管亦可貼附在分離平板處， 使得分離平板也將導管分為兩半部，舉例而言，其可藉由沿 Q 著長度方向切割導管、並將分離平板放置在經由切割而形成 的凹槽内而達成。兩個獨立的半部係因而形成，其於導管的 個別末端處具有兩個獨立的抽吸開口。 導管可以任何適當形式固定於分離平板處，特別是導管 ' 可藉由金屬續接方式（例如：透過熔接或黏接接合）而連接 至分離平板。 在另一實施例中，導管可具有供兩製程腔室所用之共同 © 抽吸開口，此實施例可使兩製程腔室之間的壓力快速相同， 因此，分離平板無須遭受大幅壓力差異而可進一步降低分離 平板的硬度與強度。 由於具有導管以排空相鄰製程腔室之分離平板的設計優 勢，因而增加了唧送裝置的定位變化。因此，唧送裝置可置 於製程腔室的頂部、或置於製程腔室底部下方，而不將其配 置在泵區段側壁處而與製程腔室的塗佈工具緊鄰；故可明顯 減少整體裝置所需的空間。 200946707 較佳為，塗佈裝置係設計為一種同軸塗佈裝置，其具有 相鄰配置成行以形成一基板通道的數個製程腔室，其中基板 係自一處理腔室移動至另一處理腔室。由此，處理腔室包括 不同種類之腔室以進行塗佈製成與所有的處理步驟。基板係 以相對於與基板主要表面平行之基板平面呈一直立位置、與 該垂直方向之間呈±25°之一角度而傳輸。 此外，塗佈裝置係包括用於進行濺鍍、電漿輔助化學氣 φ 相沉積（PECVD)與物理氣相沉積（PVD)之塗佈工具。 導管係與塗佈工具相鄰配置於製程腔室中，例如：雙極 式磁控（twin-magnetron)配置方式。其表示，相對於基板的 ' 傳輸方向，導管的抽吸開口係分別配置在塗佈工具前及/或塗 • 佈工具後。較佳為，導管或抽吸開口係個別置於各個單獨製 程腔室的入口或出口處。 除此之外（或或者是），至少一導管係置於與塗佈工具相 ® 對處，例如濺鍍設備或PECVD裝置的陰極處。 導管可相對於製程腔室高度而具有不同長度，因此，導 管可分別涵蓋製程腔室或分離平板的全部或部分高度。所述 高度係以垂直方向定義，因此，不管是非常短的導管（幾乎 未自裝置上方或下方的唧送裝置延伸出來）甚至是非常長的 導管（其長度與製程腔室或分離平板的高度相同）都是可以 使用的。 導管也可包括散佈於導管長度的數個抽吸開口。這些抽 200946707 吸開口可裝配有關閉件以根據特定需求而關閉或開啟抽吸開 口。此外，抽吸開口也可包括整流板以控制氣流。 較佳為，導管係延伸於製程腔室或分離平板的不同高度 部分，以使製程腔室排空良好。這可藉由在製程腔室上方與 下方區域都提供抽吸開口而達成。因此，導管可延伸達製程 腔室高度的-半以上、或三分之二以上，或是製程腔室高度 的-半以下、或三分之-以下。同時，抽吸開口係可提供於 Ο 製程腔室沿著基板通道的下方與上方區域、或共同導管的兩 區域中。 【實施方式】 份 圖1以透視方式繪示本發明之塗佈裝置的一部 該塗佈裝置具有四個製程腔室丨_4。製程腔室也稱 為部件或製程部件 ❹ 以及兩製程腔室3與4係彼此相 腔室的背側作為共同侧，且因而 的雙胞式製程腔室。 兩製程腔室（及製程腔室1與2) 鄰配置’其以各製程 形成一種背對背配置 與另-對製程腔室3、4相鄰配置。圖！中雖僅繪: 個製程腔室的情形，該領域技術人士應知數餅製; 室1、2及3、4亦可以其背側彼此相鄰配置而逐一 齊。因此，配置成行之製程腔室（如處理腔室2、< 及處理腔室1、3)限定了通道5、6，箕 而基板22 4 200946707 其而移動。因此 "此，雙胞式製程腔室1、2與3、4定義 了兩條通道5與6。 較大型之to 〇> , 十坦千板（例如建築用玻璃平板或顚示 基板22係可沿著通道5、6而移分別藉由可移 動基板載體（圖中未示）而移動通過製程腔室2、 1、2 ° 一 背侧彼此相鄰之製程腔室1、2以及製程腔室3、 ❿ 4係藉由一分離平板9而分隔開來。 塗佈工具（例如雙極式磁控電極7、8 )係位於與 刀離平板9相對處。為使塗佈工具7、8簡單結合，製 程腔至1 4包括結合門14、15以供輕易進入製程腔室。 製程腔至可没计為模組，例如包括兩製程腔室（即 製程腔室1、2或3、4)之模組。因此，製程腔室或 形成一模組之雙胞式製程腔室係可以同樣方式設計， 使得整個塗佈裝置可由相同模組的使用者定義配置方 © 式加以設定，而僅視特定塗佈需求來採行其他設備。 由於製程腔至14中執行的塗佈製程（例如減鑛.製 程）需要真空條件，製程腔室1-4因而包括唧送裝置 12、13 ’ 如渦輪泵（turb〇 puinps )。 圖1所示實施例的唧送裝置12、13係位於塗佈裝 置的頂部’然而，也可將唧送裝置12、13配置在製程 腔室1-4的下方。 唧送裝置12、13係與導管10連接，其一係顯示 於圖1之製程腔室2中。導管1〇係自唧送裝置12延 200946707 伸至製程腔室2中，且在装盥、 T 任再與連接至渦輪泵12之末端 的相對末端處包括一抽吸開口丨】。 藉由抽吸開口 11與導管，存在於製程腔室12中 的氣體或空氣係可由料裝置12予㈣除。 如圖1之實施例所示，導普〗〇总μ认土… 等官10係延伸達製程腔室 2的高度的三分之二以上，其中 > 丹τ所述咼度係以垂直方 向加以定義。因此，藉由坤卩；主壯 ^此精由即送裝置12與導管10，亦 e[Prior Art] A coating device for coating a substrate is well known and widely used in industries of different applications. For example, a thermal insulating layer is applied to the architectural glass to enhance its thermal conductivity. Other examples of coatings used in the industry are flat-panel televisions, computer displays or solar cells, which include flat planar substrates having different layers of film to allow the functional unit to convert sunlight into electrical current or to convert electrical signals into light emission. Therefore, there is an increasing demand for a method and apparatus for depositing a film layer on a large flat planar substrate, and a coating apparatus capable of performing a rapid, automatic, and efficient coating process with high deposition precision is required. Examples of different coating devices known in the art can be found in patent documents such as DE 103 48 281 A1, DE 1〇3 52 144 illusion and Ep (7) η 39 A2. DE 103 48 281 A1 discloses a vacuum processing apparatus for a flat, rectangular or square substrate having two vacuum chambers separated by a substrate processing mechanism 3 200946707. The processing mechanism of DE 103 48 281 A1 allows the substrate to be moved from a stopper (1〇ck) to a processing chamber without exposure to the atmosphere. Also disclosed in DE 195 52 28 C2 is a coating device comprising two processing chambers, the two processing chambers being at a distance from one another and connected by a conduit which can be evacuated by a common feed device Chamber. ❹ Although the above coating apparatus having two processing chambers produces sufficient coating results, one disadvantage of the above coating apparatus design is the processing time required to move the substrate from one processing chamber to another. Accordingly, it is known in the art to provide a so-called coaxial coating apparatus in which the substrate is continuously moved from one processing chamber to the next processing chamber without leaving a vacuum provided along the substrate passage through the processing chamber. atmosphere. Examples of such coating devices are disclosed in de 1 〇 3 52 144 A1 and EP 171 73 39 A2. The coating apparatus of ❿ DE 1〇3 52 144 A1 comprises different coating zones in which the material is sputtered onto the substrate below or above the target moving over the sputtering source or stationary during the coating t-pass. A fruit section is provided between the coating sections and at the exit of the coating apparatus to evacuate the substrate channels and the processing chamber for the process. This equipment requires a lot of space due to the arrangement of pump sections between the coating sections. EP 171 73 39 discloses a coaxial coating which uses adjacent chambers or parallel channels, one for transporting the substrate through the processing chamber and the other for transporting the mask and the carrier back and forth. 4 200946707 Clean. This design is very space-saving and is an efficient work device. When the second passage is used not only for the transfer of the mask or the carrier but also for the parallel coating process, such a coaxial coating device having parallel passages through adjacent vacuum or processing chambers can also effectively increase this. The capacity of the device. Although the development of the coating process and the design of the coating apparatus have taken a lot of effort, there is still a need for improvement. OBJECT OF THE INVENTION Accordingly, it is an object of the present invention to provide a coating apparatus which has better efficiency and at the same time enables high quality deposition. Accordingly, it is an object of the present invention to reduce the space required for such a coating apparatus and to reduce the use of materials for producing such apparatus. Moreover, such a device should be as easy to manufacture as possible and simple to operate. ® Technical means The above objectives are achieved by a device having the features described in the first claim. According to the present invention, there is provided a coating apparatus comprising at least two processing chambers disposed adjacent to each other and separated by a separating plate interposed therebetween. The basic design of such a twin coating apparatus allows for a simple design of the processing chamber and reduced manufacturing costs. In addition, this design also saves space. The coating apparatus of the present invention further includes a feeding device to evacuate the processing chamber 200946707 chamber because lower pressure or vacuum conditions are required in many coating processes (e.g., sputtering). According to the invention, the separating plate between the two processing chambers comprises a conduit having at least one end connected to the feeding device and at the other end having at least one suction opening for use by the two processing chambers. However, at least two suction openings may also be provided, each for each processing chamber to separately and independently evacuate the processing chamber. The design of the separation plate with integrated conduit also gives the coating device a space-saving structure, since it is not necessary to arrange the delivery device in the separate pump section to make the overall device length longer, and the The device is placed in any or user-defined location. Further, the separation plate may be reinforced at the separation plate or provided therein, so that the separation plate can be formed into a material having a small thickness to reduce the separation plate. In addition, the two processing chambers use the same transfer device to create the same pressure conditions in the adjacent processing chambers, thus further reducing the strength and hardness requirements of the separation plates. The catheter may be arranged in different forms at or within the separation plate; for example, the catheter may be placed at a side of the separation plate that is parallel to the plane of the main surface, but the catheter may also be placed in the separation plate, and in particular In the groove formed in the separation plate or in the space formed in the double-walled structure of the separation plate. In this case, the plane separating the plate from the main surface cuts the catheter. All of the different designs for the catheter configuration result in the separation plate being reinforced by the conduit 200946707, thus reducing the thickness of the separation plate. Preferably, the conduit is disposed in a gastight manner at the separation plate to avoid contamination of the process chamber through the opening at the interface of the separation plate and the separation plate. The form of the catheter itself may vary depending on the manner in which the catheter is disposed at the separation plate; when the catheter is disposed in the groove of the separation plate, the catheter may be formed into a tubular shape that is not affected by the separation plate; however, the catheter may also be attached thereto The separation plate is so that the separation plate also divides the catheter into two halves, for example, by cutting the catheter along the length of the Q and placing the separation plate in a groove formed by cutting. Two separate halves are thus formed with two separate suction openings at the individual ends of the catheter. The catheter can be secured to the separation plate in any suitable form, and in particular the catheter can be attached to the separation plate by a metal follow-up (e.g., by fusion or adhesive bonding). In another embodiment, the conduit can have a common suction opening for the two process chambers. This embodiment allows the pressure between the two process chambers to be rapidly the same, so that the separation plate does not have to be subjected to significant pressure differences. The hardness and strength of the separation plate are further reduced. Due to the design advantages of having a conduit to evacuate the separation plates of adjacent process chambers, the positioning variations of the feed device are increased. Therefore, the feeding device can be placed at the top of the process chamber or under the bottom of the process chamber without being disposed at the side wall of the pump section in close proximity to the coating tool of the process chamber; The space required for the unit. 200946707 Preferably, the coating apparatus is designed as a coaxial coating apparatus having a plurality of process chambers arranged adjacent to each other to form a substrate passage, wherein the substrate is moved from one processing chamber to another processing chamber . Thus, the processing chamber includes a different type of chamber for coating fabrication and all processing steps. The substrate is transported at an angle of ±25° with respect to the plane of the substrate parallel to the main surface of the substrate at an angle of ±25° with respect to the vertical direction. Further, the coating apparatus includes a coating tool for performing sputtering, plasma assisted chemical gas phase deposition (PECVD), and physical vapor deposition (PVD). The conduit system is disposed adjacent to the coating tool in the process chamber, such as a twin-magnetron configuration. It means that the suction opening of the conduit is disposed before the coating tool and/or after the coating tool, respectively, with respect to the 'transport direction of the substrate. Preferably, the conduit or suction opening is individually placed at the inlet or outlet of each individual process chamber. In addition (or alternatively), at least one of the conduits is placed at the opposite end of the coating tool, such as the sputtering device or the cathode of the PECVD device. The conduits can be of different lengths relative to the height of the process chamber so that the conduits can cover all or part of the height of the process chamber or separation plate, respectively. The height is defined in a vertical direction, so that it is a very short conduit (almost no extension from the delivery device above or below the device) or even a very long conduit (the length of which is the height of the process chamber or the separation plate) The same) is available. The catheter can also include a plurality of suction openings that are interspersed throughout the length of the catheter. These pumping 200946707 suction openings can be fitted with closures to close or open the suction opening according to specific needs. In addition, the suction opening may also include a fairing to control the air flow. Preferably, the conduit extends over different height portions of the process chamber or the separation plate to allow the process chamber to be evacuated. This can be achieved by providing a suction opening both above and below the process chamber. Thus, the conduit can extend to - more than half, or more than two-thirds of the height of the process chamber, or - half or less, or less than - third of the height of the process chamber. At the same time, a suction opening can be provided in the 下方 process chamber along the lower and upper regions of the substrate channel, or in both regions of the common conduit. [Embodiment] FIG. 1 is a perspective view of a portion of a coating apparatus of the present invention. The coating apparatus has four process chambers 丨4. The process chamber is also referred to as a component or process component ❹ and the back side of the two process chambers 3 and 4 are mutually co-located, and thus the twin process chamber. The two process chambers (and process chambers 1 and 2) are disposed adjacent to each other to form a back-to-back configuration with each other adjacent to the other process chambers 3, 4. Figure! Although only one process chamber is illustrated, those skilled in the art should know the number of cakes; the chambers 1, 2, and 3, 4 may also be arranged side by side with their back sides adjacent to each other. Thus, the process chambers configured in a row (e.g., process chamber 2, < and processing chambers 1, 3) define channels 5, 6, and the substrate 22 4 200946707 moves therewith. Therefore, the twin-type process chambers 1, 2 and 3, 4 define two channels 5 and 6. The larger type to 〇>, the ten-tank plate (for example, the building glass plate or the display substrate 22 can be moved along the channels 5, 6 and moved through the process by the movable substrate carrier (not shown) The chambers 2, 1, 2, and the process chambers 1, 2 and the process chambers 3, 4, which are adjacent to each other on the back side, are separated by a separation plate 9. Coating tools (for example, bipolar The magnetron electrodes 7, 8 are located opposite the blade 9 . To facilitate the simple bonding of the coating tools 7, 8, the process chambers 14 include the bonding gates 14, 15 for easy access to the process chamber. It may not be counted as a module, for example, a module including two process chambers (ie, process chambers 1, 2, or 3, 4). Therefore, the process chamber or the twin-type process chamber system forming a module may be the same. The design is such that the entire coating device can be set by the user-defined configuration of the same module, and only other devices are selected depending on the specific coating requirements. Due to the coating process performed in the process chamber to 14 (eg, subtraction) The vacuum process is required for the process. The process chambers 1-4 thus include the feed devices 12, 13 ' As a turbo pump (turb〇puinps). The conveying device 12, 13 of the embodiment shown in Fig. 1 is located at the top of the coating device' However, the feeding devices 12, 13 can also be arranged in the processing chamber 1-4 The delivery device 12, 13 is connected to the catheter 10, one of which is shown in the process chamber 2 of Fig. 1. The catheter 1 is extended from the delivery device 12 to the process chamber 2, and the process is extended to the process chamber 2, and The mounting, T and then the end of the end connected to the turbo pump 12 includes a suction opening. By means of the suction opening 11 and the conduit, the gas or air system present in the processing chamber 12 12 (4) In addition, as shown in the embodiment of Fig. 1, the general μ 〇 〇 认 认 认 ...... ...... ...... ...... ...... ...... ...... ...... ...... ...... ...... ...... ...... ...... ...... ...... ...... ...... ...... ...... ...... ...... ...... ...... ...... ...... ...... ...... ...... ...... ...... ...... ...... ...... ...... The degree is defined in the vertical direction. Therefore, by means of Kun, the main unit is to send the device 12 and the catheter 10, also e
可排除製程腔室2底部的氣體或空氣。 圖2繪示了分離平板9的側視圖，以證明分離平 板9的設計以及關㈣送裝置與導管之配置的各種可 行性。 如圖2所示，配置導管1〇的一種可行方式是提供 -長型管件’纟自製程腔室的頂部或分離平板9的頂 部分別延伸至靠近製程腔室底部的區域。在塗佈裝置 或製程腔室下方的空間條件受限而無法配置唧送裝置 時，這是一種較佳實施方式。 在製程腔室下方與上方具有足夠的空間來提 送裝置的例子t，如果在製程腔室的特定位置處具有 抽吸開口並非那麼重要’則可僅提供短導管，如導管 17、19’其僅延伸達分離平板的高度的一小部分，: 述南度同樣_以垂直方向予以定義。 因此，圖2所示之實施例包括三個哪送裝置 13、16 ’其分別位於製程腔室上方、或位於分離平板 的頂部處，同時包括位於製程腔室下方或分離平板9 200946707 底部處之第四唧送裝置18。唧送裝置13、16與18係 連接至短導管，例如導管17與19。 當入口開口直線連接於導管1〇、17、19的個別末 端前時，唧送裝置12、13、16與18係垂直對齊，如 圖2所不。此外，也可以水平方式配置唧送裝置，使 ㈣送裝置12、13、16與18的入口開口必須藉由一 f管而連接至導管10、17與19。 ❹ 圖3繪不了沿著圖2中箭頭交又線所示之截面。 圖3揭示了導管1〇、19可以不同方式固定於分離 平板9。導管10係置於分離平板9的凹槽中導管ι〇 :由置於凹槽中的管件所形成，且其係氣密地固定至 分離平板9 (例如藉由溶接方式此外，也可使用其 他方式來將導管1G㈣至分離平板9 ,例如使用彼此 相配、黏接接合或摩擦連接方式。 由於導管10的管件係配置在分離平9的凹槽 中’在導管10末端的共同抽吸開口 u係形成以供分 離平板9附近的兩個製程腔室使用。因此，在分離平 :9兩側（亦即在與分離平板9鄰接的兩個製程腔室 中）的麗力條件幾乎都相同。 田於等管10係固定至分離平板 被強化，因此可使用小厚度之分 刀雕十板。此外，由於 在分離平板9兩側的壓力條件會 也 為共同抽吸開口 11 而幾乎相同’故可減少分離平板9的厚度。 參照導管19即可瞭解導管 s旳另一種配置形式。導 12 200946707 管19係藉由分離平板9而分隔為兩個半部2〇與21， 其具有獨立的抽吸開口 24、25。因此，閥件或蓋口（圖 中未示）可置於導管19的兩半部20、21中，以關閉 抽吸開口 24或25其中之一。故’與分離平板9相鄰 的製程腔室係可分別被排空。然而，導管19的設計亦 強化分離平板9’特別是當導管延伸達分離平板9的 高度之一小部分以上時，如圖2所示。The gas or air at the bottom of the process chamber 2 can be excluded. Figure 2 depicts a side view of the separation plate 9 to demonstrate the design of the separation plate 9 and the various versatility of the configuration of the delivery device and conduit. As shown in Fig. 2, one possible way of configuring the conduit 1 is to provide a - long tubular member 'top of the self-contained chamber or the top of the separating plate 9 extending to a region near the bottom of the process chamber, respectively. This is a preferred embodiment when the space conditions under the coating device or process chamber are limited and the transfer device cannot be configured. An example t having sufficient space below and below the process chamber to lift the device, if there is a suction opening at a particular location in the process chamber is not as important, then only short conduits may be provided, such as conduits 17, 19' Extending only a small portion of the height of the separation plate: The south is also defined _ in the vertical direction. Thus, the embodiment shown in Figure 2 includes three transfer devices 13, 16' which are respectively located above the process chamber or at the top of the separation plate, and are located below the process chamber or at the bottom of the separation plate 9 200946707. The fourth delivery device 18. The delivery devices 13, 16 and 18 are connected to short conduits, such as conduits 17 and 19. When the inlet opening is linearly connected in front of the individual ends of the conduits 1, 、 17, 19, the feed devices 12, 13, 16 and 18 are vertically aligned, as shown in Figure 2. Further, the feeding means can be arranged in a horizontal manner so that the inlet openings of the (4) feeding means 12, 13, 16 and 18 must be connected to the pipes 10, 17 and 19 by means of a f pipe. ❹ Figure 3 does not depict a section along the line indicated by the arrow in Figure 2. Figure 3 reveals that the catheters 1 , 19 can be secured to the separation plate 9 in different ways. The catheter 10 is placed in the recess of the separation plate 9 in the conduit ι: formed by a tube placed in the groove, and which is hermetically fixed to the separation plate 9 (for example by means of fusion, other Means to connect the conduit 1G (4) to the separation plate 9, for example using mating, adhesive or frictional engagement with each other. Since the tube of the catheter 10 is disposed in the groove of the separation flat 9 'the common suction opening u at the end of the catheter 10 It is formed for use in two process chambers near the separation plate 9. Therefore, the Lili conditions on both sides of the separation flat: 9 (i.e., in the two process chambers adjacent to the separation plate 9) are almost the same. The equalizing tube 10 is fixed to the separating plate to be reinforced, so that the ten-plate can be carved with a small thickness. Further, since the pressure conditions on both sides of the separating plate 9 are also the same as the common suction opening 11, it is almost the same. The thickness of the separation plate 9 is reduced. Another configuration of the catheter s can be understood with reference to the catheter 19. Guide 12 200946707 The tube 19 is separated into two halves 2〇 and 21 by means of a separating plate 9, which has independent suction. Opening 2 4, 25. Therefore, a valve member or a cover (not shown) may be placed in the two halves 20, 21 of the conduit 19 to close one of the suction openings 24 or 25. Thus, the separation plate 9 is The adjacent process chambers can be emptied separately. However, the design of the conduit 19 also reinforces the separation plate 9', particularly when the conduit extends over a fraction of the height of the separation plate 9, as shown in FIG.
圖4與5分別說明了分離平板9a或9b的其他實 施例，其具有不同的導管10a或l〇b之配置。 根據圖4所示之實施例’分離平板9a係由一雙壁 式架構所形成，其包括彼此相距一距離之壁23與24, 因而定義出一個可容納導管l〇a的空間。在導管1〇a 的抽吸末端配置了兩個彎管，其各具有一抽吸開口以 供分離平板9a兩侧的兩個製程腔室之用。 根據圖5,導管10b係結合至分離平板％的一側， 這也是一個有助於強化分離平板9b的實施例。然而， 此實施例更易於製造’這是因為其不需於分離平板孙 中切割出1槽。開口需形成於導管1Qb抽吸末端處 至分離平板9b中，以使連接至導f⑽㈣送裝置可 排空分離平板9b兩側的兩個製程腔室。 於分離平板9Ή處，因而導管可併入：：配置 中、或與分離平板結合。因此，分離平板9:: 表面平行的平面26切割了導管1。與19,其與分離平 13 200946707 板10a的平面26a相對於導管i〇a的情形相似。此外， 在圖5的實施例中，分離平板朴的平面2仳並不切割 導管10b 〇 本發明雖以所示實施例加以描述’但該領域技術 人士應知本發明並不限於這些實施例，含有說明書中 所揭露之所有特徵的不同結合之修飾例與修正例、或 藉由省略實施例中特徵而仍不背離本發明如附申請專 利範圍中所定義之範疇的修飾例與修正例亦為可行。 特別是，即使單一請求項僅依附於其他單一請求項， 本發明仍包括所有申請專利範圍的可能組合。 【圖式簡單說明】 本發明的其他優勢、特徵與特性參考如附圖式而詳細說 明，這些圖式係完全以示意方式進行繪製，其中： 圖1係本發明一實施例之部分透視圖； 圖2係圖1所示裝置之分離平板的側視圖； 圖3係圖2之分離平板中沿圖2所示箭頭之交叉線所取 的截面圖； 圖4係與圖3之分離平板相似之另-實施例的截面圖； 以及 圖5係分離平板之第三實施例的截面圖。 【主要元件符號說明】 200946707Figures 4 and 5 illustrate other embodiments of the separation plate 9a or 9b, respectively, which have different configurations of conduits 10a or 10b. According to the embodiment shown in Fig. 4, the separating plate 9a is formed by a double-walled structure including walls 23 and 24 at a distance from each other, thereby defining a space for accommodating the duct 10a. Two bent tubes are provided at the suction end of the catheter 1A, each having a suction opening for separating the two process chambers on both sides of the flat plate 9a. According to Fig. 5, the catheter 10b is bonded to one side of the separation plate %, which is also an embodiment which contributes to strengthening the separation plate 9b. However, this embodiment is easier to manufacture' because it does not require cutting 1 slot in the separation flat. The opening is formed in the suction end of the conduit 1Qb into the separation plate 9b so that the connection to the guide f(10) (four) feeding device can evacuate the two process chambers on both sides of the separation plate 9b. At the separation plate 9Ή, the catheter can be incorporated into: the configuration, or combined with the separation plate. Therefore, the separation plate 9:: the plane 26 parallel to the surface cuts the catheter 1. And 19, which is similar to the case where the plane 26a of the plate 10a is separated from the pipe i〇a. Further, in the embodiment of Fig. 5, the plane 2 of the separation plate is not cut by the catheter 10b. The present invention has been described in the illustrated embodiment, but it should be understood by those skilled in the art that the invention is not limited to the embodiments. Modifications and modifications of the various combinations of the various features disclosed in the specification, or modifications and omissions from the scope of the invention as defined in the appended claims feasible. In particular, even if a single claim is only attached to other single claims, the present invention includes all possible combinations of the scope of the claims. BRIEF DESCRIPTION OF THE DRAWINGS Other advantages, features, and characteristics of the present invention will be described in detail with reference to the accompanying drawings in which: FIG. 1 is a partial perspective view of an embodiment of the invention; Figure 2 is a side elevational view of the separation plate of the apparatus of Figure 1; Figure 3 is a cross-sectional view of the separation plate of Figure 2 taken along the line of the arrow shown in Figure 2; Figure 4 is similar to the separation plate of Figure 3. A cross-sectional view of another embodiment; and Fig. 5 is a cross-sectional view of a third embodiment of the separation plate. [Main component symbol description] 200946707
1， 2, 3, 4 製程腔室 5, 6 通道 7, 8 塗佈工具 9, 9a, 9b •分離平板 10, 10a, 10b 導管 11 抽吸開口 12, 13 唧送裝置 14, 15 結合門 16, 18 唧送裝置 17, 19 導管 20, 21 半部 22 基板 23, 24 壁 24, 25 抽吸開口 26, 26a, 26b 平面1, 2, 3, 4 Process chamber 5, 6 channels 7, 8 Coating tools 9, 9a, 9b • Separation plates 10, 10a, 10b Conduit 11 Suction opening 12, 13 Feeding device 14, 15 Combined door 16 , 18 feed device 17, 19 conduit 20, 21 half 22 base plate 23, 24 wall 24, 25 suction opening 26, 26a, 26b plane
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