200937028 九、發明說明 【發明所屬之技術領域】 本發明係與使用於液晶面板等檢查對象板之檢查的探 針單元及檢査裝置相關。 【先前技術】 探針一般係形成平塗接地面（mat ground plane )來 @ 控制電氣特性。其實例如專利文獻1所示。依據第2圖及第 3圖，針對專利文獻1之探針進行槪略說。 被檢査裝置1將5個電極並列成一列，其中，4個係電 源電極2，1個係接地電極3。配置於配線板4下側之被檢查 裝置1側的電源配線5及接地配線6接觸於被檢查裝置1之複 數電極。電源配線5及接地配線6，係配合電源電極11及接 地電極12之位置來配置。 於配線板4之接地配線6的相反面，介由絕緣體7配設 〇 著第1平塗接地面8，介由貫通孔9電氣連結著接地配線6及 ^ 第1平塗接地面8。該第1平塗接地面8，形成於配線板4之 絕緣體7的全面。 如上所示，藉由使與接地電極12同電位之第1平塗接 地面8位於電源配線5之上側，無需將電容器插入電源配線 5與接地配線6之間，即可降低探針前端之電源配線5之前 端部分的電感成份。藉此，可縮小電源配線5彼此之間隔 及電源配線5與接地配線6之間隔，而實現對具有窄間距（ 例如，200μπι以下）之電極配置的被檢查裝置之電源供給 200937028 此種探針時，藉由平塗接地面8所具有之機能’不但 可以實現電氣特性之電感的控制’亦可實現阻抗控制。 [專利文獻1] 日本特開2003-152036號公報 【發明內容】 然而，近年之檢查對象板持續朝高精細化發展’預測 檢查信號將隨之高頻化。例如，預估高精細TV等，於不久 的將来，檢查信號將成爲18 0Hz。其次，隨著檢査信號之 高頻化，信號線之阻抗若未進行高度整合，則TCP驅動用 積體電路將會發生驅動不良的問題。 本發明之目的係在提供可解決上述問題，即使檢查信 號高頻化亦可進行安定之檢査的探針單元及檢查裝置。 以解決前述課題爲目的之本發明的探針單元之特徵， 係具備：具有接觸檢查對象板並傳送檢查信號之探針的探 針組合體、及用以使前述探針側與外部裝置側形成電氣連 結之連結纜線部，前述連結纜線部具有傳送用以進以進行 檢查之電氣信號的FPC纜線，該FPC纜線具備傳送檢查信 號之複數信號線、於一側面形成有該信號線之FPC基板、 形成於該FPC基板之另一側面之接地層、以及成爲該接地 層之一部而被插入前述FPC基板之一側面之複數前述信號 線間之線狀接地線。 -6- 200937028 以使用於具備：於結束對從外部插入之檢查對象板之 檢查後將前述探針單元搬出至外部之面板設置部、及支撐 並測試從該面板設置部所受取之檢查對象板的測定部之檢 查裝置爲佳。 即使檢查信號高頻化’亦可進行安定之檢查，且可維 持高檢查精度。 Φ 【實施方式】 以下，參照附錄圖面，針對本發明實施形態之探針單 元進行說明。此外，組合有本實施形態之探針單元的檢查 裝置，可以爲各種裝置。例如，檢查對象爲液晶面板時， 於其製造工程，針對被封入液晶之液晶面板，進行是否具 有規格書性能之檢査（試驗）。該檢査時，一般而言，係 使用具有複數探針之探針單元的檢查裝置。此時，以使檢 査裝置之各探針推壓液晶面板之電極的狀態，對特定電極 〇 供應特定電氣信號來進行檢査。此種檢査裝置全部可組用 實施形態之探針單元。 此種檢查裝置之一例如第4圖所示。圖示之檢査裝置 1 1，主要係由面板設置部12及測定部13所構成。 面板設置部12係以將從外部插入之液晶面板等檢查對 象板15搬送至測定部13，並將結束檢查之檢査對象板15搬 送至外部爲目的之裝置。面板設置部12，於開口部16之內 側具有面板設置台17，以該面板設置台17支撐檢查對象板 1 5並搬送至測定部1 3。此外，面板設置台1 7，受取於測定 200937028 部13結束檢査之檢査對象板15並搬送至外部。 測定部13係支撐從面板設置部12受取之檢查對象板15 並進行試驗之裝置。測定部13之構成，係具備墊木頂18及 探針單元21等。 墊木頂18係以支撐檢查對象板15爲目的之構件。該墊 木頂18 ’獲得χγΖΘ台（未圖示）之支撐，控制XYZ軸方向 之移動及旋轉，用以調整檢查對象板15之位置。 本發明之探針單元21，組合於如上所述之檢查裝置11 。具體而言，探針單元21，係以朝向底座20之開口 20A之 狀態獲得底座20之支撐。此外，前述檢査裝置11係組合著 本發明之探針單元21之檢查裝置的一例。本發明可適用於 可組合本發明之探針單元21之全部檢查裝置。 探針單元21，如第5圖所示，其構成係具備探針座22 、支撐部23、探針組合體24、以及連結纜線部25。 前述探針座22係以一體方式支撐支撐著探針組合體24 之複數支撐部23的板材。利用該探針座22，可介由支撐部 23以面對工作台26上之液晶面板等之檢查對象板15的狀態 支撐複數探針組合體24。 前述支撐部23，係以其基端側支撐於前述探針座22之 狀態，而以其前端側支撐前述探針組合體24爲目的之構件 。該支撐部23，如第5圖及第6圖所示’其構成係具備’：直 接裝設於前述探針座22而支撐全體之懸吊塊28、支撐於該 懸吊塊28之前端部的滑動塊29、以及—體裝設於該滑動塊 2 9之内側面（第6圖中之下側面）的探針板3 0。 -8- 200937028 探針組合體24係以接觸檢查對象板15之電路電極並傳 送檢査信號爲目的之構件。探針組合體24係裝設於探針板 3 0之下側面。該探針組合體24之構成，係具備探針塊32及 探針33。 探針塊32係直接裝設於探針板30之下側面。於該探針 塊32之下側，裝設著探針33。探針33係直接接觸檢查對象 板15之電路電極的構件。探針33，於其前端部及基端部分 0 別具備針部33八、336，前端部之針部33八係接觸於檢查對 象板15之電路電極，基端部之針部33B則接觸於連結纜線 部25之端子。 連結纜線部25係以電氣連結前述探針3 3側及外部裝置 側（未圖示）爲目的之構件。該連結纜線部25，具體而言 ，係直接連結於前述探針33之針部33B及探針座22側之信 號基板35，介由該探針座22側之電路，與外部裝置進行電 氣連結。亦即，該連結纜線部25，介由探針座22之信號基 ❹ 板35電氣連結前述探針組合體24之探針33與外部裝置。該 連結纜線部25，如第6圖〜第8圖所示，係由FPC板37、驅 動用積體電路38、以及FPC纜線3 9所構成》 前述FPC板37係將前述連結纜線部25固定於前述探針 組合體24側之構件。FPC板3 7係裝設於探針板3 0之下側。 驅動用積體電路38係用以執行檢查相關之處理的電路 。驅動用積體電路38係裝設於FPC板37之下側。驅動用積 體電路38之一方連結於FPC纜線39。驅動用積體電路38之 另一方，介由各配線41電氣連結於探針33之基端側的針部 -9- 200937028 33B。 FPC纜線39係用以傳送檢查相關電氣信號之纜線。 FPC纜線39，以其一方電氣連結至固定於FPC板37之驅動 用積體電路38的狀態，另一方電氣連結於配設在探針座22 之下側的信號基板35。藉此，FPC纜線39，介由該信號基 板35電氣連結至外部裝置，而將來自外部裝置之檢査信號 傳送至驅動用積體電路38。 FPC纜線39，如第1及7〜9圖所示，係由FPC基板43、 信號線44、平塗接地層45、接地線46、以及連結固定部47 所構成。 FPC基板43，係以於其一側面形成信號線44而於另一 側面形成平塗接地層45爲目的之基板。FPC基板43係由具 有可以連結固定部47折曲成U字形之程度之柔軟性的公知 材料所構成。 信號線44係以電氣連結驅動用積體電路3 8與信號基板 35並傳送檢査信號爲目的之線。信號線44係配設於FPC基 板43之一側面（第1圖之下側面）。信號線44之數係配合 探針33之支數進行設定。 平塗接地層45係配設於FPC基板43之另一側面（第1圖 之上側面）之全面的層。該平塗接地層45係夾著FPC基板 43與信號線44相對而配設’具有阻抗整合的機能。爲了得 到正確的阻抗整合，配合接地線46來設定信號線44與平塗 接地層45之間隔（FPC基板43之厚度）、及信號線44及平 塗接地層45與FPC基板43間之接著層厚度等之條件。 200937028 接地線46係構成平塗接地層45之一部分而直接插入於 信號線44之間的線狀接地層。接地線46係配設於複數信號 線44之間。此處，係以1 〇條對1條之比例而隔著一定間隔 配設接地線46。信號線44與接地線46之條數之比率，並未 限制爲1 〇條對1條之比例，可配合阻抗整合而調整成最適 値。其比率方面如後面所述。接地線46以長於信號線44之 方式配設。具體而言，係從FPC基板43之長度方向之一端 U (第1圖之右端）之緣部延伸至比另一端之緣部更前方而 形成。亦即，從FPC基板43之長度方向之另一端之緣部朝 前方延伸一定尺寸（稍大於後述之短路板51之寬度的程度 之尺寸）而形成。其係爲了使短路板51不接觸信號線44而 只接觸接地線46。 接地線46電氣連結於平塗接地層45，而與該平塗接地 層45共同具有阻抗整合之機能。調整接地線46之條數、間 隔、厚度、材質、寬度、長度，而與平塗接地層45共同進 Q 行阻抗整合。接地線46之條數等之調整，因爲即使配合平 塗接地層45仍會發生問題，故必須同時考慮平塗接地層45 ' 之厚度、材質、寬度、長度、面積等之組合，以實驗方式 來設定條件。 接地線46，通常，只使用於與平塗接地層45共同進行 阻抗整合。此外，若爲能無問題地傳送信號等之線，亦可 以當做信號線44使用，而同時具有信號等之傳送及阻抗整 合的機能。 連結固定部47係以支撐FPC基板43並將信號線44電氣 -11 - 200937028 連結至信號基板35側之端子部55爲目的之構件。該連結固 定部47係由支撐板50、短路板51、導電螺絲52、以及支撐 螺絲53所構成。 支撐板50係用以支撐FPC基板43，直接將該FPC基板 43電氣連結至探針33側並間接地電氣連結探針33側與信號 基板35側爲目的之構件。支撐板50，直接地支撐FPC基板 43，且電氣連結FPC纜線39之信號線44與信號基板35側之 端子部55。支撐板50係由纜線支撐部56、及固定部5 7所構 成。 纜線支撐部56係用以捲附並支撐折曲成之U字形之 FPC纜線39的部分。纜線支撐部56係朝信號基板35側之端 子部55側突出而形成。該纜線支撐部56以廣泛範圍將FPC 纜線39之信號線44推壓向信號基板35側之端子部55。 固定部5 7係用以將支撐板50固定於信號基板35側之部 分。於固定部57之兩端部配設有螺絲孔58。於信號基板35 側之相對於該螺絲孔58之位置配設有螺絲孔59。於固定部 57之中間部之6條接地線46之間的位置配設有3個螺絲孔60 〇 此外，支撐板50係由導電材料所構成，接觸平塗接地 層45而電氣連結於平塗接地層45。 短路板51係用以使6條接地線46形成短路之導電板材 。短路板51，以接觸6條接地線46之狀態，利用導電螺絲 52固定於支撐板50。 導電螺絲52係用以電氣連結短路板51與支撐板50而形 200937028 成導通之螺絲。3個導電螺絲5 2，係介由短路板5 1之螺絲 孔61螺入支撐板50之螺絲孔60，而電氣連結短路板51與支 撐板50。此外，因爲支撐板50與平塗接地層45爲電氣連結 ，若平塗接地層45與接地線46爲電氣連結。 支撐螺絲5 3係用以將支撐板5 0固定於信號基板3 5側之 螺絲。支撐螺絲5 3螺合於支撐板5 0之螺絲孔5 8與信號基板 35側之螺絲孔59而將支撐板50固定信號基板35側。 φ 以上之構成的探針單元2 1作用如下。此外，因爲組合 著該探針單元21之檢查裝置全體之作用與傳統檢查裝置相 同，此處以探針單元2 1之阻抗整合爲中心進行說明。 以檢查裝置之信號線44傳送高頻之檢查信號時，因爲 若信號線44之阻抗高度未整合，驅動用積體電路3 8會發生 驅動不良，故進行阻抗整合。此時，因爲阻抗特性對應檢 查裝置之種類而不同，故必須針對各檢查裝置之種類來進 行設定。 φ 具體而言，進行平塗接地層45、構成該平塗接地層45 之一部分之接地線46的厚度、材質等之設定。尤其是，調 整接地線46之條數、信號線44與接地線46之條數之比率、 間隔、厚度、材質、寬度、長度，與平塗接地層45協同運 作而將阻抗特性調整成最佳狀態。 該阻抗特性會因爲檢查信號之頻率等各種條件而不同 。所以，針對各檢査裝置、或針對各使用之檢查信號之頻 率差異等假設各種條件，以實驗方式設定平塗接地層45與 接地線46之厚度、材質等。 -13- 200937028 藉此，夾著FPC基板43，從其一側以平塗接地層45、 從另一側以接地線46，對傳送檢査信號之信號線44產生電 氣的、磁性的影響，進行阻抗特性之調整。 使平塗接地層45及接地線46之厚度、材質等進行各種 變化並以實驗方式限定最佳形態。 藉此，高頻之檢查信號被傳送至信號線44時，平塗接 地層45及接地線46對信號線44產生電氣的、磁性的影響， 而改變其阻抗特性。其次，以整合成對應於各檢查裝置及 探針單元21之最佳阻抗特性的方式進行調整。 藉此，即使高頻之檢査信號被傳送至信號線44時，驅 動用積體電路3 8亦不會發生驅動不良而進行安定之良好檢 查。結果，可以維持高檢查精度。 [變形例] 前述實施形態時，於FPC基板43之另一側面配設有平 塗接地層45，然而，並未限制爲墊層，亦可以爲其他構成 之層。亦可爲例如網目層或格子狀層等之具有間隙之層的 構成，而以阻抗整合之最佳形態來形成層。 【圖式簡單說明】 第1圖係本發明之實施形態之探針單元背面的分解透 視圖。 第2圖係傳統探針單元之平面圖。 第3圖係傳統探針單元之側面圖。 -14- 200937028 第4圖係檢查裝置之一例的正面圖。 第5圖係本發明之探針單元的透視圖。 第6圖係本發明之探針單元的側面圖。 第7圖係本發明之探針單元的背面圖。 第8圖係本發明之探針單元的背面透視圖。 第9圖係本發明之探針單元的背面圖。 φ 【主要元件符號說明】 2 1 :探針單元 22 :探針座 23 :支撐部 24 :探針組合體 2 5 :連結纜線部 2 8 :懸吊塊 2 9 :滑動塊 Q 3 0 :探針板 3 2 :探針塊 3 3 :探針 3 3 A、3 3 B :針部 3 5 :信號基板 37 ： FPC板 38 :驅動用積體電路 39 ： FPC纜線 41 :配線 -15- 200937028 43 ： FPC基板 44 :信號線 45 :平塗接地層 46 :接地線 47 :連結固定部 50 :支撐板 51 :短路板 52 :導電螺絲 5 3 :支撐螺絲 55 :端子部 5 6 :纜線支撐部 57 :固定部 5 8 :螺絲孔 59 :螺絲孔 6 0 :螺絲孔 6 1 :螺絲孔[Technical Field] The present invention relates to a probe unit and an inspection device used for inspection of an inspection target panel such as a liquid crystal panel. [Prior Art] Probes generally form a mat ground plane to control electrical characteristics. Actually, for example, Patent Document 1 shows. According to the second and third figures, the probe of Patent Document 1 is briefly described. The device under inspection 1 has five electrodes arranged in a row, of which four are the source electrodes 2 and one is the ground electrode 3. The power supply wiring 5 and the ground wiring 6 disposed on the inspection apparatus 1 side on the lower side of the wiring board 4 are in contact with the plurality of electrodes of the device under inspection 1. The power supply wiring 5 and the ground wiring 6 are arranged to match the positions of the power supply electrode 11 and the grounding electrode 12. On the opposite side of the ground wiring 6 of the wiring board 4, the first flat-coated ground plane 8 is disposed via the insulator 7, and the ground wiring 6 and the first flat-coated ground plane 8 are electrically connected via the through-hole 9. The first flat-coated ground plane 8 is formed on the entire surface of the insulator 7 of the wiring board 4. As described above, by placing the first flat ground plane 8 having the same potential as the ground electrode 12 on the upper side of the power supply wiring 5, it is not necessary to insert a capacitor between the power supply wiring 5 and the ground wiring 6, thereby reducing the power supply of the probe front end. The inductance component of the front end portion of the wiring 5. Thereby, the distance between the power supply lines 5 and the distance between the power supply lines 5 and the ground lines 6 can be reduced, and the power supply to the device under test having a narrow pitch (for example, 200 μm or less) can be supplied to the power supply of 200937028. Impedance control can also be achieved by the function of the flat-coated ground plane 8 'not only can control the inductance of the electrical characteristics'. [Patent Document 1] Japanese Laid-Open Patent Publication No. 2003-152036. SUMMARY OF THE INVENTION However, in recent years, the inspection target board continues to develop toward high definition. For example, it is estimated that high-definition TV, etc., will check the signal to become 18 Hz in the near future. Secondly, with the high frequency of the inspection signal, if the impedance of the signal line is not highly integrated, the TCP driver integrated circuit will have a problem of poor driving. SUMMARY OF THE INVENTION An object of the present invention is to provide a probe unit and an inspection apparatus which can solve the above problems and perform inspection of stability even if the inspection signal is high frequency. The probe unit of the present invention for solving the above-mentioned problems includes a probe assembly having a probe that contacts an inspection target plate and transmits an inspection signal, and a probe assembly and an external device side. In the connection cable portion of the electrical connection, the connection cable portion has an FPC cable that transmits an electrical signal for inspecting, and the FPC cable includes a plurality of signal lines for transmitting an inspection signal, and the signal line is formed on one side surface The FPC board, the ground layer formed on the other side surface of the FPC board, and the linear ground line which is inserted into one side of the ground layer and inserted between the plurality of signal lines on one side surface of the FPC board. -6-200937028 is used to support and test the panel to be taken from the panel installation unit after the inspection of the inspection target panel inserted from the outside is completed, and the probe unit is carried out to the outside. The inspection device of the measuring unit is preferred. Even if the check signal is high-frequency, the stability check can be performed and the high inspection accuracy can be maintained. [Embodiment] Hereinafter, a probe unit according to an embodiment of the present invention will be described with reference to an attached drawing. Further, the inspection device in which the probe unit of the present embodiment is combined may be various devices. For example, when the inspection target is a liquid crystal panel, in the manufacturing process, the liquid crystal panel sealed with the liquid crystal is inspected (tested) for the performance of the specification. In this inspection, in general, an inspection apparatus using a probe unit having a plurality of probes is used. At this time, a specific electrical signal is supplied to the specific electrode 来 to check the state in which the probes of the inspection device are pressed against the electrodes of the liquid crystal panel. All of the inspection devices can be combined with the probe unit of the embodiment. One of such inspection devices is shown in Fig. 4, for example. The inspection apparatus 1 1 shown in the drawing is mainly composed of a panel installation unit 12 and a measurement unit 13. The panel installation unit 12 is a device that transports the inspection target panel 15 such as a liquid crystal panel inserted from the outside to the measurement unit 13 and transports the inspection target panel 15 that has been inspected to the outside. The panel installation portion 12 has a panel installation table 17 on the inner side of the opening portion 16, and the inspection target plate 15 is supported by the panel installation table 17 and transported to the measurement portion 13 . In addition, the panel mounting table 17 is taken from the inspection target panel 15 which is inspected by the measurement unit 200937028 and is transported to the outside. The measuring unit 13 is a device that supports the test target plate 15 received from the panel installation unit 12 and tests it. The configuration of the measuring unit 13 includes a pad top 18, a probe unit 21, and the like. The skid top 18 is a member for supporting the inspection target panel 15. The raft top 18' is supported by a χγ ΖΘ (not shown), and controls the movement and rotation in the XYZ-axis direction to adjust the position of the inspection target plate 15. The probe unit 21 of the present invention is combined with the inspection apparatus 11 as described above. Specifically, the probe unit 21 is supported by the base 20 in a state toward the opening 20A of the base 20. Further, the inspection apparatus 11 is an example of an inspection apparatus in which the probe unit 21 of the present invention is combined. The present invention is applicable to all inspection apparatuses in which the probe unit 21 of the present invention can be combined. As shown in FIG. 5, the probe unit 21 includes a probe holder 22, a support portion 23, a probe assembly 24, and a connection cable portion 25. The probe holder 22 integrally supports the plate material supporting the plurality of support portions 23 of the probe assembly 24. With the probe holder 22, the plurality of probe assemblies 24 can be supported by the support portion 23 in a state of facing the inspection target sheet 15 such as a liquid crystal panel on the table 26. The support portion 23 is a member for supporting the probe assembly 24 at its distal end side with its proximal end side supported by the probe holder 22. As shown in FIGS. 5 and 6 , the support portion 23 has a configuration in which a suspension block 28 that is directly attached to the probe holder 22 and supports the entire suspension block 28 is supported at the front end of the suspension block 28 . The sliding block 29 and the probe plate 30 are mounted on the inner side surface (the lower side in FIG. 6) of the sliding block 29. -8- 200937028 The probe assembly 24 is a member for contacting the circuit electrode of the inspection target panel 15 and transmitting an inspection signal. The probe assembly 24 is mounted on the lower side of the probe card 30. The probe assembly 24 is configured to include a probe block 32 and a probe 33. The probe block 32 is directly mounted on the lower side of the probe card 30. On the lower side of the probe block 32, a probe 33 is mounted. The probe 33 is a member that directly contacts the circuit electrode of the inspection target board 15. The probe 33 has the needle portions 33 and 336 at the distal end portion and the proximal end portion 0. The needle portion 33 of the distal end portion is in contact with the circuit electrode of the inspection target plate 15, and the needle portion 33B at the proximal end portion is in contact with The terminal of the cable portion 25 is connected. The connecting cable portion 25 is a member for electrically connecting the probe 3 3 side and the external device side (not shown). Specifically, the connection cable portion 25 is directly connected to the needle portion 33B of the probe 33 and the signal substrate 35 on the probe holder 22 side, and is electrically connected to an external device via the circuit on the probe holder 22 side. link. That is, the connecting cable portion 25 electrically connects the probe 33 of the probe assembly 24 and the external device via the signal base plate 35 of the probe holder 22. As shown in FIGS. 6 to 8 , the connection cable portion 25 is composed of an FPC board 37, a drive integrated circuit 38, and an FPC cable 39. The FPC board 37 is used to connect the aforementioned cable. The portion 25 is fixed to the member on the side of the probe assembly 24. The FPC board 3 7 is mounted on the lower side of the probe card 30. The drive integrated circuit 38 is a circuit for performing inspection related processing. The drive integrated circuit 38 is mounted on the lower side of the FPC board 37. One of the drive integrated circuits 38 is connected to the FPC cable 39. The other of the drive integrated circuits 38 is electrically connected to the needle portion -9-200937028 33B on the proximal end side of the probe 33 via the respective wires 41. The FPC cable 39 is used to transmit cables for checking related electrical signals. The FPC cable 39 is electrically connected to the drive integrated circuit 38 fixed to the FPC board 37, and the other is electrically connected to the signal board 35 disposed on the lower side of the probe holder 22. Thereby, the FPC cable 39 is electrically connected to the external device via the signal substrate 35, and the inspection signal from the external device is transmitted to the driving integrated circuit 38. The FPC cable 39 is composed of an FPC board 43, a signal line 44, a flat coating ground layer 45, a ground line 46, and a connection fixing portion 47 as shown in Figs. 1 and 7 to 9. The FPC board 43 is a board for the purpose of forming the signal line 44 on one side and forming the flat ground layer 45 on the other side. The FPC board 43 is made of a known material having flexibility to which the fixing portion 47 can be bent into a U shape. The signal line 44 is a line for electrically connecting the drive integrated circuit 38 and the signal substrate 35 to transmit an inspection signal. The signal line 44 is disposed on one side of the FPC substrate 43 (the side below the first drawing). The number of signal lines 44 is set in accordance with the number of probes 33. The flat coating ground layer 45 is disposed on a full layer of the other side surface (the upper side in Fig. 1) of the FPC board 43. The flat-coated ground layer 45 is provided with the function of impedance integration by sandwiching the FPC board 43 with respect to the signal line 44. In order to obtain correct impedance integration, the grounding line 46 is used to set the interval between the signal line 44 and the flat coating ground layer 45 (the thickness of the FPC substrate 43), and the signal line 44 and the interlayer between the flat coating ground layer 45 and the FPC substrate 43. Conditions such as thickness. 200937028 The grounding wire 46 is a linear ground plane that is directly inserted into the signal line 44 as part of the flat coated ground layer 45. The ground line 46 is disposed between the plurality of signal lines 44. Here, the grounding wire 46 is disposed at a predetermined interval by a ratio of one to one. The ratio of the number of signal lines 44 to the number of ground lines 46 is not limited to the ratio of one to one, and can be adjusted to the optimum with impedance integration. The ratio is as described later. The ground line 46 is disposed longer than the signal line 44. Specifically, it is formed from the edge of one end U (the right end of the first drawing) in the longitudinal direction of the FPC board 43 to be further forward than the edge of the other end. In other words, the edge portion of the other end in the longitudinal direction of the FPC board 43 is formed to extend forward by a predetermined dimension (a size slightly larger than the width of the short-circuiting plate 51 to be described later). This is for contacting the ground line 46 only so that the short-circuiting plate 51 does not contact the signal line 44. The grounding wire 46 is electrically coupled to the flat coated ground plane 45 and has the function of impedance integration with the flat coated ground plane 45. The number, spacing, thickness, material, width, and length of the grounding wire 46 are adjusted, and the impedance integration of the grounding layer 45 is performed. The number of the grounding wires 46 is adjusted, because even if the problem is caused by the flat coating of the grounding layer 45, it is necessary to simultaneously consider the combination of the thickness, material, width, length, and area of the flat coating ground layer 45'. To set the conditions. Ground line 46, typically, is only used for impedance integration with flat coated ground plane 45. Further, if it is a line capable of transmitting signals or the like without any problem, it can be used as the signal line 44, and at the same time, it has a function of transmission and impedance integration of signals and the like. The connection fixing portion 47 is a member for supporting the FPC board 43 and connecting the signal line 44 electrically -11 - 200937028 to the terminal portion 55 on the signal board 35 side. The joint fixing portion 47 is composed of a support plate 50, a short circuit plate 51, a conductive screw 52, and a support screw 53. The support plate 50 is for supporting the FPC board 43, and directly connecting the FPC board 43 to the probe 33 side and indirectly electrically connecting the probe 33 side and the signal board 35 side. The support plate 50 directly supports the FPC board 43, and electrically connects the signal line 44 of the FPC cable 39 with the terminal portion 55 on the signal board 35 side. The support plate 50 is composed of a cable support portion 56 and a fixing portion 57. The cable support portion 56 is for attaching and supporting a portion of the U-shaped FPC cable 39 that is bent into a U-shape. The cable support portion 56 is formed to protrude toward the terminal portion 55 side on the signal substrate 35 side. The cable support portion 56 pushes the signal line 44 of the FPC cable 39 to the terminal portion 55 on the signal substrate 35 side in a wide range. The fixing portion 57 is a portion for fixing the support plate 50 to the side of the signal substrate 35. Screw holes 58 are disposed at both ends of the fixing portion 57. A screw hole 59 is disposed at a position on the signal substrate 35 side with respect to the screw hole 58. Three screw holes 60 are disposed at a position between the six grounding wires 46 at the intermediate portion of the fixing portion 57. Further, the supporting plate 50 is made of a conductive material, and is in contact with the flat coating layer 45 and electrically connected to the flat coating. Ground layer 45. The short-circuiting plate 51 is used to form the six grounding wires 46 to form a short-circuited conductive plate. The short-circuiting plate 51 is fixed to the support plate 50 by a conductive screw 52 in a state of contacting the six grounding wires 46. The conductive screw 52 is used to electrically connect the short circuit plate 51 and the support plate 50 to form a screw that turns into the 200937028. The three conductive screws 52 are screwed into the screw holes 60 of the support plate 50 through the screw holes 61 of the short-circuiting plate 51, and electrically connect the short-circuiting plate 51 and the supporting plate 50. In addition, since the support plate 50 and the flat ground layer 45 are electrically connected, the flat ground layer 45 and the ground line 46 are electrically connected. The support screw 53 is a screw for fixing the support plate 50 to the signal substrate 35 side. The support screw 53 is screwed to the screw hole 58 of the support plate 50 and the screw hole 59 on the side of the signal substrate 35 to fix the support plate 50 to the signal substrate 35 side. The probe unit 21 having a configuration of φ or more functions as follows. Further, since the entire inspection apparatus in which the probe unit 21 is combined functions as the conventional inspection apparatus, the impedance integration of the probe unit 21 will be mainly described herein. When the high-frequency inspection signal is transmitted by the signal line 44 of the inspection device, if the impedance height of the signal line 44 is not integrated, the drive integrated circuit 38 is driven to be defective, so that impedance integration is performed. At this time, since the impedance characteristics differ depending on the type of the inspection device, it is necessary to set the type of each inspection device. φ Specifically, the thickness of the grounding layer 45 and the grounding wire 46 constituting a part of the flat grounding layer 45 are set. In particular, adjusting the ratio of the number of the grounding wires 46, the number of the signal wires 44 to the number of the grounding wires 46, the spacing, the thickness, the material, the width, and the length, and the flat coating ground layer 45 work together to adjust the impedance characteristics to the optimum. status. This impedance characteristic differs depending on various conditions such as the frequency of the inspection signal. Therefore, the thickness, material, and the like of the flat grounding layer 45 and the grounding wire 46 are experimentally set for various conditions, such as the frequency difference of the inspection signals for each use, and the like. -13- 200937028 Thereby, the FPC board 43 is sandwiched, and the ground layer 45 is applied from one side to the ground line 46 from the other side, and the signal line 44 for transmitting the inspection signal is electrically and magnetically affected. Adjustment of impedance characteristics. The thickness, material, and the like of the flat coating layer 45 and the grounding wire 46 are variously changed, and the optimum form is experimentally limited. Thereby, when the high frequency inspection signal is transmitted to the signal line 44, the flat coating ground layer 45 and the ground line 46 have an electrical and magnetic influence on the signal line 44, and the impedance characteristics thereof are changed. Next, the adjustment is performed in such a manner as to be integrated into the optimum impedance characteristics of the respective inspection devices and probe units 21. As a result, even if the high-frequency inspection signal is transmitted to the signal line 44, the driving integrated circuit 38 does not cause a driving failure and performs a good inspection of the stability. As a result, high inspection accuracy can be maintained. [Modification] In the above embodiment, the flat ground layer 45 is disposed on the other side surface of the FPC board 43, however, it is not limited to the mat layer, and may be a layer of another structure. It is also possible to form a layer having a gap such as a mesh layer or a lattice layer, and to form a layer in an optimum form of impedance integration. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is an exploded perspective view of the back surface of a probe unit according to an embodiment of the present invention. Figure 2 is a plan view of a conventional probe unit. Figure 3 is a side view of a conventional probe unit. -14- 200937028 Figure 4 is a front view of an example of an inspection device. Figure 5 is a perspective view of the probe unit of the present invention. Figure 6 is a side elevational view of the probe unit of the present invention. Figure 7 is a rear view of the probe unit of the present invention. Figure 8 is a rear perspective view of the probe unit of the present invention. Figure 9 is a rear view of the probe unit of the present invention. φ [Description of main component symbols] 2 1 : Probe unit 22 : Probe holder 23 : Support portion 24 : Probe assembly 2 5 : Connection cable portion 2 8 : Suspension block 2 9 : Sliding block Q 3 0 : Probe card 3 2 : Probe block 3 3 : Probe 3 3 A, 3 3 B : Needle portion 3 5 : Signal substrate 37 : FPC board 38 : Driving integrated circuit 39 : FPC cable 41 : Wiring -15 - 200937028 43 : FPC board 44 : Signal line 45 : Flat coating grounding layer 46 : Grounding wire 47 : Connecting fixing part 50 : Supporting plate 51 : Shorting plate 52 : Conductive screw 5 3 : Supporting screw 55 : Terminal part 5 6 : Cable Wire support portion 57: fixing portion 5 8 : screw hole 59 : screw hole 6 0 : screw hole 6 1 : screw hole