200935029 九、發明說明： 【發明所屬之技術領域】 t發明係關於一種位置校正裝置，特別係關於-種用 於電腦數控系統中加工工件之位置校正裝置。 【先前技術】 如圖1所示 n、订切割之過程中，過大之徑向壓力易造成1件2趣曲 取後導致工件2被加工變形。 【發明内容】 目刖，在電腦數控系統之模具加工製程中，首先要進 ^程式係將工件放在加卫平台之上，亦即校模。習知之 〇板核方式係先將-塊規平行放置於虎钳上，再將工件放置 於塊規上’之後在虎钳兩側擺放軟性材料金屬塾片，最後 上緊虎鉗，然，在挾緊工件之過程中，由於虎甜以及工件 貼合面並非完全平行，故上緊後工件會些許傾斜’此時須 用榔頭進行輕微敲打，一方面係讓虎鉗挾緊工件’另-方 面貝J係讓工件保持一定水平面，以利於加工，其判斷工件 表，水平與否之方式則係由塊規之鬆緊程度來進行判斷， 不僅費時且水平度也不易測量。又，習知之挟持方 ;加工製程中也無法監控加工時工件所受之徑向壓力， 工件2置於一塊規3上，在切刀1對工件 如圖 1如二. .. 鑒於以上内容，有必要提供一種能判斷工件表面水平 否並此進仃工件表面水平度調整之位置校正裝置。 -種位置校正裝置，其包括一用來放置所要加工之工 件之測量平A · ^n. xj〇 σ ’ —故置於該測量平台上之感測器模塊，用 200935029 於感測該測量平台上不同位置之壓力並將其轉化為電壓頻 率讯號’ 一與該感測器模塊之輸出端相連之放大器模塊， 用於將該感測器模塊輸出之電壓頻率訊號放大；一與該放 大器模塊之輸出端相連之單晶片模塊，用於接收放大後之 電壓頻率訊唬，當該單晶片模塊收到並判定該感測器模塊 傳送來之各個位置之電壓頻率訊號不等時，則調整一與該 單晶片模塊之輸出端相連之工具機之加工參數。 〇 該位置校正裝置透過一感測器模塊來取樣測量平台上 各個位置之爻力情況，並透過一放大器模塊將其訊號放大 並傳送給一單晶片模塊，該單晶片模塊在該測量平台上各 個位置之受力情況不同時調整一與其輸出端相連之工具機 之加工參數，使該工具機之加工速度和切削力減小，從而 使該工件加工表面保持水平。 【實施方式】 請參閱圖2,本發明位置校正裝置之較佳實施方式包 ©括一測量平台100、一感測器模塊200、一放大器模塊3〇〇、 一單晶片模塊400及一工具機500，用來對一工件6〇〇之 位置進行校正。 該測量平台100為一分佈均勻之正方形平台，用於放 置該工件600，該工件600放置於該測量平台100上表面 之中央位置’以保證該測量平台1 〇〇各個方向受力均句。 該感測器模塊200包括四個壓力感測器S1、S2、、 S4 ’該等壓力感測器SI、S2、S3、S4均勻分佈於該測量 平台100之四個角上’用於感測該測量平台1〇〇之四個角 200935029 上之受力情況並將其轉化為電壓頻率訊號輸出。 該放大器模塊300包括四個放大器Ll、L2、L3、L4， 該等放大器LI、L2、L3、L4之輸入端分別與該等壓力感 測器SI、S2、S3、S4之輸出端相連，用於將該感測器模 塊200輸出之電壓頻率信號放大。 該單晶片模塊400採用一型號為8051之單晶片，該單 晶片模塊400之輸入端與該等放大器Ll、L2、L3、L4之 ^輸出端相連，該單晶片模塊400接收放大後之電壓頻率訊 號並對各個電壓頻率訊號進行比較，根據比較結果自動調 整該工具機500之加工參數並傳送給該工具機500。 在該工件600被加工之前，將其放置於該測量平台100 之上，並用一固定裝置如虎钳將其固定，該工件600由於 被挟緊可能會有些許傾斜，此時該測量平台100之四個角 上之受力情況不一樣，該放大器模塊300輸出之四個電壓 不一致，則可用一榔頭輕微敲打進行校正。 〇 在該工件600被加工之過程中，由於受到一徑向之加 工壓力，也有可能會發生傾斜。該等麗力感測器S1、S 2、 S3、S4靈敏度極高，在該測量平台100之四個角上之受力 情況稍有不同時即可感測到，並透過該單晶片模塊400即 時調整該工具機500之加工參數，以即時調整工件表面水 平度。 在加工前，該單晶片模塊400存儲該工具機500對該 工件600加工之原始參數。在加工過程中，該等壓力感測 器SI、S2、S3、S4不斷對該測量平台100之四個角上之 200935029 壓力進行取樣並透過該放大器模塊300將其放大 該單晶片模塊400。當該單晶片模塊4〇〇進行電壓比較^ 得到四個電壓大小一致時，表示該測量平台1〇〇之四個角 上党力情況一樣，該工件600之加工表面水平，則該工具 機500繼續以原來之加工速度和切削力對該工件6〇〇進行 加工；若加工過程中該工具機5〇〇之切刀進刀速度太快， 致使該工件600叉到之徑向壓力過大，該等壓力感測器 〇31、52、83、54感測到之壓力不同’當該單晶片模塊_ 進行電壓比較後確認四個電壓大小不一致時，例如當該放 大器L1、L2之輪出電壓不等於該放大器L3、L4i輸出電 壓，則表示該工件600可能要發生傾斜，此時該單晶片模 塊400自動調整該工具機5〇〇之加工參數，即減小該工具 機500之加工速度和切削力使該工件6〇〇受到之徑向壓力 蜒小，直到該放大器L1、L2之輸出電壓等於該放大器l3、 L4之輸帽’從而保持該工件_之加工表面水平。 上料，本發明符合發明專料件，妥依法提出專 利申請。•准’以上所述者僅為本發明之較佳實财式，舉 凡熟悉本案技藝之人士，在爰依本發明精神所作之等效修 飾或菱化，皆應涵蓋於以下之申請專利範圍内。 【圖式簡單說明】 圖1係習知技術中工件發生翹曲之狀態示意圖。 圖2係本發明位置校正裝置之較佳實施方式之方框 圖。 【主要元件符號說明】 9 200 200935029 測量平台 100 感測器模塊 壓力感測器SI、S2、S3、S4 放大器模塊 放大器 LI、L2、L3、L4單晶片模塊 工具機 500 工件 300 400 600200935029 IX. Description of the invention: [Technical field to which the invention pertains] The invention relates to a position correcting device, and in particular to a position correcting device for machining a workpiece in a computer numerical control system. [Prior Art] As shown in Fig. 1, during the process of cutting, the excessive radial pressure is likely to cause one piece of 2 interesting music to be deformed after the workpiece 2 is processed. [Summary of the Invention] It is obvious that in the mold processing process of the computer numerical control system, the program is first placed on the reinforced platform, that is, the calibration mode. The conventional method of slab nucleation is to place the block gauges in parallel on the vise, and then place the workpiece on the block gauge. After that, place the soft material metal cymbals on both sides of the vise, and finally tighten the vise. In the process of tightening the workpiece, since the tiger sweetness and the workpiece bonding surface are not completely parallel, the workpiece will be slightly inclined after tightening. At this time, the hammer must be slightly tapped. On the one hand, the vise is tightened to the workpiece. In terms of aspect, the J-series keeps the workpiece at a certain level to facilitate the processing. The method of judging the workpiece table, whether it is horizontal or not, is judged by the tightness of the block gauge, which is not only time-consuming but also difficult to measure. Moreover, it is not known that the radial pressure of the workpiece during processing is not detected in the machining process. The workpiece 2 is placed on a gauge 3, and the workpiece in the cutter 1 is as shown in Fig. 1 as follows. It is necessary to provide a position correcting device that can determine the level of the surface of the workpiece and adjust the level of the surface of the workpiece. a position correcting device comprising a measuring flat A · ^n. xj〇σ ' for placing a workpiece to be processed - so that the sensor module placed on the measuring platform is used to sense the measuring platform with 200935029 The pressure at different positions is converted into a voltage frequency signal 'an amplifier module connected to the output end of the sensor module for amplifying the voltage frequency signal outputted by the sensor module; and the amplifier module The single-chip module connected to the output end is configured to receive the amplified voltage frequency signal. When the single-chip module receives and determines that the voltage frequency signals of the respective locations transmitted by the sensor module are not equal, adjust one Processing parameters of the machine tool connected to the output of the single wafer module. The position correcting device samples the force of each position on the measuring platform through a sensor module, and amplifies and transmits the signal to a single chip module through an amplifier module, and the single chip module is respectively arranged on the measuring platform When the force of the position is different, the machining parameters of the machine tool connected to the output end thereof are adjusted, so that the machining speed and the cutting force of the machine tool are reduced, so that the machining surface of the workpiece is kept horizontal. Embodiments of the present invention include a measurement platform 100, a sensor module 200, an amplifier module 3A, a single wafer module 400, and a machine tool. 500, used to correct the position of a workpiece 6〇〇. The measuring platform 100 is a uniformly distributed square platform for placing the workpiece 600, and the workpiece 600 is placed at a central position on the upper surface of the measuring platform 100 to ensure that the measuring platform 1 is subjected to force in all directions. The sensor module 200 includes four pressure sensors S1, S2, S4 'the pressure sensors SI, S2, S3, S4 are evenly distributed on the four corners of the measuring platform 100' for sensing The force on the four corners 200935029 of the measuring platform 1 is converted into a voltage frequency signal output. The amplifier module 300 includes four amplifiers L1, L2, L3, and L4. The inputs of the amplifiers LI, L2, L3, and L4 are respectively connected to the output ends of the pressure sensors SI, S2, S3, and S4. The voltage frequency signal output by the sensor module 200 is amplified. The single chip module 400 uses a single chip of the 8051 type. The input end of the single chip module 400 is connected to the output terminals of the amplifiers L1, L2, L3, and L4, and the single chip module 400 receives the amplified voltage frequency. The signal is compared with each voltage frequency signal, and the processing parameters of the power tool 500 are automatically adjusted according to the comparison result and transmitted to the machine tool 500. Before the workpiece 600 is processed, it is placed on the measuring platform 100 and fixed by a fixing device such as a vise. The workpiece 600 may be slightly tilted due to being tightened. At this time, the measuring platform 100 is four. The force on the corners is different. If the four voltages output by the amplifier module 300 are inconsistent, it can be corrected by a slight tap on the hammer.倾斜 During the machining of the workpiece 600, tilting may occur due to a radial processing pressure. The Lili sensors S1, S2, S3, and S4 are extremely sensitive, and are sensed when the stress on the four corners of the measuring platform 100 is slightly different, and are transmitted through the single-wafer module 400. The processing parameters of the machine tool 500 are adjusted in real time to instantly adjust the surface level of the workpiece. The single wafer module 400 stores the raw parameters of the tooling machine 500 for processing the workpiece 600 prior to processing. During processing, the pressure sensors SI, S2, S3, S4 continuously sample the 200935029 pressure at the four corners of the measurement platform 100 and amplify the single wafer module 400 through the amplifier module 300. When the single-chip module 4 is subjected to voltage comparison and the four voltages are the same, it means that the party force of the four corners of the measuring platform is the same, and the machining surface level of the workpiece 600 is the machine tool 500. Continue to process the workpiece 6〇〇 with the original machining speed and cutting force; if the cutter feed speed of the machine tool is too fast during the machining process, the radial pressure of the workpiece 600 to the fork is too large, the The pressures sensed by the equal pressure sensors 〇31, 52, 83, 54 are different. 'When the voltage comparison of the single-chip module _ confirms that the four voltages are inconsistent, for example, when the voltages of the amplifiers L1 and L2 are not Equivalent to the output voltage of the amplifiers L3 and L4i, indicating that the workpiece 600 may be tilted. At this time, the single-wafer module 400 automatically adjusts the processing parameters of the machine tool 5, that is, reduces the processing speed and cutting of the machine tool 500. The force causes the workpiece 6〇〇 to be subjected to a radial pressure reduction until the output voltages of the amplifiers L1, L2 are equal to the output caps of the amplifiers l3, L4, thereby maintaining the workpiece surface level of the workpiece. The material is in accordance with the invention and the patent application is made according to the law. • The above is only the preferred form of the present invention. Those skilled in the art will be able to cover the equivalent modifications or simplifications in the spirit of the present invention. . BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic view showing a state in which a workpiece is warped in a conventional technique. Figure 2 is a block diagram of a preferred embodiment of the position correcting device of the present invention. [Main component symbol description] 9 200 200935029 Measuring platform 100 Sensor module Pressure sensor SI, S2, S3, S4 Amplifier module Amplifier LI, L2, L3, L4 single chip module Machine tool 500 Workpiece 300 400 600
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