200927374 九、發明說明： ， 【發明所屬之技術領域】 本發明是有關於一種拋光裝置，特別是指一種電泳研 磨拋光裝置及電泳研磨拋光方法。 【先前技術】 傳統機械研磨裝置（如磨床）具有以下缺失： ‘ 一、受限於磨輪製造技術，利用1〜2//m磨粒以丁之粒 ❺ 徑製作該磨輪有其製程上之困難性，因此不易量產化。 一、 且當具較大尺寸磨粒之拋光磨輪被應用於拋光製 程時，所產生之拋光痕較寬，表面粗糙度差，導致拋光品 質不佳的缺失。 二、 再者當磨輪於研磨拋光時其切刃鈍化後，容易因 該鈍化後之磨粒殘留於拋光磨輪上，導致工件表面會產生 研磨燒焦現象，又該工件切屑容易填滿磨粒間隙，使拋光 磨輪失去切削能力’同時產生熱效應。 ❹ 四、再則利用該磨輪拋光工件時，容易導致工件產生 應變效應，導致工件變形，故該技術不利於薄板精密拋光 研磨的進行。 " 【發明内容】 因此，本發明之目的，即在提供一種易量產、拋光品 質較佳、減少熱效應及變形且利於薄板精密拋光研磨的電 泳研磨拋光裝置。 本發明之另一目的，在提供一種拋光品質與耐用度較 佳的電泳研磨拋光方法。 5 200927374 • 於是’本發明電泳研磨拋光裝置是適用於供容裝電泳 • 研磨液以研磨一工件，該電泳研磨液具有多個研磨粒，該 電泳研磨拋光裝置包含一機台單元、一旋轉研磨單元、一 升降單元及一電控單元。 該機台單元包括一容裝該電泳研磨液與該工件的槽體 ' ，該旋轉研磨單元可相對該工件旋轉以研磨該工件，並包 括一伸入該槽體内的研磨座。該升降單元包括一升降組合 ❹體，及一 s又置於該升降組合體上並位於該槽體内的電極， 電控單元包括一供電給該電極與該研磨座的電源供應器。 該升降組合體可以相對該槽體在一增電限制位置與一減電 限制位置間移動’當該升降組合體朝向該增電限制位置移 動時’該電極朝向鄰近該研磨座方向移動，當該升降組合 體朝向該減電限制位置移動時，該電極朝遠離該研磨座方 向移動。 本發明電泳研磨拋光裝置的功效在於藉由將該研磨座 Φ 與該電極通電，該電泳研磨液之研磨粒能沈積於該旋轉研 磨單元上，藉以研磨薄板，此種方式使得該電泳研磨拋光 裝置易量產、拋光品質較佳、減少熱效應及變形且利於薄 板精密拋光研磨。該升降組合體能改變該電極的位置，而 控制該電泳研磨液之研磨粒的沈積速度，而使得拋光品質 更加的提升。 本發明電泳研磨拋光方法是先將一工件、一旋轉研磨 單元的一研磨座、與一升降單元的一電極置於電泳研磨液 中’再讓該旋轉研磨單元相對該工件旋轉，以研磨該工件 200927374 * ’並將該研磨座與該電極通電，使電泳研磨液之研磨粒沈 • 積於該旋轉研磨單元上。接著判斷該研磨座與該電極間的 電流大小’若是正常的電流大小則不做任何動作；若是該 電流過大則將該電極朝向鄰近該研磨座方向移動，並再度 判斷該研磨座與該電極間的電流大小；若是該電流過小則 將該電極朝向遠離該研磨座方向移動，並再度判斷該研磨 座與該電極間的電流大小，不斷循環。藉此，該電泳研磨 0 拋光方法同樣能達到上述的功效。 【實施方式】 有關本發明之前述及其他技術内容、特點與功效，在 以下配合參考圖式之一個較佳實施例的詳細說明中，將可 清楚的呈現。 參閱圖1，本發明電泳研磨拋光裝置及電泳研磨拋光方 法之較佳實施例中’該電泳研磨拋光裝置是適用於供容裝 電泳研磨液20以研磨一工件21 ^該電泳研磨液20包括多 〇 個粒徑為1 . 5 μηι以下並由碳化矽（sic)所製成的研磨粒 201 ’及由氫氧化納（NaOH)所製成並與該等研磨粒201 混合一起的溶液’該工件21為一金屬薄板。 該電泳研磨拋光裝置包含一機台單元3、一旋轉研磨單 元4、一升降單元5及一電控單元6。該機台單元3包括一 容裳該電泳研磨液20與該工件21的槽體31。該旋轉研磨 單元4可相對該工件21旋轉以研磨該工件21，並包括一伸 入該槽體31内並可相對該工件21旋轉的研磨座41，及一 矛J用導電膠黏著於該研磨座41底面的研磨墊42，該研磨墊 7 200927374 . 42供該電泳研磨液20之研磨粒201沈積於其上，並藉以接 , 觸研磨該工件21 〇 該升降單元5包括一升降組合體51，及一設置於該升 降組合體51上並位於該槽體31内的電極52。該升降組合 體51具有一馬達511、一供該馬達511驅動的減速器512、 一供該減速器512帶動的螺桿513 ' 一可相對該螺桿513旋 轉地套於該螺桿513外的螺帽514、一其一端設置於該螺帽 ❹ 514另一端並可移動地穿入該槽體31的桿件515，以及一 ex置於該彳干件515相反該螺帽5 14 —端並供該電極52設置 的載板516。 該電控單元6包括一供電給該電極52與該研磨座41 的電源供應器61、一與該電源供應器61、電極52與該研 磨座41串接在一起的量測胃62，、以及—電連接該量測器 62與該馬達511的控制器63，在本較佳實施例中，該控制 f 63為電腦。該量測11 62 t連接該㈣52與該電源供應 〇 器61，該控制器63能控制該升降組合體51移動。 參閱圖1與圖2’該升降組合體51可以相對該槽體31 纟-增電限制位置與-減電限制位置間移動。當該電源供 應器61在該研磨座41通正電且該電極52通負電時，該電 冰研磨液20的研磨粒2〇1開始泳動沈積於該研磨塾上 ’該研磨座41帶動該等研磨粒2〇1對該工件2ι表面研磨 ’然而該電泳研磨液2〇之研磨粒2〇1沈積於該研磨座Μ 上的速度與該研磨座41研磨加卫該卫件21時導致該研磨 粒201脫離產生之消耗速度並不一定相同。 8 200927374BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a polishing apparatus, and more particularly to an electrophoretic polishing and polishing apparatus and an electrophoretic polishing method. [Prior Art] Conventional mechanical grinding devices (such as grinding machines) have the following drawbacks: '1. Due to the grinding wheel manufacturing technology, it is difficult to make the grinding wheel by using the 1~2//m abrasive grain to make the grinding wheel. Sex, so it is not easy to mass produce. 1. When a polishing wheel with a larger size of abrasive grains is applied to the polishing process, the resulting polishing marks are wider and the surface roughness is poor, resulting in a lack of polishing quality. Second, when the grinding wheel is passivated during the grinding and polishing, it is easy to leave the polishing particles on the polishing wheel after the passivation, which causes the surface of the workpiece to be burnt and burnt, and the workpiece is easy to fill the gap between the workpieces. , so that the polishing wheel loses its cutting ability' while producing a thermal effect. ❹ Fourth, when the workpiece is polished by the grinding wheel, the workpiece is easily strained and the workpiece is deformed. Therefore, the technique is not conducive to the precision polishing of the thin plate. SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide an electrophoretic polishing and polishing apparatus which is easy to mass-produce, has a good polishing quality, reduces thermal effects and deformation, and facilitates fine polishing of a thin plate. Another object of the present invention is to provide an electrophoretic polishing method which is excellent in polishing quality and durability. 5 200927374 • Thus, the electrophoretic polishing and polishing apparatus of the present invention is suitable for use in a packaged electrophoresis apparatus for polishing a workpiece having a plurality of abrasive grains, the electrophoretic polishing and polishing apparatus comprising a machine unit and a rotary grinding machine Unit, a lifting unit and an electronic control unit. The machine unit includes a tank body accommodating the electrophoretic polishing liquid and the workpiece, and the rotary grinding unit is rotatable relative to the workpiece to grind the workpiece, and includes a grinding seat extending into the tank body. The lifting unit comprises a lifting assembly body, and an electrode which is placed on the lifting assembly and located in the slot. The electronic control unit comprises a power supply for supplying the electrode and the grinding base. The lifting assembly is movable relative to the slot between a power-increasing limit position and a power-reduction limit position. When the lifting assembly moves toward the power-increasing position, the electrode moves toward the grinding seat. When the lifting assembly moves toward the power-reduction limit position, the electrode moves away from the polishing seat. The electrophoretic polishing and polishing device of the present invention is effective in that the polishing pad Φ is electrically connected to the electrode, and the abrasive particles of the electrophoretic polishing liquid can be deposited on the rotary grinding unit, thereby grinding the thin plate, thereby making the electrophoresis polishing and polishing device Easy mass production, better polishing quality, reduced thermal effects and deformation, and facilitates fine polishing of thin plates. The lifting assembly can change the position of the electrode and control the deposition speed of the abrasive particles of the electrophoretic polishing liquid, so that the polishing quality is further improved. The electrophoretic polishing method of the present invention firstly places a workpiece, a polishing seat of a rotary grinding unit, and an electrode of a lifting unit in an electrophoretic polishing liquid, and then rotates the rotating grinding unit relative to the workpiece to grind the workpiece. 200927374 * 'The polishing pad is energized with the electrode to cause the abrasive particles of the electrophoretic slurry to sink on the rotating grinding unit. Then, it is judged that the current magnitude between the polishing seat and the electrode is not performed if the current is normal; if the current is too large, the electrode is moved toward the polishing seat, and the polishing seat and the electrode are again judged. If the current is too small, the electrode is moved away from the polishing seat, and the current between the polishing seat and the electrode is again determined and continuously circulated. Thereby, the electrophoretic polishing 0 polishing method can also achieve the above effects. The above and other technical contents, features, and advantages of the present invention will be apparent from the following detailed description of the preferred embodiments. Referring to FIG. 1, in a preferred embodiment of the electrophoretic polishing and polishing apparatus and the electrophoretic polishing method of the present invention, the electrophoretic polishing and polishing apparatus is adapted to accommodate the electrophoretic polishing liquid 20 to grind a workpiece 21. The electrophoretic polishing liquid 20 includes a plurality of An abrasive particle 201' having a particle diameter of 1.5 μm or less and made of sic, and a solution prepared by mixing sodium hydroxide (NaOH) and mixing with the abrasive particles 201 21 is a thin metal plate. The electrophoretic polishing and polishing apparatus comprises a machine unit 3, a rotary grinding unit 4, a lifting unit 5 and an electronic control unit 6. The machine unit 3 includes a tank body 31 for holding the electrophoretic polishing liquid 20 and the workpiece 21. The rotary grinding unit 4 is rotatable relative to the workpiece 21 to grind the workpiece 21, and includes a grinding seat 41 extending into the groove body 31 and rotatable relative to the workpiece 21, and a spear J is adhered to the grinding by a conductive adhesive. a polishing pad 42 on the bottom surface of the seat 41. The polishing pad 7 is used to deposit the abrasive particles 201 of the electrophoretic polishing liquid 20 thereon, and the workpiece 21 is contacted and ground. The lifting unit 5 includes a lifting assembly 51. And an electrode 52 disposed on the lifting assembly 51 and located in the cavity 31. The lifting assembly 51 has a motor 511, a speed reducer 512 for driving the motor 511, a screw 513' for driving the speed reducer 512', and a nut 514 which is rotatably sleeved outside the screw 513 with respect to the screw 513. a rod 515 having one end disposed at the other end of the nut 514 and movably penetrating the slot 31, and an ex placed on the stem 515 opposite the end of the nut 5 14 for the electrode 52 set carrier 516. The electronic control unit 6 includes a power supply 61 for supplying the electrode 52 to the polishing base 41, a measuring stomach 62 connected to the power supply 61, the electrode 52 and the polishing seat 41, and - The controller 62 is electrically coupled to the controller 62 and the motor 511. In the preferred embodiment, the control f 63 is a computer. The measurement 11 62 t connects the (four) 52 to the power supply unit 61, and the controller 63 can control the movement of the lift assembly 51. Referring to Figures 1 and 2', the lift assembly 51 is movable relative to the tank 31 - power up limit position and - power down limit position. When the power supply unit 61 is positively charged and the electrode 52 is negatively charged, the abrasive grains 2〇1 of the electric ice polishing liquid 20 start to be deposited on the polishing crucible. The abrasive grain 2〇1 grinds the surface of the workpiece 2i. However, the speed at which the abrasive grain 2〇1 of the electrophoretic polishing liquid is deposited on the polishing pad and the grinding of the polishing pad 41 causes the grinding. The rate of consumption of the pellets 201 is not necessarily the same. 8 200927374
_該研磨塾42上的研磨粒2〇1沈積為預設最佳厚度時 ’該升降組合體不作動’使該等研磨粒2〇1的沈積維持 與該研磨粒201消耗速度相同。而當該研磨墊42上的研磨 粒201沈積過薄時，該控制器63接受到該量測器Q的電 流值較大，會驅動該馬it 5U，使該升降組合體51朝向該 增電限制位置移動，該電極52朝向鄰近該研磨座41方向X 移動，使電流加強，讓該研磨粒2〇1沈積速度比該研磨粒 2〇1消耗速度快，當該升降組合體51到達該增電限制位置 時，該電極52與該旋轉研磨單元4相互間隔，不再靠近， 以維持一定的沈積速度。 當該研磨墊42上的研磨粒2〇1沈積過厚時，該控制器 63接受到該量測器62的電流值較小，會驅動該馬達5u， 使該升降組合體51，朝向該減電限制位置移動，該電極」^ 朝遠離該研磨座41方向移動，使電流減弱，讓該研磨粒 2〇1沈積速度比該研磨粒2〇1消耗速度慢，當該升降組合體 51到達該減電限制位置時，該電極52與該槽體31相對該 旋轉研磨單元4的一面相互間隔，不再遠離，以維持一定 的沈積速度。 本發明電泳研磨拋光裝置具有以下功效： 一、 該電泳研磨液20易製造取得，不受限於傳統磨輪 製造技術，可以輕易以沈積產生1 5 mm以下的研磨粒201 ’達到易量產的功效。 二、 該等研磨粒201較小，應用於拋光製程時，所產 生之拋光痕較細，表面平整度較佳，達成拋光品質較佳的 200927374 . 功效。 • 三、該等研磨粒201會不斷地消耗，即使磨久了，切 屑也不容易填入該等研磨粒201之間的空間，該等研磨粒 201也會不斷地沈積，因此沈積於該研磨墊42的底面的研 磨粒201不會鈍化，能保持切削能力，不會發生工件21研 磨燒焦現象’減少了熱效應的發生。 四、該電泳研磨拋光裝置的拋光品質較佳，不會產生 ❹ 應變效應，工件不會變形，因此可以應用在可撓性金屬薄 板精密抛光研磨。 參閱圖1、圖2、圖3’該電泳研磨拋光方法包含以下 步驟71〜75 : 步驟71 :將一工件21、一旋轉研磨單元4的一研磨座 41、與一升降單元5的一電極52置於電泳研磨液2〇中。 步驟72 :接於該步驟71之後，讓該旋轉研磨單元4相 對該工件21旋轉，以研磨該工件21，並將該研磨座41與 Ο 該電極52通電，並使該研磨座41及電極52間距維持於一 預定距離，使電泳研磨液2〇沈積於該旋轉研磨單元4上。 步驟73 :是以一量測計62量測流過該電極52的電流 大小，並以一控制器63判斷該電流大小的方式來判斷該研 磨座4丨與該電極52間的電流大小。若該電流位於一正常 值，代表該電流大小為正常值，則該控制器63不做動；若 該量測電流值過大，代表研磨粒2〇1研磨消耗過大，則執 行步驟74。若該電流過小，代表研磨粒2〇 、 執行步驟75。 孩太厚則 10 200927374 - 步驟74:該控制ϋ 63驅動該升降單元5的一升降組合 - 冑51的方式’來帶動該電極52朝向鄰近該研磨座41方向 移動，並延遲一預定時間後再執行步驟乃。 步驟75 ·以該控制器63驅動該升降組合體51的方式 ’來帶動該電極52朝向遠離該研磨座41 #向移動，並延 遲一預定時間後再執行步驟7;^ 藉此，該電泳研磨拋光方法同樣可以達到上述的功效 〇 ❹ 上述較佳實施例中，是以電腦作為控制器63，以判讀 該量測器62的數據並判斷該升降組合體51的移動方向， 然而值仔一提的是，如圖4所示，該電泳研磨拋光裝置可 省略忒控制器63 (如圖」所示）的設置，改為直接以操作 人員判讀該量測器62的數據，並由操作人員直接控制該升 降組合體在該増電限制位置與減電限制位置間移動，藉 此同樣可以達到上述的功效。 〇 惟以上所述者，僅為本發明之較佳實施例而已，當不 ㊣以此限定本發明實施之範B，即A凡依本發明中請專利 m圍及發明說明内容所作之簡單的等效變化與修飾，皆仍 屬本發明專利涵蓋之範圍内。 【圖式簡單說明】 圖1是一示意圖，說明本發明電泳研磨拋光裝置的一 較佳實施例的一升降組合體位於一增電限制位置； 圖2是一類似圖1的視圖，說明該升降組合體位於一 減電限制位置； ' 11 200927374 圖3是該較佳實施例的一流程圖，說明本發明電泳研 磨拋光方法；及 圖4是該較佳實施例的一示意圖，說明本發明電泳研 磨拋光裝置改以人工操作方式來控制該升降組合體移動。 〇 12 200927374 【主要元件符號說明】 20•…- •…電泳研磨液 512… •…減速器 201 ··· —研磨粒 513… …·螺桿 21 ….· .…工件 514… …·螺帽 3…… •…機台單元 515… …·桿件 31 •…· •…槽體 516… •…載板 4 ...... •…旋轉研磨單元 52…… •…電極 41 •…研磨座 6 ....... •…電控單元 42•…· •…研磨墊 61…… 電源供應β 5…… …·升降單元 62…… …· 1測器 51 ··_.· …·升降組合體 63…… …控制器 511… •…馬達 ❹ 13When the abrasive grains 2〇1 on the polishing crucible 42 are deposited to a predetermined optimum thickness, the lift assembly is not actuated to maintain the deposition of the abrasive grains 2〇1 at the same rate as the abrasive particles 201. When the abrasive grain 201 on the polishing pad 42 is deposited too thin, the controller 63 receives the current value of the measuring device Q to be large, and drives the horse 5U to make the lifting assembly 51 face the power-on. Restricting the positional movement, the electrode 52 moves toward the direction X adjacent to the polishing seat 41, so that the current is strengthened, so that the deposition rate of the abrasive grain 2〇1 is faster than the consumption rate of the abrasive grain 2〇1, when the lifting assembly 51 reaches the increase In the electrically constrained position, the electrode 52 and the rotary grinding unit 4 are spaced apart from each other and are no closer to maintain a certain deposition speed. When the abrasive grain 2〇1 on the polishing pad 42 is deposited too thick, the controller 63 receives the current value of the measuring device 62 to be small, and drives the motor 5u to make the lifting assembly 51 face the reduction. The electric limiting position moves, the electrode "^ moves away from the grinding seat 41, so that the current is weakened, so that the polishing particle 2〇1 deposition speed is slower than the polishing particle 2〇1 consumption rate, when the lifting assembly 51 reaches the When the power is limited to the position, the electrode 52 and the groove 31 are spaced apart from each other with respect to one side of the rotary grinding unit 4, and are no longer separated to maintain a certain deposition speed. The electrophoretic grinding and polishing device of the invention has the following effects: 1. The electrophoretic polishing liquid 20 is easy to manufacture, and is not limited to the traditional grinding wheel manufacturing technology, and can easily produce the abrasive particles 201 of less than 15 mm to achieve mass production. . Second, the abrasive grains 201 are small, and when applied to the polishing process, the polishing marks produced are finer, the surface flatness is better, and the polishing quality is better 200927374. • Third, the abrasive particles 201 are continuously consumed. Even if the grinding is long, the chips are not easily filled into the space between the abrasive grains 201, and the abrasive particles 201 are continuously deposited, so that the grinding is deposited on the grinding. The abrasive grains 201 on the bottom surface of the pad 42 are not passivated, and the cutting ability can be maintained without causing the workpiece 21 to be burned and burnt, which reduces the occurrence of thermal effects. 4. The electrophoresis grinding and polishing device has better polishing quality, does not produce ❹ strain effect, and the workpiece does not deform, so it can be applied to precision polishing of flexible metal sheets. Referring to FIG. 1, FIG. 2, FIG. 3', the electrophoretic polishing method comprises the following steps 71 to 75: Step 71: a workpiece 21, a polishing seat 41 of a rotary grinding unit 4, and an electrode 52 of a lifting unit 5 Placed in 2 电泳 electrophoresis slurry. Step 72: After the step 71, the rotary grinding unit 4 is rotated relative to the workpiece 21 to grind the workpiece 21, and the polishing seat 41 and the electrode 52 are energized, and the polishing seat 41 and the electrode 52 are provided. The spacing is maintained at a predetermined distance to cause the electrophoretic slurry 2 to be deposited on the rotary grinding unit 4. Step 73: The current flowing through the electrode 52 is measured by a measuring unit 62, and the magnitude of the current between the grinding base 4 and the electrode 52 is determined by a controller 63 determining the magnitude of the current. If the current is at a normal value, indicating that the current is normal, the controller 63 does not operate; if the measured current value is too large, indicating that the abrasive grain 2〇1 is excessively consumed, step 74 is performed. If the current is too small, it represents the abrasive particles 2〇, and step 75 is performed. If the child is too thick, 10 200927374 - Step 74: The control ϋ 63 drives a lifting assembly of the lifting unit 5 - the manner of the 胄 51 to drive the electrode 52 toward the adjacent grinding seat 41, and delays for a predetermined time before The steps are executed. Step 75: The method of driving the lifting assembly 51 by the controller 63 to drive the electrode 52 to move away from the grinding seat 41#, and delaying for a predetermined time before performing step 7; The polishing method can also achieve the above-mentioned effects. In the above preferred embodiment, the computer is used as the controller 63 to interpret the data of the measuring device 62 and determine the moving direction of the lifting assembly 51, but it is worth mentioning. As shown in FIG. 4, the electrophoretic polishing and polishing apparatus can omit the setting of the cymbal controller 63 (as shown in the figure), and directly interpret the data of the measuring device 62 directly by the operator, and is directly operated by the operator. The lifting assembly is controlled to move between the power limiting position and the power limiting position, thereby achieving the above-mentioned effects. The above is only the preferred embodiment of the present invention, and is not intended to limit the implementation of the present invention, that is, the simpleness of the invention according to the invention and the content of the invention. Equivalent variations and modifications are still within the scope of the invention. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic view showing a lifting assembly of a preferred embodiment of the electrophoretic polishing and polishing apparatus of the present invention in a power-increasing limit position; FIG. 2 is a view similar to FIG. The assembly is located at a power-reduction limit position; '11 200927374 FIG. 3 is a flow chart of the preferred embodiment illustrating the electrophoretic polishing method of the present invention; and FIG. 4 is a schematic view of the preferred embodiment illustrating the electrophoresis of the present invention The lapping and polishing device is manually operated to control the movement of the lifting assembly. 〇12 200927374 [Description of main component symbols] 20•...- •...electrophoretic polishing liquid 512...•...reducer 201··· —abrasive grain 513...··screw 21 ........ workpiece 514... screw nut 3 ......•...machine unit 515...··bar 31 •...· •...slot 516... •...carrier 4 ......•...rotary grinding unit 52...•...electrode 41 •...grinding seat 6 ....... •...Electronic control unit 42•...·•... polishing pad 61... Power supply β 5... ...· lifting unit 62... 1·1 detector 51 ··_.· ...· Lift assembly 63 ... controller 511... • motor ❹ 13