200912315 九、發明說明： 【發明所屬之技術領域】 本發明係有關於一種分析微機電系統封裝構造之裝置 及方法，更特別有關於一種分析微機電系統氣密封裝構造 内氣體之裝置及方法。 【先前技術】 參考第1圖，一般的微機電系統氣密封裝構造1〇〇包含 D 一基板110 ，基板110上設有微機電系統 (Micro-Electro-Mechanical-System; MEMS)元件 120 ’ 例如 疋個壓力感測器或者是麥克風，以一蓋體1 3 0蓋住MEMS 元件120以形成一内部空間16〇，將其内部空間i6〇抽成 真空狀態，盍體1 3 0之周緣則藉由黏膠i 4〇與基板丨丨〇形 成氣密性連接。 上述微機電系統元件120具有一主動面124與相對之一 背面122,且主動面上還有一主動區域126,微機電系統元 Q 件120則藉由黏膠150使其背面122附著在基板110上。 於製作上述微機電系統封裝構造1 0 〇的過程中，常會烘 烤黏膠140、150以使微機電系統元件120及蓋體13〇能牢 固地附著於基板110上。然而，黏膠140、150經烘烤後常 會有一些氣體釋出’這些釋出的氣體會瀰漫於蓋體13〇與 基板110之間的内部空間160内。當微機電系統封裝構造 100的溫度降至常溫後，這些由黏膠14〇、150所釋出的氣 體分子會沈降而附著在基板11〇上。若這些具有黏性的分 子附者在微機電系統元件120的主動區域126上，將可能 01249-TW/ASE1938 5 200912315 會影響微機電系統元件12G的作動’進而造成封裝構造⑽ 的可靠度降低。 參考第2圖，目前市面上有偵測微機電系統封裝構造 100是否洩漏氣體所配置的測試系統200。測試系統2〇〇包 含一真空腔體2H)以及與真空腔體21M目連之心分析= 220。測試時，將封裝構造1〇〇置於真空腔體21〇内，並執 行抽真n：i分析儀22〇藉由壓力之變化判斷封裝構造 1〇〇是否有洩漏的情形 '然而，上述測試系統2〇〇僅能測 試封裝構造1GG是否有心㈣情形，對於封|構造⑽在 無茂漏的情況下，密封於封裝構& 1〇〇内的氣體成分並無 有鑑於此，便有須提出一種分析微機電系統氣密 造内氣體之裝置及方法，以解決上述問題。 【發明内容】 1； 、本發明之目的在於提供一種分析微機電系統氣密封裝 構造内氣體之方法’可分析密封於微機電系統封裝構造内 的氣體成分’以瞭解該等氣體成分與該微機電系 裝構造可靠度之關聯性。 ’ ’ 於-實施例中，本發明之分析微機電系統氣密封裳構生 内氣體之方法係提供一真空腔體，並將一氣體分析儀鱼： 空腔體的第二開口連接。將—長度可變的中空彈性件的 一端與真空腔體的第―開口連通，並將—尖錐體設於 腔體内’使其尖錐延伸至彈性件内並朝向巾空彈性件的^ 二端。將待剛的微機電系統氣㈣裝構造置於彈性件的第 01249-TW/ASE 1938 6 200912315 端並細加塵力於待測.的封裳構造上’迫使中空彈性件 收縮而使得待測的封裝構造被刺穿而形成__破孔，藉此使 =測的封裝構造内的氣體由該破孔②漏出。最後藉由氣體 刀析儀刀析由待測的封裝構造中洩漏至真空腔體内的氣體 成分。 於另實施例中，本發明之分析微機電系統氣密封裝構 以内氣體之方法係提供_真空腔體，並將一氣體分析儀與 真空腔體的第二開口連接。將-長度可變的甲空彈性件的 第端與真空腔體的第一開口連通，並將一尖錐體設於中 空彈性件内且位於其第二端上，尖錐體的尖錐朝向真空腔 體將待測的微機電系統氣密封裝構造置於真空腔體内且 位於真工腔體的第—開口的下方，並施加壓力於中空彈性 件上边使其H以使得尖錐㈣穿待測的封裝構造，並 於其上形成一破孔，藉此使待測的封裝構造内的氣體由該 破孔洩漏出。最後藉由氣體分析儀分析由待測的封裝構造 中洩漏至真空腔體内的氣體成分。 為了讓本發明之上述和其他目的、特徵、和優點能更明 ..貝下文特舉本發明實施例，並配合所附圖示，作詳細說 明如下。 t實施方式】 ，考第3圖’本發明第—實施例之分析微機電系統氣 封襄構造内氣體之裝置包含—真空腔體3ig，真空 體310具有一第一開口 312以及一第二開口 3"，：中 二開口 314可連接到-氣體分析儀350。裝置_還包 01249-TW/ASE 1938 200912315 有長度可變的一中空彈性件32η a -tr处 评ί仵320，具有一第—端322以及 相對之第—端3 2 4。中办搜Μ处ο η λ λ* Τ工彈性件320的第一端322與真 空腔體310的第一開口 312如强 #也古 1 312相通，並與真空腔體310的連 接處形成氣密。裝晉ts- 教置300另具有一壓力模組330，可施加 壓力於物體上；此外，真空腔體 340，其尖錐342延伸至中空彈性件 310内還具有一尖錐體 320内並朝向中空彈性 件320的第二端324。 參考第牦至4C圖，測試時，將真空腔體310的第二開 口 314與氣體分析儀35G連接，並將待測的微機電系統封 裝構造，例如第1圖所示之微機電系統封裝構造1〇〇以蓋 體130朝下的方式置於中空彈性件32〇的第二端324上， 並以壓力模組330施加壓力於封裝構造1〇〇上（見第4a 圖）。由於彈性件320係長度可變，當壓力模組33〇逐漸下 壓時，將迫使中空彈性件320收縮，藉此使得封裝構造1〇〇 向大錐體340接近，同時封裝構造1〇〇也與彈性件32〇的 第二端324的周緣氣密接觸。當壓力模組33〇進一步下壓 ί/時’尖錐體340便會刺穿封裝構造100的蓋體130 (見第 4b圖）。當壓力模組33〇上升後，封裝構造1〇〇内的氣體 便會藉由盍體130上的破孔132通過中空彈性件320而到 達真空腔體310内《由封裝構造10〇内散逸出來的氣體會 經由第二開口 314抽至氣體分析儀350内，而由其分析出 其中的氣體成分（見第4c圖）。 參考第5圖，本發明第二實施例之分析微機電系統氣密 封裝構造内氣體之裝置400類似第一實施例之裝置3〇〇， 亦具有真空腔體310、中空彈性件320、壓力模組330與一 01249-TW/ASE 1938 8 200912315 尖錐體440。與裝置3〇〇不同的是，裝44〇〇所包含的小 錐體440係設於彈性件320内且位於第二端324上，其： ㈣朝向真空腔體310的第一開口 312或甚至是穿過； 一開口 312而到達真空腔體31〇内。 考第6a至6c圖，測試時，將真空腔體3 1 〇的第二開 、/、氣體刀析儀350連接，並將待測的微機電系統封 、構k f列如第i圖所示之微機電系統封裝構造⑽以蓋 體130朝上的方式置於真空腔體31〇内且位於第一開口川 的下方，並以壓力模組33〇施加壓力於中空彈性件32〇上 (見：“圖）。由於彈性件32〇係長度可變，#屋力模組 、漸下壓時，將迫使中空彈性件32()收縮，藉此使得 尖錐體440向封裝構造100接近，同時壓力模組330也與 中工彈! 生件320的第二端324的周緣氣密接觸。當壓力模 組㈣進一步下壓時，尖錐體44〇便會刺穿封裝構造⑽ 的盍體130 (見第6b圖）。當壓力模組33〇上升後，封裝BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus and method for analyzing a package structure of a microelectromechanical system, and more particularly to an apparatus and method for analyzing a gas in a hermetic seal structure of a microelectromechanical system. [Prior Art] Referring to Fig. 1, a general MEMS hermetic package structure 1A includes a D substrate 110 on which a Micro-Electro-Mechanical-System (MEMS) device 120' is provided. A pressure sensor or a microphone covers the MEMS element 120 with a cover body 130 to form an internal space 16〇, and the internal space i6〇 is evacuated to a vacuum state, and the periphery of the body 1 3 0 is borrowed. The adhesive i 4 丨丨〇 forms a gas-tight connection with the substrate 丨丨〇. The MEMS component 120 has an active surface 124 and an opposite back surface 122, and an active surface 126 is also disposed on the active surface. The MEMS element Q 120 has the back surface 122 attached to the substrate 110 by the adhesive 150. . During the fabrication of the above-described MEMS package structure 10 〇, the adhesives 140, 150 are often baked to allow the MEMS component 120 and the cover 13 to be firmly attached to the substrate 110. However, after the adhesives 140, 150 are baked, some gas is often released. These released gases will diffuse into the internal space 160 between the cover 13 and the substrate 110. When the temperature of the MEMS package structure 100 drops to normal temperature, the gas molecules released by the adhesives 14, 150, 150 settle and adhere to the substrate 11 。. If these viscous molecules are attached to the active region 126 of the MEMS component 120, it will be possible that 01249-TW/ASE1938 5 200912315 will affect the operation of the MEMS component 12G, which in turn will result in reduced reliability of the package structure (10). Referring to Figure 2, there is currently a test system 200 on the market for detecting the presence or absence of gas leakage from the MEMS package structure 100. The test system 2A includes a vacuum chamber 2H) and a heart analysis with the vacuum chamber 21M = 220. During the test, the package structure 1〇〇 is placed in the vacuum chamber 21〇, and the extraction n:i analyzer 22 is used to determine whether the package structure 1 is leaked by the change of pressure. However, the above test System 2〇〇 can only test whether the package structure 1GG is in the heart (4). For the seal structure (10), in the absence of leakage, the gas composition sealed in the package structure & 1 is not necessary. A device and method for analyzing gas-tight gas in a micro-electromechanical system are proposed to solve the above problems. SUMMARY OF THE INVENTION 1. The object of the present invention is to provide a method for analyzing gas in a hermetic seal structure of a microelectromechanical system, which can analyze the gas composition sealed in the package structure of the microelectromechanical system to understand the gas composition and the micro Correlation between structural reliability of electromechanical systems. In an embodiment, the method of the present invention for analyzing a microelectromechanical system to hermetically seal a gas is to provide a vacuum chamber and connect a gas analyzer fish: a second opening of the cavity. One end of the variable length hollow elastic member is communicated with the first opening of the vacuum chamber, and the tip cone is disposed in the cavity to extend the tip of the cone into the elastic member and facing the hollow elastic member Two ends. Place the MEMS gas (four) mounting structure to be placed on the end of the elastic part of 01249-TW/ASE 1938 6 200912315 and finely add the dust to the seal structure to be tested. 'Forcing the hollow elastic member to shrink and make the test The package structure is pierced to form a hole, whereby the gas in the package structure is leaked out of the hole 2. Finally, the gas component leaking into the vacuum chamber from the package structure to be tested is analyzed by a gas knife. In another embodiment, the analytical microelectromechanical system hermetic device of the present invention provides a vacuum chamber by means of an internal gas and a gas analyzer coupled to the second opening of the vacuum chamber. The first end of the variable length hollow elastic member communicates with the first opening of the vacuum chamber, and a tip cone is disposed in the hollow elastic member and located on the second end thereof, the tip of the pointed cone is oriented The vacuum chamber places the MEMS sealing structure to be tested into a vacuum chamber and is located below the first opening of the real cavity, and applies pressure to the hollow elastic member to make it H so that the tapered cone (four) wears The package structure to be tested forms a hole therethrough, thereby allowing gas in the package structure to be tested to leak out of the hole. Finally, the gas component leaking into the vacuum chamber from the package structure to be tested is analyzed by a gas analyzer. The above and other objects, features, and advantages of the present invention will become more apparent. t Embodiment 3, the apparatus of the first embodiment of the present invention for analyzing gas in a gas-filled structure of a microelectromechanical system comprises a vacuum chamber 3ig, the vacuum body 310 having a first opening 312 and a second opening 3",: The second opening 314 can be connected to the gas analyzer 350. The device_also includes 01249-TW/ASE 1938 200912315 having a variable length of a hollow elastic member 32η a -tr, having a first end 322 and an opposite first end 3 2 4 . The first end 322 of the tampering elastic member 320 communicates with the first opening 312 of the vacuum chamber 310, such as the strong #也古1 312, and forms a gas at the junction with the vacuum chamber 310. dense. The mounting device 300 further has a pressure module 330 for applying pressure to the object; further, the vacuum chamber 340 has a tip 342 extending into the hollow elastic member 310 and having a tip cone 320 and facing The second end 324 of the hollow elastic member 320. Referring to FIGS. 4C, during testing, the second opening 314 of the vacuum chamber 310 is connected to the gas analyzer 35G, and the MEMS package structure to be tested, such as the MEMS package structure shown in FIG. 1〇〇 is placed on the second end 324 of the hollow elastic member 32〇 with the cover 130 facing downward, and pressure is applied to the package structure 1 by the pressure module 330 (see FIG. 4a). Since the length of the elastic member 320 is variable, when the pressure module 33 is gradually pressed down, the hollow elastic member 320 is forced to contract, thereby causing the package structure 1 to approach the large cone 340, and the package structure is also It is in airtight contact with the circumference of the second end 324 of the elastic member 32A. When the pressure module 33 is further depressed, the tip cone 340 will pierce the cover 130 of the package structure 100 (see Figure 4b). After the pressure module 33 is raised, the gas in the package structure 1 will pass through the hollow hole 320 on the body 130 to reach the vacuum chamber 310 by the hole 132 in the body 130. The gas is drawn into the gas analyzer 350 via the second opening 314, from which the gas composition is analyzed (see Figure 4c). Referring to FIG. 5, a device 400 for analyzing gas in a hermetic seal structure of a microelectromechanical system according to a second embodiment of the present invention is similar to the device 3 of the first embodiment, and has a vacuum chamber 310, a hollow elastic member 320, and a pressure die. Group 330 and a 01249-TW/ASE 1938 8 200912315 tip cone 440. Different from the device 3, the small cone 440 included in the mounting 44 is disposed in the elastic member 320 and located on the second end 324, which: (4) faces the first opening 312 of the vacuum chamber 310 or even It is through; an opening 312 reaches the vacuum chamber 31〇. In the test, the 6a to 6c diagrams are tested. The second opening of the vacuum chamber 3 1 、, /, the gas knife analyzer 350 is connected, and the MEMS to be tested is sealed and kf is shown in the figure i. The MEMS package structure (10) is placed in the vacuum chamber 31〇 with the cover 130 facing upward and located below the first opening, and pressure is applied to the hollow elastic member 32〇 by the pressure module 33〇 (see : "Fig." Since the length of the elastic member 32 is variable, the #力力 module, when pressed down, will force the hollow elastic member 32 () to contract, thereby causing the pointed cone 440 to approach the package structure 100 while The pressure module 330 is also in airtight contact with the circumference of the second end 324 of the middle work bomb! The raw part 320 is slid into the body 130 of the package structure (10) when the pressure module (4) is further depressed. (See Figure 6b). When the pressure module 33 is raised, the package
C 構造1〇〇内的氣體便會穿過蓋體130上的破孔132散逸^ 真空腔體310内。由、生1ΛΛ “η 甶封裝構造100内散逸出來的氣體會經 由第一開口 314抽至氣體公把應ί ς η 王媸刀析儀35〇内，而由其分析出 中的氣體成分（見第6c圖）。 使用於本發明第一實施例中的中空彈性件32〇，並第二端 324可為氣密或者是非氣密端。在測試過程中，慶力模组 330下壓使得待測的封裝料⑽與中空彈性件32〇的第 二端324的周緣形成氣密接觸，並不斷的抽氣使得真空腔 體31〇内形成真空環境。另外，在測試過程中，本發明第 二實施例中的壓力模組330會下愿並與中空彈性件32〇的 01249-TW/ASE 1938 9 200912315 第二端324的周緣形成氣密接觸，同時不斷的抽氣使得真 空腔體310内形成真空環境。 本發明之分析β機電系統氣密封裝構造内氣體之裝置 可分析微機電系統封裝構造内的氣體成分，以瞭解該等氣 體成分與該微機電系統氣密封裝構造可靠度之關聯性。 雖然本發明已以前述較佳實施例揭示，然其並非 定本發明，任何熟習此技藝者，在不脫離本發明 範圍内，當可作各種之更動與修改。因此本發明^和 圍當視後附之申請專利範圍所界定者為準。 保遭範 (j 01249-TW/ASE 1938 10 200912315 【圖式簡單說明】 第1圖m微機電系統封I構造之剖面圖。 第2圖·為習知侦測料德雷 掷…“系統封裝構造是否有浪漏氣 體所配置的系統。 第3圖.為本發明楚—Φ- ±P- / 1 月第一實細*例之分析微機電系統氣密封 裝構造内氣體之裝置。 第4a至4c圖：為使用本發明第一實施例之裝置分析微 機電系統氣密封襞構造内氣體之方法。 第5圖：為本發明第二實施例之分析微機電系統氣密封 襞構造内氣體之裝置。 第6a至6c圖：為使用本發明第二實施例之裝置分析微 機電系統氣密封裝構造内氣體之方法。 01249-TW/ASE 1938 , 200912315 【主要元件符號說明】 100 微機電系統封裝構造 110 基板 120 微機電系統元件 122 背面 124 主動面 126 主動區域 130 蓋體 132 破孔 140 黏膠 150 黏膠 160 内部空間 200 測試系統 210 真空腔體 220 泡漏分析儀 300 裝置 310 真空腔體 312- 第一開口 314 第二開口 320 中空彈性件 322 第一端 324 第二端 330 壓力模組 340 尖錐體 342 尖錐 350 氣體分析儀 400 裝置 440 尖錐體 442 尖錐 01249-TW/ASE1938 12The gas in the C structure is dissipated through the hole 132 in the cover 130 to the inside of the vacuum chamber 310. The gas escaping from the η 甶 package structure 100 is pumped through the first opening 314 to the gas knives, and the gas composition is analyzed by the ( 媸 媸 媸 ( ( (see Figure 6c). The hollow elastic member 32 is used in the first embodiment of the present invention, and the second end 324 can be airtight or non-hermetic. During the test, the Qingli module 330 is pressed down to be treated. The tested encapsulant (10) is in airtight contact with the periphery of the second end 324 of the hollow elastic member 32, and is continuously evacuated to form a vacuum environment in the vacuum chamber 31. In addition, in the test, the second invention The pressure module 330 in the embodiment will be in gas-tight contact with the periphery of the second end 324 of the 01249-TW/ASE 1938 9 200912315 of the hollow elastic member 32 while continuously pumping to form the vacuum chamber 310. The vacuum environment. The device for analyzing the gas in the gas-sealed structure of the β electromechanical system can analyze the gas composition in the package structure of the MEMS to understand the correlation between the gas components and the structural safety of the MEMS seal. Though The present invention has been disclosed in the foregoing preferred embodiments, but it is not intended to be a part of the invention, and various modifications and changes can be made without departing from the scope of the invention. The definition of the scope of the patent application shall prevail. The protection of the model (j 01249-TW/ASE 1938 10 200912315 [Simplified illustration] Figure 1 is a cross-sectional view of the micro-electromechanical system I structure. Figure 2 is a conventional Detecting material Thunder throw... "The system package structure has a system configured with leakage gas. Figure 3. The present invention Chu-Φ- ±P- / January first actual fine * Example analysis of MEMS gas A device for sealing a gas inside a structure. Figures 4a to 4c: a method for analyzing a gas in a hermetic gas-tight structure of a microelectromechanical system using the apparatus of the first embodiment of the present invention. Fig. 5 is an analysis of a second embodiment of the present invention Apparatus for hermetic sealing of gas within a microelectromechanical system. Figures 6a to 6c: a method for analyzing gas in a hermetic sealed structure of a microelectromechanical system using the apparatus of the second embodiment of the invention. 01249-TW/ASE 1938, 200912315 Main component symbol description] 100 MEMS package construction 110 substrate 120 MEMS components 122 back 124 active surface 126 active area 130 cover 132 hole 140 adhesive 150 adhesive 160 internal space 200 test system 210 vacuum chamber 220 bubble leak analyzer 300 device 310 vacuum chamber 312 - first opening 314 second opening 320 hollow elastic member 322 first end 324 second end 330 pressure module 340 tip cone 342 tip cone 350 gas analyzer 400 device 440 tip cone 442 tip cone 01249 -TW/ASE1938 12