TW200903601A - Substrate processing apparatus and substrate processing method - Google Patents
Substrate processing apparatus and substrate processing method Download PDFInfo
- Publication number
- TW200903601A TW200903601A TW97117381A TW97117381A TW200903601A TW 200903601 A TW200903601 A TW 200903601A TW 97117381 A TW97117381 A TW 97117381A TW 97117381 A TW97117381 A TW 97117381A TW 200903601 A TW200903601 A TW 200903601A
- Authority
- TW
- Taiwan
- Prior art keywords
- substrate
- liquid
- coating
- film
- removal
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 370
- 238000003672 processing method Methods 0.000 title claims description 7
- 238000000576 coating method Methods 0.000 claims abstract description 202
- 239000011248 coating agent Substances 0.000 claims abstract description 201
- 239000007788 liquid Substances 0.000 claims abstract description 199
- 230000002093 peripheral effect Effects 0.000 claims description 33
- 238000011282 treatment Methods 0.000 claims description 28
- 238000000034 method Methods 0.000 claims description 14
- 230000008569 process Effects 0.000 claims description 10
- 239000004744 fabric Substances 0.000 claims description 8
- 238000007654 immersion Methods 0.000 claims description 8
- 230000003287 optical effect Effects 0.000 claims description 3
- 238000005520 cutting process Methods 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 claims description 2
- 239000010408 film Substances 0.000 abstract description 164
- 239000013039 cover film Substances 0.000 abstract description 45
- 230000003628 erosive effect Effects 0.000 abstract 2
- 230000007423 decrease Effects 0.000 abstract 1
- 238000010438 heat treatment Methods 0.000 description 78
- 238000001035 drying Methods 0.000 description 30
- 238000004140 cleaning Methods 0.000 description 24
- 238000001816 cooling Methods 0.000 description 15
- 238000005192 partition Methods 0.000 description 14
- 230000032258 transport Effects 0.000 description 9
- 238000005406 washing Methods 0.000 description 9
- 230000007246 mechanism Effects 0.000 description 7
- 239000003795 chemical substances by application Substances 0.000 description 6
- 230000009471 action Effects 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 5
- 239000013256 coordination polymer Substances 0.000 description 5
- 239000007888 film coating Substances 0.000 description 5
- 238000009501 film coating Methods 0.000 description 5
- 230000007723 transport mechanism Effects 0.000 description 5
- 238000005530 etching Methods 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 239000002904 solvent Substances 0.000 description 4
- 102100030373 HSPB1-associated protein 1 Human genes 0.000 description 3
- 101000843045 Homo sapiens HSPB1-associated protein 1 Proteins 0.000 description 3
- 230000000903 blocking effect Effects 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000005871 repellent Substances 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- 101100168604 Candida albicans (strain SC5314 / ATCC MYA-2876) CRH12 gene Proteins 0.000 description 2
- 102100021752 Corticoliberin Human genes 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- 101000895481 Homo sapiens Corticoliberin Proteins 0.000 description 2
- 230000000675 anti-caries Effects 0.000 description 2
- 230000000342 anti-suppressant effect Effects 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 238000007599 discharging Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000003384 imaging method Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000011144 upstream manufacturing Methods 0.000 description 2
- PHKJVUUMSPASRG-UHFFFAOYSA-N 4-[4-chloro-5-(2,6-dimethyl-8-pentan-3-ylimidazo[1,2-b]pyridazin-3-yl)-1,3-thiazol-2-yl]morpholine Chemical compound CC=1N=C2C(C(CC)CC)=CC(C)=NN2C=1C(=C(N=1)Cl)SC=1N1CCOCC1 PHKJVUUMSPASRG-UHFFFAOYSA-N 0.000 description 1
- 101100346171 Arabidopsis thaliana MORC3 gene Proteins 0.000 description 1
- 101100346174 Arabidopsis thaliana MORC4 gene Proteins 0.000 description 1
- 101100346177 Arabidopsis thaliana MORC5 gene Proteins 0.000 description 1
- 101100346178 Arabidopsis thaliana MORC6 gene Proteins 0.000 description 1
- 101100346179 Arabidopsis thaliana MORC7 gene Proteins 0.000 description 1
- 241000283690 Bos taurus Species 0.000 description 1
- 206010036790 Productive cough Diseases 0.000 description 1
- 101100168607 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) UTR2 gene Proteins 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 238000011276 addition treatment Methods 0.000 description 1
- 210000000941 bile Anatomy 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 210000003298 dental enamel Anatomy 0.000 description 1
- 230000008034 disappearance Effects 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000008595 infiltration Effects 0.000 description 1
- 238000001764 infiltration Methods 0.000 description 1
- 210000003127 knee Anatomy 0.000 description 1
- 210000004185 liver Anatomy 0.000 description 1
- 239000008267 milk Substances 0.000 description 1
- 210000004080 milk Anatomy 0.000 description 1
- 235000013336 milk Nutrition 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 239000000779 smoke Substances 0.000 description 1
- 239000002689 soil Substances 0.000 description 1
- 210000003802 sputum Anatomy 0.000 description 1
- 208000024794 sputum Diseases 0.000 description 1
- 239000003206 sterilizing agent Substances 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Weting (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007133878A JP2008288488A (ja) | 2007-05-21 | 2007-05-21 | 基板処理装置および基板処理方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW200903601A true TW200903601A (en) | 2009-01-16 |
Family
ID=40031639
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW97117381A TW200903601A (en) | 2007-05-21 | 2008-05-12 | Substrate processing apparatus and substrate processing method |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP2008288488A (fr) |
| TW (1) | TW200903601A (fr) |
| WO (1) | WO2008142923A1 (fr) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5933724B2 (ja) * | 2011-09-20 | 2016-06-15 | エーファウ・グループ・エー・タルナー・ゲーエムベーハー | 支持ウェハを被覆する装置及び方法 |
| US9760007B2 (en) * | 2014-02-13 | 2017-09-12 | Mitsubishi Electric Corporation | Semiconductor device manufacturing method |
| JP6737670B2 (ja) * | 2016-09-16 | 2020-08-12 | 株式会社Ｓｃｒｅｅｎホールディングス | 基板処理方法、基板処理装置 |
| JP6363249B2 (ja) * | 2017-04-17 | 2018-07-25 | 東京エレクトロン株式会社 | 基板処理方法および基板処理装置 |
| JP2019067894A (ja) * | 2017-09-29 | 2019-04-25 | エイブリック株式会社 | 半導体装置の製造方法 |
| JP7013221B2 (ja) | 2017-12-11 | 2022-01-31 | 株式会社Ｓｃｒｅｅｎホールディングス | 基板処理方法および基板処理装置 |
| JP7202960B2 (ja) * | 2019-04-16 | 2023-01-12 | 東京エレクトロン株式会社 | 塗布膜形成方法及び塗布膜形成装置 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5819350B2 (ja) * | 1976-04-08 | 1983-04-18 | 富士写真フイルム株式会社 | スピンコ−テイング方法 |
| JP3189087B2 (ja) * | 1995-04-12 | 2001-07-16 | 東京エレクトロン株式会社 | 処理装置及び処理方法 |
| JP2948501B2 (ja) * | 1995-03-20 | 1999-09-13 | 日本ファウンドリー株式会社 | 半導体装置製造工程における塗布液の塗布方法 |
| JP2003324052A (ja) * | 2002-04-30 | 2003-11-14 | Tokyo Electron Ltd | 塗布膜除去方法および塗布膜形成除去装置 |
| JP4216238B2 (ja) * | 2004-09-24 | 2009-01-28 | 東京エレクトロン株式会社 | 塗布処理装置及び塗布処理方法 |
| JP2007036121A (ja) * | 2005-07-29 | 2007-02-08 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
| JP4757126B2 (ja) * | 2005-10-11 | 2011-08-24 | 東京エレクトロン株式会社 | 基板処理方法及び基板処理装置 |
| JP4562040B2 (ja) * | 2006-02-17 | 2010-10-13 | 東京エレクトロン株式会社 | 基板処理方法、基板処理装置、その制御プログラム及びコンピュータ読取可能な記憶媒体 |
-
2007
- 2007-05-21 JP JP2007133878A patent/JP2008288488A/ja active Pending
-
2008
- 2008-04-09 WO PCT/JP2008/057034 patent/WO2008142923A1/fr not_active Ceased
- 2008-05-12 TW TW97117381A patent/TW200903601A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| WO2008142923A1 (fr) | 2008-11-27 |
| JP2008288488A (ja) | 2008-11-27 |
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