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TW200904239A - Method and device for driving an LED system - Google Patents

Method and device for driving an LED system Download PDF

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Publication number
TW200904239A
TW200904239A TW097110861A TW97110861A TW200904239A TW 200904239 A TW200904239 A TW 200904239A TW 097110861 A TW097110861 A TW 097110861A TW 97110861 A TW97110861 A TW 97110861A TW 200904239 A TW200904239 A TW 200904239A
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TW
Taiwan
Prior art keywords
led
node
light output
leds
model
Prior art date
Application number
TW097110861A
Other languages
Chinese (zh)
Inventor
Petrus Johannes Bremer
Original Assignee
Koninkl Philips Electronics Nv
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Application filed by Koninkl Philips Electronics Nv filed Critical Koninkl Philips Electronics Nv
Publication of TW200904239A publication Critical patent/TW200904239A/en

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Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/20Controlling the colour of the light
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/10Controlling the intensity of the light
    • H05B45/18Controlling the intensity of the light using temperature feedback

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  • Circuit Arrangement For Electric Light Sources In General (AREA)
  • Led Devices (AREA)

Abstract

For estimating temperatures of LED of a matrix (2), a model (100) is used. For each LED (10X, Y), the model comprises: a first node (110X, Y) representing the LED; a first capacitive component (131) connected to said first node, representing heat capacitance of the LED; a second node (103X, Y) representing a backplate portion corresponding with the LED; a second capacitive component (132) connected to said second node, representing heat capacitance of said backplate portion; a resistive component (145) between said two nodes; representing heat resistance of a thermal coupling between the LED and the backplate; resistive components (141, 142, 143, 144) between said second node (103X, Y) and adjacent second nodes, representing heat resistances of thermal couplings between the backplate portion and adjacent backplate portions; a first flow source component (153) connected to said first node, representing heat dissipation of the LED.

Description

200904239 九、發明說明: 【發明所屬之技術領域】 本發明一般係關於LED之控制。LED之一特殊應用領域 係作為LCD面板中的背光,例如在LCD TV中,且本發明 將被特別地解釋用於此應用’但應注意本發明不限於此應 用。 【先前技術】 透射類型之LCD顯示面板需要具有一背光,亦即,置於 從觀看者可見的LCD後方的一光源。僅用一個光源實施一 者光係可月b的。已開發出以呈水平定向彼此置於上方的複 數個伸長式光源(典型是氣體放電燈)為基礎的背光實施 例,此等實施例具有一優點係其可能給予不同的光量值至 面板之不同部分以增強對比差異。代替氣體放電燈,也可 能使用複數個LED。LED典型被配置成水平光條,且背光 包括配置在彼此上方之複數個此等光條。一光條之LED可 被並行驅動,但也可能個別地驅動個別LED,以使得個別 地设疋個別LED之光輸出量值,以增強LCD面板之相應部 分的對比。此設備亦指示為二維調光/增壓,且以一視訊 k號之内容為基礎被執行。由於此本質上已為熟習此項技 術者所知,所以此處可省略進一步的解釋。 LED控制中一重要特徵係希望控制光輸出。例如,在以 上實例中如果視汛信號的分析指示出視訊内容未改變, 則背光LED之光輸出不應改變。然而,一眾所周知問題 係田驅動號(LED電流)維持伍定時,LED之光輸出未 129529.doc 200904239 必恆定。顯著地,一LED之光輸出取決於溫度··其接面溫 度越南,則其光輸出越低。此外,光輸出隨著溫度上升而 降低之比率取決於LED類型。例如,對於—白色led,將 溫度從2(TC上升至7〇t:可導致光輸出減少2〇%。此在一單 個LED系統中已經不合需要,即使其可能會未引起多數使 用者的注意。在-多LED系統中,影響更顯而易見,因為 使用者會看見不同的LED在其應該具有相同的光輸出的地 方同時具有不同的光輸出。 v 政匕不僅係背光領域的一個問題。例如,在照明領域,使 用不同顏色的LED以創造一具有特殊顏色點的照明,個別 LED之光輸出的不同會導致顏色點的嚴重偏離。 至此,對於維持一 LED之光輸出,已經提出以真實測量 光輸出或-影響光輸出之參數為基礎的解決方案而。例 如,US 5.783.909描述一種用於維持—LED之發光強度的 電路,其中一光感測器被用於感測LED之發光強度或一溫 度感測器被用於感測LED之操作溫度。w〇 2〇〇6/〇43232: 示可藉由測量該LED之電阻而測量一㈣之接面溫度。 此等先别技術解決方案之—缺點係、所需的感測器之數量 與之數量成比例,且此等感測器,連同必需的測量硬 體及介面連接硬體,增加系統之成本及複雜性,不管係一 背光系統或-照明系統。即使其可能具有複數個LED共用 一個感測器,但成本仍然彳艮高。 【發明内容】 本發明之-目標係消除或至少減少以上提及之問題。 129529.doc 200904239 特定言之’本發明目標係提供一種用於驅動一 LED系統 之方法及裝置’其中補償溫度相依之光輸出,而無需具有 感測器及測量硬體。 根據本發明,不測量LED之溫度,取而代之的係,考量 供應至個別LED之個別電力’以LED系統之一熱模型為基 礎來汁异/預測/估計個別LED之溫度,且以如此計算/預測/ 估計之個別溫度為基礎來調適用於個別LED之個別控制信 號。可用硬體來實施該熱模型,但可便於用軟體來實施該 熱模型。 在獨立請求項中提及進一步的有利細節。 應/主忍,US 6.970.8 11揭示一種用於驅動一信號led之 電路,其包括一周圍環境溫度感測器,且包括一硬體模 型’其模型化回應於驅動信號的LED光輸出之行為。然 而’該解決方案不適合一種包括若干LED之系統的情況。 本發明之此等及其他態樣、特徵及優點將藉由以下一或 多項較佳實施例參照圖示之描述得以進一步地解釋,其中 同樣的參考數字指示出同樣或相似的部件。 【實施方式】 圖1示意性地繪示一背光系統1,其包括一安裝於—背板 3上之背光LED之矩形矩陣2。一般而言,將藉由參考數字 1〇指示出LED ;如果意欲指示出一特定的個別LED,則會 使用下標X及Y,指示出此LED在該矩形矩陣中的之水平位 置及垂直位置。該系統1進一步包括—控制器3〇,其決定 每一led 10應發射的光量。例如,該控制器3〇可具有用= 129529.doc 200904239 接收一視汛#號之一輸入3丨,且可被設計以視訊内容為基 礎來決定個別LED之調光或增a,如本質上已知。為了輸 出用於LED控制的控制信號,控制器3〇具有相應數目的輸 出,其一同被標示為”輸出32”。對於各個LED,該系統丨可 包括一相應的LED驅動器20,其接收來自該控制器3〇之相 應的控制信號並產生用於該LED的一適當驅動信號;在圖 1中,出於簡單的緣由,這僅對於一個LED予以繪示。同 樣地’出於簡單的緣由’至該等LED之電源及電力線未在 圖中繪示。 用於LED之適當的驅動信號可以係一塊狀led電流,以 疋切換頻率予以適當地開啟/關閉,其中作用時間循環 決定平均LED電流,並且因此決定調光或增壓位準。來自 該控制器3 0之控制信號可以係一指示出所要作用時間循環 的仏號,或其本身可以係一種塊狀信號,在此情況下,該 LED驅動器20按藉ώ塊狀控制信號指*之情況簡單地切換 LED電流開啟及關閉。 圖2係一繪示構成本發明基礎之基本問題的圖表。圖2之 水平軸代表溫度τ(攝氏度),圖2之垂直軸代表一LED之相 對光輸出RLO(百分比)。f亥圖顯示光輸出與《盈度成反比 例:隨著溫度升高,光輸出降低。在該圖中,室溫被當作 一個參考值。不同類型的LED可具有不同的溫度相依性。 在該圖之實例中’溫度每升高饥,則光輸出降低1〇%。 假设意欲用該控制器3〇驅動一特定LED,以獲得一定的 恆定光輸出。為此目的,假設該控制器產生一恆定控制信 129529.doc 200904239 號。由於係開啟中,所以該LED消耗一些能量且其溫度正 在升高;因此,其光輸出下降。如果該Led以一較高作用 時間循環操作以達到一較高光輸出(增壓),則溫度上升愈 高,因此光輸出之相對降低愈高。 一複雜因素係此作用中LED亦造成相鄰的LED之溫度升 高。即使此相鄰LED以一相對低(平均)電力操作,其溫度 不僅由其自身相對低的能量消耗所決定,而且亦由其鄰近 者產生的熱量所決定。 現在,一 LED之溫度(且因此其相對光輸出)不僅取決於 其目前的電力設定及其電力設定之歷史,而亦取決於其鄰 近者的電力設定及電力設定之歷史。 克服此問題的一種方式係為各個LED提供一相關聯的溫 度測量裝[不管係-直接溫度感測器或一個用於測量接 面電阻的感測ϋ。在此情況中,該控制㈣可接收用於各 個個別LED的個制4信號,使得該㈣㈣能夠個別調 適其於個別LED的控制信號以補償溫度效應。然而,這是 -個十分昂貴的解決方案’雖然其毫無疑問地起作用,: 不為本發明所提議。 根據本發明,該系統!包括一模型1〇〇,其代表該咖矩 陣2之熱行為。這在圖3中繪示。可用硬體或軟體來實施該 杈型,其接收來自該控制器30之輸出信號32作為輸入作 旒’且其產生代表該等LED之溫度的輸出信號199;在下 文中,將參照圖4解釋-硬體實施方案。該系統❸一步勺 括-與該控制器30相關聯的記憶體4〇,其含有關於兮等 129529.doc -10- 200904239 LED 10之光熱行為的資訊, 的關係。對於每個LED】〇 //目對光輸出與溫度之間 d(則)/d丁(見圖2)之熱光係 被疋義為TLC-200904239 IX. Description of the Invention: TECHNICAL FIELD OF THE INVENTION The present invention generally relates to the control of LEDs. One particular application area of LEDs is as a backlight in an LCD panel, such as in an LCD TV, and the invention will be specifically explained for this application', but it should be noted that the invention is not limited to this application. [Prior Art] A transmissive type LCD display panel needs to have a backlight, that is, a light source placed behind the LCD visible from the viewer. Only one light source can be used to implement one light system. Backlighting embodiments based on a plurality of elongated light sources (typically gas discharge lamps) oriented horizontally above each other have been developed, and such embodiments have the advantage that they may impart different amounts of light to the panel Different parts to enhance contrast differences. Instead of a gas discharge lamp, it is also possible to use a plurality of LEDs. The LEDs are typically configured as horizontal strips, and the backlight includes a plurality of such strips disposed above each other. The LEDs of a strip can be driven in parallel, but it is also possible to individually drive individual LEDs so that the light output values of the individual LEDs are individually set to enhance the contrast of the corresponding portions of the LCD panel. This device is also indicated as two-dimensional dimming/boosting and is executed based on the content of a video k-number. Since this is already known to those skilled in the art, further explanation may be omitted herein. An important feature in LED control is the desire to control the light output. For example, in the above example, if the analysis of the view signal indicates that the video content has not changed, the light output of the backlight LED should not change. However, a well-known problem is that the field drive number (LED current) is maintained at a time, and the LED light output is not 129529.doc 200904239 must be constant. Significantly, the light output of an LED depends on the temperature of its junction temperature in Vietnam, the lower its light output. In addition, the ratio at which the light output decreases as the temperature rises depends on the type of LED. For example, for a white LED, raising the temperature from 2 (TC to 7〇t: can result in a 2% reduction in light output. This is already undesirable in a single LED system, even though it may not attract the attention of most users. In a multi-LED system, the effect is more obvious because the user will see different LEDs having different light outputs where they should have the same light output. v Politics is not only a problem in the backlight field. For example, In the field of lighting, LEDs of different colors are used to create a lighting with a special color point, and the difference in light output of individual LEDs causes a serious deviation of the color points. At this point, for maintaining the light output of an LED, real measurement light has been proposed. Output or - a parameter-based solution that affects the light output. For example, US 5.783.909 describes a circuit for maintaining the luminous intensity of an LED, wherein a light sensor is used to sense the luminous intensity of the LED or A temperature sensor is used to sense the operating temperature of the LED. w〇2〇〇6/〇43232: The junction temperature of one (four) can be measured by measuring the resistance of the LED. The first technical solution is that the number of sensors required is proportional to the number of sensors, and these sensors, together with the necessary hardware and interface hardware, increase the cost and complexity of the system. Whether it is a backlight system or a lighting system, even though it may have a plurality of LEDs sharing one sensor, the cost is still high. [Invention] The object of the present invention is to eliminate or at least reduce the above mentioned problems. 129529.doc 200904239 In particular, the object of the present invention is to provide a method and apparatus for driving an LED system in which temperature dependent light output is compensated without the need for a sensor and measuring hardware. According to the present invention, Measure the temperature of the LED, and replace it with the individual power supplied to the individual LEDs. Based on one of the thermal models of the LED system, the temperature of the individual LEDs is predicted/estimated/estimated, and the individual temperatures calculated/predicted/estimated as such Based on the individual control signals applied to individual LEDs, the thermal model can be implemented with hardware, but it is convenient to implement the thermal model with software. Further advantageous details are mentioned in the claims. US 6,970.8 11 discloses a circuit for driving a signal led comprising an ambient temperature sensor and comprising a hardware model Modeling the behavior of the LED light output in response to the drive signal. However, the solution is not suitable for a system comprising a plurality of LEDs. These and other aspects, features and advantages of the present invention will be preferred by one or more of the following. The embodiments are further explained with reference to the description of the drawings, wherein like reference numerals indicate the same or similar components. FIG. 1 schematically illustrates a backlight system 1 including a mounting on the backplane 3 The rectangular matrix 2 of the backlit LED. In general, the LED will be indicated by reference numeral 1; if a specific individual LED is intended to be indicated, the subscripts X and Y will be used to indicate the horizontal and vertical position of the LED in the rectangular matrix. . The system 1 further includes a controller 3〇 that determines the amount of light that each led 10 should emit. For example, the controller 3 can have one input 3 接收 received by 129529.doc 200904239 and can be designed to determine the dimming or a increase of individual LEDs based on the video content, as in essence. A known. In order to output a control signal for LED control, the controller 3 has a corresponding number of outputs, which are collectively labeled "Output 32." For each LED, the system 丨 can include a corresponding LED driver 20 that receives a corresponding control signal from the controller 3 and generates an appropriate drive signal for the LED; in Figure 1, for simplicity The reason, this is only shown for one LED. Similarly, the power and power lines to the LEDs for the sake of simplicity are not shown. The appropriate drive signal for the LED can be a piece of led current that is properly turned on/off at the switching frequency, where the active time cycle determines the average LED current and thus determines the dimming or boost level. The control signal from the controller 30 may be an apostrophe indicating the time cycle to be applied, or itself may be a block signal, in which case the LED driver 20 refers to the block control signal. The situation simply switches the LED current on and off. Figure 2 is a diagram showing the basic problems constituting the basis of the present invention. The horizontal axis of Figure 2 represents the temperature τ (degrees Celsius), and the vertical axis of Figure 2 represents the relative light output RLO (percentage) of an LED. The f chart shows that the light output is inversely proportional to the “increase”: as the temperature increases, the light output decreases. In this figure, room temperature is taken as a reference value. Different types of LEDs can have different temperature dependencies. In the example of the figure, the light output is reduced by 1% for every increase in temperature. It is assumed that the controller 3 is intended to drive a particular LED to achieve a certain constant light output. For this purpose, assume that the controller generates a constant control letter 129529.doc 200904239. Since the system is turned on, the LED consumes some energy and its temperature is rising; therefore, its light output drops. If the Led is cycled for a higher period of time to achieve a higher light output (boost), the higher the temperature rise, the higher the relative decrease in light output. A complicating factor is that the LED also causes the temperature of adjacent LEDs to rise. Even if the adjacent LED operates at a relatively low (average) power, its temperature is determined not only by its relatively low energy consumption, but also by the heat generated by its neighbors. Now, the temperature of an LED (and therefore its relative light output) depends not only on its current power settings and its history of power settings, but also on the history of its neighbors' power settings and power settings. One way to overcome this problem is to provide an associated temperature measurement package for each LED [regardless of the system-direct temperature sensor or a sense ϋ for measuring the junction resistance. In this case, the control (4) can receive the individual 4 signals for the individual LEDs such that the (4) (4) can individually adapt their control signals to the individual LEDs to compensate for temperature effects. However, this is a very expensive solution 'although it does not work in any way: not proposed for the invention. According to the invention, the system! A model 1〇〇 is included which represents the thermal behavior of the coffee matrix 2 . This is illustrated in Figure 3. The file can be implemented with a hardware or software that receives the output signal 32 from the controller 30 as an input and generates an output signal 199 representative of the temperature of the LEDs; hereinafter, it will be explained with reference to FIG. Hardware implementation. The system further includes a memory 4 associated with the controller 30, which contains information about the photothermal behavior of 129529.doc -10-200904239 LED 10. For each LED, the thermal light system between the light output and the temperature d (then) / d (see Figure 2) is deprecated as TLC-

^ ,, ,a η β, Λ 丁 乂表遠。如果所有的LED 彼此相Η ’則所有的熱光係數 ® σ ^ ^ 加任 了彼此相同且此記憶體40需 要只含有一個值丁Lc。也 而 LED 10 ^ 此係該記憶體40含有個別 LED 1 〇χ γ之個別值 tlcx γ。 在该熱模型1〇〇之硬體實施 員死方案中,一LED表示為在一 電路中的一節點。該系統 表丁為在^ , , , a η β, Λ 乂 乂 乂 far. If all the LEDs are opposite each other, then all the thermo-optic coefficients ® σ ^ ^ are added to each other and the memory 40 needs to contain only one value Lc. Also, LED 10 ^ is that the memory 40 contains the individual values tlcx γ of the individual LEDs 1 〇χ γ. In the hardware model of the thermal model, an LED is represented as a node in a circuit. The system is in the

叼…、机了藉由在該電路中湳 動的一電流予以表示。埶阻可^ ^ ? "L _ θ …、I 了藉由一電阻器予以表示,埶 容量可藉由一電容器予以矣_ '、、、 °至一LED之熱輸入可藉由 攸電流源供應至相應電路節點的電流予以表示,來卜 LED之熱輸出可藉由由一雪冷 電机源從§亥相應電路節點汲取的 電流予以表示。然後,一電路節 电吟即點處的所付電壓代表該對 應LED的所得溫度。 圖4係一繪示硬體模型之一個單元⑻之電路圖,該單元 ⑻對應於-LED1Gx,Y。在該單元⑻中,—節點叫y代 表與該LED 10χ,γ對應的背板3的一部分;在該節點處的電 壓V(103X’Y)代表該背板3之該部分的溫度。該背板部分之 熱容量係由一連接該節點1〇3χ γ至接地之電容器IB予以表 示。 此背板部分與相鄰的板部分之熱交換接觸係由電阻器 141、142、143、144予以表示’其連接該節點1〇3χ γ至相 鄰節點103X’Y-,、103χ γ + 1、γ、1〇3χ+ι γ,相鄰的節 點在圖4中各自以虛線繪示β除了接收來自相鄰的背板部 I29529.doc 200904239 分之熱量或釋放熱量至相鄰的背板部分,該背板部分可經 由輕射或對流釋放熱量’其係由一連接此節點〜至接 地之電流源15 ί予以表示。在笛一 在第一近似值中,由此電流源 1 5 1汲取的電流可被認為係 L ^ 你固疋的。如果需要更多的精確 度,此電流源151可以是-可控電流源,受控於節點103χγ 上的電壓,其代表一熱損失’其與該背板部分及其周圍環 境之間的溫差成比例,但圖中未予以繪示。 ί 在該單元101中,一節點110x,Y代表該LED1〇XY;在此 節點處的電壓V(1i〇x,Y)代表該LEDi〇xy之溫度。該 led 1 〇χ,γ之熱容量係由—連接此節點iγ至接地之電容 裔132予以表示。 該LED 1Gx,Y與對應f板部分存在熱交換接觸;這係由 -電阻器⑷予以表示,其連接該節點ι〇3χγ至該節點 ii〇x,Yl 了接收來自對應背板部分之熱量或釋放熱量至 對應的背板部分,該LED可經由輻射或對流釋放熱量,其 係由一連接此節點110χ,γ至接地之電流源152予以表示。再 次:在第-近似值中,由此電流源152及取的電流可被認 為係固定的。如果需要争客沾接 而耷更多的精確度,此電流源152可以 是-可控電流源’由節點11Gxy上的電壓控制,其代表一 熱損失,其與該LED及其周圍環境之間的溫差成比例,但 圖中未予以繪示。 最後,但並非最不重要的’歸因於自其操作電流中散失 的能量而造成該LED被加熱。這係由連接此節點ιι〇χγ至 -供應電壓源vs的一電流源153予以表示。此電流源153係 129529.doc •12· 200904239 一可控電流源,受控於控制信號32或自控制信號32導出 一信號。 ’ 應注意,該模型i 00之硬體電路表示可用離散組件予以 實施,但也可用一積體電路予以實施。然而,除了—硬= 實施方案外,亦可用軟體實施該模型,且由一處理器或專 用硬體類(例如,微控制器、微處理器4FGPA)予以執行。 電阻值及電容器值可在一記憶體中儲存為固定參數。=壓 值及電流源值可在各個計算步驟之後儲存於一隨機存取= 憶體中,且可在每個計算步驟之前從此隨機存取記憶體中 讀取。 應進一步注意,該模型1 00及該控制器3 〇可被整合至— 個單元中。 在圖4之硬體表示中,該模型持續操作。在一軟體表示 中,該模型逐步驟操作。在每個步驟中,在節點i〇hY(背 板)處的一新電壓V(103x,Y)(亦即溫度)係根據公式所算 V(103x,y)new~V(1〇3x,y)old+AVx,y,其中 AT, V R,.·, R … P -/151 同樣,在即點ll〇XY(LED)處的一新電壓ν(11〇χγ)(亦即溫 度)係根據公式所計算V⑴〇χ yW哪1〇χ yWd+avl”皿 其中 ’ 129529.doc -13- 200904239叼..., the machine is represented by a current that is turbulent in the circuit. The 埶 resistance can be ^ ^ ? "L _ θ ..., I is represented by a resistor, the 埶 capacity can be 藉 _ ',, ° ° to the heat input of an LED can be obtained by the 攸 current source The current supplied to the corresponding circuit node is indicated, and the thermal output of the LED can be represented by the current drawn from the corresponding circuit node by a snow-cooled motor source. Then, a circuit saves the voltage at the point, which represents the resulting temperature of the corresponding LED. Figure 4 is a circuit diagram showing a unit (8) of a hardware model corresponding to -LED1Gx, Y. In the unit (8), the node y represents a part of the backplane 3 corresponding to the LED 10, γ; the voltage V (103X'Y) at the node represents the temperature of the portion of the backplane 3. The heat capacity of the backplane portion is represented by a capacitor IB connecting the node 1〇3χ γ to ground. The heat exchange contact of the back plate portion with the adjacent plate portion is represented by resistors 141, 142, 143, 144 'which connects the node 1 〇 3 χ γ to the adjacent node 103X'Y-, 103 χ γ + 1 , γ, 1〇3χ+ι γ, adjacent nodes are shown in dotted lines in Figure 4, respectively. In addition to receiving heat from adjacent backplanes, the heat is released or the heat is released to the adjacent backplane. The backplane portion can release heat via light or convection, which is represented by a current source 15 ί connecting the node to ground. In the first approximation, the current drawn by the current source 1 5 1 can be considered to be L ^ you are solid. If more precision is required, this current source 151 can be a controllable current source controlled by the voltage at node 103 χ γ, which represents a heat loss 'the temperature difference between the back plate portion and its surroundings Proportion, but not shown in the figure. In the unit 101, a node 110x, Y represents the LED1〇XY; the voltage V(1i〇x, Y) at this node represents the temperature of the LEDi〇xy. The led 1 〇χ, γ heat capacity is represented by the capacitance 132 connecting the node iγ to ground. The LED 1Gx, Y has a heat exchange contact with the corresponding f-plate portion; this is represented by a resistor (4) that connects the node ι〇3χγ to the node ii〇x, Yl receives heat from the corresponding backplane portion or The heat is released to the corresponding backplane portion, which can dissipate heat via radiation or convection, which is represented by a current source 152 that connects the node 110, γ to ground. Again: in the first approximation, the current source 152 and the current drawn can be considered to be fixed. If more precision is required for the guest to touch, the current source 152 can be a - controllable current source 'controlled by the voltage on node 11Gxy, which represents a heat loss between the LED and its surroundings. The temperature difference is proportional, but is not shown in the figure. Last but not least, the LED is heated due to the energy lost from its operating current. This is represented by a current source 153 that connects this node ιι〇χγ to the supply voltage source vs. This current source 153 is a controllable current source that is controlled by control signal 32 or derives a signal from control signal 32. It should be noted that the hardware circuit representation of the model i 00 can be implemented with discrete components, but can also be implemented with an integrated circuit. However, in addition to the hard-implementation scheme, the model can be implemented in software and executed by a processor or a dedicated hardware class (e.g., microcontroller, microprocessor 4FGPA). The resistance value and the capacitor value can be stored as a fixed parameter in a memory. The voltage and current source values can be stored in a random access = memory after each calculation step and can be read from the random access memory before each calculation step. It should be further noted that the model 100 and the controller 3 can be integrated into one unit. In the hardware representation of Figure 4, the model continues to operate. In a software representation, the model operates step by step. In each step, a new voltage V(103x, Y) (ie, temperature) at node i〇hY (backplane) is calculated according to the formula V(103x, y)new~V(1〇3x, y)old+AVx,y, where AT, VR,.·, R ... P -/151 Similarly, a new voltage ν(11〇χγ) at the point ll〇XY(LED) (ie temperature) is based on The formula calculates V(1)〇χ yW which 1〇χ yWd+avl”中中中' 129529.doc -13- 200904239

AVLAVL

Y (v(m)xy~v(n〇) rY (v(m)xy~v(n〇) r

R 145 + ’153 *~’l 52 cR 145 + ’153 *~’l 52 c

J OLDJ OLD

At 132 以上係正確的,只要與該系統之熱時間常數相比時間步進 A t為小。 ▲在以上公式中’下標意代圖4的電路中的組件,此應為 熟習此項技術者所明瞭。 基於來自該模型i 〇 〇之輸出信號i 9 9,該控制器3 〇瞭解每 個個別LED 1 Οχ γ之險p弓、、©存下 χ’γ之瞬間Μ度τχ,γ。使用記憶體40中的資 訊,該控制器30計算每個個別LEDl〇XY之相對光輸出 RL〇x’Y,且以一相應方式調適控制信號以補償溫度效 j例如’假6又基於輸入3 i處接收之視訊信號的視訊内 谷,該控制器3()計算出—特mled1()x,y應產生其標稱 光輸出之60%的光始·ψ 、杜 ^ + ^ ^ 尤翰出。進一步假設來自該模型1〇〇之輪 出#號1 99為此特定的LED 1〇χ γ預測/估計一瞬間溫度75 C進步假堍由圖2表示之圖形關係應用於此特定的 I^ED 1〇χ γ。gj此,基於從該模型⑽及該記憶體如接收之 貝讯’該控制器30計算出此特定的LED 10χ,γ具有—相對 光輸出為8〇%,使得該控制器30計算出其應為此特定的 L^ED 1〇χ’γ產生控制輸出信號A y,其導致一作用時間猶 衣為75% .然後,所得光輸出係其標稱光輸出 800/〇χ750/〇=60%。 概5之’為估計—矩陣2之LED的溫度,本發明提出使 用★杈型1〇〇。對於每個LED 1〇x y ,該模型包括: -第一節點ιιοχ,γ,其代表該lEd ; 129529.doc 14 200904239 -第一電容組件131,其連接至該第一節點,代表該LED 之熱容量; -第二節點1〇3χ γ ’其代表相應於該Led之背板部分; -第二電容組件132,其連接至該第二節點,代表該背板 部分之熱容量; -一處於該兩個節點之間的電阻組件丨45,其代表該lED 與該背板之間的熱耦合之熱阻;At 132 is correct, as long as the time step A t is small compared to the thermal time constant of the system. ▲In the above formula, the subscripts represent the components in the circuit of Figure 4, which should be apparent to those skilled in the art. Based on the output signal i 9 9 from the model i 该 该, the controller 3 knows the risk p bow of each individual LED 1 Οχ γ, and the moment τ χ, γ of 存 γ. Using the information in the memory 40, the controller 30 calculates the relative light output RL 〇 x'Y of each individual LED 〇 XY and adapts the control signal in a corresponding manner to compensate for the temperature effect j such as 'false 6 and based on input 3 The video intra-valley of the video signal received at i, the controller 3() calculates - the special mled1()x, y should produce 60% of its nominal light output, 杜, du ^ + ^ ^ Out. Further assume that from the model 1 〇〇 wheel out #号 1 99 for this particular LED 1 〇χ γ prediction / estimation of a momentary temperature 75 C progress false 堍 The graphical relationship represented by Figure 2 is applied to this particular I ^ ED 1〇χ γ. Gj, based on the calculation of the specific LED 10χ from the model (10) and the memory such as the received receiver, the γ has a relative light output of 8〇%, so that the controller 30 calculates the response. For this particular L^ED 1〇χ'γ produces a control output signal A y which results in a period of 75%. The resulting light output is then nominally light output 800 / 〇χ 750 / 〇 = 60% . The value of the LED is estimated to be the temperature of the LED of the matrix 2, and the present invention proposes to use the 杈 type 1 〇〇. For each LED 1 〇 xy , the model includes: - a first node ιιο χ, γ, which represents the lEd; 129529.doc 14 200904239 - a first capacitive component 131 connected to the first node, representing the thermal capacity of the LED - a second node 1 〇 3 χ γ 'which represents a portion of the backplane corresponding to the Led; - a second capacitive component 132 connected to the second node, representing the thermal capacity of the backplane portion; - one in the two a resistor assembly 丨45 between the nodes, which represents the thermal resistance of the thermal coupling between the lED and the backplane;

-處於該第二節點1〇3χ γ及相鄰的第〕節點之間的電阻組 件141、"2、143、144 ’其代表該背板部分與相鄰的背板 部分之間的熱耦合之熱阻; 弟 '"丨L源組件1 5 3,呈i車接5 士女楚 *αγa resistor component 141, "2, 143, 144' between the second node 1〇3χ γ and an adjacent node, which represents thermal coupling between the backplane portion and an adjacent backplane portion Thermal resistance; brother '"丨L source component 1 5 3, presented i car 5 female Xu * αγ

八運接至忒弟一即點,代表該LED 之散熱。 的。較佳考慮此埶損类. …、彳貝失’為此目的,對於每個 LED 10χ,γ,該模型1〇〇較佳進一步包括: -第二流源組件丨U,盆 ^ TED10 〃連接至该苐一即點ιι〇χ,γ,代表該 LED 1〇χ’γ經由輻射或對流所損失的熱; 第三流源組件151,其連接至該第二節點1〇3”,代表兮 背板部分經由輻射或對流所損失的熱。 w 雖然本發明卩 圖不及别述描述中被繪示 但熟習此項技術者雇BB A L 及4、、、田描迷’ 或例證性的而非限制“ 為係5兄明性的 t Μ㈣ 本發^限於所揭示之實施 例,更確切地,若干# κ ^ 所定義m 可能處於在附屬請求項中 所疋義之本發明的保護範圍内。 項中 129529.doc 200904239 例如,如果必需提高精確度,或如果必需防止錯誤在計 算中積聚,可能在結構之一適當策略位置(例如在該背板3 ,中二處)增加一個(或一些,但基本上係僅一個)實際溫度 j測器,。此感測器之溫度讀數應相應於由該模型ι〇〇計 异所得之溫度。如果出現一差異,則容易實施—修正,特 '係在該模型之軟體實施方案中,在此情況下所有電壓值 (酿度值)可乘以相同的修正因數藉以消除該差異。進一步 地,可猎由調適該模型之參數以修改計算,例如該等電流 源151、152、153。例#,如果實際上出現該感測器位置 之溫度增加多於該模型預測的值,則增加電流源153之電 流值係可行的。 更進-步地’在以上表示,,電塵用以代表溫度值。因 4 ’可存在介於以開氏溫度度數為單位之溫度盥以伏特為 單位之電壓之間的 '、仇特為 “ ·、 轉4因數’ 5亥因數非必然必須等於 — π)。然而,尤其是在如軟體計算中,有可能直接使 用實際溫度值。 有了此直接使 熟習此項技術者在實作本發明之請求項 發明與本附屬請求 、研九圖不本 的其他變更。在請求項中,”包括”一 ^所揭不之貫施例 步驟,不定冠詞:不排除其他組件或 或一個”不排除係複數。走田 器或其他單元可實現在該等請求項中表早一處理 能。在互不相同之獨立請 :之右干項目的功 並不指示出此等方法之結合:特定方法的純事實 館存/分散於1當的式可被 J如先學儲存媒體或一 I29529.doc -J6 - 200904239 、〜媒體其連同或作為其他硬體之部分被 以其他形式分佈,例如經由網際網路或 /、也可 訊系統。嘖戈焐夕t、 有線或無線通 α月求項之任何麥考標記不應解釋成限制 項之範圍。 市〗通寺μ求 在上文中’本發明已參照方塊圖被解釋 私昍夕外# m 开、,,曰不很據本 《月之该裝置之功能區塊。應瞭解,可用 個此等功能區μ古安..L 賞 或夕 f 中此功能區塊之功能係藉由個別 更體、'且件實現,但也可能 〇 月J用歡媸貫細* —或多個此等功能 區塊,使得此等功能區塊之功能係藉由一電腦程式或一程 式化裝置之一個或更多程式列而實現,例如一微處理器、 微控制器、數位信號處理器等。 【圖式簡單說明】 圖1不意性地繪示一背光系統; 圖2係—繪示一 lEd之溫度及其相對光輸出之間的關係 之圖表; 圖3係一示意性地繪示根據本發明之一 LED系統的基於 模型控制的方塊圖; 圖4係一示意性地繪示一電子電路作為根據本發明之一 LED控制電路之一部分的硬體實施方案之方塊圖。 【主要元件符號說明】Eight transports are connected to the younger brother, which represents the heat dissipation of the LED. of. It is preferable to consider the damage type. ..., 彳贝失' For this purpose, for each LED 10 χ, γ, the model 1 〇〇 preferably further comprises: - a second flow source component 丨 U, a basin ^ TED10 〃 connection To the first point, ιι〇χ, γ, represents the heat lost by the LED 1〇χ'γ via radiation or convection; the third flow source component 151 is connected to the second node 1〇3”, representing 兮The heat lost by radiation or convection in the back plate portion. w Although the present invention is not as depicted in the descriptions, those skilled in the art employ BB AL and 4, , , , , , The limitation "is not limited to the disclosed embodiments, and more specifically, a number of # κ ^ defined m may be within the scope of the invention as defined in the appended claims. 129529.doc 200904239 For example, if it is necessary to improve the accuracy, or if it is necessary to prevent errors from accumulating in the calculation, it is possible to add one (or some, in the appropriate strategic position of the structure (for example, in the backplane 3, the middle two) But basically only one) the actual temperature j detector. The temperature reading of this sensor should correspond to the temperature obtained from the model. If a difference occurs, it is easy to implement - the correction, in the software implementation of the model, in which case all voltage values (growth values) can be multiplied by the same correction factor to eliminate the difference. Further, the parameters of the model can be adapted to modify the calculations, such as the current sources 151, 152, 153. Example #, if the temperature of the sensor position actually increases more than the value predicted by the model, it is feasible to increase the current value of the current source 153. Further, in the above, electric dust is used to represent the temperature value. Because 4' can exist between the temperature in degrees Kelvin, the voltage in volts, the venge is ", the 4 factor, the 5 factor is not necessarily equal to - π). In particular, in the case of software calculations, it is possible to directly use the actual temperature value. This directly allows the person skilled in the art to implement the invention of the present invention and other changes to the present invention. In the request item, the "comprising" steps are not disclosed. The indefinite article: does not exclude other components or or "do not exclude plurals." A field device or other unit can achieve early processing in the request items. In the case of independent independence, the right-hand project does not indicate the combination of these methods: the pure facts of a particular method can be stored in a medium such as a storage medium or an I29529. Doc -J6 - 200904239 ~ The media is distributed in other forms along with or as part of other hardware, for example via the Internet or /, also the system. Any of the McCaw marks for the alpha or cable or the wireless channel shall not be construed as limiting the scope of the term. City 〗 〖Tongji μ seeking In the above, the present invention has been explained with reference to the block diagram. Private 昍外外# m 开,,,曰 is not very according to the functional block of the device. It should be understood that the function of this functional block can be realized by a single functional body, such as a part of the functional area, or by the use of the functional block, but it may also be used by the month. - or a plurality of such functional blocks, such that the functions of the functional blocks are implemented by one or more program modules of a computer program or a stylized device, such as a microprocessor, a microcontroller, a digital Signal processor, etc. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic diagram showing a backlight system; FIG. 2 is a diagram showing the relationship between the temperature of a lEd and its relative light output; FIG. 3 is a schematic diagram showing A block diagram of a model control based on one of the LED systems; FIG. 4 is a block diagram schematically showing an electronic circuit as a hardware embodiment of a portion of an LED control circuit in accordance with the present invention. [Main component symbol description]

1 背光系統 2 矩陣 3 背板 1〇χ γ LED 129529.doc 200904239 20 L Ε D驅動器 30 控制器 31 輸入 32 輸出信號 40 記憶體 100 模型 101 — 早兀 1〇3χ,Υ 第二節點 1〇3χ)Υ., 節點 1 03 χ γ+ 1 節點 1〇3χ.,ιΥ 節點 103 χ+ι,γ 節點 ΠΟχ,γ 第一節點 131 第一電容器 132 第二電容器 141 電阻器 142 電阻器 143 電阻器 144 電阻器 145 電阻器 151 第三電流源 152 弟二電流源 153 第一電流源 199 輸出信號 Vs 電壓源 129529.doc -181 Backlight System 2 Matrix 3 Backplane 1〇χ γ LED 129529.doc 200904239 20 L Ε D Driver 30 Controller 31 Input 32 Output Signal 40 Memory 100 Model 101 — Early 兀 1〇3χ, Υ Second Node 1〇3χ ), node 1 03 χ γ+ 1 node 1〇3χ., ιΥ node 103 χ+ι,γ node ΠΟχ, γ first node 131 first capacitor 132 second capacitor 141 resistor 142 resistor 143 resistor 144 Resistor 145 Resistor 151 Third Current Source 152 Dipole Current Source 153 First Current Source 199 Output Signal Vs Voltage Source 129529.doc -18

Claims (1)

200904239 十、申請專利範圍: 1. 一種驅動一燈照系統(1)之方法,該系統包括一安裝於一 背板(3)上的LED( 10)之一矩陣(2),該方法包括下列步 驟: a) 提供資訊(40) ’其代表每個LED( 10)之相對光輸出 (RLO)與溫度(T)之間的關係; b) 提供一模型(1〇〇),其代表該矩陣(2)之熱行為; c) 決定該等LED之一所需光輸出位準;200904239 X. Patent application scope: 1. A method for driving a lighting system (1), the system comprising a matrix (2) of LEDs (10) mounted on a backboard (3), the method comprising the following Steps: a) Provide information (40) 'which represents the relationship between the relative light output (RLO) and temperature (T) of each LED (10); b) Provide a model (1〇〇) that represents the matrix (2) thermal behavior; c) determining the required light output level of one of the LEDs; d) 當使用步驟b)中提供之該模型(1〇〇)時,計算該矩陣之 該等個別LED之溫度的一估計; e) 當使用步驟a)中提供之該資訊(4〇)時,並且基於在步 驟d)中计算所得之該溫度估計,計算該矩陣之該等個別 LED之該相對光輸出(Rl〇); f) 產生用於該等led之一控制信號(32),補償在步驟e) 中計算所得之該相對光輸出(RLO),以影響在步驟c)中 決定之該所需光輸出位準。 2.如凊求項!之方法,其中,在步驟f)中用於一 ud之— 控制信號匕(32)之-作用時間循環被計算為相應所需光輸 出位準除以在步驟e)中計算所得之該相對光輪出 (LO) 4所需光輸出位準被表示為—標稱光輸出位 之一個百分比。 千 該模型 3.如請求項1之方法 U〇〇)包括: 其中對於每一 LED(l〇x,Y) 第—郎點(11〇x,Y),其代表該LED(10X Y); 129529.doc 200904239 -一第一電容組件(131),其連接至該第一節點 (11〇χ,γ) ’代表該LED(10X,Y)之一熱容量; -一第一郎點(1 〇3χ,γ) ’其代表相應於該LED( 1 0X,Y)之談 背板(3)之一部分; -一第二電容組件(132),其連接至該第二節點 (1 03χ,γ) ’代表該背板部分之一熱容量; -處於該兩個節點(11〇χγ; 1〇3χγ)之間的一電阻組件 (145),其代表該LED(l〇X Y)與該背板之間的一熱耦合< 一熱阻; -介於該第二節點(l〇3X Y)與相鄰第二節點(1〇3χ γ ι、 1〇3χ,γ+1、1〇3χ_〗,γ、l〇3x + 1Y)之間的電阻組件(141、 142、143、144),其代表相應於該LED(1〇x幻之該背板 (3)之該部分與相應於各自相鄰led(1〇x y 1、Μ、 ΙΟχιυ、10χ+1,γ)之各自相鄰背板部分之間的熱耦合之熱 阻;d) when using the model (1〇〇) provided in step b), calculate an estimate of the temperature of the individual LEDs of the matrix; e) when using the information (4〇) provided in step a) And calculating the relative light output (R1〇) of the individual LEDs of the matrix based on the temperature estimate calculated in step d); f) generating a control signal (32) for the one of the LEDs, compensating The resulting relative light output (RLO) is calculated in step e) to affect the desired light output level determined in step c). 2. If you are asking for it! a method in which the action time cycle for a ud-control signal 匕 (32) in step f) is calculated as the corresponding desired light output level divided by the relative light wheel calculated in step e) The desired light output level of the output (LO) 4 is expressed as a percentage of the nominal light output bit. Thousands of the model 3. The method of claim 1 (U) includes: where for each LED (l〇x, Y) first - lang (11 〇 x, Y), which represents the LED (10X Y); 129529.doc 200904239 - a first capacitor component (131) connected to the first node (11 〇χ, γ) 'represents one of the LED (10X, Y) heat capacity; - a first lang point (1 〇 3χ, γ) 'which represents a portion of the back panel (3) corresponding to the LED (10X, Y); a second capacitor component (132) connected to the second node (1 03χ, γ) 'representing one of the heat capacity of the back plate portion; - a resistance component (145) between the two nodes (11 〇χ γ; 1 〇 3 χ γ), which represents between the LED (10 〇 XY) and the back plate a thermal coupling < a thermal resistance; - between the second node (l〇3X Y) and the adjacent second node (1〇3χ γ ι, 1〇3χ, γ+1, 1〇3χ_〗, γ a resistor component (141, 142, 143, 144) between l〇3x + 1Y), which represents the LED corresponding to the LED (the portion of the backplane (3) corresponding to the respective adjacent led (1〇xy 1, Μ, ΙΟχιυ, 10χ+1, γ) Thermal coupling between the thermal resistance of the portion; _ 一第一流源組件(153),其連接至該第一節點 (103χ,γ) ’ 代表該 LED(l〇x γ)之散熱。 一種模型(100)之用途’該模型代表安裝於一背板(3)上 的LED(IO)之一矩陣(2)的熱行為,以估計該矩陣之個別 led之溫度及計算補償的驅動信號(32),使得該等 產生一所需光輸出。 5.如請求項4之用途’ #中對於每一led(d,該模型 (100)包括: ' 第—筇點(110χ,γ),其代表該LED(10X Y); 129529.doc 200904239 -一第一電容組件(131),其連接至該第一節點 (11〇χ,γ),代表該LED(l〇XY)之一熱容量; _ 一第二節點(1〇3χ,γ),其代表相應於該LED(10X,Y)之該 背板(3)之一部分; -一第二電容組件(132),其連接至該第二節點 (1〇3χ,γ) ’代表該背板部分之一熱容量; -介於該兩個節點(110χ γ ; 1〇3χ γ)之間的一電阻組件 ^ (145) ’其代表該LED(10X,Y)與該背板之間的一熱耦合之 一熱阻; -介於該第二節點(103χ,γ)及相鄰第二節點(1〇3χ γ ι、 103χ,γ+丨、103η γ、ι〇3χ+〗γ)之間的電阻組件(141、 142、143、144) ’其代表相應於該LED(10X,Y)之該背板 (3)之該部分與相應於各自相鄰led(1〇XsY.i、1〇χ,γ+ι、 1 Ox-ly、10χ+1,γ)之各自相鄰背板部分之間的熱耦合之熱 阻; j _ 一第一流源組件(153),其連接至該第一節點 (103χ,γ) ’代表該LED(1〇x 〇之散熱。 6. 一種照明系統(1),其包括: -一安裝於一背板(3)上的lED( 10)之一矩陣(2); -一控制器(3 〇),其被設計以產生用於該等lEd之一控 制信號(32); -一疋憶體(40),其含有代表每個LEE)(i〇)之相對光輸 出(RLO)與溫度(τ)之間的關係之資訊; • 一模型(100),其代表該矩陣(2)之熱行為; 129529.doc 200904239 其中该模型接收由該控制器(3 〇)產生之該等控制信號 (32)作為輸入信號; 且其中該控制器(30)接收來自該模型之輸出信號(199), 該等輸出信號(199)指示出該矩陣之個別LED之溫度的一 估計。 7. 如請求項6之系統,其中該控制器(3〇)被設計以決定該等 LED之一所需光輸出位準; 其中該控制器(30)被設計以使用來自該記憶體(4〇)之資 訊及基於來自該模型之該等輸出信號(丨99),計算該矩陣 之該等個別LED之相對光輸出(rl〇); 且其中s亥控制器(30)被設計以產生用於該等LEd之該等 控制信號(32) ’補償計算所得之個別led之相對光輸出 (RLO)。 8. 如請求項6之系統,其中該控制器(3〇)被設計以決定用於 該等LED之一所需光輸出位準,作為一標稱光輸出位準 之一個百分比; 其中該控制器(30)被設計以產生用於該等LED之作用時 間循環控制信號(32),具有等於各自所需光輸出位準之 作用時間循環; 其中"亥控制器(30)被設計以使用來自該記憶體(40)之資 訊及基於來自該模型之該等輸出信號(199),計算該矩陣 之έ玄等個別LED之相對光輸出(RLO); 且其中§亥控制器(30)被設計以調適用於該等LED之該等 控制彳5 ?虎(32),以補償計算所得之相對光輸出(RL〇),以 129529.doc 200904239 便維持該所需光輸出位準。 9. 10. 如請求項8之系統’复中兮 ^ T 3亥控制器(30)被設計以調適用於 該等LED之該等控制作缺 币·Μ。就(32) ’其係藉由將用於—LEC) 之控制ί»號(32)之-作用時間循環計算為以相應相對光 輸出(RLO)除以相應所需光輸出位準。 如請求項6之系統’其中該模型⑽)係以在該控制器之 軟體予以實施。a first flow source component (153) connected to the first node (103χ, γ)' represents heat dissipation of the LED (l〇x γ). The use of a model (100) represents the thermal behavior of a matrix (2) of LEDs (IO) mounted on a backplane (3) to estimate the temperature of individual LEDs of the matrix and to calculate the compensated drive signal (32) such that they produce a desired light output. 5. For the purpose of claim 4 '# for each led (d, the model (100) includes: 'the first point (110χ, γ), which represents the LED (10X Y); 129529.doc 200904239 - a first capacitor component (131) connected to the first node (11〇χ, γ), representing a heat capacity of the LED (10〇XY); _ a second node (1〇3χ, γ), Representing a portion of the backplane (3) corresponding to the LED (10X, Y); a second capacitor component (132) connected to the second node (1〇3χ, γ)' representing the backplane portion a heat capacity; - a resistance component between the two nodes (110 χ γ; 1 〇 3 χ γ) ^ (145) 'which represents a thermal coupling between the LED (10X, Y) and the backplane One of the thermal resistances; - the resistance between the second node (103χ, γ) and the adjacent second node (1〇3χ γ ι, 103χ, γ+丨, 103η γ, ι〇3χ+ γ) The component (141, 142, 143, 144) 'which represents the portion of the backplane (3) corresponding to the LED (10X, Y) and corresponds to the respective adjacent led (1〇XsY.i, 1〇χ, γ+ι, 1 Ox-ly, 10χ+1, γ) adjacent to each other The thermal coupling between the thermal couplings; j _ a first current source component (153) connected to the first node (103χ, γ) 'represents the LED (1〇x 散热 heat dissipation. 6. A lighting system (1 ), comprising: - a matrix (2) of lED (10) mounted on a backplane (3); - a controller (3 〇) designed to generate one of the controls for the lEd Signal (32); - a memory (40) containing information representative of the relationship between relative light output (RLO) and temperature (τ) of each LEE) (i); • a model (100), It represents the thermal behavior of the matrix (2); 129529.doc 200904239 wherein the model receives the control signals (32) generated by the controller (3 作为) as input signals; and wherein the controller (30) receives An output signal (199) of the model, the output signal (199) indicating an estimate of the temperature of the individual LEDs of the matrix. 7. The system of claim 6, wherein the controller (3) is designed to determine The desired light output level of one of the LEDs; wherein the controller (30) is designed to use information from the memory (4〇) And calculating a relative light output (rl〇) of the individual LEDs of the matrix based on the output signals from the model (丨99); and wherein the controller (30) is designed to generate the LEd for the LED The control signals (32) 'compensate the calculated relative light output (RLO) of the individual LEDs. 8. The system of claim 6 wherein the controller (3〇) is designed to determine a desired light output level for one of the LEDs as a percentage of a nominal light output level; wherein the control The device (30) is designed to generate an active time cycle control signal (32) for the LEDs having an active time cycle equal to the respective desired light output level; wherein the "Hai controller (30) is designed to be used Information from the memory (40) and based on the output signals (199) from the model, calculating the relative light output (RLO) of individual LEDs such as the matrix; and wherein the controller (30) is The control is applied to the LEDs of the LEDs (32) to compensate for the calculated relative light output (RL〇), which is maintained at 129529.doc 200904239. 9. 10. The system of Requirement 8 of the Requirement 8 is designed to adjust the controls applicable to the LEDs for the lack of currency. It is (32)' that the cycle of the action time of the control ί» (32) for -LEC is calculated as the corresponding relative light output (RLO) divided by the corresponding desired light output level. The system of claim 6 wherein the model (10) is implemented in the software of the controller. 11.如請求項6之系統 施0 其中該模型(100)係以硬體予以實 1 2 .如請求項6之系統,直中斟 T CTW 1 Λ 、斗 ” 丫對於母一 LED(10x,y),該模型 (1〇〇)包括: ' -一第一節點(ιι〇χγ),其代表該lED(1〇xy); -一第一電容組件(131),其連接至該第一節點 (ΙΙΟχ,γ),代表該LED(l〇X Y)之一熱容量; _ 一第一即點(103χ,γ),其代表相應於該LED(10X,Y)之該 背板(3)之一部分; •一第二電容組件(132),其連接至該第二節點 (1〇3χ,γ),代表該背板部分之一熱容量; -處於該兩個節點(110χγ; 1〇3χγ)之間的一電阻組件 (145),其代表該LED(丨〇χ γ)與該背板之間的一熱耦合之 一熱阻; -處於δ亥第二節點(ι〇3χ,γ)及相鄰第二節點(1〇3χ n、 1〇3χ,γ+丨、1〇3Χ-1γ、l〇3x + I γ)之間的電阻組件(141、 142、143、144),其代表相應於該led(1〇x y:^該背板 129529.doc 200904239 之該部分與相應於各自相鄰LED(1〇x,y-i、1〇χ,γ + 1、 1〇x-uy、10χ+1,γ)之各自相鄰背板部分之間的熱耦合之熱 阻; -第一流源組件(153),其連接至該第一節點(ι〇3χ γ), 代表該LED(10X,Y)之散熱。 13. 如印求項12之系統,其中該第一流源組件係一可控 組件。 14. 如叫求項12之用途,其中對於每一 γ),該模型 (100)進—步包括: -一第二流源組件(丨52) ’其連接至該第一節點 (χ’γ),代表该LED(10x,Y)經由輻射或對流所損失的 熱; 第三流源組件(151),其連接至該第二節點 (103x,y) ’代表該背板部分經由輕射或對流所損失的熱。 15’ 一種用於一㈣面板之背光系統,其包括-如請求項6至 14項中任一項之照明系統。 129529.doc11. The system of claim 6 is applied to where the model (100) is implemented by hardware. The system of claim 6 is as follows: TCMW 1 Λ, 斗” 丫 for the mother-LED (10x, y), the model (1〇〇) includes: '- a first node (ιι〇χγ), which represents the lED (1〇xy); a first capacitive component (131) connected to the first a node (ΙΙΟχ, γ) representing a heat capacity of the LED (10〇XY); a first point (103χ, γ) representing the backplane (3) corresponding to the LED (10X, Y) a portion; a second capacitor component (132) connected to the second node (1〇3χ, γ), representing a heat capacity of the backplane portion; at the two nodes (110χγ; 1〇3χγ) a resistor assembly (145), which represents a thermal resistance of a thermal coupling between the LED (丨〇χ γ) and the backplane; - at the second node of δ hai (ι〇3χ, γ) and phase a resistance component (141, 142, 143, 144) between the adjacent second node (1〇3χ n, 1〇3χ, γ+丨, 1〇3Χ-1γ, l〇3x + I γ), the representative of which corresponds to The led (1〇xy:^ the backplane 129529.doc 20090423 Thermal coupling between this portion of 9 and the respective adjacent backplane portions corresponding to their respective adjacent LEDs (1〇x, yi, 1〇χ, γ + 1, 1〇x-uy, 10χ+1, γ) a thermal resistance; a first current source component (153) connected to the first node (ι〇3χ γ), representing heat dissipation of the LED (10X, Y). 13. The system of claim 12, wherein The first source component is a controllable component. 14. The use of claim 12, wherein for each gamma, the model (100) further comprises: - a second stream component (丨 52) Connected to the first node (χ'γ), representing heat lost by the LED (10x, Y) via radiation or convection; a third flow source component (151) connected to the second node (103x, y) 'Represents the heat lost by the light or convection of the backplane portion. 15' A backlight system for a (four) panel comprising - the illumination system of any one of claims 6 to 14. 129529.doc
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