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TW200842525A - Reduced-pressure drying device - Google Patents

Reduced-pressure drying device Download PDF

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Publication number
TW200842525A
TW200842525A TW096140948A TW96140948A TW200842525A TW 200842525 A TW200842525 A TW 200842525A TW 096140948 A TW096140948 A TW 096140948A TW 96140948 A TW96140948 A TW 96140948A TW 200842525 A TW200842525 A TW 200842525A
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TW
Taiwan
Prior art keywords
chamber
substrate
roller
unit
transport
Prior art date
Application number
TW096140948A
Other languages
Chinese (zh)
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TWI375135B (en
Inventor
Takahiro Sakamoto
Mitsuhiro Sakai
Shunichi Yahiro
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Tokyo Electron Ltd
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Publication of TWI375135B publication Critical patent/TWI375135B/en

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    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/708Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858Environment aspects, e.g. pressure of beam-path gas, temperature
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67155Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67207Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Nonlinear Science (AREA)
  • Atmospheric Sciences (AREA)
  • Toxicology (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Optics & Photonics (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Drying Of Solid Materials (AREA)
  • Coating Apparatus (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

This invention can carry and carry out the substrate efficient, safe, and smoothly. Moreover, the transcript mark of the substrate contacted part generated in the coating film on the substrate can be made a minimum. This reduced-pressure drying unit (VD) 46 carries a substrate G that should receive the reduced-pressure drying process into the chamber 106 by the roller transportation on the carrying side roller transportation path 104a and the internal roller transportation path 104b. On the other hand, this reduced-pressure drying unit (VD) 46 carries out the substrate G that the reduced-pressure drying process ends in the chamber 106 outside the chamber 106 by the roller transportation on the internal roller transportation path 104b and the carrying out side roller transportation path 104c. A lot of lift pins 128 lift the substrate G from the roller transportation path 104b up in the state of the horizontal position and support it in the part of the pinpoint of the extra fine while processing the reduced-pressure drying.

Description

200842525 九、發明說明: 【發明所屬之技術領域】 態乾 本發明係關於使塗布在被處理基板上之塗布液於減壓狀 燥之減壓乾燥裝置。 【先如技術】 押此種減壓乾燥裝置,係用於例如液晶顯示器(LCD)等平面顯示 器(FPD)製造之光微影步驟之中,使塗布在被處理基板(玻璃基板等 上之抗蝕劑液在預烘之前乾燥。 舀知的減壓乾燥裝置,例如如專利文獻丨所記載,具有:頂 面開口之托盤或淺底容器型之下部腔室,以及可氣密地密合或嵌 合於此下部腔室之頂面的蓋狀上部腔室。下部腔室之中,設有台 座,於此台座上將基板水平地載置而後,關閉腔室(使上部腔室密 合於下部腔室)並進行減壓乾燥處理。於將基板搬出入腔室時,& 上部腔室以起重機等上升而開放腔室,再者,為將基板裝載/卸載, 將台座以缸筒等適當上升。然後,基板搬出入或裝載/卸載,係藉 由在減壓乾煉裝置周圍操作運送基板之外部運送機器人來進行。 [專利文獻1]曰本特開2000_181079 【發明内容】 [發明欲解決之問題] 習知的減壓乾燥裝置,如上所述,每次將基板搬出入腔室時, 係以將亡部腔室上升下降(開閉)之方式進行,但是隨著基板大型 化像這種裝置構造會出現各種不良情形。亦即,若基板尺寸像 LCD基板,成為一邊超過2米的大小,則腔室會顯著大型化,僅 上部腔室就有2噸以上的重量,需要大型的升降機構,且因為大 的振動造成起塵的問題或對於作業人員在安全上的問題也會浮現 出來。又,運送機器人也愈來愈大型化,但是將大的基板水平地 保持運送愈來愈難,將剛抗蝕劑塗布後之基板如團扇狀以彎曲的 200842525 „送’容易在職板搬出 時,發生位置偏離或碰撞或破損等錯i Γ置u或裝載/卸載 出入,而且J在美i fiiit王:順暢地進行被處理基板之搬 制在最小限ί 之塗布膜附著到基板接觸部之轉印痕跡抑 [解決問題之方式] 板上iiii述本發明之減壓乾燥裝置,係對於被處理基 且有用;:gjf狀態施以乾燥處理’具備:可減壓之腔室, 為了H^A致水平狀態收容之空間;第1排氣機構, ί了ίί:ί ίί;丄使前述腔室内在密閉狀输^ 以tmf、、,:、有在刖述腔室外與中間連續的滾子運送通道, 升a Ϊ通道上之滾子運送將前述基板搬出人前述腔室; 為了將前述基板以銷前端大致水平地支持並上升 ί ^ 腔室之中離散配置之多數升降銷,於實施前述乾ί 升降狀前端提高至高於前述滾子運送通道而支 上述裝置構射’由於係將麟受減壓賴處理之基板,以 滾J運送搬人腔室之中,並將於腔室_壓乾祕理完畢的 以滾子運达搬出到腔室外’所以不需要使用運送臂之運送機器 ^ ’不會發生基板像團扇-樣地弯曲,而造成裝載 ^ 離:戈,、破損等錯誤。又,在搬出入基板時,不需要開閉: 盍之知作,解決了起塵的問題或安全上的問題。再者,於 乾燥處理+’㈣錄根升_職板轉水平錢從滾子運送 通道往上方抬起敲持’所以能有效地抑制基板之抗賴膜附著 到棊板接觸部之轉印痕跡。尤其’藉由選擇升降銷之銷前端 徑為0.8mm以下(若考慮強度,則較佳為〇 4mm〜〇 6_),能顯著 200842525 =低產生。再者,為進一步地減少轉印痕跡產生,較 3之具有中空管所構成銷本體以及安裳在此銷本體前 端部’更佳為銷尖端部由其前端呈圓形之棒體 梏二雜ϊϊίί明之一較佳態樣’升降機構,係將垂直豎立支 持^降銷之棒狀或板狀銷基部配置在滾子運送通道 外之升降驅動源之驅動力升降。若為此構 ϋ為了升降機構而施用於腔室之密封機構為必要最 度,此在減壓狀態之腔室内使多數根升降銷升降動作。 、’又,依照本發明之一較佳態樣,在腔室之 、、,、 =,子’具有為固定徑的軸(shaft) ’以隔^ $ 佳辛i將f部分的任意部位以軸承支持。本發明之一較 :可旋轉方式編,且可斜心部爾 支持著。藉此’即使是長的滾子亦能以筆直的姿 又,依照本發明之一較佳態樣,在腔室之辟a 將=以滾子運送從腔室外搬人其中的搬人σ,ς及2將板 之中搬出到外面的搬出σ,並在腔室側】ΐϊ =可則、型化。搬人口及«口可相對向地各自4^1室: 壁^,但是也可以用1個口兼用為搬出入口。 、工至之側 u 刀之/袞同’或在間機構’設有於π齡僚 入口或搬出Π之狀態時為滾子運^開啟^ 成,係將滾子運送通道之滾動間距跨ρ遍=可3該構 故能達成運送性能(蚊性高速化)之間日•可能減小, 200842525 又 排氣機構 iff内於開放狀態實施排氣的第2排氣機構。此第2排二 ,,較佳為與設置於腔室之將排氣口真空抽吸用f排耽機 共用。 (發明之效果) βΐϊ本=之減壓乾燥裝置,能_像上述構成及作用, 安全^暢地進行被處理基板之搬出人,且能^ 板之塗布膜附著基偏妾觸部之轉印痕跡減至最小限度。 【實施方式] [實施發明之最佳形態] 以下,參照附圖說明本發明之較佳實施形能。 處理li顯=== 彳邊齡布、讎、顯影及舰等—連串處理。 處理’係於鄰接於此系統而設置之外部曝光裝置12進行。* 此塗布顯影處理系統10,在中心部配置橫長的處理站 =5)3長邊方向(X㈣㈣畴配置㈣站(C/S)14及界 E皿站(C/S)14 ’為系統1〇之g盒搬出入璋,具備:匡各 i0、’fffG多段重疊而可收容多糾之㈣c於水平方 口最夕、、’列4個載置,運送機構22,對於此台座2〇上之匣各〔 Ϊίίΐΐ ^ ^ 〇 22 ^ G ^ ^ 姑可於X、Y、Z、04個轴動作,進行鄰接的處理 站(P/S)16側與基板g之遞送。 處理站(P/S)16,在於水平系統長邊方向(χ方向)延伸之平行且 反向的=線A、B,以處理流程或步驟依序地配置各處理部。 更洋§之,從ϋ盒站(C/S)14側往界面站(I/F)18侧之上游部 200842525 ί理Ϊ A:沿著第1平流運送通道34,從上游顺依序以-列配 ί全入早兀(IN PASS)24、清洗處理部26、第1熱處理部28、塗 布處理部30及第2熱處理部32。 接”更it言λ,搬人單元(in pass)24健盒站⑽)14之運送機 =ίίί理之^^’以既㈣業時間投人第1平流運送通 ίϋ'ίίΐ里部26,沿著第1平流運送通道34從上__ 單元(Ε—胃6及擦磨清洗單元 (R)38苐1熱處理部28,從上游側起依序地設置 °鮮细部3G ’從上義起依序地 故置抗蝕劑塗布早元(COT)44及減壓乾燥單元(VD 埶 ,32乂從上游侧起依序地設置預烘單元_ —bake)48及冷^ 早几(COL)5〇。位於第2熱處理部32下游側鄰 道34終點,設置通過單元(屬)52。於第丨平流^送 的基板G,從此終點之通過單元(PASS)52被遞送 另一方面,從界面站(I/F)18側往匣盒站(c/s)14側之 1沿著第2平流運送通道64從上游侧起依序成-列配 -影^元(DEV)54、後烘單元(P〇ST_BAKE)56、冷卻單元〇 、 檢查單元(AP)60及搬出單元(0UT—pASS)62。在此,後供單元 ?〇S二BAKE)56及冷卻單元(COL)58構成第3熱處理部66。搬出 = tl(〇UTPASS)62,從第2平流通道64將處理完 $200842525 IX. Description of the Invention: [Technical Field of the Invention] The present invention relates to a vacuum drying apparatus for drying a coating liquid applied on a substrate to be processed under reduced pressure. [Previous technology] This type of vacuum drying apparatus is used in a photolithography process such as a flat panel display (FPD) manufactured by a liquid crystal display (LCD), and is applied to a substrate to be processed (resistance on a glass substrate or the like). The etchant liquid is dried before pre-baking. A known vacuum drying apparatus, for example, as described in the patent document, has a top open tray or a shallow bottom container type lower chamber, and can be airtightly closed or a lid-shaped upper chamber fitted to the top surface of the lower chamber. A pedestal is provided in the lower chamber, and the substrate is horizontally placed on the pedestal, and then the chamber is closed (the upper chamber is closed to the chamber) The lower chamber is subjected to a vacuum drying treatment. When the substrate is carried out into the chamber, the upper chamber is opened by a crane or the like, and the chamber is opened and unloaded, and the pedestal is placed in a cylinder or the like. Then, the substrate is carried out or loaded/unloaded, and the robot is transported by an external transport robot that transports the substrate around the vacuum drying apparatus. [Patent Document 1] 曰本特开 2000_181079 [Summary of the Invention] Problem solved] As described above, the vacuum drying apparatus performs the method of ascending and descending (opening and closing) the dead chamber every time the substrate is carried out into the chamber. However, as the substrate is enlarged, the device structure may be various. In other cases, if the substrate size is like an LCD substrate and the size is more than 2 meters on one side, the chamber will be significantly enlarged, and only the upper chamber has a weight of 2 tons or more, requiring a large lifting mechanism, and because of the large The vibration caused by the vibration or the safety problems of the workers will also emerge. Moreover, the transport robots are becoming more and more large, but it is increasingly difficult to keep the large substrates horizontally transported. After the application of the agent, the substrate is fanned to the curved 200842525 „Send'. When the board is moved out, the position is deviated or collided or damaged, etc., or the loading/unloading is entered, and J is in the US i fiiit king: smoothly Carrying out the transfer of the substrate to be processed to the minimum of the transfer film to the substrate contact portion of the transfer mark. [Solution to Problem] On the board iiii, the vacuum drying apparatus of the present invention is described. The treated base is useful; the gjf state is subjected to a drying process': a chamber capable of decompression, a space for receiving a horizontal state for H^A; a first exhaust mechanism, ίίίίίί; In the chamber, the air is transported in a closed manner, tmf, and: there is a roller transport passage that is continuous outside the middle and the middle of the chamber, and the roller on the a channel is carried out to carry the substrate out of the chamber; The substrate is substantially horizontally supported by the front end of the pin and is raised by a plurality of lift pins in a discrete arrangement in the chamber, and the front end of the device is raised above the aforementioned roller transport path by the implementation of the above-mentioned apparatus. The substrate subjected to the decompression treatment is transported in the transfer chamber by the roll J, and the roller is transported out of the chamber after the chamber is pressed and dried, so that the transport arm transporting machine is not required. ^ 'The substrate will not be bent like a fan-like shape, causing errors such as loading, separation, and damage. Moreover, when the substrate is carried in and out, it is not necessary to open and close: 盍 知 , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , In addition, in the drying process + '(4) recorded roots _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ . In particular, the tip diameter of the pin by selecting the lift pin is 0.8 mm or less (it is preferably 〇 4 mm to 〇 6_ in consideration of the strength), and it is remarkable that 200842525 = low. Furthermore, in order to further reduce the generation of the transfer mark, the pin body having the hollow tube and the front end portion of the pin body are more preferably the rod tip portion having a circular shape at the front end thereof. One of the preferred aspects of the ϊϊ ϊϊ ί ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' If the sealing mechanism applied to the chamber for the lifting mechanism is necessary for this purpose, the plurality of lifting pins are moved up and down in the chamber in the decompressed state. Further, in accordance with a preferred aspect of the present invention, in the chamber, , , , =, the sub-' has a shaft with a fixed diameter 'to separate the portion of the f portion Bearing support. One of the inventions is more flexible: it can be edited in a rotatable manner and can be supported by a slanting heart. In this way, even a long roller can be in a straight posture. According to a preferred aspect of the present invention, in the chamber, the movement of the chamber is carried out by the roller. ς and 2 move out of the board to the outside of the carry-out σ, and on the side of the chamber ΐϊ = can be, type. It is a wall ^, but it is also possible to use one port for moving out of the entrance. On the side of the work, the u-knife/衮同' or inter-mechanism' is provided in the state of the π-age 僚 entrance or the 搬 搬, when the roller is transported, the rolling distance of the roller transport path is ρ In the case of the above-mentioned configuration, it is possible to reduce the transportation performance (the speed of the mosquitoes), and the second exhaust mechanism that performs the exhaust in the open state in the exhaust mechanism iff. This second row two is preferably shared with the f-discharging machine for vacuum suction of the exhaust port provided in the chamber. (Effects of the Invention) The pressure-reducing and drying device of the ΐϊ = = can carry out the transfer of the substrate to be processed safely and smoothly, and the transfer of the coating film of the substrate Traces are minimized. BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings. Processing li display === 彳 edge age cloth, 雠, development and ship, etc. - a series of processing. The process is performed by an external exposure device 12 disposed adjacent to the system. * This coating development processing system 10 has a horizontally long processing station at the center = 5) 3 long-side direction (X (four) (four) domain configuration (four) station (C / S) 14 and boundary E dish station (C / S) 14 ' for the system 1 〇 g 盒 搬 璋 璋 璋 璋 璋 璋 璋 璋 璋 璋 璋 璋 璋 i i i i i i i i i i i i i i i i i i i i i i i i i i i i i i i i i i i i i i i i i Each of the above [ Ϊ ίίί ^ ^ 〇 22 ^ G ^ ^ can operate on the X, Y, Z, 04 axes, and the adjacent processing station (P/S) 16 side and the substrate g are delivered. Processing station (P /S)16, which is parallel and reversed in the longitudinal direction of the horizontal system (χ direction) = line A, B, and each processing unit is sequentially arranged in a processing flow or step. More §, from the box station (C/S) 14 side to the interface station (I/F) 18 side of the upstream part 200842525 Ϊ Ϊ A: along the first advection transport channel 34, from the upstream, in order to match the ί IN PASS) 24, cleaning processing unit 26, first heat treatment unit 28, coating processing unit 30, and second heat treatment unit 32. Delivery of "more" λ, inpass 24 box (10)) Machine=ίίί理^^' to vote for both (four) industry time 1 advection transporting the inner portion 26, along the first advection transport passage 34 from the upper __ unit (Ε-gas 6 and scrubbing cleaning unit (R) 38苐1 heat treatment portion 28, from the upstream side in order Ground setting: fresh thin portion 3G 'From the top, the resist coating early element (COT) 44 and the vacuum drying unit (VD 埶, 32 乂 from the upstream side, sequentially set the pre-drying unit _ — Bake) 48 and cold (cold) (COL) 5〇. Located at the end of the adjacent side channel 34 on the downstream side of the second heat treatment unit 32, a passing unit (genus) 52 is provided. The substrate G sent by the second pass is passed through the unit. (PASS) 52 is delivered on the other hand, from the interface station (I/F) 18 side to the cassette station (c/s) 14 side 1 along the second advection transport path 64 from the upstream side sequentially into a column A phantom (DEV) 54, a post-drying unit (P〇ST_BAKE) 56, a cooling unit 〇, an inspection unit (AP) 60, and a carry-out unit (0UT-pASS) 62. Here, the rear supply unit 〇S 2 The BAKE 56 and the cooling unit (COL) 58 constitute the third heat treatment unit 66. The carry-out = tl (〇 UTPASS) 62 is processed from the second advection passage 64.

逐片地接取,並遞送給匣盒站(c/s)14之運送機構22。畢土板G η。在兩處理線A、B之間,設有輔助運送空間68 美 Ϊ”水钱置之穿梭機構7〇,利用未圖示之驅動i構, 了於處理線方向(X方向)雙方向移動。 界面站(I/F)l8,具有實施上述第i及第2平流運 64或鄰接之曝絲置I2絲板Gf牧交流的運送裝置7 、 =裝置72之周圍配置有旋轉台座_74及周邊装置%。 a 坐_74,為將基板G於水平面内旋轉之台座,用於在鱼曝光; 200842525 置12之間遞送時轉換長方形基板〇之方向。 =字連曝接光器(TIT™ 圖2之中,顯示此塗布顯影處理系統之中,對於丨 =有步驟的處理轉。首先,在g — (c/s)14,運送機^從 :座20上任-中取出i片基板G,將取出的基板g搬入 处理站(P/S)16之處理線A側之搬入單元(卿八呵叫步驟叫。基 板G從搬入單元(inPASS)24被移載或投入第丨平流運送通道34 上0The pieces are taken one by one and delivered to the transport mechanism 22 of the cassette station (c/s) 14. Bibi plate G η. Between the two processing lines A and B, there is an auxiliary transport space 68. The shuttle mechanism 7 is operated in the direction of the processing line (X direction) by a driving mechanism (not shown). The interface station (I/F) 18 has a transport device 7 for performing the above-described i-th and second flat flow 64 or an adjacent wire-shielded I2 wire plate Gf, and a rotating pedestal _74 and a periphery are disposed around the device 72. Device %. a Sit _74, a pedestal that rotates the substrate G in the horizontal plane for the fish exposure; 200842525 is transferred between 12 and 12 to convert the direction of the rectangular substrate 。. = Word Exposure Receiver (TITTM diagram) Among them, in the coating and developing treatment system, it is shown that the processing of the 丨 = step is reversed. First, at g - (c / s) 14, the transporter removes the i-substrate G from the top of the holder 20, The taken-out substrate g is carried into the loading unit on the processing line A side of the processing station (P/S) 16. (The procedure is called </ br>. The substrate G is transferred from the loading unit (inPASS) 24 or is put into the second advection conveying path 34. On 0

被投入第1平流運送通道34之基板G,最初在清洗處理部 26,藉由準分子UV照射單元(E—UV)36及擦磨清洗單元 (SCR)38,依序實施紫外線清洗處理及擦磨清洗處理(步驟S2、 S3)。擦磨清,單元(SCR)38,對於在平流運送通道34上水平移動 之基板G,藉由施以刷洗或吹風清洗,從基板表面除去粒子狀之 污垢L之後,施以沖洗處理,最後空氣刀等使基板G乾燥。擦磨 清洗單元(SCR)38中,若一連串之清洗處理結束,則基板〇直接 從第1平流運送通道34下來,通過第1熱處理部28。 於第1熱處理部28中,基板G,最初在黏附單元(AD)40被施 以使用蒸氣狀HMDS之黏附處理,將被處理面疏水化(步驟S4)。 於此黏附處理結束後’基板G以冷卻單元(COL)42冷卻至既定之 基板溫度(步驟S5)。此後,基板G從第1平流運送通道34下來, 被搬入塗布處理部30。 於塗布處理部30,基板G最初於抗蝕劑塗布單元(COT)44維 持平流地利用使用狹縫喷嘴之非旋轉法,在基板頂面(被處理面) 塗布抗蝕劑液,隨後立即於下游侧鄰之減壓乾燥單元(VD)46,接 受利用減壓之常溫乾燥處理(步驟S6)。 離開塗布處理部30之基板G,從第1平流運送通道34下來, 通過第2熱處理部32。於第2熱處理部32,基板G,最初在預烘 單元(PRE-BAKE)48接受作為抗蝕劑塗布後之熱處理或曝光前之 200842525 接i到終點之通過單元(_被 74m^ 90^ 職置之周邊曝光裝置㈣,於此,接受 =;===)抗嫌顯影時一 夕少德於Ϊ 1_2 ’對於基板G上之抗姓劑曝光既定電路圖荦。 =#光^板G,雜曝光裝置12返回界面= ()18(AS9),百先,被搬入周邊裝置冗之印字哭 ί基板上之既定部位記錄既定f訊_ 一。舞 ί的ΐ平猎Λ ΐ裝/72被搬入設於處理站(p/s)16之處理線b 側的苐2千〜運达通道64的顯影單元(DEV)54的起點。 之下=^、,其次在第2平流運送通道64上往處理線B ΪΓ: Ϊ?。在农初的顯影單元陶54,基板〇在以平流運 二,以=、沖洗、乾燥之—連串顯影處理(步驟川) 於第21^HV)54 ’結束—連串㈣處理之基板G,以承載 埶,’依序通過第3熱處理部心 4熱處理部66,基板G最初在後烘單元 U^A™)56接受作為顯影處理後熱處理之後烘(步驟S12)。夢 留在基板G上之蝴膜的顯影液或= ^Ϊ、劑圖案對於基板之密合性。其次,基板〇於冷卻單 ,部至既定基板溫度(步驟S13)。於檢查單元(ΑΡ)6〇, 厚檢ίΐ(步賴圖案,進行非接觸之線寬檢查或膜質、膜 s)62從第2平流運送通道64接取所有步 驟之處理已結束的基板G,遞送給g盒站(c/s)14之運送機構Μ。 200842525 於匣盒站(C/S)14側,運送機構22將從搬出單元(quT PASS)62接 取之處理完畢的基板G,收容在任一(通常為原來的)匣盒c(步驟 S1) 〇 於此塗布顯影處理系統10,可將本發明適用於塗布處理部3〇 内之減壓乾燥單元(VD)46。以下,依照圖3〜圖u,對於本發明 較佳實施形態中之塗布處理部内30之減壓乾燥單元(VD)46 ^構 成及作用詳加說明。 圖3顯示此實施形態之中,塗布處理部%之全體構成平面 圖、。圖4〜圖6顯示一實施例的減壓乾燥單元(VD)46之構成,圖 4為其平面圖、圖5及圖6為其剖面圖。 …s :抗姓劑塗布單元(COT)44,具有:構成第1平流運 达通道34(圖1)-部分或一區間之浮起式台 座80上浮在空中的練〇於台座長邊方向(χ * 口 =構82,以及騎在台座8G上我之基板G的顧供ς 嘴Μ,以及在塗布處理空财新抗侧喷嘴糾 f台座80頂面’設有將既定氣體(例如空於 :數軋體喷射口 88,藉由此等之氣體噴射口 )“【以 力,使基板G從纟座頂φ浮細定高度。㈣之讀之£ 基板運送機構82,具備:一對引導軌道9〇a、龍 口座80而於X方向延伸;滑動機構%,沿著此 ^寺者 遍而可來回移動;吸附墊等基板保持構件(未示、、A⑽ 上能將基板Θ之兩侧端部可離人地保姓 。、在口座80 y直進移動機構(未圖示)使‘機構92 動,使得基板(3在台座80上浮起運送。 k方向(X方向)私 抗蝕劑喷嘴84,為於台座8〇之上 垂直之水平方向(Y方向)_延伸 ^妨向(X方向) 置,對於通過其正τ方之基 型喷嘴’能在既定塗布位 劑液成帶狀噴吐。又,抗银劑喷嘴4 =狹縫狀噴吐口將抗蝕 ^冑84 ’能與支持此噴嘴之噴嘴支 200842525 ^冓件94 -體地於χ方向 . 布位置與喷嘴更新部86之間移動。 万⑽卜、在上述塗 且借喷H新部86 ’於台座8G上方既定位置由支柱構件96伴持, 具備·預塗(priming)處理部呢,田队狀&amp;、么保符 於抗餘劑喷嘴84喷吐抗韻..+嘴二3的前準備而對 嘴84之抗_噴吐口乾燥,t防止抗餘劑喷 清洗機構102 ’用以將附著在抗餘齊喷以及喷嘴 的抗飿劑除去。 辣減Μ為84之心侧喷吐口附近 88所嗔射咖聞之ί致ί ί 射口 _f 4 ’滑動機構%於保持基板之狀態,|:=^元 ,辦側於運送方向(χ方向)移動,於基板g通過抗飯=二 ίΓ,朝著基板G之頂面將抗截劑液以帶狀 Ϊ液之Ϊ前端往後端以絨毯狀布設之方式將抗敍 ,^賴軸為 城塗布有祕撇之基板G,之德Α ^述^^^送到台⑽上’越過台座⑽之後端而移載 滾子運达通道1〇4,於此解除滑動機構 = 送通道1G4之基板G,之後如躺述,錄子運送通|^ 滾子運达並移動,搬入後段之減壓乾燥單元(VD)46。 ㈣塗布處理完畢之基板G如上述方式送域壓乾料S(VD)46 ^,滑動機構92為了接取下一基板G,*返回台座⑼前端 。又,抗钮劑喷嘴84,若結束i次或多次塗布處理^ ,布位置(抗鋪液喷吐位置)往喷嘴更新部86雜,並於上 貝知噴鳴清洗或預塗處理等更新或前準備後,返回塗布位置。处 如圖3所示,抗蝕劑塗布單元(COT)44在台座8〇之延^ 游側),布設有構成第1平流運送通道34(圖1}一部分或一區間之 13 200842525 滾子運送通道104。此滾子運送通道i〇4,在減壓乾燥單元(vd)46 之腔室106之中及之外(前後)連續布設。 更詳言之,此減壓乾燥單元(VD)46周圍的滾子運送通道 104 ’由以下所構成:搬入侧滾子運送通道104a,布設於腔室 之運送上游側,亦即搬入侧;内部滾子運送通道1〇4b,布設於腔 室106内;搬出側滾子運送通道1〇4c,布設於腔室1〇6之運送下 游侧,亦即,搬出側。 各部之滾子運送通道104a、l〇4b、104c,係使在運送方向(X 方向)各隔著適當間隔配置之多根滾子1〇8a、1〇8b、1〇8c藉由各獨 立或共通之運送驅動部而旋轉,而使基板G在滾子運送之運送方 向(X方向)運送。在此,搬入侧滾子運送通道1〇4a,功能為接取從 抗飿劑塗布單元(⑺τ)44之纟座8〇於料運狀延長㈣的基板 G以滚子運送送入減壓乾燥單元(VD)46之腔室1〇6内。内部滾 子運送通道104b,功能為,將從搬入側滾子運送通道1〇4a以滾子 運送送過來的基板G以同速度之滾子運送,送入腔室1〇6内, 時將在腔室106内減壓乾燥處理完畢之基板G以滾子運送送出 腔室106之外(後段)。搬出侧滾子運送通道1〇如,功能為,將從 腔室106内之内部滾子運送通道1〇4b送出之處理完畢的基板G以 同速度之滾子運送接取,送到後段處理部(第2熱處理部32)。 、如圖3〜圖6所示,減壓乾燥單元(VD)46之腔室1〇6,形 為較扁平的直方體’其中,具有能將基水平收容的空間。於 此腔室106之運送方向(X方向),彼此相向的一對(上游側及下 側)之腔室侧壁,各設有基板G能以平流恰夠通過之大小的 縫狀搬入口 110及搬出口 112。再者,用於開閉此等搬入口 ιι〇 搬出口 112之閘機構114、116安裝於腔室1〇6之外壁。 之頂面部或上蓋118,在維修時可取下。 工主 各賴構114、116圖示雖省略,但具傷··蓋體(間體) 狹縫狀之搬出人口⑽、112)氣密地閉塞;第丨缸筒 為 與搬出入n(uG、m)水平對向之财往驗扣及更低的== 14 200842525 ΐ位升降移動;第2红筒,使蓋體在相對於搬出入口⑽、 2)為氣如、合之水平往動位置及離開分離之水平回動位置 水平移動。 於腔室106 $,構成内部滾子運送通道1〇北之滾子1〇8b,以 =於搬出人Π⑽、m)之高度位置,在運送方向(χ方向)隔著 適虽間隔配置成-列’-部分或全部之滾子腿與設於腔室1〇6 之外的馬料鋪轉源12Q經由適當的傳動機構連接。各滾子 108b,、由外徑相同的圓筒部或圓柱部而與基板〇之背面接觸之棒 體形式構成其兩端部被設置在腔室廳之左右兩側壁或其附近 的軸承(未圖示)以可旋轉方式支持著。傳動機構之旋轉軸122貫通 之腔室106之侧壁部分,以密封構件124密封。 構成搬入侧滾子運送通道1〇4a之滾子1〇8a,圖示亦省略,1 兩端部由固定在框架等的軸承以可旋轉方式支持著,藉由和上述 内部滾通道1_狀旋_祕12G共通或其他的旋轉驅 動源而旋,驅動。構成搬出側滾子運送通道1〇4c之1〇8c亦同。 此減壓乾燥單元(VD)46,具有用於在腔室1〇6内使基板g以 大致水平地支持而上升下降的升降機構126。此升降機構126,具 備:多數根(較佳為50根以上)之升降銷128,在腔室1〇6内以既 定的配置圖案(例如矩陣狀)離散的配置;多數水平棒或水平板的銷 基部130 ’將此等升降銷128以各既定之組或群,在較内部滾子運 送通道104b更低的位置支持;升降驅動源例如缸筒132,為使各 銷基部130升降移動,配置在腔室1〇6之外(下)。 更詳言之,於相鄰接的2根滾子i〇8b、108b的間隙,與滾子 108b平行(Y方向)地,多數根(較佳為7根以上)升降銷128以固定 間隔鉛直豎立配置成一列,該升降銷列在運送方向方向)隔著適 當間隔設有多數列(較佳為8列以上),使各銷基部13〇支持丨組或 £數組(圖示之例為2組)的升降銷列。然後,腔室106之底壁經由 密封構件134而氣密地貫通,且藉由可升降移動之升降驅動軸 136,將腔室内側之各銷基部13〇與腔室外側之各對應缸筒132連 15 200842525 接。 及圖6所示銷先端在較滾子運送通道腿為高之 之間升降移動。 «王動(上升)位置 各升降銷I28,具有:銷本體咖,下端部 n=8b ’二?本體ma之上端起触直·^圖 銷尖端部隱,較_ PEEK 4 ed 圓柱狀频,_在縣體128a之上端彻日所構成之 在於在ΐ起128之銷尖端部咖,其特徵 •口座上之基板I載/告卩載之以往一般的移載用升降 ί板機;人接取處理前基板咖 座抬起亚遞送給運送機器人之升降銷,其銷尖 =。亦即,相對於以往一般移載用升降銷之鎖尖端部直徑⑹ ί(;ΐΤ广上,此實施形態中的升降銷128之銷尖端部腸直 tit η: Γ(若考慮強度,最好的餘為G.4,腿), 而且刚^囫形化為既定尺値(例如R=〇.2〜〇 3_)。 排裔月底壁I 1部位或多處形成有排氣口 138。於此等 氣管140連接著真空排氣衷置142。各真空排氣 將腔室106内從錢壓狀態進行真空抽吸而維 f置之真空泵浦。又,為使此等多數真空排氣 連接管(未ΐΐΓ連ΐ。的不一致平均化,各排氣管140彼此可以用 腔室106内的兩端部’亦即接近搬入口 11〇及搬出口 112且 ti 更低之位置’設有於γ方向延伸之圓筒狀氮 乳噴出σρ 144。此錢氣喷出部144,例如由將金屬粉末燒結而成 16 200842525 管146(® 4)而連接於氮氣供給源 (未圖不)減£乾秌處理…束後,於維持腔室1〇6密閉之狀熊 壓狀態返回大氣壓狀態時,此等氮氣喷出部144從管之全g面 喷出氮氣。 ° ° 其次,說明此貫施形態中減壓乾燥單元(乂〇)46之作用。 如上所述,於上游側鄰之抗蝕劑塗布單元(c〇T)44塗布了抗 韻劑液之紐G,辭流從纟座8〇上之浮域騎道移_搬入 側滾子運送通道馳。之後,如圖5所示,基板G以滾子運送在 搬☆側滚子運送通道l〇4a上移動,最終從搬入口 11〇進入減壓乾 燥單元(VD)46之腔室1〇6之中。此時,閘機構114預先開啟^入 口 110。 内部滾子運送通道104b亦藉由旋轉驅動源120之旋轉驅動, 配^搬入側滾子運送通道10如之滾子運送動作及時點,實施相同 運送速度之滾子運送動作,如圖5所示,從搬入口 11〇進入之基 板G以滾子運送進入到腔室1〇6後方。此時,升降機構126,使 所有的升降銷128其各銷前端在較内部滾子運送通道之運送 面更低的回動(下降)位置先待機。然後,基板G若到達腔室1〇6 ,大致中心之既定位置,則停止内部滚子運送通道1〇牝之滾子運 送動作。亦可與此同時或緊接在前停止搬入側滚子運送通道1〇4a 之滾子運送動作。 、,又,如上所述,應接受減壓乾燥處理之基板G從前段或上游 側鄰^抗蝕劑塗布單元(c〇T)44搬入腔室1〇6時,在此同時(或緊 ,在前),+如圖5所示,將剛於腔室1〇6内接受減壓乾燥處理之先 行基板$,由内部滾子運送通道1〇4b及搬出侧滾子運送通道丨〇4c 上之連續等速度之滾子運送,從搬出口 112搬出到腔室之外 並維持此狀態以平流地運送到後段或下游側鄰之第2熱處理部 32(圖 1) 〇 如亡所述’在抗蝕劑塗布單元(COT)44塗布了抗蝕劑液的基 板G ’藉由搬入側滾子運送通道1〇如及内部滚子運送通道1〇牝 17 200842525 上之連績的滚子運送,被搬入減壓乾燥單元(VD)46之腔室106。 緊接在後,閘機構114、116作動,並且將至此為止為開啟的搬入 口 110及搬出口 112各自閉塞,亦將腔室106密閉。 接著,升降機構126使升降缸筒132往動,所有的銷基部13〇 :起上升既定動程分量,使在腔室1〇6内所有升降銷128之銷前 端到,超過内部滚子運送通道104b之運送面的既定高度位置為 士。藉由此升降機構126之往動(上升)動作,如圖6所示,基板〇 ^内^滾子運送通道l〇4b維持水平姿勢移載到升降銷128之銷前 端’並維持此狀態被抬起到内部滾子運送通道1〇4b之上方。 另一方面,腔室106密閉後緊接著真空排氣裝置142作動, 將腔室106内真空排氣至既定之真空度為止。如此一來,腔室1〇6 内+,基板G處理於減壓氣氛之中,藉此能使基板^上之抗蝕劑液 膜於^下以良好效率適度地乾燥。此減壓乾燥處理期間,基板 G由多數根升降銷128以大致水平地支持,而且升降銷128之非 ^且前端成圓形的銷尖端部128b為極小面積且無接觸,因此即 =熱影響而在基板G上之抗侧膜畴#基板接觸部之痕跡, f轉印痕跡也非f小而且是在實用(製品)上可忽視的程度。又 降銷128之銷尖端部i28b由樹脂所構成,銷本體施為中空管 亦能進=步減少熱傳導,對於將轉印痕跡減少到最小限度為有利。 」上述減壓乾煉處理經過一定時間則結束,真空排氣裝置 =排氣動作。取代此,氮氣喷出部144使氮氣流入腔室^^内。 。後,至内壓力上升到大氣壓後,閘機構114、116 入:no及搬出口 112。在此前後,升降機構126使升降缸 j,使所有的舰部13()-起以既定練分量下降,以使得 有升降銷|28之銷前端成為較内部滾子運送通道獅之運 ^既定高度位置為止。藉由此升降機構126之_(下降)動作, ίΪ ^斜姿勢,從升降銷128之_端移載到内部滾子運送 然後,緊接著,於内部滾子運送通道l〇4b及搬出側滾子運送 18 200842525 ϊΐ 運ΐίϊ,剛接受減壓處理之該基板G從搬 达被搬出,並維持此狀態以平流地送到後段 1苐2處理部32(圖”。於此處理完畢的基板g的搬出動 柃,如圖5所示,來自於抗蝕劑塗布單元(c〇T)44之後續^ G’、,在搬人懈子運送通道谢&amp;及内部滾子運送通道刚j 之連績滾子運送,從搬入口 11〇搬入腔室1〇6内即可。 之美此Ϊ壓乾燥單元(VD)46,應接受減壓乾燥處理 之基板G以滾子運达搬入腔室1〇6之中,並且於腔室1〇6 ,乾燥處理完畢之基板G以滾子運送搬出到腔室1〇6之外,因此, 腔室,進行基板〇之搬出人時’不需要使用運送臂之運 破像地彎曲而發生裝載/卸載時位置偏離 no及搬出口 112實施基板G之搬出入,所以,不 3 =嘲以上的腔室106的上蓋118(上下)的操作,沒有ί的 ^動乂成之起塵的問題,能確保對於作業員之安全性。 登乾^處理中,多數根升降銷128將基板G維持水平姿勢= 運达通道104b往上方抬起而以極細的銷尖端部咖,因义 i最^板G上之抗蝕劑膜附著之基板接觸部之轉印痕跡減少 關於圖3〜圖6之上述減壓乾燥單元(VD)46構成及 實施例,能在本發明技術思想的範圍内作各種變形ί 圖:〜® 1),顯示第2實施例之減壓乾燥單元(VD)46之構 實Γ(二3〜圖6)具有實f相同構成或功能之 上刀“以相冋付號。又,圖7及圖8顯示腔室1〇6内之右 圖==。’相對於中心線N成線性對稱的左半部(上游側)之構成 此第2實施例中,第丨特徵為内部滾子運送通道1〇牝 ’、即’上述第1實施例之中,内部滾子運送通道1〇4b之滾子_ 19 200842525 =柱動H身係承載基板G而滾子運送之 如果對應於,鄉 實施例,如iS!7w 好運的不獅。因此,於此第2 筒部1 SY的數個部位使用環狀的粗徑 =不=地以直線的姿勢安定圓滑地旋轉二 各滚子108d之兩&amp;部以固定位置之轴承15〇予以支 向變位之軸承152支持,並使; 軸承152之而度位置可調整。 更詳細而言,使在滾子108d之中心 延伸之長尺絲部m簡定高度持地配置, 士隔=,_定多個反U字型垂直支持構件156於,==4 子型垂直支持構件156之内侧與於運送方向(χ 平支持構件158贿直方向以可_触合,並於 件158安裝1個或多個(圖示之例為2個)之中心軸承i52。 如圖9所示,水平支持構件158由角筒所構成,於此水平支 持構件15S頂面固著之區塊16〇,形成有與安裝在反叫型垂直 支持構件156之頂面的高度調整用螺检162螺合之螺孔(未圖 藉由轉動螺栓162,能使水平支持構件158及中心軸承152高度位 置可變地調整。然後,藉由將安裝在反U字型垂直支持構件 之一側面的鎖(固定)用螺栓164轉緊,而將區塊16〇從橫向推壓, 能將水平支持構件158固定於垂直支持構件I%。 又,將女裝有2個之中心軸承152之1根水平支持構件I% 以1個反U子型垂直支持構件156支持之構成係為一例,也可例 如為將如圖1〇所示安裝有3個中心轴承152之1根水平支梏杜 158以2個反U字型垂直支持構件156支持之構成。 ' 又,如圖7及圖9所示,基部154與在腔室1〇6之排氣口 138 20 200842525 之上以被覆基部154兩側之方式水平設置 166結合而絲。兩職赚雜 反 之底面(浮起)安裝。 丨⑽雕開腔至106 士口圖7所示,於内部滾子運送通道職之 似 在較其中之-_定軸承⑼更為外108d 接觸磁式傘齒輪(bevel gear),而連接起塵^非 與安裝在腔請之外的,_74,動^ 178及驅動滑輪組180連接。 铷、、且176、傳达▼ 又,如圖7所示,於升降機構126,各 麵平行(Υ方向)延伸之水平支持棒脱支持,m以= 支持棒182以和此等垂直而在χ方向延 ; 他2施例的第2特徵’係内部滚子運送通道104b與外部 t =Λ讎子運賴道1G4a、购糾相連㈣子伽、 188 ’,又於拣^出入口 110、112及/或閘機構114、ιΐ6 〇 j圖7及圖8所示’例如腔室觸之搬出側,在搬出 =i = 於γ方向隔著適#間隔’設有配置著多個滾筒 式滾子ϋ之滾動支持部190。又,閘機構116之上部,安裝了於 γ方向隔著適當間隔配置了多個滾筒式滾子188之滾動支持部 192。搬出口 112之滾子186,一直位在滾子運送通道1〇4&amp;之高度。 閘機,116之滾子188,當閘機構116退避到底面而開啟搬出口 112%,位在滾子運送通道丨〇4之高度位置。又,於圖示之例,閘 機構116之滚子188僅設丨列,但是也可為滾動支持部192在X 方向延伸而設2列以上。 如圖11所示,於滚動支持部190、192,各滾筒式滾子186, 188僅在與基板〇之背面接觸的頂部附近露出於窗194上,能使 即使因為旋轉動作起塵,塵埃亦儘量地不散播到周圍。 一般而言,滾子運送通道的滾動間隔(滾動間距)愈小,則基板 21 200842525 之滚子運送齡蚊且高速地進行。但是 ί ί;= 能受到速率限制。此點,於此第2實施例 ’因此能使滾子運送通道刚之滾動間距iii 區間^遍^可能縮小,能達到運祕能(安雜、高速化)之提升。 此弟2貫施例之第3特徵為排氣機構。如圖8所示,於腔室 不僅經由排氣管140而連接真空排氣裝置142, 刀支排氣管196而連接排氣風扇(或排氣管路)198。於排氣The substrate G that has been introduced into the first advection transport path 34 is initially subjected to ultraviolet cleaning treatment and rubbing by the excimer UV irradiation unit (E-UV) 36 and the scrub cleaning unit (SCR) 38 in the cleaning processing unit 26. Grinding cleaning process (steps S2, S3). A scrubbing unit (SCR) 38, for removing the particulate-like dirt L from the surface of the substrate by applying a brush or a blow cleaning to the substrate G horizontally moving on the advection conveying path 34, and then applying a rinsing treatment, and finally air The blade or the like dries the substrate G. In the scrubbing cleaning unit (SCR) 38, when a series of cleaning processes are completed, the substrate 〇 directly passes down from the first advancing transport path 34 and passes through the first heat treatment unit 28. In the first heat treatment unit 28, the substrate G is first adhered to the adhesion unit (AD) 40 by vapor HMDS, and the surface to be treated is hydrophobized (step S4). After the end of the adhesion process, the substrate G is cooled by a cooling unit (COL) 42 to a predetermined substrate temperature (step S5). Thereafter, the substrate G comes down from the first advection transport path 34 and is carried into the coating processing unit 30. In the coating treatment unit 30, the substrate G is first applied to the resist application unit (COT) 44 to maintain a smooth flow, and a resist liquid is applied to the top surface (processed surface) of the substrate by a non-rotation method using a slit nozzle, and then immediately The reduced-pressure drying unit (VD) 46 adjacent to the downstream side receives the room temperature drying treatment by the reduced pressure (step S6). The substrate G that has left the coating processing unit 30 passes through the first advection conveying passage 34 and passes through the second heat treatment unit 32. In the second heat treatment unit 32, the substrate G is first received in the pre-baking unit (PRE-BAKE) 48 as a heat treatment after the resist coating or before the exposure of the 200842525 to the end of the passage unit (_ by 74m^90^ The peripheral exposure device (4), here, accepts =; ===) anti-scenario development when the singularity is less than Ϊ 1_2 'for the anti-surname agent exposure on the substrate G. = #光^板G, miscellaneous exposure device 12 return interface = () 18 (AS9), one hundred first, was moved into the peripheral device redundant printing cry ί The predetermined part of the substrate recorded the scheduled f message _ one. The Λ Λ Λ Λ 72 72 72 72 72 72 72 72 72 72 72 72 72 72 72 72 72 72 72 72 72 72 72 72 72 72 72 72 72 72 72 72 72 72 72 72 72 72 72 72 72 72 72 72 72 72 72 Below =^, and secondly on the second advection transport path 64 to the processing line B ΪΓ: Ϊ?. At the beginning of the agricultural development unit, the substrate G is placed in a flat flow, and is subjected to a series of development treatments (steps) at the end of the 21st HV) 54'-series (four) processing of the substrate G. The heat treatment portion 66 is sequentially passed through the third heat treatment portion 4, and the substrate G is initially subjected to post-development heat treatment after the post-baking unit U^ATM 56 (step S12). Dreaming of the adhesion of the developer or the pattern of the butterfly film remaining on the substrate G to the substrate. Next, the substrate is cooled to a predetermined substrate temperature (step S13). In the inspection unit (ΑΡ) 6〇, the thickness inspection (step pattern, non-contact line width inspection or film quality, film s) 62 is taken from the second advection transport channel 64 to the substrate G where all the steps have been processed, Delivered to the shipping facility of the g-box station (c/s) 14. 200842525 On the side of the box (C/S) 14, the transport mechanism 22 stores the processed substrate G picked up from the carry-out unit (quT PASS) 62 in any (usually the original) cassette c (step S1). The coating and developing system 10 can be applied to the vacuum drying unit (VD) 46 in the coating processing unit 3〇. Hereinafter, the constitution and function of the reduced-pressure drying unit (VD) 46 in the coating processing unit 30 in the preferred embodiment of the present invention will be described in detail with reference to Figs. 3 to 5 . Fig. 3 is a plan view showing the entire configuration of the coating treatment unit % in the embodiment. 4 to 6 show the configuration of a reduced-pressure drying unit (VD) 46 according to an embodiment, and Fig. 4 is a plan view thereof, and Figs. 5 and 6 are cross-sectional views thereof. ...s: anti-surname application unit (COT) 44 having: a floating pedestal 80 constituting the first advection transport passage 34 (Fig. 1) - part or a section floats in the air and is trained in the longitudinal direction of the pedestal ( χ * mouth = structure 82, and riding on the pedestal 8G on my substrate G's ς mouth 以及, and in the coating processing empty new anti-side nozzle correction y pedestal 80 top surface 'with a given gas (such as empty : a plurality of rolling body injection ports 88, by means of such gas injection ports) "[The force is used to make the substrate G float from the crucible top φ to a fixed height. (4) Read the substrate carrier mechanism 82, with: a pair of guides The track 9〇a, the dragon mouth seat 80 and extending in the X direction; the sliding mechanism %, can move back and forth along the temple; the substrate holding member such as the adsorption pad (not shown, A(10) can be used on both sides of the substrate The end can be separated from the person's name. In the mouth of the 80-y straight moving mechanism (not shown), the mechanism 92 is moved, so that the substrate (3 floats on the pedestal 80. k-direction (X-direction) private resist nozzle 84, for the horizontal direction (Y direction) _ extension of the pedestal 8 〇 (X direction), for the base type spray through the positive τ side 'It can be sprayed in a strip at a given coating liquid. Also, the anti-silver agent nozzle 4 = slit-shaped spout can make the resist 胄 84 ' with the nozzle branch supporting the nozzle 200842525 ^ 冓 94 - body Χdirection. The cloth position moves between the cloth position and the nozzle update unit 86. In the above-mentioned coating, the H new portion 86' is held by the pillar member 96 at a predetermined position above the pedestal 8G, and is provided with priming processing. The Ministry, the field team &amp;, the guarantee is in the anti-residue nozzle 84 spit anti-rhythm.. + mouth 2 3 preparation and the mouth 84 anti-spray mouth dry, t prevent anti-residue spray cleaning mechanism 102 'Used to remove the anti-caries agent attached to the anti-smooth spray and the nozzle. Spicy reduction is 84 near the heart side of the spit. 88 shots are scented ί ί 射 _f 4 'sliding mechanism% Keep the state of the substrate, |:=^ yuan, move the side in the transport direction (χ direction), pass the anti-cutting agent liquid to the top surface of the substrate G in the strip g ΪThe front end and the back end are woven in a velvet-like manner, and the razor axis is the substrate G coated with the secret. The Α 述 ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ At the rear end of the seat (10), the transfer roller is transported to the channel 1〇4, and the slide mechanism is released. The substrate G of the feed channel 1G4 is released, and then, as described, the recorder transports the pass|^ the roller arrives and moves, and moves into the rear stage. The vacuum drying unit (VD) 46. (4) The substrate G after the coating process is as described above, the transfer dry material S (VD) 46 ^, and the sliding mechanism 92 returns to the front end of the pedestal (9) in order to pick up the next substrate G. When the button nozzle 84 is finished, the cloth position (anti-spray discharge position) is mixed with the nozzle refreshing portion 86, and is updated or prepared in advance. After that, return to the coating position. As shown in FIG. 3, a resist coating unit (COT) 44 is disposed on the extending side of the pedestal 8 ,, and is provided with a 13 or a section of the first advection conveying passage 34 (Fig. 1}. The passage 104. The roller transport path i〇4 is continuously disposed in and out of the chamber 106 of the reduced-pressure drying unit (vd) 46. More specifically, the reduced-pressure drying unit (VD) 46 The surrounding roller transport path 104' is constituted by the loading side roller transport path 104a, which is disposed on the transport upstream side of the chamber, that is, the carry-in side, and the internal roller transport path 1〇4b, which is disposed in the chamber 106. The side roller transport passages 1〇4c are carried out, and are disposed on the downstream side of the transport of the chambers 1〇6, that is, the carry-out side. The roller transport passages 104a, 104b, 104c of the respective sections are in the transport direction (X In the direction), the plurality of rollers 1〇8a, 1〇8b, and 1〇8c which are disposed at appropriate intervals are rotated by the respective independent or common transport driving portions, and the substrate G is transported in the direction in which the rollers are transported (X In this case, the side roller transport path 1〇4a is carried in, and the function is to take the anti-caries agent coating unit ((7)τ) 44 The substrate G of the crucible 8 is transported by a roller to the chamber 1〇6 of the decompression drying unit (VD) 46. The internal roller transport passage 104b functions as a roll from the loading side. The sub-transport channel 1〇4a is transported by the rollers G and transported by the rollers at the same speed and fed into the chamber 1〇6, and the substrate G which is dried and dried in the chamber 106 is used as a roller. The delivery side of the delivery chamber 106 (rear stage). The carry-out side roller transport path 1 has, for example, functions to transport the processed substrate G from the internal roller transport path 1〇4b in the chamber 106 at the same speed. The roller is transported and sent to the rear stage processing unit (second heat treatment unit 32). As shown in Fig. 3 to Fig. 6, the chamber 1〇6 of the reduced pressure drying unit (VD) 46 is formed into a flattened rectangular shape. The body ' has a space in which the base can be accommodated. In the transport direction (X direction) of the chamber 106, a pair of (upstream side and lower side) chamber side walls facing each other are provided with a substrate G The slit-shaped inlet 110 and the outlet 112 are sized to pass through the advection. Further, the opening and closing of the inlet ι is carried out. The gate mechanisms 114 and 116 of the 12 are mounted on the outer wall of the chamber 1〇6. The top surface portion or the upper cover 118 can be removed during maintenance. The illustrations of the respective structures 114 and 116 are omitted, but the cover is covered. (Intermediate) The slit-shaped moving out population (10), 112) is hermetically closed; the third cylinder is checked and deducted from the level of n (uG, m) moving out and lower == 14 200842525 ΐ The second red cylinder moves the lid horizontally at a horizontally moving position relative to the carry-out inlets (10), 2), and at a horizontal return position away from the separation. In the chamber 106$, the rollers 1〇8b constituting the inner roller transport passage 1 are arranged at a height position of the carry-out person (10) and m), and are arranged at intervals in the transport direction (χ direction). The column '- part or all of the roller legs are connected to the horse feed source 12Q provided outside the chamber 1〇6 via a suitable transmission mechanism. Each of the rollers 108b has a rod body that is in contact with the back surface of the substrate cymbal by a cylindrical portion or a cylindrical portion having the same outer diameter, and constitutes a bearing whose both end portions are provided at or near the left and right side walls of the chamber hall (not The illustration) is supported in a rotatable manner. The side wall portion of the chamber 106 through which the rotating shaft 122 of the transmission mechanism passes is sealed by the sealing member 124. The rollers 1〇8a constituting the loading side roller conveying path 1〇4a are also omitted from the drawing, and the both end portions are rotatably supported by bearings fixed to the frame or the like, and the inner rolling passage 1_ Spin _ secret 12G common or other rotary drive source and rotate, drive. The same applies to 1〇8c constituting the carry-out side roller transport path 1〇4c. This reduced-pressure drying unit (VD) 46 has a lifting mechanism 126 for raising and lowering the substrate g in a substantially horizontal manner in the chamber 1〇6. The lifting mechanism 126 includes a plurality of (preferably 50 or more) lifting pins 128 arranged in a predetermined arrangement pattern (for example, a matrix) in the chamber 1〇6; a plurality of horizontal bars or horizontal plates The pin base 130' supports the lift pins 128 at a lower position than the inner roller transport passage 104b in each predetermined group or group; and the lift drive source, for example, the cylinder 132, moves the bases 130 to move up and down. Outside the chamber 1〇6 (bottom). More specifically, a plurality of (preferably seven or more) lift pins 128 are vertically spaced at regular intervals in the gap between the adjacent two rollers i 8b and 108b in parallel with the roller 108b (Y direction). A plurality of columns (preferably eight or more columns) are disposed at an appropriate interval in an erected arrangement in the direction of the transport direction, so that each of the pin bases 13 〇 supports a 丨 group or an Array (example 2 is illustrated) Group) of lift pins. Then, the bottom wall of the chamber 106 is hermetically penetrated via the sealing member 134, and the respective pin bases 13 on the inner side of the chamber are respectively connected to the respective cylinder tubes 132 on the outer side of the chamber by the lifting and lowering drive shaft 136 Connected to 15 200842525. And the pin tip shown in Fig. 6 moves up and down between the legs of the roller transporting passage. «Wang (Rise) position Each lift pin I28 has: pin body coffee, lower end n=8b ’ two? The upper end of the main body ma is straight and the tip of the pin is hidden. Compared with the _PEEK 4 ed cylindrical frequency, the _ on the upper end of the county body 128a is composed of the tip of the pin at 128. The substrate I on the mouthpiece is loaded with the conventional general lifting device for lifting the loader; the person picking up the front substrate is used to lift the lifting pin delivered to the transport robot, and the pin tip=. That is, the diameter of the lock tip portion of the lift pin for general transfer is (6) ί (; ΐΤ 上, the pin tip of the lift pin 128 in this embodiment is straight tan η: Γ (if strength is considered, it is best The remainder is G.4, leg), and is just shaped into a predetermined size (for example, R=〇.2~〇3_). The exhaust port 138 is formed at the I 1 or more locations of the bottom wall of the emirate. The air tubes 140 are connected to the vacuum exhausting unit 142. Each of the vacuum exhausts vacuum-pumps the chamber 106 from the state of the money to maintain the vacuum pumping. Further, in order to make most of the vacuum exhaust connecting tubes (Unsynchronized averaging, each exhaust pipe 140 can be used in both ends of the chamber 106, that is, near the transfer port 11 and the transfer port 112, and the position ti is lower. The cylindrical nitrogen emulsion extending in the direction is ejected by σρ 144. The money ejecting portion 144 is connected to a nitrogen supply source (not shown) by, for example, sintering a metal powder into a 16 200842525 tube 146 (® 4). After the treatment, the nitrogen gas ejecting portion 144 is returned from the state of the bear pressure state in which the chamber 1〇6 is sealed and returned to the atmospheric pressure state. The entire g surface is sprayed with nitrogen gas. ° ° Next, the action of the reduced pressure drying unit (乂〇) 46 in this embodiment will be described. As described above, the resist coating unit (c〇T) 44 adjacent to the upstream side The G is applied to the anti-funging agent liquid, and the vocabulary is moved from the floating field on the squat 8 to the side roller transport path. Then, as shown in Fig. 5, the substrate G is transported by rollers. The side roller transport path 10a moves upward, and finally enters the chamber 1〇6 of the decompression drying unit (VD) 46 from the carry-in port 11. At this time, the shutter mechanism 114 opens the inlet 110 in advance. The transport path 104b is also driven by the rotation of the rotary drive source 120, and is loaded into the side roller transport path 10, and the roller transport operation is performed in time, and the roller transport operation of the same transport speed is performed, as shown in FIG. The substrate G entering the port 11 is transported by rollers into the rear of the chamber 1 〇 6. At this time, the lifting mechanism 126 causes all the lift pins 128 to have lower front ends of the pins on the transport surface of the inner roller transport path. The return (down) position is first standby. Then, if the substrate G reaches the chamber 1〇6, the center is approximately At the position, the roller transport operation of the internal roller transport path 1 is stopped. At the same time or immediately before, the roller transport operation of the side roller transport path 1〇4a is stopped. As described above, the substrate G to be subjected to the vacuum drying treatment is carried into the chamber 1〇6 from the front or upstream side resist coating unit (c〇T) 44, at the same time (or tightly, before), + As shown in Fig. 5, the preceding substrate $, which has been subjected to vacuum drying treatment in the chamber 1〇6, is rolled by the internal roller transport path 1〇4b and the carry-out side roller transport path 丨〇4c. The sub-shipping is carried out from the unloading port 112 to the outside of the chamber and maintained in this state to be transported advancing to the second heat-treating portion 32 adjacent to the rear or downstream side (Fig. 1), as described in the 'resist coating unit ( The substrate G' coated with the resist liquid of the COT) 44 is transported into the decompression drying unit by the roller transported into the side roller transport path 1, for example, and the internal roller transport path 1〇牝200842,425. The chamber 106 of (VD) 46. Immediately after that, the shutter mechanisms 114 and 116 are actuated, and each of the carry-in port 110 and the transfer port 112 that has been opened up to this point is closed, and the chamber 106 is also sealed. Then, the lifting mechanism 126 moves the lifting cylinder 132 forward, and all the pin bases 13 〇: raises the predetermined stroke component so that the front end of all the lifting pins 128 in the chamber 1〇6 reaches beyond the internal roller conveying passage. The predetermined height position of the transport surface of 104b is Shishi. By the moving (rising) action of the lifting mechanism 126, as shown in FIG. 6, the substrate conveyance path l〇4b is maintained in a horizontal posture and transferred to the front end of the pin of the lift pin 128 and maintained in this state. Raised above the inner roller transport path 1〇4b. On the other hand, after the chamber 106 is sealed, the vacuum exhaust unit 142 is actuated to evacuate the chamber 106 to a predetermined degree of vacuum. In this way, in the chamber 1〇6, the substrate G is processed in a reduced pressure atmosphere, whereby the resist liquid film on the substrate can be appropriately dried with good efficiency. During this vacuum drying process, the substrate G is supported substantially horizontally by a plurality of lift pins 128, and the pin tip portion 128b of the lift pin 128 and having a rounded front end is extremely small in area and has no contact, thus, ie, thermal influence On the other hand, the trace of the anti-side film domain # substrate contact portion on the substrate G is not small and is negligible in practical use. Further, the pin tip portion i28b of the lowering pin 128 is made of a resin, and the pin body is applied as a hollow tube to reduce heat transfer, which is advantageous for minimizing transfer marks. The vacuum decompression process ends after a certain period of time, and the vacuum exhaust device = exhaust operation. Instead of this, the nitrogen gas ejecting portion 144 allows nitrogen gas to flow into the chamber. . Thereafter, after the internal pressure rises to the atmospheric pressure, the shutter mechanisms 114 and 116 enter: no and the outlet 112. Before and after this, the lifting mechanism 126 causes the lifting cylinder j to lower all the ship parts 13()- to the predetermined training component, so that the front end of the pin with the lifting pin|28 becomes the internal lion transport channel. The height position is up. By the _ (down) action of the lifting mechanism 126, the slanting posture is transferred from the _ end of the lift pin 128 to the inner roller, and then, the inner roller transport path l 〇 4b and the carry-out side roll Sub-transport 18 200842525 ϊ ΐ ϊ 该 该 该 该 该 该 2008 2008 2008 2008 2008 2008 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该The moving out, as shown in Fig. 5, comes from the subsequent coating of the resist coating unit (c〇T) 44, in the moving transport channel Xie &amp; and the internal roller transport channel just j The continuous roller transport can be carried into the chamber 1〇6 from the loading port 11。. The pressure drying unit (VD) 46, which is subjected to the vacuum drying treatment, is transported into the chamber by the roller. In the chamber 6, in the chamber 1〇6, the substrate G that has been dried and processed is transported out of the chamber 1 to 6 by the roller. Therefore, when the substrate is carried out, the substrate is not required to be transported. When the arm is broken, the position is deviated during loading/unloading, and the transfer port 112 is moved in and out of the substrate G. Therefore, the operation of the upper cover 118 (upper and lower) of the chamber 106 is not ridiculous, and there is no problem of dusting, which ensures safety for the operator. The lift pin 128 maintains the substrate G in a horizontal posture = the lift passage 104b is lifted upward to have a very fine pin tip portion, and the transfer mark of the substrate contact portion to which the resist film on the plate G is attached is reduced. The configuration and examples of the above-described decompression drying unit (VD) 46 of Figs. 3 to 6 can be variously modified within the scope of the technical idea of the present invention. Fig.: ~® 1) shows the vacuum drying of the second embodiment. The structure of the unit (VD) 46 (2: 3 to 6) has the same composition of the real f or the function of the upper knife. Further, Fig. 7 and Fig. 8 show the right image == in the chamber 1〇6. The configuration of the left half (upstream side) which is linearly symmetrical with respect to the center line N. In the second embodiment, the second feature is the internal roller transport path 1 〇牝 ', that is, in the first embodiment described above, Roller of internal roller transport path 1〇4b_ 19 200842525 = Column H is the carrier substrate G and the roller is transported if it corresponds to the township example, such as iS! 7w. Therefore, in the plurality of portions of the second cylindrical portion 1 SY, the two large portions of the two rollers 108d are smoothly rotated in a straight line shape using a ring-shaped large diameter=n======================= The bearing 152 of the support displacement supports and allows the position of the bearing 152 to be adjusted. More specifically, the long-length wire portion m extending in the center of the roller 108d is arranged at a fixed height, and the plurality of inverted U-shaped vertical support members 156 are set to be ==4 sub-type vertical. The inner side of the support member 156 is in contact with the transport direction (the horizontal support member 158 is brittlely aligned, and one or more (two in the illustrated example) central bearing i52 are mounted on the member 158. As shown in Fig. 9, the horizontal support member 158 is constituted by a corner cylinder, and the block 16 is fixed to the top surface of the horizontal support member 15S, and is formed with a height adjusting screw attached to the top surface of the reverse type vertical support member 156. The threaded hole of the 162 screw is checked (not shown by rotating the bolt 162, the height position of the horizontal support member 158 and the center bearing 152 can be variably adjusted. Then, by being mounted on one side of the reverse U-shaped vertical support member The lock (fixed) is tightened by the bolts 164, and the block 16 is pushed from the lateral direction to fix the horizontal support member 158 to the vertical support member I%. Also, the female wearer has 2 center bearings 152 of 1 The root horizontal support member I% is an example of a configuration supported by one anti-U sub-type vertical support member 156, and may be an example. For example, one horizontal support 158 having three center bearings 152 mounted as shown in FIG. 1A is supported by two inverted U-shaped vertical support members 156. ' Also, as shown in FIGS. 7 and 9 The base portion 154 is horizontally disposed 166 above the exhaust port 138 20 200842525 of the chamber 1〇6 to cover the two sides of the base 154. The two positions are earned and the bottom surface (floating) is installed. 丨(10) As shown in Figure 7 of 106, the internal roller transport channel seems to be in contact with the bevel gear, and the connection is dusted. In addition to the cavity, _74, the motor 178 and the drive pulley block 180 are connected. 铷,, and 176, conveyed ▼, as shown in Fig. 7, in the lifting mechanism 126, each surface extends in parallel (Υ direction) horizontal support Rod off support, m = support rod 182 is perpendicular to this and is in the direction of χ; the second feature of his 2 embodiment is the internal roller transport passage 104b and the outer t = Λ雠子运赖道1G4a, purchase Correctly connected (four) sub-gamma, 188 ', and in the selection of the entrance 110, 112 and / or gate mechanism 114, ιΐ6 〇 j Figure 7 and Figure 8 shown in the room On the moving-out side, the rolling support portion 190 in which a plurality of drum-type roller rollers are disposed is disposed in the γ-direction at intervals of γ. Further, the upper portion of the shutter mechanism 116 is attached to the γ-direction partition. The rolling support portion 192 of the plurality of drum rollers 188 is disposed at an appropriate interval. The roller 186 of the discharge port 112 is always at the height of the roller transport path 1〇4&amp; the gate, the roller 188 of the 116, when The shutter mechanism 116 retreats to the bottom surface and opens the discharge port 112%, and is positioned at the height of the roller transport path 丨〇4. Further, in the illustrated example, the roller 188 of the shutter mechanism 116 is provided only in a row, but the rolling support portion 192 may be extended in the X direction to provide two or more rows. As shown in Fig. 11, in the rolling support portions 190 and 192, each of the drum rollers 186, 188 is exposed on the window 194 only in the vicinity of the top portion in contact with the back surface of the substrate cymbal, so that dust can be dusted even by the rotating action. Also try not to spread around. In general, the smaller the rolling interval (rolling pitch) of the roller transport path, the roller of the substrate 21 200842525 is transported to the mosquitoes at a high speed. However, ί ί;= can be limited by rate. In this regard, in the second embodiment, the rolling interval iii of the roller transport path can be reduced, and the lifting ability (safety and high speed) can be improved. The third feature of this second embodiment is the exhaust mechanism. As shown in Fig. 8, the vacuum exhaust unit 142 is connected not only to the chamber via the exhaust pipe 140, but also to the exhaust fan 196 to connect the exhaust fan (or exhaust line) 198. Exhaust

管Γ里1% f別設有開閉閥細、2〇2。為了進行基板G之搬出 Γ果ΐ搬出人口110、112開啟之期間,開啟開閉閥202,則 藉由使排氣風扇198作動,能將從搬出入口 11〇、112進入腔室觸 ,之塵埃或在腔室106内產生的塵挨從排氣口 138經由分支排氣 官196而有效地排出到腔室1〇6之外。於對於腔室1〇6内進行真 空^吸時’開啟毅排氣裝置142側之開關,並預先關閉排氣 風扇198側之開閉閥2〇2。 上述實施形態之中,減壓乾燥單元(VD)46之腔室1〇6在運送 方向相對向的一對腔室側壁,分別設有搬入口 11〇及搬出口 112, 而气板G穿過腔室1〇6。但是,也可將設於腔室1〇6之一側壁的工 個ί般出^口兼用為搬入口及搬出口,此情形也可達成搬入側滾子 運送通道104a與搬出側滾子運送通道1〇4c之共用化。 本發明^中,被處理基板不限定於LCD用玻璃基板,亦可為 ^他平面顯示器用基板、半導體晶圓、CD基板、光罩、印刷基板 等。減壓乾燥處理對象之塗布液亦不限於抗蝕劑液,例如亦可為 層間絶緣材料、介電材料、配線材料等之處理液。 22 200842525 圖式簡單說明】 圖1顯示可適用本發明之塗布顯影處理系統之構成 圖2顯示上述塗布顯影處理系統之處理步驟流程圖。圖。 圖3顯示實施形態之塗布處理部全體構成平面圖: 圖4顯示第1實施例之減壓乾燥單元構成平面&amp;。 圖 圖5顯示第1實施例之減壓乾燥單元搬出入之^部狀離1% f in the tube is not equipped with an opening and closing valve, 2〇2. In order to carry out the loading and unloading of the substrate G, the opening and closing valve 202 is opened while the opening and closing of the populations 110 and 112 is opened, and the exhaust fan 198 is activated to enter the chamber from the loading and unloading ports 11 and 112, and the dust or The dust mites generated in the chamber 106 are effectively discharged from the exhaust port 138 to the outside of the chamber 1〇6 via the branch exhaust 196. When the vacuum is applied to the chamber 1〇6, the switch on the side of the exhaust unit 142 is turned on, and the on-off valve 2〇2 on the side of the exhaust fan 198 is closed in advance. In the above embodiment, the chambers 1〇6 of the reduced-pressure drying unit (VD) 46 are provided with a transfer port 11〇 and a transfer port 112 in the pair of chamber side walls facing each other in the transport direction, and the gas plate G passes through The chamber is 1〇6. However, it is also possible to use both the side wall of the chamber 1〇6 as a carry-in port and a carry-out port. In this case, the carry-in side roller transport path 104a and the carry-out side roller transport path can also be achieved. 1〇4c sharing. In the present invention, the substrate to be processed is not limited to the glass substrate for LCD, and may be a substrate for a flat panel display, a semiconductor wafer, a CD substrate, a photomask, a printed substrate, or the like. The coating liquid to be subjected to the vacuum drying treatment is not limited to the resist liquid, and may be, for example, a treatment liquid such as an interlayer insulating material, a dielectric material, or a wiring material. 22 200842525 BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 shows the constitution of a coating development processing system to which the present invention is applicable. Fig. 2 is a flow chart showing the processing steps of the above coating development processing system. Figure. Fig. 3 is a plan view showing the entire configuration of the coating treatment portion of the embodiment: Fig. 4 is a view showing the configuration of the vacuum drying unit of the first embodiment. Figure 5 is a view showing the portion of the vacuum drying unit of the first embodiment

〇 J VSJ 圖6顯示第i實施例之減壓乾燥單元之減壓乾 狀態剖面圖。 圖7顯示第2實施例之減壓乾燥單元構成平面圖。 圖8顯示第2實施例之減壓乾燥單元構成剖面^。 圖9顯示第2實施例中,將中娜承之高度位 整之機構剖面圖。 j文调 圖10顯示第2實施例中,將中心轴承之高度位置予 整之機構的一變形例側面圖。〇 J VSJ Fig. 6 is a cross-sectional view showing the reduced-pressure dry state of the reduced-pressure drying unit of the i-th embodiment. Fig. 7 is a plan view showing the configuration of the reduced-pressure drying unit of the second embodiment. Fig. 8 is a view showing a configuration of a vacuum drying unit of the second embodiment. Fig. 9 is a cross-sectional view showing the mechanism in which the height of the center is centered in the second embodiment. Fig. 10 is a side view showing a modification of the mechanism for preliminarily adjusting the height position of the center bearing in the second embodiment.

、奋^'^貝示第2實施例中,設於腔室之搬出入口及/或閘機構之 滾间式滾動之安裝構造立體圖。 W 【主要元件符號說明】 C EE G RL SY TITLER 10 12 13 14 匣盒 周邊曝光裝置 基板 滾筒部 轴 印字曝光器 塗布顯影處理系統 曝光裝置 升降缸筒 匣盒站(C/S) 23 200842525 16 處理站(P/S) 18 界面站(I/F) 20 台座 22 運送機構 22a 運送臂 - 24 搬入單元(IN PASS) 26 清洗處理部 28 第1熱處理部 30 塗布處理部 /. 32 第2熱處理部 34 第1平流運送通道 36 準分子UV照射單元(E-UV) 38 擦磨清洗單元(SCR) 40 黏附單元(AD) 42 冷卻單元(COL) 44 抗蝕劑塗布單元(COT) 46 減壓乾燥單元(VD) 48 預烘單元(PRE-BAKE) 50 冷卻單元(COL) C 52 通過單元(PASS) 54 顯影單元(DEV) 56 後烘單元(POSTBAKE) 58 冷卻單元(COL) 60 檢查單元(AP) 62 搬出單元(OUT PASS) 64 第2平流運送通道 66 第3熱處理部 68 輔助運送空間 70 穿梭機構 24 200842525 72 運送裝置 74 旋轉台座(R/S) 76 周邊裝置 80 台座 82 基板運送機構 84 抗蝕劑喷嘴 86 喷嘴更新部 88 氣體喷射口 90A、90B 引導軌道 92 滑動機構 94 喷嘴支持構件 96 支柱構件 98 預塗處理部 100 喷嘴浴 102 喷嘴清洗機構 104 滚子運送通道 104a 滚子運送通道 104b 滾子運送通道 104c 滚子運送通道 106 腔室 108a、108b、108c、108d 滾子 110 搬入口 112 搬出口 114、116 閘機構 118 上蓋 120 旋轉驅動源 122 旋轉軸 124 密封構件 126 升降機構 25 200842525 128 升降銷 128a 銷本體 128b 銷尖端部 130 銷基部 132 缸筒 134 密封構件 136 升降驅動轴 138 排氣口 140 排氣管 142 真空排氣裝置 144 氮氣喷出部 146 配管 150 軸承 152 軸承 154 基部 156 支持構件 158 支持構件 160 區塊 162 螺栓 164 螺栓 166 排氣用整流板 168 腳部 172 驅動軸 174 馬達 176 從動滑輪組 178 傳送帶 180 驅動滑輪組 182 水平支持棒 184 水平連結棒 26 200842525Fig. 2 is a perspective view showing the mounting structure of the roll-to-roll type of the carry-out port and/or the shutter mechanism of the second embodiment. W [Description of main component symbols] C EE G RL SY TITLER 10 12 13 14 周边 box peripheral exposure device substrate roller section shaft printing exposure applicator development processing system exposure device lifting cylinder 匣 box station (C/S) 23 200842525 16 Processing Station (P/S) 18 Interface station (I/F) 20 pedestal 22 transport mechanism 22a transport arm - 24 carry-in unit (IN PASS) 26 cleaning processing unit 28 first heat treatment unit 30 coating processing unit /. 32 second heat treatment unit 34 1st advection transport channel 36 Excimer UV irradiation unit (E-UV) 38 Scrub cleaning unit (SCR) 40 Adhesion unit (AD) 42 Cooling unit (COL) 44 Resin coating unit (COT) 46 Decompression drying Unit (VD) 48 Pre-bake unit (PRE-BAKE) 50 Cooling unit (COL) C 52 Passing unit (PASS) 54 Developing unit (DEV) 56 Post-drying unit (POSTBAKE) 58 Cooling unit (COL) 60 Inspection unit (AP) 62 Outlet unit (OUT PASS) 64 Second advection transport path 66 Third heat treatment unit 68 Auxiliary transport space 70 Shuttle mechanism 24 200842525 72 Transport unit 74 Rotating pedestal (R/S) 76 Peripheral unit 80 Pedestal 82 Substrate transport mechanism 84 Resist nozzle 86 Nozzle renewing portion 88 Gas ejection port 90A, 90B Guide rail 92 Sliding mechanism 94 Nozzle supporting member 96 Strut member 98 Precoating processing portion 100 Nozzle bath 102 Nozzle cleaning mechanism 104 Roller transport path 104a Roller transport path 104b Roller transport path 104c Roller transport path 106 Chambers 108a, 108b, 108c, 108d Roller 110 Carrying port 112 Carrying out port 114, 116 Gate mechanism 118 Upper cover 120 Rotary drive source 122 Rotary shaft 124 Sealing member 126 Lifting mechanism 25 200842525 128 Lifting pin 128a Pin body 128b Pin tip 130 Pin base 132 Cylinder 134 Sealing member 136 Elevating drive shaft 138 Exhaust port 140 Exhaust pipe 142 Vacuum exhaust 144 Nitrogen ejector 146 Piping 150 Bearing 152 Bearing 154 Base 156 Support member 158 Support member 160 Block 162 Bolt 164 Bolt 166 Venting rectification plate 168 Foot 172 Drive shaft 174 Motor 176 Drive pulley block 178 Conveyor belt 180 Drive pulley block 182 Horizontal support rod 184 Horizontal connection rod 26 200842525

186、188、190、192 滾動支持部 194 窗 196 排氣管 198 排氣風扇(或排氣管路) 200、202 開閉閥 27186, 188, 190, 192 Rolling Support 194 Window 196 Exhaust Pipe 198 Exhaust Fan (or Exhaust Line) 200, 202 Open and Close Valve 27

Claims (1)

200842525 十、申請專利範圍: 1. -種減壓乾燥裝置,絲對於被處理基板上 狀態下施以乾燥處理,具備: 隹醜 的^減壓之腔室,具有用以將該基板以大致水平狀態加以收容 態進工iH:構’為了施行該乾燥處理,將該腔室内於密閉狀 構,具有在該腔室之外部及内部連續之滾子運送通 ^ ’ ϊϊίΐ運送通道上之滾子運送將絲板搬出人該腔室;及 + 2 ΐϊί,具有在該腔室之中離散地配置的多數之升降銷, 降.細以將該基板關前端大致水平地支持*而上升下 乾燥處_ ’使該升_之前端較該滾子運送通 板’在實施該基板搬出人時,使該升降銷之 ί:=ΐί:運送通道為低’而實現利用該運送機構來進行該 繼,其中,該升降銷之銷 乾繼,射,料降銷之鎖 i二ΐίίί,第1至3項中任1項之減壓乾燥裝置,其令, 刖鈿邓的树脂製之銷尖端部。 體之 ^成申第4狀纖繼,其巾,補尖端部為 申請專利範圍第1至3項中任1項之減壓乾燥穿置,复由 升降驅動“驅動力使降並藉由配置在該腔室之外的 ★申明專她圍第丨至3射μ項之減壓乾縣置,其令, 28 200842525 在該腔^中,構成該滾子運送通道之滾子具有賴定直徑之轴 以及隔著既疋間隔而形成或安裝於此軸上之多數環狀滾筒,此等 滾子在該滾筒之外周面與該基板之底面相接觸。 、 8·如申請專利範圍第7項之減壓乾燥裝置,其中,該滾動之轴, ^兩端部被固定在一定高度位置之第1軸承以可旋轉方式支持 ^,而其中心部被高度位置可調整之第2軸承以可旋轉方式支持 9.;如申凊專利範圍第J至3項中任}項之減壓乾燥裝置,其中, ^該腔室之側壁部’設有:用以將該基板以滾子運送從該腔室外 ,入该腔室内之搬人u,及用以將絲板赠子運送從該腔 搬入到該腔室外的搬出口;且 4請在雜室側壁部之外,設有用以開閉該搬人口及搬出口之閘 機構。 10·=請專利範圍第9項之減壓乾燥裝置,其中,該搬入口及搬 出口係相對向而分別設於該腔室之侧壁部。 專利範圍第9項之減壓乾燥裝置,其中,於該腔室之搬 或^ ϋ有構成紐子運送通道之—部分的滚筒。 f圍第9項之減壓乾燥裝置,&amp;中,於該閘機構, ΐ分的^筒^搬人口或搬出口之狀11下構成縣子運送通道之— 1至3項巾任1項之減壓乾職置,其中, 腔室内部之㈣,而於開放狀態對該腔室内部進 仃排乳的第2排氣機構。 1運 _1 排 十一、圓式: 29200842525 X. Patent application scope: 1. - A vacuum drying device, which is subjected to drying treatment on the substrate to be processed, and has: an ugly chamber for decompression, with a substrate for substantially horizontally The state is in a state of being loaded into the work iH: in order to perform the drying process, the chamber is in a closed configuration, and has a roller transport on the outer and inner sides of the chamber for the roller transport on the transport path. Lifting the wire plate out of the chamber; and + 2 ΐϊί, having a plurality of lift pins discretely disposed in the chamber, descending to thinly support the front end of the substrate substantially horizontally* and rise to the dry place _ 'Using the lifter_previous end than the roller transporting plate', when the substrate is carried out, the lift pin is made ί:=ΐ: the transport path is low', and the transport mechanism is used to perform the process, wherein The pin of the lifting pin is dry, shot, and the lock of the pin is reduced. The vacuum drying device of any one of items 1 to 3, which makes the tip of the resin made by Deng Deng. The body of Cheng Cheng Shen 4th fiber follows, its towel, the filling tip is the decompression dry wear of any one of the first to third patent applications, and the driving force is lowered and configured by the lifting force. The outside of the chamber, the declaration of the diameter of the 丨 丨 丨 3 3 3 3 项 , , , 28 28 28 28 28 28 28 28 28 28 28 28 28 28 28 28 28 28 28 28 28 28 28 28 28 28 28 28 28 28 28 28 28 28 28 28 28 a shaft and a plurality of annular rollers formed on or mounted on the shaft via the splicing interval, the rollers being in contact with the bottom surface of the substrate on the outer circumferential surface of the roller. 8. 8 of the patent application scope The vacuum drying device, wherein the rolling shaft, the first bearing fixed at a certain height position at both ends is rotatably supported, and the second bearing whose center portion is adjustable in height position is rotatable A vacuum drying apparatus according to any one of clauses J to 3, wherein the side wall portion of the chamber is provided for: transporting the substrate by the roller from the cavity Outdoor, moving into the chamber, and transporting the silk board gift from the chamber to the For the outside of the side wall of the room, there is a gate mechanism for opening and closing the moving population and the exiting port. 10·=Please take the vacuum drying device of the ninth patent range, where the moving port And the outlets are respectively disposed on the side wall portion of the chamber. The vacuum drying device of the ninth aspect of the patent, wherein the chamber is moved or partially formed to be a part of the transport passage of the cage. In the dehumidifying and drying device of the ninth item, in the sluice mechanism, the smashing machine, the moving population, or the moving out of the eleventh constitute the county sub-transportation channel - 1 to 3 items of towels 1 item of decompression and dry work, in which the chamber is inside (4), and in the open state, the second exhaust mechanism of the milk is introduced into the chamber. 1 运_1 排11, round: 29
TW096140948A 2006-11-15 2007-10-31 Reduced-pressure drying device TWI375135B (en)

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