200842180 九、發明說明： 【發明所屬之技術領域】 本發明之實施例係關於半熱固非等向性導電膜組成。特別 本發日狀實施例係關於包含高分子重量熱祕樹脂及提供 密集地固化結構之熱固材料的半熱固非等向性導電膜組成，藉 以展現優良的品質、生產性、改良的操作性、於模组製造線的200842180 IX. Description of the Invention: TECHNICAL FIELD OF THE INVENTION Embodiments of the present invention relate to a semi-thermoset anisotropic conductive film composition. In particular, the present embodiment relates to a semi-thermosolid non-isotropic conductive film comprising a polymer weight heat-sensitive resin and a thermosetting material providing a densely-cured structure, thereby exhibiting excellent quality, productivity, and improved operation. Sex, in the module manufacturing line
生產性、以及即使有短路連接㈣亦有優良附著性及接觸電 阻。 【先前技術】 -般而言’非等向性導電膜係指有導電粒子散布於其内之 膜類的黏著劑，導電粒子例如為鎳、金等的金屬粒子或塗布有 該些金屬的高分子粒子。當非等向性導電膜置於電子元件間用 以組裝時，會於預定情況下施予熱及壓力，而藉由導電粒子於 電子元件間形成電性連接。1，於電子元件間的空間填充絕緣 黏著樹脂，藉时科電粒子並提供良好的絕緣。非等向性導 電膜被廣泛地使用於電性連接，如於晶片位於膜上⑽P餐 film，C〇F)的液晶顯示器、捲帶式封裝㈣e⑽如paekages， TCPs)、印刷電路版(PCBs)等。 當液晶顯示器變得愈來愈大且薄時，電極及電路間的間隔 尺寸也愈小。非等向性遙+替 —# 導电膜扣次者重要角色當作連接小尺寸 電路元件之方法。因此，韭笪 匕非寺向性導電膜亦受到重視，作為用 於曰曰片位於破璃上安裝、晶片位於膜上安料的材料選擇。 6 200842180 習知非等向性導電膜可以分為··環氧硬化型其包含混合有 黏著劑的環氧系（epoxy-based)或酴系樹脂；自由基硬化型其包 含自由基可聚合低聚物、單聚物及自由基啟始劑。 習知非等向性導電膜展現良好且長期可靠性或硬化速度， 但卻無法於大量生產時提供良好的品質及生產性。甚者，機械 性質和後硬化重工性質傾向不良。於生產製造線上常發生缺 陷。當要改善生產性而將電路連接時間縮短時，無法得到長期 可靠性及穩定的黏著。 更尤其，習知環氧硬化型非等向性導電膜也許會展現不足 的黏性，結果於後接合時增加缺陷，於硬化後重工性惡化。甚 者，因為反應溫度極高所以程序的控制、接合裝置的保持很困 難0 而且，習知自由基硬化型非等向性導電膜具有的問題為， 當反應速度下降以確保導電粒子及電路元件間的接觸，接合樹 脂和硬化劑因不同的流變特性可能會有不同的流動性質，因而 造成過多的泡泡產生，這會造成縮短長期可靠性的反效果。相 反地，當反應速度上升則導電粒子與電路元件間的接觸可能會 不足，因而造成低接觸可靠性及過度硬化，這也可能會造成重 工性的問題。 已有嘗試利用導入熱塑性樹脂用以解決上述問題及改善重 工性等，但要得到良好之與硬化系統間的適應性及適當膜強度 及應變是很不容易的。再者，熱塑性樹脂的收縮及擴張不容易 控制，且於低溫程序中，熱塑性樹脂可能會展現硬化反應，因 7 200842180 而在熱及濕環境下會顯著地減小可靠性。 【發明内容】 个赞明之目的在於 托供一種半熱固非笠 成，爱針士夕卞…U#4向性導電膜組 成。針對膜形成k之塗布及切割提供良好的 良好的品質。 產丨生，及提供 Γ 組生產性的非㈣性導電赌成。/、状㈣㈣性及模 曰本發明之半熱固非等向性導電膜組成，其包含··⑴且有重 == 量為約」5°_至約__的熱塑性— I、〜刀子重里為約100至約10000、以及具有丙烯酸 酉曰或甲基丙烯義功能基的熱固性材料；（3)有機過氧化物；⑷ 矽烷連接劑；及（5)導電粒子。 本發明係關於-種由上述組成所形成的非等向性導電膜。 【實施方式】 本發明之例示的實施例，將會更詳細地被描述於下，但本 毛明的其他悲樣，係能夠以不相同的形式實施，因此不應解譯 成限制於在此所提及之實施例。相反地，提供此些實施例，以 使揭路更為完整’且會完整地傳達本發明之範圍給於此領域具 有通常知識者。 本發明所提供之非等向性導電膜組成包含·· (1)具有重里平均分子重量為約150000至約600000的熱 塑性(thermoplastic)樹月旨· 200842180 (2) 具有重量平均分子重量為約100至約10000 ;以及具有 丙烯酸S旨或曱基丙婦酸醋功能基的熱固性（thermosetting)材 料； (3) 有機過氧化物； (4) 矽烷連接劑；及 (5) 導電粒子。 熱塑性樹脂（1)作為膜形成所需的母體，其能夠為高分子重 量的熱塑性樹脂，但不加以特別地限制。例如，能夠單獨地或 組合至少二種的烯烴樹脂、丙烯酯橡膠、丁二烯樹脂、丙烯晴 丁二烯共聚物、碳酸化丙烯晴丁二烯共聚物、聚乙烯縮丁醛樹 脂、苯氧樹脂、及/或環氧樹脂。氯丁二烯樹脂由於在程序中所 產生的氯離子可能會侵蝕電路元件，因此不適合作為上述用 途。 高分子重量的熱塑性樹脂受予非等向性導電膜組成所包含 之樹脂良好的適應性，防止導電粒子沈澱，且受予適足的膜的 屈服應力及破裂應變，藉以提供良好的於電路連接時的重工 性。此外，具良好的接合性質，藉由加熱及加壓並透過電路連 接，熱塑性樹脂給予非等向性導電膜良好的黏著性及附著性 質，藉以確保電路元件的良好連接。 較佳地，熱塑性樹脂具有重量平均分子重量約150000至 約600000。當熱塑性樹脂的重量平均分子重量低於約150000 時，不能夠得到適足的膜強度及破裂應變，於組成物中導電粒 9 200842180 子也許會發生嚴重的沈澱。當熱塑性樹脂的重量平均分子重量 高於約600000時，於由於降低的適應性（compatibility)非等 向性導電膜組成的調備過程中可能會發生相分離，黏著物的黏 著性降低，長期接觸可靠性會因過度的收縮及擴張而惡化。 熱固性材料（2)當作固化反應產生時的固化系統，因而能夠 確保電路元件間的黏著性及接觸可靠性。本發明之非等向性導 電膜組成所包含的熱固性材料，具有重量平均分子重量為約 100至約10000 ;並具有丙烯酸酯及甲基丙烯酸酯功能基，因 此能夠形成密集的硬化結構。 包含熱固性材料的固化系統，能夠於短時間内實踐電路連 接，藉以給予非等向性導電膜良好的模組生產性。當熱固性材 料的重量平均分子重量低於約1〇〇時，由於高反應率因此不適 合。當熱固性材料的重量平均分子重量高於約10000時，即使 透過加熱加壓尚可能會得不到密集固化結構，這會造成長期接 觸及黏著可靠性的降低。 提供參考，當基於結構式的分子重量小於約400，而利用 膠體透析層析儀（GPC)對此種小分子重量的熱固性材料進行平 均分子重量計算，會得到大的誤差。因此，於此情況下，考慮 基於分子結構的分子重量作為平均分子重量。 具有重量平均分子重量為約100至約10000 ;以及具有丙 烯酸酯及甲基丙烯酸酯功能基的熱固性材料，能夠為一或以上 的任一高分子、低聚物和單分子。沒有特別地限制熱固性材 料，為此目的的熱固性材料可以使用：高分子、低聚物或單分 10 200842180 子其具有例如包含丙烯酸甲S旨、丙烯酸乙i旨、丙烯酸異丙S旨、 丙烯酸異丁酯、乙二醇雙丙烯酸酯、二乙二醇雙丙烯酸酯、三 甲基丙烧三酰基化物、四甲氧基甲烧四丙稀酸i旨、2 -經-1，3二 丙烯酰氧基丙烷、2,2-鄰[4-(丙烯酰氧基聚甲氧基）苯基]丙 烷、2,2-鄰[4_(丙烯酰氧基聚乙氧基）苯基]丙烷、丙烯酸雙環 : 戊烯基酯、丙烯酸三環癸基酯、或三（丙烯酰氧乙基）異氰酸等 - 的功能基。以上可以單獨地或組合二種或以上來使用。且為改 ， 善黏著性及室溫穩定性，能夠使用具有磷酸酯結構的丙烯酸酯 或甲基丙烯酸酯，例如2-曱基丙烯酰氧乙基酸磷酸酯、2-丙烯 酰氧乙基磷酸酯等。 於本發明之實施例中，相對於1〇〇重量分的具有重量平均 分子重量為約150000至約600000的熱塑性樹脂，具有重量平 均分子重量為約100至約10000以及具有丙烯酸酯或甲基丙烯 酸酯功能基的熱固性材料，其含量較佳地為100至400重量 分。換言之，具有重量平均分子重量為約150000至約600000 、 的熱塑性樹脂；與具有重量平均分子重量為約100至約10000 以及具有丙烯酸酯或甲基丙烯酸酯功能基的熱固性材料，兩者 的重量比較佳地為20:80至50:50的範圍。當相對於100重量 分的熱塑性樹脂，熱固性材料的含量超過4 0 0重量分時，於加 熱及加壓後其重工性會減小。當相對於100重量分的熱塑性樹 脂，熱固性材料的含量小於100重量分時，硬化密度相對地減 小因而造成接觸可靠性減小。 有機過氧化物（3)作為熱硬化起始劑。使用於本發明的有機 11 200842180 過氧化物沒有特別地限制，可以使用一般的有機過氧化物。例 如，可以使用一或以上的二酰基過氧化物、過氧化二碳酸、過 氧酯、過氧縮酮及/或二烷基過氧化物。 有機過氧化物的示例包括··異丁基過氧化物、3,5,5-三甲 基己酰過氧化物、過氧化十二酰、硬脂驢過氧化物、玻拍醯過 氧化物、m-甲苯甲醯/苯甲醯過氧化物、苯甲醯過氧化物、二-n-過氧化二碳酸丙S旨、過氧化二碳酸二異丙ί旨、過氧重碳酸（三 級丁基環己基）S旨、二_2_乙氧基乙酯基過氧化二碳酸、二-2-乙 氧基乙酯基過氧化二碳酸、曱氧基丁基過氧化二碳酸、雙（3-甲基-3-甲氧基丁基）過氧化二碳酸、過氧化新戊酸叔丁酯、過 氧第三丁酯-2-乙基已酸酯、三級丁基過氧化異丁酸酯、三級 丁基過氧化月桂酸、三級丁基過氧化異丙烯基單碳酸鹽、過氧 三級丁酯2-乙基已基單碳酸鹽、三級丁基過氧乙酸、三級丁基 過氧化苯甲酸、a，af-雙（過氧化新癸酰基）二異丙苯、異丙苯基 過氧化新癸酸、1，1，3,3-四甲基丁基過氧化新癸酸、1-環己基 1-甲基乙基過氧化新癸酸、三級已基過氧次葵酸、三級已基過 氧化三甲基乙酸、1，1,3,3-四甲基丁基過氧化2-乙基已酸酯、 2,5-二曱基-2,5-雙（2-過氧化乙基己酰基）己烷、1-環己基1-甲 基乙基過氧化-2-乙基已酸酯、三級已基過氧化-2-乙基已酸 酯、三級已基過氧化異丙烯基單碳酸鹽、過氧三級丁酯-3,5,5-三甲基已酸酯、2,5-二曱基-2,5-雙（m-過氧化甲基苯甲酰）己 烷、叔己過氧化苯甲酸、2,5_二曱基_2,5_雙（過氧化苯甲醯）己 烷、1，1_雙（叔己過氧化）-3,3,5-三甲基環己烷、1，1-雙（叔己過 12 200842180 氧化）環己烷、丨，1·雙（叔己過氧化）-3,3,5-三甲基環己烷、ι，“ 雙（過氧第三丁酯）環己烷、n_丁基_4,4-雙（過氧三級丁酯）戊菊 酉旨（valarate)、β，α雙（過氧二級丁 ®9)二異丙苯、異丙笨過氧 化物、三級丁基異丙笨過氧化物、二-三級丁基過氧化物、2,5-二曱基_ 2 5 -雙（過氧二級丁酉旨）己快-3寻。 決定有機過氧化物的量’使其落於提供平衡的硬化性質及 組成的完整的範圍内。於本發明中’相對於100重量分的具有 重量平均分子重量為約100至約1〇〇〇〇以及具有丙烯酸酯或甲 基丙烯酸酯功能基的熱固性材料，有機過氧化物的量較佳地為 0.3至10重量分。當有機過氧化物的量小於0.3重量分時，因 低的硬化率而使低溫快速硬化性質減小。且，當其量超過1〇重 畺刀日守，至溫穩疋及元整會惡化，且因過度硬化於重工時此組 成可能會完全地被移除。 於本發明的實施例中，矽烷連接劑（4)改善具有不同分子重 里及性質的不同樹脂間的反應性，改善包括銅、玻璃等之非有 j粒子表面的黏著性，因而改善耐熱性及耐濕性並加強接觸可 靠性。石夕烧連接劑並沒有特別地加以限制，可以使用一般常用 的矽烷連接劑。較佳地，可以使用一或以上的具有乙烯基、環 氧基、甲基丙烯酰氧基、丙烯酰氧基、胺基、脲基、氯丙烯 基、巯基、硫橋（SUlfido)基或異氰基的矽烷連接劑。相對於具 有重量平均分子重量為約150000至約6〇〇〇〇〇的熱塑性樹脂 (1);具有重量平均分子重量為約100至約1〇〇〇〇以及具有丙 烯酸醋或甲基_酸!旨功能基的熱固性材料⑺；有機過氧化物 13 200842180 (3)，矽烷連接劑的量較佳地為0.2至10重量分。當矽烷連接 劑的量小於0.2重量分係不足以扮演連接劑的角色；當矽烷連 接劑的量超過10重量分，樹脂的内聚性（cohesiveness)降低因 而減少黏著性或可靠性。 使用導電粒子以改善非等向性導電膜組成的導電性質。可 以使用各種的習知的導電粒子並不加以限定。較佳地可以使用 一或以上的下述粒子：包含金、銀、錄、銅、錫或錫料等的金 屬粒子；碳粒子；塗布金、銀 '錄、銅、錫或錫料等金屬的樹 脂或改質的該些樹脂，該些樹脂包含安息香鳥嘌呤、聚甲基丙 烯酸甲酯（PMMA)、丙烯酸系共聚物、聚苯乙烯等；以及利用 進一步塗布絕緣粒子或絕緣膜於其上而被進行絕緣處理的上述 導電粒子。 導電粒子的尺寸約1至3um，取決於對應電路的間隔尺 寸。亦能夠使用不同尺寸的粒子的組合。 相對於具有重量平均分子重量為約150000至約600000的 熱塑性樹脂（1);具有重量平均分子重量為約1〇〇至約10000 以及具有丙烯酸酯或甲基丙烯酸酯功能基的熱固性材料（2);有 機過氧化物（3);矽烷連接劑（4)，導電粒子的量較佳地為0.2至 30重量分。當導電粒子的量小於0.2重量分係不足以改善導電 性質；當導電粒子的量超過30重量分，不足以提供絕緣性。 本發明之非等向性導電膜組成，在不影響其基本性質情況 下，能夠更包含例如聚合起始劑、抗氧化劑、熱穩定劑等的添 加物，用以為非等向性導電膜組成增加額外的性質。 14 200842180 能夠使用於此領域習知的聚合起始劑並不加以限定，較佳 地可以使用一或以上的苯二S分、苯二紛一曱基醚、對對苯S昆、 硫二苯胺及其組合。 而且，可以加入抗氧化劑以防止因熱所造成之組成的氧化 及提供熱穩定性。並無特別地限定，抗氧化劑的示例包含：四-(亞甲-(3,5-二-三級丁基-4·氫化桂皮酸）甲烷、3,5-雙（1，1-二 甲基乙基）-4-羥苯丙酸硫醇二-2，1-乙烯氧亞乙基酯、十八烷 3,5-二-三級丁基-4-羥基氫化桂皮酸（可自Ciba的商業化產品購 得）、2，6-二-三級-對-甲苯酚等。相對於具有重量平均分子重量 為約100至約10000以及具有丙烯酸酯或甲基丙烯酸酯功能基 的熱固性材料（2);有機過氧化物（3)，能夠單獨地或組合二種 或以上地使用上述添加物，其含量約〇.〇3至0.3重量分。添加 物的含量小於約0.03重量分時無法得到想要的性質；而添加物 的含量大於約〇. 3重量分時基本性可能會受損。 本發明之組成，能夠在不需特別設備或裝置情況下，透過 本發明所屬領域所習知的一般調備方法，來調備非等向性導電 膜。 一示例方法能夠包含··將本發明之組成溶解於如甲苯之一 般溶劑，以獲得一液體溶液；於導電粒子保持完整（無破裂）的 速度範圍内，攪拌此液體溶液一預定時間；將此液體溶液使其 具10至15um厚度地塗布於一釋放膜；以乾燥程序蒸發有機溶 劑一預定時間以獲得具單層結構的非等向性導電膜。 取決於使用方式，上述程序可能重復二次或以上，以獲得 15 200842180 具有兩層或多層結構的疊層膜。 有機溶劑可以為一或以上的甲苯、二甲苯、丙二"_ 酸酯、苯、丙酮、丁酮、四氫呋喃、二甲基甲醛、環己_等。 由依據本發明之實施例的非等向性導電膜組成所調製的非 等向性導電膜’具有至少2〇 gf/_2的屈服應力及至少300% 的破裂應變。 要將塗布非等向性導電膜組成的膜切開成具有預定寬度， 而要具有適足的機械性質。而且’對於在模組製造線上的電路 連接程序，切斷性質、前接合不良情況下的重工等程序需要良 好的機械性質。此種機械性質包含屈服應力及破裂應變等。 於下述中，將藉由實施例更清楚地說明本發明，但下述實 施例僅用於說明本發明，且本發明不限定於該些實施例。 貫 例 1 .將 80g 的叛基丁腈（Carb〇Xylated aCryl〇nitrile butadiene)(l〇72CGX，Zeon Chemicals，重量平均分子重量為 204,400)溶解於甲苯/甲基乙基酮（2/1重量比）的混合液劑，使 其具有24%的固體含量。 接著’加入溶解於甲基乙基酮具有60%的固體含量的75g 的雙驗A型環氧丙稀酸酯樹脂（VR60，Showa Highpolymer Co·，LTD.，重量平均分子重量為7,500)，並加入45g之具有重 量平均分子重量為2500(下式結構式（1))的丙烯酸酯樹脂。 分別加入13g及4g之具有三丙烯酸酯功能基的季戊四醇 二丙烯酸醋（平均分子重量為298)及2_丙烯醯氧乙基磷酸酯（平 16 200842180 均分子重量為196)。加入4g之溶解於甲苯並具有1〇%固體含 量的過氧化苯甲醯。 加入1.7g之具有甲基丙烯酰氧基縮水甘油醚氧基丙基 三甲氧基矽烧）的石夕烧連接劑，以及19g的鎳（Ni)粒子，以獲得 非等向性導電膜組成。 〇 〇H CH3 CH3 ch3 oh 〇 CH2=CH-C-〇-CH2-CH-CH2-〇-CH-CH2-〇—<^〇)— c —(〇^>— 〇-CH3-CH-〇-CH2-CH--CH2-〇-C-CH=CH2 CHs 結構式1 實施例2 :除了使用80g之羧基丁腈共聚物（N34, Zeon Chemicals，重量平均分子重量為236,400)，其溶解於甲苯/甲 基乙基酮（2/1重量比）的混合液劑並具有24%的固體含量，而 非使用羧基丁腈共聚物（1072CGX，Zeon Chemicals，重量平均 分子重量為204,400)之外，其他依據實施例1之方法來調備非 等向性導電膜組成。 實施例3 :除了使用80g之丙烯酯橡膠（SG-80H，Nagase Chemtex，重量平均分子重量為350,000)，其溶解於曱基乙基酮 並具有26%的固體含量，而非使用羧基丁腈共聚物（1072CGX， Zeon Chemicals，重量平均分子重量為204,400)之外，其他依 據實施例1之方法來調備非等向性導電膜組成。 實施例4 ··除了使用80g之丙烯酯橡膠（WS-023, Nagase Chemtex,重量平均分子重量為500,000)，其溶解於甲苯/乙酸 乙酯的混合液劑並具有20%的固體含量，而非使用羧基丁腈共 聚物（1072CGX，Zeon Chemicals，重量平均分子重量為 17 200842180 204,400)之外，其他依據實施例1之方法來調備非等向性導電 膜組成。 對比實施例1 :將75g的雙酚A型環氧丙烯酸醋樹脂 (VR60，Showa Highpolymer Co” LTD·，重量平均分子重量為 7,500)溶解於曱基乙基酮，使其具有60%的固體含量。加入 50g之具有重量平均分子重量為2500(結構式（1))的丙婦酸醋樹 脂。 分別加入13g及4g之具有二丙稀酸醋功能基的季戊四醇 三丙烯酸酯（平均分子重量為298)及2-丙烯醯氧乙基碟酸g旨（平 均分子重量為196)。加入〇.6g之溶解於甲苯並具有i0〇/〇固體 含量的過氧化苯甲醯。 加入1.7g之具有甲基丙烯統氧基（3-縮水甘油_氧基丙基 三甲氧基矽烷）的矽烷連接劑，以及19g的鎳（Ni)粒子，以獲得 非等向性導電膜組成。 對比實施例2 :除了使用8〇g之笨氧基樹脂（E1256, Japan Epoxy Resin，重量平均分子重量為59,400)，其溶解於甲基乙 基酮並具有39%的固體含量，而非使用羧基丁腈共聚物 (1072CGX，Zeon Chemicals，重置平均分子重量為 2〇4,400)之 外，其他依據實施例1之方法來調備非等向性導電膜組成。 對比貫施例3 ·除了使用80g之本氧基樹脂（E4257，Japan Epoxy Resin，重量平均分子重量為73,800)，其溶解於甲基乙 基酮並具有40。/。的固體含量，而非使用羧基丁腈共聚物 18 200842180 (1072CGX，Zeon Chemicals，重量平均分子重量為2〇44〇〇)之 外，其他依據貫施例1之方法來調備非等向性導電膜組成。 對比實施例4 :除了使用80g之丙烯酯橡膠（SG708-6, Nagase Chemtex，重量平均分子重量為7〇〇 〇〇〇)，其溶解於甲 基乙基酮並具有19%的固體含量，而非使用羧基丁腈共聚物 (1072CGX，Zeon Chemicals，重量平均分子重量為 2〇4,4〇〇)之 外，其他依據實施例1之方法來調備非等向性導電膜組成。 對比實施例5 ·除了使用8〇g之丙烯酯橡膠（S(3P3, Nagase Chemtex，重量平均分子重量為85〇 〇〇〇)，其溶解於甲 基乙基酮並具有14%的固體含量，而非使用羧基丁腈共聚物 (1072CGX，Zeon Chemicals，重量平均分子重量為2〇44〇〇)之 外，其他依據實施例1之方法來調備非等向性導電膜組成。 對比實施例6 ·除了使用1 〇0g之胺甲酸乙酯樹脂⑴乂― 3204, Nippon Kayaku，重量平均分子重量為u，5〇〇)，而非使 用具有75 00至2500重量平均分子重量的丙烯酯橡膠之外，其 他依據實施例1之方法來調備非等向性導電膜組成。 利用塗膜刮刀（casting knife)將每一個實施例及對比實施 例應用於矽氧處理聚酯上。於將溶劑乾燥（置於8(rc之烤箱5 分鐘）後，得到厚度為30至50um範圍的膜。將此膜切開成具 有1.5mm的寬度用以進行測試。 評估非等向性導電膜組成及非等向性導電膜 (1)評估非等向性導電膜組成： 19 200842180 為使非等向性導電膜組成能夠商業化地調備成膜，包含於 該組成的樹脂需要良好地混合，以得到均句的混合物。且，粒 子應沒有聚集地被散佈，用以提供xy平面的絕緣性及z軸的導 電性。甚者，僅在使組成置放約6小時而未發生導電粒子的沈 澱時，能夠使膜塗布超過300m或以上的程度。在膜塗布過程 中，應沒有針孔或刮痕的形成。 膜塗布性質、組成均勻性、導電粒子的散布、導電粒子的 沈殿，係於組成調備後利用感官試驗6小時來加以評估。計分 方式如下5-4為良好；3為中等；2-1為低。 (2) 評估非等向性導電膜： 利用萬能試驗機（Universal Testing Machine，UTM，型號 H5KT)來測量實施例及對比實施例所調備的非等向性導電膜的 屈服應力及破裂應變。從非等向性導電膜剝離聚酯膜後，實行 里規長度為l〇mm及速度為50mm/min的拉伸試驗。破裂應變 由下述公式來計算。利用在對應50%屈服應力之點的拉伸長 度’來獲得破裂應變，其中於該點時破裂會因橡膠性質而阻 滯。 破裂應變（％)=(L-L0)/L0 X 1〇〇 L為拉伸長度；l〇為初起長度（1〇mm) (3) 評估非等向性導電膜的黏著性及接觸電阻： 使用PCB及COF來評估由實施例及對比實施例所調備之 非等向性導電膜的電路連接成效。使每一調備得的膜置放於室 20 200842180 溫1小時。於8〇〇c A膜移广〜 乂 MPa情況下進行後接合後，將 基膜移除。於l80〇c、5耖;5 1 τ 〇 4,1 m . Pa情況下進行主接合。將獲 付木P口利用900黏著強度試驗測旦、 接荖，於蔣# u 1 、j里初始接觸電阻及黏著強度。 接者於將樣卩口放置於85。(：及相、H & ,nn ? 夂相對濕度RH85%下250小時及 500小犄後，進行接觸電阻的測量。 f 導賴的評估 ' ----__Productivity and excellent adhesion and contact resistance even with short-circuit connections (4). [Prior Art] In general, an anisotropic conductive film refers to a film-based adhesive in which conductive particles are dispersed, and the conductive particles are, for example, metal particles such as nickel or gold or high coated with the metals. Molecular particles. When the anisotropic conductive film is placed between the electronic components for assembly, heat and pressure are applied under predetermined conditions, and electrical contacts are formed between the electronic components by the conductive particles. 1. The space between the electronic components is filled with insulating adhesive resin, which is used to provide good insulation. Non-isotropic conductive films are widely used for electrical connection, such as wafers on the film (10) P film, C〇F) liquid crystal display, tape and reel package (four) e (10) such as paekages, TCPs), printed circuit boards (PCBs) Wait. As liquid crystal displays become larger and thinner, the spacing between electrodes and circuits is also smaller. Non-isotropic teleporting +# The important role of the conductive film deduction is to be used as a method of connecting small-sized circuit components. Therefore, 韭笪 匕 寺 向 导电 导电 导电 导电 导电 导电 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 6 200842180 The conventional anisotropic conductive film can be classified into an epoxy-curable type containing an epoxy-based or fluorene-based resin mixed with an adhesive; and a radical-hardening type containing a radical polymerizable low Polymers, monopolymers and free radical initiators. Conventional non-isotropic conductive films exhibit good long-term reliability or hardening speed, but are not capable of providing good quality and productivity in mass production. In addition, mechanical properties and post-hardening properties tend to be poor. Defects often occur on manufacturing lines. When the productivity is improved and the circuit connection time is shortened, long-term reliability and stable adhesion cannot be obtained. More specifically, the conventional epoxy-hardenable anisotropic conductive film may exhibit insufficient viscosity, resulting in an increase in defects upon post-bonding and deterioration in reworkability after hardening. In addition, since the reaction temperature is extremely high, the control of the program and the holding device are difficult to maintain. Moreover, the conventional free radical-curing anisotropic conductive film has a problem in that the reaction rate is lowered to secure the conductive particles and circuit components. Inter-contact, bonding resin and hardener may have different flow properties due to different rheological properties, thus causing excessive bubble generation, which may result in a reduction in long-term reliability. Conversely, when the reaction rate is increased, the contact between the conductive particles and the circuit components may be insufficient, resulting in low contact reliability and excessive hardening, which may also cause a problem of reworkability. Attempts have been made to solve the above problems and improve the reworkability by introducing a thermoplastic resin, but it is not easy to obtain a good compatibility with a hardening system and an appropriate film strength and strain. Furthermore, the shrinkage and expansion of the thermoplastic resin are not easily controlled, and the thermoplastic resin may exhibit a hardening reaction in a low temperature process, which significantly reduces reliability in a hot and humid environment due to 7 200842180. [Summary of the Invention] The purpose of the tribute is to provide a semi-heat-solid, non-defective, U-shaped conductive film. Good coating quality and good quality for film formation and cutting. Production of sputum, and the provision of Γ group of productive non-(four) conductive gambling. /, (4) (4) and the composition of the semi-thermoset non-isotropic conductive film of the present invention, which comprises (1) and has a weight == a thermoplastic of about 5 ° _ to about __ - I, ~ knife The weight is from about 100 to about 10,000, and a thermosetting material having a fluorene acrylate or methacrylic functional group; (3) an organic peroxide; (4) a decane coupling agent; and (5) conductive particles. The present invention relates to an anisotropic conductive film formed of the above composition. [Embodiment] The exemplary embodiments of the present invention will be described in more detail below, but other sadness of the present invention can be implemented in different forms, and therefore should not be interpreted as being limited thereto. The examples mentioned. Rather, these embodiments are provided so that this disclosure will be <RTI ID=0.0> The composition of the anisotropic conductive film provided by the present invention comprises: (1) a thermoplastic having a weight average molecular weight of about 150,000 to about 600,000. 200842180 (2) having a weight average molecular weight of about 100 Up to about 10,000; and a thermosetting material having an acrylic acid S or a thioglycolate functional group; (3) an organic peroxide; (4) a decane linking agent; and (5) conductive particles. The thermoplastic resin (1) is a matrix which is required for film formation, and can be a polymer weight thermoplastic resin, but is not particularly limited. For example, at least two kinds of olefin resins, acryl rubber, butadiene resin, acrylonitrile butadiene copolymer, carbonized propylene nitrile copolymer, polyvinyl butyral resin, phenoxy can be used alone or in combination. Resin, and / or epoxy resin. The chloroprene resin is not suitable for the above applications because the chloride ions generated in the program may erode the circuit components. The polymer weight thermoplastic resin is well adapted to the resin contained in the composition of the anisotropic conductive film, prevents the precipitation of the conductive particles, and is subjected to the yield stress and the strain strain of the appropriate film, thereby providing a good circuit connection. Heavy work. In addition, with good bonding properties, the thermoplastic resin imparts good adhesion and adhesion to the anisotropic conductive film by heating and pressurizing and connecting through the circuit, thereby ensuring good connection of the circuit components. Preferably, the thermoplastic resin has a weight average molecular weight of from about 150,000 to about 600,000. When the weight average molecular weight of the thermoplastic resin is less than about 150,000, an adequate film strength and rupture strain cannot be obtained, and the conductive particles 9 200842180 may be severely precipitated in the composition. When the weight average molecular weight of the thermoplastic resin is higher than about 600,000, phase separation may occur during preparation of a composition of a non-isotropic conductive film due to reduced compatibility, adhesion of the adhesive is lowered, and long-term contact is caused. Reliability can be exacerbated by excessive shrinkage and expansion. The thermosetting material (2) serves as a curing system at the time of curing reaction, thereby ensuring adhesion between the circuit components and contact reliability. The anisotropic conductive film composition of the present invention comprises a thermosetting material having a weight average molecular weight of from about 100 to about 10,000; and having an acrylate and methacrylate functional group, thereby capable of forming a dense hardened structure. A curing system comprising a thermosetting material can perform circuit connection in a short period of time, thereby giving good anisotropic conductivity to the anisotropic conductive film. When the weight average molecular weight of the thermosetting material is less than about 1 Torr, it is not suitable due to the high reaction rate. When the weight average molecular weight of the thermosetting material is higher than about 10,000, a densely-cured structure may not be obtained even by heat and pressure, which may cause long-term contact and reliability of adhesion. To provide a reference, when the molecular weight based on the structural formula is less than about 400, the average molecular weight calculation of this small molecular weight thermosetting material by colloidal dialysis chromatography (GPC) gives a large error. Therefore, in this case, the molecular weight based on the molecular structure is considered as the average molecular weight. The thermosetting material having a weight average molecular weight of from about 100 to about 10,000; and having a acrylate and methacrylate functional group can be any one or more of a polymer, an oligomer, and a single molecule. The thermosetting material is not particularly limited, and a thermosetting material for this purpose may be used: a polymer, an oligomer or a single component 10 200842180 which has, for example, an acrylic acid, an acrylic acid, an acrylic acid, an acrylic acid, and an acrylic acid. Butyl ester, ethylene glycol diacrylate, diethylene glycol diacrylate, trimethylpropane triacylate, tetramethoxymethyltetraacetic acid, 2-iso-1,3 diacryloyl Oxypropane, 2,2-o[4-(acryloyloxypolymethoxy)phenyl]propane, 2,2-o[4-(acryloyloxypolyethoxy)phenyl]propane, acrylic acid Bicyclic: a functional group of a pentenyl ester, a tricyclodecyl acrylate, or a tris(acryloyloxyethyl)isocyanate. The above may be used singly or in combination of two or more. And for improvement, good adhesion and room temperature stability, it is possible to use an acrylate or methacrylate having a phosphate structure, such as 2-mercaptoacryloyloxyethyl phosphate, 2-acryloyloxyethyl phosphate Ester and the like. In an embodiment of the invention, the thermoplastic resin having a weight average molecular weight of from about 150,000 to about 600,000, having a weight average molecular weight of from about 100 to about 10,000 and having an acrylate or methacrylic acid, relative to 1 part by weight. The ester functional group thermosetting material preferably has a content of from 100 to 400 parts by weight. In other words, a thermoplastic resin having a weight average molecular weight of from about 150,000 to about 600,000; and a weight ratio of a thermosetting material having a weight average molecular weight of from about 100 to about 10,000 and having an acrylate or methacrylate functional group The good location is in the range of 20:80 to 50:50. When the content of the thermosetting material exceeds 400 parts by weight with respect to 100 parts by weight of the thermoplastic resin, the reworkability thereof is reduced after heating and pressurization. When the content of the thermosetting material is less than 100 parts by weight with respect to 100 parts by weight of the thermoplastic resin, the hardening density is relatively reduced to cause a decrease in contact reliability. The organic peroxide (3) acts as a thermal hardening initiator. The organic 11 to be used in the present invention is not particularly limited, and a general organic peroxide can be used. For example, one or more diacyl peroxides, peroxydicarbonates, peroxyesters, peroxyketals and/or dialkyl peroxides may be used. Examples of organic peroxides include isobutyl peroxide, 3,5,5-trimethylhexanoyl peroxide, dodecyl peroxide, stearic acid peroxide, and glass-coated peroxide , m-toluidine/benzamide peroxide, benzamidine peroxide, di-n-peroxydicarbonate C, peroxydicarbonate diisopropyl, peroxydicarbonate (third grade) Butylcyclohexyl)S, di-2-ethoxyethyl peroxydicarbonate, di-2-ethoxyethyl peroxydicarbonate, nonyloxyperoxydicarbonate, bis ( 3-methyl-3-methoxybutyl)peroxydicarbonate, t-butyl peroxypivalate, peroxy-tert-butyl ester-2-ethylhexanoate, tert-butyl peroxyisobutylate Acid ester, tertiary butyl peroxide lauric acid, tertiary butyl peroxyisopropenyl monocarbonate, peroxytributyl butyl 2-ethylhexyl monocarbonate, tertiary butyl peroxyacetic acid, three Butyl butyl peroxide, a, af-bis(peroxynonanoyl) diisopropylbenzene, cumene peroxy neodecanoic acid, 1,1,3,3-tetramethylbutyl peroxidation Neodecanoic acid, 1-cyclohexyl 1-methylethyl peroxidation Citrate, tertiary hexyl peroxy acid, tertiary hexyl peroxytrimethylacetate, 1,1,3,3-tetramethylbutyl peroxy 2-ethyl hexanoate, 2,5 -Dimercapto-2,5-bis(2-peroxyethylhexanoyl)hexane, 1-cyclohexyl 1-methylethylperoxy-2-ethylhexanoate, tertiary hexyl peroxidation 2-ethylhexanoate, tertiary hexyl peroxyisopropenyl monocarbonate, peroxytributyl butyl ester-3,5,5-trimethyl hexanoate, 2,5-dimercapto- 2,5-bis(m-peroxymethylbenzoyl)hexane, tert-hexylperoxybenzoic acid, 2,5-dimercapto-2,5-bis(benzophenone)hexane, 1 , 1_bis(t-hexylperoxy)-3,3,5-trimethylcyclohexane, 1,1-double (t-hexyl peroxide 12 200842180 oxidized) cyclohexane, hydrazine, 1·double (unclear Oxidation)-3,3,5-trimethylcyclohexane, ι, "bis(peroxy-tert-butyl ester) cyclohexane, n-butyl-4,4-bis(peroxy-tertiary butyl ester) Valarate, β,α-bis(peroxy-dibutyl®9) diisopropylbenzene, isopropyl peroxide, tertiary butyl isopropyl peroxide, di-tertiary butyl Peroxide, 2,5-dimercapto _ 2 5 -double (peroxy The level of the organic peroxide is determined to be within the complete range of hardening properties and composition providing equilibrium. In the present invention, the weight average molecule is relative to 100 parts by weight. The amount of the organic peroxide is preferably from 0.3 to 10 parts by weight, based on the weight of from about 100 to about 1 Torr, and the thermosetting material having an acrylate or methacrylate functional group. When the amount of the organic peroxide is less than At 0.3 parts by weight, the low-temperature rapid hardening property is reduced due to the low hardening rate, and when the amount exceeds 1 〇, the boring knife is kept, the temperature is stable and the element is deteriorated, and it is excessively hardened during heavy work. This composition may be completely removed. In the embodiment of the present invention, the decane coupling agent (4) improves the reactivity between different resins having different molecular weights and properties, improves the adhesion of non-j particles including copper, glass, etc., thereby improving heat resistance and Moisture resistance and enhanced contact reliability. The Shihua burning connector is not particularly limited, and a commonly used decane coupling agent can be used. Preferably, one or more of having a vinyl group, an epoxy group, a methacryloxy group, an acryloyloxy group, an amine group, a urea group, a chloropropenyl group, a fluorenyl group, a sulfur bridge group or a different group may be used. A cyano decane linker. The thermoplastic resin (1) having a weight average molecular weight of from about 150,000 to about 6 Å; having a weight average molecular weight of from about 100 to about 1 Torr and having acrylated acid or methyl-acid! The functional group-based thermosetting material (7); the organic peroxide 13 200842180 (3), the amount of the decane coupling agent is preferably 0.2 to 10 parts by weight. When the amount of the decane coupling agent is less than 0.2 parts by weight, it is insufficient to function as a binder; when the amount of the decane coupling agent exceeds 10 parts by weight, the cohesiveness of the resin is lowered to thereby reduce the adhesion or reliability. Conductive particles are used to improve the conductive properties of the anisotropic conductive film. Various conventional conductive particles can be used without limitation. Preferably, one or more of the following particles may be used: metal particles comprising gold, silver, nickel, tin, tin or tin; carbon particles; metals coated with gold, silver, copper, tin or tin. a resin or a modified resin comprising benzoin guanine, polymethyl methacrylate (PMMA), an acrylic copolymer, polystyrene, etc.; and further coating an insulating particle or an insulating film thereon The above-mentioned conductive particles subjected to insulation treatment. The size of the conductive particles is about 1 to 3 um, depending on the spacing of the corresponding circuits. Combinations of particles of different sizes can also be used. a thermoplastic resin (1) having a weight average molecular weight of from about 150,000 to about 600,000; a thermosetting material having a weight average molecular weight of from about 1 Torr to about 10,000 and having an acrylate or methacrylate functional group (2) The organic peroxide (3); the decane coupling agent (4), the amount of the conductive particles is preferably from 0.2 to 30 parts by weight. When the amount of the conductive particles is less than 0.2 part by weight, the conductive property is insufficient; when the amount of the conductive particles exceeds 30 parts by weight, it is insufficient to provide insulation. The composition of the anisotropic conductive film of the present invention can further comprise an additive such as a polymerization initiator, an antioxidant, a heat stabilizer or the like to increase the composition of the anisotropic conductive film without affecting its basic properties. Extra nature. 14 200842180 A polymerization initiator which can be used in the art is not limited, and preferably one or more benzene di S, benzodiazepine, p-p-benzoquinone, thiodiphenylamine can be used. And their combinations. Moreover, an antioxidant may be added to prevent oxidation of the composition due to heat and to provide thermal stability. There is no particular limitation, and examples of the antioxidant include: tetrakis-(methylene-(3,5-di-tri-butyl-4-hydrogenated cinnamic acid) methane, 3,5-bis (1,1-dimethyl) Ethyl ethyl)-4-hydroxyphenylpropionic acid thiol di-2,1-ethylene oxyethylene ester, octadecan 3,5-di-tertiary butyl-4-hydroxyhydrocinnamic acid (available from Ciba Commercially available products, 2,6-di-tris-p-cresol, etc. relative to thermosetting materials having a weight average molecular weight of from about 100 to about 10,000 and having acrylate or methacrylate functional groups (2) The organic peroxide (3) can be used singly or in combination of two or more kinds in an amount of about 〇3 to 0.3 parts by weight, and the content of the additive is less than about 0.03 part by weight. The desired properties are obtained; and the content of the additive is greater than about 〇. 3 parts by weight may be impaired in basicity. The composition of the present invention can be known in the art to which the present invention pertains without the need for special equipment or devices. A general preparation method for preparing an anisotropic conductive film. An exemplary method can include dissolving the composition of the present invention in, for example, toluene a solvent is generally obtained to obtain a liquid solution; the liquid solution is stirred for a predetermined time within a speed range in which the conductive particles remain intact (no cracking); the liquid solution is applied to a release film with a thickness of 10 to 15 μm; The drying process evaporates the organic solvent for a predetermined time to obtain an anisotropic conductive film having a single layer structure. Depending on the mode of use, the above procedure may be repeated twice or more to obtain 15 200842180 laminated film having a two-layer or multi-layer structure The organic solvent may be one or more of toluene, xylene, propylene carbonate, benzene, acetone, methyl ethyl ketone, tetrahydrofuran, dimethyl formaldehyde, cyclohexane, etc. by a non-according to an embodiment of the present invention. The isotropic conductive film composition of the modulated anisotropic conductive film has a yield stress of at least 2 〇 gf / _2 and a fracture strain of at least 300%. The film coated with the non-isotropic conductive film is cut into a predetermined one. Width, but to have adequate mechanical properties. And 'for the circuit connection program on the module manufacturing line, the nature of cutting off, heavy work before the poor joints and other procedures Good mechanical properties are required. Such mechanical properties include yield stress and rupture strain, etc. In the following, the invention will be more clearly illustrated by the examples, but the following examples are merely illustrative of the invention, and the invention Not limited to these examples. Example 1. 80 g of Carb〇Xylated aCryl〇nitrile butadiene (l〇72CGX, Zeon Chemicals, weight average molecular weight 204,400) was dissolved in toluene/methyl b a mixture of ketone (2/1 by weight) having a solids content of 24%. Next 'Adding 75 g of double-type A-type epoxy propylene dissolved in methyl ethyl ketone with a solid content of 60% An acid ester resin (VR60, Showa Highpolymer Co., LTD., weight average molecular weight: 7,500) was added, and 45 g of an acrylate resin having a weight average molecular weight of 2,500 (formula (1)) was added. 13 g and 4 g of pentaerythritol diacrylate acrylate having a triacrylate functional group (average molecular weight of 298) and 2 propylene oxyethyl phosphate (P. 16 200842180, molecular weight of 196) were separately added. 4 g of benzammonium peroxide dissolved in toluene and having a solids content of 1% by weight was added. 1.7 g of a methacryloyloxyglycidoxypropyltrimethoxysulfonate coupled with methacryloxyl glycidoxypropyltrimethoxysulfonate and 19 g of nickel (Ni) particles were added to obtain an anisotropic conductive film composition. 〇〇H CH3 CH3 ch3 oh 〇CH2=CH-C-〇-CH2-CH-CH2-〇-CH-CH2-〇—<^〇)— c —(〇^>—〇-CH3-CH- 〇-CH2-CH--CH2-〇-C-CH=CH2 CHs Structural Formula 1 Example 2: In addition to using 80 g of a carboxylated nitrile copolymer (N34, Zeon Chemicals, weight average molecular weight 236,400), it was dissolved in a mixed solution of toluene/methyl ethyl ketone (2/1 by weight) and having a solid content of 24%, instead of using a carboxylated nitrile copolymer (1072CGX, Zeon Chemicals, weight average molecular weight of 204,400), The composition of the anisotropic conductive film was adjusted according to the method of Example 1. Example 3: In addition to using 80 g of propylene ester rubber (SG-80H, Nagase Chemtex, weight average molecular weight: 350,000), it was dissolved in sulfhydryl groups. Ethyl ketone and having a solid content of 26%, instead of using a carboxylated nitrile copolymer (1072CGX, Zeon Chemicals, weight average molecular weight of 204,400), other methods according to Example 1 were used to prepare anisotropic conductivity Film composition. Example 4 · · In addition to using 80g of propylene ester rubber (WS-023, Nagase Chemtex, weight average molecular weight of 5 00,000), which is dissolved in a mixed solution of toluene/ethyl acetate and has a solid content of 20%, instead of using a carboxylated nitrile copolymer (1072CGX, Zeon Chemicals, weight average molecular weight: 17 200842180 204,400), The composition of the anisotropic conductive film was prepared according to the method of Example 1. Comparative Example 1: 75 g of bisphenol A type epoxy acrylate resin (VR60, Showa Highpolymer Co" LTD., weight average molecular weight of 7,500 It is dissolved in mercaptoethyl ketone to have a solid content of 60%. 50 g of a propylene glycol vinegar resin having a weight average molecular weight of 2,500 (formula (1)) is added, and 13 g and 4 g each have two A pentaerythritol triacrylate (average molecular weight of 298) and 2-propenyloxyethyl silicate acid (average molecular weight of 196) of acrylic acid functional group. 〇6g of dissolved in toluene and having i0〇 /〇 Solid content of benzamidine peroxide. Add 1.7 g of decane linker with methacryloxy (3-glycidyloxypropyltrimethoxydecane) and 19 g of nickel (Ni) particles To obtain an anisotropic guide Electrochemical film composition. Comparative Example 2: In addition to using 8 μg of a strepoxy resin (E1256, Japan Epoxy Resin, weight average molecular weight 59,400), it was dissolved in methyl ethyl ketone and had a solid content of 39%. Instead of using a carboxylated nitrile copolymer (1072CGX, Zeon Chemicals, with a reset average molecular weight of 2,4,400), the composition of the anisotropic conductive film was prepared in accordance with the method of Example 1. Comparative Example 3 - In addition to using 80 g of the present ethoxy resin (E4257, Japan Epoxy Resin, weight average molecular weight: 73,800), it was dissolved in methyl ethyl ketone and had 40. /. The solid content, instead of using the carboxylated nitrile copolymer 18 200842180 (1072CGX, Zeon Chemicals, weight average molecular weight 2〇44〇〇), other methods according to the method of Example 1 to prepare anisotropic conductivity Membrane composition. Comparative Example 4: In addition to using 80 g of propylene ester rubber (SG708-6, Nagase Chemtex, weight average molecular weight: 7 Å), it was dissolved in methyl ethyl ketone and had a solid content of 19%. An anisotropic conductive film composition was prepared in accordance with the method of Example 1 except that a carboxylated nitrile copolymer (1072CGX, Zeon Chemicals, weight average molecular weight: 2〇4, 4〇〇) was used. Comparative Example 5 - In addition to using 8 g of propylene ester rubber (S (3P3, Nagase Chemtex, weight average molecular weight: 85 Å), which was dissolved in methyl ethyl ketone and had a solid content of 14%, Instead of using a carboxylated nitrile copolymer (1072CGX, Zeon Chemicals, weight average molecular weight: 2〇44〇〇), the composition of the anisotropic conductive film was prepared according to the method of Example 1. Comparative Example 6 · In addition to using 1 〇0g of urethane resin (1) 乂 - 3204, Nippon Kayaku, weight average molecular weight is u, 5 〇〇), instead of using propylene ester rubber having an average molecular weight of 75 to 2500 Further, the composition of the anisotropic conductive film is prepared according to the method of Embodiment 1. Each of the examples and comparative examples was applied to a ruthenium-treated polyester using a casting knife. After drying the solvent (after placing in 8 (rc oven for 5 minutes), a film having a thickness of 30 to 50 um was obtained. The film was cut to have a width of 1.5 mm for testing. Evaluation of anisotropic conductive film composition And an isotropic conductive film (1) evaluation of the composition of the anisotropic conductive film: 19 200842180 In order to enable the composition of the anisotropic conductive film to be commercially prepared, the resin contained in the composition needs to be well mixed, To obtain a mixture of the average sentences, and the particles should be dispersed without aggregation to provide the insulation of the xy plane and the conductivity of the z-axis. Even, the composition is left for about 6 hours without the conductive particles. When precipitating, the film can be coated to a degree of more than 300 m or more. In the film coating process, there should be no formation of pinholes or scratches. Film coating properties, composition uniformity, dispersion of conductive particles, and sedimentation of conductive particles are attached. After the composition was prepared, it was evaluated by sensory test for 6 hours. The scoring method was as follows: 5-4 was good; 3 was medium; 2-1 was low. (2) Evaluation of anisotropic conductive film: Using Universal Testing Machine (Universal Testing) Machine UTM, model H5KT) was used to measure the yield stress and fracture strain of the anisotropic conductive film prepared in the examples and comparative examples. After peeling the polyester film from the anisotropic conductive film, the length of the gauge was l〇 Tensile test with mm and speed of 50 mm/min. The rupture strain is calculated by the following formula. The rupture strain is obtained by using the tensile length at the point corresponding to the 50% proof stress, at which point the rupture is due to the rubber property. The rupture strain (%) = (L-L0) / L0 X 1 〇〇 L is the tensile length; l 〇 is the initial length (1 〇 mm) (3) Evaluation of the adhesion of the anisotropic conductive film Properties and Contact Resistance: PCB and COF were used to evaluate the circuit connection performance of the anisotropic conductive films prepared by the examples and the comparative examples. Each prepared film was placed in the chamber 20 200842180 for 1 hour. The base film was removed after 8 〇〇c A film shifting ~ 乂 MPa, and the main film was removed at l80 〇 c, 5 耖; 5 1 τ 〇 4, 1 m. Pa. The wood P port will be used to measure the initial contact resistance and adhesion strength in the Jiang # u 1 , j by using the 900 adhesion strength test. The receiver is placed at 85. (: and phase, H & , nn ? 夂 relative humidity RH85% for 250 hours and 500 hours, the contact resistance is measured. --__
表2 黏著性 (gf/cm) 實施例1 ^04 非等向性導f膜的轉性及_電阻的評估Table 2 Adhesion (gf/cm) Example 1 ^04 Evaluation of the Transposition and _Resistance of Anisotropic Conductor Films
21 200842180 實施例2 612 0.98 1.01 ~~' 1.31 實施例3 517 1.11 1.28 1.51 實施例4 559 1.34 1.42 1.58 對比實施例1 196 1.18 1.84 4.12 對比實施例2 988 1.41 1.64 L86 對比實施例3 ------ 1.26 ----—--- 1.58 —---—-_ 1.73 對比實施例4 336 1.67 2.94 4.88 對比實施例5 304 2.87 3.74 12.25 對比實施例6 ^12 -----—-- 1.81 -———------- 2.12 ———-—-_ 5.21 如上所述，依據本發明的非等向性導電膜組成，展現良好 的組成均勻性及導電粒子散布性，因此展現良好的絕緣及可靠 的導電非等向性。因此，由於能夠避免導電粒子的沈澱，而能 夠進行長時期間的塗布。由於良好的膜塗布性質而能夠得到高 生產性及生產良率。此外，因具有至少20 gf/mm2的屈服應力 及至少300%的破裂應變，本發明之非等向性導電膜能夠提 供.於切割時之良好的生產性及生產良率、非等向性導電膜給 料程序時之良好的切割性質、當後接合失敗時之良好的重工 性。 由表2可知，依據本發明的非等向性導電膜，展現依短接 合程序（18(TC、5秒及3.0MPa)的至少500gf/cm之穩定的黏著 強度，以及初始為2.5Ω或小於2.5Ω的接觸電阻及於置放 85 C及RH 85 %下後為4 Ω或小於4 Ω的接觸電阻。因此，此 膜為驅動顯示裝置提供良好的電路連接性質及可靠度。 22 200842180 相反地，對比實施例1展現過多的粒子沈澱，且由於於膜 塗布時產生過多的針孔而無法得到均勻的塗布。甚者，膜強度 太低不能確保切割時的操作性。由於非均勻的膜性質，而不能 夠得到穩定的附著性及接觸電阻可靠性。 • 至於對比實施例2及3，係能夠調備少量的非等向性導電 * 膜，然而因為沈澱發生快速，不能夠得到超過300m或以上的 膜塗布。而且，由於使用具有低重量平均分子重量的脆性高分 f 子，以獲得足夠的膜強度，所得之膜具有小於300%的破裂應 變及不足的黏度。 至於對比實施例4及5，其中，使用具有重量平均分子重 量為700000和850000的熱塑性樹脂，因其不良的適應性無法 得到均勻的組成，且無法得到均勻的粒子散布。結果，非等向 性導電膜的塗布表面不均勻。關於電路連接，由於連接的結構 内部造成過多的收縮及擴張，使得黏著性不足，且接觸可靠度 降低。 / 9 至於對比實施例6，其中，熱固材料的重量平均分子重量 i 高於10000，於熱及濕情況下接觸電阻增加。 依據本發明實施例的非等向性導電膜組成，為塗布及膜形 成時的切割提供良好的生產性。且由該些實施例所調備的非等 向性導電膜，具有良好的切割性質、前接合性質、前接合重工 性，因此能夠改善模組製造線的模組生產性。再者，本發明的 非等向性導電膜，於電路連接程序時形成密集的硬化結構，因 此，展現良好的長期可靠性及穩定的黏著性。此外，由於能夠 23 200842180 利用加熱及加壓於短時間内完成電路連接，而能夠得到良好的 模組生產性。 本發明之示例的實施例已揭露於本說明書中，雖然使用有 特定的用語，但它們應被使用及解釋成上位的及描述性的，並 非用作限制的目的。因此，於此領域具有通常知識者，在未脫 離本發明如下申請專利範圍之範疇及精神下，係能夠進行各種 變化。 【圖式簡單說明】 【主要元件符號說明】21 200842180 Example 2 612 0.98 1.01 ~~' 1.31 Example 3 517 1.11 1.28 1.51 Example 4 559 1.34 1.42 1.58 Comparative Example 1 196 1.18 1.84 4.12 Comparative Example 2 988 1.41 1.64 L86 Comparative Example 3 ---- -- 1.26 -------- 1.58 —----- 1.73 Comparative Example 4 336 1.67 2.94 4.88 Comparative Example 5 304 2.87 3.74 12.25 Comparative Example 6 ^12 -------- 1.81 - - - - - 2.12 - - - - - 5.21. As described above, the composition of the anisotropic conductive film according to the present invention exhibits good composition uniformity and dispersibility of conductive particles, Shows good insulation and reliable electrical anisotropy. Therefore, since the precipitation of the conductive particles can be avoided, the coating for a long period of time can be performed. High productivity and production yield can be obtained due to good film coating properties. In addition, the anisotropic conductive film of the present invention can provide good productivity and production yield during cutting due to a yield stress of at least 20 gf/mm 2 and a fracture strain of at least 300%, and anisotropic conductivity. Good cutting properties in the film feeding procedure, good reworkability when the joint fails. As can be seen from Table 2, the anisotropic conductive film according to the present invention exhibits a stable adhesive strength of at least 500 gf/cm according to a short bonding procedure (18 (TC, 5 sec, and 3.0 MPa), and an initial 2.5 Ω or less. The contact resistance of 2.5Ω is 4 Ω or less than 4 Ω after placement of 85 C and RH 85 %. Therefore, this film provides good circuit connection properties and reliability for driving display devices. 22 200842180 Conversely Comparative Example 1 exhibited excessive particle precipitation, and uniform coating could not be obtained due to excessive pinholes generated during film coating. Moreover, the film strength was too low to ensure operability at the time of cutting. Due to non-uniform film properties It is not possible to obtain stable adhesion and contact resistance reliability. • As for Comparative Examples 2 and 3, a small amount of anisotropic conductive* film can be prepared, but since the precipitation occurs rapidly, it cannot be obtained more than 300 m or The above film coating. Moreover, since a brittle high-concentration f sub-particle having a low weight average molecular weight is used to obtain sufficient film strength, the resulting film has a fracture strain of less than 300% and insufficient viscosity. As for Comparative Examples 4 and 5, in which thermoplastic resins having a weight average molecular weight of 700,000 and 850,000 were used, a uniform composition could not be obtained due to poor adaptability, and uniform particle dispersion could not be obtained. The coated surface of the conductive film is not uniform. With regard to the circuit connection, excessive shrinkage and expansion due to the inside of the connected structure, the adhesion is insufficient, and the contact reliability is lowered. / 9 As for Comparative Example 6, wherein the thermosetting material is The weight average molecular weight i is higher than 10,000, and the contact resistance increases under heat and humidity. The composition of the anisotropic conductive film according to the embodiment of the present invention provides good productivity for coating and film formation. The anisotropic conductive film prepared by the embodiments has good cutting properties, front bonding properties, and front bonding reworkability, thereby improving module productivity of the module manufacturing line. Furthermore, the invention is not equivalent. The directional conductive film forms a dense hardened structure during the circuit connection process, thus exhibiting good long-term reliability and stable adhesion In addition, since module integration can be achieved by heating and pressurizing in a short time by 23 200842180, good module productivity can be obtained. Exemplary embodiments of the present invention have been disclosed in the present specification, although specific use is used. Terms, but they should be used and interpreted as generic and descriptive, and not for the purpose of limitation. Therefore, those skilled in the art, without departing from the scope and spirit of the following claims Various changes can be made. [Simple description of the diagram] [Description of main component symbols]
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