200845850 九、發明說明： 【發明所屬之技術領域】 本發明涉及一種電路板及其製作方法。 【先前技術】 防焊漆或防焊油墨（solder Mask or s〇ider Resist)，俗 稱”綠漆”，以環氧樹脂或感光樹脂為主要組份，其塗佈於 電路板表面，形成電路板之永久保護層。 ，防焊漆包括熱固型、紫外硬化型、感光顯影型等三種 類型。隨著電路板越來越薄，線寬距越來越細，防焊漆於 電路板尤其係軟性電路板中之作用就顯得越來越重要。防 焊漆層之主要功能為·· (1 )防焊，留出板上待焊之焊墊(Pad)將所有線路及 銅面都U住防止波料造成短路，並㈣、焊錫用量； 尸⑺4板’防止濕氣及各種電解質使線路氧化而危 。^性^並防止外來機械傷害以維持板面良好絕緣，· 3、％緣’保證電路板上所有線路間相互良好絕緣。 ☆惟，習知電路板製作過程中，防焊漆層之製作通常係 才木用感光顯影型防焊漆，經過塗佈、 ,、 尨唑^ ^ 頂烤、曝光、顯影、 烤^文子印刷等-系列步驟，於電路基板之 餘焊漆層：並留出物塾之位置。由於該 本。二条件稷雜，需要耗費較多時間與較高成 置之影中需要使用具有留出待焊谭塾之位 _片亚進彳了準確對位’ #線路越細焊墊越小時，底片 200845850 =作成本亦就越高’對位誤差亦越大，甚至還可能會有少 里t干=歹欠邊於焊墊上，以致於達不到電路板製作之精度 要求，無法適庫目箭古# t 應則回讼度電路板發展所需之焊墊尺寸 小、密度高之特點。 【發明内容】 ^ ;此S供種電路板及其製作方法，以節約電路 漆層製作之成本，縮短電路板防焊漆層製作之時間， 棱南電路板之焊墊密度實屬必要。 以下以實_說明-種電路板及其製作方法。 :斤述：路板之製作方法，其包括以下步驟：製作一線 ^ a ^ , 衣面叹有圖案化導體層，該圖 : = 包括複數個桿墊；於線路基板 體 利用雷射於該防谭漆層中門1者夺防焊漆層力口熱固化； 7于"'層中開故複數個與焊墊對應之焊墊 囪0 板至！包括線路基板及防焊漆層，該線路基 板至〆表面5又有圖案化導體；，社回也… 數個焊塾，防焊漆層設於線“板 面，遠防谭漆層開設有複數個與桿墊對應之 =200845850 IX. Description of the Invention: [Technical Field] The present invention relates to a circuit board and a method of fabricating the same. [Prior Art] Solder Mask or s〇ider Resist, commonly known as "green paint", is mainly composed of epoxy resin or photosensitive resin, which is coated on the surface of the circuit board to form a circuit board. Permanent protective layer. The solder resist paint includes three types: thermosetting type, ultraviolet curing type, and photosensitive developing type. As circuit boards become thinner and thinner, the line width becomes thinner and thinner, and the role of solder resists in circuit boards, especially in flexible circuit boards, becomes more and more important. The main function of the solder resist layer is · (1) soldering prevention, leaving the pad to be soldered on the board (Pad) to prevent all the lines and copper surfaces from being short-circuited, and (4), the amount of solder; (7) 4 plates 'prevent moisture and various electrolytes from oxidizing the line. ^ Sex ^ and prevent external mechanical damage to maintain good insulation of the board, · 3,% edge 'to ensure good insulation between all lines on the board. ☆However, in the process of manufacturing the circuit board, the solder resist layer is usually made of sensitized anti-welding paint for wood. After coating, carbazole ^ ^ top baking, exposure, development, baking, text printing Etc. - series of steps, the paint layer on the circuit board: and leave the position of the object. Because of this. The second condition is noisy, it takes a lot of time and the higher the formation of the shadow, the need to use the position to stay out of the soldering _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ = The higher the cost is, the larger the misalignment error is. Even the lesser t dry = 歹 owing on the solder pad, so that the accuracy of the board manufacturing is not met, and the library can not be adapted. # t The characteristics of the pad required for the development of the circuit board are small in size and high in density. [Summary of the Invention] ^ This S is used to provide a circuit board and a manufacturing method thereof, so as to save the cost of the circuit paint layer manufacturing and shorten the time for manufacturing the solder mask paint layer of the circuit board, the pad density of the prismatic circuit board is really necessary. The following is a description of the circuit board and its manufacturing method. : 斤 :: The method of making a road board, which comprises the following steps: making a line ^ a ^ , the surface of the clothing layer has a patterned conductor layer, the figure: = including a plurality of pole pads; using the laser in the circuit substrate body In the middle of the lacquer layer, the first part of the door is protected by a heat-curing layer of the solder resist layer; 7 is opened in the layer of the layer, and the number of pads corresponding to the pad is 0 to the board! Including the circuit substrate and the solder resist layer, the circuit substrate has a patterned conductor to the surface 5; the social back is also... Several soldering enamels, the solder resist layer is set on the line "plate surface, far away from the tan paint layer Multiple pairs corresponding to the pole pad =
焊墊窗之直徑大小範圍為〇.〇25 固所U 所述防焊漆層開設而成。G.15軸，其利用雷射燒餘 相對於先前技術，所述電路板製作過 射於防焊漆層進行燒蝕開設對應墊 2抓用田 ，不僅有效節约了電路板防焊本= 7 200845850 電路板防焊漆層製 上，從而有效提高 燒蝕之孔徑範圍較 提高焊墊設置密度 求。此外，採用柔 得該具有防焊漆層 電路板。 作^間’而且可避免防料❹於焊墊 了电路板料漆層製作精度。由於雷射 小，從而可於—定面積線路基板上大大 」有利於滿足電路板高密度化發展之需 初性能較佳之熱固性防焊漆為材料，使 之電路板之製作方法可更好應用於軟性 【實施方式】 案實施例提供之電路板及其 下面結合附圖對本技術方 ‘作方法作進一步說明。 路板!：併圖、1至圖4，本技術方案實施例提供之電 之衣作方法包括如下步驟。 第步，製作一線路基板10Θ，該線路基板1〇〇至少 一表面具㈣案化㈣層12G。 b 所製作之線路基板100可為硬性線路基板或軟性線路 ς板’，可為單層、雙層或多層板，可為單面板或雙面板。 :所衣作之線路基板100為單面板時，只於該線路基板丄⑻ 其中一個表面設有圖案化導體層120;當所製作之線路基 0為又面板日才，於該線路基板1⑻相對兩個表面都設 有Θ案化‘體層12〇。本實施例中，如圖i所示，所述線 路基板10(3為單層單面軟性線路基板。該線路基板1〇〇包 括基材110及設於該基材110表面之圖案化導體層120。 忒基材110為軟性基材’例如聚酿亞胺。該圖案化導體層 120為金屬銅箔，其包括複數個焊墊121，用於與外部電子 200845850 .性連接。該線路基板丄。。之製作 :員〜钱刻之方法於覆銅基板上製作出線路圖形，從而开^The diameter of the pad window is in the range of 〇.〇25 固固U. G.15 axis, which utilizes laser burnout relative to the prior art, the circuit board is made to pass through the solder resist layer for ablation to open the corresponding pad 2, which not only effectively saves the circuit board solder mask = 7 200845850 The circuit board is solder-proof lacquer layer, which effectively increases the aperture aperture range and improves the pad placement density. In addition, the circuit board with the solder resist layer is used in a flexible manner. It can be used to prevent the material from being printed on the circuit board. Because the laser is small, it can be used as a material to ensure the high-density development of the circuit board, which is better for the high-density development of the circuit board, so that the manufacturing method of the circuit board can be better applied. [Embodiment] The circuit board provided in the embodiment of the present invention and the method of the present invention are further described below with reference to the accompanying drawings. The circuit board!: and FIG. 1 to FIG. 4, the electric clothing manufacturing method provided by the embodiment of the present technical solution includes the following steps. In the first step, a circuit substrate 10 is formed, and at least one surface of the circuit substrate 1 has a (four) case (four) layer 12G. b The circuit substrate 100 can be made of a rigid circuit substrate or a flexible circuit board, which can be a single layer, a double layer or a multi-layer board, and can be a single panel or a double panel. When the circuit substrate 100 is a single panel, only one surface of the circuit substrate 丄 (8) is provided with a patterned conductor layer 120; when the fabricated circuit substrate 0 is a panel, the circuit substrate 1 (8) is opposite. Both surfaces are provided with a smattered 'body layer 12'. In this embodiment, as shown in FIG. 1, the circuit substrate 10 (3 is a single-layer single-sided flexible circuit substrate. The circuit substrate 1 includes a substrate 110 and a patterned conductor layer disposed on the surface of the substrate 110. 120. The base material 110 is a soft substrate, such as a poly-imine. The patterned conductive layer 120 is a metal copper foil, and includes a plurality of pads 121 for connection with external electrons 200845850. The production: the staff ~ money engraved method on the copper substrate to make the line graphics, thus open ^
採=圖案化導體層120之線路基板·。當然 才木用其他之方法進行製作。 J 面2二步，於線路基板_具有圖案化導體層120之表 面塗佈防焊漆形成防焊漆層13〇。 衣 之二=所示，於線路基板100具有圖案化導體層120 之表面㈣防焊漆。所㈣^焊耗蓋整 ⑽具㈣案化導體層⑽之表面，包括圖案化導體層= 以及攸圖案化金屬層12〇露出之美 曰 洗爲1 m斗 土材110，幵〉成一層防焊 該防焊漆層13G可採用熱㈣防料， 環氧基樹脂、氨基樹脂或聚甲基丙稀酸樹脂（壓 克力树月日）專熱固型樹脂為主要忐 佳·^人W > 熱㈣防谭漆具有較 Π 網印、簾塗、噴塗、滾塗等塗佈方法塗 #據:戶、=體層120之表面。該防焊漆層130之厚度可 實際需求設計。本實施例中，將以環氧基 係;^綠玫宜、刀之熱固性防焊漆，採用網印之塗佈方法塗 基板⑽具有圖案化導體層⑽之表面，形成厚 又為〇.5mil(〇.l27mm)厚之防焊漆層。 第二步，將防焊漆層13〇加熱固化。 斤示將塗佈有防焊漆層13〇之線路基板100 加熱’使得防痒漆層13G固化，以便於後續操作。 八體火、烤加熱之時間可能根據防悍漆成分之不同而不同。 200845850 本實施例中，採用以環氧基樹脂為主要成分之熱軋性防焊 漆，故將塗佈有防焊漆層130之線路基板100放進烤箱， 於80〜100°C烘烤大約2〜4小時，即可於線路基板100具有 圖案化導體層120之表面形成一層固化之防焊漆層130。 第四步，利用雷射於上述固化之防焊漆層130中開設 與焊墊121對應之焊墊窗131。 如圖4所示，採用雷射蝕刻系統發射雷射於該固化之 防浑漆層130直接進行燒蝕以去除焊墊121表面之防焊 漆，形成對應於圖案化導體層120之焊墊121之焊墊窗 131。該焊墊窗131之大小可等於或略小於焊墊121之大 小。燒蝕所用之雷射源可為二氧化碳雷射或紫外雷射如鈮 I乙！呂石才留石（Neodymium :Yttrium Aluminum Garnet， Nd:YAG)為介質之固體雷射。根據待開之焊墊窗131之大 小及防焊漆層130之材料組成與厚度來控制雷射光束之能 量密度，使防焊漆層130直接經雷射光束燒蝕形成焊墊窗 131，露出相應焊墊121，從而確保了焊墊窗131開設之精 度。優選地，可選用二氧化碳雷射蝕刻系統發射二氧化碳 雷射於該防焊漆層130直接進行燒蝕，因為金屬例如銅對 二氧化碳雷射之吸收率很低，二氧化碳雷射對圖案化導體 層120之導電金屬沒有影響，故可保證只燒蝕防焊漆層130 中對應焊墊121之防焊漆，不會燒蝕焊墊121。 此外，由於該焊墊窗131直接利用雷射燒蝕防焊漆層 130開設，而雷射燒蝕之孔徑範圍大約為0.025〜0.15mm， 相應之焊墊窗131之直徑大小範圍亦可為0.025〜0.15mm， 200845850 .，故，焊墊121之直徑大小範圍可設置為0.025〜0.15jiim，從 而可於一定面積之線路基板100上大大增加焊墊121之密 度，同時雷射蝕刻系統便於實現自動對位控制，可確保防 焊漆層130之製作精度，有利於滿足電路板高密度化發展 之需求。 經過上述步驟，於線路基板100具有圖案化導體層120 之表面即形成了一層留出待焊焊墊121而將所有線路及銅 面都覆蓋住之防焊漆層130，從而最終形成具有防焊漆層 130之電路板200。 如圖4所示，即為採用本技術方案實施例提供之電路 板之製作方法製作之電路板200。該電路板200包括線路 基板100及形成於線路基板100表面之防焊漆層130。該 線路基板100至少一表面設有圖案化導體層120，該圖案 化導體層120包括複數個焊墊121，用於與外部電子元器 件進行電性連接。防焊漆層130設於線路基板100具有圖 案化導體層120之表面，該防焊漆層130開設有複數個與 焊墊121對應之焊墊窗131，所述焊墊窗131利用雷射燒 蝕該防焊漆層130開設而成。焊墊121之直徑大小範圍可 設置為0.025〜0.15mm，從而可於一定面積之線路基板100 上大大增加大焊墊121之密度。 之後，可對具有防焊漆層130之電路板200之防焊漆 層130以及所有露出之焊墊121進行外觀檢驗，如果外觀 正常即可進行其他後續製作工序，例如化學鎳金、化學錫、 喷錫等。於線路基板100之表面之防焊漆層130可起到良 π 200845850 好防焊、護板及絕緣作用。 利要件，爰依法提出專 明之較佳實施方式，本 限:舉凡熟悉本案技藝 之等效修飾或變化，= 綜上所述，本發明符合發明專 利申請。惟，以上所述者僅為本發 發明之範圍並不以上述實施方式為 之人士，在援依本案發明精神所作 應包含於以下之申請專利範圍内。 【圖式簡單說明】 圖1-圖4係本技術方案實施例提供之電 示意圖。 路板之製作方法 【主要元件符號說明】 線路基板 100 基材 圖案化導體層 120 焊墊 Π〇 防焊漆層 130 焊墊窗 121 電路板 200 131 12The circuit board of the patterned conductor layer 120 is taken. Of course, wood is produced in other ways. In the second step of the J surface 2, the solder resist lacquer layer 13 is formed on the surface of the circuit substrate _ having the patterned conductor layer 120. As shown in Fig. 2, the circuit substrate 100 has a surface (4) solder resist paint on the patterned conductor layer 120. (4) ^ welding wear cover (10) with (4) the surface of the cased conductor layer (10), including the patterned conductor layer = and 攸 patterned metal layer 12 〇 exposed beauty wash to 1 m bucket soil 110, 幵> into a layer of anti-welding The solder resist layer 13G can be made of hot (four) material, epoxy resin, amino resin or polymethyl methacrylate resin (acrylic tree month) special heat solid resin as the main · · ^ ^ ^ W > Hot (4) anti-tan paint has a relatively thin screen printing, curtain coating, spray coating, roller coating and other coating methods coated # according to: household, = body layer 120 surface. The thickness of the solder resist layer 130 can be designed to meet actual needs. In the present embodiment, the substrate (10) having the surface of the patterned conductor layer (10) is formed by a coating method using an epoxy group, a green oxide, a knife, and a thermosetting solder resist. The thickness of the substrate is 10 mil. (〇.l27mm) thick anti-welding paint layer. In the second step, the solder resist layer 13 is cured by heating. The circuit board 100 coated with the solder resist layer 13 is heated to cause the anti-itch paint layer 13G to be cured for subsequent operations. The time of the eight-body fire and the baking heat may vary depending on the composition of the anti-mite paint. 200845850 In this embodiment, a hot-rolled solder resist containing epoxy resin as a main component is used, so that the circuit substrate 100 coated with the solder resist layer 130 is placed in an oven and baked at 80 to 100 ° C. A cured solder resist layer 130 may be formed on the surface of the circuit substrate 100 having the patterned conductor layer 120 for 2 to 4 hours. In the fourth step, a pad window 131 corresponding to the pad 121 is formed by using a laser in the cured solder resist layer 130. As shown in FIG. 4, a laser lithography system is used to emit a laser to the cured enamel layer 130 to directly ablate to remove the solder resist on the surface of the pad 121 to form a pad 121 corresponding to the patterned conductor layer 120. Pad window 131. The pad window 131 may be equal to or slightly smaller than the size of the pad 121. The laser source used for ablation can be a carbon dioxide laser or an ultraviolet laser such as 铌 I B! Neodymium (Yttrium Aluminum Garnet, Nd:YAG) is a solid laser of medium. The energy density of the laser beam is controlled according to the size of the pad window 131 to be opened and the material composition and thickness of the solder resist layer 130, so that the solder resist layer 130 is directly ablated by the laser beam to form the pad window 131, exposing Corresponding pads 121 are provided to ensure the accuracy of the pad window 131. Preferably, a carbon dioxide laser etching system is optionally used to emit a carbon dioxide laser to the ablation paint layer 130 for direct ablation because the absorption rate of the metal such as copper to the carbon dioxide laser is very low, and the carbon dioxide laser is applied to the patterned conductor layer 120. The conductive metal has no effect, so that it is ensured that only the solder resist of the corresponding solder pad 121 in the solder resist layer 130 is ablated, and the solder pad 121 is not ablated. In addition, since the pad window 131 is directly opened by the laser ablation solder resist layer 130, and the laser ablation aperture range is about 0.025~0.15 mm, the corresponding pad window 131 may have a diameter range of 0.025. ~0.15mm, 200845850. Therefore, the diameter of the soldering pad 121 can be set to be 0.025~0.15 jiim, so that the density of the bonding pad 121 can be greatly increased on the circuit substrate 100 of a certain area, and the laser etching system is convenient for automatic implementation. The alignment control ensures the precision of the solder resist layer 130 and is suitable for meeting the high-density development of the circuit board. Through the above steps, on the surface of the circuit substrate 100 having the patterned conductor layer 120, a solder resist layer 130 is formed which leaves the solder pads 121 to be covered and covers all the lines and the copper surfaces, thereby finally forming a solder resist. The circuit board 200 of the lacquer layer 130. As shown in FIG. 4, the circuit board 200 is manufactured by the method for manufacturing the circuit board provided by the embodiment of the present technical solution. The circuit board 200 includes a wiring substrate 100 and a solder resist layer 130 formed on the surface of the circuit substrate 100. At least one surface of the circuit substrate 100 is provided with a patterned conductor layer 120. The patterned conductor layer 120 includes a plurality of pads 121 for electrically connecting with external electronic components. The solder resist layer 130 is disposed on the surface of the circuit substrate 100 having the patterned conductor layer 120. The solder resist layer 130 is provided with a plurality of pad windows 131 corresponding to the pads 121, and the pad windows 131 are fired by lasers. The solder resist layer 130 is etched. The diameter of the pad 121 can be set to be 0.025 to 0.15 mm, so that the density of the large pad 121 can be greatly increased on the circuit substrate 100 of a certain area. Thereafter, the solder resist layer 130 of the circuit board 200 having the solder resist layer 130 and all the exposed solder pads 121 can be visually inspected, and if the appearance is normal, other subsequent manufacturing processes, such as chemical nickel gold, chemical tin, Spray tin and so on. The solder resist layer 130 on the surface of the circuit substrate 100 can be used as a good π 200845850 for good soldering, shielding and insulation. In the case of the essentials, the preferred embodiment of the invention is stipulated in accordance with the law. The present invention is equivalent to the equivalent modification or variation of the skill of the present invention. In summary, the invention is in accordance with the invention patent application. However, the above-mentioned persons who are only the scope of the present invention and are not in the above-described embodiments are included in the scope of the following claims. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 to FIG. 4 are electrical diagrams provided by embodiments of the present technical solution. Method of manufacturing the board [Major component symbol description] Circuit board 100 Substrate Patterned conductor layer 120 Pad Π〇 Anti-welding layer 130 Pad window 121 Circuit board 200 131 12