[go: up one dir, main page]

TW200845735A - Solid-state imaging device and imaging apparatus - Google Patents

Solid-state imaging device and imaging apparatus Download PDF

Info

Publication number
TW200845735A
TW200845735A TW096148102A TW96148102A TW200845735A TW 200845735 A TW200845735 A TW 200845735A TW 096148102 A TW096148102 A TW 096148102A TW 96148102 A TW96148102 A TW 96148102A TW 200845735 A TW200845735 A TW 200845735A
Authority
TW
Taiwan
Prior art keywords
signal
column
pixel
addition
count
Prior art date
Application number
TW096148102A
Other languages
Chinese (zh)
Other versions
TWI364980B (en
Inventor
Shizunori Matsumoto
Yasuaki Hisamatsu
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Publication of TW200845735A publication Critical patent/TW200845735A/en
Application granted granted Critical
Publication of TWI364980B publication Critical patent/TWI364980B/en

Links

Classifications

    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/60Noise processing, e.g. detecting, correcting, reducing or removing noise
    • H04N25/616Noise processing, e.g. detecting, correcting, reducing or removing noise involving a correlated sampling function, e.g. correlated double sampling [CDS] or triple sampling
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10Integrated devices
    • H10F39/12Image sensors
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/50Control of the SSIS exposure
    • H04N25/53Control of the integration time
    • H04N25/533Control of the integration time by using differing integration times for different sensor regions
    • H04N25/534Control of the integration time by using differing integration times for different sensor regions depending on the spectral component
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70SSIS architectures; Circuits associated therewith
    • H04N25/76Addressed sensors, e.g. MOS or CMOS sensors
    • H04N25/78Readout circuits for addressed sensors, e.g. output amplifiers or A/D converters

Landscapes

  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)

Abstract

There is provided a solid-state imaging device, which includes: a comparator for sequentially comparing a predetermined level of an analog pixel signal obtained from a plurality of pixels with a reference signal which is gradually changed and used for converting the predetermined level into digital data; a counter for performing a count processing in parallel with a comparison processing for the predetermined level in the comparator, and holding a count value at a time of completing the comparison processing to obtain digital data indicative of a value obtained by adding the plurality of pixel signals; and an addition spatial position adjusting unit for controlling a selection operation for selecting spatial positions of the plurality of pixels to be processed in the comparator and a ratio of a weight value during the addition to adjust spatial positions of pixels after addition.

Description

200845735 九、發明說明 【發明所屬之技術領域】 本發明關係於固態攝像裝置及攝像設備,其係爲用以 檢測實體量分佈的半導體裝置之例子。更明確地說,本發 明關係於一機制,其包含多數排列單元元件,其有對例如 來自外部的光或輻射之電磁波輸入的靈敏度,並藉由該等 單元元件讀取被轉換爲電信號的一實體量分佈,將類比電 信號轉換爲數位資料,並輸出數位資料至外部。 【先前技術】 近年來,在固態攝像裝置的例子中,金屬氧化物半導 體(MOS)攝像感應器及互補金屬氧化物半導體(CMOS)攝像 感應器已經被引起很大之注意力,其能解決電荷耦合裝置 (C C D)攝像感應器的各種缺點。 例如,CMOS攝像裝置對每一像素具有放大電路,例 如浮置擴散放大器,並當CMOS攝像感應器讀出像素信號 ,作爲位址控制時,經常使用一所謂行並聯輸出型或行類 型的方法,其中,在一像素陣列單元中之一列係被選擇及 一列的像素係被一列一列地同時取用,即,一列的所有像 素係同時並平行地由像素陣列單元讀出。 再者,固態攝像裝置可以採用一方法,其中自一像素 陣列單元所讀出之類比像素信號係被一類比數位轉換器 (A/D轉換器)所轉換爲數位資料,該數位資料被輸出至外 部。 -4- 200845735 這係如同於同行並聯輸出類型攝像感應器,各類型之 信號輸出電路已經被開發。其中提出一方法作爲最先進類 型,其中一 A/D轉換器被提供用於每一行及一像素信號被 輸出至外部作爲數位資料(例如參考日本專利申請公開 2005-278135)。 再者,在一 A/D轉換方法中,各種方法已經以電路規 格、處理速度、及解析度加以考量。A/D轉換方法之單斜 率積分或斜波比較A/D轉換方法。在此方法中,一類比單 位信號係與用於數位信號轉換的參考信號相比,及一計數 處理係平行於此比較操作一起執行。根據此在完成比較操 作時的計數値,取得單位信號的數位信號。此方法也被上 述專利文獻所採用。 【發明內容】 已經在固態攝像裝置,例如數位相機中作相加處理, 其係被用作爲將光轉換爲電信號的裝置,以輸出爲影像信 號。例如,用以降低像素數量所用之相加處理係取決於一 例子,使得當捕捉影靜態影像時之所有像素被讀出或者當 捕捉動畫時像素被相加及細化(thinned),用以高速讀出。 因爲一 CMOS攝像感應器將像素信號轉換爲每一像素 的電信號,此相加處理函數可以容易加入其中。於上述專 利文獻中所揭示之固態攝像裝置也採用此相加處理系統。 然而,藉由執行簡單相加處理,使得相加目標像素的 係數均勻,但由於在相加後的像素空間位置的關係,不可 -5- 200845735 能一直取得高解析度的相加影像。這典型是因爲在相加後 的空間位置並不是呈等距排列。 本發明係針對上述環境加以完成,並提供一機制,其 能取得具有高解析度的相加影像。 在依據本發明實施例之固態攝像裝置中,其包含:一 比較器及一計數器。該比較器首先比較自一像素取得之類 比像素信號的預定位準(例如一重置位置或信號位準)與逐 漸改變的參考信號,並用以將預定位準轉換爲數位資料。 該計數器並聯於比較器所執行之比較處理,執行一計數處 理’並藉由保有在完成比較處理時之計數値,而取得該預 定位準的數位資料。換句話說,作爲有關於像素信號的 A/D轉換的機制中,採用了所謂單斜率積分類型或斜波信 號比較類型的A/D轉換系統。 在依據本發明之實施例的機制中,提供了一相加空間 位置調整單元。該相加空間位置調整單元用以控制予以在 比較器中處理的多數像素的選擇空間位置的選擇操作及在 相加時之加權値的比例,以在相加後,調整像素的空間位 置。 “藉由控制在相加時之加權値的比例,以在相加後調 整像素的空間位置,,的句子表示在相加後的像素的空間位 置係被調整’使得相加影像的解析度高於執行簡單相加, 其中相加目標像素的每一加權値爲均勻。較佳地,爲了該 目的’相加空間位置調整單元控制在相加時之加權値比, 使得在相加後的每一像素的空間位置係被安排爲等距。 -6 - 200845735 如果像素設有濾色板,用以產生彩色影像,則相加空 間位置調整單元控制選擇予以爲該比較器所執行之多數像 素的空間位置的選擇操作,使得具有相同顏色的像素係被 相加,並控制在相加時之加權値的比例,使得每一像素的 空間位置係被安排於等距。 如果每一像素在相加後的空間位置係藉由設定一適當 加權値加以調整,則在相加後的像素位置可以在最佳狀態 被安排爲等距。結果有可能確定地防止解析度變低或減少 解析度變低的可能性,而如果影像爲簡單相加處理所相加 ,則解析度有時會降低。 固態攝像裝置有時可以爲單晶片類型或具有攝像功能 的模組類型,其中封裝有一攝像單元、一信號處理器或光 學系統。 再者,本發明可以不只應用至固態攝像裝置,同時, 也可應用至攝像設備。在此時,攝像裝設備可以取得類似 於固態攝像裝置一樣的優點。攝像設備可以例如一攝影機 或具有攝像功能的行動設備。另外,”攝像,,不只是用以以 攝影機捕捉正常影像,同時也包含廣義地指紋檢測。 本發明之這些及其他特性與態樣係參考附圖加以詳細 說明。 【實施方式】 本發明之實施例將參考附圖加以詳細說明。在以下例 子中,其採用一 CMOS固態攝像裝置作爲一例子,其係爲 200845735 X-Y定址型固態攝像裝置。再者,在CMOS固態攝像裝置 中之每一像素係由NMOS構成。 然而’這是一例子並且該裝置並不限於M0S攝像裝 置。所有予以後述之實施例可以應用至所有用以檢測實體 量分佈的半導體裝置,其包含多數安排呈直線或矩陣形狀 的單元元件,其對光或自外部輸入之電磁波有靈敏度。 [固態攝像裝置的槪要] 圖1爲依據本發明實施例之CMOS固態攝像裝置 (CMOS攝像感應器)的示意圖。 固態攝像裝置1具有像素單元,其中包含有光接收元 件(例如電荷產生器)的多數像素,其輸出對應於入射光量 的信號,並被安排呈行與列(即,二維矩陣形狀)。自每一 像素輸出之信號提供一電壓信號。固態攝像裝置1同時包 含共相關雙取樣(CDS)處理功能單元及類比數位轉換器 (ADC),這些係被以行並聯方式排歹ί]。 “CDS處理功能單元及ADC被以行並聯方式排列”表 示多數CDS處理功能單元及ADC係被以實質並聯於垂直 行中之垂直信號線1 9 (行信號列)的方式設置。 當裝置以平面觀看時,多數功能單元可以只安排在像 素陣列單元1 0之行方向中之一端側上(圖中之下部的外側) 。或者,功能單元可以分開安排在像素陣列單元1 〇之行 方向中之一端側上(圖的下部的外側)及相反於一端的另一 側(圖中之上部)。在後面的情形中,較佳地,用以在列方 -8 - 200845735 向中執行讀出掃描(水平掃描)的水平掃描器被安排在像素 陣列單元1 〇的兩側,使得水平掃描器可以獨立操作。 例如,具有CDS處理功能單元與ADC並行安排的典 型例子係爲行類型,其中,用於每一垂直行的CDS處理 功能單元及ADC係被安排用於一被稱爲行區域的一部份 中’該行區域被安排在攝像單元的輸出側,及信號係被依 序讀出至輸出側。或者,不只是行類型,也可以指定一 CDS處理功能單元及一 ADC至多數(例如兩)鄰近信號線 19(垂直行),或一 CDS功能單元及一 ADC可以指定至N 垂直信號線19(垂直行)於N其他線(N爲正整數;其中在 兩線間有(N-1))。 因爲除了行類型外之任意具有一結構均具有一結構, 其中,一 CDS處理功能單元及一 ADC均爲多數垂直信號 線19(垂直行)所共用,一開關電路(開關)係被提供以供給 多數來自像素陣列1 0的多數行像素信號至一 CDS處理功 能單元及一 ADC。用以儲存輸出信號的記憶體可以必要地 取決於在後一步驟的處理。 在任一情形下,藉由指定一 C D S處理功能單元及一 A D C至多數垂直信號線1 9 (垂直行),信號處理可以在像素 信號被以像素f了爲單位I買出後被執行於像素信號上。因此 ,每一單元像素的架構可以較在每一單元像素中執行類似 信號處理時更簡化,因此,可以實施多像素之更小及更低 成本之影像感應器。 另外,在單一列中之像素信號可以同時藉由安置在行 -9- 200845735 並聯方式排列之多數信號處理器所並聯處理。因 號處理器可以以較用輸出電路中或在裝置外之一 能及一 ADC所執行處理爲慢之速度加以操作, 率消耗、頻帶效能、雜訊等等係較有利。換句話 率消耗及帶效能類似地設定時,整個感應器可以 度操作。 行類型架構可以以低速操作並在功率消耗、 及雜訊上有優點並且也不需要切換電路(開關)。 例除了特別說明外,均是描述行類型。 如於圖1所示,依據本發明實施例之固態攝 包含:像素陣列單元1 0,其中多數單元像素3係 列與行,其也稱爲像素單元或一攝像單元;一驅 7,提供外部像素陣列單元1 0 ;讀出電流供給24 給一操作電流(讀出電流),用以讀出像素信號給 單元10中之單元像素3; —行處理器26包含安 垂直行中之行A/D電路25 ; —參考信號產生器 供給用於A/D轉換的參考信號Vslop給行處理f 一輸出單元29。這些功能被設在同一半導體基材 任何參考信號Vsl〇p均可以使用,只要其爲 其具有以預定斜率線性變化的波形;及具有平順 順斜率形波形,或一步階形波形,其依序地改變 均可以使用。 在本實施例中之行 A/D電路25具有功能 A/D轉換器,其將一作爲像素信號So的基本位 此,該信 CDS功 這對於功 說,當功 以較高速 頻帶效能 以下實施 像裝置1 被排列爲 動控制器 ,用以供 像素陣列 排在每一 27,用以 I 26 ;及 上。 一信號, 改變的平 其位準者 ,包含一 準之重置 -10- 200845735 位準Srst及一信號位準Ssig獨立轉換爲數位資料,及一 參處理器,其執行重置位準Srst之A/D轉換結果及信號 位準Ssig的A/D轉換結果間之差處理,並取得爲該重置 位準Srst及信號位準Ssig間之差所表示之信號分量的數 位資料。 在行處理器26的前一級或後一級中,具有信號放大 功能的自動增益控制(AGC)電路係被安置在相同半導體區 中,如果有必要,其中安排有行處理器26。當AGC時, 類比放大係執行在行處理器26的前一級,而在AGC時, 數位放大係被執行在行處理器26的下一級。因爲當η位 元數位資料被簡單放大時,音調似乎被損壞,所以,較佳 地,資料係以類比形式被放大,然後,再數位轉換。 驅動控制器7包含控制電路,作用以依序自像素陣列 單元1 〇讀取信號。例如,驅動控制器7包含:具有水平 解碼器12a及水平驅動單元12b之水平掃描電路(行掃描 電路)1 2,其控制行定址或行掃描;具有垂直解碼器1 4a 及垂直驅動單元14b之垂直掃描電路(列掃描電路)14 ’其 控制列定址或列掃描;及具有產生內部時鐘功能的通訊/ 計時控制器20。 在圖1中之通訊/計時控制器20附近,可以安排有一 時鐘轉換器23,其係爲產生具有時鐘頻率快於輸入時鐘頻 率之脈衝的高速時鐘產生器。通訊/計時控制器20根據輸 入時鐘(主時鐘)CLK0,經由端子5a產生一內部時鐘’或 者,一高速時鐘產生在時鐘轉換器23中。 -11 - 200845735 根據產生於時鐘轉換器23中之高速時鐘,使用一信 號使完成高速之A/D轉換處理。高速時鐘的使用同時也使 之可能執行需要快速計算的動作抽取或壓縮。也可能將自 行處理器26所輸出之並聯資料轉換爲串列資料並輸出至 裝置外,作爲視訊資料D 1。以此架構,可以以較A/D轉 換數位資料的位元量爲少之端子來實施高速操作。 時鐘轉換器23具有一內建乘法電路,用以產生較輸 入時鐘頻率爲高之時鐘頻率。時鐘轉換器23自通訊/計時 控制器20接收低速時鐘CLK2,並產生具有頻率至少低速 時鐘CLK2兩倍的時鐘。如果kl爲低速時鐘CLK2的頻率 倍數’則kl乘法電路可以設置用於時鐘轉換器23,及各 種已知電路可以被使用作爲乘法電路。 在圖1中,爲了簡明顯示,並非所有的行與列都被顯 示。然而,實際上,幾十至幾千單元像素3係被安排於每 一列或每一行中,以形成像素陣列單元1 〇。典型地,每一 卓兀像素3包含一光一極體’其作爲一光接收單元(電荷 產生器),及一像素內放大器,其具有一放大半導體元件( 例如,一電晶體)。 像素內放大器可以爲能輸出一信號電荷的電路,該電 荷係被產生並累積在單元像素3中之電荷產生器中,作爲 電信號,及各種結構可以用作像素內放大器。通常使用爲 一置擴散放大器結構。例如,一包含四電晶體設在一單一 電何產生器的浮置擴散放大器,其通常用於C Μ Ο S型感應 器。四電晶體爲:一讀出選擇電晶體,其爲電荷讀出單元 -12- 200845735 (傳送閘/讀出閘)的例子;一重置電晶體,其爲重置閘的一 例子;一垂直選擇電晶體;及一源極跟隨器結構之放大電 晶體,其係爲一檢測元件,用以檢測在浮置擴散中之可能 電荷(例如,參考如後述之圖2) ° 或者,有可能使用具有三電晶體的浮置擴散放大器’ 即,一連接至汲極線(DRN)之放大電晶體’用以放大對應 於該電荷產生器所產生之信號電壓;一重置電晶體’用以 重置該電荷產生器;及一讀出選擇電晶體(電晶體閘極), 其係爲一垂直移位暫存器,經由傳送線(TRF)加以掃描。 在固態攝像裝置1中,像素陣列單元1 0可以被作成 以藉由使用一分色濾鏡,執行彩色攝像。更明確地說’色 彩分離濾片之任一彩色濾片可以安排呈所謂Bayer配置’ 安排在像素陣列單元1 〇中之用以接收每一電荷產生器(例 如光二極體)的電磁波(此實施例中之光),藉以完成彩色攝 像,其中濾片係爲具有多種顏色的濾色片的組合所作成。 如果濾色片係被排列如圖8及圖12-14所示之Bayer 配置,則G(綠)及R(紅)濾色片或B(藍)及G(綠)濾色片係 被安排在同一列,使得它們被安排在二維格狀。 單元像素3經由列控制線1 5連接至垂直掃描電路1 4 ,用以選擇一列並經由垂直信號線1 9連接至行處理器2 6 ,其中行A/D電路25被安排在每一垂直行中。列控制線 1 5表示所有由垂直掃描電路1 4至像素的所有線。 水平掃描電路1 2具有一讀出掃描器的功能,用以自 行處理器26讀出計數値給水平信號線1 8。輸出電路28係 -13- 200845735 被設在水平信號線1 8的下一級(輸出側)。 如果有必要,一數位算術單元2 9可以設在輸出電路 28的前一級。”如果有必要,,表示當有需要有關於水平方向 之其他處理時。因此,數位算術單元29具有針對水平方 向,執行多數行資料的相加處理的功能。另外’取決於至 水平信號線1 8的線連接,一記憶體被提供用以儲存多數 相加目標行的資料。例如,當有多數目標行經由個別系統 之水平信號線1 8傳送至數位算術單元29的線連接時,並 不需要記憶體,如果一多數相加目標行經由一系統之水平 信號線1 8傳送,則需要記憶體來儲存相加目標行的資料 〇 水平掃描電路12同步於低速時鐘CLK2,依序選擇行 處理器26中之行A/D電路25,並將信號引至水平信號線 (水平輸出線)1 8。例如,水平掃描電路1 2具有水平解碼器 12a,用以定義水平方向中之讀出行(選擇行處理器26中 之個別行A/D電路25),及水平驅動單元12b,用以將行 處理器26的每一信號,依據水平解碼器12a所定義之讀 出位址引至水平信號線1 8。水平信號線1 8係被安排例如 爲行A/D電路25所處理的位元η的數目(n爲正整數),如 果1 〇( = η)位元,則像素陣列單元1 0線被安排對應於位元 數。 驅動控制器7的每一元件,例如水平掃描電路1 2及 垂直掃描電路1 4係與像素陣列單元1 〇被一起成形於由單 晶矽等所作成之半導體區域上,這係藉由使用類似於半導 -14- 200845735 體積體電路製造技術的技術進行’以形成例如半導體系統 的固態攝像裝置。 這些個別功能單元形成本實施例中之固態攝像裝置1 的一部份,也稱爲”單晶片型”(提供在同一半導體基材上) ,包含每一功能單元被一體成型在由單晶矽等作成之半導 體區域上,這係藉由使用類似於半導體積體電路製造技術 加以進行,成爲例如半導體系統之CMOS攝像裝置。 固態攝像裝置1可以爲單晶片型,其中個別元件係被 一體成型在相同半導體元件,但它並未顯示出,並且也可 以是具有攝像功能的模組型,其中除了像素陣列單元1 〇、 驅動控制器7及行處理器26之各種信號處理器外,封裝 有一光學系統,例如拾取鏡頭、光學低通瀘鏡、或紅外線 切除濾鏡。 水平掃描電路1 2及垂直掃描電路1 4例如包含一解碼 器,並回應於自通訊/時序控制器20供給之控制信號CN2 及C N1,開始一移位操作(掃描)。因此,列控制線1 5包 含各種脈衝信號,用以驅動單元像素3 (例如,像素重置脈 衝RST、傳送脈衝TRG、及一垂直選擇脈衝VSEL)。 雖然未看出,但通訊/時序控制器20具有時序產生器 TG(例如一讀出位址控制設備)的功能方塊,其供給一時鐘 及爲每一單元操作所需之預定時序脈衝信號,及一通訊介 面之功能方塊’其經由端子5 a接收一自外部主控制器所 供給之主時鐘CLK0,並經由端子5b接收自外部主控制器 供給之指示操作模式等之資料DATA,並輸出包含固態攝 -15- 200845735 像裝置1的資訊至外部主控制器。 例如,通訊/時序控制器20輸出一水平位址信號給水 平解碼器12a,並輸出一垂直位址信號給垂直解碼器i4a 。每一解碼器接收信號並選擇對應的列或行。 在此時,因爲單元像素3係被安排爲二維矩陣,所以 ,較佳地,藉由以下程序完成高速的像素信號及像素資料 的讀取:執行(垂直)掃描讀取,其中爲像素信號產生器5 所產生並經由垂直信號線1 9輸出之類比像素信號係被存 取並以列爲單位讀取(以行並聯方式),然後,執行(水平) 掃描讀取,其中像素信號(此例子中之數位像素資料)係於 列方向中被存取於列方向中,其係爲垂直行的安排方向, 並讀出至外側。當然,不只是掃描讀取,同時,隨機存取 也可以藉由直接指定予以讀出之像素單元3的位址加以完 成,使得只有有關必要之單元像素3可以被讀取。 通訊/時序控制器20供給具有與主時鐘CLK0相同頻 率之時鐘CLK1經由端子5a、時鐘CLK1除以2所得之時 鐘、或進一步將時鐘CLK1除以取得之低速時鐘給裝置中 之每一單元,例如,給水平掃描電路1 2、垂直掃描電路 1 4、及行處理器2 6。在以下中,爲除以2所得之時鐘或所 有較取得時鐘爲低之時鐘係被一起稱爲低速時鐘C L K 2。 垂直掃描電路1 4選擇像素陣列單元1 〇的一列,並供 給必要脈衝給選定列。例如,垂直掃描電路1 4具有垂直 解碼器1 4a,用以界定垂直方向中之一讀出列(選—像素陣 列單元1 0的一列),及垂直驅動單元1 4b,用以供給一脈 -16- 200845735 衝至單元像素3的控制線1 5的爲驅動用之垂直解碼器 所定義的讀取位址(於列方向)。垂直解碼器14a同時 定義一讀出列外,也選擇一列作爲電子快門。 在此實施例中,有可能依據每一操作模式,選擇 A/D轉換操作,即,一正常框模式,以漸進掃描以讀 有單元像素3的資訊,並增加框速率N倍的高速框率 如正常框模式之速度兩倍。 較佳地,除了以水平解碼器1 2a以正常框率模式 行依序掃描外,水平掃描電路1 2或垂直掃描電路1 4 一位址解碼器,以任意選擇予以處理的列與行,以使 加讀出操作或十進制讀出操作可以以高速框模式執行 尤其,當用以捕彩色影像的分色濾鏡以相對於相 出操作的關係,被提供在像素陣列單元1 〇的每一單 素3時,較佳地,至少在垂直掃描電路14中,相加 可以執行在具有相同顏色的單元像素3上。爲了並 A/D轉換處理,在垂直方向中執行相加的處理,較佳 提供垂直解碼器14a,用以至少在垂直掃描電路14選 一控制線1 5。 當捕捉彩色影像時,如果相加處理對具有不同濾 件之像素進行,則發生色彩混合。另一方面,如果相 理執行於具有相同顏色的像素上,則例如在Bayer配 之奇數列或偶數列內之像素,則不會發生色彩混合。 “並行於A/D轉換,執行垂直方向中之相加處理” 在多數相加處理目標列中之最後相加處理目標列上之[Technical Field] The present invention relates to a solid-state image pickup device and an image pickup apparatus, which are examples of a semiconductor device for detecting a physical quantity distribution. More specifically, the present invention relates to a mechanism comprising a plurality of arranging unit elements having sensitivity to electromagnetic wave input such as light or radiation from the outside, and reading by the unit elements is converted into an electrical signal. An entity quantity distribution converts an analog electrical signal into digital data and outputs digital data to the outside. [Prior Art] In recent years, in the example of a solid-state image pickup device, a metal oxide semiconductor (MOS) image sensor and a complementary metal oxide semiconductor (CMOS) image sensor have been attracting great attention, which can solve the charge. Various disadvantages of the coupling device (CCD) camera sensor. For example, a CMOS camera device has an amplifying circuit for each pixel, such as a floating diffusion amplifier, and when a CMOS image sensor senses a pixel signal, as an address control, a so-called line parallel output type or line type method is often used. Wherein, one column of a pixel array unit is selected and one column of pixels is simultaneously accessed in a row and a column, that is, all the pixels of one column are simultaneously and parallelly read by the pixel array unit. Furthermore, the solid-state imaging device can adopt a method in which an analog pixel signal read from a pixel array unit is converted into digital data by an analog-to-digital converter (A/D converter), and the digital data is output to external. -4- 200845735 This is like a parallel parallel output type camera sensor, and various types of signal output circuits have been developed. There is proposed a method as a most advanced type in which an A/D converter is provided for each line and a pixel signal is outputted to the outside as digital data (for example, refer to Japanese Patent Application Laid-Open No. Hei No. 2005-278135). Furthermore, in an A/D conversion method, various methods have been considered in terms of circuit specifications, processing speed, and resolution. Single slope integration or ramp comparison A/D conversion method for A/D conversion method. In this method, a class of analog signal is compared to a reference signal for digital signal conversion, and a counting process is performed in parallel with the comparison operation. According to this, the number signal of the unit signal is obtained by counting 値 when the comparison operation is completed. This method is also employed in the above patent documents. SUMMARY OF THE INVENTION The addition processing has been performed in a solid-state image pickup device such as a digital camera, which is used as a device for converting light into an electric signal to be output as an image signal. For example, the addition processing used to reduce the number of pixels depends on an example such that when pixels are captured, all pixels are read or when the animation is captured, the pixels are added and thinned for high speed. read out. Since a CMOS camera sensor converts a pixel signal into an electrical signal for each pixel, this addition processing function can be easily added thereto. The solid-state image pickup device disclosed in the above patent document also employs this addition processing system. However, by performing a simple addition process, the coefficients of the added target pixels are made uniform, but due to the relationship of the spatial positions of the pixels after the addition, the high-resolution addition image can always be obtained. This is typically because the spatial locations after the addition are not equidistant. The present invention has been accomplished in view of the above circumstances and provides a mechanism for obtaining an added image with high resolution. In a solid-state image pickup device according to an embodiment of the invention, it comprises: a comparator and a counter. The comparator first compares a predetermined level (e.g., a reset position or signal level) of the analog pixel signal obtained from a pixel with a gradually changing reference signal and converts the predetermined level into digital data. The counter is connected in parallel to the comparison processing performed by the comparator, performs a counting process' and obtains the pre-aligned digital data by retaining the count 値 when the comparison processing is completed. In other words, as a mechanism relating to A/D conversion of a pixel signal, an A/D conversion system of a so-called single-slope integration type or a ramp-wave signal comparison type is employed. In the mechanism according to an embodiment of the present invention, an addition spatial position adjustment unit is provided. The addition spatial position adjustment unit controls the selection operation of the selection spatial position of the majority of pixels to be processed in the comparator and the ratio of the weights 値 at the time of addition to adjust the spatial position of the pixels after the addition. "By controlling the ratio of the weights 値 at the time of addition, to adjust the spatial position of the pixels after the addition, the sentence indicates that the spatial position of the added pixels is adjusted" so that the resolution of the added image is high. Performing a simple addition, wherein each weighted 値 of the added target pixel is uniform. Preferably, for this purpose, the 'additional space position adjustment unit controls the weighted 値 ratio at the time of addition so that each of the added The spatial position of one pixel is arranged to be equidistant. -6 - 200845735 If the pixel is provided with a color filter for generating a color image, the addition spatial position adjustment unit controls the selection to be performed for most of the pixels performed by the comparator The spatial position selection operation causes pixel systems having the same color to be added, and controls the ratio of the weights 値 at the time of addition such that the spatial position of each pixel is arranged equidistant. If each pixel is added The subsequent spatial position is adjusted by setting an appropriate weight ,, and the pixel positions after the addition can be arranged in an optimal state to be equidistant. As a result, it is possible to surely prevent the solution. The resolution is lowered or the resolution is lowered, and if the image is added by simple addition processing, the resolution is sometimes lowered. The solid-state imaging device may sometimes be a single-chip type or a module having an imaging function. A group type in which an image pickup unit, a signal processor or an optical system is packaged. Further, the present invention can be applied not only to a solid-state image pickup device but also to an image pickup device. At this time, the image pickup device can be similarly obtained. The same advantages of the solid-state camera device. The camera device can be, for example, a camera or a mobile device with a camera function. In addition, "camera, not only for capturing normal images with a camera, but also for fingerprint detection in a broad sense. These and other features and aspects of the present invention are described in detail with reference to the drawings. [Embodiment] An embodiment of the present invention will be described in detail with reference to the accompanying drawings. In the following example, a CMOS solid-state image pickup device is taken as an example, which is a 200845735 X-Y address type solid-state image pickup device. Furthermore, each pixel in the CMOS solid-state image pickup device is constituted by an NMOS. However, this is an example and the device is not limited to the MOS camera. All of the embodiments described hereinafter can be applied to all semiconductor devices for detecting the physical quantity distribution, which include a plurality of unit elements arranged in a linear or matrix shape, which are sensitive to light or electromagnetic waves input from the outside. [Summary of Solid-State Imaging Device] FIG. 1 is a schematic diagram of a CMOS solid-state imaging device (CMOS imaging sensor) according to an embodiment of the present invention. The solid-state image pickup device 1 has a pixel unit in which a plurality of pixels including a light receiving element (e.g., a charge generator) are output, which output signals corresponding to the amount of incident light, and are arranged in rows and columns (i.e., two-dimensional matrix shape). The signal output from each pixel provides a voltage signal. The solid-state imaging device 1 includes both a co-correlated double sampling (CDS) processing functional unit and an analog digital converter (ADC), which are arranged in parallel in a row. The "CDS processing function unit and the ADC are arranged in parallel in a row" means that most of the CDS processing function units and the ADC system are arranged in a manner of being substantially parallel to the vertical signal line 1 9 (row signal line) in the vertical line. When the apparatus is viewed in a plane, most of the functional units may be arranged only on one end side of the row direction of the pixel array unit 10 (outside of the lower portion in the drawing). Alternatively, the functional units may be arranged separately on one end side of the row direction of the pixel array unit 1 (outside of the lower portion of the drawing) and on the other side opposite to one end (upper portion in the drawing). In the latter case, preferably, horizontal scanners for performing readout scanning (horizontal scanning) in the column side-8 - 200845735 are arranged on both sides of the pixel array unit 1 , so that the horizontal scanner can Independent operation. For example, a typical example in which a CDS processing functional unit is arranged in parallel with an ADC is a row type in which a CDS processing functional unit and an ADC system for each vertical line are arranged for use in a portion called a row region. The line area is arranged on the output side of the camera unit, and the signal system is sequentially read out to the output side. Alternatively, not only the row type, but also a CDS processing functional unit and an ADC to a majority (eg, two) adjacent signal lines 19 (vertical rows), or a CDS functional unit and an ADC may be assigned to the N vertical signal line 19 ( The vertical line is on the other N lines (N is a positive integer; there is (N-1) between the two lines). Since any structure other than the row type has a structure in which a CDS processing functional unit and an ADC are shared by a plurality of vertical signal lines 19 (vertical lines), a switching circuit (switch) is provided for supply. Most of the majority of the row of pixel signals from pixel array 10 are coupled to a CDS processing functional unit and an ADC. The memory used to store the output signal may necessarily depend on the processing in the latter step. In either case, by specifying a CDS processing functional unit and an ADC to a plurality of vertical signal lines 1 9 (vertical lines), signal processing can be performed on the pixel signals after the pixel signals are purchased in units of pixels f. on. Therefore, the architecture of each unit pixel can be simplified compared to performing similar signal processing in each unit pixel, and therefore, a smaller and lower cost image sensor of multiple pixels can be implemented. In addition, the pixel signals in a single column can be simultaneously processed in parallel by a plurality of signal processors arranged in parallel in line -9-200845735. The number processor can operate at a slower speed than the output of the output circuit or one of the devices and the processing performed by an ADC. Rate consumption, band efficiency, noise, etc. are advantageous. In other words, when the rate consumption and band performance are similarly set, the entire sensor can be operated. The row type architecture can operate at low speeds and has advantages in power consumption, noise, and also does not require switching circuits (switches). The examples describe the line type except for special instructions. As shown in FIG. 1 , a solid-state camera according to an embodiment of the present invention includes: a pixel array unit 10 in which a plurality of unit pixels 3 are series and rows, which are also referred to as pixel units or a camera unit; and a drive 7 provides external pixels. The array unit 10; the read current supply 24 gives an operating current (read current) for reading out the pixel signal to the unit pixel 3 in the unit 10; the line processor 26 includes the line A/D in the vertical line The circuit 25; the reference signal generator supplies the reference signal Vslop for A/D conversion to the line f to an output unit 29. These functions can be used with any reference signal Vsl〇p provided on the same semiconductor substrate as long as it has a waveform that varies linearly with a predetermined slope; and has a smooth slope-shaped waveform, or a one-step waveform, which is sequentially Changes can be used. The row A/D circuit 25 in this embodiment has a function A/D converter which takes one as the basic position of the pixel signal So, which is implemented for the power of the CDS function, which is implemented below the high-speed band performance. The image device 1 is arranged as a dynamic controller for arranging the pixel array at each of the 27 for I 26 ; A signal, the change of the level of the person, including a quasi reset -10- 200845735 level Srst and a signal level Ssig independently converted to digital data, and a parameter processor, which performs a reset level Srst The difference between the A/D conversion result and the A/D conversion result of the signal level Ssig is processed, and the digital data of the signal component represented by the difference between the reset level Srst and the signal level Ssig is obtained. In the previous stage or the subsequent stage of the line processor 26, an automatic gain control (AGC) circuit having a signal amplifying function is disposed in the same semiconductor region, and a row processor 26 is arranged therein if necessary. When AGC, the analog amplification is performed at the previous stage of the line processor 26, and at the time of AGC, the digital amplification is performed at the next stage of the line processor 26. Since the tone seems to be corrupted when the η bit digital data is simply enlarged, preferably, the data is amplified in an analogous form and then digitally converted. The drive controller 7 includes control circuitry for sequentially reading signals from the pixel array unit 1 。. For example, the drive controller 7 includes: a horizontal scanning circuit (row scanning circuit) 12 having a horizontal decoder 12a and a horizontal driving unit 12b, which controls row addressing or line scanning; has a vertical decoder 14a and a vertical driving unit 14b. A vertical scanning circuit (column scanning circuit) 14' which controls column addressing or column scanning; and a communication/timing controller 20 having an internal clock function. In the vicinity of the communication/timing controller 20 of Fig. 1, a clock converter 23 can be arranged which generates a high speed clock generator having a pulse having a clock frequency faster than the input clock frequency. The communication/timing controller 20 generates an internal clock ' via the terminal 5a according to the input clock (main clock) CLK0 or a high-speed clock is generated in the clock converter 23. -11 - 200845735 According to the high speed clock generated in the clock converter 23, a signal is used to complete the high speed A/D conversion processing. The use of a high speed clock also makes it possible to perform motion extraction or compression that requires fast calculations. It is also possible to convert the parallel data output from the processor 26 into serial data and output it to the outside of the device as the video material D1. With this architecture, high-speed operation can be performed with fewer bits than the A/D conversion digital data. The clock converter 23 has a built-in multiplying circuit for generating a clock frequency that is higher than the input clock frequency. The clock converter 23 receives the low speed clock CLK2 from the communication/timing controller 20 and generates a clock having twice the frequency of at least the low speed clock CLK2. If kl is the frequency multiple of the low speed clock CLK2', the k1 multiplying circuit can be set for the clock converter 23, and various known circuits can be used as the multiplying circuit. In Figure 1, not all rows and columns are shown for simplicity. However, actually, tens to thousands of unit pixels 3 are arranged in each column or each row to form the pixel array unit 1 〇. Typically, each of the pixels 3 includes a photo-polar body as a light-receiving unit (charge generator), and an in-pixel amplifier having an amplifying semiconductor element (e.g., a transistor). The in-pixel amplifier can be a circuit capable of outputting a signal charge which is generated and accumulated in the charge generator in the unit pixel 3 as an electric signal, and various structures can be used as an in-pixel amplifier. It is usually used as a diffusion amplifier structure. For example, a floating diffusion amplifier comprising four transistors arranged in a single generator is typically used in C Μ Ο S-type inductors. The four transistors are: a readout selection transistor, which is an example of a charge readout unit -12-200845735 (transfer gate/readout gate); a reset transistor, which is an example of a reset gate; Selecting a transistor; and amplifying the transistor of a source follower structure, which is a detecting element for detecting a possible charge in the floating diffusion (for example, refer to FIG. 2 as described later) or, possibly using A floating diffusion amplifier having three transistors 'i.e., an amplifying transistor connected to a drain line (DRN) is used to amplify a signal voltage corresponding to the charge generator; and a reset transistor is used to The charge generator is disposed; and a read select transistor (transistor gate) is a vertical shift register that is scanned via a transfer line (TRF). In the solid-state image pickup device 1, the pixel array unit 10 can be made to perform color imaging by using a dichroic filter. More specifically, any of the color filters of the color separation filter can be arranged in a so-called Bayer configuration to arrange electromagnetic waves in the pixel array unit 1 to receive each charge generator (for example, a photodiode). The light in the example) is used to complete color imaging, wherein the filter is made up of a combination of color filters having multiple colors. If the color filter is arranged in a Bayer configuration as shown in Figures 8 and 12-14, G (green) and R (red) filters or B (blue) and G (green) filters are arranged. In the same column, they are arranged in a two-dimensional grid. The unit pixel 3 is connected to the vertical scanning circuit 14 via a column control line 15 for selecting a column and connected to the line processor 26 via a vertical signal line 19, wherein the row A/D circuit 25 is arranged in each vertical line in. The column control line 15 represents all of the lines from the vertical scanning circuit 14 to the pixels. The horizontal scanning circuit 12 has a function of a readout scanner for reading the count from the processor 26 to the horizontal signal line 18. The output circuit 28 is set to the next stage (output side) of the horizontal signal line 18 from -13 to 200845735. A digital arithmetic unit 29 can be provided in the previous stage of the output circuit 28 if necessary. "If necessary, it means that when there is a need for other processing regarding the horizontal direction. Therefore, the digital arithmetic unit 29 has a function of performing addition processing of a plurality of lines of data for the horizontal direction. In addition, 'depending on the horizontal signal line 1 A line connection of 8 is provided for storing data of a plurality of added target lines. For example, when a plurality of target lines are transmitted to the line connection of the digital arithmetic unit 29 via the horizontal signal line 18 of the individual system, Memory is required. If a majority of the added target lines are transmitted via the horizontal signal line 18 of a system, the memory is required to store the data of the added target line. The horizontal scanning circuit 12 synchronizes with the low speed clock CLK2, and sequentially selects the lines. The row A/D circuit 25 in the processor 26 directs the signal to the horizontal signal line (horizontal output line) 18. For example, the horizontal scanning circuit 12 has a horizontal decoder 12a for defining the readout line in the horizontal direction. (Selecting individual row A/D circuits 25 in row processor 26), and horizontal drive unit 12b for each signal of row processor 26 as defined by horizontal decoder 12a The out address is directed to the horizontal signal line 18. The horizontal signal line 18 is arranged, for example, for the number of bits η processed by the row A/D circuit 25 (n is a positive integer) if 1 〇 (= η) bits The pixel array unit 10 line is arranged to correspond to the number of bits. Each element of the drive controller 7, such as the horizontal scanning circuit 12 and the vertical scanning circuit 14 is formed together with the pixel array unit 1 On a semiconductor region formed by a single crystal germanium or the like, this is performed by using a technique similar to that of the semiconducting-14-200845735 bulk body circuit fabrication technique to form a solid-state image pickup device such as a semiconductor system. These individual functional units form the present embodiment. A portion of the solid-state imaging device 1 in the example, also referred to as "single-wafer type" (provided on the same semiconductor substrate), includes each functional unit integrally formed on a semiconductor region made of a single crystal germanium or the like. This is performed by using a semiconductor integrated circuit manufacturing technique to become a CMOS image pickup device such as a semiconductor system. The solid-state image pickup device 1 may be of a single wafer type in which individual components are The body is molded on the same semiconductor component, but it is not shown, and may also be a module type having an image pickup function, except for various signal processors of the pixel array unit 1 , the drive controller 7 and the line processor 26 . An optical system such as a pick-up lens, an optical low-pass mirror, or an infrared cut-off filter is packaged. The horizontal scanning circuit 12 and the vertical scanning circuit 14 include, for example, a decoder and are supplied in response to the self-communication/timing controller 20. The control signals CN2 and C N1 start a shift operation (scan). Therefore, the column control line 15 includes various pulse signals for driving the unit pixel 3 (for example, the pixel reset pulse RST, the transfer pulse TRG, and a vertical Select pulse VSEL). Although not seen, the communication/timing controller 20 has a functional block of a timing generator TG (eg, a read address control device) that supplies a clock and predetermined timing pulse signals required for each unit operation, and A functional block of a communication interface receives a main clock CLK0 supplied from an external main controller via a terminal 5a, and receives data DATA indicating an operation mode and the like supplied from an external main controller via the terminal 5b, and outputs a solid state including Photo -15- 200845735 Information from device 1 to the external host controller. For example, the communication/timing controller 20 outputs a horizontal address signal to the horizontal decoder 12a and outputs a vertical address signal to the vertical decoder i4a. Each decoder receives the signal and selects the corresponding column or row. At this time, since the unit pixels 3 are arranged in a two-dimensional matrix, it is preferable to perform high-speed reading of pixel signals and pixel data by performing the following steps: performing (vertical) scanning reading, in which pixel signals are The analog pixel signal generated by the generator 5 and output via the vertical signal line 19 is accessed and read in column units (in a row parallel manner), and then (horizontal) scan reading is performed, where the pixel signal (this The digital pixel data in the example is accessed in the column direction in the column direction, which is the arrangement direction of the vertical lines, and is read out to the outside. Of course, not only the scanning and reading are performed, but also the random access can be completed by directly specifying the address of the pixel unit 3 to be read, so that only the necessary unit pixel 3 can be read. The communication/timing controller 20 supplies a clock obtained by dividing the clock CLK1 having the same frequency as the main clock CLK0 via the terminal 5a, dividing the clock CLK1 by 2, or further dividing the clock CLK1 by the obtained low-speed clock to each unit in the device, for example To the horizontal scanning circuit 1, the vertical scanning circuit 14, and the line processor 26. In the following, a clock obtained by dividing by 2 or a clock having all of the acquired clocks is referred to as a low-speed clock C L K 2 . The vertical scanning circuit 14 selects a column of the pixel array unit 1 , and supplies the necessary pulses to the selected column. For example, the vertical scanning circuit 14 has a vertical decoder 14a for defining one of the readout columns in the vertical direction (selected - one column of the pixel array unit 10), and a vertical drive unit 14b for supplying a pulse - 16- 200845735 The read address (in the column direction) defined by the vertical decoder for driving to the control line 15 of the cell pixel 3. The vertical decoder 14a simultaneously defines a readout column and also selects a column as an electronic shutter. In this embodiment, it is possible to select an A/D conversion operation, that is, a normal frame mode, to progressively scan to read the information of the unit pixel 3 and increase the frame rate by N times the high-speed frame rate according to each operation mode. The speed is twice as high as the normal frame mode. Preferably, in addition to sequentially scanning in the normal frame rate mode with the horizontal decoder 12a, the horizontal scanning circuit 12 or the vertical scanning circuit 1 4 address decoder, arbitrarily selects the columns and rows to be processed, The addition read operation or the decimal read operation can be performed in the high-speed frame mode. In particular, when the color separation filter for capturing the color image is provided in the relationship with respect to the phase-out operation, each of the pixels in the pixel array unit 1 is provided. Preferably, at least in the vertical scanning circuit 14, the addition can be performed on the unit pixels 3 having the same color. For the parallel A/D conversion processing, the addition processing is performed in the vertical direction, and a vertical decoder 14a is preferably provided for selecting the control line 15 at least in the vertical scanning circuit 14. When capturing a color image, color mixing occurs if the addition process is performed on pixels having different filter elements. On the other hand, if the pixels are reasonably executed on pixels having the same color, for example, in Bayer with pixels in odd or even columns, color mixing does not occur. "Parallel to A/D conversion, performing the addition processing in the vertical direction" on the last addition processing target column in the majority addition processing target column

p 14a 除了 執行 出所 ,例 ,執 包含 得相 〇 加讀 元像 處理 行於 地, 擇任 色元 加處 置中 表示 A/D -17- 200845735 轉換處理結果所取得之計數値顯示一種狀態,其中,執行 在多數處理目標列中之單元像素3的像素信號上之A/D轉 換處理的結果係被相加。尤其,如果CDS處理與在計數 器2 54中之A/D轉換一起執行,則計數値顯示像素信號分 量的相加結果。換句話說,這表示在垂直方向中之相加處 理係與在行A/D電路25中之A/D轉換處理一起執行。 當然,這在本案中並不是必要的。也有可能在讀出列 爲順序掃描所讀出垂直方向的讀出列後,以數位算術處理 ,執行相加處理,使用依序選擇讀出列的簡單掃描電路, 而不使用能任意選擇讀出列的垂直解碼器1 4a。然而,當 有必要外部記憶體(用於多數列之線記憶體),以儲存多數 相加目標列的資料。 或者,可以想出行處理器2 6外,多數相加目標列係 被個別讀出及爲數位算術處理對之執行的相加處理。於此 時,並不需要外部記憶體(用於多數列的線記憶體)’然而 ,其缺點爲電路規模愈大,這是因爲行處理器26(行A/D 電路25)、參考信號產生器27、水平掃描電路12及垂直 掃描電路1 4並不需要被安置在多數列的每一系統中。例 如,如果相加處理執行兩列,則上述兩電路被安排有像素 陣列單元1 0在其間。 相反,如果在垂直方向中之相加處理係並行於行A/D 電路25中之A/D轉換處理執行,則其優點爲並不需要外 部記憶體或多數系統行處理器26。針對此點,本實施例採 用一機制,用以一起執行垂直方向中之相加處理與在行 -18- 200845735 A/D電路25中之A/D轉換處理。 另一方面,對於具有相同顏色之單元像素3的水平方 向中之相加處理可以藉由在以依序掃描水平方向以讀出後 ,使用依序選擇讀出行之簡單序向掃描電路,在數位算術 處理中選擇具有相同顏色之相加目標單元像素3而加以執 行,而不使用能任意選擇至輸出電路28之讀出行的水平 解碼器12a。或者,相加處理可以被執行,同時,完成以 水平解碼器1 2a所選擇之讀出列順序進行適當切換,使得 在依據水平方向中之選擇順序讀出後,具有相同顏色的相 加目標單元像素3的元件被依序轉送至被數位算術處理( 例如使用一數位算術單元29)所依序傳送之具有相同顏色 的單元像素的元件上。 再者,如日本專利申請2005-278 1 3 5案所述,即其第 四及第五實施例,一架構可以被採用,其中其可以實施例 如在奇數行(例如第一行及第三行)、或在偶數行(例如第二 行及第四行)上之像素相加,或者,其中像素相加之行組 合可以被任意切換,藉由安排一選擇開關,以在像素陣列 單元丨〇與行A/D電路25間切換一讀出目標行,及藉由安 排每一對行處理器26(行A/D電路25)、參考信號產生器 2 7、水平掃描電路1 2及垂直掃描電路1 4,以切換像素陣 列單元1 0。 在具有此架構的固態攝像裝置1中,自單元像素3輸 出的像素信號係被供給至在行處理器2 6中之行A/D電路 25,經由每一垂直行,經由垂直信號線1 9。 -19- 200845735 在行處理器26中之每一行A/D電路25接收一列中之 像素的類比信號So並處理類比信號So。例如,每一行 A/D電路25具有一類比數位轉換器(ADC)電路,其將類比 信號轉換爲例如1 0位元數位信號,與用於例如低速時鐘 CLK2。 執行於行處理器2 6中之A/D轉換處理使用一種並行 每一列之執行A/D轉換的方法,使用安排於每一行中之行 A/D電路25對並行儲存於每一列中之類比信號進行。在 此時,單斜率積分(或斜波信號比較)A/D轉換技術係被使 用。因爲此技術可以以簡單結構實施A/D轉換器,所以即 使A/D轉換器被並聯排列,電路規模並未增加。 爲了增行單斜率積分A/D轉換,處理目標類比信號係 根據自轉換開始直到匹配參考信號Vslop及一處理目標信 號電壓爲止,被轉換爲數位信號。原理上,斜波形參考信 號Vslop係被供給至比較器(電壓比較器),同時,計數以 時鐘信號開始。A/D轉換被執行,以計數時鐘,直到取得 脈衝信號爲止,這表示經由垂直信號線1 9輸入之類比像 素信號與參考信號Vslop間之比較結果。 再者,於此時,相對於電壓模式中之脈衝信號輸入經 垂直信號線1 9,藉由引入適當電路,有可能以A/D轉換 執行一操作用,以移除在重置該像素後的信號位準(稱爲 雜訊位準或重置位準)與對應於光數量的真信號位準V s i g 間之差。此操作等效於所謂CDS處理。以此方式,例如 固定圖案雜訊(FPN)或重置雜訊之雜訊信號成份因此被移 -20- 200845735p 14a In addition to the execution of the example, the execution includes the reading of the meta-image processing in the ground, and the count of the conversion processing result indicated by the A/D -17-200845735 in the optional color element plus processing displays a state, wherein The results of the A/D conversion process performed on the pixel signals of the unit pixels 3 in the majority of the processing target columns are added. In particular, if the CDS processing is performed together with the A/D conversion in the counter 2 54 , the count 値 displays the addition result of the pixel signal components. In other words, this means that the addition processing in the vertical direction is performed together with the A/D conversion processing in the row A/D circuit 25. Of course, this is not necessary in this case. It is also possible to perform the addition processing by digital arithmetic processing after reading out the readout columns listed in the vertical direction of the sequential scanning, and use the simple scanning circuit for sequentially selecting the readout columns without using the arbitrarily selectable readout. Column vertical decoder 1 4a. However, when external memory (for line memory of most columns) is necessary, the data of the majority of the added target columns is stored. Alternatively, in addition to the line processor 26, the majority of the addition target columns are individually read and added to the digital arithmetic processing. At this time, external memory (line memory for a plurality of columns) is not required. However, the disadvantage is that the circuit scale is larger because the row processor 26 (row A/D circuit 25) and the reference signal are generated. The processor 27, the horizontal scanning circuit 12 and the vertical scanning circuit 14 do not need to be placed in each of the plurality of columns. For example, if the addition process performs two columns, the above two circuits are arranged with the pixel array unit 10 in between. On the contrary, if the addition processing in the vertical direction is performed in parallel with the A/D conversion processing in the row A/D circuit 25, there is an advantage that the external memory or the majority system line processor 26 is not required. In response to this, the present embodiment employs a mechanism for performing the addition processing in the vertical direction and the A/D conversion processing in the line -18-200845735 A/D circuit 25 together. On the other hand, the addition processing in the horizontal direction for the unit pixels 3 having the same color can be performed by using a simple sequential scanning circuit that sequentially selects the readout lines after sequentially scanning the horizontal direction for reading. The addition of the target unit pixel 3 having the same color is selected in the arithmetic processing without using the horizontal decoder 12a which can arbitrarily select the readout line to the output circuit 28. Alternatively, the addition processing may be performed while completing the appropriate switching in the readout column order selected by the horizontal decoder 1 2a so that the addition target units having the same color are read after being sequentially read in accordance with the selection order in the horizontal direction. The elements of pixel 3 are sequentially transferred to elements of unit pixels of the same color that are sequentially transmitted by digital arithmetic processing (e.g., using a digital arithmetic unit 29). Furthermore, as described in Japanese Patent Application No. 2005-278 135, that is, its fourth and fifth embodiments, an architecture may be employed in which it may be implemented, for example, in odd rows (for example, the first row and the third row). ), or adding pixels on even lines (for example, the second line and the fourth line), or a combination of lines in which pixels are added can be arbitrarily switched by arranging a selection switch to be in the pixel array unit Switching a read target line with the row A/D circuit 25, and by arranging each pair of line processors 26 (row A/D circuit 25), reference signal generator 27, horizontal scanning circuit 12, and vertical scanning Circuit 1 4 to switch pixel array unit 10. In the solid-state image pickup device 1 having this configuration, the pixel signals output from the unit pixel 3 are supplied to the row A/D circuit 25 in the line processor 26, via each vertical line, via the vertical signal line 19 . -19- 200845735 Each row A/D circuit 25 in row processor 26 receives the analog signal So of a pixel in a column and processes the analog signal So. For example, each row of A/D circuits 25 has an analog-to-digital converter (ADC) circuit that converts an analog signal into, for example, a 10-bit digital signal, and is used, for example, for a low-speed clock CLK2. The A/D conversion process performed in the line processor 26 uses an analog A/D conversion method for each column, using the row A/D circuit 25 arranged in each row to store the analogy in parallel in each column. The signal is carried out. At this time, a single slope integral (or ramp signal comparison) A/D conversion technique is used. Since this technique can implement the A/D converter in a simple structure, even if the A/D converters are arranged in parallel, the circuit scale does not increase. In order to add single-slope integral A/D conversion, the processing target analog signal is converted into a digital signal according to the self-conversion start until the matching reference signal Vslop and a processing target signal voltage. In principle, the ramp waveform reference signal Vslop is supplied to the comparator (voltage comparator), and at the same time, the count starts with the clock signal. The A/D conversion is performed to count the clock until the pulse signal is obtained, which indicates the comparison between the analog pixel signal input via the vertical signal line 19 and the reference signal Vslop. Furthermore, at this time, with respect to the pulse signal input in the voltage mode via the vertical signal line 197, by introducing an appropriate circuit, it is possible to perform an operation by A/D conversion to remove after resetting the pixel. The difference between the signal level (called the noise level or the reset level) and the true signal level V sig corresponding to the amount of light. This operation is equivalent to the so-called CDS processing. In this way, the noise signal components such as fixed pattern noise (FPN) or reset noise are thus shifted. -20- 200845735

[參考信號產生器及行A/D電路的細節] 參考信號產生器27包含一 DA轉換器(DAC)27a。參 考信號產生器27同步於計數時鐘CKdac由通訊/時序控制 器20產生由控制資料CN4所表示之啓始値開始的步階鋸 齒波,或斜波信號(以下也稱爲參考信號 Vslop),然後, 供給所產生之用於A/D轉換的步階鋸齒波參考信號Vslop 作爲參考信號或ADC參考信號給在行處理器26中之每一 行A/D電路25。雖然未顯示出,但較佳地提供一雜訊抑 制濾波器。 根據時鐘轉換器2 3中之乘法電路所產生之被乘時鐘( 高速時鐘)所產生之參考信號 Vslop可以改變快於根據主 時鐘CLK0經端子5a輸入所產生者。 自通訊/時序控制器20所供給至參考信號產生器27 之DA轉換器27a的控制資料CN4包含資訊,以相對於時 間遵守數位資料的變化率,使得用於每一比較處理的參考 信號Vslop基本上具有相同的變化率。更明確地說,一計 數値係同步於計數時鐘CKdac每單位時間作變化,及計數 値係爲電流相加型之DA轉換器所轉換爲電壓信號。 在通訊/時序控制器20的控制下,本實施例之DA轉 換器27a可以在電壓比較器252中之比較處理時,改變( 在特定例中爲變大)參考信號Vslop之變化特徵(在特定例 中爲斜率)。 -21 - 200845735 參考信號的斜率可以藉由使用改變計數時鐘CKdac之 頻率(時鐘循環)的方法加以調整。例如,當予以供給至 DA轉換器27a的計數時鐘CKdac的頻率啓始被設計成與 計數時鐘CK0的頻率相同,較佳地,一旦到達預定計數, 計數時鐘CKdac的頻率係變成2Am倍快於計數時鐘CK0 的頻率。明確地說,當到達第一預定計數時,計數時鐘 CKdac的頻率爲兩倍快於該計數時鐘CK0的頻率時,及當 到達第二預定計數時,計數時鐘CKdac之頻率爲四倍快於 計數時鐘CK0的頻率。 上述方法只是一例子,及斜率變化並不限於此方法。 例如,任意電路可以爲一方法所使用,其中在保持供給至 參考信號產生器27的計數時鐘CKdac的循環不變時,輸 出有一 y=a-yS*X所計算的電位,其中X爲計數値,^爲 啓始値、及/3爲包含在控制資料CN4中之參考信號Vslop 的斜率(變化率),或者,依據表示包含在控制資料CN4中 之斜波電壓的斜率(變化率)的資訊,每一計數時鐘CKdac 之電壓△ SLP變化係被調整。參考信號Vsi〇p之斜率的調 整可以除了改變時鐘循環外,藉由改變單位電流源中之電 流量,而每時鐘調節△ S L P加以實施。 行A/D電路25包含電壓比較器25 2及計數器254, 並具有η-位元A/D轉換功能。電壓比較器252比較自參 考信號產生器27之DA轉換器27a所產生之參考信號 Vslop與自單元像素3所供給經垂直信號線i9(h〇,H1, …)給每一列控制線15(V0,VI,…)的類比像素信號。計 •22- 200845735 數器254計數時間,直到電壓比較器252完成比較處理爲 止,並儲存所得計數。 在本實施例中,參考信號Vslop共同由DA轉換器 2 7 a供給至安排在個別列中之電壓比較器2 5 2,及比較處 理係藉由使用予以爲每一電壓比較器2 5 2所處理之像素信 號電壓Vx上之共同參考信號Vslop加以執行。 通訊/時序控制器2 0具有控制功能,以取決於是否電 壓比較器252執行像素信號之重置位準Vrst或信號分量 Vsig的比較操作,而切換計數器254的計數處理模式。一 控制信號CN5被由通訊/時序控制器20供給至每一行A/D 電路25中之計數器254,以指示計數器254執行下數模式 或上數模式。 爲參考信號產生器27所產生之步階形參考信號Vslop 被一'起輸入至電壓比較器252的一輸入端RAMP及至另一 電壓比較器252的另一輸入端RAMP。對應垂直行之垂直 信號線1 9係連接至電壓比較器2 5 2的另一輸入端,及來 自像素陣列單元1 〇的像素信號電壓被個別地輸入。電壓 比較器252的輸出信號係被供給至計數器254。 計數時鐘CK0係被一起由通訊/時序控制器20被輸入 至計數器254的時鐘端CK及至另一計數器254的另一時 鐘端CK。 類似於參考信號Vslop,爲時鐘轉換器23之乘法電路 所產生之被乘時鐘(高速時鐘)可以被使用作爲計數時鐘 CK0。在此時,可以完成較使用經端子5a輸入之主時鐘 -23- 200845735 CLK0所能完成更高之解析度。 計數器2 5 4具有一特性,其使用不管計數模式之共同 上/下計數器(U/D CNT),計數處理可以藉由於下數操作與 上數操作間切換加以完成。 雖然計數器254之架構並未示出,但計數器254可以 藉由修改資料儲存單元265之配線配置被架構以一閂鎖器 入同步計數器中加以實施,並且,藉由接收一單一計數時 鐘C Κ 0加以執行內部計數。 然而,在本實施例中,使用非同步計數器作爲計數器 2 54係較佳的,其可以輸出一計數輸出値,而不必與計數 時鐘CK0同步。基本上,也可以使用一同步計數器,然而 ,當使用同步計數器時,所有正反器,換句話說,計數器 基本元件的操作係爲計數時鐘CK0所限制。因此,如果需 要較高頻率操作,則使用適用於高速操作之非同步計數器 係較佳的,因爲其操作限制頻率只爲第一正反器的限制頻 率所決定。 雖然所有細節將如後述,但本實施例中之行處理器 2 6(特別是行A/D電路25)及參考信號產生器27具有如下 之特徵:在使用相加讀出操作之高速框率模式期間,每一 位元之計數時鐘(稱爲計數循環)之頻率及/或供給至用於每 一列之行A/D電路25的參考信號Vsl op之斜率係被適當 地改變,以執行對每一列施加不同加權的垂直方向中之相 加處理,因此,在相加後之垂直方向中之每一顏色的空間 位置可以被適當地調整以適當間距,以取得具有高解析度 -24- 200845735 之影像。較佳地,係爲數位算術單元29所執行一加權相 加,同時也於垂直方向進行,使得在相加後之水平方向中 之每一顏色的空間位置可以被調整以適當間距,以取得高 解析度之影像。 更明確地說,在相加處理時,藉由執行加權數位相加 處理,以改變相加目標像素的加權,在相加後的像素中心 並不會在垂直方向或水平方向偏心,而是移動至較大加權 所施加的一側上。 「改變相加目標像素的加權」表示在垂直方向及水平 方向中,相加目標像素的至少一像素具有與其他像素的加 權不同。例如,如果兩像素的相加處理中,個別加權可以 設定於1至n(n爲大於1)的比例。較佳地,n爲大於2之 正整數或任意値,例如2,3,4,…等等,最好η爲2的 乘冪,例如2,4,8,. ·等等。 再者,在數位相加處理時,特別是以處理時間或動態 範圍看來,較佳地,採用一方法,其中在當處理多數相加 目標列時,參考信號Vsl op的斜率保持相同,計數器時鐘 的頻率被切換。考量加速每一位元的正反器,較佳地採用 一方法’其中只有在較高效位元或較低效位元中之正反器 被作成以高速操作,而不是使所有位元的正反器都操作於 局速。 一控制脈衝被經由控制線1 2 c自水平掃描電路1 2輸 入至計數器2 5 4。計數器2 5 4具有閂鎖功能,用以保有計 數結果’因此’保有一計數値,直到經由控制線〗2 c接收 -25- 200845735 一控制脈衝作爲一指令爲止。 在行A/D電路25之每一輸出側及來自計數器254之 輸出可以被連接至水平信號線1 8。或者,如圖所示,一作 爲η-位元記億體的儲存在計數器254保有的計數結果的資 料儲存單元25 6與安排在計數器254及資料儲存單元256 間之開關2 5 8可以被安排在計數器254的下一級。 如果採用包含資料儲存單元256之架構,則作爲控制 脈衝的記憶體傳送指令脈衝CN 8係在一預定時序被一起由 通訊/時序控制器2 0供給至在其他垂直行中之開關2 5 8及 其他開關2 5 8。在接收記憶體傳送指令脈衝CN 8時,開關 2 5 8傳送對應計數器2 5 4的計數値給資料儲存單元2 5 6。 資料儲存單元2 5 6保有/儲存所傳送之計數値。 將計數器2 5 4之計數値於預定時序儲存至資料儲存單 元2 5 6的機制並不限於在其間安置有開關2 5 8的架構。例 如’該機制也可以藉由採用一架構加以實現,其中計數器 254係直接連接至資料儲存單元256及計數器254之輸出 致能係爲gS憶體傳送指令脈衝C Ν 8所控制,或者,採用一 架構,其中記憶體傳送指令脈衝CN 8被使用爲閂鎖時鐘, 用以決定資料儲存單元2 5 6之資料取得時序。 資料儲存單元256經由控制線12c自水平掃描電路12 接收控制脈衝。貪料儲存單元2 5 6儲存自計數器2 5 4取得 之計數値,直到經由控制線i 2c接收該控制脈衝作爲指令 爲止。 水平掃描電路1 2具有作爲讀出掃描單元的功能,並 -26- 200845735 且並行於行處理器26中之每一電壓比較器252及計 2 5 4的處理,讀出儲存於資料儲存單元2 5 6中之計數《丨 資料儲存單元2 5 6之輸出被連接至水平信號線1ί 平信號線18具有η-位元寬信號線,其係爲行A/D電 之位元寬度,並經由未示出之η數量之對應於個別輸 的感應電路被連接至輸出電路2 8。 尤其,如果資料儲存單元2 56被包含在此架構中 爲計數器254所儲存之計數結果可以被傳送至資料儲 元25 6。因此,計數器254之計數操作,即A/D轉換 與對水平信號線1 8之計數結果的讀出操作可以個別 制,使得管線操作可以實現,其中A/D轉換處理及對 之信號讀出操作可以彼此並行地進行。 在此架構中,行A/D電路25在對應於水平遮没 之像素信號讀出週期,執行計數操作,並以預定時序 計數結果。更明確地說,首先,電壓比較器2 5 2比較 考信號產生器2 7供給之斜波電壓與經由垂直信號線 入之像素信號電壓,當兩電壓彼此相等時,電壓比 252之比較器輸出被反相。例如,電壓比較器252將 電位的Η位準設定爲不作動,及當像素信號電壓與參 號Vslop相等時,則設定至L位準(動作狀態)。 計數器254以同步於由參考信號產生器27所供 斜波電壓,以下數模式或上數模式開始計數操作,當 比較器輸出反相的資訊時,計數器2 54停止計數操作 鎖(保持/儲存)在該時之計數値作爲像素資料,因而 數器 直。 ! 〇水 路25 出線 ,則 存單 處理 地控 外部 週期 輸出 自參 1 9輸 較器 一源 考信 給之 接收 並閂 完成 -27- 200845735 A/D轉換。 隨後,根據經由控制線1 2 c以預定時序由水平掃描電 路12輸入之水平選擇信號CH(i)之移位操作,計數器254 依序輸出儲存/保持像素資料至行處理器2 6的外側或經由 輸出端5 c輸出至具有像素陣列單元1 0之晶片的外部。 其他各種信號處理電路也可以包含在形成固態攝像裝 置1的元件中,由於它們並未直接關係於本實施例,所以 它們並未被顯示。 [像素單元] 圖2顯示於圖1中之固態攝像裝置1所用之單元像素 3的架構圖,及在驅動單元、驅動控制線及像素電晶體間 之線連接。在像素陣列單元1 〇中之每一單元像素(像素單 元)3之結構係類似於一般CMOS影像感應器的架構。在此 實施例中,4TR結構大致被用於CMOS感應器中或者也可 以使用包含三電晶體的3 TR結構。不必說,這些像素結構 只是例子,任何結構均可以使用,只要其爲用於一般 CMOS影像感應器中之陣列結構即可。 在像素內放大器中,例如,可以使用浮置擴散放大器 。例如,一般用於CMOS感應器中之具有四電晶體之像素 放大器(以下簡稱”4 TR結構”)可以用於每一電荷產生器。 4TR結構包含:一讀出選擇電晶體,其係爲電荷讀出單元 (傳送閘/讀出閘)的例子;一爲重置閘的重置電晶體;一垂 直選擇電晶體;及一源極跟隨放大電晶體,其係爲用以檢 -28 - 200845735 測浮置擴散的電位變化的檢測器。 例如’具有不於圖2中之4 T R結構的單元像素3包含 一電荷產生器32及四電晶體連接至其上。明確地說,電 荷產生器32具有電荷累積功能,用以累積電荷;及光電 轉換功能,用以接收光並轉換所接收之光成爲電荷。四電 晶體包含讀出選擇電晶體(傳送電晶體)34,其係爲電荷讀 出單元(傳送閘/讀出閘)例子;一重置電晶體36,其係爲 重置閘的例子;一垂直選擇電晶體4 0 ;及一源極跟隨放大 電晶體4 2 ^其係爲用以檢測浮置擴散3 8之電位變化的檢 測器。 單元像素3包含有浮置擴散3 8之浮置擴散放大器 (F D A)像素信號產生器5。浮置擴散爲具有電荷積功能的 電荷注入單元例並爲具有寄生電容的擴散層。 曰買出运擇電晶體(弟一*傳送卓兀)3 4爲一*傳送驅動緩衝 器BF1所驅動經傳送線(讀出選擇線Τχ)55,該緩衝器被 供給有傳送信號 Φ TRG。重置電晶體3 6爲重置驅動緩衝 器BF2所驅動經重置線(RST)56,緩衝器BF2被供給有重 置信號 Φ RST。垂直選擇電晶體40係爲選擇驅動緩衝器 BF3所驅動經垂直選擇線(SEL)52,緩衝器BF3被供給有 垂直選擇信號Φ VSEL。每一驅動緩衝器可以爲垂直掃描 電路1 4中之垂直驅動電路1 4b所驅動。 在像素信號產生器5中之重置電晶體3 6之源極係被 連接至浮置擴散38及其汲極被連接至電源VD(可以共同 至電源Vdd),及一像素重置脈衝RST由重置驅動緩衝器 -29- 200845735 BF2輸入至閘極(重置閘RG)。 例如,垂直選擇電晶體4 0之汲極係連接至放大電晶 體42的源極,而源極係連接至像素線5 1、及其閘極(明確 稱爲”垂直選擇閘SELV”)係被連接至垂直選擇線52。然而 ,配線架構並不限於此,垂直選擇電晶體40也可以令其 汲極連接至電源Vdd及其源極連接至放大電晶體42的汲 極,及垂直選擇閘SELV可以連接至垂直選擇線52。 垂直選擇信號Φ VSEL被供給至垂直選擇線52。放大 電晶體4 2令其閘極連接至浮置擴散3 8、其汲極經由垂直 選擇電晶體40連接至電源Vdd、及其源極連至像素線51 及垂直信號線53(19)。 再者,垂直信號線53之一端延伸向行處理器26,及 垂直信號線53係於朝向行處理器26的路徑上,連接至讀 出電流供給24,藉以形成一源極跟隨器架構,其在垂直信 號線5 3及放大電晶體42間被供給有實質不變的操作電流 (讀出電流)。 明確地說,讀出電流供給24包含NMOS電晶體(明確 稱爲”載入MOS電晶體”)242安置在每一垂直行中,及一 參考電流源244包含爲所有垂直行所分享之電流產生資料 儲存單元256,及一 NMOS電晶體246,其閘極與汲極係 共同連接及其源極係連接至一源極線2 4 8。 每一載入NMOS電晶體242之汲極係連接至行中之對 應垂直信號線5 3及其源極係一起連接至源極線2 4 8作爲 接地線。因此,安排在每一垂直行中之載入ΝΜ Ο S電晶體 -30- 200845735 242之閘極係連接至NMOS電晶體246的閘極,以形成電 流鏡電路,其作用爲至垂直信號線1 9的電流源。 源極線248係令其水平方向(示於圖1左及右之垂直 行)之端連接至地端(GND),其係爲基材偏壓。有關於載入 NMOS電晶體242之接地的操作電流(讀出電流)係被由晶 片的左及右端供給。 只有必要時,用以允許電流產生器2 4 5輸出一預定電 流之負載控制信號SFLACT係由未示出之負載控制器供給 至電流產生器245。當讀出信號時,具有接收一主動負載 控制信號SFLACT之電流產生器245連續允許使用連接至 放大電晶體42之載入NMOS電晶體242,以預定定電流 流出預定不變電流。換句話說,載入NMOS電晶體242藉 由形成源極跟隨器與安置於選定列中之放大電晶體42,供 給讀出電流至放大電晶體42,藉以輸出一信號至垂直信號 線53。 在上述4TR結構中,因爲浮置擴散38係連接至放大 電晶體42之閘極,及放大電晶體42經由像素線51輸出 對應於在電壓模式之浮置擴散38的電位(以下稱爲”FD電 位”)至垂直信號線53(19)。 重置電晶體3 6重置浮置擴散3 8。讀出選擇電晶體(傳 送電晶體)34傳送電荷產生器32所產生之信號電荷至浮置 擴散3 8。很多像素被連接至垂直信號線1 9,以選擇一像 素,只有在被選定像素中之垂直選擇電晶體40被導通。 因此,只有被選擇像素被連接至垂直信號線1 9,及所選擇 -31 - 200845735 之像素信號被輸出至垂直信號線1 9。 [在電壓比較器與計數器間之介面例] 圖3爲一圖,顯示在電壓比較器252及計數器254旁 之連接介面例。 當自像素陣列單元1 〇讀出之像素信號電壓Vx與自參 考信號產生器27供給之參考信號Vslop匹配時,在每一 行中之對應垂直信號線1 9的電壓比較器2 5 2反相比較器 輸出Comp由一非動作狀態(例如高位準)反相至動作狀態( 例如低位準)。 計數器計數器254包含一閘5 02,用以根據來自電壓 比較器252之比較器輸出Comp,控制(閘控)計數時鐘 CK0的輸出;及一計數執行單元504,用以根據來自閘 5〇2的計數時鐘CIN,執行計數操作。 通訊/時序控制器20供給斜率改變指令信號CHNG給 參考信號產生器27、一計數模式控制信號UDC、重置控 制信號CLR、資料保持控制脈衝HLDC、及計數時鐘控制 信號TH分別給計數執行單元5 04。 在斜率改變指令信號CHNG中,適用以依據DA轉換 器2 7a改變參考信號Vslop之斜率的架構之信號係被使用 。例如,斜率改變指令信號CHNG可以爲能適當地切換頻 率(時鐘循環)之計數時鐘CKdac,或者可以包含在控制資 料CN4中,作爲參考信號Vslop的斜率(改變率)/3。 通訊/時序控制器20可以獨立地調整改變參考信號 -32- 200845735[Details of Reference Signal Generator and Row A/D Circuit] The reference signal generator 27 includes a DA converter (DAC) 27a. The reference signal generator 27 synchronizes with the count clock CKdac by the communication/timing controller 20 to generate a step sawtooth wave starting from the start point indicated by the control data CN4, or a ramp wave signal (hereinafter also referred to as a reference signal Vslop), and then The step sawtooth reference signal Vslop generated for the A/D conversion is supplied as a reference signal or an ADC reference signal to each of the row A/D circuits 25 in the line processor 26. Although not shown, a noise suppression filter is preferably provided. The reference signal Vslop generated by the multiplied clock (high-speed clock) generated by the multiplying circuit in the clock converter 23 can be changed faster than the one generated by the input of the terminal 5a according to the main clock CLK0. The control data CN4 supplied from the communication/timing controller 20 to the DA converter 27a of the reference signal generator 27 contains information to comply with the rate of change of the digital data with respect to time, so that the reference signal Vslop for each comparison process is basically Have the same rate of change. More specifically, a counting system is changed every unit time in synchronization with the count clock CKdac, and a counting converter is converted into a voltage signal by a DA converter of a current addition type. Under the control of the communication/timing controller 20, the DA converter 27a of the present embodiment can change (in a specific example, become larger) the variation characteristic of the reference signal Vslop (in a specific case) in the comparison processing in the voltage comparator 252 In the case of the slope). -21 - 200845735 The slope of the reference signal can be adjusted by changing the frequency (clock cycle) of the count clock CKdac. For example, when the frequency of the count clock CKdac supplied to the DA converter 27a is started to be the same as the frequency of the count clock CK0, preferably, once the predetermined count is reached, the frequency of the count clock CKdac becomes 2 Am times faster than the count. The frequency of the clock CK0. Specifically, when the first predetermined count is reached, the frequency of the count clock CKdac is twice as fast as the frequency of the count clock CK0, and when the second predetermined count is reached, the frequency of the count clock CKdac is four times faster than the count. The frequency of the clock CK0. The above method is only an example, and the change in slope is not limited to this method. For example, any circuit can be used in a method in which, when the cycle of the count clock CKdac supplied to the reference signal generator 27 is kept constant, the output has a potential calculated by y = a - yS * X, where X is a count 値, ^ is the start 値, and /3 is the slope (rate of change) of the reference signal Vslop contained in the control data CN4, or based on the information indicating the slope (rate of change) of the ramp voltage included in the control data CN4. The voltage Δ SLP change of each count clock CKdac is adjusted. The adjustment of the slope of the reference signal Vsi〇p can be implemented by varying the current in the unit current source in addition to changing the clock cycle, and adjusting Δ S L P per clock. The row A/D circuit 25 includes a voltage comparator 25 2 and a counter 254 and has an n-bit A/D conversion function. The voltage comparator 252 compares the reference signal Vslop generated from the DA converter 27a of the reference signal generator 27 with the vertical signal line i9 (h〇, H1, ...) supplied from the unit pixel 3 to each column control line 15 (V0). , VI, ...) analog pixel signals. • 22- 200845735 The counter 254 counts the time until the voltage comparator 252 completes the comparison process and stores the resulting count. In the present embodiment, the reference signal Vslop is supplied from the DA converter 2 7 a to the voltage comparators 2 5 2 arranged in the individual columns, and the comparison processing is performed by using each of the voltage comparators 2 5 2 The common reference signal Vslop on the processed pixel signal voltage Vx is performed. The communication/timing controller 20 has a control function to switch the count processing mode of the counter 254 depending on whether or not the voltage comparator 252 performs a comparison operation of the reset level Vrst of the pixel signal or the signal component Vsig. A control signal CN5 is supplied to the counter 254 in each row of A/D circuits 25 by the communication/timing controller 20 to instruct the counter 254 to execute the down mode or the up mode. The step reference signal Vslop generated by the reference signal generator 27 is input to an input terminal RAMP of the voltage comparator 252 and to the other input terminal RAMP of the other voltage comparator 252. The vertical signal line IX corresponding to the vertical line is connected to the other input terminal of the voltage comparator 252, and the pixel signal voltages from the pixel array unit 1 个别 are individually input. The output signal of the voltage comparator 252 is supplied to the counter 254. The count clock CK0 is input together by the communication/timing controller 20 to the clock terminal CK of the counter 254 and to the other clock terminal CK of the other counter 254. Similar to the reference signal Vslop, a multiplied clock (high speed clock) generated for the multiplication circuit of the clock converter 23 can be used as the count clock CK0. At this time, a higher resolution can be achieved than with the main clock -23-200845735 CLK0 input via the terminal 5a. The counter 2 5 4 has a characteristic that uses a common up/down counter (U/D CNT) regardless of the count mode, and the counting process can be completed by switching between the lower number operation and the upper number operation. Although the architecture of the counter 254 is not shown, the counter 254 can be implemented by modifying the wiring configuration of the data storage unit 265 with a latch into the sync counter, and by receiving a single count clock C Κ 0 Perform an internal count. However, in the present embodiment, it is preferable to use a non-synchronous counter as the counter 2 54, which can output a count output 値 without being synchronized with the count clock CK0. Basically, a sync counter can also be used, however, when a sync counter is used, all flip-flops, in other words, the operation of the counter base element are limited by the count clock CK0. Therefore, if higher frequency operation is required, it is preferable to use a non-synchronous counter suitable for high speed operation because its operation limit frequency is determined only by the limiting frequency of the first flip-flop. Although all the details will be described later, the line processor 26 (particularly the row A/D circuit 25) and the reference signal generator 27 in this embodiment have the following features: high speed frame rate at the use of the addition read operation During the mode, the frequency of the count clock of each bit (referred to as the count cycle) and/or the slope of the reference signal Vsl op supplied to the row A/D circuit 25 for each column are appropriately changed to perform the pair Each column applies a different weighted addition process in the vertical direction, so that the spatial position of each color in the vertical direction after the addition can be appropriately adjusted to an appropriate pitch to obtain a high resolution-24-200845735 Image. Preferably, the weighted addition performed by the digital arithmetic unit 29 is also performed in the vertical direction so that the spatial position of each color in the added horizontal direction can be adjusted to an appropriate pitch to achieve high An image of resolution. More specifically, at the time of the addition processing, by performing the weighted digital addition processing to change the weight of the added target pixel, the center of the added pixel is not eccentric in the vertical direction or the horizontal direction, but is moved. On the side to which the larger weight is applied. "Change the weight of the addition target pixel" means that at least one pixel of the addition target pixel has a different weight from the other pixels in the vertical direction and the horizontal direction. For example, in the addition processing of two pixels, the individual weighting can be set to a ratio of 1 to n (n is greater than 1). Preferably, n is a positive integer greater than 2 or any 値, such as 2, 3, 4, ..., etc., preferably η is a power of 2, such as 2, 4, 8, etc. Furthermore, in the case of digital addition processing, particularly in terms of processing time or dynamic range, preferably, a method is employed in which the slope of the reference signal Vsl op remains the same when the majority of the added target columns are processed, the counter The frequency of the clock is switched. Considering the flip-flop that accelerates each bit, it is better to use a method in which only the flip-flops in the more efficient bits or lower-effect bits are made to operate at high speed instead of making all bits positive. The counters operate at the local speed. A control pulse is input from the horizontal scanning circuit 12 to the counter 2 5 4 via the control line 1 2 c. The counter 254 has a latch function for retaining the count result 'and therefore' has a count 値 until a control pulse of -25-200845735 is received via the control line 〖2c as an instruction. The output side of the row A/D circuit 25 and the output from the counter 254 can be connected to the horizontal signal line 18. Alternatively, as shown in the figure, a data storage unit 25 stored as a η-bit unit stored in the counter 254 and a switch 2 58 arranged between the counter 254 and the data storage unit 256 may be arranged. At the next level of counter 254. If the architecture including the data storage unit 256 is employed, the memory transfer command pulse CN 8 as a control pulse is supplied to the switch 2 58 in the other vertical rows together with the communication/timing controller 20 at a predetermined timing. Other switches 2 5 8. When the memory transfer command pulse CN 8 is received, the switch 258 transmits a count corresponding to the counter 2 5 4 to the data storage unit 2 5 6 . The data storage unit 2 5 6 holds/stores the transmitted count 値. The mechanism for storing the counters of the counters 254 at a predetermined timing to the data storage unit 256 is not limited to the architecture in which the switches 258 are placed. For example, the mechanism can also be implemented by using an architecture in which the counter 254 is directly connected to the data storage unit 256 and the output enable of the counter 254 is controlled by the gS memory transfer command pulse C Ν 8 or The architecture, wherein the memory transfer command pulse CN 8 is used as a latch clock to determine the data acquisition timing of the data storage unit 256. The data storage unit 256 receives control pulses from the horizontal scanning circuit 12 via the control line 12c. The greedy storage unit 2 5 6 stores the count 取得 obtained from the counter 2 5 4 until the control pulse is received as an instruction via the control line i 2c. The horizontal scanning circuit 12 has a function as a readout scanning unit, and is -26-200845735 and is processed in parallel with each of the voltage comparators 252 and 256 in the line processor 26, and is read and stored in the data storage unit 2. Counting in 5 6 "The output of the data storage unit 2 5 6 is connected to the horizontal signal line 1 The flat signal line 18 has an η-bit wide signal line, which is the bit width of the row A/D power, and is via A sensing circuit corresponding to the individual input of the number n which is not shown is connected to the output circuit 28. In particular, if the data storage unit 256 is included in this architecture, the count results stored for the counter 254 can be transferred to the data store 256. Therefore, the counting operation of the counter 254, that is, the A/D conversion and the reading operation of the counting result of the horizontal signal line 18 can be individually made, so that the pipeline operation can be realized, wherein the A/D conversion processing and the signal reading operation thereto are performed. It can be done in parallel with each other. In this architecture, the row A/D circuit 25 performs a counting operation at the pixel signal readout period corresponding to the horizontal blanking, and counts the result at a predetermined timing. More specifically, first, the voltage comparator 252 compares the ramp voltage supplied from the test signal generator 27 with the pixel signal voltage lined through the vertical signal, and when the two voltages are equal to each other, the comparator output of the voltage ratio 252 Is reversed. For example, the voltage comparator 252 sets the potential level of the potential to be inactive, and when the pixel signal voltage is equal to the parameter Vslop, it is set to the L level (operating state). The counter 254 starts the counting operation in synchronization with the ramp voltage supplied from the reference signal generator 27, and the following number mode or the upper mode. When the comparator outputs the inverted information, the counter 2 54 stops counting the operation lock (hold/save). At this time, the count is used as the pixel data, and thus the number is straight. ! 〇水路25 outgoing line, then the deposit receipt processing ground control external cycle output self-referencing 1 9 converter comparator a source test letter to receive and latch complete -27- 200845735 A / D conversion. Subsequently, based on the shift operation of the horizontal selection signal CH(i) input by the horizontal scanning circuit 12 at a predetermined timing via the control line 1 2 c, the counter 254 sequentially outputs the storage/hold pixel data to the outside of the line processor 26 or Output to the outside of the wafer having the pixel array unit 10 via the output terminal 5c. Other various signal processing circuits may also be included in the elements forming the solid-state image pickup device 1, and since they are not directly related to the present embodiment, they are not displayed. [Pixel Unit] Fig. 2 is a view showing the structure of the unit pixel 3 used in the solid-state image pickup device 1 of Fig. 1, and the line connection between the drive unit, the drive control line, and the pixel transistor. The structure of each unit pixel (pixel unit) 3 in the pixel array unit 1 is similar to that of a general CMOS image sensor. In this embodiment, the 4TR structure is generally used in a CMOS sensor or a 3 TR structure including a tri-crystal can also be used. Needless to say, these pixel structures are merely examples, and any structure can be used as long as it is an array structure used in a general CMOS image sensor. In an in-pixel amplifier, for example, a floating diffusion amplifier can be used. For example, a pixel amplifier having four transistors (hereinafter referred to as "4 TR structure") generally used in a CMOS sensor can be used for each charge generator. The 4TR structure includes: a read select transistor, which is an example of a charge readout unit (transfer gate/readout gate); a reset transistor for resetting the gate; a vertical selection transistor; and a source Follow the amplifying transistor, which is a detector for detecting the potential change of the floating diffusion of -28 - 200845735. For example, a unit pixel 3 having a structure of 4 T R which is not in Fig. 2 includes a charge generator 32 and a four-electrode connected thereto. Specifically, the charge generator 32 has a charge accumulation function for accumulating charges; and a photoelectric conversion function for receiving light and converting the received light into a charge. The four transistors include a read select transistor (transfer transistor) 34, which is an example of a charge readout unit (transfer gate/readout gate), and a reset transistor 36, which is an example of a reset gate; The vertical selection transistor 40; and a source follower amplification transistor 4 2 ^ are detectors for detecting the potential change of the floating diffusion 38. The unit pixel 3 includes a floating diffusion amplifier (F D A) pixel signal generator 5 having a floating diffusion 38. The floating diffusion is an example of a charge injection unit having a charge product function and is a diffusion layer having a parasitic capacitance.曰 Buying the electrified transistor (the same as the transmission channel) 3 4 is a transmission line (read selection line Τχ) 55 driven by the transmission drive buffer BF1, and the buffer is supplied with the transmission signal Φ TRG. The reset transistor 36 is a reset line (RST) 56 driven by the reset drive buffer BF2, and the buffer BF2 is supplied with a reset signal Φ RST. The vertical selection transistor 40 is a vertical selection line (SEL) 52 driven by the selection drive buffer BF3, and the buffer BF3 is supplied with a vertical selection signal Φ VSEL. Each of the drive buffers can be driven by a vertical drive circuit 14b in the vertical scan circuit 14. The source of the reset transistor 36 in the pixel signal generator 5 is connected to the floating diffusion 38 and its drain is connected to the power supply VD (which can be common to the power supply Vdd), and a pixel reset pulse RST is Reset Drive Buffer -29- 200845735 BF2 Input to Gate (Reset Gate RG). For example, the drain of the vertical selection transistor 40 is connected to the source of the amplifying transistor 42, and the source is connected to the pixel line 51, and its gate (clearly referred to as "vertical selection gate SELV") is Connected to the vertical selection line 52. However, the wiring structure is not limited thereto, and the vertical selection transistor 40 may have its drain connected to the power source Vdd and its source connected to the drain of the amplifying transistor 42, and the vertical selection gate SELV may be connected to the vertical selection line 52. . The vertical selection signal Φ VSEL is supplied to the vertical selection line 52. The transistor 42 has its gate connected to the floating diffusion 38, its drain connected to the power supply Vdd via the vertical selection transistor 40, and its source connected to the pixel line 51 and the vertical signal line 53 (19). Furthermore, one end of the vertical signal line 53 extends toward the line processor 26, and the vertical signal line 53 is routed toward the line processor 26, connected to the sense current supply 24, thereby forming a source follower architecture. A substantially constant operating current (read current) is supplied between the vertical signal line 53 and the amplifying transistor 42. In particular, the sense current supply 24 includes an NMOS transistor (definitely referred to as a "load MOS transistor") 242 disposed in each vertical row, and a reference current source 244 includes current sharing for all vertical rows. The data storage unit 256, and an NMOS transistor 246, have a gate connected to the drain and a source connected to a source line 248. Each of the drain electrodes connected to the NMOS transistor 242 is connected to the corresponding vertical signal line 5 3 in the row and its source is connected to the source line 2 4 8 as a ground line. Therefore, the gate of the load ΝΜ S transistor -30-200845735 242 arranged in each vertical row is connected to the gate of the NMOS transistor 246 to form a current mirror circuit, which functions as a vertical signal line 1 9 current source. The source line 248 is connected to the ground (GND) at its end in the horizontal direction (the vertical lines shown in the left and right of Fig. 1), which is the substrate bias. The operating current (read current) for the ground applied to the NMOS transistor 242 is supplied from the left and right ends of the wafer. The load control signal SFLACT for allowing the current generator 24 5 to output a predetermined current is supplied to the current generator 245 by a load controller not shown, if necessary. When the signal is read, the current generator 245 having an active load control signal SFLACT is continuously allowed to use the load NMOS transistor 242 connected to the amplifying transistor 42 to flow a predetermined constant current at a predetermined constant current. In other words, the load NMOS transistor 242 supplies a sense current to the amplifying transistor 42 by forming a source follower and an amplifying transistor 42 disposed in the selected column, thereby outputting a signal to the vertical signal line 53. In the above-described 4TR structure, since the floating diffusion 38 is connected to the gate of the amplifying transistor 42, and the amplifying transistor 42 outputs a potential corresponding to the floating diffusion 38 in the voltage mode via the pixel line 51 (hereinafter referred to as "FD" The potential ") to the vertical signal line 53 (19). Reset the transistor 3 6 to reset the floating diffusion 3 8 . The read select transistor (transfer transistor) 34 transfers the signal charge generated by the charge generator 32 to the floating diffusion 38. A number of pixels are connected to the vertical signal line 197 to select a pixel, and only the vertical selection transistor 40 in the selected pixel is turned on. Therefore, only the pixel selected by the selected pixel is connected to the vertical signal line 159, and the pixel signal of the selected -31 - 200845735 is output to the vertical signal line 197. [Example of interface between voltage comparator and counter] Fig. 3 is a diagram showing an example of a connection interface beside voltage comparator 252 and counter 254. When the pixel signal voltage Vx read out from the pixel array unit 1 匹配 matches the reference signal Vslop supplied from the reference signal generator 27, the voltage comparators 2 5 2 of the corresponding vertical signal lines 19 in each row are inverted. The device output Comp is inverted from an inactive state (eg, a high level) to an active state (eg, a low level). The counter counter 254 includes a gate 502 for controlling (gates) the output of the count clock CK0 according to the comparator output Comp from the voltage comparator 252; and a count execution unit 504 for the slave gate 〇2 Counting the clock CIN and performing a counting operation. The communication/timing controller 20 supplies the slope change command signal CHNG to the reference signal generator 27, a count mode control signal UDC, the reset control signal CLR, the data hold control pulse HLDC, and the count clock control signal TH to the count execution unit 5, respectively. 04. In the slope change command signal CHNG, a signal system suitable for changing the slope of the reference signal Vslop in accordance with the DA converter 27a is used. For example, the slope change command signal CHNG may be a count clock CKdac capable of appropriately switching the frequency (clock cycle), or may be included in the control material CN4 as the slope (change rate) /3 of the reference signal Vslop. The communication/timing controller 20 can independently adjust the change reference signal -32- 200845735

Vslop之斜率的時序及改變計數器254(計數執行單元5 04) 之計數循環的時序。藉由控制垂直掃描電路1 4以控制一 選擇操作’該選擇係用以選擇予以爲電壓比較器252所處 理之多數像素的空間位置,及藉由控制在處理用以多列予 以相加列之分頻速度調整的相加時的加權値,通訊/時序 控制器20也具有一相加空間位置調整單元,以調整在相 加後之像素的空間位置。 例如,在如後述之第一實施例的相加處理操作中,在 列的多數相加目標處理中,每一列的參考信號Vslop的斜 率被保持爲相同,及計數循環(分頻速度)係據加値加以切 換。例如,當較前一列(相加目標列)爲大之加權被應用至 下一列(相加列)時,爲了使得較高效位元正反器以高速操 作分頻操作,而較快完成計數循環,計數模式控制信號 UDC、重置控制信號CLR、資料保有控制脈衝HLDC、及 計數時鐘控制信號TH係被供給至計數器2 5 4中之計數執 行單元504,藉以改變每一位元的分頻操作輸出爲該速度 的L倍。如果分頻操作的速度被改變爲速度的L倍,而保 持參考信號Vslop的斜率不變’實際上’ A/D轉換係被執 行有L倍大的A/D轉換增益。結果,相加處理可以以L 倍重的加權加以執行。 再者,在如後述之第二實施例中之彳i加處理操作’除 了第一實施例中之相加處理操作外’即使在用於一列之操 作中,在信號位準Ssig的處理時,在爲電壓比較器252 所進行的比較處理完成之前,斜率改變指令信號CHNG被 -33- 200845735 供給至參考信號產生器2 7,以改變參考信號v s 1 ο p的斜率 爲J倍大。同時,計數模式控制信號U D C、重置控制信號 CLR、資料保持控制脈衝HLDC、及計數時鐘控制信號τη 係被供給至計數器2 5 4中之計數執行單元5 04,使得每一 輸出至計數執行單元5 04中之位元的分頻操作係被改變爲 前一操作的分速Κ倍(較佳Κ倍=J倍)。 如果參考信號V s 1 ο ρ的斜率係被設定爲J倍大及分頻 操作被改變爲速度的Κ倍,實際上,A/D轉換處理的週期 係被縮短爲1/J倍及A/D轉換係被以A/D轉換增益的Κ/Κ 倍大執行。藉由設定Κ倍倍,實際上,A/D轉換處理的 週期可以縮短1 /J倍及A/D轉換增益可以保持爲定値,使 得A/D轉換結果的線性不被損壞。 如果第一實施例之相加處理操作的L倍加權列被組合 上上述相加處理,則相對於對應於兩列之像素信號Vsig 1 及 Vsig2,有可能取得 A/D轉換結果/,’Vsigl+K-Vsig2”, 而不會損及個別線性,同時減少A/D轉換處理的週期1 /J 倍(=1/K 倍)。 通訊/時序控制器20依據來自外主控制器的資料 DATA,來決定用於斜率改變指令信號CHNG、計數模式 控制信號UDC、重置控制信號CLR、資料保有控制脈衝 HLDC、及計數時鐘控制信號TH的on/off時序。 在第一實施例的相加處理操作中,這些on/off時序係 依據加權設定加以決定。第二實施例之相加處理操作中, 這些on/off時序係根據在光子散粒雜訊與量子雜訊間之關 -34- 200845735 係,取決於較高準確度或較快速度的目的,而加以決 當比較器輸出爲不作動態時,閘5 02傳送沒有改 輸入計數時鐘CK0作爲計數時鐘CIN,給計數執行 5 04,但當比較器輸出被反相至作動狀態時,閘502 傳送計數時鐘CK0。 當計數時鐘CK0被停止時,計數執行單元504停 數器操作並保有一計數値,以反映在該時間之像素信 壓Vx,即計數執行單元504將像素信號電壓Vx轉換 位資料並保有該數位資料。 [計數器] 圖4及5爲圖,用以顯示在計數器254中之計數 單元5 04之架構例。於此,顯示支援1 2位元之架構。 對應於每一垂直信號線1 9的每一行中之計數執 元504基本上具有非同步計數架構,其中串級有D型 器及在前一級的計數輸出係被輸入至下一級的時鐘端 〇 再者,本實施例之特徵爲其架構,其中當正反器 本身反相輸出NQ回到一 D輸入端時,每一正反器可 開控制反相輸出NQ的一保持功能的on/off操作。另 在這些級之間,設有一功能單元,用以切換計數模式 數及下數之間,及一功能單元’用以切換一計數時鐘 據前一級之計數輸出之脈衝與來自閘5 02的計數時鐘 之間。 變之 單元 停止 止計 號電 爲數The timing of the slope of Vslop and the timing of the counting cycle of the change counter 254 (counting execution unit 504). By controlling the vertical scanning circuit 14 to control a selection operation 'the selection is for selecting the spatial position of the majority of the pixels to be processed by the voltage comparator 252, and by adding the columns to the processing for processing in multiple columns. The weighting 时 at the time of addition of the frequency dividing speed adjustment, the communication/timing controller 20 also has an addition spatial position adjusting unit to adjust the spatial position of the added pixels. For example, in the addition processing operation of the first embodiment to be described later, in the majority addition target processing of the column, the slope of the reference signal Vslop of each column is kept the same, and the counting cycle (dividing speed) is Twist to switch. For example, when the weight of the previous column (addition target column) is applied to the next column (addition column), the counting cycle is completed faster in order to make the more efficient bit flip-flop operate at high speed. The count mode control signal UDC, the reset control signal CLR, the data hold control pulse HLDC, and the count clock control signal TH are supplied to the count execution unit 504 in the counter 254, thereby changing the frequency division operation of each bit. The output is L times this speed. If the speed of the frequency division operation is changed to L times the speed while keeping the slope of the reference signal Vslop constant 'actually' the A/D conversion system is performed with an L/time maximum A/D conversion gain. As a result, the addition processing can be performed with a weighting of L times. Further, in the second embodiment as will be described later, the processing operation 'except for the addition processing operation in the first embodiment', even in the operation for one column, at the processing of the signal level Ssig, Before the comparison processing for the voltage comparator 252 is completed, the slope change command signal CHNG is supplied to the reference signal generator 27 by -33-200845735 to change the slope of the reference signal vs 1 ο p to J times larger. At the same time, the count mode control signal UDC, the reset control signal CLR, the data hold control pulse HLDC, and the count clock control signal τη are supplied to the count execution unit 504 in the counter 254 such that each output to the count execution unit The frequency division operation of the bit in 5 04 is changed to the multiple of the previous operation speed (preferably Κ times = J times). If the slope of the reference signal V s 1 ο ρ is set to J times larger and the frequency division operation is changed to Κ times the speed, in practice, the period of the A/D conversion process is shortened to 1/J times and A/ The D conversion system is performed at a multiple of Κ/Κ of the A/D conversion gain. By setting Κ times, in practice, the period of A/D conversion processing can be shortened by 1 / J times and the A/D conversion gain can be kept constant, so that the linearity of the A/D conversion result is not damaged. If the L-weighted column of the addition processing operation of the first embodiment is combined with the above-described addition processing, it is possible to obtain the A/D conversion result /, 'Vsigl with respect to the pixel signals Vsig 1 and Vsig2 corresponding to the two columns. +K-Vsig2" without damaging the individual linearity, while reducing the cycle of A/D conversion processing by 1 / J times (=1/K times). The communication/timing controller 20 is based on the data from the external host controller. To determine the on/off timing for the slope change command signal CHNG, the count mode control signal UDC, the reset control signal CLR, the data hold control pulse HLDC, and the count clock control signal TH. The addition processing in the first embodiment In operation, these on/off timings are determined according to the weighting setting. In the additive processing operation of the second embodiment, these on/off timings are based on the relationship between photon shot noise and quantum noise -34-200845735 Depending on the purpose of higher accuracy or faster speed, when the comparator output is not dynamic, the gate 52 transmission does not change the input count clock CK0 as the count clock CIN, and the count is executed 5 04, but when Comparators When the output is inverted to the active state, the gate 502 transmits the count clock CK0. When the count clock CK0 is stopped, the count execution unit 504 stops the operation and maintains a count 値 to reflect the pixel signal voltage Vx at that time, that is, The counting execution unit 504 converts the pixel signal voltage Vx into the bit data and holds the digital data. [Counter] FIGS. 4 and 5 are diagrams showing an example of the structure of the counting unit 504 in the counter 254. Here, the display support 1 The 2-bit architecture. The counting unit 504 in each row corresponding to each vertical signal line 19 has substantially a non-synchronous counting architecture, wherein the cascade has a D-type and the counting output of the previous stage is input to The clock of the next stage is further characterized by the architecture of the present embodiment, wherein when the flip-flop itself inverts the output NQ back to a D input, each flip-flop can open one of the control inverted outputs NQ. Maintaining the on/off operation of the function. Between these levels, there is a function unit for switching between the number of counting modes and the number of the lowers, and a function unit for switching the count output of the previous stage clock. pulse From between the gate 502 of the count clock. Stopping unit stops the count variable number of electrically number

執行 行單 正反 CK 將其 以分 外, 於上 於根 CIN -35- 200845735 明確地說,計數執行單元5 04具有第一正反器 (FF)510-00至510_11(以下一起稱510)。計數執行單元 5 04具有能保持反相輸出端N Q之資料的資料保持單元(保 持)512_00至512_11(以下統稱512)在正反器510的反相 輸出端NQ與D輸入端之間。每一資料保持單元5 1 2其他 資料保持控制脈衝HLDC (00至1 1)所控制。資料保持單元 512具有功能有保持該計數輸出,而不管正反器510的輸 入狀態,例如,這可以爲互斥或閘加以實施。 例如,當資料保持控制脈衝HLDC在作動H(H :高位 準)時,資料保持單元512保持輸入資料(正反器510的反 相輸出NQ),當資料保持控制脈衝HLDC爲不動作L(L : 低位準)時,則釋放保持操作,以傳送輸入資料(正反器 510的反相輸出NQ)至正反器510的D輸入端。 重置控制信號CLR被一起輸入至正反器510的每一 重置端R。當重置控制信號CLR在作動Η時,正反器510 例如設定一非反相輸出Q至一 L位準,及反相輸出端NQ 爲Η位準。 再者,計數執行單元504包含計數模式開關 (U/D)514 —00至514_11(以下統稱514),用以在每一正反 器5 1 0的級間切換計數模式於上數或下數。回應於計數模 式控制柄號U D C,計數模式開關5 1 4切換在前一級正反器 510的反相輸出端NQ之資料的模式,並在不變或被反相 後輸出。例如,計數模式開關5丨4可以爲一互斥或閘加以 實施。 -36- 200845735 例如,計數模式開關5 1 4切換正反器5 1 0的反相輸出 端NQ於反相與非反相之間,使得當計數模式控制信號 U D C在高位準時,計數執行單元5 0 4操作上數操作,及當 信號UDC爲低位準時,計數執行單元504執行下數操作 〇 再者,計數執行單元 5 04包含計數時鐘開關 (SEL)516_00至516_10(以下統稱516),在每一正反器510 與下一級之計數模式開關5 1 4之間。計數時鐘開關5 1 6分 別回應於計數時鐘控制信號ΤΗ_00至TH_10(以下統稱 TH)切換計數模式開關514的輸出脈衝及來自閘502的計 數時鐘CIN,並且,將之供給至下一級之正反器5 1 0的時 鐘端CK。 每一計數時鐘開關5 1 6係爲另一計數時鐘控制信號 TH所控制。在前級之計數時鐘控制信號TH變成作動,及 在下一級的信號TH於預定延遲時序時依序變成作動(細節 如後述)。 例如,當計數時鐘信號TH爲不作動時,計數.時鐘開 關5 1 6傳送計數模式開關5 1 4的輸出,及當計數時鐘控制 信號TH被切換至作動Η時,其傳送來自閘502的計數時 鐘 CIN。 計數時鐘開關5 1 6以下述方式加以自閘5 02取得計數 時鐘CIN。在圖4所示之第一例子中,配線係被安排使得 在前一級之正反器5 1 0的時鐘脈衝係被保持用於每一行。 另一方面,在示於圖5之第二例子中,計數時鐘線517_00 -37- 200845735 至5 17_1 1(以下統稱517)係被提供並一起配線給每一行並 在每一正反器510的級之間,及來自閘5 02的計數時鐘 C IN係由計數時鐘線5 1 7取出。 在圖4所示之例子中,較圖5之第二例子之計數時鐘 C IN所需之配線爲少。然而,當計數時鐘CIN依序傳送至 較高效位元正反器510時,即使自該處輸出之資料係被處 理爲不作動,較低效位元正反器5 1 0仍在操作。 另一方面,在圖5所示之第二例子中,雖然需要較圖 4所示爲多之用於計數時鐘C IN配線,但其一優點爲完成 較少之功率消耗。這是因爲在前級之正反器5 1 0的計數操 作可以在切換後被停止,例如,藉由在閘5 02與計數時鐘 線5 17之間給個別級設置時鐘停止單元(停止)5 18(_00至 _ 1 〇),以回應於計數時鐘控制信號TH,停止供給計數時 鐘給正反器5 1 0。 第一例與第二例之架構均可以被用以允許計數執行單 元5 04以操作爲非同步二進制計數器,及藉由允許計數時 鐘開關5 1 6回應於計數時鐘控制信號TH而操作,計數執 f了卓兀504具有傳送在每一'級之正反器510的每一時fet輸 入至在下一級(較低效位元側)之正反器5 1 0的時鐘輸入的 功能。換句話說,用於較低效位元輸出之較高速時鐘係以 預定時序被依序傳送至下一級側(較高效位元側),使得用 於計數時鐘CIN之較高效位元輸出的分頻操作係被依序更 快完成。例如,在切換前之計數時鐘C IN的1 /4分頻操作 可以被改變爲在該切換後之計數時鐘CIN的1/2分頻操作 -38- 200845735 在計數時鐘被切換後,因爲計數操作(分頻操作)係爲 一較以前爲快之時鐘所執行,所以A/D轉換可以以較高速 執行,同時,藉由調整有關於參考信號Vslop之斜率’而 保持A/D轉換的線性。這將更詳述如下。 [固態攝像裝置的操作:基本操作] 圖6爲一時序圖,顯示信號取得差動理,其係爲示於 圖1之固態攝像裝置1之行A/D電路25之基本操作。 爲像素陣列單元1 0之單元像素3所檢測之類比像素 信號係依據以下操作被轉換爲數位信號。例如,執行搜尋 以找出參考信號Vslop在一斜波波形中以預定斜率降低之 一點,及參考分量的每一電壓或來自單元像素3的像素信 號的信號分量匹配的一點。一計數時鐘自參信號Vslop被 使用作爲比較處理的一點開始到對應於參考元件或信號元 件與該參考信號相匹配的一點,計數時間週期。結果,對 應於參考元件之每一値及信號元件之計數値係被取得。 換句話說,安置於每一行中之25的電壓比較器252 比較讀出至垂直信號線1 9的類比像素信號電壓V X與該參 考信號Vslop。在此時,安置於每一行中之計數器254類 似於電壓比較器252係被作成作動,參考信號Vslop的某 一電位與計數器254係被改變爲一對一的對應關係,像素 信號電壓V X被轉換爲數位資料。在本說明中,參考信號 Vslop之改變係爲將電壓的變化轉換爲時間的變化。計數 -39- 200845735 器254藉由量化某一循環(時鐘)而計數時間,以轉換爲數 位資料。如果假設參考信號Vslop係在時間週期△ t中改 變△ V及計數器2 5 4被操作於△ t循環,則當參考信號 Vslop被改變爲ΝχΔν時,計數器値變成n。 自垂直信號線1 9輸出之像素信號s 〇 (像素信號電壓 Vx)在時序上令出現在包含有像素信號雜訊的重置位準 Srst後的信號位準Ssig作爲參考位準。如果第一操作被執 行於參考位準(重置位準Srst,實際上等於重置位準Vrst) ’則第二操作被執行在由相加信號分量V s i g與重置位準 Srst所取得之信號位準Ssig上。此操作係詳述如下。 在第一操作中,即在用於重置位準Srst之A/D轉換 週期Trst中,通訊/時序控制器20首先設定一重置控制信 號CLR至作動Η,並重置自計數器254之每一正反器510 的非反相輸出端Q輸出之計數値爲” 0 ”,並同時也設定計 數器254爲下數模式(tl)。在此時,通訊/時序控制器20 設定資料保持控制脈衝HLDC爲作動Η,及計數模式控制 信號UDC爲低位準(即下數模式)。 在此時,在單元像素3中之讀出目標列Vn中之垂直 選擇信號Φ VSEL係被設定至作動Η,及像素信號So被允 許輸出至垂直信號線1 9,並且,幾乎同時重置信號φ RS T 被設定至作動Η及38被設定至重置電位(U至t2)。重置 電位被輸出至垂直信號線1 9作爲像素信號S 〇。因此,出 現在垂直信號線1 9的重置位準S r s t成爲像素信號電壓V X 。在此時,由於每一單元像素3的像素內放大器(像素信 -40- 200845735 號放大器5)的變化,予以收斂的重置信號Srst的電位被 改變。 在自讀出目標列Vn中之單元像素3讀出至對應垂直 信號線19(H0、H1、…)的像素信號的第一讀出操作穩定後 ,即,在重置位準Srst收斂後’通訊/時序控制器20供給 用以產生參考信號Vs lop的控制資料CN4給參考信號產生 器27。於此,爲了使爲計數器2 54所進行之計數操作與參 考信號Vslop同時開始改變,保持控制脈衝HLDC的資料 係被使用作爲控制資料CN4並被設定爲不作動L(tlO)。 回應於此,當參考信號Vslop作爲對電壓比較器252 之一輸入端RAMP的比較電壓時,參考信號產生器27輸 入一步階或線性電壓波形,其隨著時間改變呈鋸齒波(斜 波形狀),整個由啓始電壓SLP_ini開始。電壓比較器252 比較參考信號Vslop與自像素陣列單元10所供給之垂直 信號線1 9的像素信號電壓Vx。 與參考信號Vslop輸入至電壓比較器252的輸入端 RAMP同時,在電壓比較器252中之比較週期係爲安置在 每一列中之計數器254所同步於自參考信號產生器27供 給的參考信號Vslop被量測。實際上,資料保持控制脈衝 HLDC係被設定至不作動L,以產生參考信號Vslop,而放 資料保持單元512之保持操作,因而,計數器254開始自 啓始値〇下數作爲第一計數操作。更明確地說,計數操作 係由負方向開始。 電壓比較器2 5 2比較自參考信號產生器2 7供給之斜 -41 - 200845735 波參考信號Vslop與經由垂直信號線19輸入之像素信號 電壓Vx,並當兩電壓相等時,電壓比較器252將比較器 輸出由Η位準反相至L位準。換句話說,電壓比較器比較 對應於重置位準Vrst的電壓信號(重置位準Srst)與參考信 號Vslop,並產生一低態有效(L)脈衝信號,其在時間軸方 向有一對應於重置位準Vrst的位準,並供給所產生之脈 衝信號給計數器254。 結果,計數器254幾乎與比較器的輸出反相同時停止 計數操作,並閂鎖(保持/儲存)該時間的計數値作爲像素資 料,藉以完成 A/D轉換。換句話說,藉由在電壓比較器 2 52之比較操作所取得之在時軸有一位準的低態有效(L)的 脈衝信號之寛度係爲計數時鐘CK0所計數,得到一顯示對 應於重置位準Vrst位準之數位値Drst(如加符號爲-Drst) 的計數値。 在經過預定下數週期後,通訊/時序控制器20設定資 料保持控制脈衝HLDC爲作動H(tl4)。因此,通訊/時序 控制器2 0停止產生斜波參考信號V s 1 〇 p (11 4)並回到啓始 電壓 SLP_ini。 因爲在第一操作中,電壓比較器2 5 2檢測在像素信號 電壓Vx中之重置位準Vrst及計數器254執行計數操作, 單元像素3的重置位準Vrst被讀出,以重置位準vrst執 行A/D轉換。 重置位準Vrst包含偏移雜訊,其係爲單元像素3所 改變。然而,重置位準Vrst的變化通常很小,並且重置 -42- 200845735 位準Vrst係對所有像素大致相同。因此,任意垂直信號 線19的像素信號電壓Vx的重置位準Vrst的輸出値已大 致知道。 因此,在第一讀出操作及用於重置位準Vrst的A/D 轉換中,下數週期(比較週期)可以藉由調整參考信號 Vslop力D以縮短。例如,比較操作係藉由設定用於比較操 作(即用於重置元件之A/D轉換週期)之最長週期爲7位元 計數週期(128時鐘),而執行於重置位準Srst(重置位準 Vrst)上。 在下一第二操作中,即在用於信號位準Ssig的A/D 轉換週期Tsig中,除了重置位準Vrst外,回應於每一單 元像素3的入射光數量的信號分量也被讀出,並且執行與 第一讀取操作類似之操作。更明確地說,通訊/時序控制 器2 0首先設定計數模式控制信號UDC爲高位準及設定計 數器254爲上數模式(tl6)。 在此時,在單元像素3中,在保持讀出目標列Vn中 之垂直選擇信號Φ VSEL爲作動Η時,一傳送信號φ TRG 係被設定爲作動Η及信號位準Ssig係被讀出至垂直信號 線垂直信號線19(tl8至tl9)。 在由讀出目標列V η中之單元像素3的第二讀出給垂 直信號線19(Η0,Η1,…)穩定後,通訊/時序控制器2〇供 給用以產生參考信號Vslop的控制資料CN4給參考信號產 生器27。同時,爲了使參考信號Vslop同時於計數器254 的計數操作開始改變,該資料保持控制脈衝HLDC係使用 -43- 200845735 作爲控制資料CN4,並被設定爲不作動L(t20)。 反應於此,參考信號產生器27輸入一步階或線性電 壓波形作爲至電壓比較器2 5 2之一輸入端RAMP的比較電 壓之參考信號V s 1 ο p,該波形係在時間上以鋸齒波(斜波) 變化並由啓始電壓SLP_ini開始。電壓比較器2 5 2比較參 考電壓Vslop與由像素陣列單元10供給至垂直信號線19 之像素信號電壓Vx。 與輸入至電壓比較器252的輸入端RAMP的參考信號 Vslop同時,在電壓比較器252中之比較期間係爲每一列 中之計數器25 4所同步於自參考信號產生器27供給之參 考信號Vslop量測。實際上,在此時,資料保持控制脈衝 HLDC係被設定爲不作動L,以產生參考信號Vslop,其釋 放資料保持單元5 1 2之保持操作。因此,在第二計數操作 中,計數器254開始與第一操作反向計數,由第一讀取所 取得之像素信號電壓Vx的重置位準Srst的數位値Drst( 於此爲負値),及A/D轉換操作。換句話說,計數操作係 以正方向開始。 電壓比較器25 2比較自參考信號產生器27供給之斜 波參考信號Vslop與經由垂直信號線19所輸入之像素信 號電壓Vx,當兩者相等時,電壓比較器252將比較器的 輸出由Η位準反相至L位準(t22)。換句話說,電壓比較 器2 52比較對應於重置位準Vrst之電壓信號(像素信號電 壓Vx的信號位準Ssig)與參考信號Vslop,並產生一低態 有效(L)脈衝信號,其在時軸方向有一對應於信號分量 -44 - 200845735 V s i g的位準,並供給所產生之脈衝信號至計數器2 5 4。 結果,計數器254幾乎與比較器輸出的反相同時地停 止計數操作,並閂鎖(保持/儲存)在該時間的計數値作爲像 素資料,藉以完成A/D轉換。換句話說,爲電壓比較器 252中之比較操作在時軸中所取得之低態有效(L)的脈衝信 號的寬度係爲計數時鐘CK0所計數,取得了對應於在像素 信號電壓Vx中之信號位準Ssig的計數値。 在單元像素3中,經過預定上數週期後,在讀出目標 列Vn中之垂直選擇信號Φ VSEL被設定爲不作動L,輸 出至垂直信號線1 9的像素信號S 〇被停止,及用於讀出目 標列Vn+ 1之下一列的垂直選擇信號φ V S EL係被設定至 作動Η位準(t2 6)。在此時,通訊/時序控制器2〇準備以處 理下一讀出目標列Vn+ 1。例如,計數模式控制信號UD C 係被設定至低位準及計數器2 5 4係下數模式。 在第二操作中,因爲計數操作係以電壓比較器2 5 2檢 測像素信號電壓V X的信號位準S s i g加以執行,所以,單 元像素3的信號分量Vsig係被讀出,以對信號位準Ssig 執行A/D轉換。 因爲信號位準Ssig係爲將信號分量Vsig與重置位準 Srst相加所取得之位準,所以,用於信號位準ssig的A/D 轉換的計數値基本上爲”Drst + Dsig”。然而,因爲上數係由 重置位準Srst的A/D轉換結果的”-Drst”開始,所以,一 計數値實質上變成”-〇^1 + (〇3丨8 + 〇1^) = 〇8丨吕,,。 如果假設用於重置位準Srst之A/D轉換週期Trst及 -45- 200845735 用於信號位準Ssig之A/D轉換週期Tsig的每一位數 壓値(轉換係數)爲α [V/位數],及A/D轉換週期計 Dsig係被轉換爲電壓値,信號分量Vsig的電壓値變 • D s i g 〇 例如,如圖6所示,其表示像素信號電壓Vx的 處之括號內之數位値,在垂直信號線1 9中之像素信 壓Vx的重置位準Srst爲10,信號分量爲60、及信 準Ssig爲70爲數位値。 在重置位準Srst之A/D轉換週期Trst中,當計 Drst變成-10時,參考信號Vslop及像素信號電壓Vx (交叉)及電壓比較器252的比較器輸出被反相至作動 準,使得計數器254停止下數操作。因此,重置位準 的A/D轉換結果變成-像素陣列單元1 0,及此値被保 直到用於信號位準Ssig之A/D轉換週期Tsig結束爲 該週期爲用以讀出下一像素信號的週期。 再者,在信號位準Ssig的A/D轉換週期Tsig中 號位準係由單元像素3讀出,使得計數器254開始上 當在 A/D轉換週期Trst(在圖中之P點)中,參考 V slop變成等於像素信號電壓Vx的電位時,計數値變 ,及當參考信號 Vslop與像素信號電壓 Vx的信號 Ssig彼此相等時,來自電壓比較器252的比較器輸出 反相至作動L,藉此,計數器254停止上數操作。 在此時,爲計數器25 4所上數之實際數爲70,然 計數器2 5 4係由負値-1 〇開始上數,所以,實際計數 的電 數値 成α 位置 P.tfe· /^[-^ 號位 數値 匹配 L位 Srst 持, 止, ,信 數。 信號 成〇 位準 係被 而, 値爲 -46- 200845735 ”- 1 0 + 70 = 60”,使得其變成信號分量 Vsig的數位値 D s i g = 6 0 〇 換句話說,在本實施例中,計數器2 5 4執行第一操作 之下數及執行第二操作之上數。因此,在計數器254中, 差分處理(減法處理)係自動執行於計數値”-Drst”與計數値 ”Drst + Dsig”之間,”-Drst”爲 A/D 轉換週期,” D r s t + D s i g,, 爲信號位準Ssig的A/D轉換週期,及對應於差分處理之 結果的計數値Dsig係被保持於計數器254中。對應於差 分處理結果並予以被保持在計數器254中之計數値Dsig 係對應於信號分量Vsig。 如上所述,藉由執行重置位準Srst(實際上等於重置 分量Vrst)與信號位準Ssig之兩比較處理,及與比較處理 一起動作之下數處理及上數處理,保持了有對應於減法結 果”(在第二比較週期中之計數値)-(在第一比較週期中之計 數値)”的計數値。在此時,行A/D電路25的偏移分量必 須實際考量。 因此,完成了方程式(在第二比較週期中之計數値)-班 室在第一比較週期中之計數値)=(重置位準Srst +信號分量 Vsig +行A/D電路25之偏移分量)-(重置位準Srst +行A/D 電路25之偏移分量)=(信號分量Vsig)。藉由上述兩讀出 處理及在計數器254中之自動差分處理,除了包含每一單 元像素3的變化的重置分量V r s t外,也有可能消除每一 行A/D電路2 5之偏移分量。因此,有可能取得對應於每 一單元像素3之入射光量的信號分量Vsig的A/D轉換結 •47- 200845735 果。 因此,本實施例之行A/D電路25不只作爲一 元,用以將類比像素信號轉換爲數位像素信號,同 爲一 CDS處理功能單元。 在第二操作中,A/D轉換係藉由讀出對應於入 量的信號分量V s i g加以執行。因此,爲了判斷在 的光數量位準,有必要將上數週期設長(t20至t24 週期)’使得予以供給至電壓比較器2 5 2之參考信號 可以被顯著改變。 因此,在本實施例中,信號位準Ssig的比較 最長週期被設定爲例如12-位元計數週期(4096時_ 比較被進行於信號位準Ssig。換句話說,用於重 Srst(重置位準Vrst/參考分量)之比較處理(用於重置 A/D轉換週期)的最長週期係被設定爲短於用於信 Ssig之比較處理的最長週期(即,信號分量的a/D 期)。重置位準S r s t之比較處理的最長週期係被設 於用於信號位準S s i g之比較處理的最長週期,而 定爲等於比較處理的兩最長週期,即對於重置位準 用於信號位準Ssig的A/D轉換週期的最大値相等 ,兩A/D轉換週期的總長被縮短。 在此時,雖然在第一次與第二次間的比較位元 同,但通訊/時序控制器20供給控制資料給參考信 器27,及參考信號產生器27根據控制信號產生參 V s 1 ο p。因此,參考信號V s 1 ο p之斜率,g卩參考信號 數位單 時也作 射光數 寬範圍 Z比較 V s 1 ο ρ 操作之 I ),及 置位準 分量的 號位準 轉換週 定爲短 不是設 Srst 及 。因此 數量不 號產生 考信號 V s 1 ο ρ -48- 200845735 之變化率第一次與第二次被作成相同。如果參考信號 V s 1 ο p係在數位控制下產生,則參考信號V s 1 ο p之斜率係 容易在第一次及第二次間作成相同。以此方式,A/D轉換 的準確性可以作成相等,及由上下計數器所作之減法處理 結果可以正確地取得。 本實施例之行A/D電路25在下一級的計數器254具 有資料儲存單元256。在計數器254操作之前,由處理前 一列Hx-1所取得之計數結果係根據來自通訊/時序控制器 2 〇之記憶體傳送指令脈衝CN 8被傳送至資料儲存單元2 5 6 〇 換句話說,在A/D轉換週期結束後,在計數器2 5 4中 之資料係被儲存在資料儲存單元2 5 6中,及行A/D電路 25開始下一列Vx+Ι的A/D轉換處理。在A/D轉換處理後 ’儲存於資料儲存單元256中之資料係被依序爲水平掃描 電路12所選擇並可以爲輸出電路28所讀出。 在沒有提供資料儲存單元25 6的架構中,因爲像素資 料只在有第二讀取處理後被輸出至行處理器22外部,即 在A/D轉換處理完成後,所以對讀出處理有一限制。另一 方面,藉由安排資料儲存單元25 6,在讀出處理(A/D轉換 處理)前,指示最後減法處理結果的計數値係被傳送至資 料儲存單元2 5 6,因此,對讀出處理沒有限制。 再者,因爲保持在計數器254中之計數結果可以被傳 送至資料儲存單元2 5 6,所以,計數器2 5 4的計數結果, 即A/D轉換,及用於讀出計數結果給水平信號線1 8之讀 -49- 200845735 出操作可以被獨立控制。因此,有可能實施管線操作,其 對讀出至外部的信號並聯執行A/D轉換處理及讀出操作。 如上所述,在本實施例之固態攝像裝置1中,可以切 換上數及下數。在此時,能本身切換計數模式的上數計數 器係被用以執行計數處理兩次,同時,切換該處理模式。 單元像素3被安排呈列與行之結構係被以行並聯行A/D電 路加以架構,其中,行A/D電路25係被安排於每一垂直 行中。 因此,有可能直接取得參考位準(重置位準Srst)與信 號位準Ssig間之相減處理的結果,其作爲每一垂直行之 第二計數處理的結果。用以儲存重置位準Srst及信號位準 Ssig之計數結果的記憶體裝置係被實施爲計數器的閂鎖功 能。因此,不需要在計數器外另外之專用記憶體,來儲存 AD轉換資料。 另外,也不必要準備一特別減法器,用以計數於對應 於參考分量之信號位準(重置位準Sr st)之數位資料與對應 於信號分量之信號位準之數位資料間之差。 因此,有可能直接取得參考位準(重置位準Srst)與信 號位準Ssig間之相減處理的結果作爲每一垂直行的第一 計數處理的結果。用以儲存重置位準Srst與信號位準Ssig 之計數結果的記憶體裝置係被以計數器的閂鎖功能進行。 因此’不必在計數器外另設用以儲存AD轉換資料的專用 記憶體。 另外,也不必要準備特殊減法器,用以計算對應於參 -50- 200845735 考分量的信號位準(重置位準Srst)之數位資料與對應於信 號分量之信號位準之數位資料間之差。此架構可以藉由組 合個別上數與下數5十數益加以完成。然而,在此時,有可 能例如需要一函數元件,用以在將一計數器(在上例中爲 下數計數器)之計數値載入另一計數器(在上例中爲上數計 數器)後開始計數操作’或者,爲數位計數處理所減去每 一計數値。 例如,有可能爲了重置位準Srst,在A/D轉換週期中 執行下數操作,以保持單元像素3的重置位準Srst的A/D 轉換結果,及爲了信號位準Ssig,在A/D轉換週期Tsig 中執行上數操作,以取得來自重置位準Srst之信號分量 Vsig的A/D轉換結果。即,實際上,信號分量Vsig的 A/D轉換功能及CDS處理被同時實行。再者,因爲保持在 計數器254中之計數値所指示之像素資料顯示一正信號電 壓,所以,不必要執行互補計算,用以將負信號電壓改變 至正信號電壓,其係與現行系統高度相符。 再者,藉由在計數器2 5 4之下一級提供資料儲存單元 256,有可能並聯執行由資料儲存單元25 6經由水平信號 線1 8與輸出電路2 8至外部的信號輸出操作,及用於現行 列Hx的讀出操作及計數器2 5 4之計數操作’藉以完成更 多之有效信號輸出。藉由將像素信號電壓Vx之信號分量 Vsig轉換成數位資料所取得之計數値Dsig係被儲存於資 料儲存單元2 5 6,然後,依序爲水平掃描電路1 2所依序讀 出至外部。在此方式中,因爲由電荷產生器32所產生之 -51 - 200845735 信號電荷被處理爲類比電信號並被每一列所並聯處理至數 位資料,並隨後被轉換至數位資料,因而,可以完成一高 速計數及完成高速處理。 [A/D轉換+相加處理:基本操作] 圖7爲一時序圖,用以顯示與A/D轉換處理操作並行 處理之垂直方向中之相加處理。爲了說明簡單起見,行 A/D電路的偏移被忽略。 圖7中之每一時序及信號係爲示於圖6中之一行之相 同時序及信號所表示,而不管是否處理爲目標列否。在說 明中,時序及信號係一處理目標列之參考元件符號表示加 以區別。對於其他類似時序圖也是相同。 與A/D轉換處理操作並聯執行之垂直方向中之相加處 理係在高速框模式中執行,這係藉由設定單元像素的曝光 週期至與正常框模式相比之1 /2時間加以完成,其中像素 資訊係由在像素陣列單元1 0中之所有單元像素3讀出。 即使在A/D轉換處理執行後,對於某一列中之單元像 素3,計數器2 5 6可以以η-位元之計數値表示用於信號位 準Ssig的A/D轉換結果。在本實施例,藉由利用計數器 2 54之此資料保持特性,用以將多數列中之單元像素3之 A/D轉換値相加的處理係被執行於計數器254中。 多數予以受到相加處理的列可以爲兩列或更多列,或 任何大於3的列數。於多數列間之可接受關係不只是相鄰 列也是爲了幾列。例如,典型上,如果像素陣列單元;[〇 -52- 200845735 係用以捕捉彩色影像,則爲了匹配分色濾鏡的彩色配置, 即,被加上相同的彩色元素,選擇了適當列。例如,如果 爲B ay er配置,則在奇數列或偶數列執行相加處理。 對於水平方向的相加處理也是如此。多數予以受到相 加處理的列也可以爲兩或更多列,或者多於三的任何列數 。在多數列間之可接受關係不只是相鄰行也是用於幾行。 例如,典型上,如果像素陣列單元1 0係用於彩色影像捕 捉,爲了匹配分色濾鏡的彩色配置,即相加彩色分量係被 相加,適當行係被選擇爲目標。例如,如果爲Bayer配置 ,相加處理係被執行於奇數行或偶數行。 以下說明係根據以下之假設:相加處理係爲計數器 254所執行於任意列Iv與任意列Jv之兩列間(以兩列爲單 位之相加計算),計數器254在行A/D電路25具有上/下 數功能,其後,相加處理係被數位算術單元2 9所執行於 任意行Ih及任意行Jh之兩行間(以兩行爲單位之相加計算 )。換句話說,說明係假設相加計算係根據有預定關係的 兩列及兩行。再者,假設列ϊν係爲相加目標列及其A/D 轉換係被先執行,然後,對列Jv執行A/D轉換。 可以由信號取得差分處理的基本操作說明了解到,當 在列Iv中之單元像素3的信號被讀出及A/D轉換處理被 執行時,首先,讀出目標列Iv的垂直選擇信號cpVSEL_Iv 係被設定爲作動Η,並允許像素信號S 〇被輸出至垂直信 號線1 9。在此時,雖然未顯示,但所有資料保持控制脈衝 HLDC00至HLDC1 1被啓始設定至作動H(tl_Iv至tlO_Iv) -53- 200845735 ,並在比較處理時設定至不作動L’及計數處理(tiOJv至 tl4_Iv),所有計數時鐘控制信號ΤΗ00至TH11被設定至 不作動 L(tl_Iv 至 t26_Iv)。 假設該列Iv的重置元件爲Vrst_Iv及其重置位準爲 Srst_Iv,及列Iv的信號分量爲Vsig_Iv及其信號位準爲 Ssig_Iv。藉由對它們執行比較處理及計數處理(tl_Iv至 t26_Iv),計數器 254保持由等式所取得之數位値 Dsig_Iv(t26_Iv),其中··(在第二比較週期中之計數値)-( 在第一比較週期中之計數値)= ”(Srst_IV + VSig__Iv)-Srst_Iv = Vsig_Iv”。 在該列I v的A / D轉換週期完成後,不必重置計數器 2 5 4,依序執行在列Jv中之單元像素3的信號之讀出操作 及A/D轉換處理,類似於用於列Iv之處理的讀出操作係 被重覆。因此,首先,前一讀出目標列Iv的垂直選擇信 號 Φ VSEL_Iv係被設定爲不作動L,下一讀出目標列Jv 的垂直選擇信號Φ VSEL_Jv係被設定至作動Η,並允許像 素信號So被輸出至垂直信號線19(tl_Jv = t26_Iv)。 在此時,所有資料保持控制脈衝HLDC00至HLDC11 係被開始設定至作動H(t l_Jv至tl 0_Jv),並在比較處理及 計數處理時(tlO_Iv至tl4_Iv)被設定至不作動L,雖然未 顯示,但所有計數時鐘控制信號T Η 0 0至Τ Η 1 1被設定至 不作動 L(tl—Jv 至 t26_Jv)。 假設在列Jv中之重分量爲Vrst_Jv,其重置位準爲 Srst — Jv,及在列Jv中之信號分量爲Vsig_Jv及其信號位 -54- 200845735 準爲Ssig_Jv。藉由對它們執行比較處理及計數處理(tl-Iv 至t26_Iv),在列Jv的A/D轉換後,計數器254保持由等 式取得之數位値,其中:”Vsig_IV + (SrSt_Jv + VSig__jv)_ Srst_Jv = Vsig_Iv + Vsig_Jv’’。換句話說,由相力口垂直方向 中之列Iv及Jv的兩信號分量Vsig_Iv及Vsig_Jv所取得 之計數値係被保持在計數器254(t26_Jv)中。 例如,如圖7所示,其中一數位値係表示在像素信號 電壓Vx的線圖之括號內,其假設在列Iv中之重置位準 Srst_Iv與在列Jv中之Srst_Jv爲10,信號分量Vsig_Iv 及Vsig_Jv爲60,及信號位準Ssig_Iv及Ssig_Jv爲70。 在此時,在列Iv中之信號位準Ssig_Iv(信號分量 Vsig_Iv)的A/D轉換中,藉由執行自重置位準Srst_Iv的 A/D轉換所取得之計數値Drst_Iv( = -10)作爲開始點的上數 ,在處理後,在計數器254中之計數値Dsig_Iv變成 10+70=60” ° 隨後,在列Jv的A/D轉換中,由列Iv之A/D轉換所 取得之計數値Dsig_Iv( = 60)係被使用作爲開始點,下數係 首先被執行於重位準Srst_JV,及予以被保持在計數器254 中之値Drst_Jv變成”6 0- 1 0 = 50”。再者,上數係被藉由使 用計數値 Drst_Jv( = 50)作爲開始點而執行於信號位準 Ssig_Jv上,及在處理後予以被保持在計數器25 4中之計 數値ADD係變成”5 0 + 70 = 1 20”。此値表示在列Iv中之信 號分量Vsig_Iv相加至JV中之信號分量Vsig_Jv的結果。 在前一例子中,數位相加處理係藉由切換上數及下數 -55- 200845735 ,而被執行於行A/D電路25中。在此時,如果藉由使用 其本身而計數器能切換該計數模式,則其優點爲有可能自 動地執行CDS處理,用以免除單元像素3的信號Vsig的 重置分量V r s t與相加處理。此架構可以藉由組合個別上 數器及下數器加以完成,然而,此時,可能需要一函數元 件,例如,在裝置一計數器(本例爲下數器)之計數値至另 一計數器(本例爲上數器)後開始計數操作,或,藉由數位 計算處理,相減或相加每一計數値。 在A/D轉換處理後,計數器254經由資料儲存單元 2 5 6將計數値傳送至水平信號線1 8。在此時,表示藉由在 垂直方向中之兩列Iv及Jv的信號分量Vsig_Iv及Vsig_Jv 相加取得之相加結果係依序被供給至數位算術單元29。 藉由重覆類似上述之操作,有可能取得一影像,其中 像素資訊在垂直方向(在感應面的垂直(行)方向)被減少至 1 /2。結果,框率可以增加高達爲所有像素資訊被讀出之 正常框率模式的兩倍。 數位算術單元29相加自行處理器26供給之垂直方向 中之兩列Iv及Jv的信號分量Vsig_Iv及Vsig_Jv(以下稱 爲列相加資料ADD)與在行Ih中之列相加資料Add_Ih及 在行jh中之列相加資料ADD Jh,並且,最後取得表示兩 列及兩行相加結果之數位資料。 例如,假設計數器254針對奇數列與相鄰之一偶數列 執行相加處理,及數位算術單元2 9對奇數行及一相鄰偶 數行執行相加處理。在此時’數位算術單元29自資料儲 -56- 200845735 存單元2 5 6讀出偶數行及奇數行的列相加資料,並將之相 加,藉以執行兩行間之相加操作。 結果,數位算術單元29取得數位資料’其表示藉由 相加兩行之信號分量Vsig_lvlh及Vsig_IvJh及兩行之信 號分量Vsig_JvIh及Vsig_JvJh而取得之相加結果,前一 個兩行爲在水平方向中之在奇數行Ih中之奇數行與相鄰 的偶數行Jh,後一個兩行爲在水平方向中之奇數行Ih及 鄰接該奇數列Iv的偶數列Jv。換句話說,相加操作係執 行於排列在鄰接兩列及兩行中之四像素。 自單元像素3經由垂直信號線1 9輸出之像素信號電 壓Vx係被行A/D電路25所轉換爲數位値,及數位値係 被相加在垂直方向(行方向)中之多數單元像素3(在前一例 中,單元像素3被安排呈兩列)之間。以上述操作,有可 能取得以下作用。 例如’自像素資訊量的表示,這係相同於在垂直方向 的像素資的減去讀出(跳著讀出)1 /2。然而,因爲像素資訊 係在垂直方向的兩像素間相加,所以,像素資訊件的資訊 量被倍增。因此’即使用於單元像素3的曝光週期被設定 爲1 /2時間,以確保框率例如兩倍高,則數位値在a/d轉 換時被相加於兩列單位像素間,及一像素資訊的資訊量被 倍增。因此,相較於正常框率模式,靈敏度並未降低。 換句§舌s兌’單兀像素3之較短曝光時間並未造成一像 素資訊的資訊量的減少。因此,不必降低靈敏度,可以完 成較高之框率。再者,因爲相加處理係藉由以設有內建上 -57- 200845735 /下計數器的行A/D電路25來切換模式於上數及下數之間 加以操作,所以,可以實現更高之準確度相加操作,而不 必使用與晶片分開之外部記憶體裝置’或使用額外電路裝 置作爲行並聯AD C,該晶片上係有像素陣列單元1 0及2 6 安裝在同一半導體區域中。 在上述例子中,被執行於兩列中之像素相加爲例及解 釋,然而,這並不限於兩列相加的處理,也可能用於多數 列。在此時,如果予以相加之列數爲Μ,則影像資料的量 可以被壓縮至1/Μ。 再者,當影像資料量被壓縮至1 /Μ時,框率可以藉由 改變資料輸出率而增加Μ倍。類似於上述專利文獻所揭示 之技術,段落6 8至7 1與8 7,各種修改均可以完成。其詳 細說明可以在此被省略。 [數位相加處理的缺點] 圖8Α至8D爲圖,用以顯示爲計數器254之在垂直 方向中之數位相加處理及數位算術單元2 9之在水平方向 中之數位相加處理的缺點。圖顯示執行於垂直方向與水平 方向中之相加操作中之像素配置。 如果數位相加處理係被執行如上,則在相加後之影像 中之像素的空間中心係爲相加目標像素的中間位置。此關 係係依序累積,及在相加後之影像中之像素位置係被決定 如果相加目標像素的列順序或行順序被依序,例如1 -58- 200845735 ,2,3,4 ’…,則沒有問題,但如果例如一列順序或行 順序未依序,例如1,單元像素3,2,4,…則有問題。 實際上,當捕捉單色影像時,在多數情形下係沒有問題, 因爲通常執行相加處理不必改變相加目標像素的順序。然 而’當使用卓晶片型攝像裝置’以相加具有相同顏色的相 加目標像素時,則可能會發生問題,因爲相加目標像素的 順序必須依據分色濾鏡的色彩配置加以決定。 例如,決定使用B ay er配置濾鏡作爲分色濾鏡,其具 有如圖8 A所示之R、G、B的濾色片(Gr爲在列R中之G ,Gb爲在列B中之G)。 當對兩列及兩行執行相加處理時,垂直選擇信號 φ VSEL以第一列、第三列、第二列、第四列、第五列、 第七列、第六列及第八列…的順序由底部指定各列。因此 ,如示意圖(圖8B)所示,其中安排成予以爲行處理器26 所讀出的順序的像素、具有相同顏色的兩列,即奇數列及 偶數列係被供給至行處理器26。 當相同顏色被輸入於垂直方向中,每一安置在行處理 器26中之垂直行中之行A/D電路25執行相加處理。例如 ,行A/D電路2 5依序對以下執行相加處理:在第一列及 第三列中之具有R分量及Gr分量的每一像素信號;在第 二列及第四列之具有G b分量及B分量的每一像素信號; 在第五列及第七列之R分量及Gr分量的每一像素信號; 及在第六列及第八列之具有Gb分量及B分量的每一像素 信號。換句話說,當在垂直方向中,像素的兩相同顏色分 -59- 200845735 量被輸入至行A/D電路25時,行A/D電路25對相同顏 色分量執行相加操作。 % 在相加處理後的示意圖係如圖8 C所示。兩相加目標 列的中心列,即在相加時之垂直方向中之中心變成在相加 後的像素的中心。例如,每一中心位置爲:在第一列與第 三列之相加後的第二列;及在第二列及第四列相加後第三 列;在第五列及第七列相加後的第六列;及在第六列與第 八列相加後之第七列。 一旦此一影像作爲目標,則數位算術單元29依序取 得列相加資料ADD,並當相同顏色被輸入水平方向中時, 執行相加操作。例如,數位算術單元29依序對以下執行 相加操作:在第一行及第三行中,具有R分量及Gb分量 的每一像素信號;在第二行及第四行中之具有Gr分量與 B分量的每一像素信號;在第五行及第七行中之具有R分 量與Gb分量的每一像素信號;及在第六行及第八行中之 具有Gr分量及B分量的每一像素信號。換句話說,當在 水平方向中之具有相同顏色分量的兩像素被輸入至數位算 術單元29時,數位算術單元29對相同顏色分量執行相加 操作。 在相加處理後的示意圖中,有關於水平方向中,兩相 加相標行之中心行,即,在相加時之水平方向的中心變成 在相加後的像素的中心。例如,每一中心位置爲:在第一 行與第三行相加後的第二行;在第二行與第四行相加後的 第三列;在第五行及第七行相加後之第六行;及在第六行 -60- 200845735 及第八行相加後的第七行。 如果圖8 C所示之有關於垂直方向之相加後的中心像 素係組合如上,如圖8 D之右側所示,由每一顏色所形成 之2x2格的中心變成在相加後的顏色的空間位置。例如, 依據運算碼n(n爲〇或正整數),四列及四行被假設爲一組 合,則像素R的中心爲”2 + 4n”列及”2 + 4n”行,像素Gr的 中心爲”2 + 4n”列及”3+4n”行,像素 Gb的中心爲” 3+4n”列 及”2 + 4n”行,及像素B的中心爲”3 + 4n”列及”3+4n”行。 在此時,可以由與圖8 D的左側所示之像素的原始位 置相比了解到,每一顏色的空間位置在相加前係被安排呈 等距,在相加後,每一顏色的空間位置係以其中心以四列 及四行加以成群,及其他群四列及四行也被考量,像素並 未以等距排列。這造成在相加後的影像解析度的問題。明 確地說,有困難獲得高解析度的相加影像。 [相加影像的解析度改良方法:第一實施例] 圖9至11爲圖,用以顯示第一實施例,其爲一方法 ’用以解決以計數器254在垂直方向中之數位相加處理及 以數位算術單元29在水平方向中之數位相加處理中解析 度降低的問題。 圖9及1 〇係爲時序圖,顯示用以在第一實施例之解 析度改良方法中,並聯於A/D轉換處理執行之垂直方向之 加權相加處理。爲了簡單說明,行A/D電路的偏移分量被 省略。圖11爲一示意圖,顯示當在第一實施例之解析度 -61 - 200845735 改良方法中操作的計數時鐘開關5 1 6的作用。 示於圖9及像素陣列單元1 〇之例子爲用於兩 相加處理,及在兩相像間之加權比係被設定爲1至 雙加權相加)。示於圖9中之第一例子爲當比例爲 之雙加權相加,其中,兩相加目標列中,在A/D轉 時之對第一列Iv的加權被設爲1,及在A/D轉換 對新一列Jv之加權被設定爲2。另一方面,如圖: 之第二例子中,由2至1比例的雙加權相加,其中 加目標列中,在A/D轉換時,第一列Iv之加權被 2,及在A/D轉換時,下一列Jv的加權被設定爲1 在垂直方向中之相加處理時,如果加權被計數 所設定爲2,即,如果A/D轉換增益爲倍增,則可 以下之任一方法:第一方法爲降低參考信號Vslop (於此例爲斜率乘以1/2);第二方法爲增加計數器 驅動速度(在此例中爲速度的兩倍);及第三方法爲 考信號Vslop之斜率調整及計數器的分頻速度調整 在用以降低參考信號V s 1 ο p斜率的第一方法中 有可能任意改變斜率,但A/D轉換週期變得更長。 說,因爲可轉換電壓寬度(即,動態範圍)在預定 A/D轉換週期中變得更窄,所以,如果A/D轉換處 以高速或寬動態範圍操作,則有若干缺點。 不同於第一方法,第二方法增加計數器的分頻 加權可以被設定,而不會對A/D轉換週期或動態範 影響。然而,如果予以供給至計數器2 5 4的計數時 像素的 2(稱爲 1至2 換處理 處理時 ί 〇所示 ,兩相 設定爲 〇 器 2 5 4 以採用 的斜率 的頻率 組合參 〇 ,雖然 換句話 長度的 理需要 速度, 圍造成 鐘CK0 -62- 200845735 本身改變,則時鐘頻率可以任意改變,然而,由於本實施 例中所採,加權値被設定爲2的乘冪,如果採用爲位元單 元之改變計數器2 5 4之分頻速度的機制,而不會改變計數 時鐘CK0的時鐘頻率。 另一方面,在第三方法之組合參考信號Vslop之斜率 調整與計數器之分頻速度調整中,調整的個別優點被合倂 。即使採用改變一位元單元之計數器254的分頻速度的機 制,而不必改變計數時鐘CK0的時鐘頻率,有可能設定任 意加權値,而不會對A/D轉換週期或動態範圍作出影響。 [垂直方向之加權相加] 如圖9所示,當兩相加目標列之第一列IV的信號被 讀出及對其上執行A/D轉換處理,首先,讀出目標列Iv 的垂直選擇信號Φ VSEL_Iv係被設定爲作動Η,並允許像 素信號S 〇的輸出被輸出至垂直信號線1 9。在此時,所有 資料保持控制脈衝HLDC00至HLDC1 1係被啓始設定至作 動H(tl_Iv至tlO_Iv)並在比較處理及計數處理(tlO_Iv至 t14_Iv)時設定至不作動L,同時,所有計數時鐘控制信號 ΤΗ0 0至TH1 1被設定至不作動L(tl_Iv至t26_Iv)。因此, 藉由比較處理及計數處理(tl_Iv至t26_Iv),計數器254保 持Vsig_Iv的數位値Dsig_Iv(t26_Iv)。這與圖7所示之處 理相同。 再者,爲了讀出兩相加目標列之下一列Jv的信號’ 以執行 A/D轉換處理,讀出目標列 Jv之垂直選擇信號 -63- 200845735 φ VS EL係被設定爲作動Η及允許像素信號So被輸出至垂 直信號線1 9。在此時,不必重置計數器254,在列JV之 單元像素3的讀出操作及A/D轉換處理係依序被執行 (tl_Jv = t26_Iv)。這係與圖7所示者相同。 另一方面,本實施例之特徵係如下。當讀出下一列 Jv(tl_Jv至t26_Jv)時,雖然如同第一列Iv之處理以改變 參考信號 Vslop斜率(tl_Iv至t26_Iv),資料保持單元 5 12_0 0的資料保持控制脈衝HLDC00被設定至作動Η,持 續整個週期(tl_Jv至t26_Jv)。同時,至其餘的資料保持 單元資料保持單元512_01至資料保持單元512_像素陣列 單元10的資料保持控制脈衝HLDC01至HLDC10於開始 時被設定至作動H(tl__Jv至tlO_jv)並在比較處理及計數處 理時設定至不作動L(tlO_Jv至tl4_Jv)。再者,計數時鐘 控制信號ΤΗ00被設定至作動Η,及所有其他的計數時鐘 控制信號ΤΗ01至ΤΗ11被設定至不作動L(tljv至 t26—Iv)。 以此方式,資料保持控制脈衝HLD C00首先變成作動 Η,及記錄在最低效位元正反器5 1 0_〇 0之資料被保持。當 下一列Jv .被處理時(tl—Jv至t26__Jv),最低效位元輸出變 成實質不作動。因此,用於下一列J v的處理變成低解析 處理。 當下一列Jv被處理時(tl—JV至t26_Jv),如果計數時 is控制fg 5虎TH 0 0變成作動Η,則最低效位元(〇位元)正反 器5 10 —00之輸入時鐘被傳送至第二級(1位元)正反器 -64 - 200845735 5 10_01的時鐘端。藉由傳送最低效位元時鐘循環至下一位 元,其他較高效位元輸出的分頻操作速度,除了最低效位 元外係被增加兩倍,計數器254計數兩倍快,同時,較以 前更粗地執行量化步驟。 例如,圖1 1顯示當計數時鐘控制信號ΤΗ00時,自每 一位元的正反器510的輸出,參考信號Vslop斜率(及依 據斜率之增益)及分頻速度改變。當計數時鐘控制信號 ΤΗ00被切換至作動 Η時,供給至最低效位元正反器 510_00之計數時鐘CIN係被傳送至第二級正反器510_01 ,使得在切換後,更高效位元正反器可以較切換前更快操 作。然而,因爲前一低效位元輸出變成不作動,所以,量 化可以較之前更粗化地執行。 例如,如果在計數時鐘控制信號ΤΗ00切換之前,第 一階正反器510_00之計數輸出D00的循環爲100MHz,第 二級正反器510_01之計數輸出D01之循環爲50MHz。同 時,當計數時鐘控制信號ThOO被切換至Η位準時,第二 級正反器510_01之計數輸出D01的循環爲100MHz,使得 在較高效位元正反器5 1 0中之分頻操作係被操作於兩倍快 的速度。Execution of the line single positive and negative CK takes it extra, as described above in the root CIN-35-200845735, the counting execution unit 504 has the first flip-flops (FF) 510-00 to 510_11 (hereinafter collectively referred to as 510) . The count execution unit 5 04 has a data holding unit (hold) 512_00 to 512_11 (hereinafter collectively referred to as 512) capable of holding the data of the inverted output terminal N Q between the inverting output terminals NQ and D of the flip-flop 510. Each data holding unit 5 1 2 is controlled by other data holding control pulses HLDC (00 to 1 1). The data holding unit 512 has a function of maintaining the count output regardless of the input state of the flip-flop 510, for example, this can be implemented for mutual exclusion or gate. For example, when the material hold control pulse HLDC is operating H (H: high level), the data holding unit 512 holds the input data (inverted output NQ of the flip-flop 510), and when the data hold control pulse HLDC is inactive L (L) When the low level is on, the hold operation is released to transfer the input data (inverted output NQ of the flip-flop 510) to the D input of the flip-flop 510. The reset control signal CLR is input together to each reset terminal R of the flip-flop 510. When the reset control signal CLR is active, the flip-flop 510 sets, for example, a non-inverted output Q to an L level, and the inverted output terminal NQ is a Η level. Furthermore, the counting execution unit 504 includes counting mode switches (U/D) 514 — 00 to 514 — 11 (hereinafter collectively referred to as 514 ) for switching the counting mode to the upper or lower number between the stages of each of the flip-flops 5 1 0 . . In response to the counting mode handle number U D C, the counting mode switch 5 1 4 switches the mode of the data at the inverting output terminal NQ of the previous stage flip-flop 510 and outputs it after being invariant or inverted. For example, the count mode switch 5丨4 can be implemented as a mutex or gate. -36- 200845735 For example, the counting mode switch 5 1 4 switches the inverting output terminal NQ of the flip-flop 5 1 0 between inverting and non-inverting, so that when the counting mode control signal UDC is at a high level, the counting execution unit 5 0 4 operates the upper number operation, and when the signal UDC is low, the count execution unit 504 performs the next operation, and the count execution unit 504 includes the count clock switches (SEL) 516_00 to 516_10 (hereinafter collectively referred to as 516), at each A flip-flop 510 is interposed between the count mode switch 5 1 4 of the next stage. The count clock switch 5 16 switches the output pulse of the count mode switch 514 and the count clock CIN from the gate 502 in response to the count clock control signals ΤΗ_00 to TH_10 (hereinafter collectively referred to as TH), respectively, and supplies them to the flip-flop of the next stage. 5 10 0 clock terminal CK. Each count clock switch 5 16 is controlled by another count clock control signal TH. The count clock control signal TH at the previous stage becomes active, and the signal TH at the next stage is sequentially activated at a predetermined delay timing (details are described later). For example, when the count clock signal TH is not active, count. The clock switch 5 1 6 transfers the output of the count mode switch 5 1 4, and when the count clock control signal TH is switched to the operation ,, it transmits the count clock CIN from the gate 502. The count clock switch 5 1 6 takes the count clock CIN from the gate 5 02 in the following manner. In the first example shown in Fig. 4, the wiring is arranged such that the clock of the flip-flop 5 10 in the previous stage is held for each row. On the other hand, in the second example shown in Fig. 5, the count clock lines 517_00 - 37 - 200845735 to 5 17_1 1 (hereinafter collectively referred to as 517) are supplied and wired together to each row and at each flip-flop 510. The count clock C IN between the stages and from the gate 502 is taken out by the count clock line 51. In the example shown in Fig. 4, less wiring is required than the count clock C IN of the second example of Fig. 5. However, when the count clock CIN is sequentially transferred to the more efficient bit flip-flop 510, the lower-effect bit flip-flop 5 10 is still operating even if the data output therefrom is processed to be inactive. On the other hand, in the second example shown in Fig. 5, although much more is needed for the count clock C IN wiring as shown in Fig. 4, there is an advantage in that less power consumption is achieved. This is because the counting operation of the flip-flop 5 10 in the preceding stage can be stopped after the switching, for example, by setting the clock stop unit (stop) to the individual stages between the gate 502 and the count clock line 5 17 18 (_00 to _ 1 〇), in response to the count clock control signal TH, the supply of the count clock to the flip-flop 5 1 0 is stopped. Both the first and second embodiments can be used to allow the counting execution unit 504 to operate as a non-synchronized binary counter, and by allowing the counting clock switch 516 to operate in response to the counting clock control signal TH, counting execution f has a function of transmitting a clock input to the flip-flop 5 10 at the next stage (lower bit side) at each time the flip-flop 510 of each stage is transmitted. In other words, the higher-speed clocks for the lower-effect bit outputs are sequentially transferred to the next-stage side (the more efficient bit side) at a predetermined timing, so that the higher-efficiency bit output for the count clock CIN is divided. The frequency operation system is completed faster in sequence. For example, the 1/4 division operation of the count clock C IN before switching can be changed to the 1/2 frequency division operation of the count clock CIN after the switching -38- 200845735 After the count clock is switched, because of the counting operation (Divided operation) is performed by a faster clock than before, so the A/D conversion can be performed at a higher speed while maintaining the linearity of the A/D conversion by adjusting the slope of the reference signal Vslop. This will be described in more detail below. [Operation of Solid-State Image Pickup Apparatus: Basic Operation] Fig. 6 is a timing chart showing the signal acquisition differential principle, which is the basic operation of the line A/D circuit 25 of the solid-state image pickup device 1 shown in Fig. 1. The analog pixel signal detected for the unit pixel 3 of the pixel array unit 10 is converted into a digital signal in accordance with the following operation. For example, a search is performed to find a point at which the reference signal Vslop is lowered by a predetermined slope in a ramp waveform, and a point at which each voltage of the reference component or the signal component of the pixel signal from the unit pixel 3 matches. A count clock self-reference signal Vslop is used as a point of comparison processing to a point corresponding to the reference element or signal element matching the reference signal, counting the time period. As a result, the counts corresponding to each of the reference elements and the signal elements are obtained. In other words, the voltage comparator 252 disposed in each of the rows 25 compares the analog pixel signal voltage V X read out to the vertical signal line 19 with the reference signal Vslop. At this time, the counter 254 disposed in each row is activated similarly to the voltage comparator 252, and a certain potential of the reference signal Vslop is changed to a one-to-one correspondence with the counter 254, and the pixel signal voltage VX is converted. For digital data. In the present description, the change of the reference signal Vslop is to convert the change in voltage into a change in time. Count -39- 200845735 The 254 counts the time by quantifying a certain cycle (clock) to convert to digital data. If it is assumed that the reference signal Vslop is changed by ΔV in the time period Δt and the counter 2 5 4 is operated in the Δt cycle, the counter 値 becomes n when the reference signal Vslop is changed to ΝχΔν. The pixel signal s 〇 (pixel signal voltage Vx) output from the vertical signal line 19 causes the signal level Ssig appearing at the reset level Srst containing the pixel signal noise as a reference level in time series. If the first operation is performed on the reference level (reset level Srst, which is substantially equal to the reset level Vrst), then the second operation is performed on the summed signal component V sig and the reset level Srst The signal level is on Ssig. This operation is detailed below. In the first operation, that is, in the A/D conversion period Trst for resetting the level Srst, the communication/timing controller 20 first sets a reset control signal CLR to the operation Η, and resets each of the self-counters 254. The count 値 of the non-inverted output terminal Q output of the flip-flop 510 is "0", and the counter 254 is also set to the lower mode (tl). At this time, the communication/timing controller 20 sets the data hold control pulse HLDC to the operation Η, and the count mode control signal UDC to the low level (i.e., the lower number mode). At this time, the vertical selection signal Φ VSEL in the read target column Vn in the unit pixel 3 is set to the operation Η, and the pixel signal So is allowed to be output to the vertical signal line 119, and the signal is almost simultaneously reset. φ RS T is set to the operation Η and 38 is set to the reset potential (U to t2). The reset potential is output to the vertical signal line 1 9 as the pixel signal S 〇. Therefore, the reset level S r s t at which the vertical signal line 1 9 appears becomes the pixel signal voltage V X . At this time, the potential of the convergence reset signal Srst is changed due to the change of the in-pixel amplifier (pixel amplifier -40-200845735 amplifier 5) of each unit pixel 3. After the first readout operation of the pixel signal read out from the unit pixel 3 in the read target column Vn to the corresponding vertical signal line 19 (H0, H1, ...) is stabilized, that is, after the reset level Srst converges' The communication/timing controller 20 supplies control data CN4 for generating the reference signal Vs lop to the reference signal generator 27. Here, in order to cause the counting operation for the counter 2 54 to start changing simultaneously with the reference signal Vslop, the data of the hold control pulse HLDC is used as the control data CN4 and is set to be inactive L (t10). In response to this, when the reference signal Vslop is used as a comparison voltage to the input terminal RAMP of one of the voltage comparators 252, the reference signal generator 27 inputs a step-by-step or linear voltage waveform which changes with time as a sawtooth wave (slant wave shape) The whole starts with the starting voltage SLP_ini. The voltage comparator 252 compares the reference signal Vslop with the pixel signal voltage Vx of the vertical signal line 19 supplied from the pixel array unit 10. Simultaneously with the input signal RAM1 input to the input terminal RAMP of the voltage comparator 252, the comparison period in the voltage comparator 252 is such that the counter 254 disposed in each column is synchronized with the reference signal Vslop supplied from the reference signal generator 27. Measure. Actually, the data hold control pulse HLDC is set to be inactive L to generate the reference signal Vslop, and the hold operation of the data holding unit 512 is performed, and therefore, the counter 254 starts the self-starting number as the first counting operation. More specifically, the counting operation starts from the negative direction. The voltage comparator 2 5 2 compares the oblique-41 - 200845735 wave reference signal Vslop supplied from the reference signal generator 27 with the pixel signal voltage Vx input via the vertical signal line 19, and when the two voltages are equal, the voltage comparator 252 The comparator output is inverted from the Η level to the L level. In other words, the voltage comparator compares the voltage signal (reset level Srst) corresponding to the reset level Vrst with the reference signal Vslop, and generates a low-state active (L) pulse signal having a corresponding value in the time axis direction. The level of the level Vrst is reset and the generated pulse signal is supplied to the counter 254. As a result, the counter 254 is almost inverted with the output of the comparator while stopping the counting operation, and latches (holds/stores) the count of the time 値 as pixel data, thereby completing the A/D conversion. In other words, the pulse of the pulse signal having a quasi-low state active (L) obtained by the comparison operation of the voltage comparator 2 52 is counted by the count clock CK0, and a display corresponding to Reset the count 値 of the digit 値Drst (eg, the sign is -Drst) at the level of the Vrst level. After a predetermined number of cycles have elapsed, the communication/timing controller 20 sets the material hold control pulse HLDC to the actuation H (tl4). Therefore, the communication/timing controller 20 stops generating the ramp reference signal V s 1 〇 p (11 4) and returns to the start voltage SLP_ini. Since in the first operation, the voltage comparator 252 detects the reset level Vrst in the pixel signal voltage Vx and the counter 254 performs the counting operation, the reset level Vrst of the unit pixel 3 is read out to reset the bit. Quasi-vrst performs A/D conversion. The reset level Vrst contains offset noise, which is changed by the unit pixel 3. However, the change in the reset level Vrst is usually small, and the reset -42-200845735 level Vrst is approximately the same for all pixels. Therefore, the output 値 of the reset level Vrst of the pixel signal voltage Vx of the arbitrary vertical signal line 19 has been generally known. Therefore, in the first readout operation and the A/D conversion for resetting the level Vrst, the lower period (comparison period) can be shortened by adjusting the reference signal Vslop force D. For example, the comparison operation is performed by setting the maximum period for the comparison operation (ie, the A/D conversion period for resetting the element) to a 7-bit count period (128 clocks), and performing the reset level Srst (heavy) Set on the standard Vrst). In the next second operation, that is, in the A/D conversion period Tsig for the signal level Ssig, in addition to the reset level Vrst, the signal component in response to the amount of incident light of each unit pixel 3 is also read out. And perform an operation similar to the first read operation. More specifically, the communication/timing controller 20 first sets the count mode control signal UDC to the high level and the set counter 254 to the upper mode (tl6). At this time, in the unit pixel 3, when the vertical selection signal φ VSEL in the read target column Vn is held as the operation ,, a transfer signal φ TRG is set to the operation Η and the signal level Ssig is read out to The vertical signal line is perpendicular to the signal line 19 (tl8 to t19). After the second readout of the unit pixel 3 in the read target column V η is stabilized to the vertical signal line 19 (Η0, Η1, ...), the communication/timing controller 2 〇 supplies control data for generating the reference signal Vslop. CN4 is supplied to the reference signal generator 27. Meanwhile, in order to cause the reference signal Vslop to start changing simultaneously with the counting operation of the counter 254, the data holding control pulse HLDC uses -43-200845735 as the control data CN4, and is set to be inactive L (t20). In response to this, the reference signal generator 27 inputs a step-by-step or linear voltage waveform as a reference signal V s 1 ο p to the comparison voltage of the input terminal RAMP of the voltage comparator 252, which is a sawtooth wave in time. (Ramp) changes and starts with the starting voltage SLP_ini. The voltage comparator 2 52 compares the reference voltage Vslop with the pixel signal voltage Vx supplied from the pixel array unit 10 to the vertical signal line 19. Simultaneously with the reference signal Vslop input to the input terminal RAMP of the voltage comparator 252, the comparison period in the voltage comparator 252 is the amount of the reference signal Vslop supplied from the reference signal generator 27 in synchronization with the counter 25 in each column. Measurement. Actually, at this time, the material hold control pulse HLDC is set to be inactive L to generate the reference signal Vslop, which releases the holding operation of the material holding unit 51. Therefore, in the second counting operation, the counter 254 starts counting backwards with the first operation, and the digit 値Drst of the reset level Srst of the pixel signal voltage Vx obtained by the first reading (here, negative 値), And A/D conversion operations. In other words, the counting operation starts in the positive direction. The voltage comparator 25 2 compares the ramp reference signal Vslop supplied from the reference signal generator 27 with the pixel signal voltage Vx input via the vertical signal line 19, and when the two are equal, the voltage comparator 252 outputs the output of the comparator. The level is inverted to the L level (t22). In other words, the voltage comparator 2 52 compares the voltage signal (signal level Ssig of the pixel signal voltage Vx) corresponding to the reset level Vrst with the reference signal Vslop, and generates a low-state active (L) pulse signal, which is The time axis direction has a level corresponding to the signal component -44 - 200845735 V sig and supplies the generated pulse signal to the counter 2 5 4 . As a result, the counter 254 stops the counting operation almost simultaneously with the inversion of the comparator output, and latches (holds/stores) the count at that time as the pixel data, thereby completing the A/D conversion. In other words, the width of the low-level active (L) pulse signal obtained in the time axis for the comparison operation in the voltage comparator 252 is counted by the count clock CK0, and is obtained corresponding to the pixel signal voltage Vx. The count of the signal level Ssig is 値. In the unit pixel 3, after a predetermined number of cycles, the vertical selection signal Φ VSEL in the read target column Vn is set to be inactive L, and the pixel signal S 输出 output to the vertical signal line 19 is stopped, and is used. The vertical selection signal φ VS EL in the column below the read target column Vn+1 is set to the active level (t26). At this time, the communication/timing controller 2 is prepared to process the next read target column Vn+1. For example, the count mode control signal UD C is set to the low level and the counter 2 5 4 is the lower mode. In the second operation, since the counting operation is performed by detecting the signal level S sig of the pixel signal voltage VX by the voltage comparator 252, the signal component Vsig of the unit pixel 3 is read out to match the signal level. Ssig performs A/D conversion. Since the signal level Ssig is a level obtained by adding the signal component Vsig to the reset level Srst, the count 値 for the A/D conversion of the signal level ssig is basically "Drst + Dsig". However, since the upper number is started by "-Drst" which resets the A/D conversion result of the level Srst, a count 値 becomes "-〇^1 + (〇3丨8 + 〇1^) = 〇8丨吕,,. If the A/D conversion period Trst and -45-200845735 for resetting the level Srst are assumed to be used for each digit of the A/D conversion period Tsig of the signal level Ssig (conversion) The coefficient is α [V/digit], and the A/D conversion period meter Dsig is converted into voltage 値, and the voltage of the signal component Vsig is mutated. D sig 〇 For example, as shown in FIG. 6, it represents the pixel signal voltage. In the position 値 in the brackets of Vx, the reset level Srst of the pixel signal voltage Vx in the vertical signal line 19 is 10, the signal component is 60, and the letter Ssig is 70 for the digit 値. In the A/D conversion period Trst of the quasi-Srst, when the count Drst becomes -10, the reference signal Vslop and the pixel signal voltage Vx (intersection) and the comparator output of the voltage comparator 252 are inverted to the operation, so that the counter 254 is stopped. The next operation is performed. Therefore, the A/D conversion result of the reset level becomes the -pixel array unit 10, and the 値 is guaranteed until the signal is used. The A/D conversion period Tsig of the quasi-Ssig ends as the period for reading the next pixel signal. Furthermore, in the A/D conversion period Tsig of the signal level Ssig, the number level is read by the unit pixel 3. The counter 254 is caused to start up in the A/D conversion period Trst (point P in the figure), when the reference V slop becomes equal to the potential of the pixel signal voltage Vx, the count is changed, and when the reference signal Vslop and the pixel signal voltage When the signals Ssig of Vx are equal to each other, the comparator output from the voltage comparator 252 is inverted to the actuation L, whereby the counter 254 stops the upper operation. At this time, the actual number of the counter 25 4 is 70, However, the counter 2 5 4 starts from the negative 値-1 ,, so the actual counted electric number 値 becomes the α position P. Tfe· /^[-^ Number of digits 値 Match L bit Srst Hold, stop, , signal. The signal becomes a clamp, and 値 is -46-200845735 ”- 1 0 + 70 = 60”, so that it becomes the digit of the signal component Vsig 値D sig = 6 0 〇 In other words, in this embodiment, The counter 2 5 4 performs the first operation down number and performs the second operation upper number. Therefore, in the counter 254, the differential processing (subtraction processing) is automatically performed between the count 値 "-Drst" and the count 値 "Drst + Dsig", "-Drst" is the A/D conversion period, "D rst + D Sig, the A/D conversion period for the signal level Ssig, and the count 値Dsig corresponding to the result of the differential processing are held in the counter 254. The count corresponding to the difference processing result and held in the counter 254値Dsig corresponds to the signal component Vsig. As described above, by performing the comparison processing of the reset level Srst (actually equal to the reset component Vrst) and the signal level Ssig, and performing the sub-processing with the comparison processing The upper number processing maintains a count 値 corresponding to the subtraction result (count 値 in the second comparison period) - (count 値 in the first comparison period). At this time, the row A/D circuit 25 The offset component must be actually considered. Therefore, the equation (count 値 in the second comparison period) - the count of the shift in the first comparison period 値) = (reset level Srst + signal component Vsig + row) A/D circuit 25 offset Quantity) - (reset level Srst + offset component of row A/D circuit 25) = (signal component Vsig). By the above two read processing and automatic differential processing in counter 254, except for each unit In addition to the changed reset component V rst of the pixel 3, it is also possible to eliminate the offset component of each row of the A/D circuit 25. Therefore, it is possible to obtain A/ of the signal component Vsig corresponding to the amount of incident light of each unit pixel 3. D-conversion node 47-200845735. Therefore, the row A/D circuit 25 of the present embodiment is not only used as a unit for converting an analog pixel signal into a digital pixel signal, and is also a CDS processing functional unit. The A/D conversion is performed by reading out the signal component V sig corresponding to the input amount. Therefore, in order to judge the amount of light at the level, it is necessary to set the upper period (t20 to t24 period) to make it The reference signal supplied to the voltage comparator 252 can be significantly changed. Therefore, in the present embodiment, the comparison longest period of the signal level Ssig is set to, for example, a 12-bit count period (4096 hours _ comparison is performed) Signal level Ssig. In other words, the longest period of the comparison processing (for resetting the A/D conversion period) for the weight Srst (reset level Vrst/reference component) is set to be shorter than the longest period of the comparison processing for the letter Ssig (ie, the a/D period of the signal component). The longest period of the comparison processing of the reset level S rst is set to the longest period for the comparison processing of the signal level S sig , and is determined to be equal to the two of the comparison processing. The longest period, that is, the maximum 値 equalization of the A/D conversion period for the reset level for the signal level Ssig, the total length of the two A/D conversion periods is shortened. At this time, although the comparison bit between the first time and the second time is the same, the communication/timing controller 20 supplies the control data to the reference unit 27, and the reference signal generator 27 generates the reference Vs1 based on the control signal. ο p. Therefore, the slope of the reference signal V s 1 ο p, g 卩 when the reference signal digit is single, also the range of the number of shots Z is compared with V s 1 ο ρ operation I), and the position of the set quasi-component is defined as Short is not set to Srst and. Therefore, the rate of change does not produce the test signal V s 1 ο ρ -48- 200845735 The rate of change is the same for the first time and the second time. If the reference signal V s 1 ο p is generated under digital control, the slope of the reference signal V s 1 ο p is easily made the same between the first and second times. In this way, the accuracy of the A/D conversion can be made equal, and the result of the subtraction processing by the up and down counters can be correctly obtained. The row A/D circuit 25 of the present embodiment has a data storage unit 256 at the counter 254 of the next stage. Before the operation of the counter 254, the count result obtained by processing the previous column Hx-1 is transmitted to the data storage unit 2 according to the memory transfer command pulse CN 8 from the communication/timing controller 2, in other words, After the end of the A/D conversion period, the data in the counter 254 is stored in the data storage unit 256, and the row A/D circuit 25 starts the A/D conversion processing of the next column Vx+Ι. The data stored in the data storage unit 256 after the A/D conversion process is sequentially selected by the horizontal scanning circuit 12 and can be read by the output circuit 28. In the architecture in which the data storage unit 256 is not provided, since the pixel data is output to the outside of the line processor 22 only after the second read processing, that is, after the A/D conversion processing is completed, there is a limit to the read processing. . On the other hand, by arranging the data storage unit 25 6, before the read processing (A/D conversion processing), the count indicating the result of the last subtraction processing is transmitted to the data storage unit 256, and therefore, the readout There is no limit to processing. Furthermore, since the counting result held in the counter 254 can be transmitted to the data storage unit 2 5 6, the counting result of the counter 2 5 4, that is, the A/D conversion, and the reading result to the horizontal signal line are read. 1 8 reading -49- 200845735 Out operations can be controlled independently. Therefore, it is possible to perform a pipeline operation which performs A/D conversion processing and readout operation in parallel with signals read out to the outside. As described above, in the solid-state imaging device 1 of the present embodiment, the upper and lower numbers can be switched. At this time, the upper counter which can switch the counting mode itself is used to perform the counting process twice, and at the same time, the processing mode is switched. The structure in which the unit pixels 3 are arranged in columns and rows is constructed in a row parallel A/D circuit in which row A/D circuits 25 are arranged in each vertical row. Therefore, it is possible to directly obtain the result of the subtraction processing between the reference level (reset level Srst) and the signal level Ssig as a result of the second count processing for each vertical line. The memory device for storing the reset level Srst and the signal level Ssig is implemented as a latch function of the counter. Therefore, there is no need to use a separate dedicated memory outside the counter to store the AD conversion data. In addition, it is not necessary to prepare a special subtractor for counting the difference between the digital data corresponding to the signal level (reset level Sr st ) of the reference component and the digital data corresponding to the signal level of the signal component. Therefore, it is possible to directly obtain the result of the subtraction processing between the reference level (reset level Srst) and the signal level Ssig as a result of the first count processing for each vertical line. The memory device for storing the count result of the reset level Srst and the signal level Ssig is performed by the latch function of the counter. Therefore, it is not necessary to provide a dedicated memory for storing AD conversion data outside the counter. In addition, it is not necessary to prepare a special subtractor for calculating the digital data corresponding to the signal level (reset level Srst) of the component of the reference-50-200845735 and the digital data corresponding to the signal level of the signal component. difference. This architecture can be accomplished by combining individual upper and lower numbers. However, at this time, it is possible, for example, to require a function element to start after loading the count of a counter (in the above example, the down counter) into another counter (upper counter in the above example). Count operation 'or, minus each count 为 for digital count processing. For example, it is possible to perform the next operation in the A/D conversion period in order to reset the level Srst to maintain the A/D conversion result of the reset level Srst of the unit pixel 3, and for the signal level Ssig, at A The upper number operation is performed in the /D conversion period Tsig to obtain the A/D conversion result from the signal component Vsig of the reset level Srst. That is, actually, the A/D conversion function and the CDS processing of the signal component Vsig are simultaneously performed. Moreover, since the pixel data indicated by the count 保持 held in the counter 254 displays a positive signal voltage, it is not necessary to perform a complementary calculation for changing the negative signal voltage to the positive signal voltage, which is consistent with the current system height. . Furthermore, by providing the data storage unit 256 at a lower level of the counter 2 5 4, it is possible to perform the signal output operation by the data storage unit 256 via the horizontal signal line 18 and the output circuit 28 to the outside in parallel, and for The current column Hx read operation and the counter 2 5 count operation 'to complete more valid signal output. The count 値Dsig obtained by converting the signal component Vsig of the pixel signal voltage Vx into digital data is stored in the data storage unit 256, and then sequentially read out to the outside by the horizontal scanning circuit 12. In this manner, since the -51 - 200845735 signal charge generated by the charge generator 32 is processed as an analog electrical signal and is processed in parallel by each column to the digital data, and then converted to digital data, one can be completed. High-speed counting and high-speed processing. [A/D conversion + addition processing: basic operation] Fig. 7 is a timing chart for displaying the addition processing in the vertical direction in parallel with the A/D conversion processing operation. For simplicity of explanation, the offset of the row A/D circuit is ignored. Each of the timings and signals in Fig. 7 is represented by the sequence and signal shown in one of the rows of Fig. 6, regardless of whether or not processing is the target column. In the description, the timing and signal are treated to distinguish the reference symbol representation of the target column. The same is true for other similar timing diagrams. The addition processing in the vertical direction performed in parallel with the A/D conversion processing operation is performed in the high-speed frame mode by setting the exposure period of the unit pixel to 1 /2 time compared with the normal frame mode. The pixel information is read out by all the unit pixels 3 in the pixel array unit 10. Even after the A/D conversion processing is performed, for the unit pixel 3 in a certain column, the counter 256 can express the A/D conversion result for the signal level Ssig by the count of η-bits. In the present embodiment, by using the data retention characteristic of the counter 2 54, the processing for converting the A/D conversions of the unit pixels 3 in the plurality of columns is performed in the counter 254. Most of the columns that are subject to addition processing can be two or more columns, or any number of columns greater than three. The acceptable relationship between the majority of the columns is not just the adjacent columns but also the columns. For example, typically, if the pixel array unit; [〇 -52- 200845735 is used to capture a color image, the appropriate column is selected in order to match the color configuration of the color separation filter, ie, the same color element is added. For example, if configured for B a er, the addition process is performed in an odd column or an even column. The same is true for the addition processing in the horizontal direction. Most columns that are subject to additional processing can also be two or more columns, or any number of columns greater than three. The acceptable relationship between most columns is not just for adjacent rows but also for several rows. For example, typically, if pixel array unit 10 is used for color image capture, in order to match the color configuration of the color separation filter, i.e., the additive color components are summed, the appropriate line system is selected as the target. For example, if configured for Bayer, the addition process is performed on odd or even rows. The following description is based on the assumption that the addition processing is performed by the counter 254 between two columns of any column Iv and any column Jv (addition calculation in units of two columns), and the counter 254 is in the row A/D circuit 25 There is an up/down number function, and thereafter, the addition processing is performed by the digit arithmetic unit 29 between two lines of an arbitrary line Ih and an arbitrary line Jh (calculated by adding two rows of rows). In other words, the explanation assumes that the addition calculation is based on two columns and two rows having a predetermined relationship. Furthermore, it is assumed that the column ϊν is the addition target column and its A/D conversion system is executed first, and then the A/D conversion is performed on the column Jv. The basic operation description of the differential processing can be obtained from the signal. When the signal of the unit pixel 3 in the column Iv is read and the A/D conversion processing is performed, first, the vertical selection signal cpVSEL_Iv of the target column Iv is read. It is set to operate Η and allows the pixel signal S 〇 to be output to the vertical signal line 19. At this time, although not shown, all the data hold control pulses HLDC00 to HLDC1 1 are set to the actuation H (tl_Iv to tlO_Iv) -53 - 200845735, and are set to the inactive L' and count processing during the comparison processing ( From tiOJv to t14_Iv), all of the count clock control signals ΤΗ00 to TH11 are set to be inactive L (tl_Iv to t26_Iv). It is assumed that the reset element of the column Iv is Vrst_Iv and its reset level is Srst_Iv, and the signal component of the column Iv is Vsig_Iv and its signal level is Ssig_Iv. By performing comparison processing and counting processing (tl_Iv to t26_Iv) on them, the counter 254 holds the digit 値Dsig_Iv(t26_Iv) obtained by the equation, where (·the count in the second comparison period 値)-(in the The count in a comparison cycle 値) = "(Srst_IV + VSig__Iv) - Srst_Iv = Vsig_Iv". After the A/D conversion period of the column I v is completed, it is not necessary to reset the counter 2 5 4, and the signal read operation and the A/D conversion processing of the unit pixel 3 in the column Jv are sequentially performed, similarly for The read operation of the processing of the column Iv is repeated. Therefore, first, the vertical selection signal φ VSEL_Iv of the previous read target column Iv is set to be inactive L, and the vertical selection signal φ VSEL_Jv of the next read target column Jv is set to the operation Η, and the pixel signal So is allowed. It is output to the vertical signal line 19 (tl_Jv = t26_Iv). At this time, all the data hold control pulses HLDC00 to HLDC11 are initially set to the actuation H (t l_Jv to tl 0_Jv), and are set to the inactive L during the comparison processing and the counting processing (t10_Iv to t14_Iv), although not displayed. However, all the count clock control signals T Η 0 0 to Η Η 1 1 are set to be inactive L (tl_Jv to t26_Jv). Assume that the weight component in column Jv is Vrst_Jv, its reset level is Srst — Jv, and the signal component in column Jv is Vsig_Jv and its signal bit -54-200845735 is Ssig_Jv. By performing comparison processing and counting processing (tl-Iv to t26_Iv) on them, after the A/D conversion of the column Jv, the counter 254 holds the digits obtained by the equation, where: "Vsig_IV + (SrSt_Jv + VSig__jv)_ Srst_Jv = Vsig_Iv + Vsig_Jv''. In other words, the counts obtained by the two signal components Vsig_Iv and Vsig_Jv of the columns Iv and Jv in the vertical direction of the phase port are held in the counter 254 (t26_Jv). As shown in FIG. 7, one of the digits is indicated in the parentheses of the line graph of the pixel signal voltage Vx, which assumes that the reset level Srst_Iv in the column Iv and the Srst_Jv in the column Jv are 10, and the signal components Vsig_Iv and Vsig_Jv 60, and the signal levels Ssig_Iv and Ssig_Jv are 70. At this time, in the A/D conversion of the signal level Ssig_Iv (signal component Vsig_Iv) in the column Iv, by performing A/ of the self-resetting level Srst_Iv The D 转换Drst_Iv(= -10) obtained by the D conversion is used as the upper number of the starting point. After the processing, the count 値Dsig_Iv in the counter 254 becomes 10+70=60" °, and then the A/D conversion in the column Jv The count 値Dsig_Iv(= 60) obtained by the A/D conversion of the column Iv Used as a starting point, the number of lines to re-execute the first level Srst_JV, and be held in the counter 254 is in the Zhi Drst_Jv becomes "60-10 = 50." Furthermore, the upper number is executed on the signal level Ssig_Jv by using the count 値Drst_Jv (= 50) as a starting point, and the count 値 ADD which is held in the counter 25 4 after processing becomes "5 0 + 70 = 1 20”. This 値 indicates the result of adding the signal component Vsig_Iv in the column Iv to the signal component Vsig_Jv in the JV. In the former example, the digital addition processing is performed in the row A/D circuit 25 by switching the upper and lower numbers -55 to 200845735. At this time, if the counter can switch the counting mode by using itself, it is advantageous in that it is possible to automatically perform CDS processing for eliminating the reset component V r s t of the signal Vsig of the unit pixel 3 and the addition processing. This architecture can be implemented by combining individual up-counters and down-counters. However, in this case, a functional component may be required, for example, counting from one device counter (in this case, the lower-counter) to another counter ( In this example, the counting operation is started after the counting device, or each counting 相 is subtracted or added by the digital calculation processing. After the A/D conversion process, the counter 254 transmits the count 値 to the horizontal signal line 18 via the data storage unit 256. At this time, the addition result obtained by adding the signal components Vsig_Iv and Vsig_Jv of the two columns Iv and Jv in the vertical direction is sequentially supplied to the digital arithmetic unit 29. By repeating the operation similar to the above, it is possible to obtain an image in which the pixel information is reduced to 1 /2 in the vertical direction (in the vertical (row) direction of the sensing surface). As a result, the frame rate can be increased up to twice as high as the normal frame rate mode in which all pixel information is read. The digital arithmetic unit 29 adds the signal components Vsig_Iv and Vsig_Jv (hereinafter referred to as column addition data ADD) of the two columns Iv and Jv in the vertical direction supplied from the self processor 26 and the data Add_Ih in the row Ih and The column in the row jh adds the data ADD Jh, and finally obtains the digital data indicating the addition result of the two columns and the two rows. For example, it is assumed that the counter 254 performs addition processing for odd columns and adjacent one even columns, and the digital arithmetic unit 29 performs addition processing for odd rows and one adjacent even rows. At this time, the 'digital arithmetic unit 29 reads out the addition data of the even-numbered lines and the odd-numbered lines from the data storage unit 56-200845735 storage unit 2 5 6 and adds them, thereby performing the addition operation between the two lines. As a result, the digital arithmetic unit 29 obtains the digital data 'which represents the addition result obtained by adding the signal components Vsig_lvlh and Vsig_IvJh of the two lines and the signal components Vsig_JvIh and Vsig_JvJh of the two lines, the former two behaviors being in the horizontal direction The odd row in the odd row Ih and the adjacent even row Jh, the latter two are the odd row Ih in the horizontal direction and the even column Jv adjacent to the odd column Iv. In other words, the addition operation is performed on four pixels arranged in two adjacent columns and two rows. The pixel signal voltage Vx output from the unit pixel 3 via the vertical signal line 19 is converted into a digital volume by the row A/D circuit 25, and the digital unit is added to the majority of the unit pixels 3 in the vertical direction (row direction). (In the previous example, the unit pixels 3 are arranged in two columns). With the above operation, it is possible to obtain the following effects. For example, 'from the representation of the pixel information amount, this is the same as the subtraction read (jump read) 1 /2 of the pixel resource in the vertical direction. However, since the pixel information is added between two pixels in the vertical direction, the information amount of the pixel information piece is multiplied. Therefore, even if the exposure period for the unit pixel 3 is set to 1 /2 time to ensure that the frame rate is, for example, twice as high, the digit 値 is added between the two columns of unit pixels at the time of a/d conversion, and one pixel The amount of information in the information has been multiplied. Therefore, the sensitivity is not reduced compared to the normal frame rate mode. In other words, the shorter exposure time of the single-pixel 3 does not cause a reduction in the amount of information of one pixel information. Therefore, it is possible to achieve a higher frame rate without lowering the sensitivity. Furthermore, since the addition processing is performed by switching the mode between the upper and lower numbers by the row A/D circuit 25 provided with the built-in -57-200845735/down counter, it is possible to achieve higher The accuracy addition operation does not have to use an external memory device separate from the wafer' or use an additional circuit device as a row parallel AD C having pixel array cells 10 and 26 mounted in the same semiconductor region. In the above example, the addition of the pixels performed in the two columns is exemplified and explained, however, this is not limited to the processing of adding two columns, and may be used for a plurality of columns. At this time, if the number of added columns is Μ, the amount of image data can be compressed to 1/Μ. Furthermore, when the amount of image data is compressed to 1 / ,, the frame rate can be increased by a factor of two by changing the data output rate. Similar to the techniques disclosed in the above patent documents, various modifications can be made in paragraphs 68 to 71 and 87. Detailed descriptions thereof can be omitted here. [Disadvantages of Digital Addition Processing] Figs. 8A to 8D are diagrams for showing the disadvantages of the digital addition processing of the counter 254 in the vertical direction and the digital addition processing of the digital arithmetic unit 29 in the horizontal direction. The figure shows the pixel configuration performed in the addition operation in the vertical direction and the horizontal direction. If the digital addition processing is performed as above, the spatial center of the pixel in the added image is the intermediate position of the addition target pixel. This relationship is sequentially accumulated, and the pixel position in the added image is determined if the column order or the row order of the added target pixel is sequentially, for example, 1 -58-200845735, 2,3,4 '... There is no problem, but if, for example, a column order or a row order is not sequential, for example 1, unit pixels 3, 2, 4, ... are problematic. In fact, when capturing a monochrome image, there is no problem in most cases because the usual addition processing does not have to change the order in which the target pixels are added. However, when "adding a wafer type image pickup device" is used to add the addition target pixels having the same color, a problem may occur because the order of adding the target pixels must be determined in accordance with the color configuration of the color separation filter. For example, it was decided to use a Ba er configuration filter as a color separation filter having R, G, and B color filters as shown in FIG. 8A (Gr is G in column R, and Gb is in column B). G). When the addition processing is performed on two columns and two rows, the vertical selection signal φ VSEL is in the first column, the third column, the second column, the fourth column, the fifth column, the seventh column, the sixth column, and the eighth column. The order of ... is specified by the bottom of each column. Therefore, as shown in the schematic diagram (Fig. 8B), the pixels arranged in the order read by the line processor 26, the two columns having the same color, i.e., the odd-numbered columns and the even-numbered columns are supplied to the line processor 26. When the same color is input in the vertical direction, each of the line A/D circuits 25 disposed in the vertical line in the line processor 26 performs an addition process. For example, the row A/D circuit 25 sequentially performs an addition process on each pixel signal having an R component and a Gr component in the first column and the third column; and having the second column and the fourth column in the second column and the fourth column Each pixel signal of the G b component and the B component; each pixel signal of the R component and the Gr component in the fifth column and the seventh column; and each of the Gb component and the B component in the sixth column and the eighth column One pixel signal. In other words, when two equal color sub-pixels of -59 - 200845735 are input to the row A/D circuit 25 in the vertical direction, the row A/D circuit 25 performs an addition operation on the same color component. The schematic diagram after % addition processing is shown in Figure 8C. The center column of the two-addition target column, that is, the center in the vertical direction at the time of addition becomes the center of the added pixel. For example, each center position is: a second column after adding the first column and the third column; and a third column after the second column and the fourth column are added; in the fifth column and the seventh column The sixth column after the addition; and the seventh column after the sixth column and the eighth column are added. Once this image is targeted, the digit arithmetic unit 29 sequentially takes the column addition data ADD, and when the same color is input in the horizontal direction, performs an addition operation. For example, the digital arithmetic unit 29 sequentially performs an addition operation on each of the pixel signals having the R component and the Gb component in the first row and the third row, and the Gr component in the second row and the fourth row. Each pixel signal of the B component; each pixel signal having an R component and a Gb component in the fifth row and the seventh row; and each of the Gr component and the B component in the sixth row and the eighth row Pixel signal. In other words, when two pixels having the same color component in the horizontal direction are input to the digital arithmetic unit 29, the digital arithmetic unit 29 performs an addition operation on the same color component. In the schematic diagram after the addition processing, there is a center line in which the two phases are added to the phase line in the horizontal direction, that is, the center in the horizontal direction at the time of addition becomes the center of the pixel after the addition. For example, each center position is: a second row after the first row and the third row are added; a third column after the second row and the fourth row are added; after the fifth row and the seventh row are added The sixth line; and the seventh line after the sixth line -60-200845735 and the eighth line are added. If the center pixel system combination shown in FIG. 8C with respect to the vertical direction is as described above, as shown on the right side of FIG. 8D, the center of the 2x2 cells formed by each color becomes the added color. Spatial location. For example, according to the operation code n (n is 〇 or a positive integer), four columns and four rows are assumed to be a combination, and the center of the pixel R is a "2 + 4n" column and a "2 + 4n" row, and the center of the pixel Gr For the "2 + 4n" column and the "3+4n" row, the center of the pixel Gb is the "3+4n" column and the "2 + 4n" row, and the center of the pixel B is the "3 + 4n" column and "3+" 4n" line. At this time, it can be understood from the original position of the pixel shown on the left side of FIG. 8D that the spatial positions of each color are arranged equidistantly before the addition, after the addition, each color is The spatial position is grouped in groups of four columns and four rows, and the other groups of four columns and four rows are also considered, and the pixels are not arranged in equal distance. This causes a problem in image resolution after addition. It is clear that it is difficult to obtain a high-resolution additive image. [Method for improving the resolution of the added image: First Embodiment] FIGS. 9 to 11 are diagrams for showing the first embodiment, which is a method for solving the digital addition processing of the counter 254 in the vertical direction. And the problem that the resolution is lowered in the digital addition processing in the horizontal direction by the digital arithmetic unit 29. Figs. 9 and 1 are timing charts showing the weighted addition processing for paralleling the vertical direction of the A/D conversion processing in the resolution improvement method of the first embodiment. For the sake of simplicity, the offset component of the row A/D circuit is omitted. Fig. 11 is a view showing the action of the count clock switch 516 operated in the improved method of the resolution -61 - 200845735 of the first embodiment. An example shown in Fig. 9 and the pixel array unit 1 is for two addition processing, and the weighting ratio between the two phases is set to 1 to double weighted addition). The first example shown in Fig. 9 is when the ratio is the double-weighted addition, wherein in the two-addition target column, the weighting of the first column Iv at the A/D turn is set to 1, and at A The weight of the /D conversion to the new column Jv is set to 2. On the other hand, as shown in the second example of the figure, the double-weighted addition of the ratio of 2 to 1 is added, wherein in the target column, at the time of A/D conversion, the weight of the first column Iv is 2, and at A/ In the D conversion, the weight of the next column Jv is set to 1 in the addition processing in the vertical direction, if the weighting is counted to 2, that is, if the A/D conversion gain is multiplied, then any method can be used. The first method is to reduce the reference signal Vslop (in this case, the slope is multiplied by 1/2); the second method is to increase the counter driving speed (in this case, twice the speed); and the third method is to test the signal Vslop The slope adjustment and the frequency division speed adjustment of the counter are likely to arbitrarily change the slope in the first method for reducing the slope of the reference signal V s 1 ο p , but the A/D conversion period becomes longer. That is, since the switchable voltage width (i.e., dynamic range) becomes narrower in the predetermined A/D conversion period, there are several disadvantages if the A/D conversion is operated at a high speed or a wide dynamic range. Unlike the first method, the second method increases the frequency division weight of the counter and can be set without affecting the A/D conversion period or dynamic range. However, if it is supplied to the counter 2 2 4 when counting the pixel 2 (referred to as 1 to 2 conversion processing, 两 ,, the two phases are set to the 2 2 2 4 to use the frequency combination of the slopes, Although the length of the reason requires speed, and the clock CK0-62-200845735 itself changes, the clock frequency can be arbitrarily changed. However, since it is taken in this embodiment, the weight 値 is set to a power of 2, if It is a mechanism for changing the frequency dividing speed of the counter 2 5 4 of the bit unit without changing the clock frequency of the counting clock CK0. On the other hand, the slope of the combined reference signal Vslop in the third method is adjusted to the frequency of the counter. In the adjustment, the individual advantages of the adjustment are combined. Even if the frequency division mechanism of the counter 254 of the one-element unit is changed, without changing the clock frequency of the count clock CK0, it is possible to set an arbitrary weight 値 without A /D conversion period or dynamic range is affected. [Weighted addition in the vertical direction] As shown in Figure 9, when the signal of the first column IV of the two added target columns is read out and The A/D conversion process is performed. First, the vertical selection signal φ VSEL_Iv of the read target column Iv is set to be active, and the output of the pixel signal S 允许 is allowed to be output to the vertical signal line 19. At this time, all the data The hold control pulses HLDC00 to HLDC1 1 are set to the active H (tl_Iv to t10_Iv) and set to the inactive L when the comparison process and the count process (t10_Iv to t14_Iv) are performed, and all the count clock control signals ΤΗ0 0 to TH1 1 is set to be inactive L (tl_Iv to t26_Iv). Therefore, by the comparison processing and counting processing (tl_Iv to t26_Iv), the counter 254 holds the digit 値Dsig_Iv (t26_Iv) of Vsig_Iv. This is the same as the processing shown in Fig. 7. Furthermore, in order to read the signal of one column Jv under the two-addition target column to perform the A/D conversion process, the vertical selection signal of the read target column Jv-63-200845735 φ VS EL is set to be activated and allowed. The pixel signal So is output to the vertical signal line 19. At this time, it is not necessary to reset the counter 254, and the read operation and the A/D conversion processing of the unit pixel 3 in the column JV are sequentially performed (tl_Jv = t26_Iv). This is related to Figure 7 On the other hand, the features of this embodiment are as follows: When the next column Jv (tl_Jv to t26_Jv) is read, although the processing of the first column Iv is used to change the slope of the reference signal Vslop (tl_Iv to t26_Iv), the data The data hold control pulse HLDC00 of the holding unit 5 12_0 0 is set to the operation Η for the entire period (tl_Jv to t26_Jv). Meanwhile, the data holding control pulses HLDC01 to HLDC10 to the remaining data holding unit data holding unit 512_01 to the data holding unit 512_pixel array unit 10 are set to the actuation H (tl__Jv to t10_jv) at the beginning and are subjected to comparison processing and counting processing. Set to no action L (tlO_Jv to t14_Jv). Further, the count clock control signal ΤΗ00 is set to the operation Η, and all other count clock control signals ΤΗ01 to ΤΗ11 are set to the inactive L (tljv to t26 - Iv). In this way, the data retention control pulse HLD C00 first becomes active, and the data recorded in the least significant bit flip-flop 5 1 0_〇 0 is held. When the next column Jv. When processed (tl_Jv to t26__Jv), the least significant bit output becomes substantially inactive. Therefore, the processing for the next column J v becomes a low resolution processing. When the next column Jv is processed (tl_JV to t26_Jv), if the is control fg 5 tiger TH 0 0 becomes active when counting, the input clock of the least significant bit (〇 bit) flip-flop 5 10 00 is Transfer to the second-stage (1-bit) flip-flop -64 - 200845735 5 10_01 clock side. By transmitting the least significant bit clock to the next bit, the frequency division operation speed of the other higher efficiency bit outputs is doubled except for the least significant bit, and the counter 254 counts twice as fast as at the same time, The quantization step is performed coarser. For example, Fig. 11 shows that when the clock control signal ΤΗ00 is counted, the output of the flip-flop 510 from each bit, the slope of the reference signal Vslop (and the gain according to the slope) and the frequency dividing speed change. When the count clock control signal ΤΗ00 is switched to the operation Η, the count clock CIN supplied to the least significant bit flip-flop 510_00 is transmitted to the second-stage flip-flop 510_01, so that after switching, the more efficient bit is positive and negative. The device can operate faster than before switching. However, since the previous inefficient bit output becomes inactive, the quantization can be performed coarser than before. For example, if the count of the count output D00 of the first-order flip-flop 510_00 is 100 MHz before the count of the count clock control signal ΤΗ00, the loop of the count output D01 of the second-stage flip-flop 510_01 is 50 MHz. Meanwhile, when the count clock control signal ThOO is switched to the clamp level, the cycle of the count output D01 of the second-stage flip-flop 510_01 is 100 MHz, so that the frequency division operation in the more efficient bit-reactor 5 1 0 is Operates at twice the speed.

在此時,參考信號 Vslop之斜率係與在第一列Iv (tl_Iv至t26_Iv)及下一列Jv的處理至t26_Jv)的處 理相同。因此,於第一列Iv處理時,計數値與電壓値間 之關係爲△ V/Δ t,及A/D轉換處理的總增益變成,另一 方面,於下一列Jv之處理時之電壓値2Δ V/Δ t爲及A/D -65- 200845735 轉換處理的總增益變成2。 更明確地說’在本實施例中,當下一列1 v被處理 (tl_jv至t26_JV)時,計數器的分頻速度變成k倍該速度( 在前一例爲兩倍)’而不必改變第一列1v的處理的參考信 號Vslop斜率。因此,當相較於第一列Iv之信號分量 Vsigjv的A/D轉換處理時,一雙倍增益被施加至下一列 Jv的信號分量Vsig_Jv的A/D轉換處理。 因此,假設在第一列1v之A/D轉換中之每一位數的 電壓値(轉換係數)爲^[v/位數]及在計數器254中之速度 的增加程度(對應於計數器254中之增益)爲Lv,在下一列 Jv之A/D轉換中之每一位數之電壓値(轉換係數)變成Lvx α。在前一例子中,Lv = 2及電壓値爲2α。 因此,在列Jv之A/D轉換完成後,即加權數位相加 處理的最終計數値完成後,予以保持在計數器2 5 4中之數 位値變成”a xVsig — Iv + 2a xVsig_Jv”。 例如,假設如圖9之像素信號V x之線圖上之括號內 之數位値,在列I v及列 J v中之信號分量 V s i g _ I v及 Vsig_Jv 爲 60,及重置位準 Srst_Iv 及 Srst__Iv 爲 10。 在此時,在列Iv中之信號位準 Ssig_Iv(信號分量 Vsig_Iv)的 A/D轉換中,藉由執行由重位準Srst_Iv之 八/〇轉換所取得之計數値”〇“11〃”( = -10)作爲開始點上數 ,在處理後,計數値”-l〇 + 70 = 60 = Dsig_Iv”係被保持於計數 器254中。 隨後,在列Jv之A/D轉換中,由列Iv之a/d轉換所 -66- 200845735 取得之計數値”60 = Dsig_Iv”係被使用作爲開始點,及首先 對重置位準Srst —Jv作下數,及予以保持在計數器254中 之値變成”Dsig_Iv-2· Drst_Jv = 50-2xl0 = 40”。再者,對信 號位準Ssig_Jv執行上數,由使用開始點之計數値40開始 ,及在處理後,予以儲存在計數器254中之計數値變成 ”40 + 2x7 0= 1 8 0”。計數値表示値”Dsig — Iv + 2 · Dsig — Jv”,這 係藉由將列Jv中之數位値Dsig_Jv之兩倍與列Iv中之數 位値Dsig_Iv相加加以取得。 在圖9中所不的第一例子中,相加結2”Dsig_Iv + Lv· Dsig_IV”係藉由使對Lv( = 2)乘以下一列Jv之處理的速度 之分頻操作加以取得。然而,如圖像素陣列單元1 0之第 二例子,當第一列Iv被處理時,如果計數器的分頻操作 係藉由對Lv( = 2)乘以兩倍處理下一列Jv的分頻操作,”Lv • Dsig_Iv + DSig_Iv”可以被取得作爲相加結果。 在前一例子中,只有在計數器之較高階位元側之分頻 操作被改變至L倍,及較低階位元側之速度及資料被視爲 無效,以保持啓始計數時鐘CIN之頻率爲相同速度,並避 免增加計數器中之功率消耗的增加,這並不是必須的。 如果計數器中之功率消耗的增加可接受,則不同於以 計數時鐘開關5 1 6執行切換操作,啓始計數時鐘CIN本身 也可以藉由使用爲時鐘轉換器2 3的乘法功能所產生之高 速時鐘,來加以改變至高頻,使得計數執行單元5 0 4可以 在高速執行分頻操作。在此方式下,因爲所有位元資料可 以使用爲有效資料,所以A/D轉換準確度並未降低並且在 -67- 200845735 垂直方向中之相加處理可以被實施在行A/D電路25內。 再者,爲了控制正反器510以高速執行計數操作(分 頻操作),電路被架構以控制使得在保持正反器之位元的 加權關係不變及較低階位元輸出爲無效時,較高階位元輸 出的剩餘部份的分頻操作被係執行於高速。然而,這只是 一例子,任何架構均可能,只要其可增加正反器5 1 0之分 頻操作的速度即可,並且,也可能有各種修改。 例如,可以提供開關機構,其係用以將一位元輸出依 序移位至正反器5 1 0的低階側,同時省略用以改變予以供 給至每一級之正反器5 1 0的計數時鐘的供給模式的計數時 鐘開關516。在此時,來自下一級之正反器510的資料輸 出可以被視爲無效。這也如同A/D轉換資料般地,對較低 階位元資料變成無效。然而,在此時,有需要一電路,用 以將每一位元的計數値在切換時載入前一級側。因此,一 電路結構將較使用計數時鐘開關5 1 6以切換計數時鐘的前 一例子的結構複雜。然而,在時,因爲例如,在切換操作 後,停止在下一級之正反器5 1 0的計數時鐘的供給,使計 數操作可以停止,所以可以完成消耗較低功率的優點。 再者,雖然應用例說明使用非同步計數器作爲計數器 2 54,但相同想法可以應用至使用同步計數器。例如,如 果使用同步計數器,則每一正反器510係被藉由使用一共 同計數時鐘操作,及每一正反器5 1 0需要一閘電路,其允 許每一正反器5 1 0予以當較低階位元的値爲丨(在上數)或 在所有較低階位元的値爲0(在下數)時被反相。 -68- 200845735 在此結構中,爲了增快正反器5 1 0的分頻操作的速度 ,一開關電路可以被提供以使閘電路輸出於更低階位元側 。然而,此電路結構將較使用計數時鐘開關5 1 6以非同步 計數器切換計數時鐘的結構複雜。 或者,如使用非同步計數器之修改例所述,也可能將 其架構成一電路被提供用以在切換時將每一位元之計數値 載至較低階側,及該開關機構被提供用以將一位元輸出移 至較低階側。 [水平方向中之雙倍加權相加及最終相加影像] 圖12至14顯示在第一實施例之解析度改良方法中之 水平方向及垂直方向中之相加操作時之像素配置。類似於 圖8Α至8D,作爲對兩列及兩行執行相加處理,其顯示出 當具有R、G、B(G在列R中被表示爲Gr,及在列Β中被 表示爲Gb,以彼此區分)之的濾色鏡的Bayer配置濾鏡被 使用作爲分色濾鏡。 圖12A至12F顯示當取圖8A所示之相同列及行順序 的像素,及示於圖9之雙倍加權相加係被應用至這些像素 。圖13A至13F顯示圖8A所示之相同列與行順序,及示 於圖9之雙倍加權相加與示於圖像素陣列單元1 0之雙倍 加權相加的組合被應用至這些像素上。圖1 4A至1 4F顯示 取像素的順序與圖8A中之順序不同及圖9所示之雙倍加 權相加係被應用至這些像素。 有關於在水平方向中之雙倍加權相加處理,在垂直方 -69- 200845735 向中,被加有Lv倍加權的像素係被傳送至數位算術單元 2 9,並且’數位算術單元2 9執行水平方向中之相加處理 。執行相加處理係與圖8 A至8 D所示之處理。 在本實施例中,類似於L v倍(=2 )加權相加處理,執 行了 Lh倍加權相加。明確地說,下一行Jh的相加資料 ADD_Jh係藉由將Lh倍數加權加至第一行Ih之相加資料 ADD_Ih加以取得。典型地,其被設定爲Lh = Lv。依據前 一例子,例如,其被設定爲雙倍加權。 [比例1至2的雙倍加權相加例] 當像素係取如圖8 A所示之相同列及行順序及圖9所 示之雙倍加權相加被應用至該等像素時,首先,如圖1 2 A 所示(相同於圖8A),垂直選擇信號φ VSEL以第一列、第 三列、第二列、第四列、第五列、第七列、第六列及第八 列的順序由底部指定列數。 如於圖(圖12B)所示,其中像素係被以行處理器26讀 出之順序排列,當具有相同顏色的兩列被輸入至垂直方向 中之奇數列或偶數列時,在行處理器26中之每一垂直行 中之每一行A/D電路25執行相加處理。 在此時,可以由圖9的說明了解,用於下一列Jv之 計數器2 5 4之分頻操作係爲兩倍快於用於第一列Iv的處 理,及相加處理係被設定第一列Iv(第一列、第二列、第 五列、及第六列)之加權爲1,及用於下一列Jv的加權(第 三列、第四列、第七列及第八列)爲2,如在圖的右側之,,x -70- 200845735 2”表示加以執行。 例如’相加處理係依序執行:在第一 在第三列中之雙倍R分量及在第一列中之 二列中之Gb分量及在第四列之雙倍Gb 中之B分量及在第四列中之雙倍b分量; 分量及在第七列之雙倍R分量及在第五列 在第七列中之雙倍Gr分量;在第六列中二 八列中之雙倍Gb分量及在第六列中之B 中之雙倍B分量,’,以此類推。換句話 向中之兩像素的相同顏色分量被輸入至行 ,行A/D電路25藉由使下一列JV的分| 兩倍,而執行相同顏色分量的相加操作。 在相加操作後的示意圖係如圖1 2 C所 像素中心係被移位至較大加權所施加之下 不是在兩相加目標列的中心列,即,在相 之重心。明確地說,不是於相加時之垂直 由將第一列Iv與下一列JV間之空間距離 得之位置變成在相加後的中心,該中心被 大加權的下一列Jv側1/3歹!J (參考圖12E) 例如,各個中心位置在:對於第一列 雙倍加權相加後,位移至第三列離開第二: ;對於第二列及第四列,爲在雙倍加權相 四列側離開第三列1 /3列的位置;對於第 爲在雙倍加權相加後,移位至第七列側離| 列中之R分量, :Gr分量;在第 分量及在第二列 在第五列中之R 丨中之Gr分量及 1 Gb分量及在第 分量及在第八列 說,當在垂直方 A/D電路25時 I爲第一列Iv的 示。在相加後的 一列Jv側,而 加時之垂直方向 方向的重心,藉 :以.2 : 1內分所 移位至施加有較 〇 及第三列,爲在 列1/3列之位置 加後,移位至第 五列及第七列, 開第六列1/3列 -71 - 200845735 的位置;及對於第六列及第八列,爲在雙倍加權相加後, 移位至第八列側離開第七列1 /3列的位置。 數位算術單元29依序取得列相加資料ADD,並當相 同顏色被輸入至水平方向時,對在上述狀態中之影像執行 相加操作。例如,數位算術單元29依序執行相加操作在 :在第一行中之R分量,在第三行中之雙倍R分量及在第 一行中之Gr分量及在第三行中之雙倍Gr分量;在第二行 中之Gb分量及在第四行之雙倍Gb分量及在第二行中之B 分量及在第四行中之雙倍B分量;在第五行中之R分量及 在第七行之雙倍R分量及在第五行中之Gr分量及在第七 行中之雙倍Gi:分量;在第六行中之Gb分量及在第八行中 之雙倍Gb分量及在第六行中之B分量及在第八行中之雙 倍B分量,,,以此類推。 換句話說,當在水平方向中之兩行之相同顏色分量之 相加資料被送至數位算術單元29時,數位算術單元29藉 由使下一行J v之分量爲第一行I v的兩倍,而執行相同顏 色的相加處理。 在相加操作後之示意圖中,在相加後之像素中心被移 位至施加有較大加權的下一行Jh側,而不是兩相加目標 行的中心行,即,在相加時之水平方向的重心。明確地說 ,不是在相加時之水平方向中之重心,藉由將第一行Ih 與下一行Jh間之空間距離以2 : 1內分所得之位置變成在 相加後的中心,該中心被移位至施加有較大加權的下一行 Jv側1/3行(參考圖12F)。 -72- 200845735 例如,各個中心位置在:對於第一行及第三行’爲在 雙倍加權相加後,位移至第三行離開第二行1 /3行之位置 ;對於第二行及第四行,爲在雙倍加權相加後,移位至第 四行側離開第三行1 /3行的位置;對於第五行及第七行’ 爲在雙倍加權相加後,移位至第七行側離開第六行1 /3行 的位置;及對於第六行及第八行,爲在雙倍加權相加後’ 移位至第八行側離開第七行1 /3行的位置。 如果在相加後於垂直方向中之示於圖1 2 C的中心被組 合,則在相加後的中心爲將第一列Iv及下一列Jv間之空 間距離被以2 : 1比例內分及在第一行Ih及下一行Jh間 之空間距離被以2 : 1比例內分所取得之位置,如圖1 2D 所示。 在此時,可以由比較圖1 2D左側的像素的原始位置了 解,雖然其與圖8D的右側所示之狀態不同,但每一顏色 的空間位置並未以等距排列。 [在1 : 2及2 : 1之比例中之組合雙加權相加例子] 當相同列中之像素被採用及以圖8A所示之行順序及 雙加權相加係藉由組合圖9之操作與圖1 0之操作加以應 用至像素上時,在比例1 : 2之雙倍加權相加(圖9的模式) 及以比例2 : 1之雙倍加權相加(圖1 〇的模式)係被交替地 重複。這完成以移位方向爲主之加權相加。 例如,如圖1 3 A所示(同圖1 2 A ),垂直選擇信號 φ VSEL以第一列、第三列、第二列、第四列、第五列、 -73- 200845735 第七列、第六列及第八列的順序由底部指定列。 如圖所示(圖1 3 B),其中,當奇數列或偶數列之相同 顏色列被輸入至垂直方向時,像素係被重排爲行處理器2 6 所讀出之順序’每一安置在行處理器2 6中之每一垂直行 中之行A/D電路25執行相加操作。 在此時,示於圖9中之以1 : 2比例進行之雙倍加權 相加係被執行第一相加處理及示於圖1 〇中之以2 : 1比例 進行及雙倍加權相加係被執行用於下一相加處理。以此方 式’ g十數器2 5 4以快於第一相加處理的下一列J v的分頻 操作快兩倍對第一列Iv執行分頻操作,及相加處理係藉 由將第一列Iv(第一列及第五列)加權設定爲2,以在圖中 之右側所示之”x2”,及在下一列JV(第三列及第七列)之加 權爲一。在下一相加處理中,計數器2 5 4執行下一列Jv 的分頻操作爲第一列Iv之處理的兩倍快,及相加處理係 藉由將第一列I v (第二列及第六列)之加權設定爲1,及下 一列Jv(第四列及第八列)之加權爲2,如圖右側之”x2”所 表示。第一列、第四列、第五列、及第八列之相加處理係 藉由加倍該加權加以執行。 例如,相加處理係依序執行於:在第一列中之雙倍R 分量,在第三列中之R分量及在第一列中之雙倍Gr分量 及在第三列中之Gr分量;在第二列中之Gb分量及在第四 列之雙倍Gb分量及在第二列中之B分量及在第四列中之 雙倍B分量;在第五列中之雙倍R分量及在第七列之R 分量及在第五列中之雙倍Gr分量及在第七列中之Gr分量 -74- 200845735 ;在第六列中之Gb分量及在第八列中之雙倍Gb分量及 在第六列中之B分量及在第八列中之雙倍B分量,,,以 此類推。 換句話說,當在垂直方向中之兩像素的相同顏色分量 被輸入至行A/D電路25時,行A/D電路25藉由在第一 相加操作中,使第一列Iv的分量爲下一列Jv的兩倍,而 執行相同顏色分量的相加操作,及在下一相加操作中,藉 由使下一列Jv分量爲在第一列Iv之分量的兩倍,而執行 相同顏色分量的相加操作,並重覆這些操作。 在相加操作後的示意圖係如圖1 3 C所示。在相加後的 像素中心係被移位至較大加權所施加之下一列Jv側,而 不是在兩相加目標列的中心列,即,在相加時之垂直方向 之重心。明確地說,不是於相加時之垂直方向的重心,藉 由將第一列Iv與下一列JV間之空間距離以2 : 1內分所 得之位置變成在相加後的中心,該中心被移位至施加有較 大加權的下一列Jv側1/3列(參考圖13E)。這係與圖12C 相同。然而,由於在此時移位方向交替地不同,相加後的 像素中心也與圖12C者不同。 例如’各個中心位置在:對於第一列及第三列,爲在 雙倍加權相加後,位移至第一列離開第二列1 /3列之位置 ;對於第二列及第四列,爲在雙倍加權相加後,移位至第 四列側離開第三列1 /3列的位置;對於第五列及第七列, 爲在雙倍加權相加後,移位至第五列側離開第六列1 /3列 的位置;及對於第六列及第八列,爲在雙倍加權相加後, -75- 200845735 移位至第八列側離開第七列1 /3列的位置。 數位算術單元29依序取得列相加資料ADD,並當相 同顏色被輸入至水平方向時,對在上述狀態中之影像執行 相加操作。在此時,如同於垂直方向的處理,以2 : 1比 例之雙倍加權相加與以1 : 2之比例之雙倍加權相加係被 交替地執行。 更明確地說,第一相加處理係藉由設定第一行Ih(第 一行及第五行)之加權爲2,如圖下部所表示”x2”,及下一 行Jh(第三行及第七行)之加權爲1加以執行。下一列相加 處理係藉由設定第一行Ih(第二行及第六行)之加權爲1及 下一列Jh(第四行及第八行)之加權爲2,以圖下側之”x2” 表示加以執行。第一行、第四行、第五行及第八行之相加 處理係藉由使加權加倍。 例如,數位算術單元29依序執行相加操作在:在第 一行中之雙倍R分量,在第三行中之R分量及在第一行中 之雙倍Gr分量及在第三行中之Gr分量·,在第二行中之 Gb分量及在第四行之雙倍Gb分量及在第二行中之B分纛 及在第四行中之雙倍B分量;在第五行中之雙倍R分量及 在第七行之R分量及在第五行中之雙倍Gr分量及在第七 行中之Gr分量;在第六行中之Gb分量及在第八行中之雙 倍Gb分量及在第六行中之B分量及在第八行中之雙倍B 分量,..以此類推。 換句話說,當在水平方向中之兩像素之相同顏色分纛 被送至數位算術單元2 9時,在第一相加操作中,數位算 -76- 200845735 術單元29藉由使第一行Ih之分量爲下一行Jv的 而執行相同顏色的相加處理,及在下一相加處理中 算術單元29藉由使第二列JV之分量爲第一列Iv ,而執行相同顏色的相加處理,並重覆這些操作。 在相加操作後之示意圖中,相關於水平方向中 加後之像素中心被移位至施加有較大加權的下一行 ,而不是兩相加目標行的中心行,即,在相加時之 向的重心。明確地說,不是在相加時之水平方向中 ,藉由將第一行Ih與下一行Jh間之空間距離以2 分所得之位置變成在相加後的中心,該中心被移位 有較大加權的下一行Jh側1/3行(參考圖13F)。這 1 2D的情形相同,然而,因爲加權的移位方向被交 ,所以在相加後的像素中心變得與圖1 2D不同。 例如,各個中心位置在:對於第一行及第三行 2 : 1之比例在雙倍加權相加後,位移至第一行離開 1 /3行之位置;對於第二行及第四行,爲以1 : 2之 雙倍加權相加後,移位至第四行側離開第三行1/3 置;對於第五行及第七行,爲以2 : 1比例在雙倍 加後,移位至第五行側離開第六行1 /3行的位置; 第六行及第八行,爲以1 : 2比例在雙倍加權相加 位至第八行側離開第七行1 /3行的位置。 如果示於圖1 3 C中之垂直方向中之相加後的中 合如上時,在相加的中心被藉由內分如下加以取得 一顏色中,以2 : 1內分第一列I v及下一列J v間 兩倍, ,數位 的兩倍 ,在相 Jh側 水平方 之重心 :1內 至施加 係與圖 替變化 ,爲以 第二行 比例在 行的位 加權相 及對於 後,移 心被組 :在每 之空間 -77- 200845735 距離,及以2 : 1內分在第一行Ih及下一行Jh間之空間 距離,如圖13 D的右側所示。在此例子中,圖8 A中之相 同列順序中之像素被讀出,及由於相加處理時之加權的移 位方向係被交替地改變。因此,在相加之像素中心被以較 執行簡單加法之情形,更相等距離排列。結果,可以取得 執行簡單加法爲高之解析度信號(數位信號),簡單加法之 加權値係爲一致。 [順序及1 : 2比例之雙倍加權相加的切換例] 當圖9所示之1 : 2比例之雙倍加權相加被應用及列 或行之採用順序與圖8A所示者不同時,藉由交替地切換 取用順序,實際上,相關於列及行配置之空間關係’ 1 : 2 比例之雙倍加權相加及2 : 1比例之雙倍加權相加被交替 地重複。這完成移位方向看之加權相加。 例如,如圖1 4 A所示,在垂直方向中之相加處理,垂 直選擇信號 Φ VSEL以第三列、第一列、第二列、第四列 、第七列、第五列、第六列及第八列的順序由底部指定列 〇 如圖所示(圖14B),其中係被安排呈予以爲行處理器 26所讀出之順序,當奇數列或偶數列之兩相同顏色被輸入 於垂直方向時,安排在行處理器26中之每一垂直行中之 每一行A/D電路25執行相加操作。在此時,因爲行A/D 電路25被以圖9所示之時序操作,所以在每一相加操作 中,計數器2 5 4執行下一列Jv分頻操作爲第一列I v之處 -78- 200845735 理的兩倍快。相加處理係藉由設定第一列1V(第三列、第 二列、第七列及第六列)之加權爲1及下一列Jv(第一列、 第四列、第五列及第八列)之加權爲2,以圖中之右側之” X 2”表示加以執行。 在垂直掃描電路1 4之事先控制下’有關於列配置中 之空間關係,特別是予以受到相加之列Iv及Jv係被切換 ,以藉由1 : 2比例之雙倍加權相加及2 : 1比例之雙倍加 權相加重複地交替處理。以第一列、第四列、第五列及第 八列之加權的加倍所執行之相加處理看來,處理係與圖 13A至13F圖相同。結果,如圖14C所示,在相加後之示 意圖變成與圖13C所示的相同。 數位算術單元29依序取得列相加資料ADD,並當相 同顏色被輸入至水平方向時,對在上述狀態中之影像執行 相加操作。在此時,類似於水平方向中之處理,數位算術 單元29以第三行、第一行、第二行、第四行、第七行、 第五行、第六行及第八行之順序,以此類推來取得相加資 料,並以1 : 2之比例執行雙倍加權相加。 在每一相加操作中,相加處理係藉由設定第一行ih( 第三行、第二行、第七行及第六行)之加權爲1及下一行 Jh(第一行、第四行、第五行及第八行)之加權爲2,如圖 之下部之”x2”所表示加以執行。 下一列相加處理係藉由設定第一行Ih(第二行及第六 行)之加權爲1及下一列Jh(第四行及第八行)之加權爲2, 以圖下側之”x 2”表示加以執行。第一行、第四行、第五行 79- 200845735 及第八行之相加處理係藉由使加權加倍。 在水平掃描電路1 2之事先控制下,有關於行配置中 之空間關係,特別是予以受到相加之行Ih及Jh係被切換 ,以藉由1 : 2比例之雙倍加權相加及2 : 1比例之雙倍加 權相加重複地交替處理。以第一行、第四行、第五行及第 八行之加權的加倍所執行之相加處理看來,處理係與圖 13A至13F圖相同。結果,如圖14D所示,在相加後之示 意圖變成與圖1 3 D所示的相同。 在此例子中,在每一相加處理時,當示於圖9之比例 1 : 2之雙倍加權相加被針對計數器254之加權控制(具體 看,來對計數時鐘控制信號TH的控制)被執行時,實際上 ,相關於列及行配置中之空間關係,比例1 : 2之雙倍加 權相加及比例2 : 1之雙倍加權相加被交替地藉由交替地 切換採行之列或行之順序加以交替重複。結果,類似於圖 1 3所示,相較於執行簡單相加時,在相加後之像素中心被 安排於更相等之間距。結果,可以較執行簡單相加取得更 高解析度之信號(數位資料),在簡單相加中之加權値被均 勻施加。 可以由上述說明了解,並不是一直可以藉由簡單施加 加權相加以在相加後將像素的位置安排爲等距。爲了在加 權相加後使像素中心更均等間距,應考量如何選擇相加目 標像素並使用什麼値作爲加權値。 再者,當捕捉彩色影像時,影像可以爲分色濾鏡之顏 色排列所影響。換句話說,爲了執行相加不會發色彩混合 -80- 200845735 ,並且使空間距離關係被作成原始分色濾鏡的相同顏色配 置,可以想出在相加目標像素及加權値選擇間之關係有若 干程度的限制。 [力口權値的修改例子] 在上述詳細說明中,描述了以Bayer排列之兩列及兩 行之雙倍加權相加處理。然而,這只是一例子,各種針對 加權値、採用相加目標列及行之空間位置、及相加目標列 及行之數量的變化均有可能。 例如,針對加權値,並不限於兩倍,也可以使用更大 數字,例如4、8,…之2的乘冪。例如,在上述說明中, 顯示計數器254以兩倍速度在A/D轉換時執行分頻操作, 但並不限於此,正反器5 1 0係被控制以更高速度執行計數 操作(分頻操作)。在此時,量化步驟可以更粗地執行。 例如,如果計數執行單元504被架構成如圖4及5所 示,藉由設定計數時鐘控制信號ΤΗ00及TH01爲作動Η ’則在後2位元之計數器254的分頻操作可以增加爲4倍 快。這允許藉由將在列Ιν中之信號分量Vsig_Iv的數位値 Dsigjv加至4倍列 JV之信號分量 Vsig_Jv的數位値 Dsig__Jv,以取得數位資料”Dsig — Iv + 4· Dsig__Iv”。 再者,藉由設定計數時鐘控制信號ΤΗ 02爲作動Η, 則在後單元像素3位元之計數器254的分頻操作可以增加 至8倍快。這允許藉由將8倍在列Jv中之信號分量 Vsigjv的數位値Dsig_jv加至列Iv之信號分量Vsig_Iv -81 - 200845735 的數位値Dsig_Iv,以取得數位資料”Dsig_Iv+8 · Dsig_Iv” Ο 同樣地,如果計數時鐘控制信號TH0T(T = S-1)被設定 爲作動Η,則在S位元後之計數器254的分頻操作可以增 加至2— S倍快,使得一增益可以增加2— S倍大。這允許 藉由將在列Ιν中之信號分量Vsig_Iv的數位値Dsig_Iv加 至2、S倍列Jv之信號分量Vsig_Jv的數位値Dsig_Jv, 以取得數位資料”Dsig_Iv + 2A S · Dsig__Iv”。 當計數器的分頻操作經由幾級被作成高速分頻操作( 更快),例如L1倍( = 2)、L2倍(4)、L3倍( = 8),…以此類 推時,如果較低階位元輸出被依序作成無效及其餘較高階 位元輸出的分頻操作被以較高速執行,以更粗地執行量化 步驟,用以控制較高階位元出的啓始計數時鐘可以被保持 爲與計數時鐘CIN —樣的速度。雖然以計數器操作看來, 用於在加權目標列Jv中之信號分量Vsig_Jv的A/D轉換 的解析度被降低,但依據原始計數時鐘CIN之整個計數器 操作沒有實質差異,因此,並未增加功率消耗。 如上所述,加權値可以施加爲2的乘冪,例如2倍、 4倍、8倍、…以此類推,藉由改變計數時鐘控制信號TH 的設定,及加權値可以被調整’使得在相加後之像素空間 位置係被安排以得較高解析度的影像,即在相加後的像素 位置可以被安排在更均等間距處。 圖1 5爲一圖,顯示爲設定加權値爲任意整數的機制 -82- 200845735 以設定加權値看來,不只是2的乘冪,同時,也可以 使用任意値。在此時,如果參考信號Vslop之斜率被保持 固定程度,則最好將予以供給至計數器254之計數時鐘 CK0改變至較高速時鐘。 再者,當採用不必將計數時鐘CK0的時鐘頻率改變的 機制時,計數時鐘控制信號TH的設定被改變,以將計數 器254之分頻速度改變一位元單元,及一加權値被設定爲 任意整數,參考信號的斜率藉由改變斜率改變指令信號 CHNG的設定加以調整。在此時,在參考信號Vslop的斜 率設定値、計數器254之分頻速度的設定値及予以設定之 加權値G間有兩種關係,如圖1 5所示。 明確地說,假設予以設定之加權値爲G,則可想到之 方法有:第一方法,其中,計數器254之分頻速度被設定 爲2· η倍及參考信號Vslop之斜率被設定爲厂n/G,以 滿足公式,其中,’2~ (n+l)>G>2~ η”,及第二方法’其中 ,計數器254之分頻速度被設定爲η倍及參考信號的 斜率被設定爲厂n/G,以滿足公式”2,n>G>2~ (η-1)。在 任意情形中,積G係藉由將以增加分頻速度所取得之A/D 轉換增益2〜η乘以以改變參考信號Vslop之斜率所取得 之A/D轉換增益G/2— η(斜率的乘係數的倒數)加以取得。 例如,如果加權値被設定爲單元像素3 ’則分頻速度 被設定爲該速度的兩倍’及參考信號Vslop之斜率被設定 爲第一方法中之斜率的2/3倍,在第二方法中’分頻速度 被設定爲4倍,及參考信號Vslop之斜率被設定爲4/3倍 -83- 200845735 該斜率。可以由圖中看出,在第二方法中,予以設定至計 數器254之分頻速度的乘法係數更大,使得參考信號 Vslop之斜率可以大出該差異量,其優點爲A/D轉換週期 可以作得更小,即使解析度被降低。另一方面,在第一方 法中,雖然予以設定至計數器254之分頻速度的乘法係數 係變小及A/D轉換速度變長,但解析度並未降低。 如上所述,除了以改變計數時鐘控制信號TH的設定 及斜率改變指令信號CHNG的設定的2的乘冪外,也有可 能藉由使用任意値來改變加權値。因此,加權値可以被調 整,使得在相加後之像素的空間位置係被安排於更完全相 等間距,以取得更高解析度之影像。如上所述,即使在相 加後之像素位置並不能藉由以2的乘冪之加權値來安排完 全相等間距,有可能藉由以任意値設定加權値,來設定加 權値,使得在相加後之像素位置被安排在完全相等間距。 例如,圖1 6A至1 6F顯示”比例3 : 1之相加+比例1 :3之相加”,其中加權値被設定爲3,及圖1 7A至1 7F顯 示”比例4 : 1之相加+比例1 : 4之相加”,其中加權.値被 設定爲4。2的乘冪的加權値調整之位意設定及除了 2的 乘冪以之任意値的調整增加了相加後之像素空間位置調整 的彈性,因而,有可能找到一比例之加權値,其允許在相 加後之像素空間位置被排列於等距。 [相加影像的解析度改良方法:第二實施例] 圖1 8至2 1顯示方法之第二實施例,用以解決在垂直 -84- 200845735 方向以計數器254之數位相加處理及以數位算術單元29 在水平方向中進行數位相加處理中之解析度劣化的問題。 圖18A至18C顯示單斜積分A/D轉換系統的缺點。 更明確地說,這些圖解釋以比較處理週期對A/D轉換效能 的影響,特別是對轉換處理速度,其中類比像素信號Vx 係與用於數位資料轉換的參考信號V s 1 ο p作比較,並同時 顯示縮短比較處理週期的方法例。 圖19爲時序圖,用以顯示並行於A/D轉換處理之有 關垂直方向的相加處理,以解釋第二實施例。圖2 0爲一 圖,用以顯示當計數時鐘開關5 1 6被操作於第二實施例之 解析度改良方法的作用。圖2 1爲一圖,顯示在參考信號 Vslop之斜率之改變控制與計數器之分頻速度控制間之關 除了第一實施例之相加處理操作外,第二實施例具有 一特徵,在於,即使對一列處理中,當信號位準Ssig被 處理時,在比較處理完成前,在電壓比較器252之比較處 理週期中,參考信號Vslop之斜率及計數器254之分頻速 度係彼此配合改變,以使得在該列中A/D轉換增益保持不 變,即,在該列中之像素的加權値被保持爲固定値。這使 得有可能以高速取得較高解析度之相加影像。 明確地說,斜率改變指令信號CHNG係被供給至參考 信號產生器27,以改變參考信號Vslop之斜率至J倍斜率 、及計數模式控制信號UDC、重置控制信號CLR、資料保 持控制脈衝HLDC、及計數時鐘控制信號TH係被供給至 -85- 200845735 計數器2 5 4之計數執行單元5 04,使得在計數執行單元 5 04中之每一位元輸出之分頻操作被改變爲κ倍速度(較 佳,K倍=J倍)。 在改變參考信號Vslop之斜率爲J倍斜率的同時,正 反器5 1 0係被控制以K倍速度(較佳爲J倍速度)操作計數 操作(分頻操作),但只要誤差(變化)在可允許範圍內,並 不一定要精準地”在同時”或者精準J倍乘法係數。這是與 只要誤差(變化)在一許可範圍內,就允許一誤差被控制在 一設定値內的一般技術相同。 然而,基本上(原理上),在信號分量Vsig的A/D轉 換處理中,乘法係數及改變時序係必然相同,以取得真實 反映信號分量Vsig之數位資料Dsig,而不必校正操作, 甚至在參考信號Vslop係被改變爲在信號位準Ssig及參考 信號Vslop匹配之前也是如此。 在本實施例中,行處理器26(明確地說,行A/D電路 25)對每一重置位準(重置電位)及一信號位準(信號電位)執 行單斜積分A/D轉換處理。同時,重置電位被上數或下數 之模式之一所處理(在前一例中爲下數模式),及信號電位 係爲另一模式所處理(在前一例中爲上數模式),使得在兩 處理間之差値結果的數位資料可以被由第二處理的計數處 理結果所自動取得。 在本實施例中所採用之單斜積分A/D轉換系統中, A/D轉換的解析度,即1LSB的大小係爲改變參考信號 Vslop及週期及參考信號Vslop之斜率時之計數器254之 -86- 200845735 計數速度(即,計數時鐘的頻率)所決定。 例如,假設,爲計數器254所計數一計數的週期爲一 計數循環,則在計數循環之參考信號Vslop之改變量變成 A/D轉換的解析度(寬度1LSB)。當1LSB之寬度很小(窄) 時,A/D轉換的解析度很高,而當1LSB的寬度大(寬)時 ,A/D轉換的解析度低。 因此,例如,以計數速度表示時,速度愈快,則計數 循環愈短。如果參考信號Vs lop之斜率相同,在計數循環 時,參考信號Vslop之變化,即1LSB之寬度變小,使得 A/D轉換的解析度變高。如果參考信號Vslop之斜率相同 ,如果計數速度變快,計數値前進至參考信號Vslop及在 垂直信號線1 9上之信號電壓匹配的一點,則可以取得較 大之數位資料,及A/D轉換的增益變高。這表示計數速度 的改變等效於A/D轉換增的調整及讀出增益的控制。 再者,以參考信號Vslop的斜率表示,當計數速度相 同時,斜率愈大時,在該週期中,改變參考信號Vslop之 量愈小,即當寬度1LSB,A/D轉換的解析度愈高。再者 ,當計數速度相同時,斜率愈大,則匹配參考信號Vslop 與垂直信號線1 9上之信號電壓所花之時間愈多,使得可 以取得較大之數位資料及A/D轉換增益變高。’ 換句話說,當計數速度相同時,參考信號Vslop之斜 率改變以控制1LSB的寛度時,參考信號Vslop及垂直信 號線1 9上之像素電壓Vx的匹配時間被調整。結果,即使 在垂直信號線1 9上之像素信號電壓Vx被保持相同,在匹 -87- 200845735 配時的計數値,即信號電壓的數位資料被調整。這表示參 考信號V s 1 ο p之斜率變化係等效於A / D轉換增益的調整及 讀出增益控制的調整。 在弟一實施例中’ f昔由使用如上,在相加處理時,分 頻速度被設定爲高速(參考信號Vslop取決於加權値加以 改變)及加權相加被執行。 在此時,爲了完成較高速及較高準確的處理,有必要 使得行A/D電路25之速度更快。在行A/D電路25中, 爲了完成更局速度’如果參考信號Vslop的斜率未調整, 則計數器2 5 4需要操作更快。爲了增加計數器的速度,計 數時鐘速度要增加。然而,因爲高速時必須經過行A/D電 路25及在每一行中之行A/D電路25以高速執行計數操作 ,所以可以發生功率消耗增加的問題。 爲了完成高速A/D轉換處理,同時解決這些問題,所 以想出在沒有增加計數時鐘的速度下,藉由調整參考信號 Vslop側,使得A/D轉換的階度可變,以壓縮計數時間及 完成高速處理。 例如,如圖1 8 A所示,已知除了對應於光粒的信號分 量(信號反應)外,在像素信號產生器5中之背景雜訊(感應 器雜訊基準)及光學散粒雜訊(光子散粒雜訊)係被加至有關 於來自單元像素3之光強度輸出之光信號輸出(感應器輸 出)。 當感應器輸出被A/D轉換時,如果低於感應器雜訊基 準的位準下之感應器輸出被A/D轉換,則因爲感應器輸出 -88- 200845735 之信號被埋在感應器雜訊基準下’所以’轉換變得無意義 。因此,至少超出感應器雜訊位準之感應器輸出才是對於 A/D轉換的有效範圍。 光子散粒雜訊係相對於對應於1 /2功率光信號之光電 子變化。因此,當一信號量很小時,有較少之光子散粒雜 訊,使得光信號可以準確地以高解析度之A/D轉換,進行 A/D轉換。然而,當信號量大時’光子散粒雜訊也相對地 大,使得即使光信號被以高解析度進行A/D轉換時,光信 號由於光子散粒雜訊的量而不見得一直準確被A/D轉換。 在光信號量大及包含有大量光子散粒雜訊的區域中, 只用將光子散粒雜訊移除的信號分量的解析度即可。爲此 ,如果A/D轉換的解析度降低(換句話說,如果量化步驟 變得更粗)在該範圍內,則有關A/D轉換結果的準確度就 沒有問題。以上述方法,可以想出,當信號量變大時,藉 由調整A/D轉換的準確度,換句話說,藉由採用調整解析 度或量化步驟的方法,A/D轉換的速度可以依據信號量變 得更快。 例如,如圖18B所示,當感應器輸出(對應於信號分 量之光電子量:單位爲”a.u.”)係在位準0至位準1之間, 則量化步階被設定爲1LSB,及感應器輸出係在位準1至 位準2之間,及量化步階被設定爲2LSB,同樣地及類似 地依據向上之位準,量化步階更粗,即解析度更低。 這表示如果感應器輸出位準向上,則構成在計數器 2 5 4中之計數執行單元5 0 4的較低階位元正反器5 1 0的輸 -89- 200845735 出被以感應器輸出位準的順序忽略,只有較高階位元正反 器5 1 0可以被操作。 另一方面,爲了依據感應器輸出位準逐漸地改變解析 度,可以由以上說明了解,參考信號Vslop之斜率被逐漸 改變至陡斜率,及每單位時間的電壓變化,即每一計數的 電壓差(mV/位數)被改變如圖18C所示。 然而,在上述情形中,因爲A/D轉換增益變小,所以 有關於感應器輸出之A/D轉換結果的線性被損害到。例如 ,每一位數在重置位準Srst之A/D轉換週期Trst及在信 號位準Ssig之A/D轉換週期Tsig中之變化點前的電壓値( 轉換係數)爲α [V/位數],在變化點後之每一位數的電壓値 (轉換係數)變成a /J。因此,如果A/D轉換結果的計數値 D被轉換爲電壓値·如果在該變化點的計數値爲”m”,則其 變成” α · m + (D-m) · a /J”,這使得感應器輸出的大小變 得不準確。 爲了避免如此,可以想出藉由使計數時鐘更快而將增 益校正相加,以偏移開參考信號Vslop之斜率的變化程度 ,即在計數値與電壓値間之關係△ V/ △ t係被保持爲定値 。在此時,簡單地使計數時鐘更快的技術並不能實際地採 用,因爲可能發生前述問題。 因此,如果一機制被採用,其中內部計數時鐘實際上 並未改變,及A/D轉換結果的計數値由斜率變化點,依據 參考信號Vslop之斜率被自動地校正例如至” α · m + (D_m) • α/J· J”,計數値變成” α · m + (D-m)· a = a · D,,,使 -90- 200845735 得感應器輸出之大小可以準確地取得。在第二實施例中, 作爲自動校正的機制中,採用了一種改變計數器2 5 4之分 頻速度的機制。其被詳細說明如下,其中,相加的順序係 被設定爲與圖1 3所示之處理相同。 在重置位準Srst之A/D轉換週期Trst中,單元像素 3的重置位準Srst_Iv及Srst_:iv被讀出,及計數器254下 數重置位準Srst_Iv及Srst_Jv。在此時,所有計數時鐘控 制信號ΤΗ00至TH1 1被設定爲不作動L。 再者,在信號位準Ssig的A/D轉換週期Tsig中,參 考信號Vslop被改變爲與在A/D轉換週期開始時之斜率相 同,及計數器254由每一數位値Drst_Iv及Drst_Jv開始 計數。在此時,所有資料保持控制脈衝 HLDC00至 HLDC1 1被設定至不作動L,及所有計數時鐘控制信號 ΤΗ00至TH11被設定爲不作動L。 在一點R(t21_Iv)處,參考信號Vslop之斜率係被改 變至^倍斜率(例如兩倍斜率),及在點R前之正反器5 1 0 的分頻操作係被作成K倍速度(較佳地,K = J)。 例如,在第一相加目標列Iv的處理時,參考信號 Vslop之斜率被改變爲在點R_Iv(t21_Iv)之斜率的兩倍, 同時,資料保持控制脈衝HLDC00至資料保持單元5 12_00 係被切換至作動Η及計數時鐘控制信號TH 0 0至計數時鐘 開關516_00被切換至作動Η。 在此時,在垂直信號線1 9上之某一行中之列I ν中之 像素fe號電壓V X _ I ν係被數位轉換至計數値m 0 __ I ν。爲計 -91 - 200845735 數器254所實際上數之數;Μ係由”t21__Iv-t20 Iv”與計數時 鐘循環間之週期所決定,因爲上數係由負値Drst_Iv開始 〇 再者,在此時’因爲資料保持控制脈衝H L D C 0 0被設 定至作動Η ’所以’記錄在最低效位元正反器5 1 0中之資 料被保持。貝際上’在點R — Iv(t21_Iv)後,最低效位元輸 出被作成無效。因爲在點R_Jv(t21_Iv)後,最低效位元輸 出被作成無效,所以,在點R_lv(t2 1jv)後的週期變成低 解析週期Tssig_LlIv。 再者,同時,如果計數時鐘控制信號ΤΗ00被切換至 作動Η,及最低效位元(在〇位元)正反器510_00的輸入時 鐘被傳送至第二級(在1位元)正反器510_〇1之時鐘端。藉 由傳送最低效位元的時鐘循環至下一位元,則剩餘較高位 元輸出之分頻操作被以兩倍速度執行,除了該最低效位元 以外,該計數器2 5 4開始以兩倍速上數,同時,保持量化 步階較以前兩倍粗。 例如,圖20爲當計數時鐘控制信號ΤΗ00及參考信號 Vsl〇p之斜率改變時,每一正反器 510的輸出圖。在點 R_Iv(t21_Iv)處計數時鐘控制信號ΤΗ00被切換至作動Η 使得供給至最低效正反器510_00之計數時鐘CIN被傳送 至第二級正反器5 1 0_0 1,使得較低階正反器5 1 0在切換後 以高速操作。然而,因爲最低效位元輸出變成無效,所以 ,量化步階變成較以前更粗。 例如,如果第一級正反器510_00之計數輸出D00的 -92- 200845735 循環在計數時鐘控制信號ΤΗ00切換前爲100MHz,及第 二級正反器510_01之計數輸出D01之循環爲50MHz。不 同於此,當計數時鐘控制信號ΤΗ00被切換至Η位準時, 及第二級正反器510_01的計數輸出D01之循環爲100Hz ,使得在較高階位元正反器5 1 0之分頻操作被以兩倍速度 操作。 再者,有關於像素信號電壓 Vx_Iv,在點 R_Iv(tl2_IV)後之低解析度週期Tsig_LlIv,當信號位準 Ssig__Iv及參考信號Vslop匹配時(t22_Iv),計數器254停 止,同時保持在匹配時之計數値zO_Iv。 在此時,參考信號 Vslop 之斜率變成在點 R_Iv(t21_Iv)前速度兩倍,及在計數器254中之較高階位 元正反器5 1 0也以兩倍速度執行分頻操作。因此,計數値 與電壓値間之關係變成2 △ V/2 △ t= △ V/ △ t,及計數値及 電壓値△ V/ △ t間之關係穩定,這造成保持A/D轉換結果 相對於感應器輸出呈線性。最終計數値zO__Iv本身自動變 成數位資料Dsig,其真實反映信號分量Vsig,因此,不 要外部電路作校正。 在列Iv之 A/D轉換週期完成後,不必重置計數器 2 54,列Jv中之單元像素3的讀出操作及A/D轉換處理被 依序執行,及類似於列Iv之處理的讀出操作被重複。 在此時,參考信號Vslop斜率變成與列Iv的處理相 同。資料保持控制脈衝HLDC_00及計數時鐘控制信號 ΤΗ — 00被保持爲作動Η。以此方式,參考信號Vsl〇p之斜 -93- 200845735 率爲與列Iv之處理者相同,及在計數器254中之較高階 正反器5 1 0執行兩倍速之分頻操作,使得在計數値與電壓 値間之關係變成2 △ V/ △ t。因此,在列JV之處理開始處 ,像素信號電壓Vx_Jv被以相較於列Iv之處理的兩倍增 益處理。 在改變參考信號Vslop之斜率爲在點R(t21_Jv)斜率 兩倍的同時,至資料保持單元5 1 2 __ 0 1之資料保持控制脈 衝HLDC01被切換至作動Η及至計數時鐘開關516 之 計數時鐘控制信號ΤΗ0 1被切換至作動Η。 在此時,在列J中之像素信號電壓Vx_Jv被數位轉換 爲計數値。爲計數器254所實際上數之數量係爲 ”t21—Jv-t20jv”及計數時鐘的循環間之週期所決定,及在 點R_Jv(t21_Jv)之計數値mO_Jv係被決定,因爲上數係由 負値Drst_Jv開始。 再者,在此時,因爲資料保持控制脈衝HLDC 00及 HLDC01爲作動 Η,最低效位元(在 〇位元)之正反器 510_00及第二級(在1位元)正反器510_01之資料被保持 。實際上,在點R —Jv(tl2_h)後,最低效位元(〇位元)輸 出及第二級(1位元)輸出被作成無效。因爲〇位元及i位 元之每一輸出在點 R_Jv(t21_Jv)後被作成無效,在點 以_"〇21_“)後之週期變成更低解析度週期丁以§_1^11乂。 再者,同時,如果計數時鐘控制信號ΤΗ0 1變成作動 Η,1位元正反器510_01之輸入時鐘被傳送至第三級(在2 位元)正反器510_02之時鐘端。藉由傳送時鐘循環至下一 -94- 200845735 位元,除了該0位元及1位元之輸出係被執行爲前一執行 兩倍速操作速度的兩倍外,即四倍,其他較高階位元之分 頻操作會輸出,使得計數器254開始四倍速上數,同時使 量化步階更粗。 再者,有關於像素信號電壓 Vx_Jv,在點 R_Jv(t21—Jv)後之低解析度週期Tsig_LlJv,當信號位準 Ssig_Jv及參考信號Vslop匹配時(t22_Jv),計數器254停 止,同時,保持在匹配時的計數値zO_Jv。 在此時,參考信號 Vslop 之斜率變成在點 R_Jv(t21_Jv)前速度兩倍,及在計數器254中之較高階位 元正反器5 1 0也以四倍速度執行分頻操作。因此,計數値 與電壓値間之關係變成2 △ V/2 △ t= △ V/Δ t,及計數値及 電壓値△ V/ △ t間之關係穩定,這保持A/D轉換結果相對 於感應器輸出呈線性。最終計數値z 0 _ J v本身自動變成數 位資料Dsig,其真實反映信號分量Vsig,因此,不要外 部電路作校正。 在列Jv之A/D轉換週期完成後,不必重置計數器 2 54 ’列JV中之單元像素3的讀出操作及A/D轉換處理被 依序執行,及類似於列J v之處理的讀出操作被重複。 在此時,參考信號Vslop斜率變成兩倍大,並與列Iv 的點R__Iv(t21JV)後的類似,另一方面,在計數器254中 之較高階正反器5 1 0執行四倍速之分頻操作。因此,使得 在計數値與電壓値間之關係變成4 △ V/ △ t = 2 △ V/ △ t,及 在計數値與電壓値間之關係係如前般地穩定,使得像素信 -95- 200845735 號電壓Vx_Jv被以相較於列Iv之處理的兩倍增益處理。 結果,例如,如果在例如,每一位數在重置位準Srst 之A/D轉換週期Trst及在信號位準Ssig之A/D轉換週期 Tsig中之變化點R前的電壓値(轉換係數)爲α [V/位數], 則被保持在計數器254中之最終計數値爲” Δν“§_Ιν + 2α xVsig_Jv”,及加權相加被完成。 例如,假設在圖1 9之像素信號電壓Vx之線圖上之括 號內之數位値如所示,在列Iv及列Jv中之信號分量 Vsig_Iv及 Vsigjv爲 60,及其重置位準 Srst_Iv及 Srstjv爲10,則執行雙位加權相加。予以保持在每一時 序之計數値變成類似於圖9所示者。 更明確地說,在列Iv中之信號位準Ssig_Iv(信號分量 Vsig_Iv)之A/D轉換中,藉由執行由重置位準Srst_Iv之 A/D轉換所取得之計數値”_Drst_Iv”( = -10)作爲開始點開始 上數,予以保持在計數器254中之計數値在處理後變成Μ- ΐ 0+70=60=Dsig—Iv,, 。 隨後在列Jv之A/D轉換中,重置位準Srst_Jv之下數 係以計數値”6〇 = Dsig_Iv”作爲開始値加以執行,計數値係 由在列Iv中之A/D轉換所取得,被保持在計數器254中 之計數値變成”5 〇-2 X WMO”。再者,用於信號位準 Ssigjv之上數係由此計數値40作爲開始點加以執行,及 予以被保持於計數器254中之計數値在處理後變成”4〇 + 2χ 7 0= 1 8 0,,。此計數値表示”Dsig —Ιν + 2 · Dsigjv”,這係藉由 將列Iv中之信號分量Vsig_lv之數位値Dsig__Iv加上在列 -96- 200845735At this time, the slope of the reference signal Vslop is the same as the processing in the first column Iv (tl_Iv to t26_Iv) and the processing of the next column Jv to t26_Jv). Therefore, in the first column Iv processing, the relationship between the count 値 and the voltage 为 is ΔV/Δt, and the total gain of the A/D conversion process becomes, on the other hand, the voltage at the processing of the next column Jv値The total gain of 2 ΔV/Δ t and A/D -65- 200845735 conversion processing becomes 2. More specifically, in the present embodiment, when the next column 1 v is processed (tl_jv to t26_JV), the frequency dividing speed of the counter becomes k times the speed (twice in the previous example) ' without having to change the first column 1v The processed reference signal Vslop slope. Therefore, when compared with the A/D conversion processing of the signal component Vsigjv of the first column Iv, a double gain is applied to the A/D conversion processing of the signal component Vsig_Jv of the next column Jv. Therefore, assume that the voltage 値 (conversion coefficient) of each digit in the A/D conversion of the first column 1v is ^[v/bit] and the degree of increase in the speed in the counter 254 (corresponding to the counter 254) The gain is Lv, and the voltage 値 (conversion coefficient) of each digit in the A/D conversion of the next column Jv becomes Lvx α. In the previous example, Lv = 2 and the voltage 値 is 2α. Therefore, after the completion of the A/D conversion of the column Jv, that is, after the final count 加权 of the weighted digit addition processing is completed, the digit 値 held in the counter 2 5 4 becomes "a xVsig - Iv + 2a xVsig_Jv". For example, assuming that the digits in parentheses on the line graph of the pixel signal V x of FIG. 9 are, the signal components V sig _ I v and Vsig_Jv in the column I v and the column J v are 60, and the reset level Srst_Iv And Srst__Iv is 10. At this time, in the A/D conversion of the signal level Ssig_Iv (signal component Vsig_Iv) in the column Iv, by performing the 値"〇"11〃" obtained by the eight/〇 conversion of the heavy level Srst_Iv ( = -10) As the starting point up, after processing, the count 値 "-l 〇 + 70 = 60 = Dsig_Iv" is held in the counter 254. Subsequently, in the A/D conversion of the column Jv, by the column Iv The a/d switch-66-200845735 The obtained count 値 "60 = Dsig_Iv" is used as the starting point, and the number of reset levels Srst - Jv is first counted, and remains in the counter 254. "Dsig_Iv-2· Drst_Jv = 50-2xl0 = 40". Further, the upper level is performed on the signal level Ssig_Jv, starting from the count 値40 using the start point, and after the processing, the count stored in the counter 254 is 値It becomes "40 + 2x7 0 = 1 8 0". The count 値 means 値 "Dsig - Iv + 2 · Dsig - Jv", which is obtained by double the number 値Dsig_Jv in the column Jv and the number in the column Iv 値Dsig_Iv is added and obtained. In the first example not shown in Fig. 9, the addition of 2"Dsig_Iv + Lv·Dsig_IV" is borrowed. The frequency division operation of the speed of processing Lv (= 2) by the following column Jv is obtained. However, as in the second example of the pixel array unit 10, when the first column Iv is processed, if the counter is divided The operation is performed by multiplying Lv (= 2) by twice the processing of the next column Jv, and "Lv • Dsig_Iv + DSig_Iv" can be obtained as the addition result. In the previous example, only the higher order of the counter The frequency division operation on the bit side is changed to L times, and the speed and data on the lower order bit side are regarded as invalid to keep the frequency of the start count clock CIN at the same speed, and to avoid increasing the power consumption in the counter. This is not necessary. If the increase in power consumption in the counter is acceptable, the switching operation can be performed differently by the counting clock switch 5, and the starting counting clock CIN itself can also be used as the clock converter 2 The high-speed clock generated by the multiplication function of 3 is changed to a high frequency so that the counting execution unit 504 can perform the frequency dividing operation at a high speed. In this mode, since all the bit data can be used as The data is valid, so the A/D conversion accuracy is not lowered and the addition processing in the vertical direction of -67-200845735 can be implemented in the row A/D circuit 25. Further, in order to control the flip-flop 510 to execute at high speed Counting operation (frequency division operation), the circuit is structured to control the frequency division of the remaining portion of the higher order bit output when the weighting relationship of the bit of the flip flop is unchanged and the lower order bit output is invalid. The operation is performed at high speed. However, this is only an example, and any architecture is possible as long as it can increase the speed of the frequency division operation of the flip-flop 5 10 , and various modifications are possible. For example, a switching mechanism may be provided for sequentially shifting the one-element output to the low-order side of the flip-flop 5 10 , while omitting the change of the flip-flop 5 10 that is supplied to each stage. A count clock switch 516 that counts the supply mode of the clock. At this time, the data output from the flip-flop 510 of the next stage can be regarded as invalid. This is also like the A/D conversion data, which becomes invalid for lower order bit data. However, at this time, there is a need for a circuit for loading the count of each bit to the previous stage side at the time of switching. Therefore, a circuit configuration will be more complicated than the previous example in which the count clock switch 5 16 is used to switch the count clock. However, at the time, since, for example, the supply of the count clock of the flip-flop 5 10 in the next stage is stopped after the switching operation, the counting operation can be stopped, so that the advantage of consuming lower power can be completed. Furthermore, although the application example illustrates the use of a non-synchronous counter as the counter 2 54, the same idea can be applied to the use of a synchronous counter. For example, if a sync counter is used, each flip-flop 510 is operated by using a common count clock, and each flip-flop 5 10 requires a gate circuit that allows each flip-flop 5 1 0 to It is inverted when 较低 of the lower order bits is 丨 (in the upper number) or when 値 of all lower order bits is 0 (in the lower number). -68- 200845735 In this configuration, in order to increase the speed of the frequency division operation of the flip-flop 5 10 , a switching circuit can be provided to cause the gate circuit to be output on the lower order bit side. However, this circuit configuration is more complicated than the use of the count clock switch 5 1 6 to switch the count clock with a non-synchronous counter. Alternatively, as described in the modification using the asynchronous counter, it is also possible to configure the circuit to be provided to load the count of each bit to the lower order side at the time of switching, and the switching mechanism is provided for Move one bit output to the lower order side. [Double Weighted Addition and Final Addition Image in Horizontal Direction] Figs. 12 to 14 show pixel configurations at the time of the addition operation in the horizontal direction and the vertical direction in the resolution improvement method of the first embodiment. Similar to FIGS. 8A to 8D, as an addition process for two columns and two rows, it is shown that when there are R, G, B (G is represented as Gr in column R, and Gb is represented in column ,, The Bayer configuration filter of the color filters that are distinguished from each other is used as a dichroic filter. Figures 12A through 12F show the pixels in the same column and row order as shown in Figure 8A, and the double-weighted addition system shown in Figure 9 is applied to these pixels. 13A to 13F show the same column and row order shown in Fig. 8A, and the combination of the double weighted addition shown in Fig. 9 and the double weighted addition shown in the pixel array unit 10 is applied to these pixels. . Fig. 1 4A to 1 4F show that the order of taking pixels is different from the order in Fig. 8A and the double weight addition addition shown in Fig. 9 is applied to these pixels. Regarding the double-weighted addition processing in the horizontal direction, in the vertical side -69-200845735, the pixel system to which the Lv-weighted weight is added is transmitted to the digital arithmetic unit 2 9, and the 'digital arithmetic unit 2 9 performs Addition processing in the horizontal direction. The addition processing is performed with the processing shown in Figs. 8A to 8D. In the present embodiment, Lh-fold weighted addition is performed similarly to the L v-fold (= 2) weighted addition processing. Specifically, the addition data ADD_Jh of the next line Jh is obtained by adding the Lh multiple weight to the addition data ADD_Ih of the first line Ih. Typically, it is set to Lh = Lv. According to the former example, for example, it is set to double weighting. [Double Weighted Addition Example of Ratios 1 to 2] When the pixel is subjected to the same column and row order as shown in FIG. 8A and the double weighted addition shown in FIG. 9 is applied to the pixels, first, As shown in Fig. 1 2 A (same as Fig. 8A), the vertical selection signal φ VSEL is in the first column, the third column, the second column, the fourth column, the fifth column, the seventh column, the sixth column, and the eighth column. The order of the columns is specified by the bottom of the number of columns. As shown in the figure (Fig. 12B), in which the pixels are arranged in the order in which they are read by the line processor 26, when two columns having the same color are input to the odd or even columns in the vertical direction, the line processor Each row A/D circuit 25 in each of the vertical rows 26 performs an addition process. At this time, it can be understood from the description of FIG. 9 that the frequency dividing operation for the counter of the next column Jv is twice as fast as the processing for the first column Iv, and the addition processing is set first. The weights of the columns Iv (first column, second column, fifth column, and sixth column) are 1, and weighting for the next column Jv (third column, fourth column, seventh column, and eighth column) 2, as shown on the right side of the figure, x -70- 200845735 2" indicates execution. For example, 'addition processing is executed sequentially: double R component in the first column in the third column and in the first column The Gb component in the second column and the B component in the double Gb in the fourth column and the double b component in the fourth column; the component and the double R component in the seventh column and in the fifth column Double Gr component in the seventh column; double Gb component in the 28th column in the sixth column and double B component in B in the sixth column, ', and so on. In other words The same color component of the two pixels is input to the row, and the row A/D circuit 25 performs the addition operation of the same color component by making the division of the next column JV twice. As shown in Fig. 1 2, the pixel center system is shifted to a larger weight, and is not in the center column of the two added target columns, that is, at the center of gravity of the phase. Specifically, it is not vertical when added. The position obtained by the distance between the first column Iv and the next column JV is changed to the center after the addition, and the center is heavily weighted by the next column Jv side 1/3 歹!J (refer to FIG. 12E), for example, each center Position: After the double-weighted addition of the first column, the displacement to the third column leaves the second: ; For the second and fourth columns, the third column is separated from the third column by the third column and the fourth column Position; for the first, after double-weighted addition, shift to the R component of the seventh column side, the :Gr component; in the first component and in the second column in the fifth column, R 丨The Gr component and the 1 Gb component are in the first component and in the eighth column. When in the vertical A/D circuit 25, I is the first column Iv. On the added column Jv side, and the time-added The center of gravity in the vertical direction, by: 2: 1 The internal division is shifted to the third and seventh columns, and is added to the fifth and seventh columns after the column 1/3 column is added, and the sixth column is 1/3 column - 71 - 200845735; and for the sixth and eighth columns, after the double-weighted addition, shift to the position of the eighth column side leaving the seventh column 1/3 column. The digital arithmetic unit 29 sequentially acquires the column addition data ADD, and performs an addition operation on the image in the above state when the same color is input to the horizontal direction. For example, the digital arithmetic unit 29 sequentially performs the addition operation on the R component in the first row, the double R component in the third row, and the Gr component in the first row and the double in the third row. a multiple of the Gr component; the Gb component in the second row and the double Gb component in the fourth row and the B component in the second row and the doubled B component in the fourth row; the R component in the fifth row And the double R component in the seventh row and the Gr component in the fifth row and the double Gi: component in the seventh row; the Gb component in the sixth row and the double Gb component in the eighth row And the B component in the sixth row and the double B component in the eighth row, and so on. In other words, when the addition data of the same color component of two lines in the horizontal direction is sent to the digital arithmetic unit 29, the digital arithmetic unit 29 makes the component of the next line J v into the first line I v by two Times, and the addition processing of the same color is performed. In the schematic diagram after the addition operation, the center of the pixel after the addition is shifted to the side of the next line Jh to which the larger weight is applied, instead of the center line of the two addition target lines, that is, the level at the time of addition. The center of gravity of the direction. Specifically, it is not the center of gravity in the horizontal direction at the time of addition, by changing the position obtained by dividing the spatial distance between the first line Ih and the next line Jh by 2:1 into the center after the addition, the center It is shifted to the next line Jv side 1/3 line to which a larger weight is applied (refer to FIG. 12F). -72- 200845735 For example, each center position is: for the first row and the third row 'after the double weighted addition, the displacement to the third row leaves the second row 1/3 row; for the second row and The fourth line, after the double weighted addition, shifts to the position where the fourth line side leaves the third line 1/3 line; for the fifth line and the seventh line', after the double weighted addition, shift To the seventh line side, leave the position of the 1/3 line of the sixth line; and for the sixth line and the eighth line, after the double weighted addition, 'shift to the eighth line side and leave the seventh line 1/3 line s position. If the centers shown in Fig. 1 2 C are combined in the vertical direction after the addition, the spatial distance between the first column Iv and the next column Jv is divided by 2:1 at the center after the addition. And the spatial distance between the first row Ih and the next row Jh is divided by a ratio of 2:1, as shown in Fig. 1 2D. At this time, it is possible to compare the original positions of the pixels on the left side of Fig. 12D, although it is different from the state shown on the right side of Fig. 8D, the spatial positions of each color are not arranged equidistantly. [Combined double-weighted addition example in the ratio of 1:2 and 2:1] When the pixels in the same column are used and the row order and the double-weighted addition shown in Fig. 8A are combined by the operation of Fig. 9 When applied to the pixel with the operation of Fig. 10, the double-weighted addition of the ratio 1: 2 (the mode of Fig. 9) and the double weighted addition of the ratio of 2: 1 (the mode of Fig. 1) Repeated alternately. This completes the weighted addition based on the shift direction. For example, as shown in Fig. 13A (same as Fig. 12A), the vertical selection signal φ VSEL is in the first column, the third column, the second column, the fourth column, the fifth column, and the seventh column of -73-200845735 The order of the sixth and eighth columns is specified by the bottom column. As shown in the figure (Fig. 13B), when the same color column of the odd column or the even column is input to the vertical direction, the pixel system is rearranged into the order in which the row processor 26 reads out. The row A/D circuit 25 in each of the vertical rows of the row processor 26 performs an addition operation. At this time, the double-weighted addition by the ratio of 1:2 shown in Fig. 9 is performed by the first addition processing and the ratio of 2:1 and double-weighted addition shown in Fig. 1 It is executed for the next addition process. In this way, the 'g decimator 2 5 4 performs a frequency division operation on the first column Iv twice as fast as the frequency division operation of the next column J v faster than the first addition processing, and the addition processing is performed by A column Iv (first column and fifth column) is weighted to 2 to be "x2" shown on the right side of the figure, and weighted to one in the next column JV (third column and seventh column). In the next addition processing, the counter 2 5 4 performs the frequency division operation of the next column Jv twice as fast as the processing of the first column Iv, and the addition processing is performed by the first column I v (the second column and the The weighting of the six columns is set to 1, and the weight of the next column Jv (fourth and eighth columns) is 2, as indicated by the "x2" on the right side of the figure. The addition processing of the first column, the fourth column, the fifth column, and the eighth column is performed by doubling the weighting. For example, the addition process is performed sequentially on the double R component in the first column, the R component in the third column, and the double Gr component in the first column and the Gr component in the third column. ; the Gb component in the second column and the double Gb component in the fourth column and the B component in the second column and the double B component in the fourth column; the double R component in the fifth column And the R component in the seventh column and the double Gr component in the fifth column and the Gr component in the seventh column -74-200845735; the Gb component in the sixth column and the double in the eighth column The Gb component and the B component in the sixth column and the double B component in the eighth column, and so on. In other words, when the same color component of two pixels in the vertical direction is input to the row A/D circuit 25, the row A/D circuit 25 makes the component of the first column Iv by the first addition operation. The addition operation of the same color component is performed twice for the next column Jv, and the same color component is performed by making the next column Jv component twice the component of the first column Iv in the next addition operation Add operations and repeat these operations. The schematic diagram after the addition operation is shown in Fig. 13C. The pixel center after the addition is shifted to the next column Jv side applied by the larger weight, instead of the center column of the two added target columns, i.e., the center of gravity in the vertical direction at the time of addition. Specifically, instead of the center of gravity in the vertical direction at the time of addition, the position obtained by dividing the spatial distance between the first column Iv and the next column JV by 2:1 becomes the center after the addition, the center is Shift to the next column Jv side 1/3 column to which a larger weight is applied (refer to FIG. 13E). This is the same as Figure 12C. However, since the shift directions are alternately different at this time, the center of the added pixels is also different from that of Fig. 12C. For example, 'each center position is: for the first column and the third column, after the double weighted addition, the displacement to the first column leaves the 1/3 column of the second column; for the second column and the fourth column, After the double-weighted addition, shift to the position of the third column side leaving the third column 1/3 column; for the fifth column and the seventh column, after the double-weighted addition, shift to the fifth The column side leaves the position of the 1/3 column of the sixth column; and for the sixth column and the eighth column, after the double weighted addition, -75-200845735 shifts to the eighth column side and leaves the seventh column 1/3 The position of the column. The digital arithmetic unit 29 sequentially acquires the column addition data ADD, and performs an addition operation on the image in the above state when the same color is input to the horizontal direction. At this time, as in the processing in the vertical direction, the double-weighted addition in a ratio of 2:1 and the double-weighted addition in a ratio of 1:2 are alternately performed. More specifically, the first addition processing is performed by setting the weight of the first row Ih (the first row and the fifth row) to 2, as shown in the lower part of the figure "x2", and the next row Jh (the third row and the The weight of the seven lines) is 1 and executed. The next column of addition processing is set to the lower side of the figure by setting the weight of the first row Ih (the second row and the sixth row) to 1 and the next column Jh (the fourth row and the eighth row) to be 2 X2” means to be executed. The addition processing of the first line, the fourth line, the fifth line, and the eighth line is performed by doubling the weight. For example, the digital arithmetic unit 29 sequentially performs the addition operation in the double R component in the first row, the R component in the third row, and the double Gr component in the first row and in the third row. The Gr component, the Gb component in the second row and the double Gb component in the fourth row and the B branch in the second row and the double B component in the fourth row; in the fifth row Double R component and the R component in the seventh row and the double Gr component in the fifth row and the Gr component in the seventh row; the Gb component in the sixth row and the double Gb in the eighth row The component and the B component in the sixth row and the double B component in the eighth row. . And so on. In other words, when the same color split of two pixels in the horizontal direction is sent to the digital arithmetic unit 29, in the first addition operation, the digit counts -76-200845735 by the first unit The component of Ih is the addition processing of the same color for the next line Jv, and the arithmetic unit 29 performs the addition processing of the same color by making the component of the second column JV the first column Iv in the next addition processing. And repeat these operations. In the schematic diagram after the addition operation, the pixel center associated with the addition in the horizontal direction is shifted to the next row to which the larger weight is applied, instead of the center row of the two addition target rows, that is, at the time of addition The center of gravity. Specifically, not in the horizontal direction at the time of addition, the position obtained by dividing the spatial distance between the first line Ih and the next line Jh by 2 points becomes the center after the addition, and the center is shifted. The next weighted Jh side 1/3 line of the large weight (refer to Fig. 13F). The case of this 1 2D is the same, however, since the weighted shift direction is intersected, the pixel center after the addition becomes different from Fig. 12D. For example, each center position is: for the first row and the third row, the ratio of 2:1 is doubled and weighted, and the displacement is shifted to the position where the first row leaves 1/3 row; for the second row and the fourth row, In order to add by double the weight of 1: 2, shift to the third row side and leave the third row 1/3; for the fifth row and the seventh row, after double addition, shift by 2:1 ratio The position from the fifth line side to the sixth line 1 / 3 line; the sixth line and the eighth line, in the ratio of 1: 2 in the double weighted addition bit to the eighth line side leaves the seventh line 1 / 3 line s position. If the sum of the sums in the vertical direction shown in Fig. 13 C is as above, the center of the addition is obtained by subdividing as follows, and the first column I v is divided by 2:1. And twice in the next column J v, twice the number of digits, the center of gravity of the horizontal side of the phase Jh: 1 to the change of the applied system and the figure, the weight of the line in the second line is proportional to the The shifting heart is grouped: the distance between each space -77-200845735, and the distance between the first row Ih and the next row Jh within 2:1, as shown on the right side of Figure 13D. In this example, the pixels in the same column order in Fig. 8A are read out, and the weighted shift directions due to the addition processing are alternately changed. Therefore, the center of the added pixels is arranged at a more equal distance in the case where the simple addition is performed. As a result, it is possible to obtain a resolution signal (digital signal) in which simple addition is performed, and the weighting of the simple addition is uniform. [Example of switching between sequential and double-weighted addition of 1:2 ratio] When the double-weighted addition of the 1: 2 ratio shown in Fig. 9 is applied and the order of use of the column or row is different from that shown in Fig. 8A By alternately switching the order of access, in practice, the spatially related relationship between the column and row configurations '1: 2 ratio double-weighted addition and the 2:1 ratio double-weighted addition are alternately repeated. This completes the weighted addition seen in the shift direction. For example, as shown in FIG. 14A, in the addition processing in the vertical direction, the vertical selection signal Φ VSEL is in the third column, the first column, the second column, the fourth column, the seventh column, the fifth column, and the The order of the six columns and the eighth column is specified by the bottom column (Fig. 14B), which is arranged in the order in which it is read by the line processor 26, when the same color of the odd or even columns is When input is in the vertical direction, each row A/D circuit 25 arranged in each vertical line in the line processor 26 performs an addition operation. At this time, since the row A/D circuit 25 is operated at the timing shown in FIG. 9, in each addition operation, the counter 254 performs the next column Jv frequency division operation as the first column Iv - 78- 200845735 It is twice as fast. The addition processing is performed by setting the weight of the first column 1V (the third column, the second column, the seventh column, and the sixth column) to 1 and the next column Jv (the first column, the fourth column, the fifth column, and the The weight of the eight columns is 2, which is executed by the "X 2" on the right side of the figure. Under the prior control of the vertical scanning circuit 14, there is a spatial relationship in the column arrangement, in particular, the added columns Iv and Jv are switched to double the weighted addition by the 1:2 ratio and 2 : The double-weighted addition of the ratios is alternately repeated. The addition processing performed by the weighted doubling of the first column, the fourth column, the fifth column, and the eighth column is similar to the processing of Figs. 13A to 13F. As a result, as shown in Fig. 14C, the intention after the addition becomes the same as that shown in Fig. 13C. The digital arithmetic unit 29 sequentially acquires the column addition data ADD, and performs an addition operation on the image in the above state when the same color is input to the horizontal direction. At this time, similar to the processing in the horizontal direction, the digit arithmetic unit 29 is in the order of the third row, the first row, the second row, the fourth row, the seventh row, the fifth row, the sixth row, and the eighth row. The analogy is used to obtain the added data, and the double weighted addition is performed in a ratio of 1:2. In each addition operation, the addition processing is performed by setting the first row ih (the third row, the second row, the seventh row, and the sixth row) to be weighted to 1 and the next row Jh (first row, first The weights of the four rows, the fifth row, and the eighth row are 2, as indicated by the "x2" in the lower part of the figure. The next column of addition processing is set to weight the weight of the first row Ih (the second row and the sixth row) to 1 and the next column Jh (the fourth row and the eighth row) to 2, to the lower side of the figure. x 2" means to be executed. The first row, the fourth row, the fifth row 79-200845735 and the eighth row are processed by doubling the weighting. Under the prior control of the horizontal scanning circuit 12, there is a spatial relationship in the row configuration, in particular, the rows Ih and Jh which are subjected to the addition are switched to double the weighted addition by the ratio of 1:2 and 2 : The double-weighted addition of the ratios is alternately repeated. The addition processing performed by the weighted doubling of the first line, the fourth line, the fifth line, and the eighth line is similar to the processing of Figs. 13A to 13F. As a result, as shown in Fig. 14D, the intention after the addition becomes the same as that shown in Fig. 13 D. In this example, at each addition processing, the double-weighted addition of the ratio 1:2 shown in Fig. 9 is weighted for the counter 254 (specifically, the control of the count clock control signal TH) When executed, in fact, related to the spatial relationship in the column and row configuration, the double-weighted addition of the ratio 1: 2 and the double-weighted addition of the ratio 2: 1 are alternately switched by alternately. The order of the columns or rows is alternately repeated. As a result, similarly to Fig. 13, the center of the pixels after the addition is arranged at a more equal interval than when the simple addition is performed. As a result, a higher resolution signal (digital data) can be obtained by performing simple addition, and the weighting 値 in the simple addition is uniformly applied. It can be understood from the above description that it is not always possible to arrange the positions of the pixels to be equidistant after the addition by simply applying the weighted addition. In order to make the pixel centers more evenly spaced after the addition of weights, it is important to consider how to add the target pixels and what 値 is used as the weight 値. Furthermore, when capturing a color image, the image can be affected by the color arrangement of the color separation filter. In other words, in order to perform the addition without color mixing -80-200845735, and the spatial distance relationship is made into the same color configuration of the original color separation filter, the relationship between the added target pixel and the weighted 値 selection can be imagined. There are a number of restrictions. [Modified Example of Force Function] In the above detailed description, the double-weighted addition processing of two columns and two rows arranged in Bayer is described. However, this is only an example. It is possible to vary the weighting 値, the spatial position of the added target column and the row, and the number of added target columns and rows. For example, for weighting 値, it is not limited to twice, and a larger number, for example, a power of 2 of 4, 8, ... can be used. For example, in the above description, the display counter 254 performs the frequency dividing operation at the time of A/D conversion at twice the speed, but is not limited thereto, and the flip-flop 5 10 is controlled to perform the counting operation at a higher speed (dividing operating). At this time, the quantization step can be performed coarser. For example, if the count execution unit 504 is configured as shown in FIGS. 4 and 5, by setting the count clock control signals ΤΗ00 and TH01 to be active Η 'the frequency division operation of the counter 254 in the last 2 bits can be increased by 4 times. fast. This allows the digital data "Dsig - Iv + 4 · Dsig__Iv" to be obtained by adding the digit 値 Dsigjv of the signal component Vsig_Iv in the column Ιν to the digit 値 Dsig__Jv of the signal component Vsig_Jv of the 4x column JV. Furthermore, by setting the count clock control signal ΤΗ 02 to be active, the frequency division operation of the counter 254 of the 3-bit pixel of the rear unit pixel can be increased to 8 times faster. This allows the digit data "Dsig_Iv+8 · Dsig_Iv" to be obtained by adding the digit 値Dsig_jv of the signal component Vsigjv in the column Jv to the digit 値Dsig_Iv of the signal component Vsig_Iv -81 - 200845735 of the column Iv. If the count clock control signal TH0T (T = S-1) is set to be active, the frequency division operation of the counter 254 after the S bit can be increased to 2 - S times faster, so that a gain can be increased by 2 - S Bigger. This allows the digital data "Dsig_Iv + 2A S · Dsig__Iv" to be obtained by adding the digit 値Dsig_Iv of the signal component Vsig_Iv in the column Ιν to the digit 値Dsig_Jv of the signal component Vsig_Jv of 2, S times column Jv. When the frequency division operation of the counter is made into a high-speed division operation (faster) via several stages, such as L1 times (= 2), L2 times (4), L3 times (= 8), etc., if lower, if lower The frequency-division operation of the order bit output is invalidated and the remaining higher-order bit outputs are executed at a higher speed to perform the quantization step more coarsely, and the start count clock for controlling the higher order bits can be maintained. For the same speed as the count clock CIN. Although it seems that the resolution of the A/D conversion for the signal component Vsig_Jv in the weighted target column Jv is lowered by the counter operation, there is no substantial difference in the entire counter operation according to the original count clock CIN, and therefore, the power is not increased. Consumption. As described above, the weighting 値 can be applied as a power of 2, for example, 2 times, 4 times, 8 times, ... and so on, by changing the setting of the count clock control signal TH, and the weighting 値 can be adjusted 'to make The added pixel spatial position is arranged to obtain a higher resolution image, that is, the pixel positions after the addition can be arranged at a more equal pitch. Figure 15 is a diagram showing the mechanism for setting the weighting 値 to an arbitrary integer. -82- 200845735 In terms of setting the weighting, it is not only the power of 2, but also any 値. At this time, if the slope of the reference signal Vslop is maintained at a fixed level, it is preferable to change the count clock CK0 supplied to the counter 254 to a higher speed clock. Furthermore, when a mechanism that does not have to change the clock frequency of the count clock CK0 is employed, the setting of the count clock control signal TH is changed to change the frequency dividing speed of the counter 254 by one bit unit, and a weighting 値 is set to arbitrary Integer, the slope of the reference signal is adjusted by changing the setting of the slope change command signal CHNG. At this time, there are two relationships between the setting of the reference signal Vslop, the setting of the frequency dividing speed of the counter 254, and the weighting 値G to be set, as shown in Fig. 15. Specifically, assuming that the weighting 値 set is G, the conceivable method is: the first method, wherein the frequency dividing speed of the counter 254 is set to 2·n times and the slope of the reference signal Vslop is set to the factory n. /G, to satisfy the formula, where '2~(n+l)>G>2~ η", and the second method 'where the frequency dividing speed of the counter 254 is set to n times and the slope of the reference signal is Set to factory n/G to satisfy the formula "2, n > G > 2~ (η-1). In any case, the product G is obtained by multiplying the A/D conversion gain 2 to n obtained by increasing the frequency dividing speed by the A/D conversion gain G/2 - η obtained by changing the slope of the reference signal Vslop ( The reciprocal of the multiplication factor of the slope is obtained. For example, if the weighting 値 is set to unit pixel 3 'the frequency dividing speed is set to twice the speed' and the slope of the reference signal Vslop is set to 2/3 times the slope in the first method, in the second method The mid-divide speed is set to 4 times, and the slope of the reference signal Vslop is set to 4/3 times -83 - 200845735. It can be seen from the figure that in the second method, the multiplication coefficient set to the frequency dividing speed of the counter 254 is larger, so that the slope of the reference signal Vslop can be larger than the difference amount, and the advantage is that the A/D conversion period can be Make it smaller, even if the resolution is reduced. On the other hand, in the first method, although the multiplication coefficient set to the frequency dividing speed of the counter 254 is small and the A/D conversion speed is long, the resolution is not lowered. As described above, in addition to the power of 2 for changing the setting of the count clock control signal TH and the setting of the slope change command signal CHNG, it is also possible to change the weighting 藉 by using an arbitrary 値. Therefore, the weighting 値 can be adjusted so that the spatial positions of the added pixels are arranged at more complete intervals to obtain a higher resolution image. As described above, even if the pixel positions after the addition cannot be arranged by the weighting 2 of the power of 2, it is possible to set the weighting 藉 by setting the weighting 値 in any 値, so that the addition is performed. The pixel locations are then arranged at exactly equal spacing. For example, Figures 16A through 16F show "addition of ratio 3:1 + addition of ratio 1:3", where the weighting 値 is set to 3, and Figures 7A to 17F show "proportion of ratio 4:1" Plus + ratio 1: 4 plus", where weighting. 値 is set to a weight of 42. The setting of the weighting 値 adjustment and the adjustment of any power other than the power of 2 increase the elasticity of the pixel space position adjustment after the addition, and thus it is possible to find a ratio. The weighting 値 allows the pixel spatial locations after the addition to be arranged equidistantly. [Method for improving the resolution of the added image: Second Embodiment] A second embodiment of the display method of FIGS. 18 to 21 is for solving the digital addition processing of the counter 254 in the direction of the vertical -84-200845735 and in the digital position. The arithmetic unit 29 performs a problem that the resolution in the digital addition processing is deteriorated in the horizontal direction. 18A to 18C show the disadvantages of the single oblique integral A/D conversion system. More specifically, these figures explain the effect of comparing the processing cycles on the A/D conversion performance, especially for the conversion processing speed, where the analog pixel signal Vx is compared with the reference signal V s 1 ο p for digital data conversion. And at the same time, an example of a method of shortening the comparison processing cycle is displayed. Fig. 19 is a timing chart for showing the addition processing in the vertical direction in parallel with the A/D conversion processing to explain the second embodiment. Figure 20 is a diagram for showing the effect of the resolution improvement method when the count clock switch 51 is operated in the second embodiment. Figure 2 is a diagram showing the relationship between the change control of the slope of the reference signal Vslop and the frequency division speed control of the counter. In addition to the addition processing operation of the first embodiment, the second embodiment has a feature in that even In the processing of one column, when the signal level Ssig is processed, before the comparison processing is completed, in the comparison processing period of the voltage comparator 252, the slope of the reference signal Vslop and the frequency dividing speed of the counter 254 are changed in cooperation with each other, so that The A/D conversion gain remains unchanged in this column, i.e., the weighted chirp of the pixels in the column is held at a fixed chirp. This makes it possible to obtain a higher resolution added image at a high speed. Specifically, the slope change command signal CHNG is supplied to the reference signal generator 27 to change the slope of the reference signal Vslop to the J-fold slope, and the count mode control signal UDC, the reset control signal CLR, the data hold control pulse HLDC, And the count clock control signal TH is supplied to the counter execution unit 504 of the -85-200845735 counter 2 5 4 so that the frequency division operation of each bit output in the count execution unit 504 is changed to the κ speed ( Preferably, K times = J times). While changing the slope of the reference signal Vslop to a J-fold slope, the flip-flop 5 10 is controlled to operate at a K-speed (preferably J-speed) counting operation (frequency dividing operation), but as long as the error (change) Within the allowable range, it is not necessary to accurately "at the same time" or precise J-fold multiplication factor. This is the same as the general technique of allowing an error to be controlled within a setting range as long as the error (change) is within a permissible range. However, basically (in principle), in the A/D conversion processing of the signal component Vsig, the multiplication coefficient and the change timing are necessarily the same to obtain the digital data Dsig of the true reflection signal component Vsig without the correction operation, even in the reference. The signal Vslop is changed to be the same before the signal level Ssig and the reference signal Vslop match. In the present embodiment, the line processor 26 (specifically, the row A/D circuit 25) performs a single oblique integration A/D for each reset level (reset potential) and a signal level (signal potential). Conversion processing. At the same time, the reset potential is processed by one of the upper or lower modes (in the previous example, the lower mode), and the signal potential is processed by another mode (in the previous example, the upper mode), The digital data of the difference between the two processes can be automatically obtained by the result of the counting process of the second process. In the single-slope integral A/D conversion system used in this embodiment, the resolution of the A/D conversion, that is, the size of the 1LSB is the counter 254 when the slope of the reference signal Vslop and the period and the reference signal Vslop is changed - 86- 200845735 The counting speed (that is, the frequency of the counting clock) is determined. For example, assume that the period in which the counter 254 counts a count is a count cycle, the amount of change in the reference signal Vslop in the count cycle becomes the resolution of the A/D conversion (width 1 LSB). When the width of 1LSB is small (narrow), the resolution of A/D conversion is high, and when the width of 1LSB is large (wide), the resolution of A/D conversion is low. Therefore, for example, when expressed in the counting speed, the faster the speed, the shorter the counting cycle. If the slope of the reference signal Vs lop is the same, the variation of the reference signal Vslop, that is, the width of 1 LSB becomes small at the time of the counting cycle, so that the resolution of the A/D conversion becomes high. If the slope of the reference signal Vslop is the same, if the counting speed becomes faster, the counting 値 advances to the point where the reference signal Vslop and the signal voltage on the vertical signal line 19 match, then a larger digital data and A/D conversion can be obtained. The gain becomes higher. This means that the change in the count speed is equivalent to the adjustment of the A/D conversion increase and the control of the read gain. Furthermore, the slope of the reference signal Vslop is expressed. When the counting speed is the same, the larger the slope is, the smaller the amount of the reference signal Vslop is changed in the period, that is, the width of the ALS is higher when the width is 1 LSB. . Moreover, when the counting speed is the same, the larger the slope, the more time it takes to match the signal voltage on the reference signal Vslop and the vertical signal line 19, so that a larger digital data and an A/D conversion gain can be obtained. high. In other words, when the count speed is the same, when the slope of the reference signal Vslop is changed to control the twist of 1 LSB, the matching time of the reference signal Vslop and the pixel voltage Vx on the vertical signal line 19 is adjusted. As a result, even if the pixel signal voltage Vx on the vertical signal line 19 is kept the same, the count 値 at the time of the -87-200845735, that is, the digital data of the signal voltage is adjusted. This means that the slope change of the reference signal V s 1 ο p is equivalent to the adjustment of the A / D conversion gain and the adjustment of the read gain control. In the embodiment of the present invention, the above is used, and in the addition processing, the frequency dividing speed is set to a high speed (the reference signal Vslop is changed depending on the weighting 値) and weighted addition is performed. At this time, in order to perform higher speed and higher accurate processing, it is necessary to make the line A/D circuit 25 faster. In the row A/D circuit 25, in order to complete the further speed ' If the slope of the reference signal Vslop is not adjusted, the counter 2 5 4 needs to operate faster. In order to increase the speed of the counter, the counting clock speed is increased. However, since the row A/D circuit 25 and the row A/D circuit 25 in each row must perform the counting operation at a high speed at a high speed, the problem of an increase in power consumption can occur. In order to complete the high-speed A/D conversion processing and solve these problems at the same time, it is thought that the speed of the A/D conversion can be made variable by compressing the counting time by adjusting the reference signal Vslop side without increasing the counting clock speed. Complete high speed processing. For example, as shown in FIG. 18A, background noise (inductor noise reference) and optical scattered noise in the pixel signal generator 5 are known in addition to signal components (signal responses) corresponding to the light particles. (Photon shot noise) is applied to an optical signal output (sensor output) regarding the light intensity output from the unit pixel 3. When the sensor output is A/D converted, if the sensor output below the level of the sensor noise reference is A/D converted, the signal from the sensor output -88-200845735 is buried in the sensor. The 'so' conversion of the benchmark has become meaningless. Therefore, the sensor output that exceeds at least the sensor noise level is the effective range for A/D conversion. The photon shot noise is relative to the photon change corresponding to the 1 /2 power optical signal. Therefore, when the amount of signal is small, there is less photon-scattering noise, so that the optical signal can be accurately converted to A/D with high-resolution A/D conversion. However, when the amount of signal is large, the photon shot noise is relatively large, so that even if the optical signal is A/D converted with high resolution, the optical signal is not always accurate due to the amount of photon shot noise. A/D conversion. In a region where the amount of optical signals is large and a large amount of photon shot noise is included, only the resolution of the signal component for removing photon shot noise may be used. For this reason, if the resolution of the A/D conversion is lowered (in other words, if the quantization step becomes thicker) within the range, there is no problem with the accuracy of the A/D conversion result. In the above method, it can be imagined that the A/D conversion speed can be adjusted according to the signal by adjusting the accuracy of the A/D conversion, in other words, by adjusting the resolution or the quantization step when the signal amount becomes large. The amount gets faster. For example, as shown in Fig. 18B, when the sensor outputs (corresponding to the amount of photoelectrons of the signal component: the unit is "a. u. ") is between level 0 and level 1, then the quantization step is set to 1LSB, and the sensor output is between level 1 and level 2, and the quantization step is set to 2LSB, similarly And similarly according to the upward level, the quantization step is thicker, that is, the resolution is lower. This means that if the sensor output level is upward, the lower order of the counting execution unit 5 0 4 in the counter 254 is formed. The bit-reactor 5 1 0-89-200845735 is ignored in the order of the sensor output level, and only the higher-order bit-reactor 5 1 0 can be operated. On the other hand, in order to be based on the sensor output The level gradually changes the resolution. It can be understood from the above description that the slope of the reference signal Vslop is gradually changed to a steep slope, and the voltage change per unit time, that is, the voltage difference (mV/digit) of each count is changed as This is shown in Fig. 18C. However, in the above case, since the A/D conversion gain becomes small, the linearity of the A/D conversion result regarding the sensor output is impaired. For example, each digit is at the reset level. Srst A/D conversion period Trst and A/D at signal level Ssig The voltage 値 (conversion coefficient) before the change point in the conversion period Tsig is α [V/digit], and the voltage 値 (conversion coefficient) of each digit after the change point becomes a /J. Therefore, if A/ The count of the D conversion result 値D is converted into a voltage 値· If the count 値 at the change point is “m”, it becomes “α · m + (Dm) · a /J”, which makes the size of the sensor output In order to avoid this, it is conceivable to add the gain correction by making the count clock faster, offsetting the degree of change of the slope of the reference signal Vslop, that is, the relationship between the count 値 and the voltage △. The V/Δt system is kept constant. At this time, the technique of simply making the count clock faster cannot be practically used because the aforementioned problem may occur. Therefore, if a mechanism is employed, the internal count clock is actually The change is not changed, and the count of the A/D conversion result is automatically corrected by the slope of the reference signal Vslop, for example, to "α · m + (D_m) • α/J· J", and the count 値 becomes "α". · m + (Dm)· a = a · D,,, make -90- 200845735 The size of the sensor output can be accurately obtained. In the second embodiment, as a mechanism for automatically correcting, a mechanism for changing the frequency dividing speed of the counter 254 is employed. It is explained in detail as follows, in which the order of addition is set to be the same as the processing shown in Fig. 13. In the A/D conversion period Trst of the reset level Srst, the reset levels Srst_Iv and Srst_:iv of the unit pixel 3 are read, and the counter 254 counts down the levels Srst_Iv and Srst_Jv. At this time, all of the count clock control signals ΤΗ00 to TH1 1 are set to be inactive L. Furthermore, in the A/D conversion period Tsig of the signal level Ssig, the reference signal Vslop is changed to be the same as the slope at the beginning of the A/D conversion period, and the counter 254 is counted by each of the digits 値Drst_Iv and Drst_Jv. At this time, all of the data hold control pulses HLDC00 to HLDC1 1 are set to be inactive L, and all of the count clock control signals ΤΗ00 to TH11 are set to be inactive L. At a point R(t21_Iv), the slope of the reference signal Vslop is changed to a double slope (for example, twice the slope), and the frequency division operation of the flip-flop 5 1 0 before the point R is made K times speed ( Preferably, K = J). For example, at the time of processing of the first addition target column Iv, the slope of the reference signal Vslop is changed to twice the slope at the point R_Iv(t21_Iv), and the data holding control pulse HLDC00 to the data holding unit 5 12_00 is switched. The operation clock and the count clock control signal TH 0 0 to the count clock switch 516_00 are switched to the operation Η. At this time, the pixel fe number voltage V X _ I ν in the column I ν in a certain row on the vertical signal line 19 is digitally converted to the count 値m 0 __ I ν . For the count -91 - 200845735, the actual number of the number 254; the system is determined by the period between the "t21__Iv-t20 Iv" and the count clock cycle, because the upper number is started by the negative 値Drst_Iv, here again At the time 'because the data hold control pulse HLDC 0 0 is set to the operation Η 'so the data recorded in the least significant bit flip-flop 5 1 0 is held. After the point R — Iv(t21_Iv), the least significant bit output is invalidated. Since the least significant bit output is made invalid after the point R_Jv(t21_Iv), the period after the point R_lv(t2 1jv) becomes the low resolution period Tssig_LlIv. Furthermore, at the same time, if the count clock control signal ΤΗ00 is switched to the operation Η, and the least significant bit (in the 〇 bit) the input clock of the flip-flop 510_00 is transferred to the second-stage (at 1-bit) flip-flop 512_〇1 clock terminal. By transmitting the clock of the least significant bit to the next bit, the frequency dividing operation of the remaining higher bit output is performed at twice the speed, except for the least significant bit, the counter 2 5 4 starts at twice the speed Up, while keeping the quantization step twice as thick as before. For example, Fig. 20 is an output diagram of each flip-flop 510 when the slopes of the count clock control signal ΤΗ00 and the reference signal Vsl 〇p are changed. At the point R_Iv(t21_Iv), the count clock control signal ΤΗ00 is switched to the operation Η so that the count clock CIN supplied to the least efficient flip-flop 510_00 is transferred to the second-stage flip-flop 5 1 0_0 1, so that the lower-order positive and negative The device 5 10 operates at high speed after switching. However, since the least significant bit output becomes invalid, the quantization step becomes thicker than before. For example, if the -92-200845735 cycle of the count output D00 of the first-stage flip-flop 510_00 is 100 MHz before the count clock control signal ΤΗ00 is switched, and the count output D01 of the second-stage flip-flop 510_01 is 50 MHz. Different from this, when the count clock control signal ΤΗ00 is switched to the Η level, and the count output D01 of the second stage flip-flop 510_01 is 100 Hz, the frequency division operation of the higher order bit flip-flop 5 1 0 is performed. It is operated at twice the speed. Furthermore, regarding the pixel signal voltage Vx_Iv, the low-resolution period Tsig_LlIv after the point R_Iv(tl2_IV), when the signal level Ssig__Iv and the reference signal Vslop match (t22_Iv), the counter 254 stops while keeping the count at the time of matching.値zO_Iv. At this time, the slope of the reference signal Vslop becomes twice the speed before the point R_Iv(t21_Iv), and the higher order bit flip-flop 5 1 0 in the counter 254 also performs the frequency dividing operation at twice the speed. Therefore, the relationship between the count 値 and the voltage 变成 becomes 2 Δ V / 2 Δ t = Δ V / Δ t, and the relationship between the count 値 and the voltage 値 Δ V / Δ t is stable, which results in maintaining the A/D conversion result relative to The sensor output is linear. The final count 値zO__Iv itself automatically changes to the digital data Dsig, which truly reflects the signal component Vsig, so no external circuit is required for correction. After the A/D conversion period of the column Iv is completed, it is not necessary to reset the counter 2, the read operation and the A/D conversion processing of the unit pixel 3 in the column Jv are sequentially performed, and the reading similar to the processing of the column Iv The out operation is repeated. At this time, the slope of the reference signal Vslop becomes the same as that of the column Iv. The data hold control pulse HLDC_00 and the count clock control signal ΤΗ — 00 are held as active Η. In this way, the ramp-93-200845735 rate of the reference signal Vsl〇p is the same as that of the column Iv, and the higher-order flip-flop 5 1 0 in the counter 254 performs the double-speed division operation so that the count is performed. The relationship between 値 and voltage 变成 becomes 2 Δ V / Δ t. Therefore, at the beginning of the processing of the column JV, the pixel signal voltage Vx_Jv is processed by twice the gain compared to the processing of the column Iv. While changing the slope of the reference signal Vslop to twice the slope of the point R(t21_Jv), the data holding control pulse HLDC01 to the data holding unit 5 1 2 __ 0 1 is switched to the counting clock of the operation Η and to the counting clock switch 516 Signal ΤΗ0 1 is switched to the active Η. At this time, the pixel signal voltage Vx_Jv in the column J is digitally converted into a count 値. The number of the actual number of the counter 254 is determined as the period between "t21 - Jv - t20jv" and the cycle of the count clock, and the count 値 mO_Jv at the point R_Jv (t21_Jv) is determined because the upper number is negative Start with Drst_Jv. Furthermore, at this time, since the data retention control pulses HLDC 00 and HLDC01 are the active Η, the least significant bit (in the 〇 bit) of the flip-flop 510_00 and the second-level (in the 1-bit) flip-flop 510_01 The information is kept. In fact, after the point R - Jv (tl2_h), the least significant bit (〇 bit) output and the second level (1 bit) output are invalidated. Since each output of the 〇 bit and the i bit is invalid after the point R_Jv(t21_Jv), the period after the point _"〇21_") becomes a lower resolution period §_1^11乂. Furthermore, at the same time, if the count clock control signal ΤΗ0 1 becomes active, the input clock of the 1-bit flip-flop 510_01 is transferred to the clock terminal of the third-stage (at 2-bit) flip-flop 510_02. Loop to the next -94-200845735 bit, except that the 0-bit and 1-bit output is executed twice as fast as the previous double-speed operation, that is, four times, the division of other higher-order bits The operation will output, so that the counter 254 starts the quadruple speed up and makes the quantization step thicker. Furthermore, regarding the pixel signal voltage Vx_Jv, the low resolution period Tsig_LlJv after the point R_Jv(t21_Jv), when the signal bit When the quasi-Ssig_Jv and the reference signal Vslop match (t22_Jv), the counter 254 stops while maintaining the count 値zO_Jv at the time of matching. At this time, the slope of the reference signal Vslop becomes twice the speed before the point R_Jv(t21_Jv), and Higher order bit in counter 254 The inverter 5 10 also performs the frequency division operation at four times speed. Therefore, the relationship between the count 値 and the voltage 变成 becomes 2 Δ V / 2 Δ t = Δ V / Δ t, and the count 値 and the voltage 値 Δ V / Δ The relationship between t is stable, which keeps the A/D conversion result linear with respect to the sensor output. The final count 値z 0 _ J v itself automatically becomes the digital data Dsig, which truly reflects the signal component Vsig, therefore, no external circuit is required for correction. After the A/D conversion cycle of the column Jv is completed, it is not necessary to reset the counter 2 54 'the reading operation of the unit pixel 3 in the column JV and the A/D conversion processing are sequentially performed, and the processing similar to the column J v The read operation is repeated. At this time, the slope of the reference signal Vslop becomes twice as large as that after the point R__Iv(t21JV) of the column Iv, and on the other hand, the higher order flip-flop 5 1 in the counter 254 0 performs the frequency division operation of the quadruple speed. Therefore, the relationship between the count 値 and the voltage 变成 becomes 4 Δ V / Δ t = 2 Δ V / Δ t, and the relationship between the count 値 and the voltage 系 is as before Stable, so that the pixel signal -95- 200845735 voltage Vx_Jv is compared to the column Iv The double gain processing of the processing. As a result, for example, if, for example, the number of bits is at the A/D conversion period Trst of the reset level Srst and the change point R in the A/D conversion period Tsig of the signal level Ssig The previous voltage 値 (conversion coefficient) is α [V/digit number], and the final count 値 held in the counter 254 is "Δν" §_Ιν + 2α xVsig_Jv", and the weighted addition is completed. For example, assume that the digits in parentheses on the line graph of the pixel signal voltage Vx of FIG. 19 are as shown, the signal components Vsig_Iv and Vsigjv in the column Iv and the column Jv are 60, and their reset levels Srst_Iv and If Srstjv is 10, a two-bit weighted addition is performed. The counts that are kept at each time order become similar to those shown in Fig. 9. More specifically, in the A/D conversion of the signal level Ssig_Iv (signal component Vsig_Iv) in the column Iv, by performing the A/D conversion by the reset level Srst_Iv, the count 値"_Drst_Iv" (= -10) As the starting point starts counting, the count held in the counter 254 becomes Μ-ΐ 0+70=60=Dsig_Iv,, after processing. Then in the A/D conversion of the column Jv, the number of the reset level Srst_Jv is executed as the start 値 "6〇 = Dsig_Iv", and the count is obtained by the A/D conversion in the column Iv. The count that is held in the counter 254 becomes "5 〇-2 X WMO". Furthermore, the number used for the signal level Ssigjv is executed by the count 値40 as the starting point, and the count 予以 held in the counter 254 becomes "4〇+ 2χ 7 0= 1 8 0 after processing. , this count 値 denotes "Dsig - Ιν + 2 · Dsigjv", which is obtained by adding the digit 値Dsig__Iv of the signal component Vsig_lv in the column Iv to the column -96-200845735

Jv中之信號分量Vsigjv之數位値Dsig_Jv加以取得。 可以由上述說明了解,即使參考信號Vslop之斜率在 列的A/D轉換處理時改變,如果分頻速度被改變以補償斜 率變化,則最終計數値z,即信號分量Vsig之數位資料 Dsig並不會爲斜率之變化所影響,及如果信號分量 Vsig 相同,則最終計數値z( = Dsig)匹配。這變成不必要校正最 終計數値,當然不必一函數單元,以保持在改變點的計數 値m。 因爲參考信號Vsig的斜率在變化點R後並未變大, 所以A/D轉換週期可以縮短差異量,使得相加影像可以以 較高速取得。 在上述說明中,解釋了在某一列之A/D轉換處理中, 參考信號Vslop之斜率被設定爲兩倍斜率及計數器254之 分頻操作被增加爲兩倍速。然而,並不限於此,參考信號 Vslop之斜率可以依據感應器輸出位準的上升加以改變, 經過之幾級與正反器5 1 0係被控制以較高速執行計數操作 (分頻操作)。在此時,量化步階變得更粗。 例如,如果計數執行單元5 04係被架構如圖4及5所 示,在列Iv之處理中,參考信號Vslop之斜率被設定爲4 倍大及計數時鐘控制信號ΤΗ0 1被設定爲作動Η,藉以完 成在2位元之計數器2 5 4予以以4倍快速度操作後的分頻 操作係如圖19所示。再者,如果參考信號Vslop之斜率 被設定爲8倍大及計數時鐘控制信號TH02被設定爲作動 Η,藉以完成在3位元之計數器2 5 4後予以以8倍快速度 -97- 200845735 操作後的分頻操作。同樣地’參考信號Vs lop之斜率被設 定爲2— S倍(S爲正整數,”~ ”爲乘冪),及計數時鐘控制 信號TH0T(T = S-1)被設定爲作動Η,藉以完成在S位元的 計數器2 5 4予以以2 ~ S倍快操作後的分頻操作。 如上所述,如果參考信號Vslop之斜率取決於信號分 量V s i g的大小(換句話說,光子散粒雜訊的大小)經過幾級 變化(逐漸改變至陡斜率),例如J1倍(=2位),J2倍(4倍) 、J3倍(8倍)…以此類推,參考信號Vslop之全搖擺的週 期被進一步縮短,藉以以更高速執行A/D轉換。 再者,計數器之分頻操作係被改變以經由幾級更高速 操作,依據參考信號Vslop之斜率變化,例如K1倍(2倍) ,K2倍(4倍),K3倍(8倍),··以此類推,及較低階資料 變成無效,使得對應於信號分量Vsig之準確計數値被取 得作爲最終輸出,而不管在改變參考信號V s 1 ο p點之計數 値。因爲愈多低階位元資料被作無效處理,則量化步階更 粗,在A/D轉換中之解析度更低,但有關於光子散粒雜訊 ,準確度愈低將不會對A/D轉換結果造成問題。 因爲比較處理所需之時間藉由設定參考信號Vslop之 斜率更陡(更大)而縮短,所以,可以減少計數器操作次數 ,使得完成高速之A/D轉換,即縮短A/D轉換週期。相 反地,如果A/D轉換週期保持相同,則計數操作之次數可 以減少,使得完成低功率消耗。 再者,當計數器的分頻操作經幾級而變快時,如果較 低階位元輸出依序變成無效及只有其餘較高階位元的分頻 -98- 200845735 操作以高速操作,以更粗執行量化步階,則控制較 元輸出之啓始計數時鐘可以保持爲與計數時鐘c IN 速度。雖然A/D轉換的解析度被降低,但整個計數 上依原始計數時鐘C IN操作,因此,不增加功率消 者,當信號分量Vsig變得更大時,藉由使用光子 訊,量化步階更粗,以降低 A/D轉換準確度,使 A/D轉換準確度並不會嚴重損及A/D轉換準確度。 參考信號Vslop之斜率變化的點R爲可變,及 模式係取決於是否要更高準確度或更快速度的目的 光子散粒雜訊及量化雜訊間之關係而加以執行。 再者,在前一例子中,當參考信號Vslop之斜 定爲2 S倍時,其顯示當加1改變S時,例如,1 ,時,本發明並不限於此,任意變化步階均可能, 2,4,以此類推。在此關係中,模式切換係取決於 確度或較快速的目的根據在光子散粒雜訊及量化雜 關係加以執行。 當加權相加被藉由使用光子散粒雜訊執行時, 的操作次數可以降低,而不會嚴重損及A/D轉換準 使得可以在加權相加處理時執行高速A/D轉換。相 果A/D轉換週期相同,及可以減少計數器操作次數 完成較低功率消耗。 [相加影像的解析度改良方法:第三實施例] 圖20爲一顯不以計數器254在垂直方向中執 高階位 相同的 器實際 耗。再 散粒雜 得實際 切換的 而根據 率被設 ,2,3 例如, 較高準 訊間之 計數器 確度, 反,如 ,因而 行數位 -99- 200845735 相加處理及以數位算術單元29在水平方向行數位相加處 理,解決解析度劣化的方法之第三實施例。 在第三實施例中,並不是兩列及兩行之加權相加處理 ,而是三列及三行之加權相加處理。在行方向中之三行的 加權相加處理不是必要的。 當執行於三像素之相加處理,例如三像素之加權可以 彼此不同或者只有一像素的加權與另兩像素的加權不同。 在後者中,其間之關係被設定爲1 : n : 1的比例(η爲大於 1之値)。較佳地,η爲正整數或任意大於2的値,例如, 2,單元像素3,4,..等等,最好是2的乘冪,例如,2, 4,8,…等等。用以設定這些加權値的方法係類似於用於 兩像素的加權相加者。 例如,圖22Α及22Β所示,三列及三行之加權相加操 作可以藉由組合垂直方向中之加權相加處理及水平方向中 之加權相加處理加以完成,垂直方向中,相加處理係以垂 直方向中以三列爲單位加以爲行A/D電路25所執行,在 水平方向中,相加處理係以水平方向中以三行爲單元爲數 位算術單元29所執行。 三列及三行之加權相加處理的應用形態,例如如果所 有處理目標像素的係數被設定相同値,則將會爲如圖20A 所示之平滑濾波處理,但如果有一加權値被設定使得中心 像素的係數被設定爲大於週邊像素的係數,則加強中心像 素的加權相加處理可以完成如圖20B所示。 在此時,例如,當像素被以交錯掃描讀出時,可能以 -100- 200845735 1 : 2 : 1之比例之加權相加,及在相加後的重心位置被強 調’以取得局解析度之影像。 在比例1 : 2 : 1之比例的加權相加與相加後的空間位 置間之關係係改變如下。更明確地說,在比例1 : 2 : 1之 加權相加中,在相加後之空間位置並未改變,類似於丨:1 :1比例之加權相加,但在相加後強調中心位置,可以在 改變相加後之空間位置的處理中,完成高解析度之影像。 [攝像裝置] 圖2 3爲一攝像裝置架構圖,其係爲利用依據上述固 態攝像裝置1的實體資訊取得裝置的例子。一攝像裝置8 係爲一攝像設備,用以捕捉可見光彩色影像。 上述固態攝像裝置1的機制不只是用於固態攝像裝置 也適用於攝像設備。在此時,攝像設備中,有可能藉由以 加權相加而在相加後改變空間位置,來取得高解析度。 在此時,計數之分頻速度變快以設定加權之控制、或 參考信號Vslop之斜率控制可以藉由設定資料至外部主控 制器資料加以任意指定,該控制器資料指示切換模式給通 訊/時序控制器20。 明確地說,攝像裝置8包含:一攝像鏡頭802、一光 低通濾鏡804、一濾色群812、像素陣列單元1〇、驅動控 制器7、行處理器26、參考信號產生器27及相機信號處 理器8 1 0。攝影鏡頭8 02將載有在照明裝置,例如螢光之 物體Z的影像之光L導引至攝像裝置側並產生物體Z的影 -101 - 200845735 像。濾色群812具有例如排列成Bayer配置之 濾色鏡。驅動控制器7驅動像素陣列單元1 〇。 26對自像素陣列單元1 0輸出之像素信號,執行 或 A/D轉換處理。參考信號產生器27供給 Vslop至行處理器26。相機信號處理器810對來 影像信號執行處理。 光學低通濾鏡804係用以阻擋高於Nyquist 率分量,以避免假化。再者,用以降低紅外線分 線截止濾鏡8 0 5可以與光學低通濾鏡804設在一 與一般攝像裝置相同。 設在行處理器26下一級之相機信號處理器 攝像信號處理器820及相機控制器900,其作動 器,用以控制整個攝像裝置8。 攝像信號處理器820具有信號分離器822及 處理器8 3 0。信號分離器822具有一主分色功能 主彩色濾鏡外之一彩色濾鏡被使用時,分開自行, 中之A/D轉換功能單元所供給之數位攝像信號成 、G(綠)、B(藍)三原色。The digital component of the signal component Vsigjv in Jv is obtained by Dsig_Jv. It can be understood from the above description that even if the slope of the reference signal Vslop is changed at the A/D conversion processing of the column, if the frequency dividing speed is changed to compensate for the slope change, the final count 値z, that is, the digital data Dsig of the signal component Vsig is not Will be affected by the change in slope, and if the signal component Vsig is the same, the final count 値z (= Dsig) matches. This becomes unnecessary to correct the final count 値, of course, without a function unit to keep the count at the change point 値m. Since the slope of the reference signal Vsig does not become large after the change point R, the A/D conversion period can shorten the amount of difference so that the added image can be obtained at a relatively high speed. In the above description, it is explained that in the A/D conversion processing of a certain column, the slope of the reference signal Vslop is set to twice the slope and the frequency dividing operation of the counter 254 is increased to twice the speed. However, without being limited thereto, the slope of the reference signal Vslop may be changed in accordance with the rise of the sensor output level, and the stages and the flip-flops 5 10 are controlled to perform the counting operation (dividing operation) at a higher speed. At this time, the quantization step becomes thicker. For example, if the counting execution unit 504 is structured as shown in FIGS. 4 and 5, in the processing of the column Iv, the slope of the reference signal Vslop is set to be 4 times larger and the count clock control signal ΤΗ0 1 is set to be active Η, The frequency division operation after the counter of the 2-bit counter 2 5 4 is operated at 4 times is shown in FIG. 19 . Furthermore, if the slope of the reference signal Vslop is set to 8 times larger and the count clock control signal TH02 is set to be active, the operation is performed after the 3-bit counter 2 5 4 is operated at 8 times speed -97-200845735 After the crossover operation. Similarly, the slope of the reference signal Vs lop is set to 2 - S times (S is a positive integer, "~" is a power), and the count clock control signal TH0T (T = S-1) is set to be activated, thereby Completion of the frequency division operation after the counter 2 5 4 of the S bit is operated at 2 to S times. As described above, if the slope of the reference signal Vslop depends on the magnitude of the signal component V sig (in other words, the size of the photon shot noise), it undergoes several stages of change (gradual change to a steep slope), for example, J1 times (= 2 bits) ), J2 times (4 times), J3 times (8 times)... and so on, the period of the full swing of the reference signal Vslop is further shortened, thereby performing A/D conversion at a higher speed. Furthermore, the frequency division operation of the counter is changed to operate at a higher speed through several stages, depending on the slope of the reference signal Vslop, such as K1 times (2 times), K2 times (4 times), K3 times (8 times), And so on, and the lower order data becomes invalid, so that the exact count 对应 corresponding to the signal component Vsig is taken as the final output regardless of the count 値 at the point of changing the reference signal V s 1 ο p . Since more low-order bit data is invalidated, the quantization step is thicker and the resolution in A/D conversion is lower, but with regard to photon shot noise, the lower the accuracy will not be for A. The /D conversion result caused a problem. Since the time required for the comparison processing is shortened by setting the slope of the reference signal Vslop to be steeper (larger), the number of counter operations can be reduced, so that the high-speed A/D conversion, that is, the A/D conversion period is shortened. Conversely, if the A/D conversion period remains the same, the number of counting operations can be reduced, so that low power consumption is achieved. Furthermore, when the frequency division operation of the counter becomes faster through several stages, if the lower order bit output is sequentially invalidated and only the remaining higher order bits are divided, the operation is performed at a high speed to be thicker. When the quantization step is performed, the start count clock that controls the meta-output can be kept at the same speed as the count clock c IN . Although the resolution of the A/D conversion is lowered, the entire count is operated according to the original count clock C IN , and therefore, without increasing the power consumer, when the signal component Vsig becomes larger, the quantization step is performed by using photon information. Thicker to reduce A/D conversion accuracy, so A/D conversion accuracy does not seriously impair A/D conversion accuracy. The point R at which the slope of the reference signal Vslop changes is variable, and the mode is performed depending on whether or not the relationship between the photon shot noise and the quantized noise of higher accuracy or faster speed is required. Furthermore, in the former example, when the reference signal Vslop is inclined to 2 S times, it is displayed that when S is changed by 1 and, for example, 1, the present invention is not limited thereto, and any variation step may be , 2, 4, and so on. In this relationship, mode switching is performed based on the photon shot noise and the quantized miscellaneous relationship depending on the accuracy or faster purpose. When the weighted addition is performed by using photon shot noise, the number of operations can be reduced without seriously damaging the A/D conversion level so that high-speed A/D conversion can be performed at the time of weighted addition processing. The resulting A/D conversion cycle is the same, and the number of counter operations can be reduced to achieve lower power consumption. [Method for improving the resolution of the added image: Third Embodiment] Fig. 20 is a diagram showing the actual consumption of the same high-order bit in the vertical direction by the counter 254. The re-grain is actually switched and is set according to the rate, 2, 3, for example, the counter accuracy between the higher quasi-symbols, and, for example, the row digits -99-200845735 is added and processed by the digital arithmetic unit 29 The third embodiment of the method of solving the resolution degradation by the direction line digital addition processing. In the third embodiment, the weighted addition processing of two columns and two rows is not performed, but the weighted addition processing of three columns and three rows. A weighted addition process of three of the row directions is not necessary. When performing the addition processing of three pixels, for example, the weighting of three pixels may be different from each other or the weighting of only one pixel may be different from the weighting of the other two pixels. In the latter, the relationship between them is set to a ratio of 1: n : 1 (η is greater than 1). Preferably, η is a positive integer or any 値 greater than 2, for example, 2, unit pixels 3, 4, .., etc., preferably a power of 2, for example, 2, 4, 8, ... and so on. The method used to set these weights is similar to the weighted adders for two pixels. For example, as shown in FIGS. 22A and 22B, the weighted addition operation of three columns and three rows can be completed by combining the weighted addition processing in the vertical direction and the weighted addition processing in the horizontal direction, and the addition processing in the vertical direction. This is performed by the row A/D circuit 25 in units of three columns in the vertical direction, and in the horizontal direction, the addition processing is performed by the three-behavior unit as the digital arithmetic unit 29 in the horizontal direction. The application form of the weighted addition processing of three columns and three rows, for example, if the coefficients of all the processing target pixels are set to be the same, then the smoothing filtering process as shown in Fig. 20A will be performed, but if a weighting 値 is set so that the center The coefficient of the pixel is set to be larger than the coefficient of the peripheral pixel, and the weighted addition processing of the enhanced center pixel can be completed as shown in FIG. 20B. At this time, for example, when pixels are read out in an interlaced scan, they may be weighted by a ratio of -100-200845735 1 : 2 : 1 and emphasized at the position of the center of gravity after the addition to obtain a local resolution. Image. The relationship between the weighted addition of the ratio of the ratio 1: 2:1 and the spatial position after the addition is as follows. More specifically, in the weighted addition of the ratio 1: 2: 1, the spatial position after the addition does not change, similar to the weighted addition of the 丨:1:1 ratio, but the center position is emphasized after the addition. The high-resolution image can be completed in the process of changing the spatial position after the addition. [Camera device] Fig. 2 is an architecture diagram of an image pickup device, which is an example of a physical information acquisition device based on the above-described solid state imaging device 1. A camera device 8 is an imaging device for capturing visible light color images. The mechanism of the above-described solid-state image pickup device 1 is not only applied to a solid-state image pickup device but also to an image pickup apparatus. At this time, in the image pickup apparatus, it is possible to obtain high resolution by changing the spatial position after addition by weighted addition. At this time, the counting frequency of the counting becomes faster to control the setting of the weighting, or the slope control of the reference signal Vslop can be arbitrarily designated by setting the data to the external host controller, and the controller data indicates the switching mode to the communication/timing Controller 20. Specifically, the imaging device 8 includes: an imaging lens 802, an optical low-pass filter 804, a color filter group 812, a pixel array unit 1A, a drive controller 7, a line processor 26, a reference signal generator 27, and Camera signal processor 8 1 0. The photographic lens 082 guides the light L carrying the image of the illumination device, such as the fluorescent object Z, to the side of the imaging device and produces an image of the object Z - 101 - 200845735. The color filter group 812 has, for example, color filters arranged in a Bayer configuration. The drive controller 7 drives the pixel array unit 1 〇. 26 pairs of pixel signals output from the pixel array unit 10 are subjected to or A/D conversion processing. The reference signal generator 27 supplies Vslop to the line processor 26. The camera signal processor 810 performs processing on the incoming image signal. Optical low pass filter 804 is used to block higher than Nyquist rate components to avoid aliasing. Further, the infrared line cut filter 805 for lowering the infrared ray filter 804 can be provided in the same manner as a general image pickup device. The camera signal processor, the camera signal processor 820 and the camera controller 900, which are provided in the next stage of the line processor 26, are actuated to control the entire camera unit 8. The image pickup signal processor 820 has a signal separator 822 and a processor 803. The signal separator 822 has a main color separation function. When one color filter is used, the digital image signal supplied by the A/D conversion function unit is separated, and G (green), B ( Blue) three primary colors.

再者,攝像信號處理器820具有:一亮度信 840,用以根據信號分離器822所分開之三原色ff 、B,針對亮度信號Y作信號處理;及一編碼器 以根據亮度信號Y/彩色信號C產生視訊影像VD 雖然未顯示,但彩色信號處理器8 3 0具有例 放大器、伽瑪校正單元、色差矩陣單元。白平衡 R、G、B 行處理器 C D S處理 參考信號 自1 2 6的 頻率之頻 量之紅外 起。這係 810具有 爲主控制 彩色信號 ,用以當 處理器26 :爲R(紅) 號處理器 !號 R、G 8 60,用 〇 如白平衡 放大器根 -102- 200845735 據自未顯示之白平衡控制器所供給之增益信號,調整(白 平衡調整)在信號分離器822中之三原色分離功能單元所 供給之三原色信號的增益,並供給經調整之增益至伽瑪校 正單元及亮度信號處理器840。 根據所調整之白平衡的原色信號,伽瑪校正(r )係被 執行用以產生一準確顏色,及用於每一顏色R、G、B之 伽瑪校正輸出信號係被輸入至色差矩陣單元。色差矩陣單 元執行色差矩陣處理並輸入所取得之色差信號R-Y、B-Y 至編碼器8 6 0。 雖然未顯示,亮度信號處理器8 4 0具有例如高頻亮度 信號產生器、低頻亮度信號產生器及亮度信號產生器。高 頻亮度信號產生器取決於自信號分離器822之原色分離功 能單元所供給之原色信號,產生包含相當高頻分量之亮度 信號YH。低頻亮度信號產生器取決於自白平衡放大器供 給之白平衡原色信號,而產生只含低頻分量的亮度信號 YL。亮度信號產生器取決於兩類型之亮度信號YH、YL而 產生亮度信號Y,並供給亮度信號Y至編碼器860。 編碼器8 6 0使用對應於彩色信號次載波之數位信號, 數位化地調變色差信號R-Y、B-Y,並組合它們至爲亮度 信號處理器840所產生之亮度信號Y,並將之轉換爲數位 視訊信號VD( = Y + S + C ; S爲同步信號;C爲色度信號)。 自編碼器860輸出之數位視訊信號VD被供給至未顯 示之下一級的相機信號輸出單元,然後,使用爲監視器輸 出或作爲記錄在記錄媒體中之資料。在此時,如果有必要 -103- 200845735 ,數位視訊信號VD被經由D/A轉換被轉換爲視訊信號。 在本實施例中之相機控制器900具有:一微處理器 9 02,其爲電腦的核心,並表示爲中央處理單元(CPU),其 中整合有爲電腦所執行之操作與控制之功能並被整合在一 超小型積體電路上;一唯讀記憶體(R〇M)904,作爲專用 以讀出之記憶體;一隨機存取記憶體(RAM)906,其係爲 揮發性記憶體的例子並可用以依需要寫入及讀出;及其他 未顯不之週邊構件。微處理902、ROM904、及RAM906 被一起稱爲微電腦。 在上述中,”揮發性記憶體”表示一記憶體裝置,其在 設備斷電時’抹除記憶體內容。另一方面,,,非揮發記憶 體則表不一*記憶體裝置’即使在設備主電腦斷電時,仍 保有記憶體內容。在記憶體裝置中,不只非揮發半導體記 憶體裝置’也可以使用任何記憶體裝置,只要它們能保持 記憶體內容即可。或者’除了非揮發半導體記憶體外,也 可以使用提供有備用電源’而成爲非揮發的記憶體者。 再者’記憶體並不限於半導體記憶體裝置,也可以使 用媒體架構,例如磁碟、光碟。例如,一硬碟也可以使用 作爲非揮發記憶體。再者,也可以使用一架構作爲一非揮 發記憶體’其中,資訊被自例如c D - R Ο Μ之記錄媒體讀出 〇 相機控制器900控制整個系統。尤其,在完成高速 A/D轉換處理的前述處理中,相機控制器9〇〇具有調整各 種控制脈衝的開/關功能,各種脈衝係用於在參考信號產 -104- 200845735 生器27中之參考信號Vslop之斜率變化之控制及在計數 器254中之分頻速度之控制。 在ROM9 04中,儲存有相機控制器9〇〇的控制程式, 特別是在本例子中,儲存有相機控制器900之各種控制脈 衝的開/關時序的程式。 在RAM9 06中,儲存有爲相機控制器9〇〇所處理的各 種資料。 再者’相機控制器900係能令記錄媒體924,例如記 憶卡插入或移除,並連接至例如網際網路的通訊網路上。 例如,除了微處理器902、ROM904、RAM906外,相機控 制器900具有記憶體讀出單元907及一通訊I/F (介面)90 8 〇 記錄媒體924係用以儲存資料,例如程式資料,以使 得微處理器902根據自亮度信號處理器840所供給之亮度 系統信號,執行軟體處理,及各種設定値,例如光資料 DL的通量範圍及曝光控制處理(包含電快門控制),及在參 考信號產生器27中之參考信號Vslop之斜率改變控制與 計數器254中之分頻速度控制之各種控制脈衝的οη/off時 序。 記憶體讀出單元907儲存(安裝)自記錄媒體924所讀 出之資料至RAM906。通訊I/F90 8在通訊網路間,例如網 際網路間連接並傳送資料。 在此一攝像裝置8中,驅動控制器7及行處理器2 6 係被顯示爲與像素陣列單元1 0分開的一模組中。然而, -105- 200845735 不必說,如固態攝像裝置1的說明中,有可能使用單晶固 態攝像裝置1,’其中,驅動控制器7及行處理器2 6被整合 在同一半導體基材上,其中也安裝有像素陣列單元10者 〇 在圖中,攝像裝置8具有光學系統,除了像素陣列單 元1〇、驅動控制器7、行處理器26、參考信號產生器27 及相機信號處理器810外,另包含攝影鏡頭8 02、光學低 通濾鏡804或紅外線截止濾鏡80 5,這些較佳被形成一具 有攝像功能並包含此等構件爲一包裝的模組。 上述固態攝像裝置1可以被提供爲具有攝像功能的模 組,如圖所示,其包含像素陣列單元1〇(攝像單元)及密切 相關像素陣列單元1 0之信號處理器(除了在行處理器26 下一級的相機信號處理單元)側包含被提供有A/D轉換功 能及差値(CDS)處理功能的行處理器26作爲一封裝。整個 攝像裝置8可以藉由提供相機信號處理器8 1 0爲在模組形 式之固態攝像裝置1的下一級的信號處理器的其他部份。 或者,雖然未顯示出,但整個攝像裝置8可以藉由將 相機信號處理器8 1 0整合入具有攝像功能的模組形固態攝 像裝置1,其中像素陣列單元1 0及例如攝像鏡頭802的光 學系統係被封裝在一起。 再者’在固態攝像裝置1的模組中,可以包含對應於 相機信號處理器2 0 0的相機信號處理器8 1 0。在此時,有 可能將固態攝像裝置1與攝像裝置8認爲相同。 此攝像裝置8被提供有用以執行,,攝像”的行動裝置, -106- 200845735 例如一相機或具有攝像功能的行動設備。在本說明書中, ”攝像”不只表示爲相機所捕捉之正常影像,也可用於指紋 之檢測。 被架構如上之攝像裝置8包含所有前述固態攝像裝置 1的功能,基本架構及操作係被作成與上述固態攝像裝置 1者相同。因此,在攝像裝置8中,因爲加權相加可以被 執行,以改變在相加後之像素的空間位置’有可能完成一 較對所有均勻係數執行簡單相加所能取得爲高之解析度的 機制。 例如,使得電腦執行上述處理的程式係使用例如快閃 記憶體、1C卡之記錄媒體,或例如微型卡之非揮發半導體 記憶體卡加以分佈。再者,程式可以經由一通訊網路’例 如網際網路由伺服器下載或更新。 有可能儲存在這些實施例中所述之固態攝像裝置1的 部份處理或所有功能(特別是有關於實施高速A/D轉換之 處理的功能,其中參考信號Vslop之斜率變化控制及計數 器分頻操作之變速控制係被彼此配合執行)於1C卡或例如 微型卡之半導體記憶體,作爲記錄媒924之例子。因此, 有可能提供程式或儲存有程式之記錄媒體。類似於在固態 攝像裝置1之說明中所述之高速A/D轉換的處理,例如’ 一實施高速A/D轉換的程式,即予以安裝在RAM9 06中之 軟體等具有控制脈衝設定功能,用以實施高速A/D轉換爲 軟體,其中彼此配合有參考信號Vslop之斜率變化控制及 計數器分頻操作之速度變化控制。 -107- 200845735 軟體係爲RAM906所讀1並爲微處理器902所執行。 例如,微處理器902根據儲存在例如記錄媒體之ROM904 與RAM906中之程式,執行控制脈衝設定處理,以控制選 擇予以相加之列或行的操作,計數器分頻速度的調整與參 考信號Vslop斜率之調整(變化)的彼此配合。因此,有可 能完成一功能作爲軟體,用以改變相加後之像素的空間位 置,以相較於執行簡單相加之所有係數爲均勻者取得高解 析度的影像。 依據本發明一實施例,因爲加權値可以配合選擇相加 目標像素之選擇操作加以設定,所以,相加後之像素位置 可以藉由設定適當加權値加以調整,以最小化解析度之劣 化。結果,有可能取得高解析度之影像。 應爲熟習於本技藝者所了解,各種修改、組合、次組 合及變化可以取決於設計需要及其他因素下加以發生,這 些係在隨附申請專利範圍或其等效範圍下。 [相關申請案]本案包含分別申請於2007年1月17日 及2007年11月9日之日本專利申請JP2007-008 1 04及 JP20 07-2 9 1 467,這些案係倂入作爲參考。 【圖式簡單說明】 圖1爲依據本發明實施例之CMOS固態攝像裝置示意 圖; 圖2爲用於圖1之固態攝像裝置中之單位像素的架構 例及驅動單元、驅動控制線、及像素電晶體間之線連接; -108- 200845735 圖3爲一圖,顯示在電壓比較器與計數部旁之連接介 面例; 圖4爲一圖,顯示一計數執行單元的第一架構例; 圖5爲一圖,顯示計數執行單元的第二架構例; 圖ό爲一時序圖,顯示信號取得相加處理,其係爲示 於圖1之固態攝像裝置的行A/D電路的基本操作; 圖7爲一時序圖,顯示並聯於A/D轉換處理操作之垂 直方向中之相加處理; 圖8 A-8 D爲圖,顯示以計數器在垂直方向中之數位相 加處理及以數位算術單元在水平方向之數位相加處理的缺 點; 圖9爲一時序圖(第一例),顯示在第一實施例之改良 解析度方法中,並聯於A/D轉換處理操作之垂直方向中之 加權相加處理; 圖10爲一時序圖(第二例),顯示在第一實施例之改良 解析度方法中,並聯於A/D轉換處理操作之垂直方向中之 加權相加處理; 圖1 1爲一圖,顯示第一實施例之解析度改良方法中 之計數時鐘開關時的作用; 圖12Α至12F爲圖(第一例),顯示在第一實施例之解 析度改良方法中之垂直方向與水平方向中之相加操作自勺f象 素配置; 圖1 3 A至1 3 F爲圖(第二例),顯示在第一實施例之解 析度改良方法中之垂直方向與水平方向中之#力卩_丨乍自勺f象 -109- 200845735 素配置; 圖14A至14F爲圖(第三.例),顯示在第一實施例之解 析度改良方法中之垂直方向與水平方向中之相加操作的像 素配置; 圖1 5爲一圖,顯示用以設定任意整數之加權値的機 制例; 圖16A至16F爲圖,顯示”比例3至1之相加+比例1 至3之相加”,其中加權値被設定至”3 ” ; 圖17A至17F爲圖,顯示”比例4至1之相加+比例1 至4之相加”,其中加權値被設定爲”4” ; 圖18A至18C爲圖,顯示一種縮短在單斜率積分A/D 轉換系統之比較處理時間的方法; 圖1 9爲一*時序圖’顯不並聯於A / D轉換處理的垂直 方向中之相加處理,其用以解釋第二實施例; 圖2 0爲一圖,顯示當計時時鐘開關被操作於第二實 施例之解析度改良方法中的作用; 圖2 1爲一圖,顯示在參考信號的斜率改變控制與計 數器的分頻速度控制間之關係; 圖22 A至22B爲圖,顯示以該計數器解決在垂直方向 中之數位相加處理及以數位算術單元在水平方向中之數位 相加處理的解析度降低的方法之第三實施例;及 圖2 3爲一圖,顯示利用類似於固態攝像裝置的攝像 設備的架構。 -110- 200845735 【主要元件符號說明】 1 :固態攝像裝置 3 :單元像素 5a :端子 5 b :端 5 c :端 1 0 :像素陣列單元 1 2 :水平掃描電路 12a :水平解碼器 12b :水平驅動單元 12c :控制線 1 4 :垂直掃描電路 14a :垂直解碼器 14b :垂直驅動單元 1 5 :列控制線 1 8 :水平信號線 1 9 :垂直信號線 20 :通訊/時序控制器 23 :時鐘轉換器 24 :讀出電流供給 25 :行A/D電路 26 :行處理器 27 :參考信號產生器 27a :數位類比轉換器 -111 200845735 2 8 :輸出電路 29 :數位算術單元 7 :驅動控制器 2 5 2 :電壓比較器 2 5 4 :計數器 256 :資料儲存單元 2 5 8 :開關 3 2 :電荷產生器 3 4 :讀出選擇電晶體 3 6 :重置電晶體 3 8 :浮置擴散 40 :垂直選擇電晶體 42 :源極跟隨放大電晶體 5 2 :垂直選擇線 5 5 :傳送線 5 6 :重置線 5 :像素信號產生器 5 1 :像素線 242: NMOS電晶體 244 :參考電流源 246 :電流產生器 248 :源極線 5 02 :閘 5 04 :計數執行單元 200845735 510 :正反器 5 1 2 :資料保持單元 5 1 4 :計數模式開關 5 1 6 :計數時鐘開關 5 1 7 :計數時鐘線 5 1 8 :時鐘停止單元 8 =攝像裝置 924 :記錄媒體 802 :攝影鏡頭 8 04 :光學低通濾鏡 8 05 :紅外線截止濾鏡 8 1 〇 :相機信號處理器 8 1 2 :濾色群 820 :攝像信號處理器 8 22 :信號分離器 8 3 0 :彩色信號處理器 840 :亮度信號處理器 8 6 0 :編碼器 900 :相機控制器 902 :微處理器 904 :唯讀記憶體 906 :隨機存取記憶體 907 :記憶體讀出單元 908 :通訊介面Furthermore, the image signal processor 820 has a brightness signal 840 for performing signal processing on the luminance signal Y according to the three primary colors ff and B separated by the signal separator 822, and an encoder for sensing the luminance signal Y/color signal. C Generating Video Image VD Although not shown, the color signal processor 830 has an example amplifier, a gamma correction unit, and a color difference matrix unit. White Balance R, G, B Line Processor C D S Processing The reference signal starts from the infrared of the frequency of the frequency of 1 2 6 . This system 810 has a main control color signal for the processor 26: R (red) processor! No. R, G 8 60, such as white balance amplifier root -102- 200845735 according to white since not displayed Balancing the gain signal supplied by the controller, adjusting (white balance adjustment) the gain of the three primary color signals supplied by the three primary color separation function units in the signal separator 822, and supplying the adjusted gain to the gamma correction unit and the luminance signal processor 840. The gamma correction (r) is performed to generate an accurate color according to the adjusted white balance primary color signal, and the gamma correction output signal for each color R, G, B is input to the color difference matrix unit . The color difference matrix unit performs color difference matrix processing and inputs the obtained color difference signals R-Y, B-Y to the encoder 860. Although not shown, the luminance signal processor 804 has, for example, a high frequency luminance signal generator, a low frequency luminance signal generator, and a luminance signal generator. The high frequency luminance signal generator generates a luminance signal YH containing a relatively high frequency component depending on the primary color signal supplied from the primary color separation function unit of the demultiplexer 822. The low frequency luminance signal generator depends on the white balance primary color signal supplied from the white balance amplifier to produce a luminance signal YL containing only low frequency components. The luminance signal generator generates a luminance signal Y depending on the two types of luminance signals YH, YL, and supplies the luminance signal Y to the encoder 860. The encoder 860 digitally adjusts the color difference signals RY, BY using digital signals corresponding to the sub-carriers of the color signals, and combines them to the luminance signal Y generated by the luminance signal processor 840, and converts them into digital bits. Video signal VD (= Y + S + C ; S is the sync signal; C is the chrominance signal). The digital video signal VD outputted from the encoder 860 is supplied to a camera signal output unit which is not displayed at the lower level, and then used as a monitor output or as data recorded in a recording medium. At this time, if it is necessary -103- 200845735, the digital video signal VD is converted into a video signal via D/A conversion. The camera controller 900 in this embodiment has a microprocessor 902, which is the core of the computer, and is represented as a central processing unit (CPU), which integrates the functions of operation and control performed by the computer and is Integrated on an ultra-small integrated circuit; a read-only memory (R〇M) 904 as a dedicated read-out memory; a random access memory (RAM) 906, which is a volatile memory Examples can be used to write and read as needed; and other peripheral components that are not visible. The microprocessor 902, the ROM 904, and the RAM 906 are collectively referred to as a microcomputer. In the above, "volatile memory" means a memory device that erases memory contents when the device is powered off. On the other hand, non-volatile memory is a memory device that retains memory contents even when the device's main computer is powered off. In the memory device, not only the non-volatile semiconductor memory device' but also any memory device can be used as long as they can hold the contents of the memory. Alternatively, it may be used as a non-volatile memory in addition to a non-volatile semiconductor memory. Furthermore, the memory is not limited to a semiconductor memory device, and a media architecture such as a magnetic disk or a compact disk can also be used. For example, a hard disk can also be used as a non-volatile memory. Furthermore, it is also possible to use an architecture as a non-volatile memory' in which information is read from a recording medium such as c D - R 〇 相机 The camera controller 900 controls the entire system. In particular, in the aforementioned processing for completing the high-speed A/D conversion processing, the camera controller 9 has an on/off function for adjusting various control pulses, and various pulses are used in the reference signal generator. Control of the slope change of the reference signal Vslop and control of the frequency division speed in the counter 254. In the ROM 9 04, a control program of the camera controller 9 is stored, and in particular, in this example, a program for controlling the on/off timing of various control pulses of the camera controller 900 is stored. In the RAM 906, various materials processed for the camera controller 9 are stored. Further, the camera controller 900 can insert or remove a recording medium 924, such as a memory card, and connect to a communication network such as the Internet. For example, in addition to the microprocessor 902, the ROM 904, and the RAM 906, the camera controller 900 has a memory reading unit 907 and a communication I/F (interface) 90 8 〇 recording medium 924 for storing data, such as program data, to The microprocessor 902 is caused to perform software processing according to the brightness system signal supplied from the brightness signal processor 840, and various settings, such as a flux range of the optical data DL and an exposure control process (including an electric shutter control), and The slope of the reference signal Vslop in the signal generator 27 changes the η/off timing of the various control pulses controlled by the divided frequency in the counter 254. The memory readout unit 907 stores (installs) the data read from the recording medium 924 to the RAM 906. The communication I/F 90 8 connects and transmits data between communication networks, such as the Internet. In this image pickup device 8, the drive controller 7 and the line processor 26 are displayed in a module separate from the pixel array unit 10. However, it is needless to say that, in the description of the solid-state image pickup device 1, it is possible to use the single crystal solid-state image pickup device 1, in which the drive controller 7 and the line processor 26 are integrated on the same semiconductor substrate, The pixel array unit 10 is also mounted therein, and the image pickup device 8 has an optical system, except for the pixel array unit 1 , the drive controller 7, the line processor 26, the reference signal generator 27, and the camera signal processor 810. Further, a photographic lens 082, an optical low-pass filter 804 or an infrared cut-off filter 805 are included, which are preferably formed into a module having an imaging function and including such components as a package. The solid-state imaging device 1 described above may be provided as a module having an imaging function, as shown, including a pixel array unit 1 (imaging unit) and a signal processor of the closely related pixel array unit 10 (except in the line processor) The side of the camera signal processing unit of the next stage includes a line processor 26 provided with an A/D conversion function and a credit (CDS) processing function as a package. The entire camera unit 8 can be provided as the other part of the signal processor of the next stage of the solid-state image pickup apparatus 1 in the form of a module by providing the camera signal processor 81. Alternatively, although not shown, the entire imaging device 8 can be integrated into the module-shaped solid-state imaging device 1 having an imaging function by the camera signal processor 81, wherein the pixel array unit 10 and the optical lens such as the imaging lens 802 The system is packaged together. Further, in the module of the solid-state image pickup device 1, a camera signal processor 810 corresponding to the camera signal processor 200 may be included. At this time, it is possible to think that the solid-state imaging device 1 and the imaging device 8 are identical. The camera device 8 is provided with a mobile device for performing, imaging, -106- 200845735 such as a camera or a mobile device having a camera function. In the present specification, "camera" is not only represented as a normal image captured by the camera, It can also be used for the detection of fingerprints. The imaging device 8 constructed as above includes the functions of all the aforementioned solid-state imaging devices 1, and the basic architecture and operation are made the same as those of the above-described solid-state imaging device 1. Therefore, in the imaging device 8, because of the weighting The addition can be performed to change the spatial position of the pixels after the addition. It is possible to complete a mechanism that achieves a higher resolution than performing simple addition on all uniform coefficients. For example, causing a computer to perform the above processing The program is distributed using a recording medium such as a flash memory, a 1C card, or a non-volatile semiconductor memory card such as a micro card. Further, the program can be downloaded or updated via a communication network such as an Internet routing server. It is possible to store part of the processing or all functions of the solid-state image pickup device 1 described in the embodiments ( There is a function for performing high-speed A/D conversion processing, in which the slope change control of the reference signal Vslop and the shift control of the counter frequency division operation are performed in cooperation with each other) in a 1C card or a semiconductor memory such as a micro card, An example of the recording medium 924. Therefore, it is possible to provide a program or a recording medium storing the program. Similar to the processing of the high-speed A/D conversion described in the description of the solid-state image pickup device 1, for example, "I implement high-speed A/D conversion" The program, that is, the software installed in the RAM9 06 has a control pulse setting function for implementing high-speed A/D conversion to software, in which the slope change control of the reference signal Vslop and the speed change control of the counter division operation are matched with each other. -107- 200845735 The soft system reads 1 for RAM 906 and is executed by microprocessor 902. For example, microprocessor 902 performs control pulse setting processing to control selection based on programs stored in, for example, ROM 904 and RAM 906 of the recording medium. The operation of adding the column or row, the adjustment of the crossover speed of the counter and the adjustment (change) of the slope of the reference signal Vslop Therefore, it is possible to complete a function as a software for changing the spatial position of the added pixels to obtain a high-resolution image compared to all of the coefficients performing simple addition. In the embodiment, since the weighting 値 can be set in accordance with the selection operation of selecting the addition target pixel, the added pixel position can be adjusted by setting an appropriate weight 値 to minimize the degradation of the resolution. As a result, it is possible to obtain High-resolution images. It should be understood by those skilled in the art that various modifications, combinations, sub-combinations and variations may occur depending on design requirements and other factors, which are within the scope of the accompanying claims or their equivalents. [Related Applications] This application contains Japanese patent applications JP2007-008 1 04 and JP20 07-2 9 1 467, respectively, which were filed on January 17, 2007 and November 9, 2007, respectively. . BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic diagram of a CMOS solid-state imaging device according to an embodiment of the present invention; FIG. 2 is a structural example of a unit pixel used in the solid-state imaging device of FIG. 1 and a driving unit, a driving control line, and a pixel battery Line connection between crystals; -108- 200845735 Figure 3 is a diagram showing an example of a connection interface beside the voltage comparator and the counting section; Figure 4 is a diagram showing a first architecture example of a counting execution unit; A diagram showing a second architecture example of the counting execution unit; FIG. ό is a timing diagram showing the signal acquisition addition processing, which is the basic operation of the row A/D circuit of the solid-state image pickup device shown in FIG. 1; For a timing diagram, the addition processing in parallel in the vertical direction of the A/D conversion processing operation is shown; FIG. 8A-8D is a diagram showing the digital addition processing of the counter in the vertical direction and the digital arithmetic unit Disadvantages of the digital addition processing in the horizontal direction; FIG. 9 is a timing chart (first example) showing the weighted phase in parallel in the vertical direction of the A/D conversion processing operation in the improved resolution method of the first embodiment Add processing Figure 10 is a timing chart (second example) showing the weighted addition processing in parallel in the vertical direction of the A/D conversion processing operation in the improved resolution method of the first embodiment; Figure 11 is a diagram, The function of the count clock switch in the resolution improvement method of the first embodiment is shown; FIGS. 12A to 12F are diagrams (first example), which are shown in the vertical direction and the horizontal direction in the resolution improvement method of the first embodiment. The addition operation is performed from the spoon f pixel configuration; Fig. 1 3 A to 1 3 F is a diagram (second example), showing the vertical direction and the horizontal direction in the resolution improvement method of the first embodiment. _ 丨乍 丨乍 f 象 - 109 - 200845735 prime configuration; Figs. 14A to 14F are diagrams (third example), showing the addition operation in the vertical direction and the horizontal direction in the resolution improvement method of the first embodiment Pixel configuration; FIG. 15 is a diagram showing an example of a mechanism for setting a weighted 任意 of an arbitrary integer; FIGS. 16A to 16F are diagrams showing "addition of ratios 3 to 1 + addition of ratios 1 to 3", Wherein the weighting 値 is set to "3"; Figures 17A to 17F are diagrams showing " Addition of Examples 4 to 1 + Addition of Ratios 1 to 4, where the weighting 値 is set to "4"; Figures 18A to 18C are diagrams showing a comparison processing time for shortening the single-slope integral A/D conversion system The method of FIG. 9 is a *time sequence diagram 'additional processing in the vertical direction of the A / D conversion processing, which is used in parallel to explain the second embodiment; FIG. 20 is a diagram showing the timing clock The switch is operated in the resolution improvement method of the second embodiment; Fig. 21 is a diagram showing the relationship between the slope change control of the reference signal and the frequency division speed control of the counter; Fig. 22 A to 22B are diagrams a third embodiment of a method for solving the digital addition processing in the vertical direction and the resolution reduction of the digital addition processing in the horizontal direction by the counter; and FIG. 23 is a diagram showing An architecture of an image pickup apparatus similar to a solid-state image pickup device is utilized. -110- 200845735 [Description of main component symbols] 1: Solid-state imaging device 3: unit pixel 5a: terminal 5b: terminal 5c: terminal 1 0: pixel array unit 1 2: horizontal scanning circuit 12a: horizontal decoder 12b: horizontal Drive unit 12c: control line 14: vertical scan circuit 14a: vertical decoder 14b: vertical drive unit 15: column control line 18: horizontal signal line 1 9: vertical signal line 20: communication/timing controller 23: clock Converter 24: Read Current Supply 25: Row A/D Circuit 26: Line Processor 27: Reference Signal Generator 27a: Digital Analog Converter - 111 200845735 2 8 : Output Circuit 29: Digital Arithmetic Unit 7: Drive Controller 2 5 2 : Voltage comparator 2 5 4 : Counter 256 : Data storage unit 2 5 8 : Switch 3 2 : Charge generator 3 4 : Read selection transistor 3 6 : Reset transistor 3 8 : Floating diffusion 40 : Vertical selection transistor 42 : Source follower amplification transistor 5 2 : Vertical selection line 5 5 : Transmission line 5 6 : Reset line 5 : Pixel signal generator 5 1 : Pixel line 242 : NMOS transistor 244 : Reference current Source 246: Current Generator 248: Source Line 5 02: Gate 5 04: Counting Line unit 200845735 510: flip-flop 5 1 2 : data holding unit 5 1 4 : counting mode switch 5 1 6 : counting clock switch 5 1 7 : counting clock line 5 1 8 : clock stop unit 8 = camera 924 : recording Media 802: Photographic lens 8 04: Optical low-pass filter 8 05: Infrared cut filter 8 1 〇: Camera signal processor 8 1 2: Filter group 820: Camera signal processor 8 22: Signal separator 8 3 0 Color Signal Processor 840: Brightness Signal Processor 860: Encoder 900: Camera Controller 902: Microprocessor 904: Read Only Memory 906: Random Access Memory 907: Memory Read Unit 908: Communication interface

Claims (1)

200845735 十、申請專利範圍 1 · 一種固態攝像裝置,包含: 一比較器,用以依序比較自多數像素取得之類比像素 信號的預定位準與一參考信號,該參考信號係被逐漸改變 並用以轉換該預定位準成爲數位資料; 一計數器,用以並行於該比較器中之該預定位準的比 較處理,執行一計數處理,並在該比較處理完成時,保持 一計數値,以取得數位資料,其表示藉由相加該多數像素 信號所取得之一値;及 一相加空間位置調整單元,用以控制予以在該比較器 中處理的該多數像素的選擇空間位置之選擇操作及相加時 加權値的比例,以調整在相加後之像素的空間位置。 2 ·如申請專利範圍第1項所述之固態攝像裝置,其中 該相加空間位置調整控在該相加時之該加權値的該比例, 使得在該相加後的每一像素的該空間位置係被安排成相等 間距。 3 ·如申請專利範圍第2項所述之固態攝像裝置,其中 該像素設有一彩色濾鏡,用以產生彩色影像,及 _ #力卩¥間位置調整單元控制予以在該比較器中處理 白勺該多數像素的該空間位置的選擇之選擇操作,使得具有 相同顏色的該像素被相加,並控制在該相加時之該加權値 白勺該比例’使得每一像素的該空間位置係被安排成相等間 距。 -114- 200845735 4·如申請專利範圍第1項所述之固態攝像裝置,其中 該相加空間位置調整單元改變用於該比較器中之該參考信 號的斜率至” 1 /L2倍”大,以設定在該相加時之該加權値的 該比例至”L2”倍快。 5 ·如申請專利範圍第1項所述之固態攝像裝置,其中 該相加空間位置調整單元改變在該計數器中之分頻操作的 速度至”L 1 ”倍快’以設定在該相加時之該加權値的該比例 至”L1”倍大。 6 ·如申請專利範圍第4或5項所述之固態攝像裝置, 其中該相加空間調整單元對在該比較器中之某些像素的該 預定位準的該比較處理完成前,改變該參考信號的該斜率 至J倍大’並改變在該計數器中之該分頻操作的該速度至 J倍快,以保持某一像素的加權値爲定値。 7 ·如申請專利範圍第6項所述之固態攝像裝置,其中 該相加空間位置調整單元同時於改變該參考信號的該斜率 J倍大,控制在該計數器中之每一位元輸出的該分頻操作 的該速度的變化。 8.如申請專利範圍第5,6或7項中任一項所述之固 態攝像裝置,其中: 該計數器係爲非同步計數器並具有一計時時鐘開關’ 安置在每一位元的級之間’用以切換一輸入時鐘信號’及 該相加空間位置調整單元控制該計數時鐘開關’以當 該分頻操作的該速度改變時,傳送予以輸入至每一位元的 時鐘信號作爲高階位元時鐘信號° -115- 200845735 9 ·如申請專利範圍第1項所述之固態攝像裝置,其中 :該計數器於處理某一像素的該像素信號的一第一預定位 準時,以下數模式或上數模式之一,執行計數處理並保持 在該比較器內完成該比較處理時的一計數値,並在處理該 相同像素的該像素信號的一第二預定位準時,藉由使用該 所保持之計數値作爲開始點,以該下數模式或該上數模式 之另一模式執行該計數處理並保持在該比較器內完成該比 較處理時的該計數値。 1 0 ·如申請專利範圍第9項所述之固態攝像裝置,其 中該計數器保持在該某一像素的該像素信號的該第二預定 位準的比較處理完成時的計數値,並當下一像素的該像素 信號的該第一預定位準與該第二預定位準相比較時,該計 數器以相同於該某一像素之該像素信號的計數模式切換的 方式,藉由使用保持在該計數器中之該計數値作爲開始點 ,而執行該計數處理,以取得表示藉由相加該多數像素信 號所得到之一値的數位資料。 1 1 .如申請專利範圍第1項所述之固態攝像裝置,其 中多數前述比較器使用共用的該參考信號,並行於予以爲 每一比較器所處理的該像素信號,執行該比較處理。 12.—種攝像裝置,包含: 一比較器,用以依序比較自多數像素所取得之一類比 像素信號的預定位準與一參考信號,該參考信號係被逐漸 改變並被用以將該預定位準轉換爲數位資料; 一計數器,用以並行於該比較器中之該預定位準的該 -116- 200845735 比較處理,執行一計數處理’並保持在完成該比較處理時 之計數値,以取得表示相加該多數像素信號所得之値的數 位資料;及 一相加空間位置調整單元,用以控制予以在該比較器 中處理的該多數像素的空間位置的選擇之選擇操作及在相 加時的加權値的比例,以調整在相加後的像素之空間位置 ;及 一控制器,用以控制一控制信號的產生,該控制信號 係用控制該相加空間位置調整單元。 -117-200845735 X. Patent Application No. 1 · A solid-state imaging device comprising: a comparator for sequentially comparing a predetermined level of an analog pixel signal obtained from a plurality of pixels with a reference signal, the reference signal being gradually changed and used Converting the predetermined level into digital data; a counter for performing a counting process in parallel with the predetermined processing in the comparator, and maintaining a count 値 to obtain a digital bit when the comparing process is completed Data, which is obtained by adding the majority of the pixel signals; and an addition spatial position adjustment unit for controlling the selection operation and phase of the selected spatial position of the majority of pixels processed in the comparator The ratio of time-weighted 値 is adjusted to adjust the spatial position of the added pixels. 2. The solid-state image pickup device according to claim 1, wherein the addition spatial position adjusts the ratio of the weighted 在 at the time of addition such that the space of each pixel after the addition The position systems are arranged at equal intervals. 3. The solid-state image pickup device according to claim 2, wherein the pixel is provided with a color filter for generating a color image, and the position adjustment unit is controlled to process white in the comparator. Choosing a selection operation of the spatial position of the plurality of pixels such that the pixels having the same color are added, and controlling the weighting of the ratio at the time of the addition such that the spatial position of each pixel is Arranged to be equally spaced. The solid-state image pickup device according to claim 1, wherein the addition spatial position adjustment unit changes a slope of the reference signal used in the comparator to "1 / L2 times", The ratio of the weighted 设定 set at the time of addition is as fast as "L2". 5. The solid-state image pickup device of claim 1, wherein the addition space position adjustment unit changes a speed of the frequency division operation in the counter to "L1" times faster to set at the time of the addition. The ratio of the weighted 値 is greater than "L1". 6. The solid-state image pickup device of claim 4, wherein the addition space adjustment unit changes the reference before the comparison processing of the predetermined level of some pixels in the comparator is completed. The slope of the signal is greater than J times' and the speed of the frequency division operation in the counter is changed to J times faster to keep the weighting of a certain pixel constant. The solid-state image pickup device according to claim 6, wherein the addition spatial position adjustment unit simultaneously changes the slope of the reference signal by J times, and controls the output of each bit in the counter. The change in speed of the frequency division operation. 8. The solid-state image pickup device according to any one of claims 5, 6 or 7, wherein: the counter is an asynchronous counter and has a chronograph clock switch disposed between each bit level 'switching an input clock signal' and the addition space position adjusting unit controls the count clock switch 'to transmit a clock signal input to each bit as a high order bit when the speed of the frequency dividing operation is changed The solid-state image pickup device according to claim 1, wherein the counter is in a first predetermined level when processing a pixel signal of a certain pixel, the following number mode or number One of the modes, performing a counting process and maintaining a count 时 when the comparison process is completed in the comparator, and by using the held count when processing a second predetermined level of the pixel signal of the same pixel値 as a starting point, performing the counting process in the lower mode or another mode of the upper mode and maintaining the count when the comparison process is completed in the comparator値The solid-state image pickup device according to claim 9, wherein the counter maintains a count 値 at the completion of the comparison processing of the second predetermined level of the pixel signal of the certain pixel, and is the next pixel When the first predetermined level of the pixel signal is compared with the second predetermined level, the counter is held in the counter by using the same manner as the counting mode of the pixel signal of the certain pixel The count 値 is used as a starting point, and the counting process is performed to obtain digital data indicating one of the 値 obtained by adding the majority of the pixel signals. A solid-state image pickup device according to claim 1, wherein a plurality of the aforementioned comparators use the common reference signal, and the comparison processing is performed in parallel with the pixel signal to be processed for each comparator. 12. A camera device comprising: a comparator for sequentially comparing a predetermined level of an analog pixel signal obtained from a plurality of pixels with a reference signal, the reference signal being gradually changed and used to Pre-positioning is quasi-converted into digital data; a counter is used for parallel processing of the -116-200845735 comparison processing of the predetermined level in the comparator, performing a counting process 'and maintaining the count when the comparison processing is completed, Obtaining digital data indicating that the majority of the pixel signals are added; and an adding spatial position adjusting unit for controlling a selection operation of the spatial position of the majority of pixels processed in the comparator and The ratio of the weighted 値 of the time is added to adjust the spatial position of the added pixels; and a controller for controlling the generation of a control signal for controlling the added spatial position adjusting unit. -117-
TW096148102A 2007-01-17 2007-12-14 Solid-state imaging device and imaging apparatus TWI364980B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007008104 2007-01-17
JP2007291467A JP4786631B2 (en) 2007-01-17 2007-11-09 Solid-state imaging device, imaging device

Publications (2)

Publication Number Publication Date
TW200845735A true TW200845735A (en) 2008-11-16
TWI364980B TWI364980B (en) 2012-05-21

Family

ID=39758092

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096148102A TWI364980B (en) 2007-01-17 2007-12-14 Solid-state imaging device and imaging apparatus

Country Status (4)

Country Link
JP (2) JP4786631B2 (en)
KR (1) KR101439227B1 (en)
CN (1) CN101227551B (en)
TW (1) TWI364980B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI650951B (en) * 2017-01-30 2019-02-11 美商科點半導體有限公司 AD conversion device and imaging device

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101520665B1 (en) 2008-07-14 2015-05-15 엘지전자 주식회사 A method to control for cloth treating apparutus
JP5317591B2 (en) * 2008-09-01 2013-10-16 キヤノン株式会社 Imaging device
JP5165520B2 (en) 2008-10-01 2013-03-21 ソニー株式会社 Solid-state imaging device, imaging device, and AD conversion method for solid-state imaging device
JP4640507B2 (en) * 2009-01-06 2011-03-02 ソニー株式会社 Solid-state imaging device, signal processing method for solid-state imaging device, and imaging device
JP5636694B2 (en) * 2009-04-03 2014-12-10 ソニー株式会社 Electronic device, AD converter, AD conversion method
WO2010137244A1 (en) * 2009-05-29 2010-12-02 パナソニック株式会社 Solid-state image pickup device and camera
JP5220777B2 (en) * 2010-01-21 2013-06-26 オリンパス株式会社 Image processing apparatus, imaging apparatus, program, and image processing method
JP2011248576A (en) * 2010-05-26 2011-12-08 Olympus Corp Image processing device, imaging device, program and image processing method
WO2012144215A1 (en) * 2011-04-21 2012-10-26 パナソニック株式会社 Solid-state image pickup device
JP5871531B2 (en) * 2011-09-08 2016-03-01 キヤノン株式会社 Imaging apparatus and imaging system
US8730081B2 (en) * 2012-03-19 2014-05-20 Omnivision Technologies, Inc. Calibration in multiple slope column parallel analog-to-digital conversion for image sensors
KR101893406B1 (en) * 2012-03-28 2018-08-30 삼성전자 주식회사 Apparatus and mehod for processing a image in camera device
FR2989219B1 (en) 2012-04-04 2015-05-29 Commissariat Energie Atomique PROCESSING CIRCUIT OF PIXELS
JP6037170B2 (en) * 2013-04-16 2016-11-30 ソニー株式会社 SOLID-STATE IMAGING DEVICE, ITS SIGNAL PROCESSING METHOD, AND ELECTRONIC DEVICE
CN105378508B (en) * 2013-05-10 2019-09-03 皇家飞利浦有限公司 Direct Conversion Radiation Detectors Digital Signal Processing Electronics
JP6494160B2 (en) * 2013-12-27 2019-04-03 キヤノン株式会社 Imaging apparatus and control method thereof
JP6463002B2 (en) * 2014-05-08 2019-01-30 キヤノン株式会社 Driving method of imaging apparatus and driving method of imaging system
KR102326607B1 (en) * 2014-07-14 2021-11-16 소니그룹주식회사 Comparator, ad converter, solid-state image pickup device, electronic apparatus, and method for controlling comparator
KR102261595B1 (en) * 2014-09-19 2021-06-04 삼성전자주식회사 An image sensor, and an image processing system including the same
JP6135797B2 (en) * 2016-05-09 2017-05-31 ソニー株式会社 Solid-state imaging device
JP6701001B2 (en) * 2016-06-22 2020-05-27 キヤノン株式会社 Imaging device, control method thereof, program, and storage medium
JP2019153822A (en) * 2016-07-13 2019-09-12 ソニーセミコンダクタソリューションズ株式会社 Solid state imaging device, and control method of solid state imaging device
CN106303313B (en) * 2016-08-12 2019-04-30 中国科学院上海高等研究院 Quantization Summation Circuit of Compressed Sensing CMOS Image Sensor
CN107680030B (en) * 2017-09-21 2020-10-30 中国科学院半导体研究所 An image processor and processing method
JP6704893B2 (en) * 2017-11-30 2020-06-03 キヤノン株式会社 Solid-state imaging device, imaging system, and method for driving solid-state imaging device
KR102507628B1 (en) 2018-04-24 2023-03-09 에스케이하이닉스 주식회사 Ramp Signal Generator, and CMOS Image Sensor Using That
KR102851369B1 (en) * 2020-06-26 2025-08-26 삼성전자주식회사 Image sensor and binning method thereof

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4560205B2 (en) * 2000-12-18 2010-10-13 キヤノン株式会社 A / D converter and solid-state imaging device using the same
JP2004147092A (en) * 2002-10-24 2004-05-20 Canon Inc Signal processing device, imaging device, and control method
JP4086618B2 (en) * 2002-10-24 2008-05-14 キヤノン株式会社 Signal processing apparatus and method
JP4193768B2 (en) * 2004-07-16 2008-12-10 ソニー株式会社 Data processing method, physical quantity distribution detection semiconductor device and electronic apparatus
JP4380439B2 (en) * 2004-07-16 2009-12-09 ソニー株式会社 Data processing method, data processing apparatus, semiconductor device for detecting physical quantity distribution, and electronic apparatus
JP4306603B2 (en) * 2004-12-20 2009-08-05 ソニー株式会社 Solid-state imaging device and driving method of solid-state imaging device
JP2008136043A (en) * 2006-11-29 2008-06-12 Sony Corp Solid-state imaging device and imaging device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI650951B (en) * 2017-01-30 2019-02-11 美商科點半導體有限公司 AD conversion device and imaging device

Also Published As

Publication number Publication date
JP2009284553A (en) 2009-12-03
JP4952758B2 (en) 2012-06-13
CN101227551A (en) 2008-07-23
JP4786631B2 (en) 2011-10-05
TWI364980B (en) 2012-05-21
KR101439227B1 (en) 2014-09-12
KR20080067963A (en) 2008-07-22
JP2008199581A (en) 2008-08-28
CN101227551B (en) 2013-11-20

Similar Documents

Publication Publication Date Title
TWI364980B (en) Solid-state imaging device and imaging apparatus
JP5347341B2 (en) Solid-state imaging device, imaging device, electronic device, AD conversion device, AD conversion method
US8237808B2 (en) Solid state imaging device and imaging apparatus adjusting the spatial positions of pixels after addition by controlling the ratio of weight values during addition
KR101450718B1 (en) Data processing method, data processing device, solid-state imaging device, imaging apparatus, and electronic device
US9374097B2 (en) Data processor, solid-state imaging device, imaging device, and electronic apparatus
US7859583B2 (en) Solid-state image capture device, analog/digital conversion method for solid state image capture device, and image capture device
JP4449565B2 (en) Semiconductor device for physical quantity distribution detection
US8063960B2 (en) Solid-state imaging device and apparatus with an increased speed of analog to digital conversion
CN103297724B (en) Imaging device, imaging system and imaging device driving method
KR101188598B1 (en) Image processing method, semiconductor device for detecting physical quantity distribution, and electronic apparatus
US8963758B2 (en) Image sensor and image capturing apparatus
JP4403402B2 (en) AD conversion method, AD conversion apparatus, physical information acquisition method, and physical information acquisition apparatus

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees