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TW200833745A - Prepreg, laminate and printed wiring board - Google Patents

Prepreg, laminate and printed wiring board

Info

Publication number
TW200833745A
TW200833745A TW096128613A TW96128613A TW200833745A TW 200833745 A TW200833745 A TW 200833745A TW 096128613 A TW096128613 A TW 096128613A TW 96128613 A TW96128613 A TW 96128613A TW 200833745 A TW200833745 A TW 200833745A
Authority
TW
Taiwan
Prior art keywords
prepreg
wiring board
printed wiring
epoxy resin
laminate
Prior art date
Application number
TW096128613A
Other languages
English (en)
Inventor
Masashi Kaji
Koichiro Ogami
Tomomi Fukunaga
Original Assignee
Nippon Steel Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Steel Chemical Co filed Critical Nippon Steel Chemical Co
Publication of TW200833745A publication Critical patent/TW200833745A/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
    • C08J5/244—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using glass fibres
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C08G59/245—Di-epoxy compounds carbocyclic aromatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/504—Amines containing an atom other than nitrogen belonging to the amine group, carbon and hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Reinforced Plastic Materials (AREA)
  • Epoxy Resins (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
TW096128613A 2006-08-07 2007-08-03 Prepreg, laminate and printed wiring board TW200833745A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006214856 2006-08-07

Publications (1)

Publication Number Publication Date
TW200833745A true TW200833745A (en) 2008-08-16

Family

ID=39032896

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096128613A TW200833745A (en) 2006-08-07 2007-08-03 Prepreg, laminate and printed wiring board

Country Status (3)

Country Link
JP (1) JP5234962B2 (zh)
TW (1) TW200833745A (zh)
WO (1) WO2008018364A1 (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI477208B (zh) * 2010-11-18 2015-03-11 住友電木股份有限公司 半導體裝置
TWI735677B (zh) * 2016-10-17 2021-08-11 日商大賽璐股份有限公司 片狀預浸體

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5443993B2 (ja) * 2007-11-08 2014-03-19 新日鉄住金化学株式会社 エポキシ樹脂、その製造方法、エポキシ樹脂組成物及び硬化物
WO2009113392A1 (ja) * 2008-03-13 2009-09-17 新日本製鐵株式会社 熱伝導性に優れた絶縁被膜を持つ電磁鋼板及びその製造方法
TWI494341B (zh) * 2008-03-31 2015-08-01 新日鐵住金化學股份有限公司 Epoxy resin compositions and shaped articles
JP5681151B2 (ja) * 2012-09-03 2015-03-04 新日鉄住金化学株式会社 エポキシ樹脂組成物および成形物
JP5681152B2 (ja) * 2012-09-03 2015-03-04 新日鉄住金化学株式会社 エポキシ樹脂組成物および成形物
KR101952356B1 (ko) * 2012-12-14 2019-02-26 엘지이노텍 주식회사 에폭시 수지 조성물 및 이를 이용한 인쇄 회로 기판
WO2020100513A1 (ja) 2018-11-12 2020-05-22 東レ株式会社 繊維強化複合材料用エポキシ樹脂組成物およびエポキシ樹脂硬化物、プリフォームならびに繊維強化複合材料
CN116829617A (zh) * 2021-03-30 2023-09-29 日铁化学材料株式会社 环氧树脂组合物、预浸料和使用它们的纤维强化塑料

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05140269A (ja) * 1991-11-26 1993-06-08 Matsushita Electric Works Ltd エポキシ樹脂組成物
JP3377241B2 (ja) * 1993-02-16 2003-02-17 日本化薬株式会社 エポキシ樹脂の製法、エポキシ樹脂組成物およびその硬化物
JP3374255B2 (ja) * 1993-04-28 2003-02-04 新日鐵化学株式会社 新規エポキシ樹脂及びその製造方法並びにそれを用いたエポキシ樹脂組成物
JP4493748B2 (ja) * 1999-07-13 2010-06-30 新日鐵化学株式会社 エポキシ樹脂、その製造方法、エポキシ樹脂組成物およびその硬化物
JP2001329046A (ja) * 2000-05-24 2001-11-27 Japan Epoxy Resin Kk 半導体封止用エポキシ樹脂組成物、樹脂封止型半導体装置および半導体装置の実装方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI477208B (zh) * 2010-11-18 2015-03-11 住友電木股份有限公司 半導體裝置
TWI735677B (zh) * 2016-10-17 2021-08-11 日商大賽璐股份有限公司 片狀預浸體

Also Published As

Publication number Publication date
JPWO2008018364A1 (ja) 2009-12-24
WO2008018364A1 (en) 2008-02-14
JP5234962B2 (ja) 2013-07-10

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