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TW200801531A - Prober for electronic device testing on large area substrates - Google Patents

Prober for electronic device testing on large area substrates

Info

Publication number
TW200801531A
TW200801531A TW096117479A TW96117479A TW200801531A TW 200801531 A TW200801531 A TW 200801531A TW 096117479 A TW096117479 A TW 096117479A TW 96117479 A TW96117479 A TW 96117479A TW 200801531 A TW200801531 A TW 200801531A
Authority
TW
Taiwan
Prior art keywords
large area
prober
area substrates
displays
electronic device
Prior art date
Application number
TW096117479A
Other languages
Chinese (zh)
Other versions
TWI339730B (en
Inventor
Benjamin M Johnston
Sriram Krishnaswami
Hung T Nguyen
Matthias Brunner
Yong Liu
William Beaton
Ludwig F Ledl
Ralf Schmid
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US11/746,530 external-priority patent/US7786742B2/en
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of TW200801531A publication Critical patent/TW200801531A/en
Application granted granted Critical
Publication of TWI339730B publication Critical patent/TWI339730B/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
    • G09G3/006—Electronic inspection or testing of displays and display drivers, e.g. of LED or LCD displays
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
    • G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
    • G09G3/34—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters by control of light from an independent source
    • G09G3/36—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters by control of light from an independent source using liquid crystals
    • G09G3/3611—Control of matrices with row and column drivers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Theoretical Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Liquid Crystal (AREA)
  • Testing Electric Properties And Detecting Electric Faults (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

An apparatus and method for testing large area substrates is described. The large area substrates include patterns of displays and contact points electrically coupled to the displays on the large area substrate. The apparatus includes a prober assembly that is movable relative to the large area substrate and/or the contact points, and may be configured to test various patterns of displays and contact points on various large area substrates. The prober assembly is also configured to test fractional sections of the large area substrate positioned on a testing table, and the prober assembly may be configured for different display and contact point patterns without removing the prober assembly from the testing table.
TW096117479A 2006-05-31 2007-05-16 Prober for electronic device testing on large area substrates TWI339730B (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US80359506P 2006-05-31 2006-05-31
US82190406P 2006-08-09 2006-08-09
US11/746,530 US7786742B2 (en) 2006-05-31 2007-05-09 Prober for electronic device testing on large area substrates

Publications (2)

Publication Number Publication Date
TW200801531A true TW200801531A (en) 2008-01-01
TWI339730B TWI339730B (en) 2011-04-01

Family

ID=39142022

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096117479A TWI339730B (en) 2006-05-31 2007-05-16 Prober for electronic device testing on large area substrates

Country Status (4)

Country Link
JP (1) JP2007322428A (en)
KR (2) KR101088566B1 (en)
CN (1) CN101082637B (en)
TW (1) TWI339730B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI421513B (en) * 2009-10-27 2014-01-01 Top Eng Co Ltd Array substrate inspection apparatus and method
US8907277B2 (en) 2008-03-07 2014-12-09 Carl Zeiss Microscopy, Llc Reducing particle implantation

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2180327A1 (en) * 2008-10-21 2010-04-28 Applied Materials, Inc. Apparatus and method for active voltage compensation
CN101943744A (en) * 2009-07-06 2011-01-12 应用材料股份有限公司 Dry high-potential tester and solar simulation tool
TWI503548B (en) * 2010-01-08 2015-10-11 Photon Dynamics Inc Probe system
KR101129195B1 (en) * 2010-12-20 2012-03-27 주식회사 탑 엔지니어링 Array test apparatus
KR101234088B1 (en) * 2010-12-30 2013-02-19 주식회사 탑 엔지니어링 Array test apparatus
KR101191343B1 (en) * 2010-12-30 2012-10-16 주식회사 탑 엔지니어링 Array test apparatus
CN102621731B (en) * 2012-04-17 2014-11-19 深圳市华星光电技术有限公司 Voltage application device of liquid crystal substrate
WO2015010714A1 (en) * 2013-07-22 2015-01-29 Applied Materials, Inc. Apparatus and method for processing a large area substrate
US9472410B2 (en) * 2014-03-05 2016-10-18 Applied Materials, Inc. Pixelated capacitance controlled ESC
JP2017003484A (en) 2015-06-12 2017-01-05 株式会社ジャパンディスプレイ Display device inspection device, display device mother substrate inspection method, and display device
JP2017096949A (en) * 2015-11-24 2017-06-01 フォトン・ダイナミクス・インコーポレーテッド System and method for electrically inspecting a flat panel display using a cell contact probing pad
KR102612272B1 (en) * 2016-12-15 2023-12-11 세메스 주식회사 Probe module and array tester including the same
TWI718610B (en) * 2018-08-09 2021-02-11 日商歐姆龍股份有限公司 Probe unit
CN108982931A (en) * 2018-09-21 2018-12-11 京东方科技集团股份有限公司 Probe unit, probe jig
CN112285446B (en) * 2019-07-12 2024-05-31 瑞昱半导体股份有限公司 Test system, transmitting device and receiving device for executing various tests

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3592831B2 (en) * 1996-02-26 2004-11-24 株式会社日本マイクロニクス Probe unit and adjustment method thereof
JPH11174108A (en) * 1997-12-12 1999-07-02 Dainippon Printing Co Ltd Inspection device for electrode wiring
US6744268B2 (en) * 1998-08-27 2004-06-01 The Micromanipulator Company, Inc. High resolution analytical probe station
US7355418B2 (en) * 2004-02-12 2008-04-08 Applied Materials, Inc. Configurable prober for TFT LCD array test
JP4790997B2 (en) * 2004-03-26 2011-10-12 株式会社日本マイクロニクス Probe device
JP2006085235A (en) 2004-09-14 2006-03-30 Agilent Technol Inc Mobile operating device and method for controlling mobile operating device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8907277B2 (en) 2008-03-07 2014-12-09 Carl Zeiss Microscopy, Llc Reducing particle implantation
TWI477771B (en) * 2008-03-07 2015-03-21 Carl Zeiss Microscopy Llc Method of reducing particle implantation
TWI421513B (en) * 2009-10-27 2014-01-01 Top Eng Co Ltd Array substrate inspection apparatus and method

Also Published As

Publication number Publication date
CN101082637A (en) 2007-12-05
KR20090120444A (en) 2009-11-24
TWI339730B (en) 2011-04-01
CN101082637B (en) 2012-01-18
KR101088566B1 (en) 2011-12-05
KR20070115639A (en) 2007-12-06
JP2007322428A (en) 2007-12-13

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