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TW200746233A - Magnetic tunnel junction temperature sensors and methods - Google Patents

Magnetic tunnel junction temperature sensors and methods

Info

Publication number
TW200746233A
TW200746233A TW095135055A TW95135055A TW200746233A TW 200746233 A TW200746233 A TW 200746233A TW 095135055 A TW095135055 A TW 095135055A TW 95135055 A TW95135055 A TW 95135055A TW 200746233 A TW200746233 A TW 200746233A
Authority
TW
Taiwan
Prior art keywords
mtj
heat source
tunnel junction
magnetic tunnel
methods
Prior art date
Application number
TW095135055A
Other languages
English (en)
Inventor
Young-Sir Chung
Robert W Baird
Mark A Durlam
Original Assignee
Freescale Semiconductor Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Freescale Semiconductor Inc filed Critical Freescale Semiconductor Inc
Publication of TW200746233A publication Critical patent/TW200746233A/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
    • G01K7/36—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using magnetic elements, e.g. magnets, coils
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B61/00—Magnetic memory devices, e.g. magnetoresistive RAM [MRAM] devices
    • H10B61/20—Magnetic memory devices, e.g. magnetoresistive RAM [MRAM] devices comprising components having three or more electrodes, e.g. transistors
    • H10B61/22—Magnetic memory devices, e.g. magnetoresistive RAM [MRAM] devices comprising components having three or more electrodes, e.g. transistors of the field-effect transistor [FET] type
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/11—Magnetic recording head
    • Y10T428/1107—Magnetoresistive
    • Y10T428/1114—Magnetoresistive having tunnel junction effect

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Hall/Mr Elements (AREA)
  • Mram Or Spin Memory Techniques (AREA)
TW095135055A 2005-09-30 2006-09-22 Magnetic tunnel junction temperature sensors and methods TW200746233A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/239,884 US7510883B2 (en) 2005-09-30 2005-09-30 Magnetic tunnel junction temperature sensors and methods

Publications (1)

Publication Number Publication Date
TW200746233A true TW200746233A (en) 2007-12-16

Family

ID=37902397

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095135055A TW200746233A (en) 2005-09-30 2006-09-22 Magnetic tunnel junction temperature sensors and methods

Country Status (4)

Country Link
US (1) US7510883B2 (zh)
CN (1) CN101589452A (zh)
TW (1) TW200746233A (zh)
WO (1) WO2007040991A2 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI734316B (zh) * 2019-12-24 2021-07-21 新唐科技股份有限公司 熱感測器及其製造方法

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US7547480B2 (en) * 2005-10-28 2009-06-16 Everspin Technologies, Inc. Magnetic tunnel junction pressure sensors and methods
US7663198B2 (en) * 2006-08-29 2010-02-16 Qimonda Ag Magnetoresistive random access memory device with alternating liner magnetization orientation
US8169811B2 (en) * 2010-07-13 2012-05-01 Nxp B.V. Non-volatile re-programmable memory device
CN102147295B (zh) * 2011-01-14 2012-08-22 北方工业大学 基于磁隧道结器件的温度传感器
US9275713B2 (en) * 2013-01-17 2016-03-01 Yimin Guo Magnetoresistive element and method of manufacturing the same
EP2973769B1 (en) 2013-03-15 2020-02-12 Magarray, Inc. Magnetic tunnel junction sensors and methods for using the same
US9425377B2 (en) * 2013-04-19 2016-08-23 The Regents Of The University Of California Tunnel junction fabrication
WO2015062174A1 (zh) * 2013-11-01 2015-05-07 中国科学院物理研究所 一种用于温度传感器的纳米磁性多层膜及其制造方法
US10297300B2 (en) * 2014-09-21 2019-05-21 Samsung Electronics Co., Ltd. Method and system for determining temperature using a magnetic junction
CN104539384B (zh) * 2014-11-19 2017-03-08 华中科技大学 一种基于卫星被动微波遥感数据的射频干扰检测方法
WO2016190984A2 (en) 2015-05-08 2016-12-01 University Of Rochester Switching of perpendicularly magnetized nanomagnets with spin-orbit torques in the absence of external magnetic fields
US11594357B2 (en) * 2015-05-08 2023-02-28 University Of Rochester Switching of perpendicularly magnetized nanomagnets with spin-orbit torques in the absence of external magnetic fields
DE102015220271A1 (de) * 2015-10-19 2017-04-20 Robert Bosch Gmbh Magnetischer Temperatursensor, Verfahren zur Bestimmung einer Temperatur
JP2017139399A (ja) * 2016-02-05 2017-08-10 Tdk株式会社 磁気メモリ
US10288494B2 (en) * 2016-11-30 2019-05-14 Taiwan Semiconductor Manufacturing Co., Ltd. MTJ-based temperature-sensing device
US10794774B2 (en) * 2016-12-02 2020-10-06 Regents Of The University Of Minnesota Spintronic temperature sensor
CN110675901B (zh) * 2019-09-10 2021-10-01 北京航空航天大学 自旋随机存储器及方法
CN110836734B (zh) * 2019-12-16 2021-05-28 中国计量大学 一种利用磁隧道结tmr效应测量温度的方法
CN110836735A (zh) * 2019-12-16 2020-02-25 杨杭福 一种利用磁隧道结作为低温传感器测量温度的方法
CN113063841B (zh) * 2021-02-09 2022-05-17 江门市润宇传感器科技有限公司 一种高灵敏湿度探测器
CN113063840B (zh) * 2021-02-09 2022-09-13 苏州市迈佳凯电子科技有限公司 一种基于磁电阻效应的湿度探测器
CN113063839B (zh) * 2021-02-09 2023-01-17 于孟今 一种基于磁隧道结的湿度探测器
CN113030683A (zh) * 2021-03-15 2021-06-25 五羊—本田摩托（广州）有限公司 一种测量功率开关器件温度的方法、介质及计算机设备
US11670394B2 (en) 2021-08-18 2023-06-06 Nxp B.V. Temperature exposure detection based on memory cell retention error rate
US11747412B2 (en) 2021-09-08 2023-09-05 Globalfoundries Singapore Pte. Ltd. Magnetic field sensor using magnetic tunneling junction (MTJ) structures and passive resistors
US12156476B2 (en) 2021-09-08 2024-11-26 Globalfoundries Singapore Pte. Ltd. Programmable magnetic tunnel junction
KR20230054564A (ko) * 2021-10-15 2023-04-25 삼성전자주식회사 장파 적외선 센서 및 이를 포함하는 전자 장치
CN115683380A (zh) * 2022-11-08 2023-02-03 中国计量大学 一种利用磁隧道结rkky耦合的温度依赖性测量温度的方法

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5940319A (en) * 1998-08-31 1999-08-17 Motorola, Inc. Magnetic random access memory and fabricating method thereof
US6630402B2 (en) 2001-11-21 2003-10-07 General Semiconductor, Inc. Integrated circuit resistant to the formation of cracks in a passivation layer
US6667682B2 (en) 2001-12-26 2003-12-23 Honeywell International Inc. System and method for using magneto-resistive sensors as dual purpose sensors
US7079438B2 (en) 2004-02-17 2006-07-18 Hewlett-Packard Development Company, L.P. Controlled temperature, thermal-assisted magnetic memory device
US7324369B2 (en) 2005-06-30 2008-01-29 Freescale Semiconductor, Inc. MRAM embedded smart power integrated circuits
US7304360B2 (en) 2005-07-12 2007-12-04 Magic Technologies, Inc. Method of forming super-paramagnetic cladding material on conductive lines of MRAM devices

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI734316B (zh) * 2019-12-24 2021-07-21 新唐科技股份有限公司 熱感測器及其製造方法
US11856855B2 (en) 2019-12-24 2023-12-26 Nuvoton Technology Corporation Thermal sensor and manufacturing method thereof

Also Published As

Publication number Publication date
US20070077664A1 (en) 2007-04-05
WO2007040991A2 (en) 2007-04-12
US7510883B2 (en) 2009-03-31
CN101589452A (zh) 2009-11-25
WO2007040991A3 (en) 2009-04-16

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