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TW200732090A - Methods of measuring and compensating cutting size on chamfering machine of sheet material - Google Patents

Methods of measuring and compensating cutting size on chamfering machine of sheet material

Info

Publication number
TW200732090A
TW200732090A TW095115222A TW95115222A TW200732090A TW 200732090 A TW200732090 A TW 200732090A TW 095115222 A TW095115222 A TW 095115222A TW 95115222 A TW95115222 A TW 95115222A TW 200732090 A TW200732090 A TW 200732090A
Authority
TW
Taiwan
Prior art keywords
measuring
cutting size
feeding direction
methods
sheet material
Prior art date
Application number
TW095115222A
Other languages
Chinese (zh)
Other versions
TWI290086B (en
Inventor
Hiroyuki Sakashita
Hajime Saida
Original Assignee
Nakamura Tome Precision Ind
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nakamura Tome Precision Ind filed Critical Nakamura Tome Precision Ind
Publication of TW200732090A publication Critical patent/TW200732090A/en
Application granted granted Critical
Publication of TWI290086B publication Critical patent/TWI290086B/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q15/00—Automatic control or regulation of feed movement, cutting velocity or position of tool or work
    • B23Q15/20—Automatic control or regulation of feed movement, cutting velocity or position of tool or work before or after the tool acts upon the workpiece
    • B23Q15/22—Control or regulation of position of tool or workpiece
    • B23Q15/24—Control or regulation of position of tool or workpiece of linear position
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q17/00—Arrangements for observing, indicating or measuring on machine tools
    • B23Q17/22—Arrangements for observing, indicating or measuring on machine tools for indicating or measuring existing or desired position of tool or work
    • B23Q17/2233—Arrangements for observing, indicating or measuring on machine tools for indicating or measuring existing or desired position of tool or work for adjusting the tool relative to the workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • B24B9/08—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of glass
    • B24B9/10—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of glass of plate glass

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • A Measuring Device Byusing Mechanical Method (AREA)
  • Length Measuring Devices By Optical Means (AREA)

Abstract

A method of measuring and compensating for the cutting size in a plate material is provided to automatically perform calculation and input of a compensated value based on a measured value. The invention includes the steps of: cutting a side periphery of the plate material parallel to a feeding direction by reading two marks stuck to a direction perpendicular to the feeding direction of the plate material and determining the feeding direction of the material; detecting the difference between the positions in the direction perpendicular to the feeding direction of the two marks by reading the two marks stuck to the feeding direction on one side of two cameras (5,6); and detecting the cutting size of the periphery of the plate material by the two cameras.
TW095115222A 2006-02-24 2006-04-28 Methods of measuring and compensating cutting size on chamfering machine of sheet material TWI290086B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006048762A JP4621605B2 (en) 2006-02-24 2006-02-24 Method for measuring and correcting machining dimension in chamfering device for plate material

Publications (2)

Publication Number Publication Date
TW200732090A true TW200732090A (en) 2007-09-01
TWI290086B TWI290086B (en) 2007-11-21

Family

ID=38545281

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095115222A TWI290086B (en) 2006-02-24 2006-04-28 Methods of measuring and compensating cutting size on chamfering machine of sheet material

Country Status (4)

Country Link
JP (1) JP4621605B2 (en)
KR (1) KR100751183B1 (en)
CN (1) CN100522472C (en)
TW (1) TWI290086B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI586489B (en) * 2012-10-30 2017-06-11 Avanstrate Inc Method for manufacturing glass substrates

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JP5301818B2 (en) * 2007-11-26 2013-09-25 中村留精密工業株式会社 Method for registering correction value in side processing apparatus for glass substrate
JP2009125905A (en) * 2007-11-27 2009-06-11 Nakamura Tome Precision Ind Co Ltd Operation control method of substrate processor
JP5026235B2 (en) * 2007-11-29 2012-09-12 キヤノンマシナリー株式会社 Substrate cutting device
JP2009160725A (en) * 2008-01-07 2009-07-23 Sfa Engineering Corp Chamfering machine for flat display
CN102039547B (en) * 2009-10-15 2012-11-21 哈里斯股份有限公司 Grinding device, grinding method, and manufacturing method of thin-plate like member
KR101165208B1 (en) * 2009-11-18 2012-07-16 주식회사 케이엔제이 Method for grinding flat pannel display
CN102145471B (en) * 2010-02-10 2016-03-16 中村留精密工业株式会社 The facing attachment of hard brittle plate
JP2012047487A (en) * 2010-08-24 2012-03-08 Hamamatsu Photonics Kk Radiation detector
CN102114607B (en) * 2010-12-07 2012-09-05 富阳德迈机械有限公司 Method for polishing glass edge
JP5682819B2 (en) * 2011-03-08 2015-03-11 旭硝子株式会社 Glass plate chamfering method, chamfering apparatus and glass plate
JP5808190B2 (en) * 2011-08-05 2015-11-10 中村留精密工業株式会社 Peripheral processing equipment for hard brittle plate
JP2013163626A (en) * 2012-02-13 2013-08-22 Asahi Glass Co Ltd Cut line processing apparatus for plate-shaped substance and cut line processing method for plate-shaped substance, and manufacturing apparatus for glass sheet and manufacturing method for glass sheet
JP5289644B1 (en) * 2012-10-31 2013-09-11 三菱電機株式会社 Automatic programming apparatus and method
JP6159549B2 (en) * 2013-03-28 2017-07-05 中村留精密工業株式会社 Workpiece peripheral processing equipment
KR101395055B1 (en) * 2013-05-28 2014-05-14 삼성코닝정밀소재 주식회사 Method of determining flatness of a chmfer table
JP6190654B2 (en) * 2013-07-30 2017-08-30 中村留精密工業株式会社 Method for uniformizing machining allowance and peripheral grinding apparatus for plate material
TWI600499B (en) * 2013-08-09 2017-10-01 Nakamura-Tome Precision Industry Co Ltd Hard brittle plate grinding device and processing precision measurement and correction method
CN104310059B (en) * 2014-08-27 2017-07-25 深圳市华星光电技术有限公司 Glass substrate to expose side processing procedure and system
CN105458363B (en) * 2015-12-14 2017-11-21 广东长盈精密技术有限公司 Highlight chamfering reworking method for mobile phone appearance piece
CN105642991B (en) * 2016-04-07 2018-10-23 贵州航瑞科技有限公司 A kind of band facing attachment
CN108214175A (en) * 2016-12-12 2018-06-29 广东科达洁能股份有限公司 One kind is High Precision Automatic to push away brick device
CN107971869A (en) * 2017-11-20 2018-05-01 常州索高机械有限公司 Bilateral R angles edging device
CN108705407B (en) * 2018-04-25 2019-12-20 昆山国显光电有限公司 Glass edge grinding device
CN108549318B (en) * 2018-05-11 2020-07-31 彩虹集团有限公司 Numerical control machining method for improving quality of weir crest fillet of overflow brick
CN109623583B (en) * 2018-11-07 2019-11-12 江苏博克斯科技股份有限公司 A forming device for the edge of the outer sheet of an electronic device
CN109773614B (en) * 2018-12-03 2021-04-20 宁波公牛电器有限公司 Chamfering machine and chamfering method
CN109590893B (en) * 2019-01-04 2021-01-26 京东方科技集团股份有限公司 Grinding method and grinding system using grinding system
CN110275399B (en) * 2019-06-20 2021-05-07 合肥芯碁微电子装备股份有限公司 Method for measuring position relation error of alignment camera of laser direct imaging equipment
KR102437013B1 (en) * 2020-07-31 2022-08-29 프레임웍스 주식회사 Method of grinding a workpiece
KR102412663B1 (en) * 2020-07-31 2022-06-24 프레임웍스 주식회사 Method of grinding a workpiece
CN113211235A (en) * 2021-05-10 2021-08-06 山西光兴光电科技有限公司 Polishing apparatus and polishing method
KR102550583B1 (en) * 2022-06-17 2023-07-03 (주)네온테크 Processing and checking methods by auto alignment after loading substrate
CN116944952A (en) * 2023-07-25 2023-10-27 歌尔股份有限公司 Numerical control machine tool measuring method, numerical control machine tool and computer readable storage medium
CN119526131A (en) * 2024-09-30 2025-02-28 彩虹（合肥）液晶玻璃有限公司 Glass substrate chamfering method
CN119347432B (en) * 2024-10-15 2025-11-07 东莞市先诺电子材料有限公司 Full-automatic tab chamfering detection boxing all-in-one machine

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JPH09201757A (en) * 1996-01-29 1997-08-05 Daido Kikai Seisakusho:Kk Work form recognizing and processing method of chamfering device
JP3481144B2 (en) 1998-08-31 2003-12-22 東芝セラミックス株式会社 Chamfer width measuring device
JP2003025198A (en) 2001-07-10 2003-01-29 Sharp Corp Chamfering device and chamfered substrate
JP2003251551A (en) * 2002-02-28 2003-09-09 Nakamura Tome Precision Ind Co Ltd Working method for liquid crystal substrate, or the like and its device
JP4037169B2 (en) * 2002-05-28 2008-01-23 中村留精密工業株式会社 Side processing method of hard brittle plate
JP2004099424A (en) * 2002-07-16 2004-04-02 Shiraitekku:Kk Device for working glass
JP2006026845A (en) * 2004-07-20 2006-02-02 Nakamura Tome Precision Ind Co Ltd Adjustment method for tool position of chamfering machine

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI586489B (en) * 2012-10-30 2017-06-11 Avanstrate Inc Method for manufacturing glass substrates

Also Published As

Publication number Publication date
TWI290086B (en) 2007-11-21
JP4621605B2 (en) 2011-01-26
KR100751183B1 (en) 2007-08-22
JP2007223005A (en) 2007-09-06
CN101024275A (en) 2007-08-29
CN100522472C (en) 2009-08-05

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