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TW200720360A - Thermosetting silicone rubber composition, electronic component and electronic device - Google Patents

Thermosetting silicone rubber composition, electronic component and electronic device

Info

Publication number
TW200720360A
TW200720360A TW095134298A TW95134298A TW200720360A TW 200720360 A TW200720360 A TW 200720360A TW 095134298 A TW095134298 A TW 095134298A TW 95134298 A TW95134298 A TW 95134298A TW 200720360 A TW200720360 A TW 200720360A
Authority
TW
Taiwan
Prior art keywords
weight
rubber composition
silicone rubber
parts
thermosetting silicone
Prior art date
Application number
TW095134298A
Other languages
Chinese (zh)
Inventor
Katsutoshi Mine
Kimio Yamakawa
Original Assignee
Nihon Handa Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nihon Handa Co Ltd filed Critical Nihon Handa Co Ltd
Publication of TW200720360A publication Critical patent/TW200720360A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/10—Encapsulated ingredients

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Conductive Materials (AREA)
  • Paints Or Removers (AREA)

Abstract

Disclosed is a silicone rubber composition which can be cured quickly by heating at low temperatures while having long working life at room temperature and excellent handling properties. Specifically disclosed is a thermosetting silicone rubber composition composed of (A) 100 parts by weight of an organopolysiloxane containing at least two silicon atom-bonded alkenyl groups in a molecule, (B) 0.1-50 parts by weight of an organohydrogenpolysiloxane containing at least two silicon atom-bonded hydrogen atoms in a molecule, (C) 0-3000 parts by weight of thermally conductive particles and/or electrically conductive particles, and (D) 0.0001-20 parts by weight of a fine particle catalyst having an average particle diameter of 0.01-500 m, which is composed of wax particles containing a platinum catalyst in an amount of not less than 0.001% by weight in terms of platinum metal atoms and having a melting point of 40-230 DEG C. Also specifically disclosed is an electronic component or electronic device which is coated or bonded with such a thermosetting silicone rubber composition.
TW095134298A 2005-09-15 2006-09-15 Thermosetting silicone rubber composition, electronic component and electronic device TW200720360A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005302268 2005-09-15

Publications (1)

Publication Number Publication Date
TW200720360A true TW200720360A (en) 2007-06-01

Family

ID=37865064

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095134298A TW200720360A (en) 2005-09-15 2006-09-15 Thermosetting silicone rubber composition, electronic component and electronic device

Country Status (3)

Country Link
JP (1) JP5278943B2 (en)
TW (1) TW200720360A (en)
WO (1) WO2007032481A1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104583297A (en) * 2012-07-27 2015-04-29 道康宁东丽株式会社 Microparticles and curable organopolysiloxane composition containing the same
TWI755437B (en) * 2016-10-31 2022-02-21 日商陶氏東麗股份有限公司 One-liquid curable thermal conductive silicone grease composition and electric/electronic article

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US7875347B2 (en) * 2003-12-29 2011-01-25 General Electric Company Composite coatings for groundwall insulation, method of manufacture thereof and articles derived therefrom
US9520314B2 (en) * 2008-12-19 2016-12-13 Applied Materials, Inc. High temperature electrostatic chuck bonding adhesive
JP5648290B2 (en) * 2010-01-28 2015-01-07 株式会社デンソー Electronic device and manufacturing method thereof
JP5534837B2 (en) * 2010-01-28 2014-07-02 東レ・ダウコーニング株式会社 Thermally conductive silicone rubber composition
JP5304812B2 (en) * 2011-02-16 2013-10-02 信越化学工業株式会社 Conductive pattern forming composition and conductive pattern forming method
WO2013100944A1 (en) 2011-12-28 2013-07-04 Intel Corporation Locking hinge assembly for electronic device
JP5321723B1 (en) * 2012-10-29 2013-10-23 横浜ゴム株式会社 Conductive composition and solar battery cell
JP5895857B2 (en) * 2013-01-16 2016-03-30 信越化学工業株式会社 Method for producing liquid silicone rubber coating composition for curtain airbag
JP6224943B2 (en) * 2013-07-17 2017-11-01 イズミ物産株式会社 One-component solvent-free room temperature curable organosiloxane silicone resin adhesive and method for producing the same
JP6355108B2 (en) * 2015-12-17 2018-07-11 株式会社豊田中央研究所 Fuel cell restraint member
JP6656045B2 (en) * 2016-03-29 2020-03-04 信越化学工業株式会社 Resin composition containing supported platinum catalyst, thermosetting organopolysiloxane composition using the same, and method of curing the same
CN106590518A (en) * 2016-12-30 2017-04-26 江苏晶河电子科技有限公司 High-performance RTV-1 conducting glue water and preparation method thereof
CN112020541A (en) * 2018-05-15 2020-12-01 三键有限公司 Conductive silicone composition and cured product thereof
CN109694689A (en) * 2018-11-20 2019-04-30 国网江苏省电力有限公司电力科学研究院 One kind blocks water encapsulating glue material and preparation method
US12202943B2 (en) * 2018-12-03 2025-01-21 Momentive Performance Materials Inc. Electrostatically dissipative room temperature vulcanizable silicone
CN114901390A (en) 2019-12-06 2022-08-12 诺稀尔技术有限责任公司 Encapsulated catalysts for one-part organopolysiloxane systems and methods relating thereto
JP7290118B2 (en) * 2020-01-21 2023-06-13 信越化学工業株式会社 Thermally conductive silicone adhesive composition
JP7714373B2 (en) * 2021-05-13 2025-07-29 信越化学工業株式会社 Addition-curable liquid conductive silicone rubber composition and electrophotographic image-forming member
CN113416519B (en) * 2021-07-16 2023-05-02 广州回天新材料有限公司 Organic silicon gel for encapsulating IGBT module
EP4441150A4 (en) * 2021-11-29 2025-09-03 Dow Silicones Corp Room temperature storable one-piece post-cure thermally conductive silicone with vertical stability

Family Cites Families (10)

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Publication number Priority date Publication date Assignee Title
JPS5341707B2 (en) * 1973-04-26 1978-11-06
DE3131734A1 (en) * 1981-08-11 1983-02-24 Bayer Ag, 5090 Leverkusen HEAT-CURABLE ORGANOPOLYSILOXANE MIXTURES
US4766176A (en) * 1987-07-20 1988-08-23 Dow Corning Corporation Storage stable heat curable organosiloxane compositions containing microencapsulated platinum-containing catalysts
JP3022092B2 (en) * 1993-09-07 2000-03-15 信越化学工業株式会社 Catalyst for addition reaction
JP3899134B2 (en) * 1993-12-29 2007-03-28 東レ・ダウコーニング株式会社 Heat curable silicone composition
JPH0889817A (en) * 1994-09-20 1996-04-09 Sumitomo Bakelite Co Ltd Preparation of carried catalyst
JP3524634B2 (en) * 1995-05-25 2004-05-10 東レ・ダウコーニング・シリコーン株式会社 Thermally conductive silicone rubber composition
JPH11222524A (en) * 1997-11-18 1999-08-17 Shin Etsu Chem Co Ltd Hydrosilylation reaction catalyst and silicone composition using the same
JP3500992B2 (en) * 1997-11-19 2004-02-23 信越化学工業株式会社 Organopolysiloxane composition
JP3663324B2 (en) * 1998-11-30 2005-06-22 信越化学工業株式会社 Addition-curing silicone rubber composition

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104583297A (en) * 2012-07-27 2015-04-29 道康宁东丽株式会社 Microparticles and curable organopolysiloxane composition containing the same
CN104583297B (en) * 2012-07-27 2017-03-29 道康宁东丽株式会社 Particulate and the curable organopolysiloxane composition comprising the particulate
TWI755437B (en) * 2016-10-31 2022-02-21 日商陶氏東麗股份有限公司 One-liquid curable thermal conductive silicone grease composition and electric/electronic article

Also Published As

Publication number Publication date
JPWO2007032481A1 (en) 2009-03-19
JP5278943B2 (en) 2013-09-04
WO2007032481A1 (en) 2007-03-22

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