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TW200729327A - Method and apparatus for cleaning substrate - Google Patents

Method and apparatus for cleaning substrate

Info

Publication number
TW200729327A
TW200729327A TW095142617A TW95142617A TW200729327A TW 200729327 A TW200729327 A TW 200729327A TW 095142617 A TW095142617 A TW 095142617A TW 95142617 A TW95142617 A TW 95142617A TW 200729327 A TW200729327 A TW 200729327A
Authority
TW
Taiwan
Prior art keywords
chemical
substrate
foreign material
electronic substrate
cleaning
Prior art date
Application number
TW095142617A
Other languages
Chinese (zh)
Inventor
Ryuji Sotoaka
Keiichi Tanaka
Tomoyuki Azuma
Original Assignee
Mitsubishi Gas Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Gas Chemical Co filed Critical Mitsubishi Gas Chemical Co
Publication of TW200729327A publication Critical patent/TW200729327A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02057—Cleaning during device manufacture
    • H01L21/0206—Cleaning during device manufacture during, before or after processing of insulating layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
    • H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
    • H01L21/67086—Apparatus for fluid treatment for etching for wet etching with the semiconductor substrates being dipped in baths or vessels
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/26—Cleaning or polishing of the conductive pattern

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

Provided are a method and an apparatus for cleaning an electronic substrate, in which a load of waste liquid treatment is small after cleaning the substrate. The substrate obtained by such method and apparatus is also provided. The substrate cleaning apparatus is provided with a chemical contact means for bringing a chemical, in which acid and/or base is added to a solution including nitrous oxide (N2O), into contact with the electronic substrate, and a light source, which applies ultraviolet rays on the electronic substrate, in contact with the chemical. Thus, foreign material is oxidized by permitting the chemical to adhere on the foreign material adhered on the electronic substrate and irradiating the chemical with ultraviolet rays. Then, the oxidized foreign material is removed from the electronic substrate by having the oxidized foreign material react with the acid and/or base.
TW095142617A 2005-11-18 2006-11-17 Method and apparatus for cleaning substrate TW200729327A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005335050 2005-11-18

Publications (1)

Publication Number Publication Date
TW200729327A true TW200729327A (en) 2007-08-01

Family

ID=38048670

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095142617A TW200729327A (en) 2005-11-18 2006-11-17 Method and apparatus for cleaning substrate

Country Status (3)

Country Link
JP (1) JPWO2007058286A1 (en)
TW (1) TW200729327A (en)
WO (1) WO2007058286A1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI552220B (en) * 2012-11-26 2016-10-01 Tokyo Electron Ltd Substrate cleaning system, substrate cleaning method and memory media
CN115498329A (en) * 2022-10-13 2022-12-20 东北大学 A kind of composite electrolyte solution for magnesium battery and its preparation and use method

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8652266B2 (en) * 2008-07-24 2014-02-18 Lam Research Corporation Method and apparatus for surface treatment of semiconductor substrates using sequential chemical applications
JP5114367B2 (en) * 2008-11-21 2013-01-09 Ｈｏｙａ株式会社 Photomask manufacturing method and pattern transfer method using the photomask
WO2011027772A1 (en) * 2009-09-02 2011-03-10 和光純薬工業株式会社 Processing agent composition for semiconductor surface and method for processing semiconductor surface using same
JP2018101798A (en) * 2018-02-13 2018-06-28 株式会社ニコン Wet processing method
CN114798587B (en) * 2022-04-07 2024-01-30 武汉华星光电半导体显示技术有限公司 Mask plate foreign matter removing method

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001252631A (en) * 2000-03-10 2001-09-18 Uct Kk Surface cleaning device and surface cleaning method
JPWO2002101808A1 (en) * 2001-06-11 2004-09-30 株式会社つくばセミテクノロジー Apparatus and method for cleaning object to be processed
JP2003224084A (en) * 2001-11-22 2003-08-08 Semiconductor Energy Lab Co Ltd Semiconductor manufacturing equipment
JP2004141704A (en) * 2002-10-22 2004-05-20 Sony Corp Cleaning device and cleaning method
JP2004307634A (en) * 2003-04-07 2004-11-04 Tosoh Corp Cleaning liquid and cleaning method using the same
JP4173781B2 (en) * 2003-08-13 2008-10-29 株式会社神戸製鋼所 High pressure processing method

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI552220B (en) * 2012-11-26 2016-10-01 Tokyo Electron Ltd Substrate cleaning system, substrate cleaning method and memory media
US9799538B2 (en) 2012-11-26 2017-10-24 Tokyo Electron Limited Substrate cleaning system
CN115498329A (en) * 2022-10-13 2022-12-20 东北大学 A kind of composite electrolyte solution for magnesium battery and its preparation and use method
CN115498329B (en) * 2022-10-13 2024-04-09 东北大学 A magnesium battery composite electrolyte and its preparation and use method

Also Published As

Publication number Publication date
WO2007058286A1 (en) 2007-05-24
JPWO2007058286A1 (en) 2009-05-07

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