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TW200727760A - Circuit substrate and method of fabricating the same - Google Patents

Circuit substrate and method of fabricating the same

Info

Publication number
TW200727760A
TW200727760A TW095100422A TW95100422A TW200727760A TW 200727760 A TW200727760 A TW 200727760A TW 095100422 A TW095100422 A TW 095100422A TW 95100422 A TW95100422 A TW 95100422A TW 200727760 A TW200727760 A TW 200727760A
Authority
TW
Taiwan
Prior art keywords
circuit
dielectric layer
circuit substrate
fabricating
same
Prior art date
Application number
TW095100422A
Other languages
Chinese (zh)
Other versions
TWI293547B (en
Inventor
Ching-Fu Horng
Yung-Hui Wang
Chao-Chen Tu
Original Assignee
Advanced Semiconductor Eng
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Semiconductor Eng filed Critical Advanced Semiconductor Eng
Priority to TW95100422A priority Critical patent/TWI293547B/en
Publication of TW200727760A publication Critical patent/TW200727760A/en
Application granted granted Critical
Publication of TWI293547B publication Critical patent/TWI293547B/en

Links

Landscapes

  • Parts Printed On Printed Circuit Boards (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

A circuit substrate comprising a dielectric layer, a first surface circuit, a second surface circuit and at least one conductive piece is provided. The dielectric layer has a first surface and a second surface. The first surface circuit is lodged in the first surface of the dielectric layer, and the outer surface of the first surface circuit is coplanar with the first surface. The second surface circuit is lodged in the second surface of the dielectric layer, and the outer surface of the second surface circuit is coplanar with the second surface. Besides, at least one conductive piece is arranged in the dielectric layer for electrically connecting the first surface circuit and the second surface circuit. Because the surface circuits are lodged in the upper side and the lower side of the dielectric layer respectively, therefore, the circuit substrate of the present invention has better planarity.
TW95100422A 2006-01-05 2006-01-05 Circuit substrate and method of fabricating the same TWI293547B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW95100422A TWI293547B (en) 2006-01-05 2006-01-05 Circuit substrate and method of fabricating the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW95100422A TWI293547B (en) 2006-01-05 2006-01-05 Circuit substrate and method of fabricating the same

Publications (2)

Publication Number Publication Date
TW200727760A true TW200727760A (en) 2007-07-16
TWI293547B TWI293547B (en) 2008-02-11

Family

ID=45067879

Family Applications (1)

Application Number Title Priority Date Filing Date
TW95100422A TWI293547B (en) 2006-01-05 2006-01-05 Circuit substrate and method of fabricating the same

Country Status (1)

Country Link
TW (1) TWI293547B (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8115104B2 (en) 2008-06-11 2012-02-14 Advanced Semiconductor Engineering, Inc. Circuit board with buried conductive trace formed thereon and method for manufacturing the same
US8450621B2 (en) 2008-09-16 2013-05-28 Unimicron Technology Corp. Wiring board and process for fabricating the same
TWI425898B (en) * 2007-11-22 2014-02-01 Unimicron Technology Corp Method for fabricating wiring structure of circuit board

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI425898B (en) * 2007-11-22 2014-02-01 Unimicron Technology Corp Method for fabricating wiring structure of circuit board
US8115104B2 (en) 2008-06-11 2012-02-14 Advanced Semiconductor Engineering, Inc. Circuit board with buried conductive trace formed thereon and method for manufacturing the same
TWI425896B (en) * 2008-06-11 2014-02-01 Advanced Semiconductor Eng Circuit board with buried conductive trace formed thereon and method for manufacturing the same
US8450621B2 (en) 2008-09-16 2013-05-28 Unimicron Technology Corp. Wiring board and process for fabricating the same

Also Published As

Publication number Publication date
TWI293547B (en) 2008-02-11

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Legal Events

Date Code Title Description
MC4A Revocation of granted patent