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TW200724399A - Liquid ejection apparatus - Google Patents

Liquid ejection apparatus

Info

Publication number
TW200724399A
TW200724399A TW095141007A TW95141007A TW200724399A TW 200724399 A TW200724399 A TW 200724399A TW 095141007 A TW095141007 A TW 095141007A TW 95141007 A TW95141007 A TW 95141007A TW 200724399 A TW200724399 A TW 200724399A
Authority
TW
Taiwan
Prior art keywords
cleaning
bath
cleaning liquid
cleaning bath
liquid
Prior art date
Application number
TW095141007A
Other languages
Chinese (zh)
Other versions
TWI308084B (en
Inventor
Hirotsuna Miura
Yuji Iwata
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Publication of TW200724399A publication Critical patent/TW200724399A/en
Application granted granted Critical
Publication of TWI308084B publication Critical patent/TWI308084B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
    • H01L21/288—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/0006—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00 with means to keep optical surfaces clean, e.g. by preventing or removing dirt, stains, contamination, condensation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Optics & Photonics (AREA)
  • Coating Apparatus (AREA)
  • Optical Filters (AREA)

Abstract

A cleaning bath is provided on a base of a liquid ejection apparatus. A cleaning liquid supply section and a cleaning liquid discharge section are connected to the cleaning bath. The cleaning liquid supply section supplies cleaning liquid to the cleaning bath. The cleaning liquid discharge section drains the cleaning liquid from the cleaning bath. After having formed dots, a head unit is moved to the position immediately above the cleaning bath. Reflective mirrors are then immersed in the cleaning bath in the vicinity of an inlet pipe through which the cleaning liquid is introduced into the cleaning bath. An ejection head is also immersed in the cleaning bath in the vicinity of an outlet pipe through which the cleaning liquid is drained from the cleaning bath.
TW095141007A 2005-11-08 2006-11-06 Liquid ejection apparatus TWI308084B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005323808A JP4525559B2 (en) 2005-11-08 2005-11-08 Droplet discharge device

Publications (2)

Publication Number Publication Date
TW200724399A true TW200724399A (en) 2007-07-01
TWI308084B TWI308084B (en) 2009-04-01

Family

ID=37635698

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095141007A TWI308084B (en) 2005-11-08 2006-11-06 Liquid ejection apparatus

Country Status (7)

Country Link
US (1) US20070103512A1 (en)
EP (1) EP1782957B1 (en)
JP (1) JP4525559B2 (en)
KR (1) KR100804120B1 (en)
CN (1) CN100509415C (en)
DE (1) DE602006007654D1 (en)
TW (1) TWI308084B (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101428479B1 (en) * 2007-06-22 2014-08-11 삼성전자 주식회사 Ink-jet image forming apparatus and control method thereof
JP5875485B2 (en) * 2012-08-24 2016-03-02 株式会社ミマキエンジニアリング Head cleaning apparatus, ink jet recording apparatus, and head cleaning method
US9505219B2 (en) * 2015-01-09 2016-11-29 Oce-Technologies B.V. Droplet ejection apparatus and method of cleaning the same
DE102016103749A1 (en) * 2016-03-02 2017-09-07 Snaptrack, Inc. Workpiece blank and method for marking the blank
DE102017202628B4 (en) 2017-02-17 2022-03-17 Trumpf Werkzeugmaschinen Gmbh + Co. Kg Method of encoding a plate-like workpiece, method of identifying a plate-like workpiece, radiation processing apparatus and coding system
CN109435471A (en) * 2018-11-22 2019-03-08 上海汉图科技有限公司 Ultrasonic cleaning equipment and printer

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05259252A (en) * 1992-03-10 1993-10-08 Hitachi Ltd Measuring apparatus for temperature characteristics
JPH1177340A (en) 1997-09-10 1999-03-23 Miyachi Technos Corp Marking method
JP3514061B2 (en) * 1997-02-12 2004-03-31 富士ゼロックス株式会社 Optical scanning device and cleaning method thereof
JPH11162831A (en) * 1997-11-21 1999-06-18 Nikon Corp Projection exposure apparatus and projection exposure method
WO1999027568A1 (en) * 1997-11-21 1999-06-03 Nikon Corporation Projection aligner and projection exposure method
US6854841B1 (en) * 1998-04-17 2005-02-15 Elesys, Inc. Point-of-incidence ink-curing mechanisms for radial printing
EP1065058A3 (en) 1999-06-30 2003-04-09 Canon Kabushiki Kaisha Method for manufacturing ink jet recording head, ink jet recording head manufactured by such method, and laser working method
JP2004532750A (en) * 2001-03-30 2004-10-28 エル アンド ピー プロパティ マネジメント カンパニー Method and apparatus for inkjet printing
SG96643A1 (en) * 2001-09-10 2003-06-16 Inst Data Storage Method and apparatus for cleaning inkjet cartridges
WO2003028943A1 (en) * 2001-10-03 2003-04-10 Lambda Physik Application Center, L.L.C. Method and apparatus for fine liquid spray assisted laser material processing
KR100426087B1 (en) * 2001-10-12 2004-04-06 삼성전자주식회사 Printhead cleaning apparatus and ink jet printer having the same
JP2003127537A (en) * 2001-10-29 2003-05-08 Optrex Corp Marking method
JP4107198B2 (en) * 2002-11-20 2008-06-25 セイコーエプソン株式会社 Droplet ejection device, droplet ejection method, and electro-optical device
JP2004188903A (en) * 2002-12-13 2004-07-08 Konica Minolta Holdings Inc Capping member, cleaning member, piping member, ink tank member, and uv hardening type inkjet recording device with these
US20040164325A1 (en) * 2003-01-09 2004-08-26 Con-Trol-Cure, Inc. UV curing for ink jet printer
US7137696B2 (en) * 2003-01-09 2006-11-21 Con-Trol-Cure, Inc. Ink jet UV curing
JP4244382B2 (en) * 2003-02-26 2009-03-25 セイコーエプソン株式会社 Functional material fixing method and device manufacturing method
JP4731913B2 (en) 2003-04-25 2011-07-27 株式会社半導体エネルギー研究所 Pattern forming method and semiconductor device manufacturing method
JP4503941B2 (en) * 2003-06-02 2010-07-14 東芝テック株式会社 Inkjet head cleaning apparatus and inkjet head cleaning method
JP4049105B2 (en) * 2004-02-24 2008-02-20 セイコーエプソン株式会社 Wiping device, droplet discharge device, electro-optical device, method of manufacturing electro-optical device, and electronic apparatus
US7401885B2 (en) 2004-08-23 2008-07-22 Semiconductor Energy Laboratory Co., Ltd. Droplet discharge apparatus
JP4311364B2 (en) 2005-03-18 2009-08-12 セイコーエプソン株式会社 Droplet discharge device

Also Published As

Publication number Publication date
JP4525559B2 (en) 2010-08-18
TWI308084B (en) 2009-04-01
US20070103512A1 (en) 2007-05-10
EP1782957A1 (en) 2007-05-09
CN1962272A (en) 2007-05-16
EP1782957B1 (en) 2009-07-08
CN100509415C (en) 2009-07-08
DE602006007654D1 (en) 2009-08-20
JP2007130527A (en) 2007-05-31
KR100804120B1 (en) 2008-02-18
KR20070049579A (en) 2007-05-11

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees