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TW200719406A - Sealing part and substrate processing apparatus - Google Patents

Sealing part and substrate processing apparatus

Info

Publication number
TW200719406A
TW200719406A TW095120985A TW95120985A TW200719406A TW 200719406 A TW200719406 A TW 200719406A TW 095120985 A TW095120985 A TW 095120985A TW 95120985 A TW95120985 A TW 95120985A TW 200719406 A TW200719406 A TW 200719406A
Authority
TW
Taiwan
Prior art keywords
sealing member
reduced pressure
pressure vessel
sealing
radical
Prior art date
Application number
TW095120985A
Other languages
Chinese (zh)
Other versions
TWI320952B (en
Inventor
Daisuke Hayashi
Akira Muramatsu
Original Assignee
Nihon Valqua Kogyo Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nihon Valqua Kogyo Kk filed Critical Nihon Valqua Kogyo Kk
Publication of TW200719406A publication Critical patent/TW200719406A/en
Application granted granted Critical
Publication of TWI320952B publication Critical patent/TWI320952B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/3065—Plasma etching; Reactive-ion etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67069—Apparatus for fluid treatment for etching for drying etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/16—Vessels
    • H01J2237/166—Sealing means

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Drying Of Semiconductors (AREA)
  • Gasket Seals (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Pressure Vessels And Lids Thereof (AREA)

Abstract

A sealing part that is inexpensive and enable excellent durability to be secured without the need for a predetermined sealing space as would be required for a double sealing structure. A sealing part seals an inside of a reduced pressure vessel from an outside, in which a high-elasticity polymeric material-eroding eroding substance is present and which is comprised of a substrate processing apparatus carrying out predetermined processing on a substrate housed in the reduced pressure vessel. The sealing part has a radical sealing member and a vacuum sealing member. The radical sealing member is disposed on an inside side of the reduced pressure vessel and is resistant to the eroding substance. The vacuum sealing member is made of the high-elasticity polymeric material and is disposed on an outside side of the reduced pressure vessel. At least one refuge space is formed through at least part of the radical sealing member and at least part of the vacuum sealing member being separated from one another. The radical sealing member and the vacuum sealing member are fitted together.
TW095120985A 2005-09-30 2006-06-13 Sealing part and substrate processing apparatus TWI320952B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005288357 2005-09-30
JP2006003059A JP4364199B2 (en) 2005-09-30 2006-01-10 Seal parts and substrate processing apparatus

Publications (2)

Publication Number Publication Date
TW200719406A true TW200719406A (en) 2007-05-16
TWI320952B TWI320952B (en) 2010-02-21

Family

ID=37852869

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095120985A TWI320952B (en) 2005-09-30 2006-06-13 Sealing part and substrate processing apparatus

Country Status (4)

Country Link
JP (1) JP4364199B2 (en)
KR (1) KR100793553B1 (en)
DE (1) DE102006029425B4 (en)
TW (1) TWI320952B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109844924A (en) * 2016-10-11 2019-06-04 维易科仪器有限公司 Sealing element for chip processing assembly

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4754621B2 (en) * 2006-02-14 2011-08-24 日本バルカー工業株式会社 Composite sealing material
WO2009038022A1 (en) * 2007-09-21 2009-03-26 Nippon Valqua Industries, Ltd. Compound seal member
US8888106B2 (en) 2008-09-18 2014-11-18 Nippon Valqua Industries, Ltd. Seal plate, seal member that is used in seal plate, and method for manufacturing the same
US8343370B2 (en) * 2009-02-19 2013-01-01 Federal-Mogul Corporation Method of fabricating a PTFE seal element and a shaft seal assembly therewith
KR101120606B1 (en) * 2009-12-30 2012-03-16 세메스 주식회사 Sealing unit and apparatus for processing a substrate having the sealing unit
JP5777315B2 (en) * 2010-10-19 2015-09-09 日本バルカー工業株式会社 Composite sealing material
JP5973781B2 (en) * 2011-07-20 2016-08-23 三菱電線工業株式会社 Corrosion-resistant composite seal structure
WO2014057803A1 (en) * 2012-10-09 2014-04-17 日本バルカー工業株式会社 Composite seal
JP6254981B2 (en) * 2015-08-12 2017-12-27 ファナック株式会社 Laser oscillator vacuum vessel
JP6809917B2 (en) * 2017-01-31 2021-01-06 株式会社バルカー Composite sealing material
KR102277809B1 (en) * 2019-07-15 2021-07-14 세메스 주식회사 Unit for supporting substrate and system for treating substrate with the unit
CN113969980A (en) * 2020-07-23 2022-01-25 中国科学院微电子研究所 a vacuum device
CN112246183B (en) * 2020-11-10 2025-02-14 福州闽海药业有限公司 A high-efficiency wet granulator with good sealing performance
JP2024139045A (en) * 2023-03-27 2024-10-09 株式会社バルカー Composite sealing material
WO2025154361A1 (en) * 2024-01-16 2025-07-24 三菱電線工業株式会社 Composite seal structure, seal structure, and sealing method by means of composite seal structure
JP7669576B1 (en) * 2024-08-01 2025-04-28 三菱電線工業株式会社 Composite seal structure, seal structure, and sealing method using the composite seal structure

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5805408A (en) * 1995-12-22 1998-09-08 Lam Research Corporation Electrostatic clamp with lip seal for clamping substrates
US6089543A (en) * 1997-07-11 2000-07-18 Applied Materials, Inc. Two-piece slit valve door with molded-in-place seal for a vacuum processing system
KR100543361B1 (en) * 1999-08-11 2006-01-20 삼성전자주식회사 Loadlock chamber
EP1087157A3 (en) 1999-09-27 2003-01-08 Greene, Tweed Of Delaware, Inc. Seal and protective shield
US6689221B2 (en) 2000-12-04 2004-02-10 Applied Materials, Inc. Cooling gas delivery system for a rotatable semiconductor substrate support assembly

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109844924A (en) * 2016-10-11 2019-06-04 维易科仪器有限公司 Sealing element for chip processing assembly

Also Published As

Publication number Publication date
KR20070037295A (en) 2007-04-04
DE102006029425B4 (en) 2019-09-19
JP4364199B2 (en) 2009-11-11
JP2007120738A (en) 2007-05-17
DE102006029425A1 (en) 2007-04-05
KR100793553B1 (en) 2008-01-14
TWI320952B (en) 2010-02-21

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