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TW200719397A - Analyzing apparatus, processing apparatus, measuring instrument, exposure apparatus, substrate processing system, analysis method, and program - Google Patents

Analyzing apparatus, processing apparatus, measuring instrument, exposure apparatus, substrate processing system, analysis method, and program

Info

Publication number
TW200719397A
TW200719397A TW095140950A TW95140950A TW200719397A TW 200719397 A TW200719397 A TW 200719397A TW 095140950 A TW095140950 A TW 095140950A TW 95140950 A TW95140950 A TW 95140950A TW 200719397 A TW200719397 A TW 200719397A
Authority
TW
Taiwan
Prior art keywords
line width
measuring instrument
program
analysis method
analyzing
Prior art date
Application number
TW095140950A
Other languages
Chinese (zh)
Other versions
TWI413154B (en
Inventor
Shinichi Okita
Original Assignee
Nikon Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikon Corp filed Critical Nikon Corp
Publication of TW200719397A publication Critical patent/TW200719397A/en
Application granted granted Critical
Publication of TWI413154B publication Critical patent/TWI413154B/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • G03F7/70625—Dimensions, e.g. line width, critical dimension [CD], profile, sidewall angle or edge roughness
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
    • G03F7/70516—Calibration of components of the microlithographic apparatus, e.g. light sources, addressable masks or detectors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
    • G03F7/70533—Controlling abnormal operating mode, e.g. taking account of waiting time, decision to rework or rework flow
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/7055—Exposure light control in all parts of the microlithographic apparatus, e.g. pulse length control or light interruption
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/706835—Metrology information management or control
    • G03F7/706837—Data analysis, e.g. filtering, weighting, flyer removal, fingerprints or root cause analysis
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/706843—Metrology apparatus

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Data Mining & Analysis (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

The line width of a pattern on a substrate, which has been exposed and developed by an exposure apparatus, is measured by a measuring instrument. If an analyzing apparatus determines that this line width is abnormal (step 303), the analyzing apparatus identifies an apparatus causing the line width variation according to the matching level between the measured value of the line width and the simulated value thereof (step 307); identifies a factor causing the line width variation according to a statistical value (step 311); and optimizes parameters (steps 315, 317). This improves the yield of a device fabrication process.
TW095140950A 2005-11-04 2006-11-06 An analyzing device, a processing device, a measuring device, an exposure device, a substrate processing system, a resolving method, and a recording recording medium TWI413154B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005320281 2005-11-04

Publications (2)

Publication Number Publication Date
TW200719397A true TW200719397A (en) 2007-05-16
TWI413154B TWI413154B (en) 2013-10-21

Family

ID=38005852

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095140950A TWI413154B (en) 2005-11-04 2006-11-06 An analyzing device, a processing device, a measuring device, an exposure device, a substrate processing system, a resolving method, and a recording recording medium

Country Status (4)

Country Link
JP (1) JP5035685B2 (en)
KR (1) KR101555709B1 (en)
TW (1) TWI413154B (en)
WO (1) WO2007052699A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI397954B (en) * 2008-02-25 2013-06-01 東京威力科創股份有限公司 Substrate processing method, program and computer storage medium and substrate processing system

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5237690B2 (en) * 2008-05-16 2013-07-17 ルネサスエレクトロニクス株式会社 Manufacturing method of semiconductor device
KR101017109B1 (en) * 2008-11-26 2011-02-25 세메스 주식회사 Semiconductor manufacturing process monitoring method
JP2011054859A (en) * 2009-09-04 2011-03-17 Hitachi High-Technologies Corp Device and system for inspecting pattern for semiconductor device
NL2005719A (en) 2009-12-18 2011-06-21 Asml Netherlands Bv Method of measuring properties of dynamic positioning errors in a lithographic apparatus, data processing apparatus, and computer program product.
JP6107078B2 (en) * 2012-11-21 2017-04-05 大日本印刷株式会社 Imprint mold manufacturing method, pattern forming method, and semiconductor device manufacturing method
CN107278279B (en) * 2015-02-23 2020-07-03 株式会社尼康 Substrate processing system, substrate processing method, and device manufacturing method
JP7214417B2 (en) * 2018-09-20 2023-01-30 株式会社Ｓｃｒｅｅｎホールディングス Data processing method and data processing program
JP7188950B2 (en) 2018-09-20 2022-12-13 株式会社Ｓｃｒｅｅｎホールディングス Data processing method and data processing program
JP7329386B2 (en) * 2019-08-09 2023-08-18 コニアク ゲーエムベーハー Process control method for lithographically processed semiconductor devices
CN112967942B (en) * 2020-08-07 2023-03-10 重庆康佳光电技术研究院有限公司 Wafer testing method and device, computer storage medium and computer equipment

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3067142B2 (en) * 1989-11-28 2000-07-17 富士通株式会社 Photomask inspection apparatus and photomask inspection method
JP2003243288A (en) * 2002-02-15 2003-08-29 Canon Inc Processing equipment
JP4393146B2 (en) * 2003-09-25 2010-01-06 株式会社東芝 Semiconductor manufacturing method and semiconductor manufacturing apparatus
JP2005121286A (en) * 2003-10-16 2005-05-12 Matsushita Electric Ind Co Ltd Oxygen-enriched water heater
JP4649837B2 (en) * 2003-12-12 2011-03-16 株式会社ニコン Data analysis method, device manufacturing method and system

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI397954B (en) * 2008-02-25 2013-06-01 東京威力科創股份有限公司 Substrate processing method, program and computer storage medium and substrate processing system

Also Published As

Publication number Publication date
TWI413154B (en) 2013-10-21
JPWO2007052699A1 (en) 2009-04-30
JP5035685B2 (en) 2012-09-26
WO2007052699A1 (en) 2007-05-10
KR20080074942A (en) 2008-08-13
KR101555709B1 (en) 2015-09-25

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