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TW200717741A - Thermalsetting composition for sealing organic EL element - Google Patents

Thermalsetting composition for sealing organic EL element

Info

Publication number
TW200717741A
TW200717741A TW095124709A TW95124709A TW200717741A TW 200717741 A TW200717741 A TW 200717741A TW 095124709 A TW095124709 A TW 095124709A TW 95124709 A TW95124709 A TW 95124709A TW 200717741 A TW200717741 A TW 200717741A
Authority
TW
Taiwan
Prior art keywords
pts
organic
sealing
composition
molecular
Prior art date
Application number
TW095124709A
Other languages
Chinese (zh)
Other versions
TWI387071B (en
Inventor
Yoshihide Arai
Kenichi Horie
Original Assignee
Three Bond Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Three Bond Co Ltd filed Critical Three Bond Co Ltd
Publication of TW200717741A publication Critical patent/TW200717741A/en
Application granted granted Critical
Publication of TWI387071B publication Critical patent/TWI387071B/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/226—Mixtures of di-epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/5046—Amines heterocyclic
    • C08G59/5053—Amines heterocyclic containing only nitrogen as a heteroatom
    • C08G59/5073—Amines heterocyclic containing only nitrogen as a heteroatom having two nitrogen atoms in the ring
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/315—Compounds containing carbon-to-nitrogen triple bonds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H05B33/04—Sealing arrangements, e.g. against humidity
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Electroluminescent Light Sources (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

To provide a thermosetting composition for organic EL device sealing that attains sealing without detriment to the organic EL device so that the occurrence/growth of dark spots is surely inhibited with high transmittance retained to thereby maintain stable emission performance over a prolonged period of time. Sealing of organic EL device is carried out by the use of a composition comprising as main components 100 pts.wt. Of low-molecular-weight epoxy resin of 200 to 2000 molecular weight (A) having at least two glycidyl groups per molecule; 40 to 150 pts.wt. Of high-molecular-weight epoxy resin of 20,000 to 100,000 molecular weight (B) having a bisphenol A or bisphenol F skeleton; per 100 pts.wt. Of the sum of component (A) and component (B), 0.5 to 20 pts.wt. Of latent imidazole compound (C) having a nitrile group; and 0.1 to 10 pts.wt. Of silage coupling agent (D).
TW095124709A 2005-10-24 2006-07-06 Thermosetting composition for sealing organic EL elements TWI387071B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005308269A JP5288150B2 (en) 2005-10-24 2005-10-24 Thermosetting composition for sealing organic EL elements

Publications (2)

Publication Number Publication Date
TW200717741A true TW200717741A (en) 2007-05-01
TWI387071B TWI387071B (en) 2013-02-21

Family

ID=37967506

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095124709A TWI387071B (en) 2005-10-24 2006-07-06 Thermosetting composition for sealing organic EL elements

Country Status (5)

Country Link
JP (1) JP5288150B2 (en)
KR (1) KR101234895B1 (en)
CN (1) CN101243117B (en)
TW (1) TWI387071B (en)
WO (1) WO2007049385A1 (en)

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KR101376818B1 (en) * 2007-06-26 2014-03-21 엘지전자 주식회사 Organic Light Emitting Diode
WO2009047886A1 (en) 2007-10-12 2009-04-16 Panasonic Corporation Case mold type capacitor and method for manufacturing the same
KR20090076753A (en) 2008-01-08 2009-07-13 주식회사 엘지화학 Transparent resin composition
KR20090076754A (en) 2008-01-08 2009-07-13 주식회사 엘지화학 Optical film, retardation film, protective film and liquid crystal display device comprising the same
JP5881927B2 (en) * 2008-03-26 2016-03-09 日立化成株式会社 Semiconductor sealing adhesive, semiconductor sealing film adhesive, semiconductor device manufacturing method, and semiconductor device
JP5671778B2 (en) * 2008-03-26 2015-02-18 日立化成株式会社 Film-like adhesive for semiconductor sealing, semiconductor device and method for manufacturing the same
US8613986B2 (en) 2008-04-30 2013-12-24 Lg Chem, Ltd. Optical film and information technology apparatus comprising the same
KR101105424B1 (en) 2008-04-30 2012-01-17 주식회사 엘지화학 Resin composition and optical film formed using the same
KR101091534B1 (en) * 2008-04-30 2011-12-13 주식회사 엘지화학 Optical film and information electronic device including the same
JP5890177B2 (en) 2008-06-02 2016-03-22 スリーエム イノベイティブ プロパティズ カンパニー Adhesive encapsulating composition and electronic device produced using the same
JP2010080087A (en) * 2008-09-24 2010-04-08 Toshiba Corp Method of manufacturing flat panel display device, apparatus for manufacturing flat panel display device, and flat panel display device
JP5201347B2 (en) * 2008-11-28 2013-06-05 株式会社スリーボンド Photocurable resin composition for sealing organic EL elements
CN102388078B (en) * 2009-04-17 2013-09-25 三井化学株式会社 Sealing composite and sealing sheet
JP5619383B2 (en) * 2009-07-10 2014-11-05 モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 Composition for sealing organic light emitting device and organic light emitting device
KR20120055720A (en) * 2009-09-04 2012-05-31 가부시끼가이샤 쓰리본드 Organic el element sealing member
JP5429054B2 (en) * 2010-06-01 2014-02-26 住友ベークライト株式会社 Resin composition, metal foil with resin, and metal base substrate
US8674502B2 (en) 2010-07-16 2014-03-18 Hitachi Chemical Company, Ltd. Semiconductor-encapsulating adhesive, semiconductor-encapsulating film-form adhesive, method for producing semiconductor device, and semiconductor device
JP5651421B2 (en) * 2010-10-07 2015-01-14 三井化学株式会社 Sealing composition and sealing sheet using the same
TWI491638B (en) 2010-11-16 2015-07-11 Ind Tech Res Inst Thermosetting composition
WO2012138030A1 (en) * 2011-04-05 2012-10-11 제일모직 주식회사 Adhesive film for an organic el device, composite included in the adhesive film for an organic el device, and organic el display device including the adhesive film for an organic el device
JP6252473B2 (en) * 2012-07-05 2017-12-27 株式会社スリーボンド Sheet adhesive and organic EL panel using the same
KR102050341B1 (en) 2012-07-05 2019-11-29 도레이 카부시키가이샤 Binder resin composition for preform, binder particle, preform, and fiber-reinforced composite material
SG10201706103VA (en) * 2012-07-26 2017-09-28 Denki Kagaku Kogyo Kk Resin composition
KR20140071552A (en) 2012-11-23 2014-06-12 삼성디스플레이 주식회사 Organic light emitting display apparatus and manufacturing method thereof
KR101549735B1 (en) 2013-03-26 2015-09-02 제일모직주식회사 Composition for filling agent for encapsulating organic light emitting diode and organic light emitting diode display comprising the same
JP6152319B2 (en) 2013-08-09 2017-06-21 日東電工株式会社 Adhesive composition, adhesive tape or sheet
CN105073884B (en) 2013-09-24 2018-01-30 Lg化学株式会社 curable composition
JP2015096571A (en) * 2013-11-15 2015-05-21 日東電工株式会社 Photocurable resin composition and sheet made of photocurable resin composition using the same
WO2015087807A1 (en) * 2013-12-11 2015-06-18 積水化学工業株式会社 Curable resin composition for sealing organic electroluminescent display element, curable resin sheet for sealing organic electroluminescent display element, and organic electroluminescent display element
JP6549984B2 (en) * 2014-02-27 2019-07-24 積水化学工業株式会社 Curable resin composition for sealing an organic electroluminescence display device, curable resin sheet for sealing an organic electroluminescence display device, and an organic electroluminescence display device
TWI519560B (en) 2014-11-24 2016-02-01 財團法人工業技術研究院 Resin and resin composition containing oxetane group and epoxy group
KR101840219B1 (en) * 2015-08-31 2018-03-20 삼성에스디아이 주식회사 Low Temperature Curable Composition, Cured Film Prepared therefrom, and Electronic Device Incorporating the Cured Film
CN111819218A (en) * 2018-03-06 2020-10-23 日立化成株式会社 Prepreg, Laminate, Multilayer Printed Wiring Board, Semiconductor Package, and Resin Composition, and Method for Manufacturing Prepreg, Laminate, and Multilayer Printed Wiring Board
WO2019194041A1 (en) 2018-04-02 2019-10-10 三井化学株式会社 Sheet-shaped epoxy resin composition and cured product thereof, and sheet for sealing

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JP2003034708A (en) * 2001-07-24 2003-02-07 Nippon Kayaku Co Ltd Resin composition and its cured material
WO2003029321A1 (en) * 2001-09-28 2003-04-10 Sumitomo Bakelite Company, Ltd. Epoxy resin compositions and semiconductor devices
JP3757272B2 (en) * 2002-02-13 2006-03-22 国立大学法人富山大学 Organic electroluminescence device
JP2004059718A (en) * 2002-07-29 2004-02-26 Sumitomo Chem Co Ltd Thermosetting resin composition, and adhesive film obtained by molding the composition
CN100371403C (en) * 2003-04-21 2008-02-27 索玛株式会社 mfg. method of soaking adaptable liquid epoxy resin compound, and generator thereof
CN1989167A (en) * 2004-07-23 2007-06-27 大赛璐化学工业株式会社 Thermosetting resin composition, sealing material for optical device and cured product
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JP4816863B2 (en) * 2004-12-22 2011-11-16 株式会社スリーボンド Thermosetting composition for sealing organic EL elements

Also Published As

Publication number Publication date
WO2007049385A1 (en) 2007-05-03
JP5288150B2 (en) 2013-09-11
CN101243117B (en) 2010-11-10
TWI387071B (en) 2013-02-21
KR20080065582A (en) 2008-07-14
CN101243117A (en) 2008-08-13
KR101234895B1 (en) 2013-02-19
JP2007112956A (en) 2007-05-10

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