TW200702351A - Reactive epoxy carboxylates and actinic radiation curable resin compositions containing the same - Google Patents
Reactive epoxy carboxylates and actinic radiation curable resin compositions containing the sameInfo
- Publication number
- TW200702351A TW200702351A TW095112131A TW95112131A TW200702351A TW 200702351 A TW200702351 A TW 200702351A TW 095112131 A TW095112131 A TW 095112131A TW 95112131 A TW95112131 A TW 95112131A TW 200702351 A TW200702351 A TW 200702351A
- Authority
- TW
- Taiwan
- Prior art keywords
- carboxylates
- reactive
- radiation curable
- actinic radiation
- compositions containing
- Prior art date
Links
- 150000007942 carboxylates Chemical class 0.000 title abstract 5
- 239000004593 Epoxy Substances 0.000 title abstract 3
- 230000005855 radiation Effects 0.000 title abstract 2
- 239000011342 resin composition Substances 0.000 title 1
- 239000002253 acid Substances 0.000 abstract 3
- 150000007513 acids Chemical class 0.000 abstract 3
- 239000003822 epoxy resin Substances 0.000 abstract 2
- 239000000203 mixture Substances 0.000 abstract 2
- 229920000647 polyepoxide Polymers 0.000 abstract 2
- 150000008065 acid anhydrides Chemical class 0.000 abstract 1
- 125000000217 alkyl group Chemical group 0.000 abstract 1
- 125000004432 carbon atom Chemical group C* 0.000 abstract 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 abstract 1
- 150000001875 compounds Chemical class 0.000 abstract 1
- 125000005843 halogen group Chemical group 0.000 abstract 1
- 229910052739 hydrogen Inorganic materials 0.000 abstract 1
- 239000001257 hydrogen Substances 0.000 abstract 1
- 125000004435 hydrogen atom Chemical class [H]* 0.000 abstract 1
- 238000005984 hydrogenation reaction Methods 0.000 abstract 1
- 150000007519 polyprotic acids Polymers 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F299/00—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers
- C08F299/02—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates
- C08F299/026—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates from the reaction products of polyepoxides and unsaturated monocarboxylic acids, their anhydrides, halogenides or esters with low molecular weight
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
- C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
- C08F290/06—Polymers provided for in subclass C08G
- C08F290/064—Polymers containing more than one epoxy group per molecule
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/14—Polycondensates modified by chemical after-treatment
- C08G59/1433—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds
- C08G59/1438—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds containing oxygen
- C08G59/1455—Monocarboxylic acids, anhydrides, halides, or low-molecular-weight esters thereof
- C08G59/1461—Unsaturated monoacids
- C08G59/1466—Acrylic or methacrylic acids
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Emergency Medicine (AREA)
- General Chemical & Material Sciences (AREA)
- Epoxy Resins (AREA)
- Macromonomer-Based Addition Polymer (AREA)
Abstract
To provide reactive epoxy carboxylates and reactive polycarboxylic acids which are little deteriorated by light and can give cured articles having well-balanced toughness. FOR Reactive epoxy carboxylates (A) obtained by reacting (a) a hydrogenated epoxy resin which is a product of nuclear hydrogenation of an epoxy resin represented by the general formula (1) with (b) a compound having in the molecule one or more polymerizable ethylenically unsaturated groups and one or more carboxyl groups; reactive polycarboxylic acids (c) obtained by reacting the carboxylates (A) with (C) a polybasic acid anhydride; actinic radiation curable compositions containing the carboxylates (A) or the polycarboxylic acids (C); and use of the compositions: (1) wherein R1's are each independently hydrogen, halogeno, or alkyl of 1 to 4 carbon atoms; m is an integer of 1 to 4; and n is a positive number of 1 to 6 on the average.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005110540 | 2005-04-07 | ||
| JP2005123303 | 2005-04-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW200702351A true TW200702351A (en) | 2007-01-16 |
Family
ID=37086854
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW095112131A TW200702351A (en) | 2005-04-07 | 2006-04-06 | Reactive epoxy carboxylates and actinic radiation curable resin compositions containing the same |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP4986059B2 (en) |
| TW (1) | TW200702351A (en) |
| WO (1) | WO2006109572A1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI468430B (en) * | 2007-08-21 | 2015-01-11 | Nippon Kayaku Kk | A reactive carboxylic acid ester compound, an active energy ray-hardening resin composition using the same, and a use thereof |
| TWI476253B (en) * | 2011-01-12 | 2015-03-11 | Prior Company Ltd | Method for forming double-curing coating, hard coating, and hard coating |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5172321B2 (en) * | 2006-12-26 | 2013-03-27 | 三井化学株式会社 | Liquid crystal sealant |
| TW200837093A (en) * | 2007-01-16 | 2008-09-16 | Nippon Kayaku Kk | Carboxylate resin and resin composition containing the carboxylate resin |
| JP5362186B2 (en) * | 2007-03-24 | 2013-12-11 | 株式会社ダイセル | Resin composition for nanoimprint |
| JP5269449B2 (en) * | 2007-03-24 | 2013-08-21 | 株式会社ダイセル | Curable resin composition for nanoimprint |
| JPWO2009123276A1 (en) * | 2008-04-04 | 2011-07-28 | 日本化薬株式会社 | Epoxy compound having protecting group and curable resin composition containing the same |
| JP5739609B2 (en) * | 2009-09-16 | 2015-06-24 | 互応化学工業株式会社 | Photosensitive resin composition, solder resist composition and printed wiring board |
| JP5731229B2 (en) | 2010-08-20 | 2015-06-10 | 株式会社タムラ製作所 | Alkali-soluble transparent resin composition |
| WO2012111186A1 (en) * | 2011-02-15 | 2012-08-23 | 株式会社プリンテック | Transparent resin substrate |
| JP5710356B2 (en) * | 2011-04-18 | 2015-04-30 | 日本化薬株式会社 | Energy ray curable resin composition for optical lens sheet and cured product thereof |
| JP5878913B2 (en) * | 2013-12-17 | 2016-03-08 | 互応化学工業株式会社 | Photosensitive resin composition, composition for solder resist, printed wiring board, and method for producing photosensitive resin composition |
| JP6055028B2 (en) * | 2015-05-29 | 2016-12-27 | 互応化学工業株式会社 | Photosensitive resin composition, solder resist composition and printed wiring board |
| CN110366704B (en) * | 2017-03-30 | 2023-01-13 | 日本瑞翁株式会社 | Radiation-sensitive resin composition and electronic component |
| JP7478553B2 (en) * | 2020-03-02 | 2024-05-07 | 日鉄ケミカル&マテリアル株式会社 | Hydrogenated compound and its manufacturing method, polymerizable unsaturated group-containing alkali-soluble resin, photosensitive resin composition containing same, cured product obtained by curing the same, and touch panel and color filter containing the cured product as a constituent component |
| CN111748077B (en) | 2019-03-29 | 2025-04-18 | 日铁化学材料株式会社 | Alkali-soluble resin, hydrogenated compound and method for producing the same, resin composition and cured film thereof, touch panel and optical filter |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11140144A (en) * | 1997-11-04 | 1999-05-25 | Nippon Kayaku Co Ltd | Resin composition and cured product thereof |
| JPH11189631A (en) * | 1997-12-26 | 1999-07-13 | Nippon Kayaku Co Ltd | Resin composition, cured product thereof, and printed wiring board |
| JP2002220425A (en) * | 2001-01-25 | 2002-08-09 | Nippon Kayaku Co Ltd | Resin composition, solder resist resin composition and their cured items |
| JP2003321636A (en) * | 2002-04-30 | 2003-11-14 | Dainippon Ink & Chem Inc | Active energy ray-curable resin composition for flexo ink |
| JP4554170B2 (en) * | 2003-06-03 | 2010-09-29 | 株式会社タムラ製作所 | UV curable alkali-soluble resin, UV curable resin for solder resist film and printed wiring board |
| JP2005062449A (en) * | 2003-08-12 | 2005-03-10 | Kyocera Chemical Corp | Photosensitive resin composition |
| JP4623499B2 (en) * | 2004-12-17 | 2011-02-02 | 日本化薬株式会社 | Hydrogenated epoxy resin |
| CN102604512A (en) * | 2005-03-15 | 2012-07-25 | 日本化药株式会社 | Epoxy resin, epoxy resin composition, and utilizing the same, prepreg and laminated plate |
-
2006
- 2006-03-29 JP JP2007512793A patent/JP4986059B2/en not_active Expired - Fee Related
- 2006-03-29 WO PCT/JP2006/306471 patent/WO2006109572A1/en not_active Ceased
- 2006-04-06 TW TW095112131A patent/TW200702351A/en unknown
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI468430B (en) * | 2007-08-21 | 2015-01-11 | Nippon Kayaku Kk | A reactive carboxylic acid ester compound, an active energy ray-hardening resin composition using the same, and a use thereof |
| TWI476253B (en) * | 2011-01-12 | 2015-03-11 | Prior Company Ltd | Method for forming double-curing coating, hard coating, and hard coating |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2006109572A1 (en) | 2006-10-19 |
| JP4986059B2 (en) | 2012-07-25 |
| JPWO2006109572A1 (en) | 2008-10-30 |
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