TW200702067A - Ultrafine nozzle and method for producing the same - Google Patents
Ultrafine nozzle and method for producing the sameInfo
- Publication number
- TW200702067A TW200702067A TW095105816A TW95105816A TW200702067A TW 200702067 A TW200702067 A TW 200702067A TW 095105816 A TW095105816 A TW 095105816A TW 95105816 A TW95105816 A TW 95105816A TW 200702067 A TW200702067 A TW 200702067A
- Authority
- TW
- Taiwan
- Prior art keywords
- core wire
- nozzle
- electroforming
- electroformed
- producing
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title abstract 3
- 238000005323 electroforming Methods 0.000 abstract 3
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 abstract 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 abstract 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 abstract 1
- 229910052737 gold Inorganic materials 0.000 abstract 1
- 239000010931 gold Substances 0.000 abstract 1
- 239000007788 liquid Substances 0.000 abstract 1
- 229910052751 metal Inorganic materials 0.000 abstract 1
- 239000002184 metal Substances 0.000 abstract 1
- 229910052763 palladium Inorganic materials 0.000 abstract 1
- 229910052709 silver Inorganic materials 0.000 abstract 1
- 239000004332 silver Substances 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
- C25D1/02—Tubes; Rings; Hollow bodies
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B1/00—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Micromachines (AREA)
- Coating Apparatus (AREA)
- Nozzles (AREA)
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
To provide an ultrafine nozzle in which the inside diameter of the tip is made into the fine one of ≤ 30 μm, and further, the wall thickness is made thin, thus the discharge of a liquid is made smooth, and which is applicable to various apparatuses for medical use or industrial use, and to provide a method for producing the same. In the production method, a core wire 43 is subjected to special electroforming (first electroforming), and a part of the core wire 43 is exposed to thereby form a taper-shaped electroformed tube 41 with the core wire 43 attached thereto, further, second electroforming is performed to form a second electroformed tube 44, and thereafter, the core wire 43 and the first electroformed tube 41 are pulled out, thus the integrated type ultraprecise nozzle using the electroformed tubes with different inside/outside diameters is formed. The tip part of the nozzle may be subjected to taper working, and the inside and outside may be plated with metal such as gold, silver and palladium.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005046218A JP4686209B2 (en) | 2005-02-22 | 2005-02-22 | Ultra-fine nozzle and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200702067A true TW200702067A (en) | 2007-01-16 |
| TWI298647B TWI298647B (en) | 2008-07-11 |
Family
ID=36927261
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW095105816A TW200702067A (en) | 2005-02-22 | 2006-02-21 | Ultrafine nozzle and method for producing the same |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP4686209B2 (en) |
| TW (1) | TW200702067A (en) |
| WO (1) | WO2006090620A1 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2011078160A1 (en) * | 2009-12-22 | 2011-06-30 | Motoyama Osamu | Endoscope with extremely small diameter |
| JP5294101B1 (en) * | 2013-03-15 | 2013-09-18 | 広樹 中田 | Laval nozzle electroforming method and electroformed laval nozzle |
| JP6046078B2 (en) * | 2014-05-16 | 2016-12-14 | フェムトディプロイメンツ株式会社 | Liquid film nozzle device, injection needle, syringe, syringe-type liquid film generation device, liquid sterilization device, liquid screen forming device, and liquid film nozzle device manufacturing method |
| JP6127239B1 (en) * | 2016-07-28 | 2017-05-17 | クラスターテクノロジー株式会社 | Dispenser nozzle and fluid dispensing apparatus using the same |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5836063B2 (en) * | 1981-07-20 | 1983-08-06 | 日本電信電話株式会社 | Manufacturing method for nozzle molding mold |
| JP2002332588A (en) * | 2001-05-07 | 2002-11-22 | Hikari Tekku Kk | Method of manufacturing high-accuracy tubular parts by electroforming |
| WO2003031693A1 (en) * | 2001-09-28 | 2003-04-17 | Optical Forming Corporation | Electroforming system and electroforming method |
| JP2003147568A (en) * | 2001-11-02 | 2003-05-21 | Nippon Ceramic Co Ltd | Method of manufacturing connecting tool by electroforming method |
-
2005
- 2005-02-22 JP JP2005046218A patent/JP4686209B2/en not_active Expired - Fee Related
-
2006
- 2006-02-15 WO PCT/JP2006/302625 patent/WO2006090620A1/en not_active Ceased
- 2006-02-21 TW TW095105816A patent/TW200702067A/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| JP2006233244A (en) | 2006-09-07 |
| WO2006090620A1 (en) | 2006-08-31 |
| JP4686209B2 (en) | 2011-05-25 |
| TWI298647B (en) | 2008-07-11 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |