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TW200709327A - Processor and aligning method - Google Patents

Processor and aligning method

Info

Publication number
TW200709327A
TW200709327A TW095117510A TW95117510A TW200709327A TW 200709327 A TW200709327 A TW 200709327A TW 095117510 A TW095117510 A TW 095117510A TW 95117510 A TW95117510 A TW 95117510A TW 200709327 A TW200709327 A TW 200709327A
Authority
TW
Taiwan
Prior art keywords
substrate
processor
process chamber
aligning method
positioners
Prior art date
Application number
TW095117510A
Other languages
Chinese (zh)
Other versions
TWI390657B (en
Inventor
Akihiko Shimura
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of TW200709327A publication Critical patent/TW200709327A/en
Application granted granted Critical
Publication of TWI390657B publication Critical patent/TWI390657B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67201—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the load-lock chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67069—Apparatus for fluid treatment for etching for drying etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67236—Apparatus for manufacturing or treating in a plurality of work-stations the substrates being processed being not semiconductor wafers, e.g. leadframes or chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Drying Of Semiconductors (AREA)

Abstract

To make alignment for accurate control of position of a substrate in a process chamber even if a plurality of process chambers are provided. In a load lock chamber 30, positioners 33a, 33b, 33c, and 33d are arranged for aligning a substrate S placed on buffers 31 and 32. A rectangular substrate S is pressed at four points by the abutment block 36 of the positioners 33a, 33b, 33c, and 33d, in the load lock chamber 30 for alignment in X-Y direction. The position is set for each process chamber, corresponding to processing position in each process chamber.
TW095117510A 2005-05-18 2006-05-17 Processing device and alignment method TWI390657B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005144886A JP4849825B2 (en) 2005-05-18 2005-05-18 Processing apparatus, alignment method, control program, and computer storage medium

Publications (2)

Publication Number Publication Date
TW200709327A true TW200709327A (en) 2007-03-01
TWI390657B TWI390657B (en) 2013-03-21

Family

ID=37425464

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095117510A TWI390657B (en) 2005-05-18 2006-05-17 Processing device and alignment method

Country Status (4)

Country Link
JP (1) JP4849825B2 (en)
KR (1) KR100809125B1 (en)
CN (2) CN101447444B (en)
TW (1) TWI390657B (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101007710B1 (en) * 2008-03-26 2011-01-13 주식회사 에스에프에이 Load Lock Chamber of Chemical Vapor Deposition Equipment
TWI458587B (en) * 2012-01-17 2014-11-01 Chin Yen Wang Calibration apparatus
CN103569672B (en) * 2012-07-20 2016-03-09 上海微电子装备有限公司 The transmitting device of a kind of compatible silicon chip and glass substrate
JP2014075432A (en) * 2012-10-03 2014-04-24 Hioki Ee Corp Substrate support device and substrate checking device
CN105529278B (en) * 2014-09-29 2019-08-16 盛美半导体设备（上海）有限公司 Process the device of semiconductor structure
JP6298109B2 (en) * 2016-07-08 2018-03-20 キヤノントッキ株式会社 Substrate processing apparatus and alignment method
JP7105629B2 (en) * 2018-06-20 2022-07-25 東京エレクトロン株式会社 Automatic teaching method and control device
CN109904101B (en) * 2019-01-28 2021-09-03 拓荆科技股份有限公司 Wafer transferring and measuring system
JP7259476B2 (en) 2019-03-27 2023-04-18 東京エレクトロン株式会社 Alignment apparatus, substrate processing apparatus, alignment method, and substrate processing method
CN110504185B (en) * 2019-08-27 2022-02-11 北京芯可鉴科技有限公司 ESD Protection Unit Test and Reinforcement Method
JP7578362B2 (en) 2021-03-04 2024-11-06 東京エレクトロン株式会社 SUBSTRATE POSITION CONTROL METHOD AND SUBSTRATE PROCESSING SYSTEM
CN117352452A (en) * 2023-11-23 2024-01-05 北京北方华创微电子装备有限公司 Semiconductor process equipment and calibration device thereof

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2622525B2 (en) * 1989-03-31 1997-06-18 東京エレクトロン株式会社 Liquid crystal substrate manufacturing equipment
US5558482A (en) * 1992-07-29 1996-09-24 Tokyo Electron Limited Multi-chamber system
JP3139155B2 (en) * 1992-07-29 2001-02-26 東京エレクトロン株式会社 Vacuum processing equipment
JP3335983B2 (en) * 1993-02-26 2002-10-21 東京エレクトロン株式会社 LCD glass substrate alignment mechanism and vacuum processing device
JP3299338B2 (en) * 1993-04-28 2002-07-08 東京エレクトロン株式会社 Vacuum processing equipment
JP3350234B2 (en) * 1994-06-06 2002-11-25 東京エレクトロン株式会社 Object buffer device, processing device using the same, and method of transporting the same
JP3650495B2 (en) * 1995-12-12 2005-05-18 東京エレクトロン株式会社 Semiconductor processing apparatus, substrate replacement mechanism and substrate replacement method thereof
JP4674705B2 (en) * 1998-10-27 2011-04-20 東京エレクトロン株式会社 Transport position adjusting method and transport system of transport system
US7280883B2 (en) * 2001-09-06 2007-10-09 Dainippon Screen Mfg. Co., Ltd. Substrate processing system managing apparatus information of substrate processing apparatus
KR20030043220A (en) * 2001-11-27 2003-06-02 엘지.필립스 엘시디 주식회사 Apparatus for sensing breakage in base glass plate of LCD
JP2004241428A (en) * 2003-02-03 2004-08-26 Tokyo Electron Ltd Substrate treatment device and method therefor
EP1450392A1 (en) * 2003-02-20 2004-08-25 Applied Materials, Inc. Methods and apparatus for positioning a substrate relative to a support stage
JP4376116B2 (en) * 2003-06-03 2009-12-02 東京エレクトロン株式会社 How to adjust the board delivery position
KR100523277B1 (en) * 2003-06-10 2005-10-25 브룩스오토메이션아시아(주) Aligner of load lock device

Also Published As

Publication number Publication date
JP4849825B2 (en) 2012-01-11
CN101447444B (en) 2011-04-13
TWI390657B (en) 2013-03-21
KR100809125B1 (en) 2008-03-03
CN101447444A (en) 2009-06-03
CN100511633C (en) 2009-07-08
CN1866493A (en) 2006-11-22
JP2006324366A (en) 2006-11-30
KR20060119815A (en) 2006-11-24

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