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TW200707721A - Encapsulation device and method for encapsulation - Google Patents

Encapsulation device and method for encapsulation

Info

Publication number
TW200707721A
TW200707721A TW095121270A TW95121270A TW200707721A TW 200707721 A TW200707721 A TW 200707721A TW 095121270 A TW095121270 A TW 095121270A TW 95121270 A TW95121270 A TW 95121270A TW 200707721 A TW200707721 A TW 200707721A
Authority
TW
Taiwan
Prior art keywords
resin
chamber
seal
encapsulation
irradiation
Prior art date
Application number
TW095121270A
Other languages
Chinese (zh)
Other versions
TWI422027B (en
Inventor
Toshio Negishi
Original Assignee
Ulvac Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ulvac Inc filed Critical Ulvac Inc
Publication of TW200707721A publication Critical patent/TW200707721A/en
Application granted granted Critical
Publication of TWI422027B publication Critical patent/TWI422027B/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H05B33/04—Sealing arrangements, e.g. against humidity
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

There are provided a sealing device and a sealing method capable of curing a resin in a short time and suppressing affect of heat to a seal object portion when performing sealing by using a ultraviolet cure resin. The sealing device includes an alignment bonding chamber (3) into which nitrogen gas can be introduced and an UV irradiation chamber (4) having a UV irradiation lamp (30). In the alignment bonding chamber (3), a seal glass substrate (7) and a substrate (9) are placed on a convey mechanism (15) and pressurized bonding is performed by using UV cure type seal resin (7a). After this, the convey mechanism (15) carries an organic EL panel (40) out of the alignment bonding chamber (3) into the UV irradiation chamber (4), where the seal resin (7a) is cured.
TW095121270A 2005-06-15 2006-06-14 Sealing device and sealing method TWI422027B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005175632 2005-06-15

Publications (2)

Publication Number Publication Date
TW200707721A true TW200707721A (en) 2007-02-16
TWI422027B TWI422027B (en) 2014-01-01

Family

ID=37532225

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095121270A TWI422027B (en) 2005-06-15 2006-06-14 Sealing device and sealing method

Country Status (5)

Country Link
JP (1) JP4827842B2 (en)
KR (1) KR100882178B1 (en)
CN (1) CN100514707C (en)
TW (1) TWI422027B (en)
WO (1) WO2006134863A1 (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102012581B (en) * 2010-09-30 2012-08-22 深圳市华星光电技术有限公司 Liquid crystal box forming device and method
JP5619175B2 (en) * 2010-10-20 2014-11-05 株式会社アルバック Organic film formation method
CN102184935B (en) * 2011-04-02 2012-08-08 东莞宏威数码机械有限公司 OLED display screen packaging equipment and method for pressing and packaging
CN102270742B (en) * 2011-08-29 2013-04-17 电子科技大学 Organic optoelectronic device wrapper and device packaging method
JP6066055B2 (en) * 2012-12-06 2017-01-25 Ａｉメカテック株式会社 Organic EL sealing device
JP6066054B2 (en) * 2012-12-06 2017-01-25 Ａｉメカテック株式会社 Organic EL sealing device, sealing roll film manufacturing device, and organic EL sealing system
CN104051495B (en) 2014-05-28 2017-02-15 京东方科技集团股份有限公司 Packaging device and packaging equipment
WO2016147536A1 (en) * 2015-03-16 2016-09-22 セイコーエプソン株式会社 Electronic component transport device and electronic component inspection device
CN108093649A (en) * 2015-03-16 2018-05-29 精工爱普生株式会社 Electronic component handling apparatus and electronic component inspection device
CN104821377B (en) * 2015-05-05 2017-07-21 合肥京东方光电科技有限公司 Paster packaging system and method
CN106654061B (en) 2016-12-26 2019-04-02 武汉华星光电技术有限公司 A kind of ultraviolet lamp for LED package
CN117621334A (en) * 2023-11-28 2024-03-01 深圳视爵光旭电子有限公司 A jig for display module production and its use method

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4785269B2 (en) * 2000-05-02 2011-10-05 株式会社半導体エネルギー研究所 Manufacturing method of light emitting device and cleaning method of film forming device
JP2002203682A (en) * 2000-10-26 2002-07-19 Semiconductor Energy Lab Co Ltd Light-emitting device and its manufacturing method
TW550672B (en) * 2001-02-21 2003-09-01 Semiconductor Energy Lab Method and apparatus for film deposition
JP2002322556A (en) * 2001-02-21 2002-11-08 Semiconductor Energy Lab Co Ltd Film forming method and film forming apparatus
KR100549100B1 (en) * 2001-06-14 2006-02-02 미쓰보시 다이야몬도 고교 가부시키가이샤 Organic EL display manufacturing apparatus and organic EL display manufacturing method
JP3811943B2 (en) * 2001-07-06 2006-08-23 日本精機株式会社 Manufacturing method of organic EL panel.
JP2003086355A (en) * 2001-09-05 2003-03-20 Kiko Kenji Kagi Kofun Yugenkoshi Sealing structure of organic EL element, sealing method and sealing device
US20040035360A1 (en) * 2002-05-17 2004-02-26 Semiconductor Energy Laboratory Co., Ltd. Manufacturing apparatus
JP4450589B2 (en) * 2003-09-09 2010-04-14 株式会社アルバック Deposition equipment
JP4327544B2 (en) * 2003-09-24 2009-09-09 株式会社アルバック Deposition equipment
KR100558558B1 (en) * 2004-01-26 2006-03-10 삼성전자주식회사 Multi Chamber Process Equipment

Also Published As

Publication number Publication date
CN101069453A (en) 2007-11-07
CN100514707C (en) 2009-07-15
JP4827842B2 (en) 2011-11-30
JPWO2006134863A1 (en) 2009-01-08
TWI422027B (en) 2014-01-01
WO2006134863A1 (en) 2006-12-21
KR20070072602A (en) 2007-07-04
KR100882178B1 (en) 2009-02-06

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees