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TW200707718A - Bidirectional transceiver assembly for POF application - Google Patents

Bidirectional transceiver assembly for POF application

Info

Publication number
TW200707718A
TW200707718A TW094134510A TW94134510A TW200707718A TW 200707718 A TW200707718 A TW 200707718A TW 094134510 A TW094134510 A TW 094134510A TW 94134510 A TW94134510 A TW 94134510A TW 200707718 A TW200707718 A TW 200707718A
Authority
TW
Taiwan
Prior art keywords
pof
application
transceiver assembly
bidirectional transceiver
light
Prior art date
Application number
TW094134510A
Other languages
English (en)
Inventor
Dong Pan
Jurgen Michel
Edward H Sargent
Wojciech Giziewicz
Lionel C Kimerling
Original Assignee
Massachusetts Inst Technology
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Massachusetts Inst Technology filed Critical Massachusetts Inst Technology
Publication of TW200707718A publication Critical patent/TW200707718A/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/026—Monolithically integrated components, e.g. waveguides, monitoring photo-detectors, drivers
    • H01S5/0262—Photo-diodes, e.g. transceiver devices, bidirectional devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/16—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of types provided for in two or more different subclasses of H10B, H10D, H10F, H10H, H10K or H10N, e.g. forming hybrid circuits
    • H01L25/167—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of types provided for in two or more different subclasses of H10B, H10D, H10F, H10H, H10K or H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0225—Out-coupling of light
    • H01S5/02251—Out-coupling of light using optical fibres
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/023—Mount members, e.g. sub-mount members
    • H01S5/02325—Mechanically integrated components on mount members or optical micro-benches
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/026—Monolithically integrated components, e.g. waveguides, monitoring photo-detectors, drivers
    • H01S5/0261—Non-optical elements, e.g. laser driver components, heaters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
    • H01S5/18—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities
    • H01S5/183—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
    • H01S5/42—Arrays of surface emitting lasers
    • H01S5/423—Arrays of surface emitting lasers having a vertical cavity

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Semiconductor Lasers (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Optical Communication System (AREA)
TW094134510A 2005-08-01 2005-10-03 Bidirectional transceiver assembly for POF application TW200707718A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/194,343 US7606499B2 (en) 2005-08-01 2005-08-01 Bidirectional transceiver assembly for POF application

Publications (1)

Publication Number Publication Date
TW200707718A true TW200707718A (en) 2007-02-16

Family

ID=37667668

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094134510A TW200707718A (en) 2005-08-01 2005-10-03 Bidirectional transceiver assembly for POF application

Country Status (3)

Country Link
US (1) US7606499B2 (zh)
TW (1) TW200707718A (zh)
WO (1) WO2007015702A2 (zh)

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KR100810209B1 (ko) * 2005-12-29 2008-03-07 삼성전자주식회사 반이중 통신방식의 광연결 구조 및 이에 적합한 광소자
US8687664B2 (en) * 2006-03-08 2014-04-01 Agere Systems Llc Laser assembly with integrated photodiode
US20070274642A1 (en) * 2006-04-12 2007-11-29 Fujifilm Corporation Optical transmission system
JP4911774B2 (ja) * 2007-07-25 2012-04-04 パナソニック株式会社 光送受信装置及びそれを用いた光通信システム
EP2564527B1 (en) 2010-04-28 2017-11-15 Huawei Technologies Co., Ltd. Cross-talk reduction in a bidirectional optoelectronic device
EP2586139A2 (en) * 2010-06-25 2013-05-01 Hoya Corporation USA Cross-talk reduction in a bidirectional optoelectronic device
CN102375185B (zh) * 2010-08-20 2013-11-13 国碁电子(中山)有限公司 光收发器及其制造方法
WO2012033724A2 (en) 2010-09-06 2012-03-15 Hoya Corporation Usa Cross-talk reduction in a bidirectional optoelectronic device
US8834041B2 (en) 2011-09-29 2014-09-16 Corning Cable Systems Llc Ferrule-based optical component assemblies
WO2013063410A1 (en) 2011-10-28 2013-05-02 Hoya Corporation Usa Optical waveguide splitter on a waveguide substrate for attenuating a light source
CN103837945A (zh) * 2012-11-28 2014-06-04 浜松光子学株式会社 单芯光收发器
US9105807B2 (en) 2013-04-22 2015-08-11 Avago Technologies General Ip (Singapore) Pte. Ltd. Semiconductor optical emitting device with grooved substrate providing multiple angled light emission paths

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5031188A (en) * 1990-04-30 1991-07-09 At&T Bell Laboratories Inline diplex lightwave transceiver
JPH06120906A (ja) * 1992-10-03 1994-04-28 Canon Inc 光レシーバ、光半導体装置及びそれを用いた光通信方式及び光通信システム
DE4444470A1 (de) 1994-11-29 1996-05-30 Hertz Inst Heinrich Sender/Empfänger-Anordnung für ein optisches Duplexsystem
JPH11352363A (ja) 1998-06-09 1999-12-24 Sony Corp 光送受信装置と光送受信装置の組み立て方法
DE19834090A1 (de) * 1998-07-29 2000-02-03 Heidenhain Gmbh Dr Johannes Optoelektronische Sende- und Empfangseinheit
GB2374461B (en) * 1999-11-30 2004-10-27 Omron Tateisi Electronics Co Optical device and apparatus comprising the optical device
US6344664B1 (en) 1999-12-02 2002-02-05 Tera Connect Inc. Electro-optical transceiver system with controlled lateral leakage and method of making it
JP2001242348A (ja) 1999-12-24 2001-09-07 Asahi Kasei Corp 光通信方法及び光通信リンク
US6496291B1 (en) * 2000-10-17 2002-12-17 Intel Corporation Optical serial link
JP2002261300A (ja) * 2000-12-25 2002-09-13 Sumitomo Electric Ind Ltd 光受信器
US7941056B2 (en) * 2001-08-30 2011-05-10 Micron Technology, Inc. Optical interconnect in high-speed memory systems
JP3925134B2 (ja) 2001-09-28 2007-06-06 ソニー株式会社 光送受信器
JP2004191396A (ja) * 2002-12-06 2004-07-08 Sony Corp 光送受信装置
JP2004198719A (ja) * 2002-12-18 2004-07-15 Tdk Corp 光モジュール及びその製造方法
US7456476B2 (en) * 2003-06-27 2008-11-25 Intel Corporation Nonplanar semiconductor device with partially or fully wrapped around gate electrode and methods of fabrication
JP2005049830A (ja) 2003-07-14 2005-02-24 Fuji Photo Film Co Ltd 光信号伝送システム
US7455463B2 (en) * 2004-06-02 2008-11-25 Finisar Corporation High density array of optical transceiver modules
WO2006113725A2 (en) * 2005-04-18 2006-10-26 The Regents Of The University Of California Optical transceiver integratable with silicon vlsi

Also Published As

Publication number Publication date
WO2007015702A2 (en) 2007-02-08
WO2007015702A3 (en) 2007-04-12
US20070025405A1 (en) 2007-02-01
US7606499B2 (en) 2009-10-20

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