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TW200643617A - Radiation-emitting semiconductor chip and method to produce a semiconductor-body for such a semiconductor chip - Google Patents

Radiation-emitting semiconductor chip and method to produce a semiconductor-body for such a semiconductor chip

Info

Publication number
TW200643617A
TW200643617A TW095101580A TW95101580A TW200643617A TW 200643617 A TW200643617 A TW 200643617A TW 095101580 A TW095101580 A TW 095101580A TW 95101580 A TW95101580 A TW 95101580A TW 200643617 A TW200643617 A TW 200643617A
Authority
TW
Taiwan
Prior art keywords
support
semiconductor chip
pattern
photosensitive layer
semiconductor
Prior art date
Application number
TW095101580A
Other languages
Chinese (zh)
Inventor
Masanobu Takashima
Original Assignee
Fuji Photo Film Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Photo Film Co Ltd filed Critical Fuji Photo Film Co Ltd
Publication of TW200643617A publication Critical patent/TW200643617A/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/11—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/029—Inorganic compounds; Onium compounds; Organic compounds having hetero atoms other than oxygen, nitrogen or sulfur
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0023—Etching of the substrate by chemical or physical means by exposure and development of a photosensitive insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0082—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the exposure method of radiation-sensitive masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Structural Engineering (AREA)
  • Engineering & Computer Science (AREA)
  • Architecture (AREA)
  • Inorganic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Materials For Photolithography (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)

Abstract

The object of the present invention is to provide a pattern-forming material which is high photosensitive and capable of forming a pattern with higher fineness, by means of using a high transparent substance as a support and designating the total thickness: and form a permanent pattern of such as solder resist as an object. Therefore, provided is a pattern-forming material having a support, and at least a photosensitive layer and a prospective layer on said support, wherein the photosensitive layer comprising at least a binder, a polymerizable compound, an optical polymerization initiator and a heat crosslinking agent; as well as total thickness of the support, photosensitive layer and prospective layer is 30 to 200 μm, and the minimum energy being used in the said exposure and without changing the thickness of the portion to be exposed of said photosensitive layer before exposure and after development is 0.1 to 200 mJ/cm<SP>2</SP>.
TW095101580A 2005-01-17 2006-01-16 Radiation-emitting semiconductor chip and method to produce a semiconductor-body for such a semiconductor chip TW200643617A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005009330 2005-01-17

Publications (1)

Publication Number Publication Date
TW200643617A true TW200643617A (en) 2006-12-16

Family

ID=36677658

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095101580A TW200643617A (en) 2005-01-17 2006-01-16 Radiation-emitting semiconductor chip and method to produce a semiconductor-body for such a semiconductor chip

Country Status (5)

Country Link
JP (1) JPWO2006075633A1 (en)
KR (1) KR20070095947A (en)
CN (1) CN101107565A (en)
TW (1) TW200643617A (en)
WO (1) WO2006075633A1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8487030B2 (en) 2009-07-09 2013-07-16 Cheil Industries Inc. Organic-inorganic hybrid composition and image sensor
US8502334B2 (en) 2009-04-09 2013-08-06 Cheil Industries Inc. Image sensor and method for manufacturing the same

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5163494B2 (en) * 2006-08-31 2013-03-13 Ｊｓｒ株式会社 Radiation-sensitive insulating resin composition, cured product, and electronic device
JP7011386B2 (en) * 2016-11-16 2022-01-26 キヤノン株式会社 Adhesion layer forming composition and article manufacturing method
WO2023286724A1 (en) * 2021-07-12 2023-01-19 株式会社ニコン Exposure apparatus

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3452597B2 (en) * 1993-02-08 2003-09-29 日立化成工業株式会社 Photosensitive resin composition laminate
JP3100040B2 (en) * 1997-07-04 2000-10-16 日本合成化学工業株式会社 Photoresist film
JPH11240109A (en) * 1998-02-25 1999-09-07 Hitachi Chem Co Ltd Laminated film for forming permanent protecting coating film and manufacture of permanent protecting coating film using this laminated film
WO2000058788A1 (en) * 1999-03-26 2000-10-05 Nippon Steel Chemical Co., Ltd. Photopolymerizable layered product with high resolution and semiconductor device made with the same
JP2001013681A (en) * 1999-06-28 2001-01-19 Hitachi Chem Co Ltd Photosensitive element, production of resist pattern, and production of printed wiring board
JP4495841B2 (en) * 2000-08-18 2010-07-07 帝人株式会社 Polyester film for dry film resist
JP4731787B2 (en) * 2002-04-10 2011-07-27 富士フイルム株式会社 Exposure head and exposure apparatus
JP2004151230A (en) * 2002-10-29 2004-05-27 Hitachi Chem Co Ltd Photosensitive element, method for manufacturing photosensitive element, method for manufacturing resist pattern using the same, and method for manufacturing printed circuit board
JP2004333672A (en) * 2003-05-02 2004-11-25 Kanegafuchi Chem Ind Co Ltd Photosensitive resin composition and photosensitive dry film resist with favorable storage stability, and use method thereof
JP4298391B2 (en) * 2003-06-12 2009-07-15 三菱化学株式会社 Blue-violet light-sensitive composition, and image forming material, image forming material, and image forming method using the same
JP2005043580A (en) * 2003-07-25 2005-02-17 Mitsubishi Chemicals Corp Thermosetting photosensitive composition, and image forming material, image forming material, and image forming method using the same
JP2005084114A (en) * 2003-09-04 2005-03-31 Mitsubishi Chemicals Corp Photocurable composition, and image forming material, image forming material and image forming method using the same
JP4367075B2 (en) * 2003-10-07 2009-11-18 三菱化学株式会社 Photocurable composition, and photocurable image forming material, photocurable image forming material, and image forming method using the same
JP2005115151A (en) * 2003-10-09 2005-04-28 Mitsubishi Chemicals Corp Photocurable composition, and photocurable image forming material, photocurable image forming material, and image forming method using the same
JP4501402B2 (en) * 2003-10-20 2010-07-14 三菱化学株式会社 Photocurable composition, photocurable image forming material using the same, photocurable image forming material, and image forming method
JP2007041493A (en) * 2004-10-20 2007-02-15 Mitsubishi Chemicals Corp Photosensitive composition, blue-violet laser photosensitive composition, and image forming material, image forming material, and image forming method using the same
JP2006119513A (en) * 2004-10-25 2006-05-11 Kaneka Corp Photosensitive resin composition and photosensitive dry film resist, and printed wiring board using same
WO2006057385A1 (en) * 2004-11-29 2006-06-01 Hitachi Chemical Company, Ltd. Photosensitive resin composition, photosensitive film for permanent resist, method for forming resist pattern, printed wiring board, and semiconductor device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8502334B2 (en) 2009-04-09 2013-08-06 Cheil Industries Inc. Image sensor and method for manufacturing the same
US8487030B2 (en) 2009-07-09 2013-07-16 Cheil Industries Inc. Organic-inorganic hybrid composition and image sensor
TWI492924B (en) * 2009-07-09 2015-07-21 第一毛織股份有限公司 Organic-inorganic hybrid composition and image sensor

Also Published As

Publication number Publication date
CN101107565A (en) 2008-01-16
WO2006075633A1 (en) 2006-07-20
KR20070095947A (en) 2007-10-01
JPWO2006075633A1 (en) 2008-06-12

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